JP5454310B2 - Substrate bonding apparatus and substrate bonding method - Google Patents

Description

  The present invention relates to a substrate bonding apparatus and a substrate bonding method.

In order to increase the mounting density of semiconductor devices, a stacked semiconductor device in which a plurality of substrates on which electronic circuits are formed is stacked has been attracting attention. When laminating a plurality of substrates, there is a substrate laminating apparatus that aligns and bonds substrates together (see, for example, Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2009-231671

  In the substrate bonding apparatus, it is desirable to move a plurality of substrates to a contact position with each other at high speed and to superimpose the substrates in a short time. However, since there are individual differences in the thickness of the substrate, it is difficult to specify the contact position.

  In order to solve the above-described problem, in the first aspect of the present invention, a first stage that holds the first substrate, a second stage that is arranged opposite to the first stage and holds the second substrate, A first microscope for observing the surface of the second substrate held on the second stage, a second microscope for observing the surface of the first substrate held on the first stage, and at least one of the first stage and the second stage , A position where the focal plane of the first microscope matches the surface of the second substrate, and a position where the focal plane of the second microscope matches the surface of the first substrate Based on the above, there is provided a substrate bonding apparatus including a calculation unit that calculates a distance between the surface of the first substrate held on the first stage and the surface of the second substrate held on the second stage.

  In the second aspect of the present invention, the first stage and the first stage when the focal plane of the first microscope and the surface of the second substrate held by the second stage facing the first stage are matched. Detecting a relative position of the two stages; detecting a relative position of the first stage and the second stage when the focal plane of the second microscope and the surface of the first substrate are matched; Based on the position where the focal plane of the first microscope and the surface of the second substrate are matched, and the position where the focal plane of the second microscope is matched with the surface of the first substrate, the first stage is held on the first stage. And a step of calculating a distance between the surface of the first substrate and the surface of the second substrate held on the second stage.

  In the third aspect of the present invention, in the focal plane of the first microscope, the step of observing the surface of the second substrate held by the second stage facing the first stage, and observing the surface of the second substrate Detecting the first relative position of the first stage and the second stage in the step of observing, observing the surface of the first substrate within the focal plane of the second microscope, and observing the surface of the first substrate. A distance corresponding to the first relative position detected in the step of detecting the first relative position from the second relative position of the first stage and the second stage in the step is calculated between the first stage and the second stage. A substrate bonding method including the step of bonding the first substrate and the second substrate by bringing them close to each other is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a plan view schematically showing the overall structure of a substrate bonding apparatus 100. FIG. It is a front view which shows the structure of the stage apparatus 140 roughly. 3 is a flowchart of an embodiment of a substrate alignment method. It is the schematic which shows observing the parameter | index image which the 1st microscope 342 projects with the 2nd microscope. 6 is a schematic diagram showing that the surface position of the first substrate 122 is measured by the second microscope 344. FIG. FIG. 6 is a schematic view showing that the surface position of the second substrate 123 is measured by the first microscope 342. It is the schematic which shows superimposing the 1st board | substrate 122 and the 2nd board | substrate 123. FIG. It is the schematic which shows the space | interval of the bump 402. FIG. It is the schematic which shows superimposing the 1st board | substrate 122 and the 2nd board | substrate 123. FIG. Another example of calculating the distance between the first substrate 122 and the second substrate 123 is shown. Yet another example of calculating the distance between the first substrate 122 and the second substrate 123 is shown.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of the substrate bonding apparatus 100. The substrate bonding apparatus 100 includes a housing 102, a room temperature unit 104, a high temperature unit 106, and substrate cassettes 112, 114, and 116. The normal temperature part 104 and the high temperature part 106 are provided in the common housing 102.

  The substrate cassettes 112, 114, and 116 are detachably attached to the housing 102 outside the housing 102. The substrate cassettes 112, 114, and 116 accommodate the first substrate 122 and the second substrate 123 that are bonded in the substrate bonding apparatus 100. As a result, the plurality of first substrates 122 and second substrates 123 are collectively loaded into the substrate bonding apparatus 100. Further, the first substrate 122 and the second substrate 123 bonded together in the substrate bonding apparatus 100 are collected at a time.

  The room temperature unit 104 includes a pre-aligner 126, a stage device 140, a substrate holder rack 128, a substrate removal unit 130, and a pair of robot arms 132 and 134, which are disposed inside the housing 102. The inside of the housing 102 is temperature-controlled so that substantially the same temperature as the room temperature of the environment in which the substrate bonding apparatus 100 is installed is maintained.

  Since the pre-aligner 126 is highly accurate, the position of each first substrate 122 or second substrate 123 is temporarily aligned so that the position of the first substrate 122 or the second substrate 123 is within the adjustment range of the narrow stage device 140. To do. Thereby, the positioning in the stage apparatus 140 can be ensured.

  The substrate holder rack 128 accommodates and waits for a plurality of upper substrate holders 124 and a plurality of lower substrate holders 125. The upper substrate holder 124 and the lower substrate holder 125 respectively hold the first substrate 122 and the second substrate 123 by electrostatic adsorption, for example.

