JP5401065B2 - Method for measuring sample mounting position and method for correcting mounting position in charged particle beam drawing apparatus - Google Patents

Description

  The present invention relates to a sample placement position measuring method in a charged particle beam drawing apparatus in which a sample is transported and placed on a stage by a transport robot, and a sample placement position correcting method using this measurement method.

  The charged particle beam drawing apparatus includes a stage movable in horizontal X and Y directions orthogonal to each other, beam irradiation means for irradiating a sample placed on the stage with a charged particle beam, and the X and Y directions of the stage. And a stage position measuring device that measures the position of the sample, and is configured to draw a pattern on the sample by moving the stage and irradiating the sample with a charged particle beam while checking the position of the stage. .

  In addition, if the height of the sample deviates from the normal height because the sample is bent by its own weight, the irradiation position of the deflected charged particle beam on the sample changes, or the sample moves from the focal range of the charged particle beam. The drawing accuracy deteriorates. Therefore, the drawing apparatus is provided with a height measuring device for measuring the height of the sample, and the deflection angle and focus range of the charged particle beam are corrected according to the measurement result. The height measuring instrument has a light projecting unit that converges and irradiates light onto the surface of the sample from obliquely above, and a light receiving unit that receives reflected light from the sample and detects the position of the reflected light. The height of the sample is calculated from the position (see, for example, Patent Document 1).

  In addition, the drawing apparatus includes a transfer robot, and the sample is transferred and placed on the stage by the transfer robot. Here, even if the transfer robot operates according to the control data, the sample may not be placed at the regular position on the stage. In this case, the position of the pattern drawn on the sample is shifted. Therefore, in general, a reference block is provided on the stage, and the sample is pressed against the reference block so that the sample can be positioned and placed at a normal position on the stage. However, in this case, particles are generated when the sample is pressed against the reference block, and the particles are placed on the sample, which may cause a defect in the drawing pattern.

Therefore, conventionally, after placing the sample without positioning on the stage by the transfer robot, the sample is imaged with a CCD camera, and the amount of deviation from the normal position of the sample placement position is measured by image processing. There are also known methods for correcting the drawing position of a pattern in accordance with the amount of deviation and for correcting the placement position of a sample (see, for example, Patent Document 2). However, this method requires a CCD camera and an illuminating means for illuminating the sample in order to measure the mounting position of the sample, and the drawing apparatus becomes complicated and expensive.
JP 2008-177256 A JP 2002-280287 A

  In view of the above points, the present invention provides a sample mounting position measuring method in a charged particle beam drawing apparatus capable of measuring the position of a sample mounted on a stage without using a new position measurement tool, and the method An object of the present invention is to provide a sample placement position correction method using a measurement method.

  A first aspect of the present invention includes a stage movable in horizontal X and Y directions orthogonal to each other, beam irradiation means for irradiating a sample placed on the stage with a charged particle beam, the X direction of the stage, and A stage position measuring device that measures the position in the Y direction, a light projecting unit that converges and irradiates light onto the surface of the sample obliquely from above, and a light receiving unit that receives the reflected light from the sample and detects the position of the reflected light And a sample placement position in a charged particle beam drawing apparatus comprising: a height measuring device that measures the height of the sample from the position of reflected light; and a transport robot that transports and places the sample on the stage This is a measurement method, and a special sample is used on the surface, which has two linear marks extending in directions orthogonal to each other and having different light reflectivity from other parts. Carry sample on stage Then, while moving the stage in the X direction, irradiate the surface of the dedicated sample with light from the light projecting part of the height measuring device so that the light irradiation spot intersects one mark part. The position of one stage of the mark that intersects the scanning trajectory of the irradiation spot is measured based on the change in the amount of reflected light received by the light receiving unit of the height measuring device. Change at least twice and measure the position of at least two locations on one mark, and move the stage in the Y direction while the light from the light projecting part of the height measuring instrument is applied to the surface of the dedicated sample. Irradiate and scan the light irradiation spot so that it intersects the other mark part, and based on the change in the amount of reflected light received by the light receiving part of the height measuring device, the other spot that intersects the scanning locus of the irradiation spot Measure the position of the mark part The step of changing the position of the stage in the X direction at least twice and measuring the position of at least two positions of the other mark section, and matching one mark section from the measured positions of at least two positions of one mark section A step of calculating a first straight line and calculating a second straight line that matches the other mark portion from at least two measured positions of the other mark portion; and the first straight line and the second straight line A step of calculating a deviation amount in the X direction and Y direction of the sample mounting position with respect to the stage from the position of the intersection, and at least an inclination angle of the first straight line with respect to the Y direction and an inclination angle of the second straight line with respect to the X direction. And a step of calculating a rotational deviation amount of the sample placement position from one side.

