JP2022176736A - Component mounting device and component mounting method - Google Patents

Abstract

An object of the present invention is to mount a lead component on a substrate by efficiently correcting leads. A component mounting apparatus includes a gripping device that holds a body of a lead component having a plurality of leads, a moving device that moves the gripping device, and a plurality of leads while the body is held by the gripping device. a detection device for detecting the tip portion of the lead component, a correction lead setting section for setting the correction lead to be corrected on the substrate from the plurality of leads based on the detection position of the tip portion detected by the detection device, and the lead component at the first angle After inserting the corrective lead into the first hole of the substrate while being inclined to the above angle, the moving device is controlled to insert the non-corrective lead into the second hole of the substrate until the lead component reaches the second angle. and a movement control unit. [Selection drawing] Fig. 1

Description

The present disclosure relates to a component mounting apparatus and a component mounting method.

2. Description of the Related Art In the technical field related to component mounting apparatuses, there is known a board-to-board working machine that inserts leads of lead components into through-holes of a board, as disclosed in Patent Document 1.

WO2117/085864

Patent Literature 1 discloses a technique for mounting a lead component having long leads and short leads on a substrate. Further, in Patent Document 1, after inserting a long lead into a through-hole of a substrate, a lead component is moved in the X and Y directions to bend the long lead, and then a short lead is inserted into the through-hole of the substrate. is disclosed. Lead parts come in many varieties. Therefore, there is a demand for a technology capable of efficiently straightening the leads and mounting the lead parts on the board, regardless of the kind of lead parts.

An object of the present disclosure is to efficiently straighten leads and mount a lead component on a substrate.

According to the present disclosure, a grip device for holding a body of a lead component having a plurality of leads, a moving device for moving the grip device, and tips of the plurality of leads while the body is held by the grip device. a correction lead setting unit for setting correction leads to be corrected on the board from a plurality of leads based on the detection position of the tip detected by the detection device; and tilting the lead component at a first angle. After inserting the corrective lead into the first hole of the board in the state of being held, the non-corrective lead is inserted into the second hole of the board until the lead component reaches the second angle. and, a component mounting apparatus is provided.

According to the present disclosure, the lead component can be mounted on the substrate by efficiently correcting the lead.

1 is a perspective view showing a component mounting apparatus according to an embodiment; FIG. FIG. 2 is a side view showing the component mounting apparatus according to the embodiment; FIG. 3 is a perspective view showing the grip device according to the embodiment. FIG. 4 is a side view showing a lead component held by the grip device according to the embodiment; FIG. 5 is a bottom view of the lead component according to the embodiment. FIG. 6 is a perspective view showing the detection device according to the embodiment. FIG. 7 is a block diagram showing a component mounting apparatus according to the embodiment; FIG. 8 is a diagram for explaining the processing of the position error calculation unit and the processing of the correction lead setting unit according to the embodiment; FIG. 9 is a diagram for explaining corrective insertion according to the embodiment. FIG. 10 is a diagram for explaining corrective insertion according to the embodiment. FIG. 11 is a diagram for explaining corrective insertion according to the embodiment. FIG. 12 is a diagram for explaining corrective insertion according to the embodiment. FIG. 13 is a diagram for explaining corrective insertion according to the embodiment. FIG. 14 is a flow chart showing a component mounting method according to the embodiment.

Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiments. The constituent elements of the embodiments described below can be combined as appropriate. Also, some components may not be used.

In the embodiment, a local coordinate system is set in the component mounting apparatus 1, and the positional relationship of each part will be described with reference to the local coordinate system. An XYZ orthogonal coordinate system is set as the local coordinate system. A direction parallel to the X-axis in a predetermined plane is defined as an X-axis direction. A direction parallel to the Y-axis perpendicular to the X-axis in a predetermined plane is defined as the Y-axis direction. A direction parallel to the Z-axis that is orthogonal to each of the X-axis and the Y-axis is defined as the Z-axis direction. The direction of rotation or inclination about the X-axis is defined as the θX direction. The direction of rotation or inclination about the Y-axis is defined as the θY direction. A rotation direction or a tilt direction about the Z axis is defined as the θZ direction. The predetermined plane is the XY plane. The Z-axis is orthogonal to the predetermined plane. In the embodiment, the predetermined plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction. Note that the predetermined plane may be inclined with respect to the horizontal plane.

[Component mounting equipment]
FIG. 1 is a perspective view showing a component mounting apparatus 1 according to an embodiment. FIG. 2 is a side view showing the component mounting apparatus 1 according to the embodiment. As shown in FIGS. 1 and 2, the component mounting apparatus 1 includes a base 2, a component supply member 3, a board support member 4, a gripping device 5, a moving device 6, and a detecting device 7.

The base 2 supports the component supply member 3, the board support member 4, the moving device 6, and the detection device 7, respectively.