  The stage device 140 aligns the positions of the electrodes to be bonded on the first substrate 122 and the second substrate 123 to be bonded and superimposes them. Stage device 140 includes a first stage 141, a second stage 142, and a control unit 148. Further, a heat insulating wall 145 and a shutter 146 are provided so as to surround the stage device 140. The space surrounded by the heat insulating wall 145 and the shutter 146 is communicated with an air conditioner or the like, and the temperature is controlled, so that the alignment accuracy in the stage device 140 is maintained.

  In the stage apparatus 140, the second stage 142 moves while holding the lower substrate holder 125 holding the second substrate 123. On the other hand, the first stage 141 holds the upper substrate holder 124 and the first substrate 122 in a fixed state. Further, in the stage apparatus 140, the first stage 122 and the second substrate 123 are sandwiched and overlapped between the lower substrate holder 125 and the upper substrate holder 124 by raising the second stage 142.

  The substrate removing unit 130 includes a first substrate 122 and a second substrate 123 (denoted as a laminated substrate) sandwiched and bonded between the upper substrate holder 124 and the lower substrate holder 125 carried out from the pressure unit 240 of the high temperature unit 106. Take out). The laminated substrate taken out from the substrate holder is returned to and stored in one of the substrate cassettes 112, 114, 116 by the robot arms 134, 132 and the second stage 142. The upper substrate holder 124 and the lower substrate holder 125, from which the laminated substrate has been taken out, are returned to the substrate holder rack 128 and stand by. The substrate removing unit 130 is disposed above the substrate holder rack 128.

  The first substrate 122 and the second substrate 123 to be loaded into the substrate bonding apparatus 100 are a single silicon wafer, compound semiconductor wafer, glass substrate, etc., in which elements, circuits, terminals, etc. are formed. It may be. Further, the loaded first substrate 122 and second substrate 123 may be laminated substrates that are already formed by laminating a plurality of wafers.

  Of the pair of robot arms 132, 134, the robot arm 132 disposed on the side closer to the substrate cassettes 112, 114, 116 is the first substrate 122 between the substrate cassettes 112, 114, 116, the pre-aligner 126 and the stage apparatus 140. The second substrate 123 is transported. On the other hand, the robot arm 134 arranged on the side far from the substrate cassettes 112, 114, 116 is between the stage device 140, the substrate holder rack 128, the substrate removing unit 130, and the air lock 220, the first substrate 122, the second substrate. 123, the upper substrate holder 124 and the lower substrate holder 125 are conveyed.

  The robot arm 134 is also responsible for loading and unloading the upper substrate holder 124 and the lower substrate holder 125 with respect to the substrate holder rack 128. The robot arm 134 also has a function of turning over the first substrate 122, the second substrate 123, the upper substrate holder 124, or the lower substrate holder 125. As a result, the surface of the first substrate 122 on which circuits and the like are formed is bonded to the surface of the second substrate 123 on which the circuits and the like are formed.

  The high temperature unit 106 includes a heat insulating wall 108, an air lock 220, a robot arm 230, and a plurality of pressure units 240. The heat insulating wall 108 surrounds the high temperature part 106, maintains a high internal temperature of the high temperature part 106, and blocks heat radiation to the outside of the high temperature part 106. Thereby, the influence which the heat of the high temperature part 106 has on the normal temperature part 104 is suppressed.

  The robot arm 230 conveys the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 between any one of the pressure units 240 and the air lock 220. The air lock 220 includes shutters 222 and 224 that open and close alternately on the normal temperature part 104 side and the high temperature part 106 side.

  When the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 are carried into the high temperature unit 106 from the normal temperature unit 104, first, the shutter 222 on the normal temperature unit 104 side is opened, and the robot arm 134 is moved. The first substrate 122, the second substrate 123, the upper substrate holder 124 and the lower substrate holder 125 are carried into the air lock 220. Next, the shutter 222 on the normal temperature part 104 side is closed, and the shutter 224 on the high temperature part 106 side is opened.

  Subsequently, the robot arm 230 unloads the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 from the air lock 220 and inserts them into any of the pressure units 240. The pressurizing unit 240 heats and pressurizes the first substrate 122 and the second substrate 123 carried into the pressurizing unit 240 while being sandwiched between the upper substrate holder 124 and the lower substrate holder 125. Thus, the first substrate 122 and the second substrate 123 are bonded and bonded together. Note that the pressing unit 240 may bond the first substrate 122 and the second substrate 123 together by pressing the first substrate 122 and the second substrate 123 without heating them.

  When the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 are carried out from the high temperature unit 106 to the normal temperature unit 104, the above series of operations are executed in reverse order. Through these series of operations, the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 are carried into or out of the high temperature unit 106 without leaking the internal atmosphere of the high temperature unit 106 to the normal temperature unit 104 side. it can.

  As described above, in many regions in the substrate bonding apparatus 100, the robot arm 134 with the upper substrate holder 124 holding the first substrate 122 or the lower substrate holder 125 holding the second substrate 123. , 230 and the second stage 142. When the upper substrate holder 124 that holds the first substrate 122 or the lower substrate holder 125 that holds the second substrate 123 is transported, the robot arms 134 and 230 move the upper substrate holder 124 or the lower substrate by vacuum suction, electrostatic suction, or the like. The substrate holder 125 may be sucked and held. Further, the upper substrate holder 124 or the lower substrate holder 125 attracts and holds the first substrate 122 or the second substrate 123 by electrostatic attraction.