  According to a second aspect of the present invention, there is provided a method for correcting a mounting position of a sample in the charged particle beam lithography apparatus, wherein the rotational deviation amount calculated by the mounting position measuring method according to the first aspect of the present invention is used. Feedback is provided to the control unit of the transfer robot, and the control data of the transfer robot is corrected so that the rotational deviation amount is removed.

  A third aspect of the present invention is a sample placement position correction method in the charged particle beam drawing apparatus, wherein the charged particle beam drawing apparatus delivers the sample to a transport robot while positioning the sample at a fixed position. The position of the sample in the alignment unit is rotationally corrected by the amount of the rotational deviation calculated by the mounting position measuring method according to the first aspect of the present invention.

  In the first aspect of the present invention, the height of each mark portion that intersects the scanning locus of the irradiation spot is measured by the height measuring instrument, and the height of the mark relative to the reference height is measured. It is desirable to correct the measurement position in accordance with the amount of deviation.

  Furthermore, in the second aspect of the present invention, the transfer robot has a rotation axis rotatable around an axis in the Z direction orthogonal to the X direction and the Y direction, and a horizontal axis of a coordinate system fixed to the rotation axis. Direction, and a robot arm that can extend and contract in a direction parallel to the Y direction when the sample is placed, the rotation angle of the rotation axis of the transfer robot when the sample is placed is While correcting for the amount of rotational deviation, the position of the stage when placing the sample is corrected in the X direction by the amount of displacement in the X direction of the sample by correcting the rotation angle of the rotation axis, and the position of the stage when placing the sample is further corrected. It is desirable to correct in the Y direction by the amount of displacement of the sample in the Y direction by correcting the rotation angle of the rotating shaft, or to correct the expansion / contraction amount of the robot arm by the amount of displacement of the sample in the Y direction by correcting the rotation angle of the rotating shaft. .

  In the second and third aspects of the present invention, the position of the stage at the time of sample placement is calculated in the X direction and the Y direction calculated by the placement position measurement method of the first aspect of the present invention. It is desirable to correct in the X direction and Y direction by the amount of deviation.

  According to the first aspect of the present invention, since the sample placement position can be measured using an existing height measuring instrument, a new position measurement tool is not required, and the drawing apparatus can be prevented from becoming complicated and expensive. . In addition, according to the second and third aspects of the present invention, it is possible to remove the rotational displacement of the sample placement position that cannot be dealt with by correcting the pattern drawing position or the stage position.

  1 and 2 show an electron beam lithography apparatus which is an example of a charged particle beam lithography apparatus according to the present invention. The electron beam drawing apparatus is adjacent to the drawing chamber 1, the electron column 2 as a beam irradiation means standing on the ceiling of the drawing chamber 1, the transfer chamber 3 adjacent to the drawing chamber 1, and the side of the transfer chamber 3. An alignment chamber 4 is provided. The drawing chamber 1 is provided with a stage 5 that is movable in the X and Y directions orthogonal to each other. Then, the sample W positioned at a fixed position in the alignment chamber 4 is transferred to the transfer robot 6 disposed in the transfer chamber 3, and the sample W is transferred to the stage 5 by the robot 6 and placed thereon. The sample W is, for example, a mask in which a light shielding film such as a chromium film and a resist film are stacked on a glass substrate.

