JP5275642B2 - Light emitting device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent light from a light-emitting element from being absorbed by a protection element and to dissolve a fault of a conventional structure in a light-emitting device having a structure where the protection element is electrically connected to the light-emitting element for preventing damage that the light-emitting element receives by static electricity shock. <P>SOLUTION: A first cup 7 is formed on an upper face (light take-out face) of a substrate and a housing 1. An LED chip 2 is mounted on a base of the first cup 7. A second cup 8 is formed in a position except for a mounting position of the LED chip 2 on the base of the first cup 7. The protection element 3 protecting the LED chip 2 from static electricity shock is mounted on the base of the second cup 8. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, in an LED package, an element structure in which a protective element (for example, a Zener diode element) is electrically connected to an LED chip is known for the purpose of preventing element damage that the LED chip receives due to electrostatic shock.

  FIG. 1 shows a conventional structure example 1 as a general element structure of an LED package in which a protection element (for example, a Zener diode element) is electrically connected to an LED chip for the purpose of preventing damage to the LED chip due to electrostatic shock. FIG. Referring to FIG. 1, the substrate / housing 101 is made of ceramics, metal, resin, etc., and has power supply to the LED chip 102, connection between the protection element 103 and the LED chip 102, external leads, and electrode wiring for mounting. It has been subjected.

  In addition, a cup-shaped reflection horn 104 is formed inside or on the surface of the substrate / housing 101 so as to surround the mounting portion of the LED chip 102 and the protection element 103 and distribute the light of the LED chip 102. Inside the horn (cup) 104, an LED chip 102 and a protective element (for example, a Zener diode) 103 for protecting the LED chip 102 from electrostatic shock are mounted. The LED chip 102 and the protection element 103 are sealed with a translucent resin 105. Here, in order to convert a part of the light emitted from the LED chip 102 into light having a different wavelength, there is a case where a phosphor is mixed with the translucent resin 105.

  FIG. 2 is a diagram showing the structure of the LED package shown in Patent Document 1 (conventional structure example 2). Referring to FIG. 2, the substrate 201 is made of ceramics, metal, or the like. On the inside or the surface of the substrate 201, power is supplied to the LED chip 202, the protection element 203 and the LED chip 202 are connected, external leads, and mounting. The electrode wiring for is provided.

  An LED chip 202 and a protection element 203 are mounted on the substrate 201. A housing 206 is formed on the surface of the substrate 201 so as to cover the protective element 203. The housing 206 surrounds the mounting portion of the LED chip 202 and has a cup shape to distribute the light of the LED chip 202. A reflection horn 204 is formed, an LED chip 202 is mounted inside the reflection horn (cup) 204, and the LED chip 202 is sealed with a translucent resin 205. Here, in order to convert part of the light emitted from the LED chip 202 into light having a different wavelength, a fluorescent material may be mixed with the light-transmitting resin 205 in some cases.

  FIG. 3 is a diagram showing the structure of the LED package disclosed in Patent Document 2 (conventional structure example 3). Referring to FIG. 3, power supply to the LED chip 302, connection between the protection element 303 and the LED chip 302, external leads, and electrode wiring for mounting are provided on or inside the substrate / housing 301.

  Further, the substrate / housing 301 has a first cup structure 307 for mounting the LED chip 302 formed on the front surface and a second cup structure 308 for mounting the protection element 303 formed on the back surface. The LED chip 302 is mounted on the bottom of the first cup 307, and the protective element 303 is mounted on the bottom of the second cup 308. The inner side of the first cup 307 is sealed with a translucent resin 309, and the inner side of the second cup 308 is sealed with a resin 310. Here, in order to convert a part of the light emitted from the LED chip 302 into light having a different wavelength, there is a case where a fluorescent material is mixed with the translucent resin 309 and used.

  FIG. 4 is a view showing the structure of a product of an LED package already on the market (conventional structure example 4). Referring to FIG. 4, power supply to the LED chip 402, connection between the protection element 403 and the LED chip 402, external leads, and electrode wiring for mounting are provided inside or on the surface of the substrate / housing 401.