  FIG. 2 schematically shows the structure of the stage apparatus 140. The stage device 140 includes a first stage 141, a second stage 142, a first microscope 342, a second microscope 344, an interferometer 370, and the control unit shown in FIG. 148.

  The frame 310 includes a top plate 312 and a bottom plate 316 that are parallel to each other and a plurality of support columns 314 that couple the top plate 312 and the bottom plate 316. The top plate 312, the support column 314, and the bottom plate 316 are each formed of a highly rigid material and do not deform even when a reaction force relating to the operation of the internal mechanism is applied. When incorporated in the substrate bonding apparatus 100, the space between the columns 314 is sealed with a heat insulating wall 145.

  The first stage 141 is fixed to the lower surface of the top plate 312. The first stage 141 sucks the upper substrate holder 124 that holds the first substrate 122 on the lower surface. The adsorption method may be vacuum adsorption or electrostatic adsorption.

  The second stage 142 is disposed in the elevating unit 360 so as to face the first stage 141. The elevating unit 360 is placed on the bottom plate 316 and moved in the X direction while being guided by a guide rail 352 fixed to the bottom plate, and the Y stage moves on the X stage 354 in the Y direction. It is placed on the stage 356. Therefore, under the control of the control unit 148, the member mounted on the second stage 142 can be moved in any direction on the XY plane, and can also be moved in the Z direction. The movement distance in the Z direction can be detected by a displacement sensor 372. Data detected by the displacement sensor 372 is fed back to the control unit 148.

  The second stage 142 holds the lower substrate holder 125 by vacuum suction or the like, and the lower substrate holder 125 holds the second substrate 123 by electrostatic suction. The lifting unit 360 moves the second stage 142 up and down in the Z direction in response to an instruction from the control unit 148. As an example of the drive type of the raising / lowering part 360, the drive by a VCM (voice coil motor), the drive by a cylinder and a piston, etc. are mentioned. The second stage 142 may further have a function of tilting or rotating about the X, Y, and Z axes as rotation axes. The second stage 142 may have a coarse / fine movement separation drive mechanism.

  The first microscope 342 is fixed to the lower surface of the top plate 312 with a predetermined interval with respect to the first stage 141. The first microscope 342 observes the surface of the second substrate 123 held on the second stage 142. The first microscope 342 has a built-in index 346. In the present embodiment, the focal plane of the first microscope 342 is fixed. Image data observed by the first microscope 342 is transmitted to the control unit 148. The control unit 148 controls the vertical position of the second stage 142 so that the observation object is positioned on the focal plane of the first microscope 342 based on the contrast of the received image data [a1]. Note that, instead of the contrast, the observation object may be positioned on the focal plane of the first microscope 342 by the phase difference method using the TTL method.

  The second microscope 344 is fixed to the second stage 142 and moves together with the second stage 142. The second microscope 344 observes the surface of the first substrate 122 held on the first stage 141. In the present embodiment, the focal length of the second microscope 344 is fixed. The second microscope 344 may further include an index. Image data observed by the second microscope 344 is transmitted to the control unit 148. The control unit 148 controls the vertical position of the second stage 142 so that the observation object is positioned on the focal plane of the second microscope 344 based on the contrast of the received image data.

  The interferometer 370 irradiates light to the mirrors fixed to the first stage 141 and the second stage 142, respectively, and the relative position between the first stage 141 and the second stage 142 due to interference of light reflected from the mirror. Is detected. In this case, the interferometer 370 includes a relative position in the X direction between the first stage 141 and the second stage 142, a relative position in the Y direction, a relative tilt around the X axis, a relative tilt around the Y axis, The relative inclination around the Z axis is detected. Interferometer 370 feeds back the detected data to control unit 148.

  The control unit 148 controls the second stage 142. The control unit 148 precisely controls the second stage 142 based on data fed back by the interferometer 370 and the displacement sensor 372. The controller 148 further includes the surface of the first substrate 122 held on the first stage 141 via the upper substrate holder 124 and the surface of the second substrate 123 held on the second stage 142 via the lower substrate holder 125. A calculation unit for calculating an interval between the two.

  FIG. 3 is a flowchart of an embodiment of a substrate alignment method using the stage apparatus 140. This alignment method includes a step S010 in which the first substrate 122 and the like are placed on the first stage 141, a step S020 in which the second microscope 344 observes the index image 380, and a step S030 in which the position of the first substrate 122 is detected. Step S040 for detecting the position of the second substrate 123; Step S050 for calculating the distance between the first substrate 122 and the second substrate 123; Step S060 for aligning the first substrate 122 and the second substrate 123; Step S070 in which the first substrate 122 and the second substrate 123 are overlaid.

  In step S 010, the first substrate 122 and the second substrate 123 are placed on the stage apparatus 140. First, the first arm 122 accommodated in one of the substrate cassettes 112, 114, and 116 is loaded into the pre-aligner 126 by the robot arm 132 and positioned based on the outer shape reference. The robot arm 134 mounts one upper substrate holder 124 on the second stage 142. The second stage 142 on which the upper substrate holder 124 is mounted moves to the vicinity of the robot arm 132. The robot arm 132 mounts the first substrate 122 on the upper substrate holder 124. As a result, the upper substrate holder 124 holds the first substrate 122.