  The transfer robot 6 includes a rotary shaft 6a that is rotatable around an axis in the Z direction orthogonal to the X direction and the Y direction, and a robot arm 6b that is extendable in one horizontal axis of a coordinate system fixed to the rotary shaft 6a. And a polar coordinate type robot having a robot hand 6c for holding the sample W attached to the tip of the robot arm 6b. The expansion / contraction direction of the robot arm 6 b is parallel to the Y direction when the sample W is placed on the stage 5. Further, the robot hand 6c is always maintained in a posture that matches the expansion / contraction direction of the robot arm 6b. In the present embodiment, the robot arm 6b is configured to expand and contract by the bending and stretching operations of the pair of arms, but the robot arm 6b may be configured by a telescopic arm.

The electron column 2 is a well-known one that forms an electron beam emitted from a built-in electron gun into a required cross-sectional shape and then deflects and irradiates the sample W, and detailed description thereof is omitted. The electron column 2 is controlled by an irradiation control unit 7, the stage 5 is controlled by a stage control unit 8, and the transfer robot 6 is controlled by a robot control unit 9. The irradiation control unit 7, the stage control unit 8, and the robot control unit 9 are centrally controlled by the overall control unit 10. The overall control unit 10, first memory 11 ₁ and the ₂ second memory 11 are connected. The first memory 11 ₁ pattern data is stored. The overall control unit 10, the shape of the graphic to be drawn based on the pattern data, to create the drawing data defining the position, and stores it in the second memory 11 _2.

  The electron beam drawing apparatus also includes a stage position measuring device 12 that measures the position of the stage 5 in the X direction and the Y direction, and a height that measures the height of the sample W placed on the stage 5 (Z direction position). And a measuring device 13. As shown in FIG. 2, the stage position measuring device 12 includes a laser length meter 12 a that measures the X-direction position of the stage 5 by incident / reflected laser light on a stage mirror 5 a having an X-direction normal fixed to the stage 5. The laser length meter 12b measures the Y-direction position of the stage 5 by incident / reflected laser light on a stage mirror 5b having a Y-direction normal fixed to the stage 5.

  The height measuring device 13 includes a light projecting unit 13a that converges and irradiates laser light on the surface of the sample W obliquely from above, and a light receiving unit 13b that receives the reflected light from the sample W and detects the position of the reflected light. The height signal processing unit 13c calculates the height of the sample W from the position of the reflected light. The height data of the sample W measured by the height measuring device 13 is input as response data to the overall control unit 10 when a height data read command is received from the overall control unit 10. Then, the overall control unit 10 calculates the deflection angle and the focal range of the electron beam necessary to maintain the drawing accuracy according to the deviation amount from the normal height of the sample W, and corrects the drawing data. . The height signal processing unit 13c also has a function of calculating the height signal obtained from the light receiving unit 13b and detecting the amount of reflected light received.

  When drawing a pattern on the sample W, an operation command is issued from the overall control unit 10 to the stage control unit 8, and the stage 5 is moved. The irradiation controller 7 controls the shaping of the electron beam in the electron column 2 while confirming the position of the stage 5 measured by the stage position measuring device 12 based on the drawing data input from the overall controller 10. Deflection control is performed to irradiate a desired position of the sample W with an electron beam.

  By the way, since the stage position measuring device 12 cannot measure the position of the sample W, if the sample W is not placed at the regular position on the stage 5, the position of the entire pattern drawn with respect to the outer shape of the sample W is shifted. . Here, even if the transfer robot 6 operates according to the control data, the sample W may not be placed at the regular position on the stage 5. Therefore, when the electron beam drawing apparatus is assembled or adjusted, the sample placement position on the stage 5 is measured using the dedicated sample 100 shown in FIG.

  The dedicated sample 100 is formed with two linear mark portions 101 and 102 extending in directions orthogonal to each other and having different light reflectivities from other portions. Here, when the dedicated sample 100 is placed at a regular position on the stage 5, the first mark portion 101 is parallel to the Y direction, and the second mark portion 102 is parallel to the X direction. In the present embodiment, as the dedicated sample 100, as shown in FIG. 3B, a glass substrate 103 having a light shielding film 104 such as a chromium film laminated thereon is used. The mark parts 101 and 102 are configured. Therefore, the reflectance of light at the mark portions 101 and 102 is lower than that of other portions.

