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JP6034054B2 - Electronic component storage package and electronic device - Google Patents

Electronic component storage package and electronic device Download PDF

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Publication number
JP6034054B2
JP6034054B2 JP2012102191A JP2012102191A JP6034054B2 JP 6034054 B2 JP6034054 B2 JP 6034054B2 JP 2012102191 A JP2012102191 A JP 2012102191A JP 2012102191 A JP2012102191 A JP 2012102191A JP 6034054 B2 JP6034054 B2 JP 6034054B2
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layer portion
layer
seal ring
electronic component
side wall
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JP2013232446A (en
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博司 柴山
博司 柴山
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

本発明は、電子部品収納用パッケージに関し、特に、電子部品を気密に封止するためのシールリングが用いられた構成のものに関する。   The present invention relates to an electronic component storage package, and particularly relates to a package using a seal ring for hermetically sealing an electronic component.

従来の電子部品収納用パッケージ（以下、単にパッケージともいう）は、一般に上面に電子部品を収容するための凹部が形成されている。パッケージは、略直方体の凹部の底面を成す基体２１および凹部を囲む側壁２２を備えている。基体２１および側壁２２は、セラミックス等からなり、凹部の底面に半導体素子等の電子部品２６が載置される載置部２１ａを有している。   A conventional electronic component storage package (hereinafter also simply referred to as a package) generally has a concave portion for storing an electronic component on the upper surface. The package includes a base body 21 forming a bottom surface of a substantially rectangular parallelepiped recess and a side wall 22 surrounding the recess. The base 21 and the side wall 22 are made of ceramics or the like, and have a placement portion 21a on which an electronic component 26 such as a semiconductor element is placed on the bottom surface of the recess.

側壁２２部の一例を図３の断面図に示す（例えば、特許文献１参照）。同図に示すように、凹部の周囲の側壁２２の上面には、メタライズ層２３を介して、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等からなる枠状のシールリング２４が接合されている。   An example of the side wall 22 portion is shown in the cross-sectional view of FIG. 3 (see, for example, Patent Document 1). As shown in the figure, a frame-like seal ring 24 made of an iron (Fe) -nickel (Ni) -cobalt (Co) alloy or the like is provided on the upper surface of the side wall 22 around the recess via a metallized layer 23. It is joined.

このようなパッケージを用い、基体の載置部２１ａに電子部品２６を載置固定するとともに、電子部品２６とパッケージ外部に導出される配線導体２７とをボンディングワイヤ２８を介して接続し、しかる後、シールリング２４の上面に鉄（Ｆｅ）−Ｎｉ−コバルト（Ｃｏ）合金等からなる蓋体２５をシーム溶接することにより、製品としての電子装置が作製される。   Using such a package, the electronic component 26 is mounted and fixed on the mounting portion 21a of the base, and the electronic component 26 and the wiring conductor 27 led out of the package are connected via the bonding wire 28, and thereafter Then, a lid 25 made of iron (Fe) -Ni-cobalt (Co) alloy or the like is seam welded to the upper surface of the seal ring 24, thereby producing an electronic device as a product.

このような電子装置は、外部電気回路基板に固定され、外部電気回路基板から供給される駆動信号により電子部品２６が作動し、電子部品２６によって処理された信号を外部に伝送できる電子装置として機能する。   Such an electronic device functions as an electronic device that is fixed to an external electric circuit board, the electronic component 26 operates by a drive signal supplied from the external electric circuit board, and a signal processed by the electronic component 26 can be transmitted to the outside. To do.

特開平９−２９３７９９号公報JP-A-9-293799

しかしながら、従来のパッケージにおいて、シールリング２４を側壁２２の上面に接合し、蓋体２５をシールリング２４を介して側壁２２の上面にシーム溶接法等により接合すると、基体２１と蓋体２５の熱膨張係数差に起因する熱応力が発生する。そして、基体２１および側壁２２と、シールリング２４、または蓋体２５との間に生じる熱膨張係数差に起因した熱応力によって、メタライズ層２３、側壁２２部分にクラックが生じたり、メタライズ層２３とシールリング２４とを接合するろう材等の接合材が剥離したりし、電子装置の気密性および信頼性を維持し難いという問題点があった。   However, in the conventional package, when the seal ring 24 is joined to the upper surface of the side wall 22 and the lid body 25 is joined to the upper surface of the side wall 22 via the seal ring 24 by a seam welding method or the like, the heat of the base body 21 and the lid body 25 is obtained. Thermal stress due to the difference in expansion coefficient is generated. Then, due to the thermal stress caused by the difference in thermal expansion coefficient generated between the base body 21 and the side wall 22 and the seal ring 24 or the lid body 25, the metallized layer 23 and the side wall 22 are cracked, There is a problem in that it is difficult to maintain the airtightness and reliability of the electronic device because a bonding material such as a brazing material for bonding to the seal ring 24 peels off.

