JP5210617B2 - Resin sealing device provided with resin transport mechanism, and resin transport method in resin seal device - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device that seals a semiconductor chip or the like with a resin.

  In the resin sealing device, there is a case where high-quality resin sealing is hindered due to deposition of a resin or the like, which is a sealing material, on the mold surface as an adhering substance. Therefore, it is necessary to clean the mold surface in order to remove deposits on the mold surface regularly or irregularly. Various cleaning methods are conceivable. For example, in the resin sealing device described in Patent Document 1, cleaning is performed using a resin dedicated for cleaning instead of a resin used for normal resin sealing. Here, the cleaning resin is transported to the mold by a transport mechanism (loader) at the required timing, and then the mold is pressed, and the deposit on the mold surface is reattached to the cleaning resin side. Cleaning is performed by the technique of making it occur. Further, the conveyance of the cleaning resin to the mold relies on a conveyance mechanism that conveys the normal sealing resin to the mold (that is, the sealing resin and the cleaning resin are separated by one conveyance mechanism). They are transported as necessary.)

Japanese Patent Laid-Open No. 10-172997

  As in the resin sealing device described in Patent Document 1, when different types of resins are appropriately transferred by one transport mechanism and transported, there is a problem that resin mixing occurs. That is, there is a problem that a small amount of resin that remains attached to the transport mechanism when a certain type of resin is transported is peeled off when another type of resin is transported and supplied into the mold. Specifically, for example, in the resin sealing operation after the cleaning operation, the residue of the cleaning resin adhering to the transport mechanism is mixed into the original sealing resin and supplied into the mold. This is the case. If such resin mixing occurs, the resin sealing quality will inevitably deteriorate.

  The applicant has already proposed an invention for solving such problems (Japanese Patent Application No. 2007-191956). Here, instead of directly holding the resin by the transport mechanism, a dedicated resin holder (resin holder that can be attached to and detached from the transport mechanism) is prepared for each type of resin, and transported through the resin holder. In this way (when the resin type is changed, the entire resin holder is replaced) to prevent resin contamination.

  However, since a certain amount of time is required for supplying the resin to the resin holder (supplying the resin to the empty resin holder), the supply of the resin to the resin holder may limit the transfer capability of the transfer mechanism. That is, the supply (accommodation) of the resin to the empty resin holder is performed by once removing the resin holder from the conveyance mechanism, supplying the resin to the empty resin holder by the resin supply mechanism, and then again supplying the resin to the conveyance mechanism. This is because it is performed according to the procedure of mounting, and it takes a certain amount of time from when the transport mechanism brings back the empty resin holder until the next transport starts. Although it is theoretically possible to supply the resin directly to the resin holder held by the transport mechanism, the degree of design inconvenience is large.

  The present invention has been made to solve this problem. After preparing a plurality of resin holders in advance, an empty resin holder and a resin holder that already contains resin are provided each time it is transported. By exchanging, the transport mechanism improves the transport capacity by shortening the time from when the empty resin holder is brought back to the next transport, and provides a resin sealing device with excellent cycle time as a whole It is.

  The present invention is a resin sealing device provided with a transport mechanism for transporting resin to a mold, comprising a plurality of resin holders capable of containing the resin and detachable / replaceable in the transport mechanism, The transport mechanism can transport the resin contained in the resin holder via the resin holder attached to the transport mechanism, and the transport mechanism transports the resin to the mold. The above-described problems are solved by attaching and detaching and replacing the empty resin holder and the accommodated resin holder for each cycle.

  That is, with a plurality of resin holders prepared in advance, a resin holder that is not mounted on the transport mechanism (that is, a resin holder other than the resin holder that is currently traveling and transports resin to the mold) The necessary resin is supplied (accommodated) until the next conveyance. Furthermore, when the transport mechanism brings back an empty resin holder (resin holder after charging the mold), the resin is supplied (accommodated) by removing the empty resin holder and supplying the resin to the empty resin holder, It is possible to replace the “resin holder itself” with a separate resin holder in which the resin is accommodated in advance (without being attached to the transport mechanism again), and to perform the next transport immediately.

  By adopting such a configuration, it is not necessary to wait for the time during which the resin is supplied (accommodated) to the resin holder brought back, and the transport capability of the transport mechanism can be improved.

