JP5000303B2 - シリカ含有シリコーン樹脂組成物及びその成形体 - Google Patents
シリカ含有シリコーン樹脂組成物及びその成形体 Download PDFInfo
- Publication number
- JP5000303B2 JP5000303B2 JP2006537692A JP2006537692A JP5000303B2 JP 5000303 B2 JP5000303 B2 JP 5000303B2 JP 2006537692 A JP2006537692 A JP 2006537692A JP 2006537692 A JP2006537692 A JP 2006537692A JP 5000303 B2 JP5000303 B2 JP 5000303B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone resin
- silica
- group
- resin composition
- containing silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 199
- 229920002050 silicone resin Polymers 0.000 title claims description 109
- 239000000377 silicon dioxide Substances 0.000 title claims description 95
- 239000011342 resin composition Substances 0.000 title claims description 50
- 150000001875 compounds Chemical class 0.000 claims description 47
- 239000010419 fine particle Substances 0.000 claims description 41
- -1 silane compound Chemical class 0.000 claims description 32
- 238000006460 hydrolysis reaction Methods 0.000 claims description 30
- 125000000524 functional group Chemical group 0.000 claims description 23
- 239000003054 catalyst Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 22
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 238000007334 copolymerization reaction Methods 0.000 claims description 16
- 230000007062 hydrolysis Effects 0.000 claims description 16
- 229910000077 silane Inorganic materials 0.000 claims description 15
- 239000012454 non-polar solvent Substances 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000001118 alkylidene group Chemical group 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 4
- 150000003377 silicon compounds Chemical class 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 31
- 239000000047 product Substances 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000001723 curing Methods 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 150000003254 radicals Chemical class 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 125000002723 alicyclic group Chemical group 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000008119 colloidal silica Substances 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 238000012719 thermal polymerization Methods 0.000 description 6
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 230000008707 rearrangement Effects 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- KBXJHRABGYYAFC-UHFFFAOYSA-N octaphenylsilsesquioxane Chemical compound O1[Si](O2)(C=3C=CC=CC=3)O[Si](O3)(C=4C=CC=CC=4)O[Si](O4)(C=5C=CC=CC=5)O[Si]1(C=1C=CC=CC=1)O[Si](O1)(C=5C=CC=CC=5)O[Si]2(C=2C=CC=CC=2)O[Si]3(C=2C=CC=CC=2)O[Si]41C1=CC=CC=C1 KBXJHRABGYYAFC-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- FKPSBYZGRQJIMO-UHFFFAOYSA-M benzyl(triethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC1=CC=CC=C1 FKPSBYZGRQJIMO-UHFFFAOYSA-M 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 229920006352 transparent thermoplastic Polymers 0.000 description 2