The component supply member 3 supplies lead components 100 . In the embodiment, component supply member 3 includes a tray on which lead component 100 is placed. A plurality of lead components 100 are arranged on the component supply member 3 . The types of lead components 100 may be the same or different.

The board support member 4 supports the board 200 on which the lead component 100 is mounted. The substrate support member 4 supports the substrate 200 such that the upper surface of the substrate 200 and the XY plane are parallel.

A grip device 5 holds a lead component 100 . The grip device 5 includes a robot hand.

A moving device 6 moves the gripping device 5 . The mobile device 6 includes an articulated robot. In an embodiment, the mobile device 6 is a vertical articulated robot. In addition, the moving device 6 may be a horizontal articulated robot. The moving device 6 includes a base member 6A fixed to the base 2, a turning member 6B supported by the base member 6A, a first arm 6C connected to the turning member 6B, and connected to the first arm 6C. It has a second arm 6D and a third arm 6E connected to the second arm 6D.

The turning member 6B is supported by the base member 6A so as to be able to turn around the turning axis TX. The pivot axis TX is parallel to the Z-axis. The first arm 6C is connected to the turning member 6B so as to be rotatable around the first rotation axis AX1. The first rotation axis AX1 is orthogonal to the Z axis. The second arm 6D is connected to the first arm 6C so as to be rotatable about the second rotation axis AX2. The second rotation axis AX2 is parallel to the first rotation axis AX1. The third arm 6E is connected to the second arm 6D so as to be rotatable about the third rotation axis AX3. The third rotation axis AX3 is parallel to the second rotation axis AX2. The grip device 5 is attached to the third arm 6E.

The moving device 6 includes a turning actuator that turns the turning member 6B, a first turning actuator that turns the first arm 6C, a second turning actuator that turns the second arm 6D, and a third arm 6E. and a third rotation actuator for rotating.

The detection device 7 detects the lead component 100 held by the grip device 5 . The detection device 7 includes a three-dimensional measuring device. The detection device 7 detects the position of the lead component 100 in the local coordinate system based on the phase shift method.

[Grip device]
FIG. 3 is a perspective view showing the grip device 5 according to the embodiment. The grip device 5 includes a robot hand. The grip device 5 has a connecting member 5A attached to the third arm 6E, a rotating member 5B supported by the connecting member 5A, and a pair of moving members 5C supported by the rotating member 5B.

The rotating member 5B is supported by the connecting member 5A so as to be rotatable around the rotation axis RX. The rotation axis RX is orthogonal to the third rotation axis AX3. A pair of moving members 5C move in a direction toward and away from each other. A grip portion 5D is provided at the lower end portion of the moving member 5C. A pair of grip parts 5D approaches and separates from each other.

The grip device 5 has a rotation actuator that rotates the rotating member 5B and a grip actuator that moves the pair of moving members 5C toward or away from each other.

With the lead component 100 arranged between the pair of grips 5D, the pair of grips 5D approach each other, whereby the lead component 100 is held by the grips 5D. By separating the pair of grips 5D from each other, the lead component 100 is released from the grips 5D.

A force sensor 8 is arranged on one moving member 5C. The force sensor 8 can detect the load applied to the grip portion 5D.

[Lead parts]
FIG. 4 is a side view showing the lead component 100 held by the grip device 5 according to the embodiment. FIG. 5 is a bottom view of the lead component 100 according to the embodiment.

A lead component 100 has a body 101 and a plurality of leads 110 protruding from the body 101 .

Body 101 includes a synthetic resin housing. An element such as a coil is arranged in the internal space of the body 101 . The lead 110 is a metallic protrusion. The leads 110 are connected to elements arranged, for example, in the internal space of the body 101 .

Leads 110 protrude downward from the bottom surface of body 101 . With the lead component 100 mounted on the substrate 200, the bottom surface of the body 101 and the top surface of the substrate 200 face each other.

In the embodiment, lead component 100 has two leads 110 . In an embodiment, lead 110 includes first lead 111 and second lead 112 .

The gripping device 5 holds the body 101 of the lead component 100 . The pair of grip portions 5D hold the lead component 100 by sandwiching the body 101 therebetween.

[Detection device]
FIG. 6 is a perspective view showing the detection device 7 according to the embodiment. As shown in FIG. 6 , the detection device 7 detects the tip portions of the plurality of leads 110 while the body 101 is held by the grip device 5 . In an embodiment, the detection device 7 detects the position of the tip of the lead 110 . In the following description, the position of the tip of the lead 110 detected by the detection device 7 is appropriately referred to as the detection position.

The detection device 7 includes a projection device 7A that irradiates the lead component 100 held by the grip device 5 with striped pattern light, an imaging device 7B that captures an image of the lead component 100 irradiated with the striped pattern light, and an imaging device 7B. and an arithmetic unit 7C for calculating the detected position of the tip of the lead 110 in the three-dimensional space by calculating the data based on the phase shift method.

