JP6527381B2 - Resin sealing system and resin sealing method - Google Patents

Description

  The present invention relates to a resin sealing system and a resin sealing method used for resin seal molding of a semiconductor.

  Conventionally, as a resin sealing system used for resin seal molding of semiconductors, a molding press unit that performs resin seal molding using an upper mold, a lower mold, and a middle mold, and a plurality of molds that take the middle mold out of the molding press unit A medium conveyance mechanism, a medium preheating unit for preheating the medium before being carried into the molding press unit, an eject press unit for separating the sealed molded object and the runner gate from the medium, and a medium mold for cleaning the medium One having a cleaning unit is known (Patent Document 1).

  In the resin sealing system of Patent Document 1, a plurality of medium-sized conveyance mechanisms convey a plurality of medium-sized pieces at different timings in the order of a medium-sized preheating unit, a forming press unit, an eject press unit, and a medium-sized cleaning unit. By repeating the operation, a plurality of middle molds are simultaneously circulated in the resin sealing system.

Patent No. 4574059 gazette

  However, since the resin sealing system of Patent Document 1 conveys a plurality of middle molds by a plurality of middle-sized conveyance mechanisms, when replacing the middle mold after resin sealing molding with a middle mold before resin sealing molding, There is a problem that the middle mold before the resin sealing and forming can not be carried into the forming and pressing unit unless the middle form after the resin sealing and forming is carried out of the forming and pressing unit and conveyed to the eject pressing unit. For this reason, in the resin sealing system of patent document 1, there exists a problem that it is difficult to aim at shortening of an index.

  An object of this invention is to provide the resin sealing system which can aim at shortening of an index, and the resin sealing method.

  In order to achieve the above object, a resin sealing system according to the present invention carries a resin sealing device that performs resin sealing molding using an upper mold, a lower mold and a middle mold, and carries the middle mold into the resin sealing apparatus. And a medium transport mechanism capable of carrying out the medium mold from the resin-sealed device, the medium transport mechanism having a plurality of middle holders capable of holding the middle mold, and a plurality of the middle holders Are configured to simultaneously transport a plurality of the middle molds, and the middle transport mechanism circulates the plurality of middle molds at the same time between an apparatus disposed outside the resin sealing apparatus and the resin sealing apparatus. It is characterized in that it is configured to

  In the resin sealing system according to the present invention, it is preferable that at least one of the plurality of middle mold holding parts be provided with an unnecessary resin holding part for holding unnecessary resin separated from the middle mold after resin sealing molding. .

  In the resin sealing method according to the present invention, a work / tablet supply mechanism for supplying a work and a resin tablet to the resin sealing device is disposed on one side of the resin sealing device. A middle mold provided with a tablet supply area, and on the other side of the resin sealing apparatus, a device for performing at least one of a preheating process and a cleaning process on the middle mold transported by the middle transport mechanism. A processing area may be provided, and the medium-sized transfer mechanism may be configured to be reciprocally movable between the medium-sized processing area and the resin sealing device.

  In this case, the medium-sized transfer mechanism is configured to be movable along the rail part and a rail part that is bridged across the medium-sized processing region and the resin sealing device, and a plurality of the medium-sized holding parts And a medium-sized carrier body having the

  Further, the work / tablet supply mechanism includes a work / tablet supply area and a rail portion which is bridged across the resin sealing device, and a work / tablet transport configured to be movable along the rail portion. The rail portion of the work / tablet supply mechanism is provided at the same time as the middle-sized conveyance main body of the middle-sized conveyance mechanism and the work / tablet conveyance main body of the work / tablet supply mechanism simultaneously in the resin sealing device. It is preferable to be provided in the position different from the said rail part of the said medium-sized conveyance mechanism so that it can enter.

  The resin sealing method according to the present invention is a resin sealing method performed using the above-described resin sealing system, and before resin sealing molding by a middle type holding portion of a part of the plurality of middle type holding portions. The middle mold is carried into the resin sealing apparatus, and the middle mold after resin sealing molding is carried out of the resin sealing apparatus by another middle mold holding section of the plurality of middle mold holding sections. The cleaning process is performed on the middle mold carried out by the middle mold holding unit, and then the middle mold after cleaning is held by the partial middle mold holding unit, thereby simultaneously performing a plurality of the middle molds by the middle transport mechanism. It is characterized by circulating.

  ADVANTAGE OF THE INVENTION According to this invention, the resin sealing system which can aim at shortening of an index, and the resin sealing method can be provided.

It is a front perspective view which shows schematic structure of the resin sealing system which concerns on one Embodiment of this invention. It is a front view which partially omits and shows schematic structure of the resin sealing device which concerns on this embodiment. It is a perspective view which abbreviate | omits and shows schematic structure of the medium-sized conveyance mechanism which concerns on this embodiment. It is a rear perspective view which abbreviate | omits and shows schematic structure of the workpiece supply mechanism which concerns on this embodiment. It is a side view showing a schematic structure of a cleaning device concerning this embodiment. It is a figure which shows the time of the start of the molding cycle of the resin sealing method which concerns on this embodiment. It is a figure which shows the mold-opening process of the resin sealing method which concerns on this embodiment, and a shaping | molding completed inside-mold collection process. It is a figure which shows the work tablet supply process and medium-sized installation process of the resin sealing method which concerns on this embodiment. It is a figure which shows the cleaning process of the resin sealing method which concerns on this embodiment. It is a figure which shows the cull discard process of the resin sealing method which concerns on this embodiment. It is a figure which shows the medium-sized collection | recovery process after cleaning of the resin sealing method which concerns on this embodiment. It is a figure which shows the pre-heating process of the resin sealing method which concerns on this embodiment.