従って、本発明は上記問題点に鑑み完成されたもので、その目的は、基体および側壁と、シールリングおよび蓋体との間に生じる熱膨張係数差に起因した熱応力が生じても、メタライズ層、接合材およびシールリング部の気密性を維持することができる電子装置を提供することにある。   Therefore, the present invention has been completed in view of the above problems, and its purpose is to metallize even if thermal stress is generated due to a difference in thermal expansion coefficient generated between the base body and the side wall, and the seal ring and the lid. An object of the present invention is to provide an electronic device capable of maintaining airtightness of a layer, a bonding material, and a seal ring portion.

本発明の一実施形態に係る電子部品収納用パッケージは、上面に電子部品を収容するための凹部を有し、前記上面の前記凹部の周囲にメタライズ層が形成された筐体と、前記メタライズ層の上面に接合材を介して接合されたシールリングとを具備しており、前記メタライズ層は、前記筐体の上面側の第１層部分と、該第１層部分の上に位置する第２層部分とから成り、前記筐体の上面、前記メタライズ層の前記第１層部分、前記第２層部分および前記シールリングの順に幅が狭くなっており、前記筐体の上面が前記メタライズ層の前
記第１層部分の両側に露出しており、前記シールリングの幅方向の両側に前記メタライズ層の前記第１層部分および前記第２層部分の上面の両側部分がそれぞれ露出しており、前記第１層部分の上面の両側部分から前記第２層部分の上面の両側部分および前記シールリングの側面にかけてそれぞれ前記接合材が被覆していることを特徴とする。
 An electronic component storage package according to an embodiment of the present invention includes a housing having a recess for storing an electronic component on an upper surface, and a metallization layer formed around the recess on the upper surface, and the metallization layer The metallization layer includes a first layer portion on the upper surface side of the housing and a second layer located on the first layer portion. And the width of the upper surface of the housing, the first layer portion of the metallized layer, the second layer portion, and the seal ring are narrowed in this order, and the upper surface of the housing is formed of the metallized layer. Previous
The both sides of the upper surface of the first layer portion and the second layer portion of the metallized layer are exposed on both sides in the width direction of the seal ring, respectively. the bonding material, respectively, characterized in that the covers from both side portions of the upper surface of the first layer toward the side surface of the side portions and the seal ring of the upper surface of the second layer portion.

また、本発明の一実施形態に係る電子装置は、上記の電子部品収納用パッケージと、前記凹部内に収容された電子部品と、前記シールリングの上面に接合された、前記凹部を封止する蓋体とを備えたことを特徴とする。   An electronic device according to an embodiment of the present invention seals the concave portion joined to the upper surface of the seal ring, the electronic component storage package, the electronic component accommodated in the concave portion, and the seal ring. And a lid.

本発明の一実施形態に係る電子部品収納用パッケージによれば、メタライズ層が、筐体の上面側の第１層部分と、この第１層部分の上に位置する第２層部分とから成り、筐体の上面、メタライズ層の第１層部分、第２層部分およびシールリングの順に幅が狭くなっており、筐体の上面がメタライズ層の第１層部分の両側に露出しており、シールリングの幅方向の両側において、メタライズ層の第１層部分および第２層部分の上面さらにシールリングの側面にかけて接合材が被覆していることから、筐体からシールリングにむけて、水平方向の体積膨張または体積収縮が段階的・連続的に小さくなり、筐体とメタライズ層とシールリングと接合材との間に生じる熱膨張係数差に起因した熱応力の影響が緩和されるとともに、メタライズ層の第２層部分の外周エッジ等に集中する熱応力が接合材によって分散されたり吸収されたりすることによって緩和される。また、シールリングを接合する際の余剰な接合材が、露出している側壁の上面を越えて流れることがなく、接合材が凹部内に流れ込んだり、パッケージの外側側面へ漏れ出たりすることを抑制でき、筐体の内部に形成された配線パターンや端子に接合材が付着することによる電気的な接続不良を抑制することができる。
According to the electronic component storage package according to the embodiment of the present invention, the metallized layer includes the first layer portion on the upper surface side of the housing and the second layer portion positioned on the first layer portion. , The width of the upper surface of the housing, the first layer portion of the metallization layer, the second layer portion and the seal ring are narrowed in this order, the upper surface of the housing is exposed on both sides of the first layer portion of the metallization layer, On both sides in the width direction of the seal ring, since the bonding material covers the upper surface of the first layer portion and the second layer portion of the metallization layer and the side surface of the seal ring , the horizontal direction from the housing to the seal ring The volume expansion or contraction of the material is reduced stepwise and continuously, and the effects of thermal stress due to the difference in thermal expansion coefficient between the housing, the metallized layer, the seal ring, and the bonding material are alleviated and metallized. the first layer 2 Thermal stress concentrated on the outer peripheral edge portion or the like is alleviated by or absorbed or dispersed by the bonding material. In addition, excess bonding material when bonding the seal ring does not flow beyond the upper surface of the exposed side wall, so that the bonding material flows into the recess or leaks to the outer side surface of the package. It is possible to suppress the electrical connection failure caused by the bonding material adhering to the wiring pattern or the terminal formed inside the housing.