In the embodiment, each of the projection device 7A and imaging device 7B is housed in a housing 7D. Each of the projection device 7A and the imaging device 7B is fixed to the housing 7D. A transparent member 7E is arranged in the opening at the upper end of the housing 7D. A glass plate is exemplified as the transparent member 7E.

The projection device 7A has a light source, a light modulation element that modulates light emitted from the light source to generate fringe pattern light, and an emission optical system that emits the fringe pattern light generated by the light modulation element. A digital mirror device (DMD), a transmissive liquid crystal panel, or a reflective liquid crystal panel is exemplified as the light modulation element.

The imaging device 7B has an imaging optical system that forms an image of the striped pattern light reflected by the lead component 100, and an imaging element that acquires image data of the lead component 100 via the imaging optical system. As an image sensor, a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) or a CCD image sensor (Charge Coupled Device Image Sensor) is exemplified.

Arithmetic device 7C includes a computer system. The arithmetic unit 7C includes a processor such as a CPU (Central Processing Unit), a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output circuit capable of inputting and outputting signals and data. interface.

The detection device 7 measures the three-dimensional shape of the lead component 100 held by the grip device 5 based on the phase shift method. The projection device 7A irradiates the lead component 100 with striped pattern light having, for example, a sinusoidal lightness distribution while shifting the phase. The lead component 100 held by the grip device 5 is arranged above the transparent member 7E. The striped pattern light emitted from the projection device 7A is irradiated onto the lead component 100 through the transparent member 7E. The imaging device 7B images the lead component 100 on which the striped pattern light is projected. The imaging device 7B images the lead component 100 through the transparent member 7E. The imaging device 7B images the lead component 100 from below the lead component 100 . The computing device 7C calculates the detection position of the tip of the lead 110 in the local coordinate system based on the imaging data of the imaging device 7B.

[Control device]
FIG. 7 is a block diagram showing the component mounting apparatus 1 according to the embodiment. As shown in FIG. 7 , the component mounting apparatus 1 has a control device 9 . Controller 9 includes a computer system. The control device 9 includes an arithmetic processing device 9A including a processor such as a CPU (Central Processing Unit), and a volatile memory such as a RAM (Random Access Memory) and a non-volatile memory such as a ROM (Read Only Memory). It has a storage device 9B and an input/output interface 9C.

Each of the gripping device 5, the moving device 6, the detecting device 7, and the force sensor 8 is connected to the input/output interface 9C. Each of the gripping device 5 and the moving device 6 is controlled by the control device 9 . A control device 9 controls the rotary actuator and the grip actuator of the grip device 5 . The control device 9 controls the turning actuator, the first turning actuator, the second turning actuator and the third turning actuator of the moving device 6 . Each of the detection data of the detection device 7 and the detection data of the force sensor 8 is transmitted to the control device 9 .

The arithmetic processing unit 9A has a position error calculator 10, a correction lead setting unit 11, a movement controller 12, and a grip controller 13.

The position error calculator 10 calculates the difference Δ between the detected position Ps of the tip of the lead 110 detected by the detector 7 and the ideal position Pr of the tip of the lead 110 for each of the plurality of leads 110 . The ideal position Pr of the tip of the lead 110 means the designed position of the tip of the lead 110 . The ideal position Pr of the tip of the lead 110 is known data derived from design data or specification data of the lead component 100 . The ideal position Pr of the tip of the lead 110 is stored in advance in the storage device 9B.

For example, if the lead 110 is bent during transportation of the lead component 100 or if the lead component 100 contains a manufacturing error, the difference Δ becomes large.

The correction lead setting unit 11 sets correction leads to be corrected on the substrate 200 from the plurality of leads 110 based on the detection positions of the leading ends of the leads 110 detected by the detection device 7 . In the embodiment, the corrective lead setting unit 11 sets the lead 110 for which the difference Δ calculated by the position error calculator 10 exceeds a predetermined allowable value as the corrective lead.

In an embodiment, a straightened lead refers to the lead 110 straightened using the substrate 200 . Straightening the lead 110 includes bending the lead 110 . When correcting the correction lead, the correction lead is bent so that the tip of the correction lead approaches an ideal position or each of the plurality of leads 110 is inserted into the hole 210 of the substrate 200 .

In the embodiment, the leads 110 that are not set as corrective leads by the corrective lead setting unit 11 are appropriately referred to as non-correctable leads.

FIG. 8 is a diagram for explaining the processing of the position error calculator 10 and the processing of the correction lead setting unit 11 according to the embodiment. In FIG. 8, the ideal position Pr of the tip of the lead 110 is predetermined. In addition, the allowable range TL related to the position of the tip of the lead 110 is determined in advance with reference to the ideal position Pr. In the example shown in FIG. 8, the allowable range TL is a circular range centered on the tip of the lead 110 . The allowable range TL and the allowable value are determined based on the lead spacing indicating the spacing between the two leads 110 and the hole spacing indicating the spacing between the holes 210 of the substrate 200 into which the two leads 110 are inserted respectively. That is, the allowable range TL and the allowable value are determined such that two leads 110 are inserted into two holes 210 at the same time.