  In addition, a first cup 407 on which the LED chip 402 is mounted and a second cup 408 on which the protection element 403 is mounted are provided independently on the upper surface of the substrate / housing 401. In other words, the second cup 408 is provided outside the first cup 407, the LED chip 402 is mounted on the bottom of the first cup 407, and the protective element 403 on the bottom of the second cup 408. Has been implemented. The inner side of the first cup 407 is sealed with a translucent resin 409, and the inner side of the second cup 408 is sealed with a protective resin 410. Here, in order to convert a part of the light emitted from the LED chip 402 into light having different wavelengths, there is a case where a fluorescent material is mixed with the translucent resin 409 and used.

  In the conventional structural example 1 shown in FIG. 1, the LED chip 102 and the protection element 103 are mounted adjacent to the bottom of the reflection horn (cup) 104.

  In such a configuration, a part of the light emitted from the LED chip 102 or a part of the light emitted from the phosphor is absorbed by the protective element 103, and the total amount of light emitted from the LED package is reduced. There is.

  Conventional structure example 2 and conventional structure example 3 are proposed for the purpose of solving the problems of conventional structure example 1.

  That is, in the conventional structure example 2, the protection element 203 is mounted on the external position of the reflection horn (cup) 204 on which the LED chip 202 is mounted, so that the light emitted from the LED chip 202 or the phosphor is protected. To prevent absorption.

  More specifically, in the conventional structural example 2, the protective element (zener diode) 203 is covered with a housing material 206.

  However, in this conventional structure example 2, there is a problem that an external stress (stress) is applied to the protective element 203 in the covering process of the housing material 206 by injection molding or die casting, causing malfunction of the element.

  In addition, there is a problem that in the process of covering the housing material 206 by injection molding or die casting, external stress is applied to the wire for obtaining an electrical connection from the protective element 203 to cause malfunction of the element.

  In addition, after molding the housing resin, there is a problem in that peeling or cracking occurs at the interface between the protective element 203 and the housing 206, resulting in insufficient strength of the housing material 206, dimensional changes, poor conduction, and the like.

  Further, since the housing element for covering the protective element 203 is formed after the protective element 203 is mounted on the substrate (lead frame) 201, there is a problem that a large-scale apparatus is required for the process and a multi-step man-hour is required. It was.

  Also, in the conventional structure example 3, the first cup 307 for mounting the LED chip 302 and the second cup 308 for mounting the protection element 303 are provided on the front and back surfaces of the substrate / housing member 301. By providing them independently, the protective element 303 is mounted outside the first cup 307 on which the LED chip 302 is mounted. As a result, light emitted from the LED chip 302 or the phosphor is protected by the protective element 303. To prevent absorption.

  However, in the conventional structure example 3, by forming the second cup 308 for mounting the protection element 303 on the back surface of the mounting portion of the LED chip 302, the heat dissipation path of the heat generated in the LED chip 302 is cut off and light emission occurs. There has been a problem that the characteristics are deteriorated and the variation in the heat radiation characteristics and the emission characteristics is increased due to the variation in the injection amount of the protective resin 310.

  Further, in the conventional structural example 3, since it is necessary to mount elements on both the front and back surfaces of the substrate / housing member 301, the LED chip 302 is first mounted, then the substrate / housing member 301 is inverted, and then the protective element is mounted. There is a problem that a complicated and sophisticated process and equipment for mounting the LED chip 302 and the protection element 303 at the same time on both sides are required.

  Furthermore, the resin injection / curing for element protection needs to be performed individually on each side, and there is a problem that a multi-step process is required as well.

  Furthermore, a step is generated by the protective material (for example, resin) 310 that protrudes from the second cup 308 for the protective element 303, or when the protective resin 310 is mixed into the bonding material (solder or the like), the product (LED package) ) Caused a mounting failure.

  Conventional structure example 4 is also intended to solve the problem of conventional structure example 1.

  Conventional Structure Example 4 is the same surface as the surface on which the first cup 407 on which the LED chip 402 is mounted on the substrate / housing member 401 and the first cup 407 on which the LED chip 402 is mounted. The second cup 408 for mounting the protective element 403 is provided outside the LED, and the LED chip 402 and the protective element 403 are mounted apart from each other. Similarly, the light emitted from the LED chip 402 or the phosphor is prevented from being absorbed by the protective element 403.

  However, in the conventional structure example 4, the Au wiring wire and the protection due to injection variation (insufficient injection amount, protrusion, scooping up, etc.) of the protective material (for example, resin) 410 injected into the second cup 408 for the protective element 403. Sorting failure due to atmospheric exposure of elements, changes in external dimensions, probe contact failure during electrical characteristics inspection, or interference between the suction nozzle and protective resin during mounting of LED package products causes the suction nozzle to become contaminated with resin and cause mounting failure A great number of problems occur.