  In addition, as long as it has the conveyance mechanism which employ | adopts the form of conveying resin through a resin holder, this invention can exhibit the effect of "the improvement of the conveyance capability of a conveyance mechanism", and is not necessarily the kind of resin to convey. There is no need to have more than one.

  Further, if a plurality of types of the resin are prepared according to the purpose of use and a plurality of the resin holders are prepared for each of the plurality of types of resins, mixing of a plurality of types of resins can be performed at the same time as improving the conveyance capability of the conveyance mechanism. In the case where different types of resin are transported by one transport mechanism, it is possible to effectively prevent the resin from being mixed.

  In another aspect, the present invention relates to a resin transport method in a resin sealing device having a transport mechanism for transporting resin to a mold, and the transport mechanism transports the resin to the mold. A step of transporting the resin held via the resin holder capable of containing the resin to the mold, a step of charging the resin held against the mold, and A method for transporting a resin in a resin sealing device, comprising: bringing back an empty resin holder; and a step of attaching and detaching and replacing the empty resin holder and a stored resin holder in which the resin is stored It can also be understood as

  In these cases, the resin is accommodated in the empty resin holder until the next conveyance.

  By applying the present invention, the transfer capability of the resin transfer mechanism can be improved, and the cycle time of the entire resin sealing device is improved.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram of a resin sealing device 100 which is an example of an embodiment of the present invention. FIG. 2 is a side sectional view of the loader 130. FIG. 3 is a cross-sectional view taken along line IV-IV in FIG. FIG. 4 is an enlarged front view of the chuck portion. FIG. 5 thru | or FIG. 13 is the figure which showed the process of the resin holder attachment / detachment / exchange of a chuck | zipper part.

  For convenience of explanation, the left and right direction in FIG. 1 is described as the X direction, the up and down direction is defined as the Y direction, and the direction perpendicular to both the X direction and the Y direction is defined as the Z direction (height direction).

<Configuration of resin sealing device>
The resin sealing device 100 includes a substrate supply unit 102 to which a product to be molded before resin sealing is supplied and a molded product in which a molded product after resin sealing is stored on a base portion 101 that is a base of the device. The product storage unit 104 and two molds 106 arranged side by side between the substrate supply unit 102 and the molded product storage unit 104 are arranged linearly. In this embodiment, the substrate supply unit 102 supplies a molded product (dummy for cleaning) used for cleaning according to an instruction in addition to supplying a molded product (lead frame or substrate) used for normal resin sealing. Frame, dummy substrate) can be supplied. Further, in the vicinity of the substrate supply unit 102, a swivel table 103 that turns the molding product taken out from the substrate supply unit 102 to adjust the orientation, and after the orientation is adjusted by the turning table 103, the molding product is brought to a predetermined temperature. A pre-heater unit 105 that heats and maintains the temperature is disposed. Further, along with the turning table 103 and the preheater unit 105, a resin tablet supply unit (resin supply unit) 109 to which a resin tablet as a sealing material is supplied is arranged. In the resin tablet supply unit 109, the resin tablet is accommodated in the resin holder 170. The resin tablet supply unit 109 is provided with a lifter 109A (not shown in FIG. 1) so that the resin holder 170 can be lifted and transferred to the loader 130. In the present embodiment, the resin-supplied tablet supply unit 109 can supply a cleaning resin used for mold cleaning in addition to a resin used for normal resin sealing. The cleaning resin is supplied to the resin holder 170 dedicated to the cleaning resin.

  On the other hand, in the vicinity of the molded product storage unit 104, a cooling stage (cooling unit) 107 in which the molded product after resin sealing is cooled, and an unnecessary part (cull unit) of the molded product cooled by the cooling stage 107 are taken out. A gate break portion 108 is disposed.

  Further, an X-direction guide 120 is installed on the base portion 101 in parallel with the arrangement of the substrate supply unit 102, the molded product storage unit 104, and the mold 106. On this X direction guide 120, the loader 130 and the unloader 140 are arrange | positioned so that it can move freely along the said guide. These loader 130 and unloader 140 function as a transport mechanism for a plurality of molds 106 arranged. That is, the loader 130 carries the molded product before resin sealing supplied from the substrate supply unit 102 and the resin tablet supplied from the resin tablet supply unit 109 into the mold 106 at a predetermined timing. On the other hand, the unloader 140 has a function of carrying out a molded product resin-sealed by each mold 106 and storing it in the molded product storage unit 104.