  Hereinafter, preferred embodiments for carrying out the present invention will be described using the drawings. The following embodiments do not limit the invention according to each claim, and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. .

  As shown in FIG. 1, the resin sealing system 1 according to the present embodiment includes a resin sealing device 10 that performs resin sealing molding using the upper mold 13, the lower mold 15, and the middle molds 16 a and 16 b, and A work / tablet supply mechanism 20 for supplying an object (a workpiece) and a resin tablet to the apparatus 10, a preheating device 30 for preheating the middle molds 16a and 16b, a cleaning device 40 for cleaning the middle molds 16a and 16b, a runner and A waste collection unit 50 for discarding wastes such as unnecessary resin (cal) molded by a gate or the like, and a medium-sized transfer mechanism 60 for transferring the medium-sized pieces 16a and 16b in the resin sealing system 1 are provided. In addition, the resin sealing system 1 includes a molded product recovery mechanism (not shown) that recovers the resin molded product P from the medium-sized transport mechanism 60. Since this molded article recovery mechanism can adopt various known configurations, the description thereof will be omitted.

  In the resin sealing system 1 according to the present embodiment, the work / tablet supply mechanism 20 is disposed on one side of the resin sealing device 10 (left side in FIG. 1) with the resin sealing device 10 as the center, and the resin sealing A preheating device 30, a cleaning device 40, a waste collection unit 50, and a molded product recovery mechanism are disposed on the other side (the right side in FIG. 1) of the stopper 10. That is, in the resin sealing system 1 according to the present embodiment, the area on one side of the resin sealing device 10 is a work / tablet supply area for storing and transporting the work and the resin tablet, For performing various processes on the middle molds 16 a and 16 b before the region on the other side of the resin sealing device 10 is carried into the resin sealing device 10 or after being carried out of the resin sealing device 10. It is a medium-sized processing area. The medium-sized transfer mechanism 60 is disposed so as to be movable from the medium-sized processing area through the resin sealing device 10 to the work / tablet supply area.

  The work / tablet supply mechanism 20, the preheating device 30, the cleaning device 40, the waste collection unit 50, and the medium-sized conveyance mechanism 60 are provided on the long base 2 extending in the direction of both sides of the resin sealing device 10. The resin sealing device 10 is housed in a housing space formed in a substantially central portion of the base 2. That is, the work / tablet supply mechanism 20, the resin sealing device 10, the preheating device 30, the cleaning device 40, and the waste collection unit 50, one end of the base 2 (left end in FIG. 1) to the other end The workpiece / tablet supply mechanism 20 → the resin sealing device 10 → the preheating device 30 → the cleaning device 40 → the waste collection unit 50 are arranged in the longitudinal direction of the base 2 in the order of (right end portion in FIG. 1) The medium-sized transfer mechanism 60 is disposed along the longitudinal direction of the base 2 so as to be parallel to the row. The molded product recovery mechanism is disposed at an appropriate position in the middle-sized processing area.

  As shown in FIGS. 1 and 2, the resin sealing device 10 includes a rectangular lower plate 11 placed on the floor and four tie bars 10 a extending upward from four corners of the lower platen 11. , And a rectangular plate-like upper platen 12 whose four corners are connected to the upper ends of four tie bars 10a, and the four tie bars 10a pass through the four corners along the tie bar 10a between the lower platen 11 and the upper platen 12 The movable platen 14 is provided with a rectangular plate-like movable platen 14 provided so as to be able to move up and down, and an elevation mold clamping mechanism 18 provided between the lower platen 11 and the movable platen 14 to raise and lower the movable platen 14. The raising and lowering mold clamping mechanism 18 can employ various types of mold clamping mechanisms such as a hydraulic or electric mold clamping cylinder, and a hydraulic or electric toggle link clamping mechanism. In the resin sealing device 10 according to the present embodiment, the lower platen 11, the tie bar 10a, the upper platen 12, the movable platen 14, and the lifting and clamping mechanism 18 can adopt various known configurations. Therefore, the detailed description is omitted.

  Further, the resin sealing device 10 includes an upper die 13 attached to the lower surface of the upper platen 12, a lower die 15 attached to the upper surface of the movable platen 14 (a surface facing the upper die 12), an upper die 13 and It further comprises middle molds 16a and 16b capable of forming a mold cavity with the lower mold 15. The lower mold 15 is formed with a plurality of (five in the present embodiment) accommodation pots (not shown) capable of accommodating resin tablets, and the accommodation pots are respectively accommodated in the accommodation pots. A plunger (not shown) is arranged to push the resin tablet towards the mold cavity. Further, in the lower mold 15, an ejection mechanism (not shown) for separating the middle molds 16a and 16b from the lower mold 15 after resin sealing molding is disposed. In the resin sealing device 10 according to the present embodiment, the upper mold 13, the lower mold 15, the housing pot, the plunger, and the ejection mechanism can adopt various known configurations, so that details thereof I omit explanation.

