JP4995003B2 - Electronic component package manufacturing apparatus and manufacturing method - Google Patents

Description

  The present invention relates to an electronic component package manufacturing apparatus and manufacturing method for manufacturing an electronic component package hermetically sealed by joining a base member and a lid member by a sealing member by high-frequency induction heating.

  Small electronic components formed by hermetically sealing a crystal resonator are widely used for mobile phones or other mobile communications. Such a hermetically sealed electronic component is generally a sealing member in which a crystal resonator is fixed to a base member (package member) with a conductive adhesive and is previously formed on a lid member (lid or cap). The base member is overlaid with a lid member, and is hermetically sealed by seam bonding in a vacuum or the like. As mobile phones and the like are miniaturized, these hermetically sealed electronic components are also increasingly required to be miniaturized. For example, the lid member is a small package type electronic device with a side of 1.5 to 1 mmφ. There is an increasing demand for parts.

  In order to manufacture such a minute hermetically sealed electronic component, parallel seam joining, in which a pair of widely used roller electrodes are rolled along a lid member, has become difficult at the same time. Since parallel seam bonding must be performed individually, parallel seam bonding cannot be shortened any more, and there is a problem that it is difficult to reduce costs in the manufacturing process. As a method for solving this problem, an induction heating method has been already proposed in which a sealing member is melted by high-frequency induction heating and a lid member is joined to a base member to manufacture an airtight sealed electronic component ( For example, see Patent Documents 1 to 4).

Patent Document 1 discloses a technical idea that electromagnetic induction heating can be used as an example of a heating unit for hermetically sealing a piezoelectric element, but does not describe a specific example of electromagnetic induction heating. . In Patent Document 2, a metal material having a high magnetic permeability is used for the lid member, and the heating temperature is controlled by utilizing the fact that the magnetic permeability decreases when the Curie temperature is reached. At this time, an example in which a weight is applied to the lid member by the pressing member is described. Patent Document 3 describes that a brazing material applied to a metal lid member constituting a piezoelectric component is directly hermetically sealed by high-frequency induction heating in a vacuum atmosphere of 1 × 10 ⁵ Pascal or less or a nitrogen atmosphere of 95% or more. Has been. Further, Patent Document 4 describes that the induction heating method is used for soldering the semiconductor component, although it is not hermetic sealing of the package of the electronic component, and the semiconductor component on which the solder is formed is placed on the upper side of the parallel induction heating coil. An example in which solder is melted and soldered while being conveyed is described.
JP 07-283675 A JP 2002-246868 A JP 2006-129185 A JP 2005-150142 A

  In general, the method by high frequency induction heating is not limited to the high frequency induction heating method disclosed in the above-mentioned Patent Documents 1 to 4, but when heating a small object to be heated such as an electronic component, it seems to exist in a high frequency electromagnetic field. It arrange | positions in and becomes a form which heats the whole to-be-heated material. The sealing member made of AuSn alloy or low-melting glass is melted by the heating action of the high-frequency electromagnetic field. At this time, the lid member made of a metal material with high magnetic permeability is naturally a crystal resonator or a piezoelectric member on the base member. A conductive adhesive for bonding the elements, or a solder material for soldering an electronic component element such as a semiconductor element to the base member together with the crystal resonator or the piezoelectric element is also heated together. Therefore, it does not adversely affect the electronic component element such as the crystal resonator or the piezoelectric element bonded to the base member, and the semiconductor element is soldered to the base member together with the crystal resonator or the piezoelectric element. Great care must be taken to ensure that the solder material does not melt.

  However, recently, the Pb-free solder material used in the soldering process of the assembly process of electronic equipment may have a melting point higher by several tens of degrees than the solder of the PbSn alloy, and is made of AuSn alloy or low-melting glass. If the sealing member is not tightly sealed as a whole, the sealing member partially melts and flows out when soldering when assembling the electronic device. Hermetic sealing is reduced, and electronic devices such as mobile phones may be defective. In order to realize a highly reliable hermetic seal, the wettability between the sealing member melted by induction heating and the base member or the lid member is improved, and the molten sealing member is interposed between the base member and the lid member. It is necessary to protrude from the whole and form a fillet. In order to achieve such high reliability and hermetic sealing with high soldering strength, that is, high bonding strength, the conventional high-frequency induction heating method requires long induction heating at a high temperature, for example, several seconds or more. There wasn't. However, if induction heating at high temperature is performed for a long time, it may adversely affect the characteristics such as the oscillation frequency of the crystal unit and the wiring. Therefore, there are problems with other induction heating conditions. And the lid member are difficult to hermetically seal.