In addition, when an external force from the tip of the mounting nozzle is applied to the substrate / housing 401 when mounting the LED package product, damage such as chipping or cracking occurs due to insufficient strength near the second cup 408 for the protective element 403. There is also a problem.
JP 2007-227882 A JP 2001-036140 A

  The present invention provides a light emitting device (for example, an LED device) having a structure in which a protective element is electrically connected to a light emitting element (for example, an LED chip) for the purpose of preventing damage to the light emitting element (for example, an LED chip) due to electrostatic shock. An object of the present invention is to provide a light-emitting device that can prevent light from a light-emitting element (for example, an LED chip) from being absorbed by a protective element and that can solve the problems of the conventional structure, and a method for manufacturing the same. Yes.

In order to achieve the above object, the invention described in claim 1 is directed to a light emitting device having a structure in which a protective element is electrically connected to a light emitting element for the purpose of preventing damage to the light emitting element due to electrostatic shock. The substrate is provided with a first cup on which at least one light emitting element is mounted, and a second cup deeper than a height of the protection element on which at least one protection element is mounted on the bottom surface of the first cup. At least one cup is provided , and the second cup is characterized in that a light-reflective sealing material that conceals the protection element is filled as a protection element sealing material .

  The invention according to claim 3 is the method for manufacturing the light emitting device according to claim 1, wherein the first cup and the second cup are formed on the substrate by using silicon anisotropic etching. It is characterized by that.

  According to the first and second aspects of the present invention, the structure in which the protective element is electrically connected to the light emitting element (for example, the LED chip) for the purpose of preventing the light emitting element (for example, the LED chip) from being damaged by electrostatic shock. In a light-emitting device (for example, an LED device), a substrate of the light-emitting device (for example, an LED device) is provided with a first cup (concave portion) on which a light-emitting element (for example, an LED chip) is mounted. Since at least one second cup (concave portion) on which at least one protection element is mounted is provided on the bottom surface of the LED, light from the light emitting element (for example, LED chip) is prevented from being absorbed by the protection element. In addition, it is possible to eliminate the problems of the conventional structure.

  Specifically, in the present invention, a light-reflective sealing material that conceals the protective element is formed as a protective element sealing material on the second cup on which the protective element is mounted from the protective element. It is possible to prevent light emitted from the phosphor from being absorbed by the protective element and dimming.

  In the present invention, the second cup for mounting the protection element is formed on the bottom surface of the first cup, and the protection element is mounted on the bottom surface of the second cup. Sometimes it is possible to prevent interference between the suction nozzle and the protective element and between the suction nozzle and the protective element sealing material resin.

  In the present invention, a package structure is formed in which a second cup for mounting a protective element is formed on the bottom surface of the first cup, and a protective element and a protective element sealing material are formed in the second cup. Even if the wiring wire is exposed or the resin overflows from the cup due to variations in the filling amount of the protective element sealing material, the translucent sealing material is overlaid and filled in the first cup. Less susceptible to variation. Specifically, problems such as exposure of the Au wiring wires and protective elements to the atmosphere, overflowing resin, sorting failures due to changes in external dimensions, and probe contact failures during electrical characteristic inspections basically do not occur. In addition, even if the protective element sealing material overflows, there is a low possibility of affecting the light emission characteristics. In other words, there is an advantage that the control range of the filling amount of the protective element sealing material can be set widely.

  Moreover, in this invention, compared with the case where the 2nd cup for mounting a protective element is formed in the bottom face of a 1st cup, and the 2nd cup is formed independently outside the 1st cup. Thus, the device size (package size) can be reduced.

According to a third aspect of the present invention, in the method for manufacturing a light emitting device according to the first aspect, silicon is used for the substrate, and the first cup (concave portion) and the second cup ( Since the concave portion is formed on the substrate using silicon anisotropic etching, the first cup and the second cup can be easily (in a simple process), and complicated processes, etc. A light emitting device can be manufactured without necessity.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. In the following description, it is assumed that the light emitting device is an LED device (LED package) and the light emitting element is an LED chip.