The position error calculator 10 calculates the difference Δ between the detected position Ps indicating the actual position of the tip of the lead 110 and the ideal position Pr.

FIG. 8A shows an example in which the detection position Ps of the first lead 111 is arranged within the allowable range TL, and the detection position Ps of the second lead 112 is arranged within the allowable range TL. When the detection position Ps of the first lead 111 is located within the allowable range TL, the correction lead setting unit 11 determines the detection position Ps of the tip of the first lead 111 and the ideal position Pr of the tip of the first lead 111. is equal to or less than the allowable value. Similarly, when the detection position Ps of the second lead 112 is located within the allowable range TL, the correction lead setting unit 11 determines the ideal difference between the detection position Ps of the tip of the second lead 112 and the tip of the second lead 112 . It is determined that the difference Δ from the position Pr is equal to or less than the allowable value. In the example shown in FIG. 8A, the corrective lead setting unit 11 does not set both the first lead 111 and the second lead 112 as corrective leads. In the example shown in FIG. 8A, each of the first lead 111 and the second lead 112 is set as a non-correction lead.

Both the first lead 111 and the second lead 112 are set as non-corrected leads because the lead interval between the first lead 111 and the second lead 112 and the insertion of each of the first lead 111 and the second lead 112 It means that the hole spacing between the two holes 210 that are aligned is substantially the same. That is, it means that two leads 110 can be inserted into two holes 210 at the same time.

FIG. 8B shows an example in which the detection position Ps of the first lead 111 is arranged within the allowable range TL and the detection position Ps of the second lead 112 is not arranged within the allowable range TL. When the detection position Ps of the second lead 112 is not arranged within the allowable range TL, the correction lead setting unit 11 determines the detection position Ps of the tip of the second lead 112 and the ideal position Pr of the tip of the second lead 112. Δ exceeds the allowable value. In the example shown in FIG. 8B, the corrective lead setting unit 11 does not set the first lead 111 as the corrective lead, but sets the second lead 112 as the corrective lead. In the example shown in FIG. 8B, the first lead 111 is set as a non-correction lead.

Setting at least one of the first lead 111 and the second lead 112 as the corrective lead means that the lead interval between the first lead 111 and the second lead 112 and the insertion of each of the first lead 111 and the second lead 112 are different. It means that the hole spacing of the two holes 210 to be measured does not match. This means that two leads 110 cannot be inserted into two holes 210 at the same time.

The movement control unit 12 controls the movement device 6 . After inserting the correction lead into the first hole 210 of the substrate 200 with the body 101 of the lead component 100 inclined at the first angle θ1, the movement control unit 12 tilts the body 101 of the lead component 100 at the second angle θ2. The moving device 6 is controlled to insert the non-corrected lead into the second hole 210 of the substrate 200 until the .

In the embodiment, the movement control unit 12 inserts the corrective lead into the first hole 210 of the substrate 200 while the body 101 of the lead component 100 is inclined at the first angle θ1, and the non-corrective lead is inserted into the substrate 200 . After correcting the corrected lead until it faces the second hole 210, the moving device inserts the non-corrected lead into the second hole 210 of the substrate 200 until the body 101 of the lead component 100 reaches the second angle θ2. 6.

For example, when the second lead 112 is set as the corrected lead and the first lead 111 is set as the non-corrected lead, the movement control section 12 tilts the body 101 of the lead component 100 at the first angle After inserting the second lead 112 into the first hole 210 of the substrate 200 and bending the second lead 112 until the first lead 111 faces the second hole 210 of the substrate 200, the body 101 of the lead component 100 is The moving device 6 is controlled so that the first lead 111 is inserted into the second hole 210 of the substrate 200 until the second angle θ2 is reached.

The movement control unit 12 also controls the movement device 6 based on the detection value of the force sensor 8 . The force sensor 8 can detect the load applied to the lead 110 when the lead 110 is inserted into the hole 210 of the substrate 200 . When the movement control unit 12 determines that the load applied to the lead 110 exceeds a predetermined threshold based on the detection value of the force sensor 8, the movement control unit 12 stops the operation of inserting the lead 110 into the hole 210, for example. , the mobile device 6 is controlled.

The grip control section 13 controls the grip device 5 . The grip control section 13 controls the grip device 5 so that the pair of grip sections 5D approaches or separates from each other. With the body 101 disposed between the pair of grips 5D, the body 101 is held by the grips 5D by the pair of grips 5D approaching each other. By separating the pair of grips 5D from each other, the lead component 100 is released from the grips 5D.