  In the measurement, first, the dedicated sample 100 is positioned in the alignment chamber 4, and the dedicated sample 100 is transported from the alignment chamber 4 onto the stage 5 by the transport robot 6. Next, while moving the stage 5 in the X direction, the surface of the dedicated sample 100 is irradiated with light from the light projecting unit 13 a of the height measuring device 13, and the light irradiation spot SP intersects the first mark unit 101. Scan in the X direction. At this time, the amount of the reflected light received by the light receiving unit 13b of the height measuring device 13 decreases as shown in FIG. 4 where the scanning locus of the irradiation spot SP intersects the first mark unit 101. Therefore, the position of the intersection between the scanning locus of the irradiation spot SP and the first mark portion 101 can be measured based on the change in the amount of received light. That is, the X coordinate of the intersection can be obtained from the X direction position of the stage 5 when the amount of received light becomes the minimum, and the Y coordinate coincides with the scanning locus of the irradiation spot SP (parallel to the X direction). This can be obtained from the position of the stage 5 in the Y direction. Then, the irradiation spot SP is scanned in the X direction, and the position of the intersection is measured twice while changing the position of the stage 5 in the Y direction. As shown in FIG. The positions of x1 and x2 are measured.

  Next, while moving the stage 5 in the Y direction, the surface of the dedicated sample 100 is irradiated with light from the light projecting unit 13 a of the height measuring device 13, and the light irradiation spot SP intersects the second mark unit 102. The stage 5 is to scan in the Y direction and measure the position of the intersection of the scanning locus of the irradiation spot SP and the second mark portion 102 based on the change in the amount of reflected light received by the light receiving portion 13b. Change the position in the X direction twice. Then, as shown in FIG. 3A, the positions of two locations y1 and y2 of the second mark portion 102 are measured.

  Note that the width of each of the mark portions 101 and 102 is desirably slightly smaller than the size of the irradiation spot SP (for example, 80 μm). According to this, the change pattern of the amount of received light has a Gaussian shape (normal distribution shape) and is approximated using a Gaussian curve, so that the scanning locus of the irradiation spot SP and the position of the intersection of the mark portions 101 and 102 can be determined. It becomes possible to measure with high accuracy.

  By the way, when the height of the dedicated sample 100 is deviated by dZ from the normal height indicated by the one-dot chain line in FIG. 5A, the position of the irradiation spot SP on the surface of the dedicated sample 100 is the normal height of the dedicated sample 100. As compared with the case of the above, it is shifted by dQ on the XY plane. When the incident angle of the irradiation light from the light projecting unit 13a is α, dQ = dZtanα. The measurement positions at the respective positions of the mark portions 101 and 102 are determined on the assumption that the dedicated sample 100 exists at a normal height. For this reason, if the height difference of the dedicated sample 100 occurs, an error occurs in the measurement positions at the respective locations. Here, when the optical axis of the irradiation light from the light projecting unit 13a is inclined with respect to the X direction and the Y direction and the inclination angle with respect to the Y direction is β as shown in FIG. The X-direction component dQx of the spot displacement dQ is dQsinβ, and the Y-direction component dQy is −dQcosβ.

  Therefore, in the present embodiment, the height of each mark portion 101, 102 that intersects the scanning locus of the irradiation spot SP is measured by the height measuring device 13, and dQx obtained as described above from the height deviation amount dZ. The measurement position is corrected by adding dQy to the X and Y coordinates of the measurement position.

  The above processing includes the height signal output from the height signal processing unit 13c of the height measuring device 13, the received light amount signal, and the stage position signal output from the stage position measuring device 12 via the stage control unit 8. Is performed by the overall control unit 10 (see FIG. 1). The overall control unit 10 is connected to application software for performing from measurement to mark position calculation and placement position calculation. Here, when the configuration of the electron beam drawing apparatus is performed by bidirectional TCP / IP connection using Ethernet (registered trademark) for data input / output with each control unit, the application software is installed on a terminal existing in the network. If it is installed, it is possible to perform the same processing, and the present invention is not limited to being executed only by the overall control unit.