  The second stage 142 moves again to the robot arm 134 side. The robot arm 134 turns over the upper substrate holder 124 holding the first substrate 122 and brings it close to the first stage 141. Thereby, the first stage 141 holds the upper substrate holder 124 holding the first substrate 122 by vacuum suction.

  Next, the robot arm 134 mounts the lower substrate holder 125 on the second stage 142. The second stage 142 on which the lower substrate holder 125 is mounted moves to the vicinity of the robot arm 132. The robot arm 132 mounts the second substrate 123 positioned by the pre-aligner 126 on the basis of the external shape on the lower substrate holder 125. Thereby, the lower substrate holder 125 holds the second substrate 123. Further, the second stage 142 holds the lower substrate holder 125 by vacuum suction. The second stage 142 mounts the lower substrate holder 125 and the second substrate 123 and moves directly below the first stage 141.

FIG. 4 is a schematic diagram showing step S020 in which the index image 380 is observed with the second microscope 344. In step S020, the index image 380 of the index 346 projected by the first microscope 342 is observed by the second microscope 344. By moving the second stage 142, the second microscope 344 is focused on the imaging plane of the first microscope 342. In this case, the control unit 148 moves the second stage 142 in the X and Y directions to position the index image 380 of the first microscope 342 within the field of view of the second microscope 344. Further, the control unit 148 moves the second stage 142 in the Z direction, so that the focal plane of the second microscope 344 is positioned on the imaging plane of the index 346 imaged by the first microscope 342. Thereby, the Z-axis position Z _L0 of the second stage 142 when the index image 380 of the index 346 imaged by the first microscope 342 is positioned on the focal plane of the second microscope 344 is acquired.

When the focal lengths of the first microscope 342 and the second microscope 344 are fixed, the Z-axis position F ₀ of the image plane of the first microscope 342 is known. Therefore, since the Z-axis position Z _{L0 of} the second stage 142 on which the second microscope 344 focused on the image plane is also known, step S020 may be omitted. In this case, when stable in the short term, the measurement may be performed once at the beginning of the lot and the value may be stored. Further, when there is a possibility that the focal lengths of the first microscope 342 and the second microscope 344 change due to fluctuations in atmospheric pressure, correction may be performed according to fluctuations in atmospheric pressure. Here, the index image 380 formed with the first microscope 342 is observed with the second microscope 344, but instead of this, an index printed on a transparent plate or the like may be used as a common index. In this case, the index is inserted into the field of view of both the first microscope 342 and the second microscope 344, and the second stage 142 and the focal planes of both the first microscope 342 and the second microscope 344 are on the index. The transparent plate may be moved in the Z direction.

The position Z _L0 is a control reference position for the second stage 142 in the Z-axis direction. Here, the position in the Z-axis of a surface of the first substrate 122 and _{Z UW,} the distance from the position _{F 0} to the position _{Z UW} and _{f 1.} Further, the position in the Z-axis of a surface of the second substrate 123 and _{Z LW,} the distance from the position _{F 0} to the position _{Z LW} and _{f 2.} Since the thicknesses of the first substrate 122 and the second substrate 123 vary depending on individual differences and types of substrates to be bonded, the distances f ₁ and f ₂ are not constant.

FIG. 5 is a schematic diagram showing step S030 for detecting the position of the first substrate 122. As shown in FIG. In step S030, the surface position of the first substrate 122 is detected by the second microscope 344. The controller 148 moves the second stage 142 to focus the second microscope 344 on the surface of the first substrate 122. As shown in FIG. 5, it is assumed that the second microscope 344 is focused on the surface of the first substrate 122 when the second stage 142 reaches the position Z _L1 . The control unit 148 calculates the distance f ₁ from the difference between the position Z _L1 and the position Z _L0 of the second stage 142 at this time.

  In this case, the second microscope 344 observes the alignment mark provided on the surface of the first substrate 122 and transmits the position information to the control unit 148. The control unit 148 calculates and stores the position, orientation, and the like of the first substrate 122 held on the first stage 141 based on the received data.

FIG. 6 is a schematic diagram showing step S040 for detecting the position of the second substrate 123. As shown in FIG. In step S040, the surface position of the second substrate 123 is detected by the first microscope 342. The controller 148 moves the second stage 142 to focus the first microscope 342 on the surface of the second substrate 123. As shown in FIG. 6, it is assumed that the first microscope 342 is focused on the surface of the second substrate 123 when the second stage 142 reaches the position Z _L2 . The control unit 148 calculates the distance f ₂ from the difference between the position Z _L2 and the position Z _L0 of the second stage 142 at this time.

  In this case, the first microscope 342 observes the alignment marks provided on the surface of the second substrate 123 and transmits the position information to the control unit 148. The control unit 148 calculates and stores the position, orientation, and the like of the second substrate 123 held on the second stage 142 based on the received data.