[Corrective insertion]
Next, a method for inserting the corrected leads and the non-corrected leads of the lead component 100 into the holes 210 of the substrate 200 will be described. In the following description, the operation of inserting the non-correctable lead into the second hole 210 of the substrate 200 after inserting the corrective lead into the first hole 210 of the substrate 200 is appropriately referred to as corrective insertion.

Each of FIGS. 9 to 13 is a diagram for explaining corrective insertion according to the embodiment.

In the embodiment, mounting the lead component 100 on the substrate 200 means inserting both of the two leads 110 into the holes 210 of the substrate 200 . Before the lead component 100 is mounted on the board 200 means before both of the two leads 110 are inserted into the holes 210 of the board 200 .

The grip device 5 can move the component supply member 3 , the detection device 7 and the board support member 4 by the movement device 6 . The grip device 5 moves to the component supply member 3 to hold the body 101 of the lead component 100 placed on the component supply member 3 , and then moves to the detection device 7 . The detection device 7 detects the positions of the tips of the leads 110 of the lead component 100 held by the grip device 5 . After the position of the tip of the lead 110 is detected by the detection device 7 , the gripping device 5 moves to the substrate supporting member 4 and inserts the lead component 100 into the hole 210 of the substrate 200 supported by the substrate supporting member 4 . The operation of inserting the lead 110 is initiated.

The top surface of the substrate 200 is parallel to the XY plane. A hole 210 is formed in the substrate 200 . Hole 210 includes a hole 211 into which first lead 111 is inserted and a hole 212 into which second lead 112 is inserted.

In the examples shown in FIGS. 9 to 13, it is assumed that the length of the first lead 111 and the length of the second lead 112 are equal. Further, as shown in FIG. 9, before the lead component 100 is mounted on the substrate 200, the second lead 112 is bent, and the detection position Ps of the tip of the second lead 112 and the tip of the second lead 112 and the ideal position Pr exceeds the allowable value. On the other hand, it is assumed that the difference Δ between the detected position Ps of the tip of the first lead 111 and the ideal position Pr of the tip of the first lead 111 is equal to or less than the allowable value. That is, assume that the second lead 112 is set as the corrected lead, and the first lead 111 is set as the non-corrected lead. A second lead 112 (corrective lead) is inserted into hole 212 (first hole), and a first lead 111 (non-corrective lead) is inserted into hole 211 (second hole).

In embodiments, the mobile device 6 is an articulated robot. Therefore, the moving device 6 can tilt the lead component 100 with respect to the upper surface of the substrate 200 . The moving device 6 can arbitrarily adjust the angle between the upper surface of the substrate 200 and the lower surface of the body 101 held by the grip device 5 .

As shown in FIG. 9, when the body 101 is adjusted to the second angle θ2 before the lead component 100 is mounted on the substrate 200, the tip of the second lead 112 (correction lead) and the upper surface of the substrate 200 are aligned. is longer than the distance L1 between the tip of the first lead 111 (uncorrected lead) and the upper surface of the substrate 200 . Note that the distances (L1, L2) here refer to the distances in the Z-axis direction parallel to the upper surface of the substrate 200. FIG.

A second angle θ2 is an angle between the upper surface of the substrate 200 and the lower surface of the body 101 held by the grip device 5 . As shown in FIG. 9, the second angle θ2 is 0°. That is, the upper surface of the substrate 200 and the lower surface of the body 101 held by the grip device 5 are substantially parallel. In a state in which the upper surface of substrate 200 and the lower surface of body 101 are parallel before lead component 100 is mounted on substrate 200, the distance L2 between the tip of second lead 112 (correction lead) and the upper surface of substrate 200 is It is longer than the distance L1 between the tip of the first lead 111 (uncorrected lead) and the upper surface of the substrate 200 .

In the embodiment, the operation of inserting the second lead 112 into the hole 210 before the first lead 111 is performed. That is, before the lead component 100 is mounted on the substrate 200, the top surface of the substrate 200 and the bottom surface of the body 101 are parallel to each other. It is inserted into hole 210 .

As shown in FIG. 9, when the tip of the first lead 111 faces the hole 211 of the substrate 200, the tip of the second lead 112 and the hole 212 of the substrate 200 cannot face each other.

As shown in FIG. 10, the movement control unit 12 moves the lead component 100 held by the grip device 5 so that the lower surface of the body 101 of the lead component 100 forms a first angle θ1 with respect to the upper surface of the substrate 200. The body 101 is tilted. The first angle θ1 is the angle between the upper surface of the substrate 200 and the lower surface of the body 101 held by the grip device 5 . The first angle θ1 is greater than the second angle θ2. As an example, the first angle θ1 is 5° or more and 45° or less.

The movement control unit 12 controls the movement device 6 so that the tip of the second lead 112 faces the hole 212 with the body 101 of the lead component 100 inclined at the first angle θ1. In the example shown in FIG. 10, the movement control unit 12 tilts the body 101 of the lead component 100 to the first angle θ1 from the state shown in FIG. 9, moves the lead component 100 in the +X direction, The tip of 112 and the hole 212 are made to face each other.

