JP3778759B2 - Display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display device such as a liquid crystal display device.
[0002]
[Prior art]
FIG. 5 shows a plan view of an example of a conventional liquid crystal display device. This liquid crystal display device includes an active matrix type liquid crystal display panel 1. The liquid crystal display panel 1 is configured such that a lower glass substrate 2 and an upper glass substrate 3 are bonded together via a sealing material (not shown), and liquid crystal (not shown) is sealed therebetween. In this case, the lower side and the right side of the lower glass substrate 2 protrude from the upper glass substrate 3.
[0003]
In the semiconductor chip mounting region 21 (see FIG. 6A) provided in series at predetermined three locations on the upper surface of the lower projection 2a of the lower glass substrate 2, the semiconductor chip 4 is anisotropically conductive adhesive. (Not shown). A semiconductor chip 5 is mounted on a semiconductor chip mounting region provided at a predetermined position on the upper surface of the right protruding portion 2b of the lower glass substrate 2 via an anisotropic conductive adhesive (not shown). The semiconductor chips 4 and 5 are composed of a liquid crystal driving LSI or the like.
[0004]
In the display area 6 surrounded by a two-dot chain line on the upper surface of the lower glass substrate 2, a plurality of scanning lines are provided extending in the row direction (left and right direction in FIG. 5), and A plurality of signal lines are provided so as to extend in the column direction (vertical direction in FIG. 5). The right end of the scanning line is connected to the right semiconductor chip 5 via an output wiring 7 provided at a predetermined location on the upper surface of the lower glass substrate 2. Therefore, the semiconductor chip 5 on the right side is for scanning line driving for supplying voltages to a plurality of scanning lines. The lower end portion of the signal line is connected to the lower semiconductor chip 4 via output wirings 8 provided at predetermined three locations on the upper surface of the lower glass substrate 2. Therefore, the lower semiconductor chip 4 is for driving signal lines for supplying voltages to a plurality of signal lines.
[0005]
The lower surface of one end portion of the flexible wiring substrate 11 is bonded to the outer surface of the semiconductor chip 4 mounting region on the upper surface of the lower protruding portion 2a of the lower glass substrate 2 via an anisotropic conductive adhesive (not shown). . The flexible wiring substrate 11 and the lower semiconductor chip 4 are connected via input wirings 12 provided at predetermined three locations on the upper surface of the lower protrusion 2 a of the lower glass substrate 2. The flexible wiring substrate 11 and the right semiconductor chip 5 are connected to each other via an input wiring 13 provided at a predetermined position on the upper surface in the vicinity of the right protruding portion 2 b of the lower glass substrate 2.
[0006]
Next, FIG. 6A shows an enlarged plan view of a predetermined part of the liquid crystal display panel 1 shown in FIG. 5 in an exploded state. A region 21 surrounded by an alternate long and short dash line on the upper surface of the lower protruding portion 2a of the lower glass substrate 2 is a semiconductor chip mounting region on which the semiconductor chip 4 is mounted. The input wiring 12 includes a plurality of narrow signal input wirings 14 and five wide power supply wirings 15. In this case, the signal input wirings 14 and the power supply wirings 15 are arranged in a disordered manner in accordance with the specifications of the semiconductor chip 4 (arrangement of signal input bump electrodes and power supply bump electrodes) described later.
[0007]
The plurality of signal input wirings 14 include a plurality of signal input electrode connection terminals 14a provided on the lower side of the semiconductor chip mounting area 21, and the signal input electrode connection terminals 14a below the semiconductor chip mounting area 21. It consists of a plurality of signal input terminals 14b extending to the vicinity of the protruding end on the lower side of the lower glass substrate 2 on the side. The five power supply wirings 15 are provided on the lower side of the semiconductor chip mounting area 21 and on the lower side of the semiconductor chip mounting area 21 from the power supply electrode connection terminals 15a. It consists of five power supply terminals 15b extended to the vicinity of the lower protruding end of the glass substrate 2.