  In the present embodiment, two molds 106 are arranged as described above. However, the number of molds 106 is not necessarily limited to two, and one or three or more molds may be arranged. Good. Furthermore, the substrate supply unit 102 and the molded product storage unit 104 may be arranged on the same side, and the loader 130 and the unloader 140 may be realized by a single transport mechanism.

  Next, the loader 130 as a transport mechanism will be described in detail with reference to FIGS. Although the loader 130 will be described here, a substantially similar mechanism is also adopted for the unloader 140.

  The loader 130 is disposed on the two X-direction guides 120 provided on the base unit 101. That is, the loader 130 can freely move on the base portion 101 along the X direction guide 120. The loader main body (main body portion) 131 of the loader 130 is configured in a substantially L shape when viewed from the side surface (X direction). A slide rail (guide portion) 134 is provided on the loader main body 131 along the long side portion (left and right direction in FIG. 2) of the L shape. Two slide bodies 133 are fitted to the slide rail 134 with respect to one slide rail 134. Further, the two slide bodies 133 are connected and fixed to the arm portion 132. That is, the arm part 132 accommodated in the loader main body 131 is slidably supported by the loader main body 131 via the slide rail 134 and the slide body 133. In the present embodiment, the arm portion 132 is configured to be slidable with respect to the loader body 131, but sliding itself is not an essential component of the present invention. Further, four support rollers 135 are provided for one slide rail 134 so as to abut on the slide rail 134 closer to the mold 106 (that is, the slide tip side) than the connecting position of the slide body 133 in the arm portion 132. It has been. Further, a chuck portion 136 is suspended from the support roller 135 via a vertical mechanism 137 on the mold 106 side (that is, on the slide tip side). 2 and 3, the chuck portion 136 is shown in a simplified manner, and the structure thereof will be described in detail with reference to FIG.

<Configuration of chuck part>
The chuck portion 136 is suspended from the arm portion 132 via the vertical mechanism 137, and can be moved up and down appropriately (in the Z direction) by operating the vertical mechanism 137. The chuck portion 136 includes a chuck portion main body 150 connected to the vertical mechanism 137, a slide plate 152 slidably connected to the lower surface of the chuck portion main body 150 via a first slide guide 151, and the slide plate. The claw plate 154 is slidably coupled to the claw plate 154 via the second slide guide 153, and the chuck claw 155 is fixed to the claw plate 154. Note that both the first slide guide 151 and the second slide guide 153 are slidable in the X direction (left-right direction in FIG. 4). The slide plate 152, the second slide guide 153, the claw plate 154, and the chuck claw 155 constitute one chuck mechanism 139. A total of two chuck mechanisms 139 having different positions in the X direction are arranged on the chuck body 150 (first and second chuck mechanisms 139A and 139B). As a result, the two chuck mechanisms (first and second chuck mechanisms) 139 slide relative to each other along the first slide guide 151 to widen or narrow the distance between them (contact / Separation) is possible. That is, the first slide guide 151 functions as a “horizontal movement mechanism” capable of relatively moving the first and second chuck mechanisms 139A and 139B in the horizontal direction. The slide plate 152 is provided with a holder hook portion 156. The holder hook portion 156 is provided on the “adjacent chuck mechanism side” of the slide plate 152. That is, the slide plate 152 provided in the first chuck mechanism 139A is provided on the second chuck mechanism 139B side, while the slide plate 152 provided in the second chuck mechanism 139B is provided on the first chuck mechanism side 139A side. ing.

  Further, a clamp actuator 157 is installed and fixed on the upper surface of the chuck portion main body 150, and a rod 157A of the clamp actuator 157 is disposed so as to protrude from the lower surface side of the chuck portion main body 150.

  Further, the resin holder 170 capable of accommodating the resin tablets 180 is provided with a plurality of resin tablet accommodating portions 170A, and one or more resin tablets 180 can be accommodated in each resin tablet accommodating portion 170A. It is configured (see also FIG. 11B). In addition, the resin holder 170 is formed with one overhanging portion 170B in the front and rear (Y direction).

  5 to 13, the vertical mechanism 137 is omitted for convenience.

<Operation of the entire resin sealing device>
Next, the operation of the resin sealing device 100 will be described.