After the tip of the second lead 112 and the hole 212 are opposed to each other, the movement control unit 12 controls the moving device 6 so that the second lead 112 is inserted into the hole 212 as shown in FIG. . The movement control unit 12 obliquely inserts the second lead 112 into the hole 212 while maintaining the body 101 of the lead component 100 at the first angle θ1. That is, the movement control unit 12 moves the body 101 in a direction approaching the upper surface of the substrate 200 and in a direction inclined with respect to the upper surface of the substrate 200, while maintaining the body 101 at the first angle θ1. Lead 112 is inserted into hole 212 . In the embodiment, the movement control unit 12 moves the lead component 100 in the −X direction and the −Z direction while maintaining the body 101 at the first angle θ1 from the state shown in FIG. Thereby, the second lead 112 is inserted into the hole 212 as shown in FIG.

The force sensor 8 detects the load applied to the second lead 112 when the second lead 112 is inserted into the hole 212 . The movement control section 12 controls the movement device 6 based on the detection value of the force sensor 8 . When the movement control unit 12 determines that the load applied to the second lead 112 exceeds a predetermined threshold based on the detection value of the force sensor 8, the movement control unit 12 controls the second lead 112 so as not to apply an excessive load. Then, for example, the operation of inserting the second lead 112 into the hole 212 is stopped, or the operation of inserting the second lead 112 into the hole 212 is re-executed after correcting the movement trajectory of the lead component 100 . control the device 6;

After the second lead 112 is inserted into the hole 212 , the second lead 112 is straightened using the substrate 200 . As shown in FIG. 12 , the movement control unit 12 moves the lead component 100 until the tip of the first lead 111 faces the hole 211 of the substrate 200 while the second lead 112 is arranged in the hole 212 . do. That is, the movement control unit 12 moves the lead component 100 parallel to the upper surface of the substrate 200 until the tip of the first lead 111 faces the hole 211 of the substrate 200 while the second lead 112 is arranged in the hole 212 . move in any direction. In the embodiment, the movement control unit 12 moves the lead component 100 in the -X direction from the state shown in FIG. 11 while maintaining the body 101 at the first angle θ1. Thereby, as shown in FIG. 12, the second lead 112 is bent and the second lead 112 is straightened. The second lead 112 is corrected so that the tip of the second lead 112 approaches the ideal position Pr of the second lead 112 .

After the second lead 112 is corrected until the first lead 111 faces the hole 211 of the substrate 200, the movement control unit 12 moves the second lead 112 to the hole 212 as shown in FIG. , controls the moving device 6 so that the first lead 111 is inserted into the hole 211 . The movement control unit 12 controls the movement device 6 so that the first lead 111 is inserted into the hole 211 of the substrate 200 until the body 101 of the lead component 100 reaches the second angle θ2 described with reference to FIG. do. That is, the movement control unit 12 inserts the first lead 111 into the hole 211 of the substrate 200 so that the bottom surface of the body 101 and the top surface of the substrate 200 are parallel.

In addition, in the examples shown in FIGS. 9 to 13, the first lead 111 is not bent (not straightened). Note that the first lead 111 may be bent (corrected). That is, when the first lead 111 is set as a non-corrected lead, the first lead 111 may or may not be corrected.

[Parts mounting method]
FIG. 14 is a flow chart showing a component mounting method according to the embodiment. The movement control section 12 controls the movement device 6 so that the grip device 5 moves to the component supply member 3 . After the grip device 5 moves to the component supply member 3, the grip controller 13 causes the grip device 5 to hold the lead component 100 arranged on the component supply member 3 (step S1).

The movement control unit 12 controls the movement device 6 so that the grip device 5 holding the lead component 100 moves to the detection device 7 . After the gripping device 5 moves to the detecting device 7, the detecting device 7 detects the positions of the tips of the plurality of leads 110 while the body 101 is held by the gripping device 5 (step S2).

The position error calculator 10 calculates the difference Δ between the detected position Ps of the tip of the lead 110 and the ideal position Pr of the tip of the lead 110 for each of the plurality of leads 110 . The correction lead setting unit 11 determines whether or not the difference Δ is equal to or less than the allowable value (step S3).

When it is determined in step S3 that the difference Δ is equal to or less than the allowable value (step S3: Yes), the movement control unit 12 starts normal insertion (step S4).

Normal insertion means inserting each of the two leads 110 into the hole 210 of the substrate 200 while maintaining the body 101 of the lead component 100 at the second angle θ2.

The movement control unit 12 determines whether or not the detection value of the force sensor 8 is normal (step S5).