[0008]
Here, the signal input wiring 14 and the power supply wiring 15 are formed of a transparent metal such as ITO. The reason why the power supply wiring 15 is formed wider than the signal input wiring 14 is that a larger current flows in the power supply wiring 15 than in the signal input wiring 14, so that the wiring resistance is lowered. is there. The detailed description of the input wiring 13 is omitted.
[0009]
As shown in FIG. 5, the flexible wiring board 11 includes a film 22 having a belt-like portion 22 a and a protruding portion 22 b that protrudes from a predetermined location on the lower side of the belt-like portion 22 a. As shown in the transmission enlarged plan view of FIG. 6B, the signal input terminals 14b and the power supply terminals of the three sets of input wirings 12 are provided at predetermined positions on the lower surface of the strip 22a of the film 22. Three sets of connection terminals 23a and 23b connected to 15b and one set of connection terminals 24 (see FIG. 5) connected to one set of input wirings 13 are provided.
[0010]
In FIG. 5 and FIG. 6 (b), the central set of connection terminals 23 a and 23 b and the connection terminal 24 is connected to a connection terminal (not shown) provided on the lower surface of the protruding end portion of the protruding portion 22 b of the film 22. The film 22 is connected via a lead wire (not shown) provided on the lower surface of the belt-like portion 22a and the protruding portion 22b. On the other hand, the remaining two sets of connection terminals 23a, 23b are connected to a central pair of connection terminals 23a, 23a, 23b via a relay hole formed across the connection terminals 23a, 23b on the upper surface of the through hole and film 22 (not shown). 23b is connected to each corresponding connection terminal.
[0011]
That is, the flexible wiring board 11 has three sets of connection terminals 23a and 23b and one set of connection terminals 24 formed on the lower surface, one set of connection terminals 23a and 23b in the center, and the remaining two sets of connection terminals 23a and 23b. Are formed as a double-sided wiring board formed on the upper surface, and three sets of connection terminals 23a and 23b are provided in parallel on the lower surface of the strip portion 22a of the film 22, One set is directly connected to a lead wire provided on the lower surface of the strip 22a of the film 22, and the remaining two sets are connected to the lead wire through a through hole or the like.
[0012]
Further, in this case, as shown in FIG. 6A, the arrangement of the signal input wiring 14 and the power supply wiring 15 of the liquid crystal display panel 1 is determined according to the specifications of the semiconductor chip 4 described later (signal input bump electrodes and power supply wiring). The arrangement of the connection terminals 23a and 23b of the flexible wiring board 11 is also changed according to the arrangement, as shown in FIG. 6B. It has become.
[0013]
Next, 7 (a) is a transparent enlarged plan view for showing the terminal positions of the semiconductor chip 4 mounted in the semiconductor chip mounting region 21 of the liquid crystal display panel 1 shown in FIG. 6 (a), and FIG. FIG. 7 is an enlarged plan view of a semiconductor chip mounting region 21 of the liquid crystal display panel 1 shown in FIG. Output electrode connection terminals 8 a made up of one end portions of a plurality of output wirings 8 are provided in a staggered manner on the upper side in the semiconductor chip mounting region 21 of the liquid crystal display panel 1. A plurality of signal input bump electrodes 31 and a pair of five power supply bump electrodes 32 are provided on the lower side portion of the lower surface of the semiconductor chip 4, and a plurality of output bump electrodes 33 are provided on the upper side portion of the lower surface. Are provided in a staggered pattern. In the above description, the power supply bump electrodes 32 are connected to each other in a pattern (not shown), and one set corresponds to one power supply electrode connection terminal 15a.
[0014]
When the semiconductor chip 4 is mounted on the semiconductor chip mounting region 21 of the liquid crystal display panel 1 via an anisotropic conductive adhesive, the signal input bump electrode 31, the power supply bump electrode 32, and the output chip of the semiconductor chip 4 are output. The bump electrode 33 is connected to the signal input electrode connection terminal 14a, the power supply electrode connection terminal 15a, and the output electrode connection terminal 8a in the semiconductor chip mounting region 21 of the liquid crystal display panel 1.