  Therefore, the present invention provides low power induction heating that raises the temperature of a sealing member such as AuSn or low-melting glass used for hermetically sealing the base member and the lid member relatively slowly, and sealing such as AuSn. Combined with high power induction heating that raises the temperature of the member with a steep slope compared to the low power induction heating, the high power induction heating is preferably performed in a short time of 1 second or less, the low power induction heating is A high-quality hermetically sealed electronic component can be obtained without adversely affecting the solder material of the base member, the electronic component element, etc. by performing the time longer than the time of the high power induction heating, preferably several seconds. It features.

  According to a first aspect of the present invention, there is provided a heating coil that performs high-frequency induction heating of a base member and a lid member to which an electronic component element is attached, a high-frequency power supply device that supplies high-frequency power to the heating coil, the base member, An electronic component package comprising: a pressing member that presses against the lid member; wherein the sealing member positioned between the base member and the lid member is melted to hermetically seal the base member and the lid member In the apparatus, the high-frequency power supply device is capable of high-power induction heating time in a high-power mode that can rapidly raise the sealing member to a temperature that does not reach the oscillation abnormality occurrence temperature that starts to cause abnormality in the oscillation of the electronic component element. A function of supplying high-frequency power to the heating coil and a low power supply mode capable of gradually raising the temperature of the sealing member as compared with the high power induction heating. And a function of supplying high-frequency power to the heating coil with a low power induction heating time longer than the high power induction heating time, and switching from the low power supply mode to the high power mode, or the large power mode. There is provided an electronic component package manufacturing apparatus having a sequence for switching from a power mode to the low power supply mode.

  According to a second invention, in the first invention, the low-power induction heating time is a predetermined time exceeding 1 second, and the high-temperature induction heating time is a predetermined time of 1 second or less. A package manufacturing apparatus is provided.

  According to a third invention, in the first invention or the second invention, the heating coil is composed of conductors folded back so as to be parallel to each other at a predetermined interval larger than the width of the lid member. An apparatus for manufacturing an electronic component package, which is a parallel coil and extends in a direction perpendicular to a supply direction of the base member and the lid member.

  In a fourth invention according to any one of the first invention to the third invention, the pressing member is disposed at the predetermined interval between the conductors of the heating coil, and the upper surface of the lid member It has an area equal to or larger than that, and has a pressing surface that can uniformly suppress the entire surface of the lid member when the base member and the lid member are positioned between the conductors of the heating coil. An electronic component package manufacturing apparatus is provided.

  In a fifth aspect based on any one of the first aspect to the fourth aspect, the base member and the lid member are sequentially conveyed at a predetermined interval with respect to the heating coil, and the predetermined interval Provides an apparatus for manufacturing an electronic component package that is longer than a distance at which the next lid member does not move by the high-frequency magnetic force of the heating coil during the hermetic sealing.

  In a sixth aspect based on any one of the first aspect to the fifth aspect, the base member and the lid member are placed on a tray and sequentially conveyed by a conveyance member, and the base member and the lid member are When the heating coil stops between the parallel conductors of the heating coil, the pressing member descends or the tray rises, and the pressing member presses the lid member, and the high-frequency power supply device synchronizes with the pressing member. Provides a high-frequency power to the heating coil.

  A seventh invention provides the electronic component package manufacturing apparatus according to any one of the first to sixth inventions, wherein the pressing member is made of a heat-resistant nonmagnetic material.

  According to an eighth aspect of the present invention, high frequency induction is applied to the heating coil to apply high frequency induction heating to the base member and the lid member to which the electronic component element is attached, and the sealing is located between the base member and the lid member. In a method of manufacturing an electronic component package that is hermetically sealed by melting a member and joining the base member and the lid member, a large electric power that can raise the temperature of the sealing member with a steep slope is supplied. Performing a high power induction heating step and a low power induction heating step for gradually increasing the temperature of the sealing member as compared with the high power induction heating step before or after the high power induction heating step, When the temperature of the sealing member is increased in the low power induction heating step, the low power induction heating step is switched to the high power induction heating step, or the high power induction heating step is When the temperature of the attaching member is increased, the high power induction heating step is switched to the low power induction heating step, and each of the sealing members starts to cause an abnormality in oscillation of the electronic component element. And the low power induction heating step is performed for a longer time than the high temperature induction heating step, so that the base member or the lid member on which the sealing member is brazed is wetted with respect to the conductive portion. Provided is a method of manufacturing an electronic component package, which is characterized by improving performance.

  In a ninth aspect of the electronic component package according to the eighth aspect, the low power induction heating step is performed for a predetermined time exceeding 1 second, and the high temperature induction heating step is performed for a predetermined time of 1 second or less. A manufacturing method is provided.