Further, in step S050, the control unit 148, based on the _{f 1} and _{f 2,} and calculates the distance between the surface of the first substrate 122 surface of the second substrate 123. In this case, the distance between the surface of the first substrate 122 and the surface of the second substrate 123 in the state shown in FIG. 4 is obtained by the sum (f ₂ + f ₂ ) of the distance f ₁ and the distance f ₂ . Since the position Z _L0 of the second stage 142 at this time is known, the distance between the surface of the first substrate 122 and the surface of the second substrate 123 at that time with respect to an arbitrary position of the second stage 142 can be known. it can. For example, when the maintaining the position of the second stage 142 in step S040, since the second stage 142 is elevated from the position _{Z L0} by a distance _{f 2,} surface and a second substrate of the first substrate 122 at this time The distance between the surfaces of 123 is (f ₁ + f ₂ ) −f ₂ , that is, f ₁ .

  In step S060, the control unit 148 moves the second stage 142 based on the calculated position information of the first substrate 122 and the second substrate 123, and bonds the first substrate 122 and the second substrate 123 together. The first substrate 122 and the second substrate 123 are positioned so that the positions of the electrodes to be aligned with each other. In this case, positioning may be performed by so-called global alignment so that the positional deviation of the plurality of sets of alignment marks on the first substrate 122 and the second substrate 123 is statistically reduced. The above movement includes parallel movement in the XY axis plane, rotational movement of the Z axis, and tilt movement of the X axis or Y axis.

FIG. 7 is a schematic diagram showing step S070 in which the first substrate 122 and the second substrate 123 are overlaid. In step S070, the second stage 142 is raised by a distance of the interval _{f 1} obtained in step S060, superposing the first substrate 122 and the second substrate 123. As a result, the controller 148 can accurately calculate the distance between the surface of the first substrate 122 and the surface of the second substrate 123, so that the second stage 142 can be accurately controlled and superimposed. it can.

  For the purpose of alleviating the impact at the time of contact between the first substrate 122 and the second substrate 123 and preventing the substrate from being damaged due to the impact, the control unit 148 has the calculated surface of the first substrate 122 and the second substrate 123. The second stage 142 is raised at a high speed up to a predetermined distance before the distance from the surface, and the second stage 142 is raised at a low speed from the predetermined distance to bring the first substrate 122 and the second substrate 123 into contact with each other. For example, the second stage 142 is raised at a high speed up to 2 mm before the position where the first substrate 122 and the second substrate 123 contact, and the remaining 2 mm is raised at a low speed. By such control, it is possible to prevent the substrate from being damaged at the time of contact while shortening the time for overlapping the substrates. The control of the rising speed of the second stage 142 may be two-stage control including a high speed stage and a low speed stage, and a method of gradually decelerating from high speed to low speed may be used.

  According to the above-described substrate position detection method, the positions of the surfaces of the first substrate 122 and the second substrate 123 can be accurately detected. Therefore, the first substrate can be accurately detected regardless of the thicknesses of the first substrate 122 and the second substrate 123. The distance between the surface of 122 and the surface of the second substrate 123 can be calculated. Therefore, the substrates can be superposed at high speed and safely in accordance with the distance. Furthermore, since it is not necessary to directly measure the thicknesses of the first substrate 122 and the second substrate 123, the time required for the apparatus used for the measurement can be saved.

  FIG. 8 is a conceptual diagram showing the interval between the bumps 402. As shown in FIG. 8, bumps 402 may be formed on the first substrate 122 and the second substrate 123 for the purpose of bonding corresponding electrodes. Since such a bump 402 has a certain height in design, it is preferable to consider the height of the bump 402 when the first substrate 122 and the second substrate 123 are overlaid.

For example, with respect to the height “a” of the bump 402 of the first substrate 122 and the height “b” of the bump 402 of the second substrate 123, the portions without the bump 402 on the first substrate 122 and the second substrate 123 in Step S 030 and Step S 040 In step S050, the distance between the surface of the first substrate 122 and the surface of the second substrate 123 is calculated, and the height a and the height b are further subtracted from the distance. 402 to calculate the distance _{H B} of. In step S070, by controlling the rate of rise of the second stage 142 based on the interval H _B, as shown in FIG. 9, it is possible to fast and safe superimposed substrate.

  In the substrate alignment method shown in FIG. 3, when an index is provided inside the second microscope 344, the index image projected by the second microscope 344 may be observed by the first microscope 342 in step S020. That is, by moving the second stage 142, the first microscope 342 is focused on the image plane of the second microscope 344. At this position, the index image of the index built in the first microscope 342 to the second microscope 344 can be observed.

  In the substrate alignment method shown in FIG. 3, the order of step S030 and step S040 may be interchanged. That is, first, the surface position of the first substrate 122 may be detected after the surface position of the second substrate 123 is detected.

  In this case, it is preferable that which one of the surface of the first substrate 122 and the surface of the second substrate 123 is detected first is the one with the smaller rising amount of the second stage 142 first. Thereby, the operation of lowering the second stage 142 after that can be omitted, and a position detection error due to the play of the machine accompanying switching from the operation of raising the second stage 142 to the operation of lowering can be prevented. Which detection is small in the amount of rise of the second stage 142 is predicted by the focal length of the first microscope 342, the focal length of the second microscope 344, the expected thickness of the first substrate 122, and the second substrate 123. Depends on thickness etc. In particular, the rising amount of the second stage 142 is expected to be the difference between the focal length of the first microscope 342 and the thickness expected for the second substrate 123 and the focal length of the second microscope 344 and the first substrate 122. Depends on the difference in thickness. Therefore, when these can be predicted, it is preferable to first detect the one corresponding to the larger of the two differences.