  A plurality of middle molds 16a and 16b are provided (two in the present embodiment), and the plurality of middle molds 16a and 16b are arranged between the upper mold 13 and the lower mold 15 in order (alternately in the present embodiment). Thus, a mold cavity is formed by the upper mold 13, the lower mold 15, and one middle mold 16a (or 16b). The plurality of medium-sized molds 16a and 16b have the same structure. Each of the middle molds 16a and 16b is formed in a rectangular plate shape having a predetermined thickness, penetrates from the lower surface to the upper surface, and communicates with the storage pot of the lower mold 15 when placed on the lower mold 15. And a runner formed on the upper surface, a runner through which the resin flowing in through the communication hole flows, a cavity formed on the lower surface, in which a semiconductor to be an object to be sealed is disposed, and a resin flowing through the runner A plurality of (five in the present embodiment) gates are formed to flow into the cavity portion. Further, a pair of insertion holes into which a pair of rod-like support portions 49 described later of the cleaning device 40 are inserted are formed in the front surface of the middle molds 16a and 16b. In the upper mold 13, the lower mold 15, and the middle molds 16a and 16b, unnecessary resin (cal), a resin molded article P, and the middle molds 16a and 16b are molded by runners and gates after resin sealing and molding. Eject mechanisms (not shown) for separating the respective components are appropriately arranged. In addition, since it is possible to employ | adopt well-known various structures, this eject mechanism abbreviate | omits the detailed description.

  The middle molds 16 a and 16 b having the above configuration are not fixed to the machine body of the resin sealing apparatus 10, and are predetermined to any one of the resin sealing apparatus 10, the preheating apparatus 30 and the cleaning apparatus 40 by the medium transport mechanism 60. It is transported based on the determined processing flow.

  As shown in FIGS. 1 to 3, the medium-sized transfer mechanism 60 extends parallel to the longitudinal direction of the base 2 and extends across the medium-sized processing region and the resin sealing device 10, and a pair of rail portions 62. A medium-sized conveyance main body 64 slidably attached to the rail 62 via the sliders 63 and 63, a drive (not shown) for reciprocating the medium-size conveyance main 64 along the rail 62, and a drive And a control unit (not shown) for controlling the unit. The drive unit can adopt various known drive means such as a servomotor, for example, and is configured to drive the medium-sized transport main body 64 based on a control signal output from the control unit.

  As shown in FIG. 1, the rail portion 62 has such a length that the resin sealing device 10 passes from the end (right end in FIG. 1) of the base 2 on the medium-sized processing region side and slightly enters the work / tablet supply region. 1 and 2, the work / tablet supply mechanism 20 is displaced from the rail portion 23 described later in the longitudinal direction (the position on the rear side in the present embodiment), and It is supported by a plurality of support plates erected on the base 2 at a position higher than the rail portion 23.

  As shown in FIG. 3, the medium-sized transfer main body 64 is formed in an inverted L-shaped cross section including an upper surface portion 64a and a back surface portion 64b, and has a length capable of arranging and holding two middle dies 16a and 16b in series. It has in the longitudinal direction. The middle-sized transport main body 64 has a pair of sliders 63, 63 separately attached to the back surface 64b along the longitudinal direction, and by attaching the pair of sliders 63, 63 to the rail 62, The longitudinal direction of the medium-sized transfer main body 64 is configured to be parallel to the extending direction of the rail portion 62. On the lower surface of the upper surface portion 64a of the middle-size transfer main body 64, a first middle-size holding portion 66 and a second middle-size holding portion 68 configured to be able to hold one middle size 16a, 16b are arranged in the longitudinal direction of the middle-size transfer main body 64. It is provided side by side.

  As shown in FIGS. 2 and 3, the first middle mold holding portion 66 is provided on one side in the longitudinal direction of the middle conveyance body 64, and includes a pair of middle support pieces 67a and 67b. The pair of middle support pieces 67a and 67b are spaced apart with a width slightly larger than the length in the longitudinal direction of the middle mold 16a (16b), and the lower end portions thereof are bent and extended in a direction approaching each other By doing this, one middle mold 16a (16b) can be held between the pair of left and right middle support pieces 67a and 67b. The middle-sized support pieces 67a and 67b are configured to be rotatable around the upper end or movable in directions away from each other by various driving means, and between the pair of middle-sized support pieces 67a and 67b. In the state of holding the middle mold 16a (16b) (holding state), and the state of releasing the held middle mold 16a (16b) (release state), it is configured to be displaceable.