  According to the electronic component package manufacturing apparatus according to the first aspect of the present invention, the low power induction heating step for gradually increasing the temperature of the sealing member, and the temperature of the sealing member at a steep slope compared to the low power induction heating. Combined with a high power induction heating step to raise, high power induction in a high power mode capable of rapidly raising the sealing member to a temperature that does not reach the oscillation abnormality occurrence temperature that begins to cause abnormality in the oscillation of the electronic component element according to the sequence Soldering material and wiring that solders the electronic component element to the base member without adversely affecting the characteristics of the electronic component element in a short time because it performs heating and low power induction heating that improves the wettability of the sealing member The electronic component package can be hermetically sealed without adversely affecting the manufacturing process, and the life of the manufacturing apparatus can be extended.

  According to the electronic component package manufacturing apparatus of the second invention, in addition to the effects obtained in the first invention, the high temperature induction heating time is a short time of 1 second or less, and the low power induction heating time is Since the wettability of the sealing member is improved in a time longer than the high-temperature induction heating time, it is possible to provide an electronic component package with more stable bonding strength.

  According to the third aspect of the invention, in addition to the effect obtained in the first aspect or the second aspect, the parallel type coil has a direction in which the base member and the lid member are sequentially and intermittently conveyed. Therefore, a plurality of base members and lid members can be joined at a time, and efficient hermetic sealing is possible.

  According to the fourth invention, in addition to the effects obtained in the first to third inventions, the pressing member uniformly suppresses the entire surface of the lid member, so that the heating of the lid member becomes uneven. Since there is almost no uniformity, the wettability between the base member or the lid member and the sealing member becomes uniform as a whole, and the melting and spreading of the sealing member become uniform as a whole. Highly reliable hermetic sealing is possible.

  According to the fifth aspect of the invention, in addition to the effects obtained in the first to fourth aspects of the invention, the distance between the front and back of the base member and the lid member, which are sequentially and intermittently conveyed, is determined when the heating is performed. Since the base member is placed on the tray so that the next lid member is not displaced by the high-frequency magnetic force of the coil for use, the sealing operation can be sequentially performed without taking special measures.

  According to the sixth invention, in addition to the effects obtained in the first to fifth inventions, when the base member and the lid member are conveyed to a predetermined position of a parallel coil and stopped, Since the pressing member presses the base member and the lid member, the lid member will not be displaced or detached due to the action of magnetic force during high-frequency induction heating, so the sealing process should be performed efficiently. Can do.

  According to the seventh aspect of the invention, in addition to the effects obtained in the first to sixth aspects of the invention, since the pressing member is made of a nonmagnetic material, the temperature is particularly increased by the high frequency induction heating action. Therefore, the pressing member does not act as a heating body, does not adversely affect the characteristics of the electronic component element, and does not adversely affect the solder material or wiring for soldering the electronic component element to the base member.

  According to the method of manufacturing an electronic component package according to the eighth aspect of the present invention, the low power induction heating step for gradually increasing the temperature of the sealing member, and the temperature of the sealing member at a steep slope as compared with the low power induction heating. Combined with a high power induction heating process that raises and improves the wettability of the sealing member by low power induction heating, so even if the high power induction heating process is performed in a short time, the sealing strength of the entire sealing part is uniform Since the high power induction heating time is shorter than before, the characteristics of the electronic component elements are not adversely affected, and the electronic component elements are adversely affected by the solder material and wiring that are soldered to the base member. Can be provided.

  According to the ninth aspect, in addition to the effects obtained in the eighth aspect, when the low power induction heating step is performed prior to the high power induction heating step, the wettability is first improved. Heating is performed with a small electric power that is a fraction of the large heating power in the high-power induction heating process, and the high-power induction heating process is switched to the high-power induction heating process so as to rapidly increase to a temperature that does not reach the oscillation abnormality occurrence temperature of the sealing member. Compared with the case where the temperature is rapidly increased to a temperature exceeding the melting temperature of the sealing member, the influence of mechanical stress due to the thermal expansion of each member can be reduced, and a highly reliable hermetic sealing can be realized. In addition, when the high power induction heating process is performed prior to the low power induction heating process, the temperature of the sealing member is increased with a steep slope and then gradually increased. Thus, it is possible to provide an electronic component package manufacturing method with high reliability.

[Embodiment 1]
A method for manufacturing an electronic component package according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1A is a diagram for explaining an example of the high-frequency induction heating power supply according to the present invention, and FIG. 1B shows an example of the temperature rise in the vicinity of the sealing member due to the high-frequency induction heating power supply. FIG. FIG. 2 shows a base member and a lid member having a general structure that are sealed by a manufacturing method using high frequency induction heating according to the present invention.