  First, a single molded product before resin sealing is conveyed from the substrate supply unit 102 to the turning table 103. This conveyance is performed by a conveyance hand (not shown). When one molded product is conveyed to the turning table 103, the turning table 103 rotates. Thereafter, the other molded product is conveyed to the turning table 103, and a total of two molded products are arranged on the turning table 103. Thereafter, the two molded articles are simultaneously conveyed to the preheater 105 by the loader 130. Here, after the arm portion 132 of the loader 130 slides in the Y direction, the chuck claw 155 is opened by the slide of the claw plate 154 in the chuck portion 136, and the molded product is clamped, held, and conveyed. In the preheater unit 105, the product to be molded is heated to a predetermined temperature and kept warm. Two preheaters 105 are provided in the present embodiment, and the preheater 105 is conveyed to one of them (the vacant side).

  On the other hand, in the resin tablet supply unit 109, the resin tablet 180 as a sealing material is supplied to the storage unit 170 </ b> A of the resin holder 170. Thereafter, the molded product kept warm by the preheater unit 105 is held by the chuck claws 155. Further, the resin holder 170 in which the resin tablet 180 is accommodated is lifted by the lifter 109 </ b> A and held by the chuck portion 136. This holding is performed by the two chuck mechanisms 139 (139A, 139B) sliding in the X direction by the first slide guide 151 (details will be described later). In other words, the loader 130 simultaneously conveys the molded product and the resin holder 170 containing the resin tablet 180 to the mold 106.

  The molded product and the resin tablet 180 conveyed by the loader 130 are put into the mold 106 at a predetermined timing. Thereafter, the loader 130 retreats from the mold 106 and moves to the resin tablet supply unit 109 side with an empty resin holder (empty resin holder) 170 attached.

  When the resin sealing in the mold 106 is completed, the work after the resin sealing is transferred to the cooling stage 107 by the unloader 140 in the future. In the cooling stage 107, the workpiece after resin sealing is cooled to a predetermined temperature. Thereafter, the work is again transferred from the cooling stage 107 to the gate break unit 108 by the unloader 140. Here, an unnecessary portion of the work, that is, a resin corresponding to the cull portion is removed by gate break. Unnecessary parts are discarded, and the remaining work is conveyed to the product storage unit 104 by the unloader 140.

  Resin sealing is continuously performed by repeating such a procedure.

  In the resin sealing device 100, each time the resin tablet 180 is transported by the loader 130 (for each cycle in which the loader 130 transports the resin tablet 180 to the mold 106), the resin holder 170 is attached / detached / replaced. That is, a resin holder (empty resin holder) 170 that has become “empty” by inserting the resin tablet 180 into the mold 106 is temporarily removed, and the resin tablet 180 is supplied (accommodated) to the empty resin holder 170. Instead, replacement of the holder itself with a resin holder (accommodated resin holder) in which the resin tablet 180 is accommodated in advance is performed each time it is transported. By adopting such a configuration, it becomes possible to enter the next conveyance without waiting for the time during which the resin is supplied (accommodated) to the resin holder brought back, and the conveyance capacity of the loader 130 is improved. Is possible.

<Removal / replacement of resin holder>
The attachment / detachment / exchange operation of the resin holder 170 will be described in detail with reference to FIGS. Here, only the chuck portion 136 which is a part of the loader 130 is taken out and described.

  The resin holder 170-1 currently held (that is, the empty resin holder 170 brought back by the loader 130) is removed as follows.

  First, as shown in FIG. 5, the rod 157A of the clamp actuator 157 is raised and the pressing (fixing) to the resin holder 170-1 is released. Subsequently, one of the two lifters 109A (the lifter 109A-1 on the side where the resin holder 170 is not placed) rises and comes into contact with the bottom surface of the empty resin holder 170-1. Further, the resin holder 170-1 is lifted to such an extent that the contact between the projecting portion 170B of the empty resin holder 170-1 and the holder hook portion 156 is released (see FIG. 6). In this state, the chuck mechanism 139 slides outward (that is, the slide plate 152 slides along the first slide guide 151 and the two chuck mechanisms 139 are separated). As a result, the holder hook portion 156 retracts from the position below the overhang portion 170B of the resin holder 170-1 (see FIG. 7). After that, as shown in FIG. 8, the rod 157A of the clamp actuator 157 protrudes again to push down the resin holder 170-1, and the lifter 109A-1 is lowered, so that the resin holder 170-1 is moved to the chuck portion 136, that is, It will be removed from the loader 130 (see FIG. 9).