  In the above embodiment, the focal length of the first microscope 342 and the focal length of the second microscope 344 are both fixed. Alternatively, one or both of the focal length of the first microscope 342 and the focal length of the second microscope 344 may be variable. In this case, the focal length is not changed from step S020 to step S040. do it.

In step S050, the sum (f ₂ + f ₂ ) of the distance f ₁ and the distance f ₂ is calculated, and the distance between the first substrate 122 and the second substrate 123 is calculated based on the calculated sum. Not limited to. For example when the maintaining the position of the second stage 142 at step S040, directly the distance between the surface of the first substrate 122 in this case the surface of the second substrate 123, the distance f ₁ detected in step S030 Become. In this case, even if the sum (f ₂ + f ₂ ) is not calculated, the control unit 148 raises the second stage 142 from this state by the distance f ₁ to move the first substrate 122 and the second substrate 123 together. Can be overlapped.

  FIG. 10 shows another example of calculating the distance between the first substrate 122 and the second substrate 123. In FIG. 10, the first stage 141 is provided with a reference plate 390 serving as a height reference. Here, the height means a direction in which the first stage 141 and the second stage 142 face each other, that is, a vertical direction in the drawing.

In the example shown in FIG. 10, instead of step S020 in FIG. 3, first, the distance d0 in the height direction from the reference plate 390 to the focal plane of the first microscope 342 is observed and adjusted using a gauge or the like. Next, the control unit 148 moves the second stage 142 to align the focal plane of the second microscope 344 with the reference plate 390. Thereby, the Z-axis position Z _L0 of the second stage 142 when the focal plane of the second microscope 344 is aligned with the reference plate 390 is acquired. Thereafter, the processing after step S030 in FIG. 3 is executed. Here, the distance d0 from the reference plate 390 to the focal plane of the first microscope 342 is known, instead of the distance between the first microscope 342 and a second microscope 344 with respect to the position _{F 0} in FIG. 4, the distance d0 By using it, the distance between the surface of the first substrate 122 and the surface of the second substrate 123 can be calculated in step S050.

  FIG. 11 shows still another example of calculating the distance between the first substrate 122 and the second substrate 123. In FIG. 11, the first stage 141 is provided with a reference plate 390 serving as a height reference. The second stage 142 is also provided with a reference plate 392 serving as a height reference. Here, the height means a direction in which the first stage 141 and the second stage 142 face each other, that is, a vertical direction in the drawing. Further, in the example shown in FIG. 11, the first stage 141 holds the reference substrate 410 having a known thickness via the upper substrate holder 124, and the second stage 142 has the thickness via the lower substrate holder 125. A known reference substrate 412 is held.

  In the example shown in FIG. 11, instead of step S020 in FIG. 3, first, the distance d1 in the height direction from the reference plate 390 to the surface of the reference substrate 410, and the height from the reference plate 392 to the surface of the reference substrate 412. The direction distance d2 is adjusted by observing with a gauge or the like. Next, the processing from steps S020 to S070 in FIG. 3 is executed, and the reference substrates 410 and 412 are overlaid. Based on the movement amount of the second stage 142 at that time, the reference substrate 410 when the second microscope 344 observes the surface of the reference substrate 410 on the first stage 141 when the reference substrates 410 and 412 are used. The distance d3 between the surface and the surface of the reference substrate 412 is calculated.

  Next, the first stage 141 holds the first substrate 122 via the upper substrate holder 124, and the second stage 142 holds the second substrate 123 via the lower substrate holder 125. Further, similarly to the case of FIG. 10, the height of the second stage 142 when the focal plane of the first microscope 342 is aligned with the reference plate 392 and the focal plane of the first microscope 342 are aligned with the surface of the second substrate 123. In this case, the height difference d4 from the second stage 142 is calculated. Similarly, the height of the second stage 142 when the focal plane of the second microscope 344 is aligned with the reference plate 390 and the second stage 142 when the focal plane of the second microscope 344 is aligned with the surface of the first substrate 122. The height difference d5 is calculated. Thus, at the height position of the second stage 142 where the focal plane of the second microscope 344 is aligned with the surface of the first substrate 122, the distance between the surface of the first substrate 122 and the surface of the second substrate 123 is (d4 -D1) + (d5-d2) + d3.