- OYDNMGZCIANYBE-UHFFFAOYSA-N (1-hydroxy-3-prop-2-enoyloxypropan-2-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CO)COC(=O)C=C OYDNMGZCIANYBE-UHFFFAOYSA-N 0.000 description 1
- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- NFPBWZOKGZKYRE-UHFFFAOYSA-N 2-propan-2-ylperoxypropane Chemical compound CC(C)OOC(C)C NFPBWZOKGZKYRE-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ROVPTGZDLJKYQV-UHFFFAOYSA-N 3-[diethoxy(ethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](CC)(OCC)CCCOC(=O)C(C)=C ROVPTGZDLJKYQV-UHFFFAOYSA-N 0.000 description 1
- UULWRBNKTKMMHF-UHFFFAOYSA-N 3-[diethoxy(ethyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](CC)(OCC)CCCOC(=O)C=C UULWRBNKTKMMHF-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- ISHXIPDXNPZCMQ-UHFFFAOYSA-N 3-[diethyl(methoxy)silyl]propyl 2-methylprop-2-enoate Chemical compound CC[Si](CC)(OC)CCCOC(=O)C(C)=C ISHXIPDXNPZCMQ-UHFFFAOYSA-N 0.000 description 1
- BFDBEDDUOYPWBW-UHFFFAOYSA-N 3-[diethyl(methoxy)silyl]propyl prop-2-enoate Chemical compound CC[Si](CC)(OC)CCCOC(=O)C=C BFDBEDDUOYPWBW-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- WUTSHINWYBIRDG-UHFFFAOYSA-N 3-[ethoxy(diethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](CC)(CC)CCCOC(=O)C(C)=C WUTSHINWYBIRDG-UHFFFAOYSA-N 0.000 description 1
- ZZXDQQWCXYGRHX-UHFFFAOYSA-N 3-[ethoxy(diethyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](CC)(CC)CCCOC(=O)C=C ZZXDQQWCXYGRHX-UHFFFAOYSA-N 0.000 description 1
- JSOZORWBKQSQCJ-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C(C)=C JSOZORWBKQSQCJ-UHFFFAOYSA-N 0.000 description 1
- DGBFOBNYTYHFPN-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C=C DGBFOBNYTYHFPN-UHFFFAOYSA-N 0.000 description 1
- YDSKIYLJGKSHFX-UHFFFAOYSA-N 3-[ethyl(dimethoxy)silyl]propyl prop-2-enoate Chemical compound CC[Si](OC)(OC)CCCOC(=O)C=C YDSKIYLJGKSHFX-UHFFFAOYSA-N 0.000 description 1
- DNMCYIZEDZBBNM-UHFFFAOYSA-N 3-[ethyl(methoxy)silyl]propyl 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OCCC[SiH](CC)OC DNMCYIZEDZBBNM-UHFFFAOYSA-N 0.000 description 1
- ZCRUJAKCJLCJCP-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C=C ZCRUJAKCJLCJCP-UHFFFAOYSA-N 0.000 description 1
- DOGMJCPBZJUYGB-UHFFFAOYSA-N 3-trichlorosilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](Cl)(Cl)Cl DOGMJCPBZJUYGB-UHFFFAOYSA-N 0.000 description 1
- LEPRPXBFZRAOGU-UHFFFAOYSA-N 3-trichlorosilylpropyl prop-2-enoate Chemical compound Cl[Si](Cl)(Cl)CCCOC(=O)C=C LEPRPXBFZRAOGU-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OTVVCOHGXGFPPV-UHFFFAOYSA-N C(C=C)(=O)OCO.C(C=C)(=O)OCO.CCCCCCCCCC Chemical compound C(C=C)(=O)OCO.C(C=C)(=O)OCO.CCCCCCCCCC OTVVCOHGXGFPPV-UHFFFAOYSA-N 0.000 description 1