[0015]
[Problems to be solved by the invention]
By the way, in the conventional flexible wiring board 11 in such a liquid crystal display device, the figure is adjusted in accordance with the specifications of the semiconductor chip 4 shown in FIG. 7A (arrangement of the signal input bump electrode 31 and the power supply bump electrode 32). 6 (b), since the connection terminals 23a and 23b are arranged in a disordered arrangement, three sets of connection terminals 23a and 23b are provided in parallel on the lower surface of the strip 22a of the film 22, and a predetermined 2 The pair of connection terminals 23a and 23b must be connected to a common lead wire provided on the lower surface of the strip 22a of the film 22 through a through hole or the like. As a result, the strip 22a of the film 22 is connected. The width of the film increases, and thus the overall occupied area increases, and the number of films 22 taken from the base film having a constant area decreases, resulting in an increase in cost. There was a problem that is.
An object of the present invention is to reduce the area occupied by a flexible wiring board.
[0016]
[Means for Solving the Problems]
The present invention has a display panel having a plurality of semiconductor chip mounting areas arranged on one side, a plurality of power supply electrodes and a plurality of signal input electrodes, and is mounted on each of the semiconductor chip mounting areas of the display panel. Each of the semiconductor chips of the display panel is provided with a plurality of semiconductor chips and a flexible wiring board that is disposed along only one side of the display panel and is bonded to the outside of the semiconductor chip mounting region. A power supply wiring, a first signal input wiring, and a second signal input wiring extending in a direction perpendicular to the one side are provided corresponding to the semiconductor chip mounting area located on one end side in the mounting area. , another semiconductor chip so as to correspond to the mounting region provided extending out the power line and the first signal input lines in a direction perpendicular to the one side portion, said plurality of semiconductor chip mounting areas In the second signal input lines which are formed corresponding to the semiconductor chip mounting region of the one end passes through each of the semiconductor chip mounting area, and is formed corresponding to the other semiconductor chip mounting region The wiring is connected so as to be connected to the second signal input wiring, and is connected to the power wiring and the first signal input wiring formed on the flexible wiring board corresponding to each semiconductor chip mounting region. A connection terminal is provided, and a connection terminal connected to a second signal input wiring formed corresponding to the semiconductor chip mounting region on the one end side is provided.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
1 is a plan view of a liquid crystal display device according to an embodiment of the present invention, FIG. 2A is an enlarged plan view of a predetermined part of the liquid crystal display panel shown in FIG. 1, and FIG. 2A is an enlarged plan view of a portion of the flexible wiring board corresponding to the area of the liquid crystal display panel in FIG. 2A, and FIG. 3A is an enlarged plane of the semiconductor chip mounting area in the center of the liquid crystal display panel shown in FIG. FIG. 3B is a transparent enlarged plan view of a portion of the flexible wiring substrate corresponding to the region of the liquid crystal display panel of FIG. 3A, and FIG. 4A is the liquid crystal display panel shown in FIG. FIG. 4B is an enlarged plan view of the semiconductor chip mounting area of the liquid crystal display panel shown in FIG. 3A, showing a terminal position of the semiconductor chip mounted in the semiconductor chip mounting area. Is. In these drawings, the same reference numerals as those in FIGS. 5 to 7 are given the same reference numerals, and the description thereof will be omitted as appropriate.
[0018]
In the semiconductor chip 4 in this embodiment, as shown in FIG. 4A, a pair of five power supply bump electrodes 32 is provided on the left side of the lower side portion of the lower surface, and the right side of the lower side portion of the lower surface. A plurality of signal input bump electrodes 31 are provided, and a plurality of output bump electrodes 33 are provided in a staggered pattern on the upper side of the lower surface.
[0019]
Corresponding to the specifications of the semiconductor chip 4, as shown in FIG. 4B, the left side of the lower side in the semiconductor chip mounting area 21 of the liquid crystal display panel 1 is composed of one end of five power supply lines 41. A power supply electrode connection terminal 41a is provided, and a first of a plurality of first signal input wirings 42 (see FIG. 3A) is provided on the left side of the right side of the lower side in the region 21. A signal input electrode connection terminal 42a is provided, and the right side of the lower side of the region 21 is formed of a predetermined part of a plurality of second signal input wirings 43 (see FIG. 3A). The second signal input electrode connection terminals 43a are provided, and the output electrode connection terminals 8a formed of one end portions of the plurality of output wirings 8 are provided in a staggered manner on the upper side in the region 21.
