JP5049613B2 - 有機発光装置及びその製造方法 - Google Patents
有機発光装置及びその製造方法 Download PDFInfo
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- JP5049613B2 JP5049613B2 JP2007056762A JP2007056762A JP5049613B2 JP 5049613 B2 JP5049613 B2 JP 5049613B2 JP 2007056762 A JP2007056762 A JP 2007056762A JP 2007056762 A JP2007056762 A JP 2007056762A JP 5049613 B2 JP5049613 B2 JP 5049613B2
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- Prior art keywords
- organic light
- moisture
- light emitting
- layer
- emitting device
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 32
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 27
- 229910052805 deuterium Inorganic materials 0.000 claims description 27
- 150000002894 organic compounds Chemical class 0.000 claims description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 12
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 238000004050 hot filament vapor deposition Methods 0.000 claims description 3
- 238000002230 thermal chemical vapour deposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 121
- 239000007789 gas Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000003230 hygroscopic agent Substances 0.000 description 2
- 239000001272 nitrous oxide Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
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- Electroluminescent Light Sources (AREA)
Description
図1に示す有機発光素子を形成する。
上部電極6の膜厚を60nmとし、防湿層をVHFプラズマCVDで次のように形成した以外は実施例1と同様にして、図2に示す有機発光素子を形成する。
2 TFT層
3 素子分離膜
4 下部電極
5 有機化合物層
6 上部電極
7,7’ 内部サブ防湿層
8 外部サブ防湿層
9 円偏光板
10 防湿層
Claims (2)
- 基板と、前記基板上に形成されている有機発光素子と、前記有機発光素子上に形成されており、前記有機発光素子を覆っている防湿層と、を有し、前記有機発光素子は、前記基板側から順に下部電極と、有機化合物層と、上部電極と、を有する有機発光装置において、前記防湿層は重水素を含む、窒化シリコン、酸化シリコン、酸窒化シリコンのいずれかからなることを特徴とする有機発光装置。
- 基板と、前記基板上に順に配置されている下部電極と有機化合物層と上部電極とを有する有機発光素子と、前記有機発光素子を覆っている防湿層と、を有する有機発光装置の製造方法において、
前記有機発光素子を、前記基板上に形成する工程と、
重水素ガスを含む原料ガスを用いた、プラズマCVD法、Cat−CVD法、熱CVD法または光CVD法により、前記有機発光素子上及び前記有機発光素子の周辺に、重水素を含む、窒化シリコン、酸化シリコン、酸窒化シリコンのいずれかからなる防湿層を形成する工程と、を有することを特徴とする有機発光装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007056762A JP5049613B2 (ja) | 2006-03-31 | 2007-03-07 | 有機発光装置及びその製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006097180 | 2006-03-31 | ||
JP2006097180 | 2006-03-31 | ||
JP2007056762A JP5049613B2 (ja) | 2006-03-31 | 2007-03-07 | 有機発光装置及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007294416A JP2007294416A (ja) | 2007-11-08 |
JP2007294416A5 JP2007294416A5 (ja) | 2010-04-15 |
JP5049613B2 true JP5049613B2 (ja) | 2012-10-17 |
Family
ID=38764803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007056762A Expired - Fee Related JP5049613B2 (ja) | 2006-03-31 | 2007-03-07 | 有機発光装置及びその製造方法 |
Country Status (1)
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JP (1) | JP5049613B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110040616A (ko) * | 2008-07-24 | 2011-04-20 | 후지 덴키 홀딩스 가부시키가이샤 | 유기 el 디바이스 및 그 제조 방법 |
CN108987602B (zh) * | 2017-12-13 | 2020-07-10 | 广东聚华印刷显示技术有限公司 | 有机电致发光器件的封装结构及制作方法 |
US12255273B2 (en) * | 2019-02-15 | 2025-03-18 | Samsung Display Co., Ltd. | Display device and method for fabricating the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3577117B2 (ja) * | 1994-10-07 | 2004-10-13 | Tdk株式会社 | 有機エレクトロルミネセンス素子の製法 |
JPH11144864A (ja) * | 1997-11-13 | 1999-05-28 | Mitsubishi Chemical Corp | 有機電界発光素子及びその製造方法 |
JP2000012550A (ja) * | 1998-06-25 | 2000-01-14 | Matsushita Electron Corp | 半導体装置およびその製造方法 |
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2007
- 2007-03-07 JP JP2007056762A patent/JP5049613B2/ja not_active Expired - Fee Related
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JP2007294416A (ja) | 2007-11-08 |
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