  FIG. 5 is a diagram showing a first configuration example of the light emitting device according to the present invention. Referring to FIG. 5, in the light emitting device (LED device) of the first configuration example, a first cup (concave portion) 7 is formed on the upper surface (light extraction surface) of the substrate / housing 1. The LED chip 2 is mounted on the bottom surface of 7. A second cup (recess) 8 is formed at a position other than the mounting position of the LED chip 2 on the bottom surface of the first cup 7, and the LED chip 2 is electrostatically impacted on the bottom surface of the second cup 8. The protection element 3 for protecting from is mounted.

  In the second cup 8, a light-reflective sealing material 10 that conceals the protective element 3 and reflects light from the LED chip 2 and the phosphor is formed (filled and sealed) from the protective element 3. In the first cup 7, a light-transmitting sealing material or a light-transmitting seal containing a phosphor is formed after the light-reflecting sealing material 10 in the second cup 8 is formed. A stopper 9 is formed (filled and sealed).

Here, the substrate / housing 1 is made of a material such as ceramics such as Al ₂ O _{3 and} AlN, metals such as Cu, Al, Fe, Ni, Ag, and brass, and resins such as Si and various engineering plastics. Although not shown, the substrate / housing 1 is patterned on the inside or the surface of the power supply to the LED chip 2, connection between the protection element 3 and the LED chip 2, external leads, and electrode wiring for mounting (joining). ing. Here, examples of the material for the electrode wiring include Ni, Au, Cr, Cu, Ag, and alloys containing these.

  The inner surface of the first cup 7 is preferably subjected to a surface treatment for reflecting light from the LED chip 2 and the phosphor. Here, for the surface treatment of the inner surface of the first cup 7, Al, Ag, Au, an alloy containing these, or the like is used. Instead of the surface treatment of the inner surface of the first cup 7, or together with the surface treatment of the inner surface of the first cup 7, a material having a high light reflectance may be used for the constituent material itself of the substrate / housing 1. .

  Further, as a method for bonding (fixing) the LED chip 2 and the substrate 1, eutectic bonding, Ag paste bonding, Au bump bonding, or the like can be generally used. In addition to the above, the bonding (connection) method for feeding the LED chip 2 includes connection by wire bonding.

  Further, as the protection element 3, a Zener diode, a diode connection of a transistor, a MOSFET, a composite element thereof, an IC, or the like is used. Here, the protection element 3 is connected in parallel to the LED chip 2 in the reverse direction.

The light-reflective sealing material 10 that seals the second cup 8 is made of a resin (for example, silicon or epoxy resin) containing white pigment (for example, TiOs _{2 or} Al ₂ O ₃ ), white ceramic particles, or the like. It is done.

  Further, silicon, an epoxy resin, low melting point glass, or the like is used for the translucent sealing material 9 that seals the first cup 7.

  Further, when the translucent sealing material 9 includes a phosphor, a YAG phosphor, an orthosilicate phosphor, a nitride phosphor or the like is used as the phosphor.

  Comparison of the light output of the LED package between the first configuration example of the present invention and the conventional structure example 1, and the manufacture of the LED package between the first configuration example of the present invention and the conventional structure example 4 Table 1 shows the result of comparison of the number of defects.

  From Table 1, in the 1st structural example of this invention, compared with the former, the optical output was high and the tendency for the number of manufacturing defects to be small was seen.

  FIG. 6 is a diagram showing a second configuration example of the light emitting device according to the present invention. Referring to FIG. 6, the light emitting device (LED device) of the second configuration example is basically the same as the first configuration example, but in the second configuration example, the first cup A plurality of LED chips 2 (two LED chips 2 in the example of FIG. 6) are mounted on the bottom surface of 7. Thus, the LED chip 2 mounted on the bottom surface of the first cup 7 may be plural.

  FIG. 7 is a diagram showing a third configuration example of the light-emitting device according to the present invention. Referring to FIG. 7, the light emitting device (LED device) of the third configuration example is basically the same as that of the first configuration example, but in the third configuration example, the second cup A plurality of protection elements 3 (two protection elements 3 in the example of FIG. 7) are mounted on the bottom surface of FIG. Thus, the protection element 3 mounted on the bottom surface of the second cup 8 may be plural.

  By mounting the plurality of protection elements 3 on the bottom surface of the second cup 8, the number of man-hours for injecting the light reflective sealing material 10 can be reduced.