[0020]
As shown in FIG. 3A, the power supply wiring 41 extends from the power supply electrode connection terminal 41a to the vicinity of the protruding end on the lower side of the lower glass substrate 2 below the semiconductor chip mounting region 21. A terminal 41b is provided. The first signal input wiring 42 extends from the first signal input electrode connection terminal 42a to the vicinity of the lower protruding end of the lower glass substrate 2 below the semiconductor chip mounting region 21. An input terminal 42b is provided.
[0021]
Next, the second signal input wiring 43 will be described. In the central semiconductor chip mounting area 21 in FIG. 2A, as shown in FIGS. 3A and 4B, the semiconductor chip mounting area from above the second signal input electrode connection terminal 43a. A signal input relay wiring 43b is provided which is appropriately extended in the area 21 and appropriately extended from the lower side of the second signal input electrode connection terminal 43a to the outside of the semiconductor chip mounting area 21.
[0022]
As shown in FIGS. 2A and 3A, the lower end portion of the signal input relay wiring 43b is located at the lower right side of the central semiconductor chip mounting area 21, the right side thereof, and the semiconductor chip mounting area 21 on the right side thereof. The second signal input electrode connection terminal 43a is connected to the second signal input electrode connection terminal 43a in the semiconductor chip mounting region 21 on the right side via the signal input relay wiring 43c provided therein. Is connected to a second signal input terminal 43d extending to the vicinity of the lower protruding end of the lower glass substrate 2 below the right semiconductor chip mounting region 21.
[0023]
As shown in FIGS. 2A, 3A, and 4B, the upper end portion of the signal input relay wiring 43b is located in the central semiconductor chip mounting region 21, on the left side, and on the left side of the semiconductor chip. The signal input relay wiring 43e provided on the lower right side of the mounting area 21 is connected to the second signal input electrode connection terminal 43a in the left semiconductor chip mounting area 21.
[0024]
As shown in FIG. 1, the flexible wiring board 11 includes a film 22 having a narrow strip portion 22 a and a projecting portion 22 b projecting from a predetermined portion on the lower side of the strip portion 22 a. As shown in FIG. 1, FIG. 2 (b) and FIG. 3 (b), power supply terminals 41b of three sets of power supply wirings 41 are provided at predetermined positions on the lower surface of the strip 22a of the film 22, The first signal input terminal 42 b of the three sets of first signal input wirings 42, the second signal input terminal 43 d of the second signal input wiring 43, and the connection terminals 51 to 51 connected to the input wiring 13. 54 is provided. In this case, the flexible wiring board 11 is not provided with connection terminals that are directly connected to the second input electrode connection terminals 43 a in the semiconductor chip mounting region 21 at the center and the left side of the liquid crystal display panel 1.
[0025]
In FIG. 1 and FIG. 2B, the right connection terminals 51 to 54 are connected to connection terminals (not shown) provided on the lower surface of the projecting end portion of the projecting portion 22 b of the film 22, and the strip-shaped portion 22 a of the film 22 and They are connected via a lead wire (not shown) provided on the lower surface of the protrusion 22b. On the other hand, the connection terminals 51 and 52 on the center and the left side correspond to the connection terminals 51 and 52 on the right side through relay holes formed across the connection terminals 51 and 52 on the upper surface of the through hole and film 22 (not shown). Connected to the connection terminal.
[0026]
Next, the lower surface of one end portion of the flexible wiring substrate 11 is joined to the outside of the semiconductor chip mounting region 21 on the upper surface of the protruding portion 2a on the lower side of the lower glass substrate 2 via an anisotropic conductive adhesive (not shown). A part of the state will be described. If it demonstrates with reference to FIG. 3, the connection terminal 51 of the flexible wiring board 11 is connected to the power supply electrode connection terminal 41a in the semiconductor chip mounting area | region 21 via the power supply terminal 41b. The connection terminal 52 of the flexible wiring board 11 is connected to the first signal input electrode connection terminal 42a in the semiconductor chip mounting region 21 via the first signal input terminal 42b, as described with reference to FIG. ing.