  Hereinafter, with reference to FIG. 6, processing performed by the application software of the overall control unit 10 will be described. First, from the measured coordinates (Xx1, Yx1) and (Xx2, Yx2) of the two locations x1 and x2 of the first mark portion 101, the first straight line L1 (two locations x1 and x2) that matches the first mark portion 101 is obtained. A second straight line that matches the second mark portion 102 from the coordinates (Xy1, Yy1), (Xy2, Yy2) of the two measured positions y1, y2 of the second mark portion 102. An equation of L2 (a straight line connecting two locations y1 and y2) is calculated.

  Next, the position of the intersection point O between the first straight line L1 and the second straight line L2 is obtained, and the deviation amount in the X direction and the Y direction from the normal position of the mounting position of the dedicated sample 100 with respect to the stage 5 is obtained from this position. calculate. Further, the inclination angle θ1 of the first straight line L1 with respect to the Y direction and the inclination angle θ2 of the second straight line L2 with respect to the X direction are averaged to calculate the rotational deviation amount θ around the axis of the dedicated sample 100 in the Z direction. To do. Note that the inclination angle θ1 and the inclination angle θ2 should be basically equal, and the rotational deviation amount θ may be obtained from one of the both inclination angles θ1 and θ2. However, there are cases where the first and second straight lines L1 and L2 are not orthogonal due to the measurement error at the above-mentioned locations of the mark portions 101 and 102. In order to improve the measurement accuracy, the inclination angles θ1 and θ2 are averaged. Thus, it is desirable to obtain the rotational deviation amount θ.

  The deviation amounts in the X direction and Y direction of the sample placement position calculated as described above are fed back to the stage control unit 8. The stage control unit 8 performs correction to shift the position of the stage 5 at the time of placing the sample in the X direction and the Y direction by this amount of deviation. Accordingly, the sample W can be placed on the stage 5 so as not to cause a deviation in the X direction and the Y direction from the normal position.

  Even if the sample placement position with respect to the stage 5 is deviated from the normal position in the X direction and the Y direction, the position of the pattern drawn on the sample W is shifted in the X direction and the Y direction by this deviation amount, or the drawing is performed. Since the position of the stage 5 can be dealt with by shifting the position of the stage 5 in the X direction and the Y direction by this amount of deviation, it is not indispensable to correct the position of the stage 5 when placing the sample.

  Further, the rotation deviation amount θ of the sample placement position calculated above is fed back to the robot controller 9. Then, the control data of the transfer robot 6 is corrected so that the rotation angle of the rotation shaft 6a of the transfer robot 6 when the sample is placed is an angle obtained by adding the rotation deviation amount θ. Thereby, the sample W can be placed on the stage 5 so as not to cause a rotational deviation from the normal position.

  When the rotation angle of the rotation shaft 6a is corrected by the rotation deviation amount θ, the sample W is displaced by ΔX in the X direction and by ΔY in the Y direction as shown in FIG. Note that ΔX = Rtan θ and ΔY = R (1−cos θ) where R is the distance from the center of the rotating shaft 6a to the center of the sample W.

  In this case, the position of the stage 5 at the time of sample mounting is set in the X direction by the amount obtained by adding the X-direction displacement amount ΔX of the sample W by the rotation angle correction of the rotation shaft 6a to the X-direction deviation amount of the sample mounting position described above. If corrected, it is possible to remove the deviation of the sample placement position with respect to the stage 5 in the X direction.

  Similarly, if the position of the stage 5 at the time of sample placement is corrected in the Y direction by an amount obtained by adding the Y-direction displacement amount ΔY by the rotation angle correction of the rotary shaft 6a to the above-described amount of deviation in the Y direction of the sample placement position. The deviation of the sample placement position with respect to the stage 5 in the Y direction can be removed.

  When the sample is placed, the expansion / contraction direction of the robot arm 6b of the transfer robot 6 is parallel to the Y direction. Therefore, the amount of expansion / contraction of the robot arm 6b when the sample is placed is corrected by the Y-direction displacement amount ΔY by the rotation angle correction of the rotation shaft 6a, and the distance R from the center of the rotation shaft 6a to the center of the sample W is ΔY. By shortening, it is also possible to remove the deviation in the Y direction of the sample placement position with respect to the stage 5.