- YURHEELXCRFZIC-UHFFFAOYSA-N C(C=C)(=O)OCO.C(C=C)(=O)OCO.CCCCCCCCCCCCCCC Chemical compound C(C=C)(=O)OCO.C(C=C)(=O)OCO.CCCCCCCCCCCCCCC YURHEELXCRFZIC-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- RZIOAYKWDOSHMG-UHFFFAOYSA-M [NH4+].[OH-].[OH-].CC[N+](CC)(CC)CC Chemical class [NH4+].[OH-].[OH-].CC[N+](CC)(CC)CC RZIOAYKWDOSHMG-UHFFFAOYSA-M 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- WUPZNKGVDMHMBS-UHFFFAOYSA-N azane;dihydrate Chemical compound [NH4+].[NH4+].[OH-].[OH-] WUPZNKGVDMHMBS-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001793 charged compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- YLDVAZYZSYKKOT-UHFFFAOYSA-N diethoxy(4-methylheptan-4-yloxy)silane Chemical compound C(CC)C(C)(O[SiH](OCC)OCC)CCC YLDVAZYZSYKKOT-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- SIWNOIGHWNVCHR-UHFFFAOYSA-N diethoxy(dimethyl)silane;triethoxy(methyl)silane Chemical compound CCO[Si](C)(C)OCC.CCO[Si](C)(OCC)OCC SIWNOIGHWNVCHR-UHFFFAOYSA-N 0.000 description 1
- VVKJJEAEVBNODX-UHFFFAOYSA-N diethoxy-di(propan-2-yl)silane Chemical compound CCO[Si](C(C)C)(C(C)C)OCC VVKJJEAEVBNODX-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- VHPUZTHRFWIGAW-UHFFFAOYSA-N dimethoxy-di(propan-2-yl)silane Chemical compound CO[Si](OC)(C(C)C)C(C)C VHPUZTHRFWIGAW-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- PYSAMOQTNZQMIN-UHFFFAOYSA-N ethoxy(propan-2-yl)silane Chemical group CCO[SiH2]C(C)C PYSAMOQTNZQMIN-UHFFFAOYSA-N 0.000 description 1
- DFJDZTPFNSXNAX-UHFFFAOYSA-N ethoxy(triethyl)silane Chemical compound CCO[Si](CC)(CC)CC DFJDZTPFNSXNAX-UHFFFAOYSA-N 0.000 description 1
- STBFUFDKXHQVMJ-UHFFFAOYSA-N ethoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OCC STBFUFDKXHQVMJ-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- GNUALYPKLFQNJG-UHFFFAOYSA-N heptan-4-yloxy(dimethoxy)silane Chemical compound C(CC)C(O[SiH](OC)OC)CCC GNUALYPKLFQNJG-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- ZZXXBDPXXIDUBP-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound C(C=C)(=O)OCO.C(C=C)(=O)OCO ZZXXBDPXXIDUBP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- FUMSHFZKHQOOIX-UHFFFAOYSA-N methoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OC FUMSHFZKHQOOIX-UHFFFAOYSA-N 0.000 description 1
- YKFVVAUPACHDIG-UHFFFAOYSA-N methoxy-tri(propan-2-yl)silane Chemical compound CO[Si](C(C)C)(C(C)C)C(C)C YKFVVAUPACHDIG-UHFFFAOYSA-N 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- BJDLPDPRMYAOCM-UHFFFAOYSA-N triethoxy(propan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)C BJDLPDPRMYAOCM-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- HUZZQXYTKNNCOU-UHFFFAOYSA-N triethyl(methoxy)silane Chemical compound CC[Si](CC)(CC)OC HUZZQXYTKNNCOU-UHFFFAOYSA-N 0.000 description 1