本発明の一実施形態に係る電子装置によれば、上記電子部品収納用パッケージと、凹部内に収容された電子部品と、シールリングの上面に接合されて凹部を封止する蓋体とを具備したことにより、長期にわたり封止性がよく、電子部品を正常かつ安定して作動させ得る信頼性の高い電子装置とできる。   According to an electronic device according to an embodiment of the present invention, the electronic component housing package, the electronic component housed in the recess, and a lid that is bonded to the upper surface of the seal ring and seals the recess. As a result, a highly reliable electronic device that has good sealing performance over a long period of time and can operate the electronic component normally and stably can be obtained.

本発明の電子部品収納用パッケージの実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the electronic component storage package of this invention. 図１の電子部品収納用パッケージの要部拡大断面図である。It is a principal part expanded sectional view of the electronic component storage package of FIG. 従来の電子部品収納用パッケージの要部拡大断面図である。It is a principal part expanded sectional view of the conventional electronic component storage package.

以下、本発明の電子部品収納用パッケージについて図を用いつつ説明する。なお、図はいずれも模式的なものであって、実際の寸法関係とは異なることがある。また、以下の説明において上下左右という用語は、単に図面上の位置関係を説明するために用いるものであり、実際の使用時における位置関係を意味するものではない。   Hereinafter, the electronic component storage package of the present invention will be described with reference to the drawings. In addition, all the figures are schematic and may differ from an actual dimensional relationship. Further, in the following description, the terms “upper, lower, left, and right” are merely used to describe the positional relationship on the drawings, and do not mean the positional relationship during actual use.

図１は、本発明の電子部品収納用パッケージの実施の形態の一例を示す斜視図である。図１において、１は、上面に電子部品を収容するための凹部１ｃを有した筐体を示す。筐体１は、凹部１ｃの底面を成す基体１ａ部分および凹部１ｃの側壁１ｂ部分とから成る。筐体１の上面の凹部１ｃの周囲（側壁１ｂの上面）には、メタライズ層２が形成されている（判りやすくするために図１のメタライズ導体部分にハッチングを付している。これら
ハッチング部分は断面を示すものではない）。そして、メタライズ層２の上面にはシールリング３がＡｕ−Ｓｎ合金などの低融点のろう材等の接合材４を介して接合されている。 FIG. 1 is a perspective view showing an example of an embodiment of an electronic component storage package according to the present invention. In FIG. 1, reference numeral 1 denotes a housing having a recess 1 c for accommodating an electronic component on the upper surface. The housing 1 includes a base 1a portion that forms the bottom surface of the recess 1c and a side wall 1b portion of the recess 1c. A metallized layer 2 is formed around the recess 1c on the top surface of the housing 1 (the top surface of the side wall 1b) (for easy understanding, the metallized conductor portions in FIG. 1 are hatched. These hatched portions). Does not indicate a cross section). A seal ring 3 is bonded to the upper surface of the metallized layer 2 via a bonding material 4 such as a low melting point brazing material such as an Au—Sn alloy.

なお、図１には、筐体１の凹部１ｃの底面から側壁１ｂの側面や基体１ａの下面まで電気的に導通された内部配線パターンが形成される等、筐体１内外に配線パターンが形成される場合を示している。この他にも、側壁１ｂを貫通して金属製の端子が取り付けられたり、基体１ａが側壁１ｂの外側まで延設されて、そこにねじ固定用の穴が形成されたりしている電子部品収納用パッケージ等、用途に応じて様々な形態のものが用いられる。
In FIG. 1, such that the internal wiring pattern which is electrically connected to the lower surface of the sides and the base 1a of the side wall 1b from the bottom surface of the recess 1c of the housing 1 is formed, the wiring pattern in the housing 1 and out The case where is formed is shown. In addition, an electronic component housing in which a metal terminal is attached through the side wall 1b, or a base 1a is extended to the outside of the side wall 1b, and a screw fixing hole is formed there. Various types of packages are used depending on the application.