  Thereafter, the sample W is transported and placed on the stage 5 by the transport robot 6, a pattern is drawn on the sample W, transport accuracy is evaluated from the drawing result, and final adjustment is performed. Here, since the sample placement position is measured as described above and the sample placement position is corrected based on the measurement result, the final adjustment can be easily performed. Further, by regularly transporting and placing the dedicated sample 100 on the stage 5, it is possible to check the transport accuracy without drawing.

  In the present embodiment, the sample placement position can be measured using the stage position measuring device 12 and the height measuring device 13. And since it is not necessary to provide a new measuring tool for measuring the sample placement position in the drawing apparatus, it is possible to avoid the drawing apparatus from becoming complicated and expensive.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, in the above-described embodiment, the rotational deviation amount θ is removed by correcting the rotation angle of the rotation shaft 6a of the transport robot 6, but it is an alignment unit that delivers the sample W to the transport robot 6 with the sample W positioned at a fixed position. It is also possible to remove the rotational deviation amount θ by correcting the rotation of the position of the sample W in the alignment chamber 4 by the rotational deviation amount θ.

  Further, in the above-described embodiment, the positions of the two mark portions 101 and 102 are measured. However, the positions of three or more mark portions 101 and 102 are measured, and these three or more points are measured. From these, a straight line that matches each of the mark portions 101 and 102 may be obtained by a regression method. Further, in the above-described embodiment, the present invention is applied to the measurement of the sample placement position in the electron beam lithography apparatus that irradiates the electron beam, but also in the lithography apparatus that irradiates other charged particle beams such as an ion beam. Similarly, the present invention can be applied.

The conceptual diagram which shows the structure of the electron beam drawing apparatus which is an example of the charged particle beam drawing apparatus used for implementation of this invention. FIG. 2 is a schematic plan view of a drawing chamber and a transfer chamber portion of the drawing apparatus of FIG. 1. (a) Explanatory drawing which shows the scanning locus | trajectory of an exclusive sample and an irradiation spot, (b) Sectional drawing of an exclusive sample. Explanatory drawing which shows the relationship between the position of an irradiation spot, and the amount of received light. Explanatory drawing which shows the cause of the generation | occurrence | production of the error by the height shift of an exclusive sample. Explanatory drawing which shows the calculation method of the mounting position of an exclusive sample. Explanatory drawing which shows position correction of the stage accompanying rotation angle correction | amendment of the rotating shaft of a conveyance robot.

Explanation of symbols

W ... Sample, 1 ... Drawing chamber, 2 ... Electronic column (beam irradiation means), 3 ... Transport chamber, 4 ... Alignment chamber (alignment unit), 5 ... Stage, 5a, 5b ... Stage mirror, 6 ... Transport robot, 6a ... Rotating shaft, 6b ... Robot arm, 6c ... Robot hand, 7 ... Illumination control unit, 8 ... Stage control unit, 9 ... Robot control unit, 10 ... Overall control unit, 11 ₁ ... First memory, 11 ₂ ... First 2 memory, 12 ... stage position measuring device, 12a, 12b ... laser length meter, 13 ... height measuring device, 13a ... light projecting unit, 13b ... light receiving unit, 13c ... height signal processing unit, 100 ... dedicated sample, 101 ... 1st mark part (one mark part), 102 ... 2nd mark part (the other mark part), 103 ... Glass substrate, 104 ... Light shielding film, X1, X2, Y1, Y2 ... Measurement position, L1, L2 ... Straight line that matches the mark, θ Amount of rotation deviation, ΔX: Amount of displacement in the X direction of the sample by correcting the rotation angle, ΔY: Amount of displacement of the sample in the Y direction by correcting the rotation angle, R: A distance from the rotation axis of the robot to the center of the sample, dz: A normal height and Height deviation amount, spot position deviation amount due to dQ ... dz, α ... incident angle of light with respect to XY plane of height measuring device, β ... optical axis installation angle of height measuring device with respect to Y direction.