  At this stage, the resin tablet 170 to be transported next time is already accommodated in the resin holder 170-2 placed on the other lifter 109A-2.

  Next, the mounting of the resin holder (accommodated resin holder) 170-2 in which the resin tablet 180 is accommodated is performed.

  First, the loader 130 moves to a position directly above the resin holder 170-2. Even at this time, the two chuck mechanisms 139 are open to the outside (left and right in FIG. 10) (at this time, the molded product to be conveyed next time is held by the chuck claws 155 in the respective chuck mechanisms 139). May be.) In this state, the lifter 109A-2 rises and conveys the resin holder 170-2 between the two chuck mechanisms 139 (see FIG. 10). In the present embodiment, the lifter 109A-2 side is raised, but instead, a configuration in which the chuck portion 136 side is lowered may be employed.

  Subsequently, as shown in FIG. 11, the slide plate 152 of each chuck mechanism 139 slides inward along the first slide guide 151. By this operation, the holder hook portion 156 provided in the slide plate 152 enters the lower side of the overhang portion 170B in the resin holder 170-2. As shown in FIG. 11B, the raised resin holder 170-2 is positioned in the XY directions by the positioning pins 158 protruding downward from the chuck portion main body 150.

  Subsequently, as shown in FIG. 12, the rod 157A of the clamp actuator 157 protrudes and presses the upper surface of the resin holder 170-2. Accordingly, as illustrated in FIG. 13, the overhanging portion 170 </ b> B of the resin holder 170-2 comes into contact with the holder hook portion 156. That is, the resin holder 170-2 is held in a state of being securely fixed by the holder hook portion 156. Subsequently, the lifter 109A-2 descends. Through such a series of steps, the attachment / detachment / exchange operation between the empty resin holder 170-1 and the accommodated resin holder 170-2 is completed.

  In this embodiment, after preparing a plurality of resin holders 170 in advance, a resin holder that is not attached to the loader 130 (that is, a resin holder that is carrying the resin to the mold in a progressive form) Resin holders 170-2) are supplied (accommodated) with the necessary resin tablets 180 until the next conveyance. Furthermore, when the loader 130 takes back the empty resin holder (resin holder after the resin is poured into the mold) 170-1, the loader 130 removes the empty resin holder 170-1 and removes the empty resin holder 170-1. Instead of supplying (accommodating) the resin tablet 180 to the loader 130 again, the resin holder 180-2 in which the resin tablet 180 is accommodated in advance and the “holder itself” are exchanged, and the next conveyance is immediately performed. It is possible to do.

  By adopting such a configuration, it is not necessary to wait for the time during which the resin tablet 180 is supplied (accommodated) to the resin holder 170-1 that has been taken home, and the conveyance capability of the loader 130 can be improved. ing.

<About cleaning work>
Further, the mold 106 is cleaned at a predetermined timing. This timing is performed automatically by the number of times of resin sealing, time, or the like, or by an operator's operation. When an instruction for the cleaning operation is given, a molded product (dummy frame) for cleaning is supplied from the substrate supply unit 102, while a cleaning resin tablet is supplied from the resin tablet supply unit 109. The cleaning resin tablet is supplied in a form of being accommodated in a dedicated resin holder (resin holder dedicated to the cleaning resin tablet) 170.

  After that, the loader 130 conveys the molded article for cleaning and the cleaning resin tablet to the mold 106. The conveyance is performed by cleaning with the resin holder 170 containing the normal sealing resin. This is performed after the resin holder 170 containing the resin for use is attached / detached / replaced. The attachment / detachment / exchange operation of the resin holder 170 is the same as the above procedure.

  After that, the loader 130 conveys and puts the molding object (dummy frame) and the cleaning resin into the mold for cleaning work. When the cleaning operation is completed, the resin holder is attached / detached / replaced again, and the sealing resin is conveyed using the resin holder 170 dedicated to the sealing resin.

  Note that the release of the resin tablet 180 from the resin holder 170 and the storage of the tablet resin in the resin holder are performed by opening and closing the tablet shutter 170C by a cylinder 190 or the like disposed outside, for example, as shown in FIG. Is done.