  The second middle mold holding portion 68 is provided on the other side of the middle conveyance main body 64 in the longitudinal direction, and a pair of left and right middle support pieces 69a and 69b for holding one middle mold 16b (16a) and the middle mold 16b (16a) A pair of left and right molded product support pieces 70a and 70b for receiving the resin molded product P separated from the above and a karel adsorption part (unnecessary resin holding part) 72 for adsorbing cull (not shown) separated from the middle mold 16b (16a) And have. The middle-sized support pieces 69 a and 69 b have the same configuration as the middle-sized support pieces 67 a and 67 b of the first middle-sized holding portion 66. The molded article support pieces 70 a and 70 b are each formed in an L-shape, and the upper end thereof is connected to the upper surface portion 64 a of the middle-size conveyance main body 64. The pair of molded article support pieces 70a and 70b are spaced apart with a width slightly smaller than the length of the resin molded article P in the longitudinal direction, and the pair of molded article support pieces 70a and 70b form a middle size. 16b (16a) is configured to support the lower surface of the resin molded product P separated therefrom. The cull adsorbing portion 72 is connected to a vacuum pump (not shown) via a flexible tube (not shown), and the cull (not shown) separated from the middle mold 16b (16a) by driving the vacuum pump. It is configured to adsorb the

  The control unit of the medium conveyance mechanism 60 is a position where the first medium holding unit 66 installs the medium 16a (16b) in the preheating device 30 and recovers the preheated medium 16a (16b) (preheating medium installation / collection position) The second middle mold holding portion 68 enters the resin sealing device 10 and recovers the middle mold 16b (16a) after resin sealing and molding (a molded middle mold collection position), and the first middle mold holding portion 66 The cleaning apparatus 40 is delivered with the position (middle installation position) at which the middle mold 16a (16b) is installed in the sealing device 10 and the middle mold 16b (16a) after resin sealing molding held by the second middle mold holding portion 68. The position (cleaning position), the position where the cull held by the cull adsorption unit 72 of the second middle type holding unit 68 is discarded to the waste collection unit 50 (cal disposal position), and the first middle type holding unit 66 is cleaned. Medium size 16b 16a) to receive (medium-sized recovery position after cleaning), in the order of preheated medium-sized installation / recovery position → molded medium-sized recovery position → medium-sized installation position → cleaning position → cull disposal position → post-cleaning medium-sized recovery position The medium-sized conveyance main body 64 is conveyed, and the drive unit is controlled based on a predetermined program so as to repeatedly execute this operation. In the case where the distance between the first medium holding part 66 and the second medium holding part 68 is substantially the same as the space between the cleaning device 40 and the waste collection part 50, the cull disposal position and the medium collection position after cleaning are In the meantime, the medium-sized transfer body 64 may not be moved (see FIGS. 10 and 11).

  Further, in the control unit of the medium conveyance mechanism 60, the medium supporting pieces 67a and 67b of the first medium holding unit 66 perform holding or releasing operation of the medium 16a (16b) at the preheating medium installation / collection position and the medium installation position. At the molded middle mold recovery position, the holding operation of the middle mold 16b (16a) is performed by the middle mold supporting pieces 69a and 69b of the second middle mold holding unit 68, and the kar separated from the middle mold 16b (16a) by the kar adsorption unit 72. In the cull discarding position, the drive unit is controlled based on a predetermined program so that the adsorption by the cull adsorption unit 72 is released.

  As shown in FIGS. 1 and 4, the work / tablet supply mechanism 20 supplies a work to the work / tablet conveyance device 22 for conveying the work and the resin tablet into the resin sealing device 10, and the work / tablet conveyance device 22. And a tablet supply device 28 for supplying a resin tablet to the work tablet transfer device 22. In addition, the work / tablet supply mechanism 20 synchronizes or asynchronously drives the respective drive units with drive units (not shown) respectively provided to the work / tablet transfer device 22, the work supply device 26, and the tablet supply device 28. And a control unit (not shown) for controlling the Each drive part can employ | adopt various well-known drive means, such as a servomotor, for example, and it is comprised so that it may operate | move based on the control signal output from a control part.

  The work / tablet transport device 22 extends parallel to the longitudinal direction of the base 2 and is stretched across the work / tablet supply area and the resin sealing device 10 as shown in FIGS. 1, 2 and 4 A rail portion 23, a pair of slider portions 24 and 24 slidably mounted on the rail portion 23, and a work / tablet transfer main body 25 mounted on the pair of slider portions 24 and 24 are provided.

  As shown in FIG. 1, the rail portion 23 is a long plate member having a length that allows the work / tablet transfer main body 25 to reciprocate between the inside of the work / tablet supply area and the inside of the resin sealing device 10. is there. The rail portion 23 is provided at a position different from the rail portion 62 of the middle-sized conveyance mechanism 60 so that the work / tablet conveyance main body 25 and the middle-sized conveyance main body 64 of the middle-sized conveyance mechanism 60 can enter into the resin sealing device 10 simultaneously. ing. Specifically, as shown in FIG. 1 and FIG. 2, the rail portion 23 is a position (a position on the front side in the present embodiment) offset from the rail portion 62 of the medium-sized transport mechanism 60 in the front-rear direction. The lower position is supported by a plurality of support plates provided upright on the base 2.

  As shown in FIG. 4, the work / tablet transfer main body 25 is a block-like member having a plurality of subpots 25a capable of temporarily storing resin tablets and a work storage portion 25b capable of temporarily storing a work. And is slidably attached to the rail portion 23 via the pair of slider portions 24 and 24. The sub pots 25 a are formed in the same number (five in the present embodiment) as the storage pots formed in the lower mold 15 of the resin sealing device 10.

  The work supply device 26 is mounted on the work / tablet transfer main body 25 to mount one by one a rack containing a plurality of works formed of a substrate (lead frame) on which a semiconductor such as an IC chip is mounted and a work Means are provided in the work / tablet supply area. The workpiece feeding device 26 is configured to load workpieces one by one on the workpiece / tablet transport main body 25 by operating the loading device at appropriate timing by the control unit.