- FCVNATXRSJMIDT-UHFFFAOYSA-N trihydroxy(phenyl)silane Chemical compound O[Si](O)(O)C1=CC=CC=C1 FCVNATXRSJMIDT-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- BJAARRARQJZURR-UHFFFAOYSA-N trimethylazanium;hydroxide Chemical compound O.CN(C)C BJAARRARQJZURR-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
[RSiO3/2]n (1)
(但し、Rは(メタ)アクリロイル基を有する有機官能基、nは8、10又は12である)
で表され、構造単位中に籠型構造を有するポリオルガノシルセスキオキサンを主たる成分とするシリコーン樹脂と、分子中に−R3−CR4=CH2又は−CR4=CH2(但し、R3はアルキレン基、アルキリデン基又は−OCO−基を示し、R4は水素又はアルキル基を示す)で表される不飽和基を少なくとも1個含み、前記シリコーン樹脂とラジカル共重合が可能な不飽和化合物を、1:9 9〜99:1の重量割合で配合したシリコーン樹脂組成物にシラン化合物で処理されたシリカ微粒子が1〜70重量%配合されていることを特徴とするシリカ含有シリコーン樹脂組成物である。
RSiX3 (3)
(Rは(メタ)アクリロイル基を有する有機官能基であり、Xは加水分解性基を示す。)で表されるケイ素化合物を極性溶媒及び塩基性触媒存在下で加水分解反応させると共に一部縮合させ、得られた加水分解生成物を更に非極性溶媒及び塩基性触媒存在下で再縮合させ製造されたものであることが好ましく、その分子中ケイ素原子数と(メタ)アクリル基数が等しく、且つ籠型構造を有するシリコーン樹脂であることがよい。
(但し、Rは(メタ)アクリロイル基を有する有機官能基であり、Xは水素、または(メタ)アクリロイル基を有する有機官能基、nは0または1の整数)で表せる水酸基を有した不飽和化合物を含むことが好ましい。
RmSiAnX4-m−n (5)
(但し、Rは(メタ)アクリロイル基を有する有機官能基であり、Aはアルキル基、Xはアルコキシル基又はハロゲン原子、m及びnはm+nが1〜3の整数であることを満たし、mは0または1、nは0〜3の整数)で表されるシラン化合物で処理されていることがよく、シリカ微粒子の配合量は、シリコーン樹脂組成物に対し1〜70重量%であることが望ましい。
一般式(1)中、Rは(メタ)アクリロイル基を有する有機官能基であり、nは8、10又は12であるが、Rは下記一般式(9)で表される有機官能基であることが好ましい。一般式(9)中、mは1〜3の整数であり、R1は水素原子又はメチル基である。
(式中、Zは(2a)又は(2b)で表される何れかの基を示し、Rは水素又はメチル基を示す)で表され、Zが式(2a)表される基である場合の具体的な化合物としては、Rが水素であるペンタシクロ[6.5.1.13,6.02,7.09,13]ペンタデカンジメチロールジアクリレート、Zが式(2b)で表される基である場合の具体的な化合物としてはRが水素であるジシクロペンタニルジメチロールジアクリレート(又は、トリシクロ[5.2.1.02,6]デカンジメチロールジアクリレート)を例示することができる。
撹拌機、滴下ロート、温度計を備えた反応容器に、溶媒として2−プロパノール(IPA)40mlと塩基性触媒として5%テトラメチルアンモニウムヒドロキシド水溶液(TMAH水溶液)を装入した。滴下ロートにIPA 15mlと3−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング・シリコーン株式会社製SZ-6030)12.69gを入れ、反応容器を撹拌しながら、室温で3−メタクリロキシプロピルトリメトキシシランのIPA溶液を30分かけて滴下した。3−メタクリロキシプロピルトリメトキシシラン滴下終了後、加熱することなく2時間撹拌した。2時間撹拌後溶媒を減圧下で溶媒を除去し、トルエン50mlで溶解した。反応溶液を飽和食塩水で中性になるまで水洗した後、無水硫酸マグネシウムで脱水した。無水硫酸マグネシウムをろ別し、濃縮することで加水分解生成物(シルセスキオキサン)を8.6g得た。このシルセスキオキサンは種々の有機溶剤に可溶な無色の粘性液体であった。
実施例1
実施例2〜6
次に、ロールコーターを用いて、厚さ0.4mmになるようにキャスト(流延)し、30W/cmの高圧水銀ランプを用い、8000mJ/cm2の積算露光量で硬化させ、所定の厚みとしたシート状のシリコーン樹脂成形体を得た。
A:シリカ固形分
B:3−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング・シリコーン株式会社製SZ−6030)
C:シリコーン樹脂組成物1(合成例1で得られた化合物:25重量部、ジペンタエリスリトールヘキサアクリレート:75重量部)
D:シリコーン樹脂組成物2(合成例1で得られた化合物:25重量部、ペンタエリスリトールトリアクリレート:75重量部)
E:シリコーン樹脂組成物3(合成例1で得られた化合物:25重量部、グリセリンジメタクリレート:75重量部)
F:シリコーン樹脂組成物4(合成例1で得られた化合物:25重量部、ペンタエリスリトールトリアクリレート:55重量部、グリセリンジメタクリレート:20重量部)
G:1−ヒドロキシシクロヘキシルフェニルケトン(重合開始剤)
2)全光線透過率(参考規格JIS K 7361-1):試料厚み0.4mm)
3)線膨張係数:熱機械的分析法、昇温速度昇温速度5℃/min、圧縮荷重0.1N
5)成形性:樹脂30gをキャストし荷重40kgで18分後に硬化して得た成形物の厚みが、所定の±5%未満で○、±10%未満で△、±10%以上で×とした。
Claims (9)
- 一般式(1)、