If it is determined in step S5 that the detection value of the force sensor 8 is normal (step S5: Yes), normal insertion proceeds. The grip device 5 simultaneously inserts the two leads 110 into the two holes 210 of the substrate 200 while holding the body 101 . As the normal insertion progresses, the insertion operation of inserting the two leads 110 into the holes 210 of the substrate 200 is completed. The lead component 100 is mounted on the substrate 200 by completing the insertion operation.

If it is determined in step S5 that the detected value of the force sensor 8 is abnormal (step S5: No), normal insertion is interrupted. The position error calculator 10 calculates the search amount (step S6).

The search amount is the difference between the inner diameter of the hole 210 and the outer diameter of the lead 110 .

After the probing amount is calculated, the movement control unit 12 starts probing insertion (step S7).

The probing insertion is performed by changing the position of the lead component 100 with respect to the substrate 200 or the moving locus of the lead 110 inserted into the hole 210 within the range of the probing amount so that the detection value of the force sensor 8 becomes small. It refers to determining a position or movement trajectory and inserting the lead 110 into the hole 210 of the substrate 200 .

The movement control unit 12 determines whether or not the detection value of the force sensor 8 is normal (step S8).

In step S8, when it is determined that the detection value of the force sensor 8 is normal (step S8: Yes), probing insertion proceeds. As the probing insertion progresses, the insertion operation of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

In step S8, when it is determined that the detection value of the force sensor 8 is abnormal (step S8: No), the movement control unit 12 determines whether or not the predetermined number of retries has been exceeded (step S9).

If it is determined in step S9 that the number of retries has not been exceeded (step S9: No), the process returns to step S7. The movement control unit 12 executes probing insertion a plurality of times within the range of the number of retries until the insertion operation is completed.

If it is determined in step S9 that the number of retries has been exceeded (step S9: Yes), the movement control unit 12 stops the insertion operation.

If it is determined in step S3 that the difference Δ exceeds the allowable value (step S3: No), the movement control section 12 starts corrective insertion described with reference to FIGS. 9 to 13 (step S10).

The movement control unit 12 determines whether or not the detection value of the force sensor 8 is normal (step S11).

In step S11, when it is determined that the detection value of the force sensor 8 is normal (step S11: Yes), corrective insertion proceeds. As the corrective insertion progresses, the insertion operation of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

In step S11, when it is determined that the detection value of the force sensor 8 is abnormal (step S11: No), the position error calculator 10 calculates the probe amount (step S12).

After the probing amount is calculated, the movement control unit 12 starts probing insertion (step S13).

The movement control unit 12 determines whether or not the detection value of the force sensor 8 is normal (step S14).

In step S14, when it is determined that the detection value of the force sensor 8 is normal (step S14: Yes), probing insertion proceeds. As the probing insertion progresses, the insertion operation of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

In step S14, when it is determined that the detection value of the force sensor 8 is abnormal (step S14: No), the movement control unit 12 determines whether or not the predetermined number of retries has been exceeded (step S15).

If it is determined in step S15 that the number of retries has not been exceeded (step S15: No), the process returns to step S13. The movement control unit 12 executes probing insertion a plurality of times within the range of the number of retries until the insertion operation is completed.

In step S15, when it is determined that the number of retries has been exceeded (step S15: Yes), the movement control unit 12 stops the insertion operation.

[effect]
As described above, the component mounting apparatus 1 according to the embodiment includes the grip device 5 that holds the body 101 of the lead component 100 having the plurality of leads 110, the moving device 6 that moves the grip device 5, and the body 101. The plurality of leads 110 are detected based on the detection device 7 that detects the tip of each of the leads 110 while being held by the grip device 5, and the detection position of the tip of the lead 110 detected by the detection device 7. a correction lead setting unit 11 for setting correction leads to be corrected on the substrate 200 from the substrate 200; After inserting into the hole 210 (hole 212), the uncorrected lead (first lead 111) is inserted into the second hole 210 (hole 211) of the substrate 200 until the body 101 of the lead component 100 reaches the second angle θ2. , and a movement control unit 12 that controls the movement device 6 .

According to the embodiment, after the corrected lead is inserted into the hole 212 with the body 101 of the lead component 100 inclined at the first angle θ1, the corrected lead is corrected until the non-corrected lead faces the hole 211, After the corrected lead is corrected, the non-corrected lead is inserted into the hole 211 until the body 101 of the lead component 100 reaches the second angle θ2. As a result, the leads 110 of any type of lead component 100 are efficiently straightened on the substrate 200 and the lead component 100 is efficiently mounted on the substrate 200 .

In the embodiment, when the body 101 is adjusted to the second angle θ2 before the lead component 100 is mounted on the substrate 200, the distance L2 between the tip of the correction lead and the upper surface of the substrate 200 is the same as that of the non-correction lead. L1 longer than the distance between the tip and the top surface of the substrate 200; That is, before the lead component 100 is mounted on the substrate 200, the top surface of the substrate 200 and the bottom surface of the body 101 are parallel to each other. It is inserted into hole 210 . The component mounting apparatus 1 efficiently corrects the leads 110 on the board 200 and removes the lead component 100 without depending on the relative positions of the two leads 110 and the board 200 before the lead component 100 is mounted on the board 200 . can be mounted on the substrate 200 .