  First, the base member 1 shown in FIG. 2 is a container or a flat plate-like member in which a quartz vibrator or a piezoelectric vibrator (not shown) is fixed with a conductive adhesive, and is made of an electrically insulating material such as ceramic. The lid member 2 is called a lid or cap formed by plating gold (Au) or nickel (Ni) on both sides of the Kovar, and is made of gold-tin alloy (Au-Sn) or low melting point glass. Such a sealing member 3 is formed in advance. Generally, a portion to be sealed of the base member 1 is a metallized conductive portion 1A, and the conductive portion 1A is brazed, that is, joined to the lid member 2 by the sealing member 3. In the first embodiment, the sealing member 3 is formed on the lid member 3 in advance, but may be formed on the base member 1. The base member 1 and the lid member 2 may be general ones and will not be described in further detail.

  As shown in FIG. 1A, the high-frequency induction heating of the present invention comprises a low-power induction heating H1 and a high-power induction heating H2, and the time T1 required for the low-power induction heating H1 is a requirement for the high-power induction heating H2. Longer than time T2. As shown in FIG. 1B, the low power induction heating H1 increases the temperature of the lid member 2 and the sealing member 3 to around the melting point Tm (temperature indicated by the broken line) of the sealing member 3 with a relatively gentle inclination. Let Compared with the low power induction heating H1, the high power induction heating H2 raises the temperature of the lid member 2 and the sealing member 3 with a steep slope so as not to reach the oscillation abnormality occurrence temperature Ta. Here, although melting | fusing point Tm of the sealing member 3 changes with sealing members, the thing in the range of about 300 degreeC +/- 30 degreeC is common. For the convenience of actual temperature measurement, the oscillation abnormality occurrence temperature Ta indicates the surface temperature of the lid member 2 when the oscillation of the crystal resonator starts to be abnormal due to the temperature rise, and the lid member 2 and the sealing member It can be considered that the temperature of 3 is substantially the same. In the case of the present invention, since the induction heating time is short, the rising temperature of the crystal resonator is lower than the rising temperature of the lid member 2 and the sealing member 3. The oscillation abnormality occurrence temperature Ta varies depending on the crystal resonator. The oscillation abnormality occurrence temperature Ta is an example. In the case of a piezoelectric element, the abnormality occurrence temperature at which an abnormality starts to occur in the vibration frequency, a conductive adhesive that bonds the crystal unit or the piezoelectric element to the base member 1, or other It may be a temperature at which the solder for soldering the electronic component element to the base member 1 starts to be adversely affected by melting or the like.

  The power in the case of the low power induction heating H1 is about 15 to 30% of the rated value in an example of the power supply for high frequency induction heating, and the required time T1 depends on the value of the heating power, but the base member 1 2 seconds or more in order to make the wettability between the conductive portion 1A and the sealing member 3 satisfactory, preferably when the temperature rise starts to saturate and the inclination begins to become gentle (for example, about 3 seconds or more) After that. After the time point when the temperature rise starts to become gentle, the wettability between the conductive portion 1A of the base member 1 and the sealing member 3 becomes sufficiently high. In FIG. 1 (A), since it is schematically shown, the power of the low power induction heating H1 is shown flat after rising, but gradually, for example, continuously in a range of about 10% or less of the rated value. Or may be raised step by step. In this case, the required time T1 of the low power induction heating H1 can be shortened according to the increase of the power.

  The required time T2 of the high power induction heating H2 increases the temperature of the sealing member 3 with a steep slope so as not to reach the temperature that does not adversely affect the electronic component element, that is, the oscillation abnormality occurrence temperature Ta in FIG. It is a time required for this, and it is preferably a short time of about 1 second or less. The high power induction heating H2 is performed with a set power within the range of about 80% of the rated power of the high frequency heating device. Since the high power induction heating H2 raises the temperature of the lid member 2 and the sealing member 3 with a steep slope, the time required for the high frequency induction heating can be completed in a short time. For example, even with only the low power induction heating H1, the temperature of the lid member 2 and the sealing member 3 can be gradually increased to the vicinity of the oscillation abnormality occurrence temperature Ta exceeding the melting temperature of the sealing member 3, In order to obtain a satisfactory hermetic seal with uniform bonding strength, for example, a long time of about 10 seconds or more is required.

  If it takes too much time in this way, the time over which the melting point Tm of the sealing member 3 is exceeded becomes too long, so that the conductive adhesive or solder that attaches the electronic component element to the base member melts. In addition, there is a greater possibility that a problem of adversely affecting the wiring or the like will occur. Therefore, in the first embodiment, the temperature of the lid member 2 and the sealing member 3 is gradually increased to around the melting temperature of the sealing member 3 over a period of 2 to 5 seconds by the low power induction heating H1. Thus, the wettability between the conductive portion 1A of the base member 1 and the sealing member 3 is improved, and the high power induction heating H2 is performed for a short time in a state where the wettability is good. The high-power induction heating H2 melts the sealing member 3 by raising the temperature with a steep inclination in a short time of about 1 second or less. The molten sealing member 3 includes the conductive portion 1A of the base member 1 and the lid member 2. And is brazed to the conductive portion 1A of the base member 1 in a state where a fillet is formed on the joint surface between the base member 1 and the lid member 2. Therefore, in the first embodiment, the bonding strength does not occur without causing the problem that the conductive adhesive that attaches the electronic component element to the base member is fluidized or the solder is melted, and further the wiring is adversely affected. A uniform and good hermetic sealing structure can be obtained.