[RSiO3/2]n (1)
但し、Rは(メタ)アクリロイル基を有する有機官能基であり、nは8、10又は12である;
で表され、構造単位中に籠型構造を有するポリオルガノシルセスキオキサンを主たる成分とする籠型シリコーン樹脂と、分子中に−R3−CR4=CH2又は−CR4=CH2
但し、R3はアルキレン基、アルキリデン基又は−OCO−基を示し、R4は水素又はアルキル基を示す;
で表される不飽和基を少なくとも2個含み前記シリコーン樹脂とラジカル共重合が可能な不飽和化合物を、10:90〜80:20の重量割合で配合したシリコーン樹脂組成物中に、平均粒子径が1〜100nmの微粒子シリカを5〜70重量%の範囲で含有することを特徴とするシリカ含有シリコーン樹脂組成物。 - シリコーン樹脂が、一般式(3)、
RSiX3 (3)
但し、Rは(メタ)アクリロイル基を有する有機官能基であり、Xは加水分解性基を示す;
で表されるケイ素化合物を極性溶媒及び塩基性触媒存在下で加水分解反応させると共に一部縮合させ、得られた加水分解生成物を更に非極性溶媒及び塩基性触媒存在下で再縮合させて得られたものであり、分子中のケイ素原子数と(メタ)アクリロイル基数が等しく、且つ籠型構造を有するものである請求項1記載のシリカ含有シリコーン樹脂組成物。 - 微粒子シリカが、0.1〜80重量%のシラン化合物で処理されている請求項1記載のシリカ含有シリコーン樹脂組成物。
- シラン化合物が下記一般式(5)
RmSiAnX4-m−n (5)
但し、Rは(メタ)アクリロイル基を有する有機官能基であり、Aはアルキル基、Xはアルコキシル基又はハロゲン原子、m及びnはm+nが1〜3の整数であることを満たし、mは0又は1、nは0〜3の整数である;
で表される請求項4記載のシリカ含有シリコーン樹脂組成物。 - 請求項1〜5のいずれかに記載のシリカ含有シリコーン樹脂組成物をラジカル共重合させて得られるシリカ含有シリコーン樹脂共重合体組成物。
- 請求項1〜5のいずれかに記載のシリカ含有シリコーン樹脂組成物を、ラジカル共重合させて得られた樹脂成形体。
- 樹脂成形体の線膨張係数が40ppm/K以下、全光線透過率が85%以上且つガラス転位温度が300℃以上である請求項7記載の樹脂成形体。
- 請求項1〜5のいずれかに記載のシリカ含有シリコーン樹脂組成物を、加熱又はエネルギー線を照射してラジカル共重合させることを特徴とする樹脂成形体の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006537692A JP5000303B2 (ja) | 2004-09-27 | 2005-09-21 | シリカ含有シリコーン樹脂組成物及びその成形体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004279508 | 2004-09-27 | ||
JP2004279508 | 2004-09-27 | ||
JP2006537692A JP5000303B2 (ja) | 2004-09-27 | 2005-09-21 | シリカ含有シリコーン樹脂組成物及びその成形体 |
PCT/JP2005/017368 WO2006035646A1 (ja) | 2004-09-27 | 2005-09-21 | シリカ含有シリコーン樹脂組成物及びその成形体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006035646A1 JPWO2006035646A1 (ja) | 2008-07-31 |
JP5000303B2 true JP5000303B2 (ja) | 2012-08-15 |
Family
ID=36118795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006537692A Expired - Fee Related JP5000303B2 (ja) | 2004-09-27 | 2005-09-21 | シリカ含有シリコーン樹脂組成物及びその成形体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5000303B2 (ja) |
KR (1) | KR100991025B1 (ja) |
CN (1) | CN100545184C (ja) |
TW (1) | TWI388629B (ja) |
WO (1) | WO2006035646A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008065862A1 (fr) * | 2006-12-01 | 2008-06-05 | Konica Minolta Opto, Inc. | Matériau de dispositif optique en matière plastique, dispositif optique en matière plastique fait à partir de celui-ci et dispositif de capture optique |
JP5413195B2 (ja) | 2007-09-28 | 2014-02-12 | 旭硝子株式会社 | 微細パターン形成体、微細パターン形成体の製造方法、光学素子および光硬化性組成物 |
JP5283885B2 (ja) * | 2007-10-23 | 2013-09-04 | コリア エレクトロテクノロジー リサーチ インスティテュート | 高分子樹脂と疎水化された無機物とで形成された有機無機ハイブリッド材料の製造方法、およびこれにより製造された材料 |
TWI499619B (zh) * | 2007-12-27 | 2015-09-11 | Nippon Steel & Sumikin Chem Co | Containing a curable poly cage-shaped structure of silicon oxide copolymer and its manufacturing method and use of the cage structure-containing curable silicon oxide copolymer of poly curable resin composition and cured |
