JP5294919B2 - 被加工物の製造方法 - Google Patents
被加工物の製造方法 Download PDFInfo
- Publication number
- JP5294919B2 JP5294919B2 JP2009038814A JP2009038814A JP5294919B2 JP 5294919 B2 JP5294919 B2 JP 5294919B2 JP 2009038814 A JP2009038814 A JP 2009038814A JP 2009038814 A JP2009038814 A JP 2009038814A JP 5294919 B2 JP5294919 B2 JP 5294919B2
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- JP
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- Prior art keywords
- charged particle
- workpiece
- processing
- particle beam
- shape
- Prior art date
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000012545 processing Methods 0.000 claims description 86
- 239000002245 particle Substances 0.000 claims description 77
- 238000012937 correction Methods 0.000 claims description 36
- 230000033001 locomotion Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 description 64
- 238000009499 grossing Methods 0.000 description 42
- 238000009826 distribution Methods 0.000 description 19
- 238000013461 design Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 238000003672 processing method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30472—Controlling the beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3114—Machining
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Drying Of Semiconductors (AREA)
- Electron Beam Exposure (AREA)
- Electron Sources, Ion Sources (AREA)
Description
101 形状修正加工用イオンビーム
102 平滑化加工用イオンビーム
103 ラスター走査軌跡
104 被加工物表面形状
105 設計形状
106 誤差形状
112 プロペラ型シャッター
Claims (6)
- 複数の荷電粒子ビームを被加工物表面に対して同じ相対運動をさせながら同時に照射して加工を行う被加工物の製造方法において、
前記複数の荷電粒子ビームのうちの第1の荷電粒子ビームを用いて、前記相対運動の速度を可変制御することによって被加工物表面の形状修正加工を行い、
前記複数の荷電粒子ビームのうちの第2の荷電粒子ビームを用いて、被加工物表面の単位面積に対する到達粒子数を一定に保つように、前記相対運動の速度変化に応じて前記第2の荷電粒子ビームを可変制御することによって被加工物表面の平滑化加工を行うことを特徴とする被加工物の製造方法。 - 前記第2の荷電粒子ビームの可変制御は、前記第2の荷電粒子ビームの照射時間のパルス制御によって行うことを特徴とする請求項1に記載の被加工物の製造方法。
- 前記第2の荷電粒子ビームの可変制御は、前記第2の荷電粒子ビームの電流量の制御によって行うことを特徴とする請求項1に記載の被加工物の製造方法。
- 前記第2の荷電粒子ビームは20〜500eVの低エネルギーであることを特徴とする請求項1ないし3のいずれかに記載の被加工物の製造方法。
- 前記第1の及び前記第2の荷電粒子ビームの照射位置において、前記相対運動の方向に対して前記第1の荷電粒子ビームの後方に前記第2の荷電粒子ビームのビーム中心があることを特徴とする請求項1ないし3のいずれかに記載の被加工物の製造方法。
- 前記被加工物は、光学素子または光学素子を成形するための金型であることを特徴とする請求項1ないし5のいずれかに記載の被加工物の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009038814A JP5294919B2 (ja) | 2009-02-23 | 2009-02-23 | 被加工物の製造方法 |
US12/706,435 US8431913B2 (en) | 2009-02-23 | 2010-02-16 | Charged particle beam processing method |
EP10153938.5A EP2221849B1 (en) | 2009-02-23 | 2010-02-18 | Charged particle beam processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009038814A JP5294919B2 (ja) | 2009-02-23 | 2009-02-23 | 被加工物の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010194546A JP2010194546A (ja) | 2010-09-09 |
JP2010194546A5 JP2010194546A5 (ja) | 2012-04-12 |
JP5294919B2 true JP5294919B2 (ja) | 2013-09-18 |
Family
ID=42144885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009038814A Expired - Fee Related JP5294919B2 (ja) | 2009-02-23 | 2009-02-23 | 被加工物の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8431913B2 (ja) |
EP (1) | EP2221849B1 (ja) |
JP (1) | JP5294919B2 (ja) |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136315A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | マイクロイオンビ−ム加工方法およびその装置 |