Furthermore, in the form shown in FIGS. 1 to 11, the inclination of the surface of the first substrate 122 and the inclination of the surface of the second substrate 123 may be further considered. In this case, for example, the position (X _Li , Y _Li , Z _Li ) of the second stage 142 when the second microscope 344 observes a plurality of alignment marks on the first substrate 123, for example, three alignment marks. (I = 1, 2, 3...) Is acquired. Further [theta] x, minimizing the following _{S L} [theta] y, the Zc as a parameter. The Zc when minimizing the following _{S L} may be used as the _{Z L1} in FIG.
S _L = Σ _i (Z _Li − (Y _Li θx−X _Li θy + Zc)) ²

Similarly, the position (X _Ui , Y _Ui , Z _Ui ) of the second stage 142 when the first microscope 342 observes a plurality of alignment marks on the second substrate 124, for example, three alignment marks (i = 1, 2, 3... Further [theta] x, minimizing the following _{S U} [theta] y, the Zc as a parameter. The Zc when minimizing the following _{S U} may be used as the _{Z L2} in FIG.
S _U = Σ _i (Z _Ui − (− Y _Ui θx + X _Ui θy−Zc)) ²

  The stage device 140 described above can be used not only for the substrate bonding apparatus 100 but also for other purposes. Further, in the stage device 140, the first and second substrates 122 and 123, which have been superposed, are pressed and heated to join them, thereby forming the substrate bonding apparatus 100 in which the pressing unit 240 is omitted. it can. In the above embodiment, the upper substrate holder 124 and the lower substrate holder 125 are used, but one or both of the first substrate 122 and the second substrate 123 are directly connected to the first stage 141 without using one or both of them. Or the like.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 100 Substrate bonding apparatus, 102 Case, 104 Normal temperature part, 106 High temperature part, 108 Heat insulation wall, 112 Substrate cassette, 114 Substrate cassette, 116 Substrate cassette, 122 First substrate, 123 Second substrate, 124 Upper substrate holder, 125 Lower substrate holder, 126 Pre-aligner, 128 Substrate holder rack, 130 Substrate removal unit, 132 Robot arm, 134 Robot arm, 140 Stage device, 141 First stage, 142 Second stage, 145 Heat insulation wall, 146 Shutter, 148 Control unit, 220 Air Lock, 222 Shutter, 224 Shutter, 230 Robot Arm, 240 Pressurizer, 310 Frame, 312 Top Plate, 314 Support, 316 Bottom Plate, 342 First Microscope, 344 Second Microscope, 346 Indicator, 352 Guy Rails, 354 X stage 356 Y stage, 360 lifting unit, 370 interferometer 372 displacement sensor, 380 index image, 390 a reference plate, 392 the reference plate, 402 bump 410 reference substrate, 412 a reference substrate

Claims (21)