  In the actual high frequency induction heating, there is a time delay between the control of the heating power and the temperature change, but in order to make the explanation easy to understand in FIG. 1, the low power induction heating H1 and the high power induction heating are used. It is illustrated that the temperatures of the lid member 2 and the sealing member 3 change in synchronization with H2. In the above description, the high power induction heating H2 is preferably about 1 second or less, but in the case of power lower than the rated power, for example, 70 to 80% of the rated power, it may slightly exceed 1 second, In this case, the temperature rise is a little slower than the rated power, so the induction heating time is somewhat longer, but the power is reduced before the oscillation abnormality occurrence temperature Ta is reached in consideration of the temperature rise time delay. By doing so, it is possible to obtain a favorable hermetic sealing structure with uniform bonding strength as described above.

[Embodiment 2]
Next, Embodiment 2 will be described with reference to FIG. In FIG. 3, the same symbols as those used in FIG. 1 indicate the same names. The method of manufacturing an electronic component package by high frequency induction heating according to the second embodiment is characterized in that high power induction heating H2 as described above is performed first, and then low power induction heating H1 is performed. The high-power induction heating H2 and the low-power induction heating H1 have substantially the same functions as those in the first embodiment even if the required time and the magnitude of the power are different, and thus the description thereof is omitted.

  In the second embodiment, since the high power induction heating H2 is performed first, the temperatures of the lid member 2 and the sealing member 3 rise with a steep slope. In FIG. 1B, before the temperature reaches the melting point Tm of the sealing member 3, the high power induction heating H2 is switched to the low power induction heating H1, and before the low power induction heating H1 reaches the oscillation abnormality occurrence temperature Ta. finish. When switched to the low power induction heating H1, the temperature of the lid member 2 and the sealing member 3 gradually rises and ends before the low power induction heating H1 reaches the oscillation abnormality occurrence temperature Ta. The temperature of the sealing member 3 or the like does not reach the oscillation abnormality occurrence temperature Ta. In the second embodiment, since the melted sealing member 3 is maintained at least at an abnormal temperature of the melting point Tm for a few seconds thereafter, the wettability between the conductive portion 1A of the base member 1 and the sealing member 3 is improved. The melted sealing member 3 expands between the conductive portion 1A of the base member 1 and the lid member 2, and forms a fillet on the joint surface between the base member 1 and the lid member 2. Therefore, even in the second embodiment, a good hermetic sealing structure with uniform bonding strength is obtained without causing the problem that the conductive adhesive that attaches the electronic component element to the base member is fluidized or the solder melts. Obtainable.

  Note that the high power induction heating H2 is preferably finished before or after the melting point Tm of the sealing member 3, but may be finished before reaching the oscillation abnormality occurrence temperature Ta in consideration of the time delay of the temperature rise. Therefore, the required time T2 of the high power induction heating H2 may slightly exceed 1 second. In this case, in the low power induction heating H1, the power is controlled so that the temperature increased by the high power induction heating H2 does not exceed the oscillation abnormality occurrence temperature Ta, and the temperature is maintained for a predetermined time, for example, several seconds. Is controlled so as not to fall below the melting point Tm of the sealing member 3. In the low power induction heating H1, the heating power may be reduced stepwise or continuously as long as the oscillation abnormality occurrence temperature Ta is not exceeded and the melting point Tm of the sealing member 3 is not exceeded.

  FIG. 4 shows an example of the lid member 2 particularly suitable for the induction heating method of the present invention. The lid member 2 is composed of a Kovar plate 2A as a base material, a nickel (Ni) film 2B having a thickness of several μm formed on both surfaces by plating or vapor deposition, and gold (Au) formed on the outer surface of the nickel film 2B. And a sealing member 3 made of a gold-tin alloy (Au—Sn) film 2D having a thickness of several tens of μm formed on one of the film 2C and the gold (Au) film 2C. The gold-tin alloy (Au—Sn) film 2D is formed in contact with the nickel (Ni) film 2B, which is a ferromagnetic material, and the temperature of the nickel (Ni) film 2B, which is a ferromagnetic material, is likely to increase due to high-frequency induction heating. Therefore, it acts to promote the temperature rise of the sealing member 3 made of the gold-tin alloy (Au—Sn) film 2D during high-frequency induction heating, and in particular, the sealing member is used for the high power induction heating H2 even in a short time of about 1 second. 3 is rapidly increased, so that hermetic sealing can be satisfactorily performed without adversely affecting the electronic component element or the like.