  The tablet feeding device 28 picks up a tablet container (not shown) that accommodates a large number of resin tablets for molding (resin sealing and molding) a substrate, and transports a work / tablet by picking out the resin tablets in the tablet container. And a loading unit 28a for loading the resin tablet onto the work / tablet transfer main body 25. The loading unit 28a is installed in the work / tablet supply area. The tablet container is a container disposed below the base 2 and is configured to be able to align and accommodate a plurality of resin tablets. The mounting means 28a is configured to be capable of moving up and down along a pair of rails 28b and 28c extending along the vertical direction, and in the lowered position, picks a plurality (five in the present embodiment) of resin tablets from the tablet container. It is configured to be able to be taken out and to load the picked resin tablets in the subpot 25 a of the work / tablet transfer main body 25 at the raised position.

  The work / tablet supply mechanism 20 having the above configuration can reciprocate the work / tablet transfer main body 25 between the inside of the work / tablet supply area and the inside of the resin sealing apparatus 10, and the work / tablet The work tablet transport main body 25 on which the work and the resin tablet are mounted is moved into the resin sealing apparatus 10 in the supply area, and the resin tablet transported by the work tablet transport main body 25 is formed in the lower mold 15 While being dropped into the pots, it is possible to place a work at a predetermined position of the lower die 15.

  As shown in FIG. 1, the preheating device 30 has a mounting surface on which the middle mold 16a (16b) held by the first middle mold holding portion 66 of the middle conveyance body 64 of the middle conveyance mechanism 60 can be placed. The heating body 32 which heats the middle form 16a (16b) mounted in the mounting surface, and the raising / lowering movement part 34 which supports the heating body 32 so that raising / lowering is possible. The preheating device 30 heats the middle mold 16a (16b) at a position where the heating body 32 is lifted by the elevating and moving unit 34, and heating of the middle mold 16a (16b) is completed. It is configured to descend to the retracted position.

  The cleaning device 40, as shown in FIGS. 1 and 5, includes a cleaning device main body 42 for cleaning one middle mold 16b (16a), a second middle mold holding portion 68 of the middle conveyance body 64 of the middle conveyance mechanism 60, and a cleaning device. And a transport unit 44 that transports the middle mold 16b (16a) to the main body 42. The cleaning device main body 42 can adopt various known cleaning means such as a structure for cleaning the middle mold 16b (16a) by brushing, or a structure for cleaning the middle mold 16b (16a) by suction, for example. The explanation is omitted.

  As shown in FIGS. 1 and 5, the transport unit 44 vertically transports the middle mold 16b (16a) and the front and rear moving body 46 movable in a direction toward or away from the middle mold 16b (16a). And a vertically movable body 48 capable of Specifically, the transport unit 44 is configured to be movable along a pair of front and rear guide rails 45 installed on the base 2 so as to extend in a direction orthogonal to the longitudinal direction of the base 2 and the front and rear guide rails 45. A longitudinal moving body 46, a pair of upper and lower guide rails 47 provided on the longitudinal moving body 46 so as to extend along the vertical direction, and a vertically moving body 48 configured to be movable along the vertical guide rail 47 There is. The vertically movable body 48 has a pair of rod-like support portions 49 engageable with a pair of insertion holes formed in the front of the middle mold 16b (16a).

  The transport unit 44 causes the back and forth mover 46 to approach the middle mold 16 b (16 a) held by the second middle mold holding unit 68 of the middle transport body 64 of the middle transport mechanism 60 in a state where the vertically movable body 48 is lifted. Thus, the rod-like support 49 of the vertically movable body 48 can be inserted into and engaged with the insertion hole of the middle mold 16b (16a). Further, in the state where the rod-like support portion 49 of the vertically movable body 48 is engaged with the insertion hole of the middle mold 16b (16a), the transport portion 44 slightly raises the vertically movable body 48 to start the middle type from the second middle type holding portion 68. The middle mold 16b (16a) is removed from the second middle mold holding portion 68 by separating the 16b (16a) and thereafter moving the front and rear moving body 46 backward (moving in a direction away from the second middle mold holding portion 68). Is configured to be possible. Further, the transport unit 44 lowers the vertically movable body 48 in a state in which the middle mold 16b (16a) is taken out, and then moves the forward and backward movable body 46 forward (moves in the direction approaching the cleaning device main body 42). The middle mold 16b (16a) can be inserted into the cleaning device main body 42. Further, the transport unit 44 is configured to be able to deliver the cleaned middle mold 16b (16a) to the first middle mold holding unit 66 by performing the reverse operation to the above operation.

  As shown in FIG. 1, the waste collection unit 50 is provided at the top of the collection container 52 for collecting culls and the collection container 52, and collects culls dropped from the cull adsorbing part 72 of the second middle type holding part 68. And a guide member 54 for guiding the container 52.

  Next, the operation of the resin sealing system 1 according to the present embodiment, that is, the resin sealing method performed using the resin sealing system 1 according to the present embodiment will be described with reference to FIGS. The following operation of the resin sealing system 1 is executed by drive control of each component based on a program stored in advance in the storage unit.