JPH04373125A (ja) | 1991-06-21 | 1992-12-25 | Hitachi Ltd | 集束イオンビーム装置およびそれによる加工方法 |
JPH0817800A (ja) * | 1994-06-29 | 1996-01-19 | Hitachi Ltd | 集束イオンビーム装置およびそれを用いた試料加工方法 |
US7053370B2 (en) * | 2001-10-05 | 2006-05-30 | Canon Kabushiki Kaisha | Information acquisition apparatus, cross section evaluating apparatus, cross section evaluating method, and cross section working apparatus |
WO2004044954A2 (en) * | 2002-11-08 | 2004-05-27 | Epion Corporation | Gcib processing of integrated circuit interconnect structures |
WO2005031838A1 (ja) * | 2003-09-30 | 2005-04-07 | Japan Aviation Electronics Industry Limited | 固体表面の平坦化方法及びその装置 |
DE10351276A1 (de) * | 2003-10-31 | 2005-06-16 | Leo Elektronenmikroskopie Gmbh | Teilchenstrahlgerät |
US20060017016A1 (en) * | 2004-07-01 | 2006-01-26 | Fei Company | Method for the removal of a microscopic sample from a substrate |
US7676904B2 (en) * | 2004-07-30 | 2010-03-16 | Hitachi Global Storage Technologies Netherlands B.V. | Method of manufacturing high sensitivity spin valve designs with ion beam treatment |
US7355188B2 (en) * | 2005-05-24 | 2008-04-08 | Varian Semiconductor Equipment Associates, Inc. | Technique for uniformity tuning in an ion implanter system |
JP5084126B2 (ja) | 2005-10-04 | 2012-11-28 | キヤノン株式会社 | イオンビーム加工方法及び加工装置 |
JP4939840B2 (ja) * | 2006-05-31 | 2012-05-30 | オリンパス株式会社 | ガスクラスターイオンビームによる超精密研磨方法 |
EP2747120B1 (en) * | 2006-10-30 | 2017-12-20 | Japan Aviation Electronics Industry, Limited | Method of smoothing solid surface with gas cluster ion beam |
DE102007058103A1 (de) | 2006-12-04 | 2008-06-05 | Carl Zeiss Smt Ag | Bestrahlung mit hochenergetischen Ionen zur Oberflächenstrukturierung und Behandlung oberflächennaher Bereiche von optischen Elementen |
DE102007026847A1 (de) * | 2007-06-06 | 2008-12-11 | Carl Zeiss Nts Gmbh | Teilchenstrahlgerät und Verfahren zur Anwendung bei einem Teilchenstrahlgerät |
US8269194B2 (en) * | 2007-08-08 | 2012-09-18 | Sii Nanotechnology Inc. | Composite focused ion beam device, and processing observation method and processing method using the same |
WO2009020151A1 (ja) * | 2007-08-08 | 2009-02-12 | Sii Nanotechnology Inc. | 複合集束イオンビーム装置及びそれを用いた加工観察方法、加工方法 |
US8293126B2 (en) * | 2007-09-28 | 2012-10-23 | Tel Epion Inc. | Method and system for multi-pass correction of substrate defects |
US8093563B2 (en) * | 2008-08-29 | 2012-01-10 | Carl Zeiss Nts, Llc | Ion beam stabilization |
JP2010080712A (ja) * | 2008-09-26 | 2010-04-08 | Canon Inc | 情報処理装置、露光装置、デバイス製造方法、情報処理方法およびプログラム |
US7750323B1 (en) * | 2009-05-13 | 2010-07-06 | Advanced Ion Beam Technology, Inc. | Ion implanter and method for implanting a wafer |
-
2009
- 2009-02-23 JP JP2009038814A patent/JP5294919B2/ja not_active Expired - Fee Related
-
2010
- 2010-02-16 US US12/706,435 patent/US8431913B2/en not_active Expired - Fee Related
- 2010-02-18 EP EP10153938.5A patent/EP2221849B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
US8431913B2 (en) | 2013-04-30 |
EP2221849A3 (en) | 2012-06-13 |
EP2221849B1 (en) | 2013-07-24 |
EP2221849A2 (en) | 2010-08-25 |
US20100213393A1 (en) | 2010-08-26 |
JP2010194546A (ja) | 2010-09-09 |
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