[Embodiment 3]
Next, an example of a manufacturing apparatus that realizes the electronic component package manufacturing method according to the first and second embodiments will be described with reference to FIGS. FIG. 5 is a diagram showing an outline of a high-frequency induction heating device, and FIG. 6 is a diagram showing a part of an electronic component package manufacturing apparatus according to the present invention. Although not shown in detail, the main body 11 of the power high-frequency oscillation device includes a high-frequency oscillation unit that generates oscillation power of a desired high frequency, a power supply unit that supplies DC power to the high-frequency oscillation unit, and the like. The control terminal unit 12 of the power high-frequency oscillation device is composed of a computer or the like, and in its memory, various data relating to the size of the bonding area of the conductive portion 1A of the base member 1, the metal used to form the conductive portion 1A, It stores various data relating to the size of the joining contact area of the lid member 2, the laminated structure, the metal material, etc., various data relating to the type of the sealing member 3, the area and thickness of the joining portion, and other data. The control terminal unit 12 has a sequence for switching between the low power induction heating H1 and the high power induction heating H2, and controls the heating times T1 and T2 and the respective power values.

  The heating coil head unit 13 of the power high-frequency oscillation device includes a parallel induction heating coil 21 and a pressing member 22 that moves up and down as shown in FIG. 6, and operates as described later. The cooling water circulation pump 14 flows the cooling water through the cooling pipe 15 to cool the main body 11 of the power high-frequency oscillation device, and further flows the cooling water through the cooling pipe 16 to cool the induction heating coil 21 of the power high-frequency oscillation device. . FIG. 6A is an explanatory view of the heating coil head portion 13 as viewed from above, and FIG. 6B is a cross-sectional view thereof. The parallel induction heating coil 21 bends one conductor at a predetermined radius, and the two bent conductors 21A and 21B are parallel to each other at a substantially predetermined interval, so that electric insulation such as ceramic in the heating coil head 13 is obtained. It is supported by members. Although not shown, the two parallel conductors 21 </ b> A and 21 </ b> B are connected to a high-frequency conductor extending from the main body 11 in the heating coil head 13.

  As shown in FIG. 6A, the parallel induction heating coil 21 of this embodiment has parallel portions of a length that can be hermetically sealed by induction heating of the 10 base members 1 and the lid member 2 simultaneously. The two conductors 21A and 21B in the parallel portion have a gap larger than the width of the base member 1 and the lid member 2 as shown in FIG. Thus, by making the space | interval of the two conductors 21A and 21B of a parallel part larger than the width | variety of the base member 1 and the cover member 2, the sealing member 3 located between the base member 1 and the cover member 2 of FIG. The induction heating of the edge portion is performed well, and the sealing strength is more uniformly improved.

  The pressing member 22 positioned above the lid member 2 is preferably made of a heat-resistant electric insulating material such as ceramic. The pressing member 22 is not particularly limited in shape and structure, but is a pressing member having a width smaller than the interval between the two parallel conductors 21A and 21B of the induction heating coil 21 and having a width equal to or larger than the width of the lid member 2. Part 22A. The lower surface of the pressing portion 22A may be flat or have a large number of fine minute irregularities, but it is desirable to have a lower surface that can press the entire upper surface of the lid member 2 substantially uniformly. In this case, since the lower surface of the pressing portion 22A that is not heated by the high frequency induction substantially uniformly presses the entire upper surface of the lid member 2, the lid member 2 is not substantially heated by the pressing portion 22A, and the high frequency induction heating is performed. Thus, the lid member 2 does not substantially vary in temperature, and the temperature of the entire surface is uniform.

  That is, the pressing member 22 not only prevents the lid member 2 placed on the base member 1 from being displaced or moved by a magnetic force, but also prevents the sealing member 3 formed in advance on the lid member 2. The temperature rise is made uniform, the sealing member 3 is promoted to be uniformly melted as a whole, and the sealing quality is improved. The pressing member 22 may be fixed at a fixed position, but in the third embodiment, the pressing member 22 can be moved up and down by the lifting mechanism 23. When the row of the base member 1 and the lid member 2 is conveyed to a predetermined position between the parallel conductors 21A and 21B of the parallel induction heating coil 21 and stopped, the lifting mechanism 23 lowers the pressing member 22 to The pressing portion 22A presses the lid member 2 with a predetermined pressing force. For example, when the elevating mechanism 23 is an air cylinder or a hydraulic cylinder, or an electromagnetic elevating mechanism that responds at a higher speed, the lid member 2 is pushed in as the sealing member 3 melts. The effect of improving in this way is also obtained.

  The base member 1 and the lid member 2 are placed on a tray 24, and the tray 24 is intermittently transported by a general transport mechanism (not shown). Although not shown in the figure, the high frequency induction heating is preferably performed in a vacuum chamber. Various configurations have been proposed for transporting the tray to the vacuum chamber, and since these known configurations can be used, description thereof will be omitted. The tray 24 is made of a heat-resistant electrical insulating material such as a ceramic material. The tray 24 shown in FIG. 6 has ten shallow mounting recesses 24A that can position ten base members 1 in one row, and includes five rows. This tray 24 is different from that used in seam welding or the like in that the space between adjacent rows is wide. The distance X between the rows of the mounting recesses 24A is such that the lid member 2 placed in the next row does not move even by the magnetic force generated by the parallel induction heating coil 21 during high-frequency induction heating. It has become. In order to reduce the distance X between the rows, an electromagnetic shield member made of a copper plate or a net connected to a fixed potential (not shown) is provided, and the electromagnetic shield member moves up and down. Then, the lid members 2 in the next row may be shielded from the electromagnetic force of the induction heating coil 21 and the magnetic force may be weakened to such an extent that the lid member 2 is not displaced from the base member 1.

  Next, the operation of this apparatus will be described. The control terminal unit 12 of the power high-frequency oscillation device is configured so that the lifting mechanism 23 first indicates the pressing member 22 in the direction of arrow A2 every time the unillustrated transport mechanism moves intermittently at a predetermined speed in the direction of arrow A1. The lower surface of the pressing portion 22A is brought into contact with the lid member 2 and a predetermined pressure is applied. At this time, a sequence in which the transport mechanism is temporarily stopped when the lid member 2 reaches a predetermined position by a sensor (not shown) and the control terminal unit 12 gives a drive command to the lifting mechanism 23 may be used. Further, for example, when the elevating mechanism 23 is composed of a cylinder device, the control terminal unit 12 gives a drive command to a cylinder device (not shown), advances the cylinder rod with a predetermined stroke, and lowers the pressing portion 22A to lower the lid member 2. A predetermined pressing force is applied to. The pressure applied by the cylinder device is rich in elasticity and responds quickly when the sealing member 3 is melted, which is preferable for obtaining good sealing quality.

  In the case of the first embodiment, almost simultaneously with the pressing member 22 pressing the lid member 2, the control terminal unit 12 gives a drive command to the main body 11 of the power high-frequency oscillation device, and the main body 11 is connected to the induction heating coil 21. A high-frequency current for conducting power induction heating H1 is applied. When the control terminal unit 12 performs the low power induction heating H1 for a predetermined time T1 according to the sequence, the control terminal unit 12 gives a drive command to the main body unit 11 of the power high frequency oscillation device so as to switch to the high power induction heating H2. When the high power induction heating H2 is completed, the elevating mechanism 23 raises the pressing portion 22A in the direction of the arrow A2 ', and the tray 24 is intermittently conveyed in the direction of the arrow A1.

  As described above, the combination of the low power induction heating H1 and the high power induction heating H2 increases the high frequency induction heating time as compared with the case of only the high power induction heating H2, but the high power induction heating H2 is sufficient. Since it is short, uniform and high sealing strength can be obtained without adversely affecting the characteristics of the electronic component element such as a crystal resonator and the solder material for soldering the electronic component element to the base member. In addition, since the plurality of base members 1 and the lid member 2 can be hermetically sealed at a time, the hermetic sealing time per unit can be sufficiently shortened as compared with the conventional seam welding using a roller.

  In the third embodiment, the pressing member 22 moves downward to press the lid member 2, but the tray 24 may move upward to press the lid member 2 against the fixed pressing member 22. In this case, a lifting device (not shown) provided in the lower direction of the induction heating coil 21 is lifted, and is further lifted by supporting the tray on the transport mechanism in the middle of the lifting. Press on. In this case, the induction heating coil 21 is placed away from the transport mechanism by a distance that prevents the magnetic field formed by the induction heating coil 21 from moving the waiting lid member 2, or on the transport mechanism. An electromagnetic shield plate (not shown) that electromagnetically shields the base member 1 and the lid member 2 on and after the next row placed on the tray may be provided horizontally along the tray 24 so as not to contact the lid member 2. .

It is a figure for demonstrating the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a figure which shows an example of the electronic component package of the general structure airtightly sealed with the manufacturing method by the high frequency induction heating of this invention. It is a figure for demonstrating the manufacturing method of the electronic component package which concerns on Embodiment 2 of this invention. It is a figure which shows an example of the cover member especially suitable for the manufacturing method by the induction heating method of this invention. It is a figure which shows an example of the electronic component package of a structure suitable for airtight sealing with the manufacturing method by the high frequency induction heating of this invention. It is a figure for demonstrating an example of the high frequency induction heating part of the manufacturing apparatus of the electronic component package which concerns on this invention.

Explanation of symbols

H1 ... Low power induction heating H2 ... High power induction heating Ta ... Oscillation abnormality occurrence temperature of electronic component element Tm ... Melting point of sealing member 1 ... Base member (container)
2 ... Lid member (cap, lid)
3. Sealing member (brazing material)
DESCRIPTION OF SYMBOLS 11 ... Main part of electric power high frequency oscillation device 12 ... Control terminal part 13 ... Heating coil head 14 ... Cooling water circulation pump 15, 16 ... Cooling pipe 21 ... Parallel type induction heating Coil 21A, 21B ... Parallel conductor 22 ... Holding member 22A ... Pressing portion of holding member 22 ... Lifting mechanism 24 ... Tray 24A ... Mounting recess

Claims (9)

A heating coil that performs high-frequency induction heating of a base member and a lid member to which an electronic component element is attached, a high-frequency power supply device that supplies high-frequency power to the heating coil, and a presser that holds the base member and the lid member An electronic component package manufacturing apparatus comprising: a member, wherein a sealing member positioned between the base member and the lid member is melted to hermetically seal the base member and the lid member;
The high-frequency power supply device is capable of heating the sealing member in a high power induction heating time in a high power mode that can rapidly raise the sealing member to a temperature that does not reach an oscillation abnormality occurrence temperature that starts to cause an abnormality in the oscillation of the electronic component element. Low power induction heating longer than the high power induction heating time due to the function of supplying high frequency power to the coil and the low power supply mode that can raise the temperature of the sealing member more slowly than the high power induction heating A function of supplying high-frequency power to the heating coil over time, and a sequence for switching from the low power supply mode to the high power mode, or switching from the high power mode to the low power supply mode. An apparatus for manufacturing an electronic component package, comprising: In claim 1,
The electronic component package manufacturing apparatus, wherein the low power induction heating time is a predetermined time exceeding 1 second, and the high temperature induction heating time is a predetermined time of 1 second or less. In claim 1 or claim 2,
The heating coil is a parallel coil composed of conductors folded back so as to be parallel to each other at a predetermined interval larger than the width of the lid member, and in the supply direction of the base member and the lid member An apparatus for manufacturing an electronic component package, wherein the apparatus extends in a direction perpendicular to the electronic component package. In any one of Claims 1 thru | or 3,
The pressing member is disposed at the predetermined interval between the conductors of the heating coil, has an area equal to or larger than an upper surface of the lid member, and the base member and the lid member are arranged in the heating coil. An apparatus for manufacturing an electronic component package, comprising: a pressing surface that can uniformly suppress the entire surface of the lid member when positioned between conductors. In any one of Claim 1 thru | or 4,
The base member and the lid member are sequentially conveyed at a predetermined interval with respect to the heating coil,
The electronic component package manufacturing apparatus according to claim 1, wherein the predetermined interval is equal to or longer than a distance at which the next lid member does not move by the high-frequency magnetic force of the heating coil during the hermetic sealing. In any one of Claims 1 thru | or 5,
The base member and the lid member are placed on a tray and sequentially conveyed by a conveyance member, and when the base member and the lid member stop between the conductors parallel to each other in the heating coil, the pressing member is lowered. Or the tray rises, the pressing member presses the lid member, and the high-frequency power supply device supplies high-frequency power to the heating coil in synchronization therewith. . In any one of Claims 1 thru | or 6,
The apparatus for manufacturing an electronic component package, wherein the pressing member is made of a heat-resistant nonmagnetic material. High frequency induction heating is performed on the base member and the lid member to which the electronic component element is attached by supplying high frequency power to the heating coil, and the sealing member located between the base member and the lid member is melted to In an electronic component package manufacturing method that is hermetically sealed by joining a base member and the lid member,
A high power induction heating step for supplying a large power capable of raising the temperature of the sealing member with a steep slope, and the temperature of the sealing member before or after the high power induction heating step A low-power induction heating process that raises gently compared to the induction heating process,
When the temperature of the sealing member is increased in the low power induction heating process first, the low power induction heating process is switched to the high power induction heating process, or the high power induction heating process is performed first. When the temperature of the temperature of the sealing member is increased, switching from the high power induction heating step to the low power induction heating step, the oscillation abnormality of the sealing member starts to cause an abnormality in the electronic component element, respectively. Raise further within the temperature below the generation temperature,
The low-power induction heating process is performed for a longer time than the high-temperature induction heating process to improve the wettability of the base member or the lid member to which the sealing member is brazed to the conductive portion. Manufacturing method of component package. In claim 8,
The method of manufacturing an electronic component package, wherein the low power induction heating step is performed for a predetermined time exceeding 1 second, and the high temperature induction heating step is performed for a predetermined time of 1 second or less.

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