  In this embodiment, the single loader 130 realizes the transfer of the resin and the molded product, which contributes to the compactness of the apparatus. In addition, the loader 130 includes two sets of chuck mechanisms 139 that can hold a molded product, and the resin holder 170 can be attached and detached by moving the two sets of chuck mechanisms 139 horizontally. As a result of adopting such a configuration, it is possible to adjust the interval of the chuck mechanism 139 by the slide in accordance with the arrangement interval of the molded products in the mold.

  In addition, a plurality of resin holders 170 are preliminarily arranged at a specific location (a predetermined location on the resin sealing device 100) according to the type (according to the type of resin to be accommodated). By detecting the presence / absence of the arranged resin holder 170 at this location, it is possible to detect whether the loader 130 is holding or not holding the resin, and to identify the type of resin to be held according to this specific position. Also good. That is, if there is no resin holder 170 that should be at a specific location, it is possible to determine that the type of resin corresponding to that location is held by the loader 130.

  In addition, the loader 130 can detect holding / non-holding of the resin accommodated in the resin holder by attaching or detaching the resin holder 170, or the resin holder 170 is provided with an identification mark corresponding to the type of resin. If the type of resin can be identified by a sign (for example, at least a part of the shape, pattern, color, or combination thereof), the identification information can be used for control of the resin sealing device. Become.

  In the present embodiment, two types of resins, ie, “sealing resin” and “cleaning resin” are described as examples. However, the present invention is not limited to this. For example, the present invention can also be applied when a plurality of types of resins having different properties are used depending on the product.

  Moreover, although the tablet-shaped resin is demonstrated to resin as an example, the same effect can be exhibited even if it is other resin such as powder or granule.

  Regardless of the sealing type such as transfer molding or compression molding, it can be widely used in a resin sealing device. In particular, it is suitable for a multi-press type resin sealing apparatus in which a plurality of dies are arranged in parallel.

1 is a schematic configuration diagram of a resin sealing device 100 including a transport mechanism that is an example of an embodiment of the present invention. Side sectional view of loader 130 as a transport mechanism Sectional view along arrow IV-IV in Fig. 2 Enlarged front view of chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part The figure which showed the resin holder attachment / detachment / replacement process of the chuck part Schematic configuration diagram of resin holder

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 101 ... Base part 102 ... Substrate supply part 103 ... Turning table 104 ... Molded product storage part 105 ... Preheater 106 ... Mold 107 ... Cooling stage 108 ... Gate break 109 ... Resin tablet supply part 109A ... Lifter 120 ... X-direction guide 130 ... loader 131 ... loader body 132 ... arm part 133 ... slide body 134 ... slide rail 136 ... chuck part 137 ... vertical mechanism 140 ... unloader 150 ... chuck part body 151 ... first slide guide 152 ... slide plate 153 ... second slide guide 154 ... nail plate
155 ... Chuck claw 156 ... Holder hook part 157 ... Clamp actuator 157A ... Rod 158 ... Positioning pin 170 ... Resin holder 170A ... Resin tablet housing part 170B ... Overhang part 180 ... Resin tablet

Claims (4)

A resin sealing device including a transport mechanism for transporting resin to a mold,
A plurality of resin holders capable of accommodating the resin and being detachable / replaceable in the transport mechanism;
The transport mechanism can transport the resin contained in the resin holder via the resin holder mounted on the transport mechanism,
Furthermore, the empty resin holder and the accommodated resin holder are attached and detached and exchanged for each cycle in which the transport mechanism transports the resin to the mold. In claim 1,
A plurality of types of resins are prepared according to the purpose of use,
A plurality of the resin holders are prepared for each of the plurality of types of resins. A resin transport method in a resin sealing device having a transport mechanism for transporting resin to a mold,
For each cycle in which the transport mechanism transports the resin to the mold,
Transporting the resin held through a resin holder capable of containing the resin to the mold;
Introducing the resin to be held against the mold;
The process of bringing back the empty resin holder after the injection,
A method for transporting resin in a resin sealing device, comprising: a step of attaching and detaching and replacing the empty resin holder and a stored resin holder in which the resin is stored. In claim 3,
The resin is accommodated in the empty resin holder before the next conveyance. A method for conveying a resin in a resin sealing device.

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