Claims (5)

A stage movable in the horizontal X and Y directions perpendicular to each other, a beam irradiation means for irradiating a charged particle beam to a sample placed on the stage, and a stage position for measuring the position of the stage in the X and Y directions A measuring device; a light projecting unit that irradiates and irradiates light onto the surface of the sample obliquely from above; and a light receiving unit that receives reflected light from the sample and detects the position of the reflected light. A sample placement position measurement method in a charged particle beam drawing apparatus comprising a height measuring device for measuring the height of a sample from a transport robot for transporting and placing a sample on a stage,
As a sample, a dedicated sample in which two linear mark portions extending in directions orthogonal to each other and having a light reflectance different from that of other portions is formed on the surface,
After the dedicated sample is transported and placed on the stage by the transport robot, the surface is moved in the X direction, and the light from the light projecting part of the height measuring device is irradiated onto the surface of the dedicated sample to irradiate the light. Scan the spot so that it crosses one mark, and based on the change in the amount of reflected light received by the light receiving part of the height measuring device, locate the position of one mark that crosses the scanning locus of the irradiation spot. Measuring at least two times by changing the position of the stage in the Y direction and measuring at least two positions of one mark part; and
While moving the stage in the Y direction, irradiate the surface of the dedicated sample with light from the light projecting part of the height measuring device, scan the light irradiation spot so that it intersects the other mark part, and measure the height Based on the change in the amount of reflected light received by the light receiving portion of the detector, the position of the other mark portion that intersects the scanning locus of the irradiation spot is measured at least twice by changing the position in the X direction of the stage. Measuring at least two positions of the other mark portion;
A first straight line that matches one mark portion is calculated from at least two measured positions of one mark portion, and a first straight line that matches the other mark portion from at least two measured positions of the other mark portion is calculated. Calculating a straight line of 2;
Calculating a deviation amount in the X direction and Y direction of the mounting position of the sample with respect to the stage from the position of the intersection of the first straight line and the second straight line;
A step of calculating a rotational displacement amount of the sample mounting position from at least one of an inclination angle of the first straight line with respect to the Y direction and an inclination angle of the second straight line with respect to the X direction. A sample mounting position measuring method in a beam drawing apparatus. The height of each mark portion that intersects the scanning locus of the irradiation spot is measured by the height measuring device, and the measurement position of the location is corrected according to the amount of deviation of the height of the location from the reference height. 2. A method for measuring a mounting position of a sample in a charged particle beam writing apparatus according to claim 1, wherein 請 Motomeko 1 or 2 wherein the rotational displacement amount calculated by the placement position measuring method according to feedback to the control unit of the transfer robot, so as to correct the control data of the transfer robot as rotational deviation amount is removed A method for correcting a placement position of a sample in a charged particle beam drawing apparatus. 4. The method of correcting a sample placement position in a charged particle beam drawing apparatus according to claim 3, wherein the transfer robot is configured to rotate around a Z-direction axis orthogonal to the X and Y directions, and a rotation axis. A polar coordinate type robot having a horizontal one-axis direction of a coordinate system fixed to the robot, and a robot arm that can expand and contract in a direction parallel to the Y direction when a sample is placed,
The rotation angle of the rotation axis of the transfer robot when the sample is placed is corrected by the amount of the rotational deviation, and the position of the stage when the sample is placed is set in the X direction by the amount of displacement of the sample in the X direction by correcting the rotation angle of the rotation axis In addition, the position of the stage when the sample is placed is corrected in the Y direction by the amount of displacement of the sample in the Y direction by correcting the rotation angle of the rotation axis, or the expansion / contraction amount of the robot arm is adjusted to the rotation angle of the rotation axis. A method for correcting a placement position of a sample in a charged particle beam drawing apparatus, wherein the amount is corrected by the amount of displacement of the sample in the Y direction.   The position of the stage at the time of sample mounting is corrected in the X direction and the Y direction by the amount of deviation in the X direction and Y direction calculated by the mounting position measuring method according to claim 1 or 2. A method for correcting a placement position of a sample in the charged particle beam drawing apparatus according to claim 3.