  In FIG. 6, resin sealing molding is performed in the resin sealing device 10 using one middle mold (hereinafter referred to as “second middle mold 16 b”), and the other middle mold (hereinafter “first It is illustrated that the medium size 16 a ′ ′ is being preheated in the preheating device 30. In this state, the middle-size transfer main body 64 of the middle-size transfer mechanism 60 is located at a position where the preheated first middle mold 16 a can be recovered by the first middle-mold holding portion 66 (preheating middle mold installation / recovery position). Further, a work and a resin tablet are supplied to the work / tablet transfer main body 25 of the work / tablet supply mechanism 20 from the work supply device 26 and the tablet supply device 28. Hereinafter, the operation shown in FIG. 6 will be described as the start of the molding cycle.

  After a predetermined curing time has elapsed, the resin sealing device 10 is opened, and the cull, the resin molded article P and the second middle mold 16b are separated by the ejection mechanism of the second middle mold 16b, respectively. The second middle mold 16b is released from the lower mold 15 by the ejection mechanism (mold opening process). Further, the heating body 32 of the preheating device 30 is lowered to the retracted position. In this state, with the middle-size transfer main body 64 of the middle-size transfer mechanism 60 holding the preheated first middle mold 16 a by the first middle-mold holding section 66, the second middle-mold holding section 68 is positioned inside the resin sealing device 10. It moves along the rail part 62 until it reaches. At this time, the first middle mold holding portion 66 holding the first middle mold 16 a passes through the resin sealing device 10 and enters the work / tablet supply area. Then, in a state in which the medium-sized transfer main body 64 is positioned at the formed medium-size recovery position, as shown in FIG. 7, the second medium-size support pieces 69a and 69b of the second medium-size holding portion 68 grip the second medium size 16b, to recover. In addition, the resin molded product P is held by the molded product support pieces 70a and 70b of the second middle mold holding unit 68, and the cull is held by the kar adsorption unit 72 (a molded middle mold recovery step).

  After the second middle mold 16b, the resin molded article P and the cull are recovered by the second middle mold holding portion 68, the upper mold 13 and the lower mold 15 are cleaned by various known configurations. Thereafter, as shown in FIG. 8, the supply of the work and the resin tablet to the resin sealing device 10 and the operation of installing the first middle mold 16 a in the resin sealing device 10 are performed in parallel. Specifically, the work / tablet transfer main body 25 of the work / tablet supply mechanism 20 enters into the resin sealing device 10 in the mold open state, and the resin tablet is supplied to the storage pot formed in the lower mold 15 A work is placed on a predetermined position of the lower mold 15 (work / tablet supply step). Also, in parallel with this, the middle-size transfer main body 64 of the middle-size transfer mechanism 60 is a rail portion so that the first middle-size holding portion 66 which has entered the work / tablet supply area reenters the resin sealing apparatus 10. Move along 62 Then, after the supply of the work and the resin tablet is completed and the work tablet transport main body 25 retracts into the work tablet supply area, the gripping of the first middle mold 16a by the first middle mold holding unit 66 is released, and the lower mold 15 The first middle mold 16a is installed on the top (middle installation step).

  After the first middle mold 16a is installed in the resin sealing device 10, as shown in FIG. 9, the middle conveyance mechanism 60 is continued until the second middle mold holding portion 68 reaches a position (cleaning position) corresponding to the cleaning device 40. The medium-sized transport main body 64 moves along the rail portion 62. Then, at the cleaning position, the second middle mold 16 b is delivered to the cleaning device 40 and cleaned by the cleaning device 40 (cleaning step). Further, the resin molded product P is collected by a molded product collection mechanism (not shown). Furthermore, after the medium-sized transfer main body 64 retracts from inside the resin sealing device 10, the resin sealing device 10 is clamped, and resin sealing molding is performed using the upper die 13, the lower die 15, and the first middle die 16a. Ru.

  After the second middle mold 16 b and the resin molded product P are delivered to the cleaning device 40 and the molded product recovery mechanism, respectively, as shown in FIG. 10, the second middle mold holding portion 68 corresponds to the waste collection portion 50 ( The medium-sized transfer main body 64 of the medium-sized transfer mechanism 60 moves along the rail portion 62 until the scrap disposal position is reached. Then, in this state, the suction by the cal adsorption portion 72 of the second middle type holding portion 68 is stopped, and the karl held by the cal adsorption portion 72 falls into the collection container 52 through the guide member 54 of the waste collection portion 50. Allow the waste (cal disposal process). Thus, the cull removed from the second middle mold 16 b is discarded to the waste collection unit 50.

  After the culls are discarded to the waste collection unit 50, as shown in FIG. 11, the second middle mold 16b cleaned by the cleaning device 40 is delivered to the first middle mold holding unit 66 (middle cleaning process after cleaning). In the resin sealing system 1 according to the present embodiment, the distance between the first middle mold holding portion 66 and the second middle mold holding portion 68 is substantially the same as the distance between the cleaning device 40 and the waste collection portion 50. The position of the medium-sized transfer main body 64 is the same at the cull discarding position and the medium-size recovery position after cleaning. For this reason, the medium-sized transfer main body 64 does not move at the time of transition from the cull discarding process to the medium-sized collection process after cleaning. On the other hand, when the position of the medium transport body 64 is different between the cull discarding position and the after-cleaning mid-size recovery position, the first mid-holding unit 66 corresponds to the cleaning device 40 after the cull discarding step and before the mid-cleaning step after cleaning An operation of moving the medium-sized transfer main body 64 of the medium-size transfer mechanism 60 along the rail portion 62 is performed until the position (cleaning position) is reached.