  FIG. 8 is a diagram showing a fourth configuration example of the light-emitting device according to the present invention. Referring to FIG. 8, in the light emitting device (LED device) of the fourth configuration example, a plurality of second cups 8 (two second cups 8 in the example of FIG. 8) on the bottom surface of the first cup 7. Is formed. In the example of FIG. 8, the protection element 3 is mounted on the bottom surface of each of the two second cups 8, and each is sealed with a light reflective sealing material 10. In the example of FIG. 8, one protective element 3 is mounted on the bottom surface of each of the two second cups 8, but a plurality of protective elements 3 are mounted on the bottom surfaces of the two second cups 8. May be implemented.

  As described above, when the plurality of second cups 8 are formed on the bottom surface of the first cup 7, the degree of freedom in layout is widened, the mounting density can be improved, and the output and cost can be reduced. .

  As described above, the light emitting device of the present invention has a structure in which the protective element is electrically connected to the light emitting element (for example, LED chip) for the purpose of preventing the light emitting element (for example, LED chip) from being damaged by electrostatic shock. In (for example, an LED device), a substrate of the light emitting device (for example, an LED device) is provided with a first cup (concave portion) on which at least one light emitting element (for example, an LED chip) is mounted. At least one second cup (recessed portion) on which at least one protection element is mounted is provided on the bottom surface of the slab.

  Here, the second cup is preferably filled with a light-reflective sealing material that conceals the protection element as the protection element sealing material.

  Further, in the present invention, a light-reflective sealing material that conceals the protection element is formed as a protection element sealing material on the second cup on which the protection element is mounted, so that the LED chip or the phosphor is formed. It is possible to prevent the light emitted from the light from being absorbed by the protective element and dimming.

  In the present invention, the second cup for mounting the protective element on the bottom surface of the first cup is formed, and the protective element is mounted on the bottom surface of the second cup, whereby the light emitting device (LED It is possible to prevent interference between the suction nozzle and the protective element and between the suction nozzle and the protective element sealing material resin when the apparatus is mounted.

  In the present invention, a package structure is formed in which a second cup for mounting a protective element is formed on the bottom surface of the first cup, and a protective element and a protective element sealing material are formed in the second cup. Even if the wiring wire is exposed or the resin overflows from the cup due to variations in the filling amount of the protective element sealing material, the translucent sealing material is overlaid and filled in the first cup. Less susceptible to variation. Specifically, problems such as exposure of the Au wiring wires and protective elements to the atmosphere, overflowing resin, sorting failures due to changes in external dimensions, and probe contact failures during electrical characteristic inspections basically do not occur. In addition, even if the protective element sealing material overflows, there is a low possibility of affecting the light emission characteristics. In other words, there is an advantage that the control range of the filling amount of the protective element sealing material can be set widely.

  Moreover, in this invention, compared with the case where the 2nd cup for mounting a protective element is formed in the bottom face of a 1st cup, and the 2nd cup is formed independently outside the 1st cup. Thus, the device size (package size) can be reduced.

  Next, as a manufacturing example of the package portion of the light emitting device (LED device, LED package) of the present invention, a manufacturing process example of a silicon processed substrate using silicon anisotropic etching technology will be specifically described with reference to FIG. To do.

  First, as shown in FIG. 9A, a thermal silicon oxide film 32 having a thickness of 500 nm is formed on the surface of the mirror silicon wafer 1 using a diffusion furnace.

  Next, a resist pattern is formed on one surface of the wafer 1 by photolithography, and the thermal silicon oxide film 32 is removed by etching with buffered hydrofluoric acid (BHF), whereby a silicon oxide film as shown in FIG. 32 patterns are formed.

  Using the patterned silicon oxide film 32 as a mask, a concave portion (first cup) 7 as shown in FIG. 9C is formed by crystal anisotropic etching using, for example, a 20% TMAH solution.

  Next, all the thermally oxidized silicon film 32 is once removed with a BHF solution, and a 500 nm thick thermally oxidized silicon film 34 is again formed on the surface of the silicon substrate 1 using a diffusion furnace as shown in FIG. 9D. To do.

  Next, a resist pattern for processing a recess is formed on the bottom surface of the first cup 7 by photolithography. Resist spray coating can be used as a suitable means for resist patterning into a three-dimensional shape.

  After resist patterning, the thermal silicon oxide film 34 is removed by etching with a BHF solution to form a pattern of the silicon oxide film 34 as shown in FIG.

  Crystal anisotropic etching using, for example, a 20% TMAH solution is performed using the patterned silicon oxide film 34 as a mask, and a recess (second cup) is formed on the bottom surface of the first cup 7 as shown in FIG. 8 is formed.