[0027]
The connection terminal 53 of the flexible wiring board 11 is connected to the second signal input electrode connection terminal 43a in the semiconductor chip mounting region 21 on the right side via the second signal input terminal 43d, as described with reference to FIG. Connected to the second signal input electrode connection terminal 43a in the semiconductor chip mounting area 21 on the left side via the signal input relay line 43c on the left side, and further to the signal input relay line on the left side. It is connected to the second signal input electrode connection terminal 43a in the semiconductor chip mounting area 21 on the left side via 43e.
[0028]
Thus, in this liquid crystal display device, the power supply electrode connection terminals 41a are gathered and provided on the left side of the lower side in each semiconductor chip mounting region 21 of the liquid crystal display panel 1 in accordance with the specifications of the semiconductor chip 4. Also in the flexible wiring board 11, the connection terminals 51 connected to each set of power supply terminals 41b can be provided in one place. As a result, the second signal input electrode connection terminals 43a in the adjacent semiconductor chip mounting areas 21 of the liquid crystal display panel 1 can be connected to each other via the signal input relay wires 43c, 43e, etc. The flexible wiring board 11 does not need to be provided with a connection terminal that is directly connected to the second input electrode connection terminal 43a in the semiconductor chip mounting region 21 at the center and the left side of the liquid crystal display panel 1, and therefore the flexible wiring board. Accordingly, the amount of wiring provided on the film 11 is reduced, and the width of the strip 22a of the film 22 can be reduced accordingly, and the area occupied by the flexible wiring board 11 can be reduced. As a result, the number of films 22 taken from the base film having a constant area increases, and the cost of the flexible wiring board 11 can be reduced.
[0029]
In this case, in the embodiment of the present invention, the first signal input wiring connected to a part of the signal input electrodes of each semiconductor chip and the remaining signal input are provided in each semiconductor chip mounting region of the display panel. A second signal input wiring connected to the electrode is provided, and a first signal input connection terminal connected to the first signal input terminal is provided on the flexible wiring board, and the signal of each semiconductor chip is directly provided. Since the signal input relay wiring for connecting the corresponding second signal input wirings to each other is provided on the display panel in addition to inputting to the input bump electrodes, the digital signal has a large number of signal input lines. It is applicable to a liquid crystal display panel of the type.
[0030]
Further, in this liquid crystal display device, the signal input relay wires 43b, 43c and 43e are provided on the upper surface of the lower projection 2a of the lower glass substrate 2 of the liquid crystal display panel 1, but these signal input relay wires are provided. Since 43b, 43c, and 43e are provided in the semiconductor chip mounting region 21, the width (frame width) of the lower protrusion 2a of the lower glass substrate 2 can be prevented from increasing.
[0031]
In the above embodiment, the second signal input electrode connection terminal 43a in the adjacent semiconductor chip mounting region 21 of the liquid crystal display panel 1 is connected via the signal input relay wires 43b, 43c, 43e. Although described above, the present invention is not limited to this, and all of the first and second signal input electrode connection terminals 43a in the adjacent semiconductor chip mounting regions 21 of the liquid crystal display panel 1 are connected via the signal input relay wiring. You may make it do.