A first stage for holding a first substrate;
A second stage for holding a second substrate so as to face the first substrate;
A second microscope for observing alignment marks provided on the surface of the first substrate held on the first stage;
A first microscope for observing alignment marks provided on the surface of the second substrate held on the second stage;
When the first substrate and the second substrate are aligned with each other based on the position of the alignment mark provided on the surface of the second substrate and the surface of the first substrate , and the aligned A drive unit that relatively moves the first stage and the second stage when the first substrate and the second substrate are brought into contact with each other;
When the focal point of the first microscope and the surface of the second substrate are matched before moving the first stage and the second stage relative to each other so that at least the first substrate and the second substrate are brought into contact with each other At least one of the first stage and the second stage, and at least one of the first stage and the second stage when the focal point of the second microscope is matched with the surface of the first substrate An acquisition unit that calculates an interval between the surface of the first substrate and the surface of the second substrate, based on the position of
With
The said drive part moves the said 1st stage and the said 2nd stage relatively based on the said space | interval acquired by the said acquisition part, The board | substrate bonding apparatus characterized by the above-mentioned. The drive unit relatively moves the first stage and the second stage to a position where the focus of the first microscope and the focus of the second microscope match.
The acquisition unit uses the at least one of an interval and a relative position between the first stage and the second stage when the focal point of the first microscope and the focal point of the second microscope coincide with each other. The substrate bonding apparatus according to claim 1 , wherein an interval between the surface of the second substrate and the surface of the second substrate is calculated. The first microscope and the second microscope match the focus of the first microscope and the focus of the second microscope by observing the index projected from one of the first microscope and the second microscope on the other. The board | substrate bonding apparatus of Claim 1 or 2 to be made. The substrate bonding apparatus according to claim 1, wherein the first microscope and the second microscope are configured to match a focal point of the first microscope and a focal point of the second microscope by observing a common index. Either one of the first stage and the second stage has a reference plate that serves as a reference for the height in the facing direction,
The drive unit includes the first stage and the second stage to a position where one of the first microscope and the second microscope, which is arranged to face the reference plate, is aligned with the reference plate. Move one of the stages,
The acquisition unit includes at least one of a distance and a relative position between the first stage and the second stage when the one focus of the first microscope and the second microscope is matched with the reference plate. The substrate bonding apparatus according to claim 1 , further comprising: calculating a distance between the surface of the first substrate and the surface of the second substrate. The substrate bonding apparatus according to claim 5 , wherein the acquisition unit acquires a distance in a direction facing the other focal point of the first microscope and the second microscope and the reference plate prior to calculation. The acquisition unit further uses the inclination of the surface of the second substrate observed with the first microscope and the inclination of the surface of the first substrate observed with the second microscope, and the surface of the first substrate and the first substrate The board | substrate bonding apparatus as described in any one of Claim 1 to 6 which calculates the space | interval with the surface of 2 board | substrates. The acquisition unit may further use a height of a bump disposed on at least one of the surface of the first substrate and the surface of the second substrate to provide a distance between the surface of the first substrate and the surface of the second substrate. The board | substrate bonding apparatus as described in any one of Claim 1 to 7 which computes. The driving unit includes a surface of the first substrate calculated by the acquiring unit when the first stage and the second stage are relatively moved so that the first substrate and the second substrate are brought into contact with each other. 9. The speed according to claim 1, wherein a speed at which the first stage and the second stage are brought close to each other is reduced by a predetermined distance before a moving distance corresponding to a distance from the surface of the second substrate. Substrate bonding device. The substrate according to any one of claims 1 to 9 , wherein at least one of the first stage and the second stage holds the first substrate or the second substrate formed by stacking a plurality of substrates. Bonding device. The substrate bonding according to claim 1, wherein the first microscope is relatively fixed to the first stage and the second microscope is relatively fixed to the second stage. apparatus. A substrate laminating method for laminating a first substrate and a second substrate each having a circuit formed thereon,
Observing an alignment mark provided on the surface of the first substrate held on the first stage with a second microscope;
Observing an alignment mark provided on the surface of the second substrate held on the second stage so as to face the first substrate with a first microscope;
Based on the position of the mark for alignment provided on the surface of the second substrate and a surface of said first substrate, said first substrate held by the first stage, which is held in the second stage the An alignment step of aligning the second substrate with each other;
Contacting the first substrate and the second substrate aligned with each other by relatively moving the first stage and the second stage toward each other; and
At least before the contacting step, the focal point of the first microscope and the surface of the second substrate held on the second stage facing the first stage holding the first substrate are matched. Detecting a relative position between the first stage and the second stage, and the relative relationship between the first stage and the second stage when the focal point of the second microscope is matched with the surface of the first substrate. A position where the focal point of the first microscope is matched with the surface of the second substrate, and a position where the focal point of the second microscope is matched with the surface of the first substrate And obtaining an interval between the surface of the first substrate held on the first stage and the surface of the second substrate held on the second stage based on
Including
In the contact step, the first stage and the second stage are relatively moved based on the interval acquired in the acquisition step. The obtaining step includes
Relatively moving the first stage and the second stage to a position where the focal point of the first microscope and the focal point of the second microscope coincide with each other;
The surface of the first substrate and the first position are determined by using at least one of the distance and the relative position between the first stage and the second stage when the focal point of the first microscope and the focal point of the second microscope match. The board | substrate bonding method of Claim 12 which calculates the space | interval with the surface of 2 board | substrates. Claim wherein the acquisition step, including the by observing the projected indices on the other from one of the first microscope and said second microscope, the step of matching the focal point of the second microscope focus of the first microscope The substrate bonding method according to 12 or 13 . 14. The substrate bonding method according to claim 12 , wherein the obtaining step includes a step of matching a focal point of the first microscope and a focal point of the second microscope by observing a common index. The obtaining step includes
Of the first microscope and the second microscope, one focal point arranged opposite to a reference plate provided on one of the first stage and the second stage is matched with the reference plate. Moving one of the first stage and the second stage to a position,
Further using at least one of a distance and a relative position between the first stage and the second stage when the one focus of the first microscope and the second microscope is matched with the reference plate, The substrate bonding method according to claim 12 , wherein an interval between the surface of the first substrate and the surface of the second substrate is calculated. 17. The substrate bonding according to claim 16 , wherein the acquiring step acquires a distance in a direction facing the other focal point of the first microscope and the second microscope and the reference plate prior to the calculating step. Method. The acquisition step further uses the inclination of the surface of the second substrate observed with the first microscope and the inclination of the surface of the first substrate observed with the second microscope, and the surface of the first substrate and the first substrate. The board | substrate bonding method as described in any one of Claim 12 to 17 which calculates the space | interval with the surface of 2 board | substrates. The obtaining step further uses a height of a bump disposed on at least one of the surface of the first substrate and the surface of the second substrate to provide a distance between the surface of the first substrate and the surface of the second substrate. The substrate bonding method according to any one of claims 12 to 18 , wherein the method is calculated.   In the contact step, when the first stage and the second stage are relatively moved to bring the first substrate and the second substrate into contact with each other, the surface of the first substrate calculated in the acquisition step 20. The method according to claim 12, further comprising a step of decelerating a speed at which the first stage and the second stage are brought close to each other at a predetermined distance before a moving distance corresponding to a distance from the surface of the second substrate. The method for bonding substrates as described in 1. Observing an alignment mark provided on the surface of the first substrate held on the first stage with a second microscope;
Observing the alignment mark provided on the surface of the second substrate held on the second stage so as to face the first substrate with a first microscope;
An alignment step of aligning the first substrate held on the first stage and the second substrate held on the second stage;
The surface of the second substrate held by the second stage opposed to the first stage holding the first substrate, focuses the first microscope on the surface of the second substrate, by the first microscope A first observation step to observe;
A detection step of detecting at least one of an interval and a relative position between the first stage and the second stage when observed in the first observation step;
Focuses the second microscope on the surface of the first substrate, and a second observation step of observing the surface of the first substrate by said second microscope,
From the positions of the first stage and the second stage observed in the second observation step, at least one of the distance detected in the detection step and the distance corresponding to the relative position is set as a relative movement distance. Bonding the first substrate and the second substrate by relatively moving one stage and the second stage;
A substrate bonding method including:

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