CN101910224B (zh) | 2007-12-28 | 2012-11-14 | 3M创新有限公司 | 纳米粒子、乙烯基单体和有机硅的共聚物 |
JP2011508058A (ja) | 2007-12-28 | 2011-03-10 | スリーエム イノベイティブ プロパティズ カンパニー | ナノ粒子、ビニルモノマー、及びシリコーンのコポリマー |
KR20110002004A (ko) | 2008-04-08 | 2011-01-06 | 아사히 가라스 가부시키가이샤 | 와이어 그리드형 편광자의 제조 방법 |
JP2011246548A (ja) * | 2010-05-25 | 2011-12-08 | Showa Denko Kk | 硬化性樹脂組成物および透明フィルム |
SG187800A1 (en) | 2010-08-13 | 2013-04-30 | Asahi Kasei E Materials Corp | Photosensitive silicone resin composition |
JP5844796B2 (ja) * | 2011-03-31 | 2016-01-20 | 新日鉄住金化学株式会社 | 硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物 |
JP2013129766A (ja) * | 2011-12-22 | 2013-07-04 | Nippon Steel & Sumikin Chemical Co Ltd | ガラス繊維複合化樹脂基板 |
JP2013163789A (ja) * | 2012-02-13 | 2013-08-22 | Asahi Kasei E-Materials Corp | 感光性シリコーン樹脂組成物 |
JP5655992B2 (ja) * | 2012-08-03 | 2015-01-21 | マツダ株式会社 | 透明積層体及びその製造方法 |
JP6021605B2 (ja) * | 2012-11-19 | 2016-11-09 | 新日鉄住金化学株式会社 | かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物 |
IT201600108121A1 (it) * | 2016-10-26 | 2018-04-26 | Pirelli | Nuovi materiali di rinforzo, composizioni elastomeriche e pneumatici per ruote di veicoli che li comprendono |
KR102412888B1 (ko) * | 2017-05-12 | 2022-06-28 | 삼성디스플레이 주식회사 | 하드코팅용 조성물, 및 하드코팅층을 포함하는 윈도우 부재 |
CN113396169A (zh) * | 2019-02-08 | 2021-09-14 | 日铁化学材料株式会社 | 光硬化性硅酮树脂组合物及由其硬化成的硅酮树脂成形体以及所述成形体的制造方法 |
CN112225534B (zh) * | 2020-10-25 | 2022-05-03 | 湖南长重机器股份有限公司 | 一种高强度多孔陶粒及其制备方法 |
KR20230096008A (ko) * | 2020-10-29 | 2023-06-29 | 스미또모 가가꾸 가부시키가이샤 | 경화성 조성물 |
KR102497162B1 (ko) * | 2020-12-03 | 2023-02-06 | 홍익대학교 산학협력단 | 섬유강화 아크릴 수지로 제조된 폐사가축 저장용 탱크 및 이의 제조방법 |
CN118369387A (zh) * | 2021-12-22 | 2024-07-19 | 日铁化学材料株式会社 | 光固化性有机硅树脂组合物、其固化物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS581756A (ja) * | 1981-06-01 | 1983-01-07 | ゼネラル・エレクトリツク・カンパニイ | Uv硬化性組成物、被覆物品およびその製法 |
WO2002083764A1 (fr) * | 2001-04-09 | 2002-10-24 | Sekisui Chemical Co., Ltd. | Composition photoreactive |
JP2004004612A (ja) * | 2002-03-28 | 2004-01-08 | Chisso Corp | 液晶表示パネル用シール材料 |
JP2004143449A (ja) * | 2002-09-30 | 2004-05-20 | Nippon Steel Chem Co Ltd | 官能基を有するかご型シルセスキオキサン樹脂とその製造方法 |
JP2004314468A (ja) * | 2003-04-17 | 2004-11-11 | Sumitomo Chem Co Ltd | 硬化被膜が形成された透明基材及びそのための硬化性組成物 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60031134T2 (de) * | 1999-08-04 | 2007-08-16 | Hybrid Plastics, Fountain Valley | Verfahren zur herstellung polyhedrischer oligomerer silsesquioxane |
JP3321563B2 (ja) * | 1999-08-06 | 2002-09-03 | 株式会社山勝 | ピアス |
JP4381636B2 (ja) * | 2001-11-05 | 2009-12-09 | 新日鐵化学株式会社 | シリコーン樹脂組成物及びシリコーン樹脂成形体 |
TW200502279A (en) * | 2003-02-27 | 2005-01-16 | Ube Nitto Kasei Co | Method for producing polyorganosiloxane particles and method for producing silica particles |