[0032]
【The invention's effect】
As described above , according to the present invention, the display panel includes a plurality of semiconductor chip mounting regions arranged on one side, a plurality of power supply electrodes, and a plurality of signal input electrodes. In a display device comprising a plurality of semiconductor chips mounted in each semiconductor chip mounting area, and a flexible wiring board disposed along only one side of the display panel and joined to the outside of the semiconductor chip mounting area, Of each semiconductor chip mounting area of the display panel, a power supply wiring, a first signal input wiring, and a second wiring extending in a direction perpendicular to the one side corresponding to the semiconductor chip mounting area located on one end side . of the signal input lines is provided, provided the other said to correspond to the semiconductor chip mounting area wiring power is extended in a direction perpendicular to the one side portion and the first signal input lines, the double In the semiconductor chip mounting area, a second signal input lines which are formed corresponding to the semiconductor chip mounting region of the one end passes through each of the semiconductor chip mounting area, and the other semiconductor chip mounting region Are routed so as to be connected to the second signal input wiring formed corresponding to the first wiring, and the power wiring and the first signal formed on the flexible wiring substrate corresponding to the respective semiconductor chip mounting regions. Since the connection terminal connected to the input wiring and the connection terminal connected to the second signal input wiring formed corresponding to the semiconductor chip mounting region on the one end side are provided, The power supply connection terminals connected to the power supply wiring of the display panel can be provided in one place, and as a result, the amount of wiring provided on the flexible wiring board can be reduced. Becomes possible, it is possible to reduce the area occupied by the flexible printed circuit board accordingly, it is possible to reduce the cost of the flexible wiring board thus.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device according to an embodiment of the present invention.
2A is an enlarged plan view of a predetermined part of the liquid crystal display panel shown in FIG. 1 in an exploded state, and FIG. 2B is a flexible view of a portion corresponding to the region of the liquid crystal display panel shown in FIG. The enlarged plan view of a wiring board.
3A is an enlarged plan view of a semiconductor chip mounting region at the center of the liquid crystal display panel shown in FIG. 2A, and FIG. 3B is a portion corresponding to the region of the liquid crystal display panel shown in FIG. The transmission expansion top view of a flexible wiring board.
4A is a transmission enlarged plan view for showing terminal positions of a semiconductor chip mounted in a semiconductor chip mounting region of the liquid crystal display panel shown in FIG. 3A, and FIG. 4B is a plan view of FIG. The enlarged plan view of the semiconductor chip mounting area | region of the liquid crystal display panel shown in FIG.
FIG. 5 is a plan view showing an example of a conventional liquid crystal display device.
6A is an enlarged plan view of a predetermined part of the liquid crystal display panel shown in FIG. 5 in an exploded state, and FIG. 6B is a flexible view of a portion corresponding to the region of the liquid crystal display panel shown in FIG. The transmission expansion top view of a wiring board.
7A is a transparent enlarged plan view for showing the terminal positions of the semiconductor chip mounted in the semiconductor chip mounting region of the liquid crystal display panel shown in FIG. 6A, and FIG. The enlarged plan view of the semiconductor chip mounting area | region of the liquid crystal display panel shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2 Lower glass substrate 2a Protrusion part 4 Semiconductor chip 11 Flexible wiring board 22 Film 22a Strip-like part 22b Protrusion part 41 Power supply wiring 41a Power supply electrode connection terminal 41b Power supply terminal 42 1st signal input wiring 42a 1st 1 signal input electrode connection terminal 42b first signal input terminal 43 second signal input wiring 43a second signal input electrode connection terminals 43b, 43c, 43e signal input relay wiring 43d second signal input Terminals 51, 52, 53 Connection terminal

Claims (1)

A display panel having a plurality of semiconductor chip mounting areas arranged on one side, a plurality of power supply electrodes and a plurality of signal input electrodes, and a plurality of mounted on each semiconductor chip mounting area of the display panel In a display device comprising a semiconductor chip and a flexible wiring board disposed along only one side of the display panel and bonded to the outside of the semiconductor chip mounting area , each of the semiconductor chip mounting areas of the display panel A power supply wiring, a first signal input wiring, and a second signal input wiring extended in a direction perpendicular to the one side corresponding to the semiconductor chip mounting region located on one end side are provided, and another semiconductor corresponding to the chip mounting area provided extending out the lines and the first signal input wiring power in a direction perpendicular to the one side portion, the plurality of semiconductor chip mounting area, the one The second signal input wiring formed corresponding to the semiconductor chip mounting area on the side passes through each semiconductor chip mounting area and is formed corresponding to the other semiconductor chip mounting area. The flexible wiring board is provided with connection terminals connected to the power supply wiring and the first signal input wiring that are formed corresponding to the respective semiconductor chip mounting regions. And a connection terminal connected to the second signal input wiring formed corresponding to the semiconductor chip mounting region on the one end side.

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