  After the second middle mold 16 b is delivered to the first middle mold holding section 66, as shown in FIG. 12, the first middle mold holding section 66 reaches the position (preheating middle mold installation / recovery position) corresponding to the preheating device 30. The middle-size transfer main body 64 of the middle-size transfer mechanism 60 moves along the rail portion 62. During this movement, the second middle mold 16b after cleaning is inspected by a known inspection means (not shown), and if the cleaning is insufficient, the movement of the middle-sized conveyance main body 64 is stopped and an error sound is notified. You may Then, in a state where the first middle mold holding portion 66 reaches the preheating middle mold installation and recovery position, the heating body 32 of the preheating device 30 is raised to preheat the second middle mold 16b (preheating step). Further, a work and a resin tablet are supplied from the work supply device 26 and the tablet supply device 28 to the work / tablet conveyance main body 25 of the work / tablet supply mechanism 20.

  By the above steps, the first middle mold 16a and the second middle mold 16b are replaced with respect to the state at the start of the molding cycle shown in FIG. Therefore, hereinafter, the first middle mold 16a and the second middle mold 16b are read as appropriate, and the steps described above are repeated to simultaneously circulate the first middle mold 16a and the second middle mold 16b in the resin sealing system 1, The resin molded product P can be molded continuously.

  As described above, the resin sealing system 1 according to the present embodiment includes the resin sealing device 10 that performs resin sealing molding using the upper mold 13, the lower mold 15, and the middle molds 16 a and 16 b, and the resin sealing apparatus 10. And a middle type holding mechanism 60 capable of carrying in the middle molds 16a and 16b and capable of carrying out the middle molds 16a and 16b from the resin sealing device 10, and the middle type conveyance mechanism 60 can hold the middle molds 16a and 16b. It has a plurality of sections 66 and 68, and is configured to be capable of simultaneously transporting a plurality of middle molds 16a and 16b by a plurality of middle mold holding sections 66 and 68, and arranged outside resin sealing apparatus 10 by a middle size transport mechanism 60. The plurality of middle molds 16 a and 16 b are simultaneously circulated between the devices 30 and 40 and the resin sealing device 10.

  And in the resin sealing system 1 according to the present embodiment, the plurality of middle molds 16a and 16b are simultaneously transported by the plurality of middle mold holding portions 66 and 68 provided in the single medium transport mechanism 60 as described above. Therefore, in one operation in which the medium-sized conveyance mechanism 60 enters into the resin sealing device 10, the medium-sized member 16b (16a) after resin-sealing molding by the one medium-sized holding portion 68 (66) is removed from the resin sealing device 10. The process of taking out and the process of disposing the middle mold 16a (16b) before the resin sealing molding on the resin sealing apparatus 10 can be continuously performed by the other middle mold holding portion 66 (68). Further, while resin sealing molding is performed using the middle mold 16a (16b) in the resin sealing apparatus 10, the middle mold 16b (16a) taken out of the resin sealing apparatus 10 is disposed outside the resin sealing apparatus 10 The various apparatuses such as cleaning and preheating are executed by the apparatus 30, 40, and after the resin sealing and molding, the medium conveyance mechanism 60 is again advanced into the resin sealing apparatus 10 to replace the medium molds 16a and 16b. It becomes possible. According to the resin sealing system 1 according to the present embodiment, the replacement work of the middle molds 16a and 16b to be introduced into the resin sealing device 10 can be performed efficiently and in a short time, and the resin sealing device Since various processes such as taking out of the resin molded product P and cleaning and preheating of the middle molds 16a and 16b can be performed in parallel while resin sealing molding is being performed in 10, the index can be shortened. Is possible.

  In the resin sealing system 1 according to the present embodiment, the rail portion 23 of the work / tablet supply mechanism 20 simultaneously controls the work / tablet conveyance main body 25 and the middle-sized conveyance main body 64 of the middle-sized conveyance mechanism 60. It is provided at a position different from the rail portion 62 of the medium-sized transfer mechanism 60 so that it can enter inside. According to the resin sealing system 1 according to the present embodiment, the replacement work of the middle molds 16 a and 16 b by the middle transport body 64 of the middle transport mechanism 60 and the work / tablet transport main body 25 of the work / tablet supply mechanism 20. Since it is possible to simultaneously execute the work and the supply operation of the resin tablet in parallel, it is possible to further shorten the index.

  The preferred embodiment of the present invention has been described above, but the technical scope of the present invention is not limited to the scope described in the above-described embodiment. It is possible to add various change or improvement to each above-mentioned embodiment.

  For example, although the resin sealing system 1 is described as including the preheating device 30, the cleaning device 40, the waste collection unit 50, and the molded product recovery mechanism in the above-described embodiment, the present invention is not limited thereto. The resin sealing system includes a resin sealing device and a medium-sized transfer mechanism, and is configured to simultaneously circulate a plurality of middle dies between the resin sealing device and a device disposed outside the resin sealing device by the medium-sized transfer mechanism. Various configurations can be adopted as long as the configuration is the same.