CN100339408C (zh) * | 2003-03-27 | 2007-09-26 | 新日铁化学株式会社 | 硅树脂组合物及其模塑体 |
-
2005
- 2005-09-21 CN CNB2005800325854A patent/CN100545184C/zh not_active Expired - Fee Related
- 2005-09-21 KR KR1020077009572A patent/KR100991025B1/ko active Active
- 2005-09-21 WO PCT/JP2005/017368 patent/WO2006035646A1/ja active Application Filing
- 2005-09-21 JP JP2006537692A patent/JP5000303B2/ja not_active Expired - Fee Related
- 2005-09-23 TW TW094133138A patent/TWI388629B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS581756A (ja) * | 1981-06-01 | 1983-01-07 | ゼネラル・エレクトリツク・カンパニイ | Uv硬化性組成物、被覆物品およびその製法 |
WO2002083764A1 (fr) * | 2001-04-09 | 2002-10-24 | Sekisui Chemical Co., Ltd. | Composition photoreactive |
JP2004004612A (ja) * | 2002-03-28 | 2004-01-08 | Chisso Corp | 液晶表示パネル用シール材料 |
JP2004143449A (ja) * | 2002-09-30 | 2004-05-20 | Nippon Steel Chem Co Ltd | 官能基を有するかご型シルセスキオキサン樹脂とその製造方法 |
JP2004314468A (ja) * | 2003-04-17 | 2004-11-11 | Sumitomo Chem Co Ltd | 硬化被膜が形成された透明基材及びそのための硬化性組成物 |
Also Published As
Publication number | Publication date |
---|---|
WO2006035646A1 (ja) | 2006-04-06 |
TW200615334A (en) | 2006-05-16 |
CN101027330A (zh) | 2007-08-29 |
JPWO2006035646A1 (ja) | 2008-07-31 |
TWI388629B (zh) | 2013-03-11 |
CN100545184C (zh) | 2009-09-30 |
KR100991025B1 (ko) | 2010-10-29 |
KR20070058665A (ko) | 2007-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5000303B2 (ja) | シリカ含有シリコーン樹脂組成物及びその成形体 | |
JP4558643B2 (ja) | シリコーン樹脂組成物及びその成形体 | |
JP4381636B2 (ja) | シリコーン樹脂組成物及びシリコーン樹脂成形体 | |
JP6021605B2 (ja) | かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物 | |
JP5433426B2 (ja) | シリコーン樹脂の製造方法及びこのシリコーン樹脂を含んだ硬化型樹脂組成物 | |
WO2013146477A1 (ja) | シリカ含有コーティング用樹脂組成物及び積層体 | |
WO2013094585A1 (ja) | ガラス繊維複合化樹脂基板 | |
CN1754915A (zh) | 有机硅树脂组合物及成型体 | |
US20070260008A1 (en) | Silica-Containing Silicone Resin Composition and Its Molded Product | |
JPWO2010073445A1 (ja) | 活性エネルギー線硬化型組成物、活性エネルギー線硬化型コーティング材及び成形品 | |
JP5844796B2 (ja) | 硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物 | |
JP5073738B2 (ja) | レンズ | |
WO2014054256A1 (ja) | 反射材用組成物及びこれを用いた光半導体発光装置 | |
JP5385832B2 (ja) | 硬化型樹脂組成物及びこれから得られる成形体 | |
JP2006307088A (ja) | 樹脂組成物、及びそれを用いた光学部材とその製造方法 | |
CN114656878A (zh) | 硅酮树脂组合物、成形体、层叠体及成形体的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111011 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120515 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120516 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5000303 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150525 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150525 Year of fee payment: 3 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150525 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |