JP5353969B2 - Organic EL device and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device which can resolve unevenness of electrical resistance in a fixing part and does not cause display problems such as contrast deterioration by making pressing conditions between a display substrate and a relay substrate be uniform over the entire fixing part, and an electronic apparatus including the electro-optical device. <P>SOLUTION: An electro-optical device includes a display substrate on which a plurality of light-emitting elements and switching elements supplying a current to the light-emitting elements. The current is supplied through a power supply line, such as a power supply wiring 23R for light emission, in accordance with a signal provided through a signal line, such as a control signal wiring 24a for a scanning line driving circuit. The power supply line, such as the power supply wiring 23R for light emission, is formed to be wider than the signal line, such as the control signal wiring 24a for the scanning line driving circuit, and a plurality of external connection terminals such as external connection terminals 66a, 66b, 66c are provided on the power supply line such as the power supply wiring 23R for light emission. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an electro-optical device and an electronic apparatus, and more particularly, to an electro-optical device including an organic electroluminescence material and an electronic apparatus including the electro-optical device.

  In recent years, a color electro-optical device having a structure in which a light emitting element made of a light emitting material such as an organic fluorescent material is sandwiched between a pixel electrode (anode) and a cathode, in particular, an organic electroluminescence (organic EL) material is used as the light emitting material. An organic EL display device has been developed. A conventional electro-optical device (organic EL display device) will be briefly described below.

  FIG. 11 is a diagram illustrating a wiring structure of a conventional electro-optical device. As shown in FIG. 11, the conventional electro-optical device includes a plurality of scanning lines 901, a plurality of signal lines 902 extending in a direction intersecting the scanning lines 901, and a plurality of light emitting elements extending in parallel with the signal lines 902. A power supply wiring 903 is provided, and a pixel region A is provided at each intersection of the scanning line 901 and the signal line 902. Each signal line 902 is connected to a data side driving circuit 904 including a shift register, a level shifter, a video line, and an analog switch, and each scanning line 901 is connected to a scanning side driving circuit 905 including a shift register and a level shifter. ing.

  Each pixel region A has a switching thin film transistor 913 to which a scanning signal is supplied to the gate electrode via the scanning line 901 and a holding for holding an image signal supplied from the signal line 902 via the switching thin film transistor 913. The capacitor Cap, the current thin film transistor 914 to which the image signal held by the holding capacitor Cap is supplied to the gate electrode, and the light emission power supply wiring when electrically connected to the light emission power supply wiring 903 via the current thin film transistor 914 A pixel electrode 911 into which a driving current flows from 903 and a light emitting layer 910 sandwiched between the pixel electrode 911 and the cathode 912 are provided. The cathode 912 is connected to the cathode power supply circuit 931.

  The light emitting layer 910 includes three types of light emitting elements, a light emitting layer 910R that emits red light, a light emitting layer 910G that emits green light, and a light emitting layer 910B that emits blue light. The light emitting layers 910R, 910G, and 910B include Striped arrangement. The light emitting power supply wirings 903R, 903G, and 903B connected to the light emitting layers 910R, 910G, and 910B via the current thin film transistor 914 are connected to the light emitting power supply circuit 932, respectively. The reason why the power supply wiring for light emission is wired for each color is that the driving potential of the light emitting layer 910 is different for each color.

  In the above configuration, when a scanning signal is supplied to the scanning line 901 and the switching thin film transistor 913 is turned on, electric charge corresponding to the image signal supplied to the signal line 902 at that time is held in the holding capacitor Cap. The on / off state of the current thin film transistor 914 is determined according to the amount of charge held in the storage capacitor Cap. Then, a current flows from the light emitting power supply wirings 903R, 903G, and 903B to the pixel electrode 911 via the current thin film transistor 914, and further, a drive current flows to the cathode 912 via the light emitting layer 910. At this time, light emission corresponding to the amount of current flowing through the light emitting layer 910 is obtained from the light emitting layer 910.

  11 includes a scanning line 901, a signal line 902, a cathode 912, a light-emitting power supply wiring 903 (903R, 903G, 903B), a scanning side driving circuit 905, and a pixel region A made of glass or the like. A configuration in which circuits such as a cathode power supply circuit 931, a light emission power supply circuit 932, and a data side driving circuit 904 are formed on a transparent substrate (display substrate) and arranged on a flexible flexible substrate (relay substrate). Sometimes it is said.

  In such a configuration, the flexible substrate is fixed to the substrate, and the scanning line 901, the signal line 902, the cathode 912, and the light-emitting power supply wiring 903 are electrically connected to the circuit formed on the flexible substrate. There is a need. The fixing and electrical connection between the substrate and the flexible substrate are performed by disposing an anisotropic conductive film containing conductive particles between the substrate and the flexible substrate and pressing the flexible substrate against the substrate.

  In order to stably emit light from the light emitting layer 910 provided in the above-described electro-optical device, it is required to reduce the potential fluctuation of the driving current applied from the light emitting power supply wiring 903 to the pixel electrode 911 as much as possible. In particular, the electro-optical device shown in FIG. 11 is a current-driven electro-optical device, and in order to prevent display problems such as display unevenness and contrast reduction, wiring resistances of the cathode 912 and the light-emitting power supply wiring 903 are used. It is necessary to minimize the voltage drop due to the above. For this reason, the cathode 912 and the light-emitting power supply wiring 903 are formed wider than the scanning line 901 and the signal line 902.

  When the substrate and the flexible substrate are fixed, there is a demand to make the pressure bonding conditions the same over the entire surface of the fixing portion in order to make the electrical resistance generated mainly in the pressing portion uniform. In order to satisfy this requirement, it is necessary to make the shape of the terminal provided in the fixing portion to which the above-described various wirings are connected the same.

  However, as described above, since the electro-optical device shown in FIG. 11 is a current-driven electro-optical device, reducing the wiring width of the cathode 912 and the light-emitting power supply wiring 903 causes a voltage drop due to wiring resistance or the like. It is difficult to consider. In addition, since the scanning lines 901 and the signal lines 902 are large in number, and it is necessary to make the lines thin and narrow in order to arrange all of them, the line widths of the scanning lines 901 and the signal lines 902 are set to the cathode 912 and the light emission. It is also difficult to make it the same width as the power supply wiring 903.

  The present invention has been made in view of the above circumstances, and eliminates the non-uniformity of electrical resistance in the fixed portion by making the pressure bonding conditions of the display substrate and the relay substrate the same throughout the fixed portion. It is an object of the present invention to provide an electro-optical device that does not cause display problems such as a decrease in contrast and an electronic apparatus including the electro-optical device.