  Further, in the embodiment described above, the area on one side of the resin sealing apparatus 10 with the resin sealing apparatus 10 as the center is the work / tablet supply area, and the area on the other side is the medium-sized processing area. Although the present invention has been described above, the present invention is not limited to this, and the arrangement relationship between the work / tablet supply area and the medium-sized processing area can be changed as appropriate. In the embodiment described above, the work / tablet supply mechanism 20, the resin sealing device 10, the preheating device 30, the cleaning device 40, and the waste collection unit 50 are arranged side by side along the longitudinal direction of the base 2 However, the present invention is not limited to this, and the arrangement locations of these configurations can be changed as appropriate.

  Furthermore, in the embodiment described above, since the substrate (lead frame) on which five semiconductors are mounted in parallel is used as a work (seal target), the housing pot of the lower mold 15 and the communication holes of the middle molds 16a and 16b Although five runners, a cavity portion and a gate, and five sub pots 25a of the work / tablet transfer main body 25 are respectively formed, the present invention is not limited to this. It changes suitably according to the number of semiconductors attached to.

  Furthermore, in the embodiment described above, the middle-sized transport mechanism 60 is provided with two middle-sized holding portions (the first middle-sized holding portion 66 and the second middle-sized holding portion 68), and the two middle sizes are circulated simultaneously in the resin sealing system. However, the present invention is not limited to this, and three or more middle-sized holders may be provided, and three or more middle-sized holders may be simultaneously circulated in the resin sealing system.

  Further, in the embodiment described above, the first middle mold holding portion 66 and the second middle mold holding portion 68 are described as holding the middle molds 16a and 16b by holding the middle molds 16a and 16b by the left and right pair of middle support pieces 67a, 67b, 69a and 69b, respectively. However, the present invention is not limited to this, and various holding means such as a structure for holding by vacuum suction can be adopted.

  DESCRIPTION OF SYMBOLS 1 resin sealing system, 10 resin sealing devices, 13 upper mold | types, 15 lower mold | types, 16a 1st middle type (middle type), 16b 2nd middle type (middle type), 20 work tablet supply mechanism, 23 rail part, 25 work * Tablet transport body, 30 preheating device, 40 cleaning device, 60 medium transport mechanism, 62 rail portion, 64 middle transport body, 66 first middle mold holding section (middle mold holding section), 68 second middle mold holding section (middle mold holding section), 72 Cull adsorption section (non-essential resin holding section)

Claims (6)

A resin sealing device that performs resin sealing molding using an upper mold, a lower mold and a middle mold;
And a medium transport mechanism capable of carrying the middle mold into the resin sealing apparatus and capable of carrying out the middle mold from the resin sealing apparatus;
The medium-sized transfer mechanism has a plurality of medium-sized holding portions capable of holding the medium-sized, and the plurality of medium-sized holding portions are configured to simultaneously convey a plurality of the medium-sized cases.
A resin seal characterized in that a plurality of the middle molds are circulated in parallel between an apparatus disposed outside the resin sealing apparatus and the resin sealing apparatus by the medium transport mechanism. Stop system. The unnecessary resin holding portion for holding the unnecessary resin separated from the middle mold after resin seal molding is provided in at least one of the plurality of middle mold holding portions. Resin sealing system. A work / tablet supply area in which a work / tablet supply mechanism for supplying a work and a resin tablet to the resin sealing device is provided on one side of the resin sealing device.
On the other side of the resin-sealed device, there is provided a medium-sized processing region in which a device for performing at least one of preheating treatment and cleaning treatment for the medium-sized material conveyed by the medium-sized conveyance mechanism is disposed.
The resin-sealed system according to claim 1 or 2, wherein the medium-sized transfer mechanism is configured to be reciprocally movable between the medium-sized processing region and the resin sealing device. The medium-sized conveyance mechanism is configured to be movable along the rail part and a rail part that is bridged across the medium-sized processing region and the resin sealing device, and includes a plurality of the medium-sized holding parts. The resin sealing system according to claim 3, comprising: a main body. The work / tablet supply mechanism includes a work / tablet supply area and a rail portion which is bridged across the resin sealing device, and a work / tablet transport main body configured to be movable along the rail portion. Equipped with
The rail portion of the work / tablet supply mechanism is configured to allow the middle-sized transfer main body of the middle-sized transfer mechanism and the work / tablet transfer main body of the work / tablet supply mechanism to simultaneously enter the resin sealing apparatus. It is provided in the position different from the said rail part of the said medium-sized conveyance mechanism. The resin sealing system of Claim 4 characterized by the above-mentioned. It is the resin sealing method performed using the resin sealing system of any one of Claims 1-5, Comprising:
The intermediate mold holding portion before the resin sealing molding is carried into the resin sealing device by a part of the middle mold holding portions of the plurality of middle mold holding portions, and another middle mold holding portion of the plurality of middle mold holding portions , Carry out the resin mold after resin sealing molding from the resin sealing device,
The cleaning process is performed on the middle mold carried out by the other middle mold holding unit, and then the middle mold after cleaning is held by the partial middle mold holding unit, so that a plurality of the middle molds are transported by the middle transport mechanism. The resin sealing method characterized by circulating in parallel according to .

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