  By removing all the thermally oxidized silicon film 34 once with the BHF solution, the silicon processed substrate 1 as shown in FIG. 9G can be manufactured.

  Next, a light reflection / electrode layer is formed on the obtained silicon processed substrate 1.

  The light reflection / electrode layer is formed as follows. That is, first, a thermal silicon oxide film having a thickness of 500 nm is formed on the surface of the silicon processed substrate 1 using a diffusion furnace, and a resist pattern is formed by a photolithography technique. Then, a Ti or Ti—Ni alloy film is formed as a thermal silicon oxide film as an adhesion layer, a Ni or Pt or Pd film is formed as a barrier metal layer, and an Ag or Al or Ag alloy film is continuously formed as a reflective layer. The film is formed. Next, the light reflection / electrode layer 36 as shown in FIG. 9H can be formed by lifting off the three-layered metal film thus formed.

  The light reflection / electrode layer 36 also functions as a bonding pattern for mounting.

  In this manner, the light reflecting / electrode layer can be formed on the silicon processed substrate 1 (the silicon processed substrate 1 including the first cup 7 and the second cup 8).

  It is also possible to pattern the metal film by wet etching using an acid / alkali solution or a dry etching process such as RIE.

  It is also possible to form an electrode pattern by forming a through hole perpendicular to the substrate 1 by laser processing or dry etching process, and filling the through hole with a conductive material such as metal by a technique such as metal plating or CVD. It is.

  In this way, by using silicon for the substrate 1 and forming the first cup 7 and the second cup 8 on the substrate 1 using silicon anisotropic etching, the first cup 7 and The second cup 8 can be easily manufactured (by a simple process).

  In the above description, the first, second, third, and fourth configuration examples are given. However, the light emitting device of the present invention is for the purpose of preventing damage to the light emitting element (for example, LED chip) due to electrostatic shock. In the light emitting device (for example, LED device) having a structure in which the protective element is electrically connected to the light emitting element (for example, LED chip), the substrate of the light emitting device (for example, LED device) has at least one light emitting element (for example, LED). A first cup on which a chip) is mounted, and at least one second cup on which at least one protective element is mounted is provided on the bottom surface of the first cup. The present invention is not limited to the above-described first, second, third, and fourth configuration examples, and various modifications are possible.

  In the above description, the light emitting device is an LED device (LED package) and the light emitting element is an LED chip. However, the light emitting element is not limited to the LED chip, and may be a semiconductor laser element or the like. The light emitting device is not limited to an LED device (LED package), but may be a semiconductor laser device or the like.

The present invention can be used for LED lamps, office / home lighting, store lighting, public outdoor lighting, automobile / train / aircraft lighting, and light sources for information devices such as TVs / mobile phones.

It is a figure which shows the conventional structural example 1 of the LED package which electrically connected the protection element with the LED chip. It is a figure which shows the conventional structural example 2 of the LED package which electrically connected the protection element with the LED chip. It is a figure which shows the conventional structural example 3 of the LED package which electrically connected the protection element with the LED chip. It is a figure which shows the conventional structural example 4 of the LED package which electrically connected the protection element with the LED chip. It is a figure which shows the 1st structural example of the light-emitting device which concerns on this invention. It is a figure which shows the 2nd structural example of the light-emitting device which concerns on this invention. It is a figure which shows the 3rd structural example of the light-emitting device which concerns on this invention. It is a figure which shows the 4th structural example of the light-emitting device which concerns on this invention. It is a figure which shows the manufacture example of the package part of the light-emitting device (LED device, LED package) of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate housing 2 LED chip 3 Protection element 7 1st cup 8 2nd cup 9 Translucent sealing material 10 Light reflecting sealing material

Claims (2)

In a light emitting device having a structure in which a protective element is electrically connected to a light emitting element for the purpose of preventing damage to the light emitting element due to electrostatic shock, a first light emitting device on which at least one light emitting element is mounted is mounted on the substrate of the light emitting device. And at least one second cup deeper than the height of the protective element on which at least one protective element is mounted is provided on the bottom surface of the first cup , and the second cup is A light-emitting device , wherein a light-reflective sealing material that conceals the protective element is filled as a protective element sealing material .   The method for manufacturing a light emitting device according to claim 1, wherein the first cup and the second cup are formed on the substrate by using silicon anisotropic etching. .

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