In order to solve the above-described problems, an electro-optical device according to the present invention includes a signal line, a light-emitting element having a light-emitting layer provided between the pixel electrode and the cathode on a substrate, and the pixel electrode electrically And a plurality of first external connection terminals connected to the power supply line, wherein the plurality of first external connection terminals are outside an actual display region including the light emitting element. Each of the power supply line and the plurality of first external connection terminals is larger than a width of the signal line, and each of the plurality of first external connection terminals is Each of the plurality of first external connection terminals is smaller than the width of the power supply line, and is formed within the width of the power supply line.
The electro-optical device according to the aspect of the invention is the above-described electro-optical device, wherein a scanning line provided to intersect the signal line, a scanning line driving circuit that supplies a scanning signal to the scanning line, A scanning line driving circuit control signal wiring for supplying a scanning line driving circuit control signal to the scanning line driving circuit; and a second external connection terminal electrically connected to the scanning line driving circuit control signal wiring; And the width of the control signal line for the scanning line driving circuit and the width of the second external connection terminal are the same.
The electro-optical device according to the aspect of the invention is the electro-optical device described above, wherein the width of the signal line is smaller than the width of the control signal line for the scanning line driving circuit and the second external connection terminal. Features.
The electro-optical device according to the aspect of the invention is the electro-optical device described above, in which the signal line is electrically connected to the third external connection terminal, the width of the signal line, and the third The width of the external connection terminal is the same.
In order to solve the above-described problem, the electro-optical device according to the aspect of the invention includes the plurality of pixels according to the intersection of the actual display region provided with the plurality of pixel regions, the plurality of signal lines, and the plurality of signal lines. A plurality of scanning lines formed so as to be provided with a region; a power supply line that supplies a driving current to the pixel region; a power line wider than each of the plurality of signal lines; and a scanning signal for the plurality of scanning lines. A scanning line driving circuit to be supplied; a scanning line driving circuit control signal wiring for supplying a scanning line driving circuit control signal to the scanning line driving circuit; and the scanning line driving circuit disposed outside the actual display area A first external connection terminal connected to the control signal line, wherein the width of the first external connection terminal is the same as the width of the control signal line for the scanning line driving circuit.
The electro-optical device according to the aspect of the invention is the electro-optical device described above, and includes a plurality of second external connection terminals that are disposed outside the actual display region and connected to the power supply line. The width of each of the two external connection terminals is narrower than the width of the power supply line.
Further, an electro-optical device according to the present invention is the electro-optical device described above, and includes a plurality of third external connection terminals that are disposed outside the actual display region and connected to each of the plurality of signal lines. The width of each of the plurality of third external connection terminals is the same as the width of each of the plurality of signal lines.
The electro-optical device according to the aspect of the invention is the above-described electro-optical device, wherein the first external connection terminal, the second external connection terminal, and the third external connection terminal are each provided with a convex portion. It is characterized by being.
The electro-optical device according to the aspect of the invention is the electro-optical device described above, and a plurality of concave portions are provided on surfaces of the first external connection terminal, the second external connection terminal, and the third external connection terminal, respectively. It is formed.
An electronic apparatus according to an aspect of the invention includes any one of the above electro-optical devices.
In order to solve the above-described problem, the electro-optical device according to the first aspect of the present invention includes at least a first wiring connected to the first external connection terminal and a second wiring wider than the width of the first wiring. The formed electro-optical device is characterized in that a plurality of second external connection terminals are provided for the second wiring.
According to this invention, since the second wiring having a width wider than the first wiring is provided with a plurality of external connection terminals, the wiring substrate is fixed to the display substrate and is electrically connected. Crimping conditions such as the degree of pressure application can be made uniform over the entire fixing portion. For this reason, it is possible to eliminate the non-uniformity of the electrical resistance in the fixing portion, and as a result, display defects such as display unevenness and a decrease in contrast due to the non-uniformity of the electric resistance in the fixing portion. It does not occur.
The electro-optical device according to the first aspect of the invention is characterized in that a convex portion is formed on the first external connection terminal and the second external connection terminal.
According to the present invention, the convex portions are formed on both the first external connection terminal and the second external connection terminal provided for the first wiring and the second wiring. For example, the wiring is made of an anisotropic conductive film. When the applied substrate is fixed to the display substrate, the proportion of the conductive particles contained in the anisotropic conductive film protrudes from both ends of the first external connection terminal and the second external connection terminal, and conversely on the external connection terminal Therefore, the ratio of staying in the region increases, which is extremely suitable for reducing the electrical resistance in the fixing portion.
The electro-optical device according to the first aspect of the present invention is characterized in that a plurality of recesses are formed on the surfaces of the first external connection terminal and the second external connection terminal.
According to this invention, the first external connection terminal and the second external connection terminal are divided into a plurality of electrodes by a plurality of recesses formed on the surfaces of the first external connection terminal and the second external connection terminal. Therefore, the substrate on which the wiring is applied can be fixed to the display substrate and the pressure bonding conditions such as the pressure applied when conducting can be made more uniform.
The electro-optical device according to the first aspect of the invention is characterized in that the widths of the second external connection terminals are substantially equal.
According to the present invention, since the widths of the second external connection terminals are set to be substantially equal, the pressure-bonding conditions such as the degree of pressure applied when the wiring substrate is fixed to the display substrate and electrical conduction is established are further increased. A preferable state can be set.
In the electro-optical device according to the first aspect of the present invention, the first relay wiring having the same width as the first wiring and the second relay wiring having the same width as the second wiring are formed. The first wiring and the first relay wiring are electrically connected via the first external connection terminal, and the second wiring and the second relay wiring are connected via the second external connection terminal. It has a relay board which is electrically connected.
In order to solve the above-described problem, an electro-optical device according to a second aspect of the present invention provides a plurality of light emitting elements and a current supplied via a power supply line in accordance with a signal supplied via the signal line. In the electro-optical device in which the switching element to be supplied to the light emitting element is formed, the power line is formed wider than the signal line, and a plurality of first external connection terminals are provided with respect to the power line. It is characterized by being provided.
According to the present invention, there is a power line formed wide because it is necessary to supply a large current in order to obtain light emission from the light emitting element, and a signal line thinned and narrowed to supply a large number of signals. Even in the case of coexistence, multiple external connection terminals are provided for the wide power supply lines, so that the substrate to which the wiring is applied is fixed to the display substrate and the pressure applied when conducting is established. The pressure bonding conditions such as can be made uniform over the entire fixing portion. For this reason, it is possible to eliminate the non-uniformity of the electrical resistance in the fixing portion, and as a result, display defects such as display unevenness and a decrease in contrast due to the non-uniformity of the electric resistance in the fixing portion. It does not occur.
The electro-optical device according to the second aspect of the invention is characterized in that a convex portion is formed on the second external connection terminal provided for the first external connection terminal and the signal line. .
According to the present invention, the first external connection terminal and the second external connection terminal provided for the power supply line and the signal line are formed with projections, for example, with an anisotropic conductive film. When the substrate is fixed to the display substrate, the proportion of the conductive particles contained in the anisotropic conductive film protrudes from both ends of the first external connection terminal and the second external connection terminal is reduced, and conversely remains on the external connection terminal. Since the ratio increases, it is extremely suitable for reducing the electrical resistance at the fixing portion.
The electro-optical device according to the second aspect of the present invention is characterized in that a plurality of recesses are formed on the surfaces of the first external connection terminal and the second external connection terminal. Item 8. The electro-optical device according to Item 7.
According to this invention, since the external connection terminal is divided into a plurality of electrodes by a plurality of recesses formed on the surfaces of the first external connection terminal and the second external connection terminal, wiring is performed. In addition to fixing the substrate to the display substrate, it is possible to make the pressure bonding conditions, such as the degree of pressure applied when conducting electricity, more uniform.
The electro-optical device according to the second aspect of the invention is characterized in that the widths of the second external connection terminals are substantially equal.
In the electro-optical device according to the second aspect of the present invention, a first relay wiring having a width comparable to the signal line and a second relay wiring having a width comparable to the power line are formed, The signal line and the first relay wiring are electrically connected via the first external connection terminal, and the power supply line and the second relay wiring are electrically connected via the second external connection terminal. It is characterized by having a relay board.
In the electro-optical device according to the second aspect of the present invention, the first external connection terminal and the first relay wiring, and the second external connection terminal and the second relay wiring are fixed by an anisotropic conductive film. It is preferable that
An electronic apparatus according to an aspect of the invention includes any one of the above electro-optical devices.

1 is an exploded perspective view schematically showing an electro-optical device according to an embodiment of the present invention. 3 is a cross-sectional view showing a state where the relay substrate 30 and the display substrate 20 are fixed by an anisotropic conductive film 40. FIG. 1 is a diagram schematically showing a wiring structure of an electro-optical device according to an embodiment of the present invention. 1 is a schematic plan view of an electro-optical device according to an embodiment. It is sectional drawing which follows the AA 'line of FIG. FIG. 5 is a top view of the vicinity of a fixing portion 65 shown in FIG. 4. It is sectional drawing of the 2nd external connection terminal 66c and the 2nd external connection terminal 70 which follow the BB 'line in FIG. It is an enlarged view of the external connection terminal 70 in FIG. 1 is a diagram illustrating an example of an electronic apparatus including an electro-optical device according to an embodiment of the invention. It is a perspective view which shows the mobile telephone as another electronic device. It is a figure which shows the wiring structure of the conventional electro-optical apparatus.

  Hereinafter, an electro-optical device and an electronic apparatus according to an embodiment of the invention will be described in detail with reference to the drawings. Each drawing referred to in the following description has a different scale for each layer and each member so that each layer and each member can be recognized on the drawing.

  FIG. 1 is an exploded perspective view schematically showing an electro-optical device according to an embodiment of the present invention. As shown in FIG. 1, the electro-optical device 10 according to the present embodiment is roughly composed of a display substrate 20 and a relay substrate 30 connected to the display substrate 20. The display substrate 20 is an active matrix organic EL device using a thin film transistor as a switching element.

  A plurality of scanning lines 21 are formed on the display substrate 20, and a plurality of signal lines 22 extending in a direction crossing the scanning lines 21 are formed. The display substrate 20 is provided with a display element 20a in which a plurality of light emitting elements are formed. Further, although not shown in FIG. 1, the display substrate 20 is provided with a power supply line and a cathode. Further, one end of the display substrate 20 is formed with scanning lines 21, signal lines 22, and external connection terminals 27 for power supply lines and cathodes (not shown).

  The electro-optical device 10 shown in FIG. 1 is a schematic diagram of the main configuration to the last, and there are many actual scanning lines 21, signal lines 22, and external connection terminals 27 with very narrow intervals. It should be noted that each is formed on the display substrate 20. Also, the connection state between the external connection terminal 27 and the scanning line 21 is not shown in FIG.

  The relay substrate 30 has a configuration in which a plurality of wirings 32 are formed on a flexible base substrate 31 and a semiconductor chip 33 is mounted at a predetermined position of the relay substrate 30. At one end of the wiring 32, an external connection terminal 34 for electrically connecting to the wiring such as the scanning line 21 and the signal line 22 formed on the display substrate 20 is formed. In FIG. 1, only the semiconductor chip 33 is mounted on the relay substrate 30, but a resistor, a capacitor, and other chip components are mounted at predetermined positions other than the portion where the semiconductor chip 33 is mounted. May be. In addition, the wiring 32 and the external connection terminal 34 formed on the relay board 30 are also schematically shown with an enlarged interval and a simplified structure in order to facilitate understanding of the structure.

  As shown in FIG. 1, the relay substrate 30 is fixed to the display substrate 20 via an anisotropic conductive film 40. At this time, the external connection terminal 34 of the relay substrate 30 is electrically connected to the external connection terminal 27 of the display substrate 20 through the anisotropic conductive film 40. The anisotropic conductive film 40 is a conductive polymer film used to electrically connect a pair of terminals with anisotropy, and is, for example, as shown in FIG. It is formed by dispersing a large number of conductive particles 41b in a thermoplastic or thermosetting adhesive resin 41a.

  FIG. 2 is a cross-sectional view showing how the relay substrate 30 and the display substrate 20 are fixed by the anisotropic conductive film 40. As shown in FIG. 2, since the conductive particles 41b are sandwiched between the external connection terminal 27 formed on the display substrate 20 and the external connection terminal 34 formed on the relay substrate 30, the external connection terminal 27 and the relay wiring are connected. Is electrically connected to the external connection terminal 34. On the other hand, in a portion other than the portion where the external connection terminal 27 and the external connection terminal 34 are formed, even if the conductive particles 41b are sandwiched, the connection terminal does not exist, and thus conduction is not achieved. In this way, conduction can be established only between the external connection terminal 27 and the external connection terminal 34.

  In order to fix the display substrate 20 and the relay substrate 30 using the anisotropic conductive film 40, the display substrate 20 is placed on a mounting table (not shown) having a guide plate having a rough surface. The display substrate 20 is vacuum-sucked. At this time, the display substrate 20 is mounted on the mounting table so that at least a portion where the relay substrate 30 is fixed to the display substrate 20 is positioned above the guide plate. Here, the guide plate having a rough surface is used to reduce the temperature applied to the display substrate 20 by reducing the contact area between the guide plate and the display substrate 20 and suppressing heat dissipation from the guide plate. Because.

  When the mounting of the display substrate 20 on the mounting table is completed, the anisotropic conductive film 40 is attached to the portion of the display substrate 20 to which the relay substrate 30 is fixed, and the surface on which the semiconductor chip 33 is mounted is placed downward. The relay substrate 30 is aligned so that the external connection terminal 34 is positioned above the anisotropic conductive film 40 on the side. When the above steps are finished, the external connection formed on the external connection terminal 34 and the display substrate 20 is heated and pressurized on the back surface of the surface on which the external connection terminal 34 is formed using a heating and pressure head (not shown). Conductivity with the terminal 27 is established, and the relay substrate 30 is fixed to the display substrate 20. At this time, the temperature applied to the relay substrate 30 and the display substrate 20 from the heating / pressurizing head is about several hundreds to several hundreds of degrees C., and the applied pressure is several megapascals. Through the above steps, the relay substrate 30 can be fixed to the display substrate 20.

  Next, details of the wiring structure of the electro-optical device 10 of the present embodiment will be described. FIG. 3 is a diagram schematically showing a wiring structure of the electro-optical device according to the embodiment of the invention. As shown in FIG. 3, the electro-optical device 10 includes a plurality of scanning lines 21, a plurality of signal lines 22 extending in a direction intersecting the scanning lines 21, and a plurality of light emitting elements extending in parallel with the signal lines 22. A power supply wiring 23 is wired, and a pixel region A is provided in the vicinity of each intersection of the scanning line 21 and the signal line 22.

  Each signal line 22 is connected to a data side drive circuit 33a including a shift register, a level shifter, a video line, and an analog switch. Each signal line 22 is connected to an inspection circuit 25 having a thin film transistor. Further, a scanning line driving circuit 24 having a shift register and a level shifter is connected to each scanning line 21.

  In each of the pixel regions A, a switching thin film transistor 52, a storage capacitor Cap, a current thin film transistor 53, a pixel electrode 51, a light emitting layer 50, and a cathode 26 are provided. The switching thin film transistor 52 has a gate electrode connected to the scanning line 21 and is driven according to a scanning signal supplied from the scanning line 21 to be turned on or off. The holding capacitor Cap holds an image signal supplied from the signal line 22 via the switching thin film transistor 52.

  The gate electrode of the current thin film transistor 53 is connected to the switching thin film transistor 52 and the storage capacitor Cap, and an image signal held by the storage capacitor Cap is supplied to the gate electrode. The pixel electrode 51 is connected to the current thin film transistor 53, and when the pixel electrode 51 is electrically connected to the light emission power supply wiring 23 via the current thin film transistor 53, a drive current flows from the light emission power supply wiring 23. The light emitting layer 50 is sandwiched between the pixel electrode 51 and the cathode 26.

  The light emitting layer 50 includes three types of light emitting elements: a light emitting layer 50R that emits red light, a light emitting layer 50G that emits green light, and a light emitting layer 50B that emits blue light. The light emitting layers 50R, 50G, and 50B are included. Are arranged in stripes. The light emitting power supply wirings 23R, 23G, and 23B connected to the light emitting layers 50R, 50G, and 50B through the current thin film transistor 53 are connected to the light emitting power supply circuit 33c. The reason why the light-emitting power supply wirings 23R, 23G, and 23B are wired for each color is that the driving potentials of the light-emitting layers 50R, 50G, and 50B are different for each color.

In the electro-optical device of this embodiment, a capacitance C ₁ is formed between the cathode 26 and the light-emitting power supply wirings 23R, 23G, and 23B. When the electro-optical device 10 is driven, charges are accumulated in the capacitance C ₁ . When the potential of the drive current flowing through each light emission power supply line 23 varies during driving of the electro-optical device 10, the accumulated charge is discharged to each light emission power supply line 23 to suppress the potential fluctuation of the drive current. . Thereby, the image display of the electro-optical device 10 can be kept normal.

  In the electro-optical device 10, when a scanning signal is supplied from the scanning line 21 and the switching thin film transistor 52 is turned on, the potential of the signal line 22 at that time is held in the holding capacitor Cap and held in the holding capacitor Cap. The on / off state of the current thin film transistor 53 is determined in accordance with the applied potential. A drive current flows from the light emitting power supply wirings 23R, 23G, and 23B to the pixel electrode 51 through the channel of the current thin film transistor 53, and further a current flows to the cathode 26 through the light emitting layers 50R, 50G, and 50B. At this time, light emission corresponding to the amount of current flowing through the light emitting layer 50 is obtained from the light emitting layer 50.

  Next, a specific configuration of the electro-optical device 10 of the present embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic plan view of the electro-optical device according to this embodiment, and FIG. 5 is a cross-sectional view taken along the line AA ′ in FIG. As shown in FIG. 4, the electro-optical device 10 of this embodiment includes a substrate 60, a pixel electrode group region (not shown), a light-emitting power supply wiring 23 (23R, 23G, 23B), and a display pixel unit 61 (one point in the figure). It is roughly composed of a chain line).

  The substrate 60 is a transparent substrate made of, for example, glass. The pixel electrode group region is a region in which pixel electrodes (not shown) connected to the current thin film transistor 53 shown in FIG. As shown in FIG. 4, the light-emitting power supply wiring 23 (23R, 23G, 23B) is arranged around the pixel electrode group region and connected to each pixel electrode. The display pixel unit 61 is located at least on the pixel electrode group region and has a substantially rectangular shape in plan view. The display pixel unit 61 includes an actual display area (or also referred to as an effective display area) 62 (inside the frame of the two-dot chain line in the figure) in the center portion and a dummy area 63 (one point) arranged outside the actual display area 62. And a region between a chain line and a two-dot chain line).

  Further, the scanning line driving circuit 24 is disposed on both sides of the actual display area 62 in the drawing. The scanning line driving circuit 24 is provided on the lower layer side (substrate 60 side) of the dummy region 63. Further, on the lower layer side of the dummy region 63, a scanning line driving circuit control signal wiring 24a and a scanning line driving circuit power supply wiring 24b connected to the scanning line driving circuit 24 are provided. Furthermore, the above-described inspection circuit 25 is arranged above the actual display area 62 in the drawing. The inspection circuit 25 is provided on the lower layer side (substrate side 2) of the dummy region 63, and the inspection circuit 25 can inspect the quality and defects of the electro-optical device during manufacturing or at the time of shipment. it can.

  As shown in FIG. 4, the light-emitting power supply wirings 23 </ b> R, 23 </ b> G, and 23 </ b> B are disposed around the dummy region 63. Each light-emitting power supply wiring 23R, 23G, 23B extends from the lower side of the substrate 60 in FIG. 2 along the scanning line drive circuit control signal wiring 24a to the upper side in FIG. 24 a is bent from the position where it is interrupted, extends along the outside of the dummy area 63, and is connected to a pixel electrode (not shown) in the actual display area 62. Further, a cathode wiring 26 a connected to the cathode 26 is formed on the substrate 60. The cathode wiring 26a is formed in a substantially U shape in plan view so as to surround the light-emitting power supply wirings 23R, 23G, and 23B.

  Next, as shown in FIG. 5, the circuit unit 11 is formed on the substrate 60, and the display pixel unit 61 is formed on the circuit unit 11. In addition, the sealing material 13 that annularly surrounds the display pixel portion 61 is formed on the substrate 60, and the sealing substrate 14 is further provided on the display pixel portion 61. The sealing substrate 14 is bonded to the substrate 60 via the sealing material 13 and is made of glass, metal, resin, or the like. The adsorbent 15 is attached to the back side of the sealing substrate 14 so that water or oxygen mixed in the space between the display pixel unit 61 and the sealing substrate 14 can be absorbed. A getter agent may be used instead of the adsorbent 15. Further, the sealing material 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin, and is particularly preferably made of an epoxy resin which is a kind of thermosetting resin.

  A pixel electrode group region 11 a is provided in the central portion of the circuit portion 11. The pixel electrode group region 11 a includes a current thin film transistor 53 and a pixel electrode 51 connected to the current thin film transistor 53. The current thin film transistor 53 is embedded in the base protective layer 281, the second interlayer insulating layer 283, and the first interlayer insulating layer 284 stacked on the substrate 60, and the pixel electrode 51 is formed on the first interlayer insulating layer 284. Is formed. One of the electrodes (source electrode) connected to the current thin film transistor 53 and formed on the second interlayer insulating layer 283 is connected to the light-emitting power supply wiring 23 (23R, 23G, 23B). The circuit unit 11 is also formed with the storage capacitor Cap and the switching thin film transistor 52 described above, but these are not shown in FIG. Further, in FIG. 5, illustration of the signal line 22 is omitted.

  Next, in FIG. 5, the above-described scanning line driving circuit 24 is provided on both sides of the pixel electrode group region 11a in the drawing. 4 includes an N-channel or P-channel thin film transistor 24c that constitutes an inverter included in the shift register, and the thin film transistor 24c is not connected to the pixel electrode 51. Except for, the structure is the same as that of the current thin film transistor 53 described above. Although the inspection circuit 25 is not shown in FIG. 5, the inspection circuit 25 is similarly provided with a thin film transistor. The thin film transistor provided in the inspection circuit 25 has the same structure as the current thin film transistor 53 except that the thin film transistor is not connected to a dummy pixel electrode 51 ′ described later.

  As shown in FIG. 5, a scanning line driving circuit control signal wiring 24a is formed on the base protective layer 281 outside the scanning line driving circuit 24 in the drawing. A scanning line driving circuit power supply wiring 24b is formed on the second interlayer insulating layer 283 outside the scanning line driving circuit control signal wiring 24a. Further, a light emitting power supply wiring 23 is formed outside the scanning line driving circuit power supply wiring 24b. The light-emitting power supply wiring 23 employs a double wiring structure including two wirings, and is disposed outside the display pixel unit 61 as described above. Wiring resistance can be reduced by adopting a double wiring structure.

For example, the red light-emitting power supply wiring 23R on the left side in FIG. 5 is formed on the first wiring 23R ₁ via the first wiring 23R ₁ formed on the base protective layer 281 and the second interlayer insulating layer 283. The second wiring 23R ₂ is formed. The first wiring 23R ₁ and the second wiring 23R ₂ are connected by a contact hole 23R ₃ penetrating the second interlayer insulating layer 283 as shown in FIG. Thus, the first wiring 23R ₁ is formed at the same level as the cathode wiring 26a, and the second interlayer insulating layer 283 is disposed between the first wiring 23R ₁ and the cathode wiring 26a. . Further, as shown in FIG. 5, the cathode wiring 26a is electrically connected to the cathode wiring 26b formed on the second interlayer insulating layer 283 through the contact hole, so to speak, the cathode wiring 26a is also a double wiring. It has a structure. Therefore, the second wiring 23R ₂ is formed at the same level as the cathode wiring 26b, and the first interlayer insulating layer 284 is disposed between the first wiring 23R ₂ and the cathode wiring 26b. By adopting such a structure, a _second capacitance C ₂ is formed between the first wiring 23R ₁ and the cathode wiring 26a and between the second wiring 23R ₂ and the cathode wiring 26b. ing.

Similarly, the blue and green light-emitting power supply wirings 23G and 23B on the right side of FIG. 5 also adopt a double wiring structure, and the first wirings 23G ₁ and 23B ₁ formed on the base protective layer 281 respectively. 4 and second wirings 23G ₂ and 23B ₂ formed on the second interlayer insulating layer 283. The first wirings 23G ₁ and 23B ₁ and the second wirings 23G ₂ and 23B ₂ are as shown in FIG. Are connected by contact holes 23G ₃ and 23B ₃ penetrating through the second interlayer insulating layer 283. A _second capacitance C ₂ is formed between the blue first wiring 23B ₁ and the cathode wiring 26a and between the blue second wiring 23B ₂ and the cathode wiring 26b.

The distance between the first wiring 23R ₁ and the second wiring 23R ₂ is preferably in the range of 0.6 to 1.0 μm, for example. If the distance is less than 0.6 μm, parasitic capacitance between the source metal and the gate metal having different potentials such as the signal line 22 and the scanning line 21 is not preferable. For example, in the actual display area 62, there are many locations where the source metal and the gate metal intersect, and if there is a large parasitic capacitance at such locations, there is a risk of causing a time delay of the image signal. As a result, an image signal cannot be written into the pixel electrode 51 within a predetermined period, which causes a decrease in contrast. The material of the second interlayer insulating layer 283 sandwiched between the first wiring 23R ₁ and the second wiring 23R ₂ is preferably, for example, SiO _2, but if formed to be 1.0 μm or more, the substrate 60 may be broken by the stress of SiO _2. .

Further, a cathode 26 extending from the display pixel portion 61 is formed on the upper side of each light emitting power supply wiring 23R. As a result, the second wiring 23R ₂ of each light-emitting power supply wiring 23R is disposed opposite to the cathode 26 with the first interlayer insulating layer 284 interposed therebetween, whereby the second wiring 23R ₂ and the cathode 26 have the aforementioned first wiring. 1 capacitance C ₁ is formed. Here, the distance between the second wiring 23R ₂ and the cathode 26 is preferably in the range of 0.6 to 1.0 μm, for example. When the distance is less than 0.6 μm, parasitic capacitance between the pixel electrode and the source metal having different potentials such as the pixel electrode and the source metal increases, and therefore a wiring delay of the signal line using the source metal occurs. As a result, the image signal cannot be written within a predetermined period, which causes a decrease in contrast. The material of the first interlayer insulating layer 284 sandwiched between the second wiring 23R ₂ and the cathode 26 is preferably, for example, SiO ₂ or acrylic resin. However, if SiO ₂ is formed to have a thickness of 1.0 μm or more, the substrate 60 may be broken by stress. In the case of an acrylic resin, it can be formed up to about 2.0 μm. However, since it has a property of expanding when it contains water, the pixel electrode formed thereon may be broken.

As described above, the display substrate 20 is provided with the _first capacitance C ₁ between the light emitting power supply wiring 23 and the cathode 26, so that the potential of the drive current flowing through the light emitting power supply wiring 23 varies. In addition, the charge accumulated in the _first capacitance C ₁ is supplied to the light-emitting power supply wiring 23, and the potential deficiency of the drive current is compensated by this charge, so that the potential fluctuation can be suppressed. The image display can be kept normal. In particular, since the light-emitting power supply wiring 23 and the cathode 26 face each other outside the display pixel portion 61, the distance between the light-emitting power supply wiring 23 and the cathode 26 is reduced and stored in the _first capacitance C1. The amount of charge that is generated can be increased, and the potential fluctuation of the drive current can be further reduced to stably display an image. Further, the light-emitting power supply wiring 23 has a double wiring structure composed of the first wiring and the second wiring, and the second capacitance C ₂ is provided between the first wiring and the cathode wiring. Further, since the electric charge accumulated in the _second capacitance C ₂ is also supplied to the light emitting power supply wiring 23, the potential fluctuation can be further suppressed, and the image display of the light emitting device 1 can be kept more normal. .

  Next, the light emitting layer 50 and the bank part (insulating part) 122 are formed in the actual pixel region 62 of the display pixel part 61. As shown in FIG. 5, the light emitting layer 50 is laminated on each of the pixel electrodes 51. The bank unit 122 is provided between each pixel electrode 51 and each light emitting layer 50, and partitions each light emitting layer 50. The bank unit 122 is configured by laminating an inorganic bank layer 122 a located on the substrate 60 side and an organic bank layer 122 b located away from the substrate 60. A light shielding layer may be disposed between the inorganic bank layer 122a and the organic bank layer 122b.

The inorganic and organic bank layers 122a and 122b are formed to extend on the peripheral edge of the pixel electrode 51, and the inorganic bank layer 122a extends to the center side of the pixel electrode 51 from the organic bank layer 122b. Is formed. Also, the inorganic bank layer 122a is, for example, preferably made of an inorganic material of SiO _2, TiO _2, SiN or the like. The film thickness of the inorganic bank layer 122a is preferably in the range of 50 to 200 nm, particularly 150 nm. If the film thickness is less than 50 nm, the inorganic bank layer 122a is thinner than the hole injection / transport layer described later, and the flatness of the hole injection / transport layer cannot be ensured. On the other hand, if the film thickness exceeds 200 nm, the step due to the inorganic bank layer 122a becomes large, and the flatness of the light emitting layer to be described later stacked on the hole injection / transport layer cannot be secured, which is not preferable.

  Furthermore, the organic bank layer 122b is formed of a normal resist such as an acrylic resin or a polyimide resin. The thickness of the organic bank layer 122b is preferably in the range of 0.1 to 3.5 μm, and particularly preferably about 2 μm. If the thickness is less than 0.1 μm, the organic bank layer 122b becomes thinner than the total thickness of the hole injection / transport layer and the light emitting layer, which will be described later, and the light emitting layer may overflow from the upper opening, which is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening becomes large, and step coverage of the cathode 26 formed on the organic bank layer 122b cannot be ensured. Further, if the thickness of the organic bank layer 122b is 2 μm or more, it is more preferable because the insulation between the cathode 26 and the pixel electrode 51 can be improved. In this way, the light emitting layer 50 is formed thinner than the bank portion 122.

  Further, an area showing lyophilicity and an area showing liquid repellency are formed around the bank portion 122. The lyophilic regions are the inorganic bank layer 122a and the pixel electrode 51, and lyophilic groups such as hydroxyl groups are introduced into these regions by plasma treatment using oxygen as a reactive gas. Further, the region showing liquid repellency is the organic bank layer 122b, and a liquid repellent group such as fluorine is introduced by plasma treatment using tetrafluoromethane as a reaction gas.

  The light emitting layer 50 is laminated on a hole injection / transport layer (not shown) laminated on the pixel electrode 51. In the present specification, a configuration including the light emitting layer 50 and the hole injection / transport layer is referred to as a functional layer, and a configuration including the pixel electrode 51, the functional layer, and the cathode 26 is referred to as a light emitting element. The hole injection / transport layer has a function of injecting holes into the light emitting layer 50 and a function of transporting holes inside the hole injection / transport layer. By providing such a hole injecting / transporting layer between the pixel electrode 51 and the light emitting layer 50, device characteristics such as light emitting efficiency and life of the light emitting layer 50 are improved. Further, in the light emitting layer 50, holes injected from the hole injection / transport layer and electrons from the cathode 26 are combined to generate fluorescence. The light emitting layer 50 has three types, a red light emitting layer that emits red (R), a green light emitting layer that emits green (G), and a blue light emitting layer that emits blue (B). As shown in FIG. 2, the light emitting layers are arranged in stripes.

  Next, as shown in FIG. 5, the dummy light emitting layer 210 and the dummy bank unit 212 are formed in the dummy region 63 of the display pixel unit 61. The dummy bank unit 212 is configured by laminating a dummy inorganic bank layer 212 a located on the substrate 60 side and a dummy organic bank layer 212 b located away from the substrate 60. The dummy inorganic bank layer 212a is formed on the entire surface of the dummy pixel electrode 51 ′. The dummy organic bank layer 212b is formed between the pixel electrodes 51 in the same manner as the organic bank layer 122b. The dummy light emitting layer 210 is formed on the dummy pixel electrode 51 ′ via the dummy inorganic bank 212a.

  The dummy inorganic bank layer 212a and the dummy organic bank layer 211b have the same material and the same film thickness as the inorganic and organic bank layers 122a and 122b described above. The dummy light-emitting layer 210 is laminated on a dummy hole injection / transport layer (not shown), and the material and film thickness of the dummy hole injection / transport layer and the dummy light-emitting layer are the above-described hole injection / transport. This is the same as the layer and the light emitting layer 50. Therefore, like the light emitting layer 50 described above, the dummy light emitting layer 210 is formed thinner than the dummy bank portion 212.

  By disposing the dummy region 63 around the actual display region 62, the thickness of the light emitting layer 50 in the actual display region 62 can be made uniform, and display unevenness can be suppressed. That is, by arranging the dummy region 63, the drying condition of the discharged composition ink when the display element is formed by the ink jet method can be made constant in the actual display region 62. Therefore, there is no possibility that the thickness of the light emitting layer 50 is uneven.

Next, the cathode 26 is formed on the entire surface of the actual display region 62 and the dummy region 63 and extends to the substrate 60 outside the dummy region 63, and outside the dummy region 63, that is, outside the display pixel unit 61. The light-emitting power supply wiring 23 is opposed to the light-emitting power supply wiring 23. The end of the cathode 26 is connected to a cathode wiring 26 a formed in the circuit unit 11. The cathode 26 serves as a counter electrode of the pixel electrode 51 and causes a current to flow through the light emitting layer 50. The cathode 26 is formed by, for example, laminating a cathode layer 26b made of a laminate of lithium fluoride and calcium and a reflective layer 26c. Of the cathode 26, only the reflective layer 26 c extends to the outside of the display pixel unit 61. The reflective layer 26c reflects light emitted from the light emitting layer 50 toward the substrate 60, and is preferably made of, for example, Al, Ag, Mg / Ag laminate, or the like. Furthermore, an anti-oxidation protective layer made of SiO ₂ , SiN or the like may be provided on the reflective layer 26c.

  As shown in FIG. 4, the relay substrate 30 is fixed to one end of the substrate 60 using the anisotropic conductive film 40 described above. The semiconductor chip 33 mounted on the relay substrate 30 incorporates the data side drive circuit 33a, the cathode power supply circuit 33b, and the light emission power supply circuit 33c shown in FIG. A portion surrounded by a broken line in FIG. 4 indicates a fixing portion between the display substrate 20 and the relay substrate 30. FIG. 6 is a top view of the vicinity of the fixing portion 65 shown in FIG. In FIG. 6, the anisotropic conductive film 40 and the relay substrate 30 are not shown.

  As shown in FIG. 6, in the fixing portion 65, a first external connection terminal having a width approximately equal to the width of the wiring is provided for each of the thin wirings, and a line is provided for the wide wiring. A plurality of second external connection terminals narrower than the width are provided. For example, for each of the scanning line drive circuit control signal wirings 24a having a narrow line width, the first external connection terminals 67, 68 having a width comparable to the line width of the scanning line drive circuit control signal wirings 24a, 69 is provided. On the other hand, for the light emission power supply wiring 23R having a wide width, second external connection terminals 66a, 66b, 66c having a width smaller than the line width of the light emission power supply wiring 23R are provided. Further, the second external connection terminal 70 having a line width comparable to that of the signal line 22 is provided for each of the signal lines 22 narrower than the scanning line drive circuit control signal wiring 24a. Note that the numbers of the first external connection terminals and the second external connection terminals are appropriately set according to the line width of the wiring formed on the substrate 60.

  As described above, the number of the first external connection terminals and the second external connection terminals is changed in accordance with the line width of the wiring formed on the substrate 60. Because. That is, as described with reference to FIGS. 1 and 2, the display substrate 10 and the relay substrate 20 are fixed by the anisotropic conductive film 40, but the fixing conditions (for example, the width of the terminal, the bonding area, and the pressure) If the degree of engagement is different, the electrical resistance in the fixing portion 65 varies depending on the position. If the electrical resistance of the fixing portion 65 varies depending on the position, display defects such as display unevenness and contrast reduction occur. For this reason, in the adhering portion 65, the crimping conditions are made the same as much as possible by changing the number of external connection terminals according to the line width of the wiring formed on the substrate 60. Furthermore, the bonding area can be increased by providing a plurality of external connection terminals. That is, since the anisotropic conductive film can be disposed between the plurality of external connection terminals n, strong adhesion is possible.

Next, the structure of the external connection terminal formed on the fixing portion 65 will be described in detail. 7 is a cross-sectional view of the second external connection terminal 66c and the second external connection terminal 70 taken along the line BB ′ in FIG. 6, and FIG. 8 is an enlarged view of the external connection terminal 70 in FIG. is there. As shown in FIGS. 7 and 8, a base protective layer 281 is formed on the substrate 60, and a gate insulating layer 71 mainly composed of SiO ₂ and / or SiN is formed on the base protective layer 281. Yes. The gate insulating layer 71 is formed to electrically insulate a channel region of a thin film transistor (not shown) from a gate electrode. In the present specification, the “main component” means a component having the highest content.

  A signal line 22 and a light-emitting power supply wiring 23R are formed on the gate insulating layer 71, and a second interlayer insulating layer 283 is formed on the signal line 22 and the light-emitting power supply wiring 23R. The light-emitting power supply wiring 23 and the scanning line drive circuit control signal wiring 24a are formed simultaneously with the scanning line 21 shown in FIG.

  A plurality of contact holes H are formed in the second interlayer insulating layer 283 above the signal lines 22 and the light-emitting power supply wirings 23R. An electrode 73 is formed on the second interlayer insulating layer 283 above the light-emitting power supply wiring 23R, and electrodes 74 and 75 are formed on the second interlayer insulating layer 283 above the signal line 22.

  Since these electrodes 73, 74, 75 are formed by sputtering after forming the contact hole H, a concave portion B is formed on the surface above the contact hole H by the amount of the metal material deposited in the contact hole H. Is formed. In this way, the electrical connection between the light-emitting power supply wiring 23R covered by the second interlayer insulating layer 283 and the electrode 74 formed on the second interlayer insulating layer 283 through the contact hole H, and the second interlayer The signal line 22 covered with the insulating layer 283 and the electrodes 74 and 75 formed on the second interlayer insulating layer 283 are electrically connected.

Further, the ends and sides of the electrodes 73, 74, 75 formed on the second interlayer insulating layer 283, and between these electrodes 73, 74, 75 are made of SiN or the like for the purpose of electrical insulation. A first interlayer insulating layer 284 made of an inorganic material is formed. Transparent electrodes 77 made of ITO or the like are formed on the upper, side, and peripheral portions of the electrodes 73, 74, and 75. Further, the transparent electrodes 77 and the second external portion formed on the peripheral portions of the electrodes 73, 74, and 75 are formed. A protective layer 78 made of SiO ₂ is formed between the connection terminals 66c, 70, 70. The electrodes 73, 74, and 75 are formed simultaneously with the gate line shown in FIG. 3, and the transparent electrode 77 is formed of ITO and formed simultaneously with the pixel electrode (anode).

  As shown in FIGS. 7 and 8, a plurality of recesses B are formed on the surfaces of the second external connection terminals 66c, 70, 70 provided in the electro-optical device of the present embodiment. In other words, the second external connection terminals 66c, 70, 70 are divided into a plurality of electrodes. As shown in FIG. 6, the number of external connection terminals is changed in accordance with the line widths of the light-emitting power supply wiring 23R and the signal line 22, so that the fixing condition in the fixing portion 65 is made uniform. Since the plurality of recesses B are formed on the surfaces of the external connection terminals 66c, 70, 70, the second external connection terminals 66c, 70, 70 are further divided into a plurality of electrodes, so that the fixing conditions can be made uniform. This is extremely suitable for the purpose.

  Further, by forming the first interlayer insulating layer 284 at the ends of the electrodes 73, 74, 75, the convex portions 79 are formed at the ends of the second external connection terminals 66 c, 70, 70. When the projection 79 fixes the display substrate 10 and the relay substrate 20 using the anisotropic conductive film 40, the conductive particles 41 b included in the anisotropic conductive film 40 are connected to the second external connection terminals 66 c and 70. , 70 acts to prevent it from protruding from the sides. As a result, more conductive particles 41b are disposed on the second external connection terminals 66c, 70, and 70, so that the electrical resistance of the fixing portion 65 is extremely excellent.

  Since the display substrate 20 of the present embodiment described above is provided with a configuration for uniformizing the crimping condition in the fixing portion 65, the external connection terminal 34 formed on the relay substrate 30 fixed to the fixing portion 65. May be formed with the same line width as the light emitting power supply wiring 23R and the scanning line drive circuit control signal wiring 24a shown in FIG. However, in order to fix the relay substrate 30 and the display substrate 20 under more uniform pressure bonding conditions, it is preferable that the pattern is the same as the second external connection terminals 66c, 70, 70, etc. formed on the fixing portion 65. It is.

  Although the electro-optical device according to the embodiment of the present invention has been described above, electronic components such as the above-described electro-optical device, a motherboard including a CPU (Central Processing Unit), a keyboard, and a hard disk can be incorporated into the housing. For example, a notebook personal computer 600 (electronic device) shown in FIG. 9 is manufactured. FIG. 9 is a diagram illustrating an example of an electronic apparatus including the electro-optical device according to the embodiment of the invention. In FIG. 9, 601 is a casing, 602 is a liquid crystal display device, and 603 is a keyboard. FIG. 10 is a perspective view showing a mobile phone as another electronic apparatus. A cellular phone 700 illustrated in FIG. 10 includes an antenna 701, a receiver 702, a transmitter 703, a liquid crystal display device 704, an operation button unit 705, and the like.

  In the above-described embodiment, a notebook computer and a mobile phone have been described as examples of electronic devices. However, the present invention is not limited to these, and a liquid crystal projector, a multimedia-compatible personal computer (PC), and an engineering workstation (EWS). It can be applied to electronic devices such as pagers, word processors, televisions, viewfinder type or monitor direct-view type video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, and devices equipped with touch panels. .

  As described above, according to the present invention, a plurality of second external connection terminals are provided for the second wiring that is wider than the first wiring. There is an effect that it is possible to make the crimping conditions such as the degree of pressure applied at the time of fixing and uniforming over the entire fixing part. For this reason, it is possible to eliminate the non-uniformity of the electrical resistance in the fixing portion, and as a result, display defects such as display unevenness and a decrease in contrast due to the non-uniformity of the electric resistance in the fixing portion. There is an effect that it does not occur.

  DESCRIPTION OF SYMBOLS 10 ... Electro-optical apparatus, 20 ... Display board | substrate, 22 ... Signal line (1st wiring), 23, 23R ... Light emission power supply wiring (2nd wiring, power supply line), 24a ... Scanning line drive circuit control signal wiring (1st) 1 wiring), 30 ... relay substrate, 40 ... anisotropic conductive film, 50 ... light emitting element, 53 ... switching element, 66a, 66b, 66c ... second external connection terminal, 67, 68, 69, 70 ... first external Connection terminal, 79... Convex, B.

Claims (5)

On the board
A signal line;
A light emitting element having a light emitting layer provided between the pixel electrode and the cathode;
A power line electrically connected to the pixel electrode;
A plurality of first external connection terminals connected to the power line,
The plurality of first external connection terminals are provided outside an actual display area including the light emitting element,
Each of the power supply line and the plurality of first external connection terminals has a width larger than a width of the signal line,
The width of each of the plurality of first external connection terminals is smaller than the width of the power supply line,
Each of the plurality of first external connection terminals is formed within the width of the power supply line. A scanning line provided to cross the signal line;
A scanning line driving circuit for supplying a scanning signal to the scanning line;
A scanning line driving circuit control signal wiring for supplying a scanning line driving circuit control signal to the scanning line driving circuit;
A second external connection terminal electrically connected to the scanning line drive circuit control signal wiring,
2. The organic EL device according to claim 1, wherein a width of the control signal line for the scanning line driving circuit and a width of the second external connection terminal are the same.   3. The organic EL device according to claim 2, wherein the width of the signal line is smaller than the width of the control signal line for the scanning line driving circuit and the second external connection terminal. The signal line is electrically connected to a third external connection terminal ;
4. The organic EL device according to claim 1, wherein a width of the signal line is the same as a width of the third external connection terminal. 5.   An electronic apparatus comprising the organic EL device according to any one of claims 1 to 4.

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