In the embodiment, the difference Δ between the detected position Ps of the tip of the lead 110 and the ideal position Pr of the tip of the lead 110 is calculated for each of the leads 110 . The corrective lead setting unit 11 sets the lead 110 having the difference Δ exceeding a predetermined allowable value as the corrective lead. Thereby, each of the corrected lead and the non-corrected lead is appropriately set.

In an embodiment, mobile device 6 includes an articulated robot. Thereby, the moving device 6 can adjust the lower surface of the body 101 to any angle with respect to the upper surface of the substrate 200 .

The force sensor 8 detects the load applied to the lead 110 when the lead 110 is inserted into the hole 210 of the substrate 200 . The movement control section 12 controls the movement device 6 based on the detection value of the force sensor 8 . When the movement control unit 12 determines that the load applied to the lead 110 exceeds a predetermined threshold based on the detection value of the force sensor 8, the movement control unit 12 stops the operation of inserting the lead 110 into the hole 210, for example. Additionally, the mobile device 6 can be controlled. This prevents excessive load from being applied to the leads 110 .

The detection device 7 detects the position of the tip of the lead 110 based on the phase shift method. As a result, the position of the tip of the lead 110 in the three-dimensional space is detected with high accuracy.

DESCRIPTION OF SYMBOLS 1... Component mounting apparatus, 2... Base, 3... Component supply member, 4... Board support member, 5... Grip device, 5A... Connecting member, 5B... Rotating member, 5C... Moving member, 5D... Grip section, 6... Moving device 6A Base member 6B Turning member 6C First arm 6D Second arm 6E Third arm 7 Detection device 7A Projection device 7B Imaging device 7C Arithmetic device , 7D... housing, 7E... transparent member, 8... force sensor, 9... control device, 9A... arithmetic processing unit, 9B... storage device, 9C... input/output interface, 10... position error calculator, 11... correction lead setting Section 12 Movement control section 13 Grip control section 100 Lead component 101 Body 110 Lead 111 First lead (uncorrected lead) 112 Second lead (corrected lead) 200 Substrate 210... Hole 211... Hole (second hole) 212... Hole (first hole) AX1... First rotation axis AX2... Second rotation axis AX3... Third rotation axis L1 -- distance, L2 -- distance, Pr -- ideal position, Ps -- detection position, RX -- rotation axis, TX -- rotation axis, Δ -- difference, θ1 -- first angle, and θ2 -- second angle.

Claims (7)

a gripping device for holding a lead component body having a plurality of leads;
a moving device for moving the gripping device;
a detection device that detects the tip of each of the plurality of leads while the body is held by the grip device;
a correction lead setting unit that sets a correction lead to be corrected on a substrate from the plurality of leads based on the detection position of the tip detected by the detection device;
After inserting the corrective lead into the first hole of the substrate while the lead component is tilted at the first angle, the non-corrective lead is inserted into the second hole of the substrate until the lead component reaches the second angle. a movement control unit for controlling the movement device to be inserted into
Component mounting equipment. In the state where the lead component is adjusted to the second angle before being mounted on the substrate, the distance between the tip of the corrective lead and the surface of the substrate is the distance between the tip of the non-corrective lead and the substrate. longer than the distance to the surface,
The component mounting apparatus according to claim 1. a position error calculator that calculates a difference between the detected position of the tip and the ideal position of the tip for each of the plurality of leads;
The corrective lead setting unit sets the lead with the difference exceeding the allowable value as the corrective lead.
The component mounting apparatus according to claim 1 or 2. The mobile device includes an articulated robot,
The component mounting apparatus according to any one of claims 1 to 3. a force sensor that detects a load applied to the lead when the lead is inserted into the hole of the substrate;
The movement control unit controls the movement device based on the detection value of the force sensor.
The component mounting apparatus according to any one of claims 1 to 4. The detection device includes a projection device for irradiating the lead component with striped pattern light, an imaging device for capturing an image of the lead component irradiated with the striped pattern light, and imaged data from the imaging device based on a phase shift method. a calculation device that calculates and calculates the detection position of the tip in a three-dimensional space,
The component mounting apparatus according to any one of claims 1 to 5. detecting tip portions of each of a plurality of leads in a state in which a body of a lead component having a plurality of leads is held by a gripping device;
setting a correction lead to be corrected on a substrate from the plurality of leads based on the detected position of the tip;
After inserting the corrective lead into the first hole of the substrate while the lead component is tilted at the first angle, the non-corrective lead is inserted into the second hole of the substrate until the lead component reaches the second angle. including inserting into
Component mounting method.

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