また、例えば、筐体１はセラミック製である例を用いているが、基体１ａが金属製であり、側壁１ｂがセラミック製であるような複合筐体１である場合であってもよい。   For example, although the case 1 is made of ceramic, the case 1 may be a composite case 1 in which the base 1a is made of metal and the side wall 1b is made of ceramic.

図２は、図１のＡ−Ａで示す断面を示す部分断面図である。図２に示すように、凹部１ｃの周囲の側壁１ｂの上面には、メタライズ層２が形成される。メタライズ層２は、側壁１ｂの上面側に形成された幅の広い第１層部分２ａと、その上に形成され、第１層部分２ａより幅の狭い第２層部分２ｂとの二つの部分を有した、凸の字形状の断面を有している。なお、幅とは、パッケージ内外方向においてのものであり、図２の左右方向の長さを意味する。また、第１層部分２ａの幅は、図２のように側壁１ｂの幅（または側壁１ｂの厚み）と同じ寸法でもよいし、側壁１ｂの幅より狭くてもよい。   FIG. 2 is a partial cross-sectional view showing a cross section taken along line AA of FIG. As shown in FIG. 2, a metallized layer 2 is formed on the upper surface of the side wall 1b around the recess 1c. The metallized layer 2 includes two parts, a first layer part 2a having a large width formed on the upper surface side of the side wall 1b and a second layer part 2b having a narrower width than the first layer part 2a. It has a convex cross section. Note that the width means the length in the package inner / outer direction and the length in the left / right direction in FIG. Further, the width of the first layer portion 2a may be the same as the width of the side wall 1b (or the thickness of the side wall 1b) as shown in FIG. 2, or may be narrower than the width of the side wall 1b.

メタライズ層２の上面には、メタライズ層２の第２層部分２ｂの幅よりも狭い幅のシールリング３が接合材４を介して接合される。すなわち、メタライズ層２の第１層部分２ａ、第２層部分２ｂ、シールリング３の順に幅が狭くなるように構成されている。   A seal ring 3 having a width smaller than the width of the second layer portion 2 b of the metallized layer 2 is bonded to the upper surface of the metallized layer 2 via a bonding material 4. That is, the first layer portion 2 a, the second layer portion 2 b, and the seal ring 3 of the metallized layer 2 are configured to be narrower in this order.

第１層部分２ａおよび第２層部分２ｂの上面は、それぞれシールリング３の幅方向両側において突出するように露出されているのがよく、第１層部分２ａの上面の両側から第２層部分２ｂの両側上面の外周部を経てシールリング３の側面にかけて接合材４に被覆されてメタライズ層２とシールリング３とが接合される。接合の際に、第２層部分２ｂの上面とシールリング３とを接合する際の余剰となった接合材４は、第２層部分２ｂの上面から第１層部分２ａの上面に流れ、第１層部分２ａの上面から第２層部分２ｂの外周、シールリング３の側面にかけて接合材４のメニスカスを形成する。   The upper surfaces of the first layer portion 2a and the second layer portion 2b are preferably exposed so as to protrude on both sides in the width direction of the seal ring 3, and the second layer portion is formed from both sides of the upper surface of the first layer portion 2a. The metallized layer 2 and the seal ring 3 are bonded to each other by being covered with the bonding material 4 through the outer peripheral portions of the upper surfaces on both sides of 2b and to the side surfaces of the seal ring 3. At the time of joining, the surplus joining material 4 when joining the upper surface of the second layer portion 2b and the seal ring 3 flows from the upper surface of the second layer portion 2b to the upper surface of the first layer portion 2a, A meniscus of the bonding material 4 is formed from the upper surface of the first layer portion 2 a to the outer periphery of the second layer portion 2 b and the side surface of the seal ring 3.

第１層部分２ａ、第２層部分２ｂ、シールリング３は、第１層部分２ａの幅をＷ１、第２層部分２ｂの幅をＷ２、シールリング３の幅をＷ３とする場合、（１／２）Ｗ１≦Ｗ２≦（４／５）Ｗ１、（１／２）Ｗ２＜Ｗ３＜（４／５）Ｗ２の関係となるように設けられる。また、第２層部分２ｂの高さをＴ１とする場合、Ｔ１≦（Ｗ１−Ｗ２）／２の関係となるように選ばれる。   When the width of the first layer portion 2a is W1, the width of the second layer portion 2b is W2, and the width of the seal ring 3 is W3, the first layer portion 2a, the second layer portion 2b, and the seal ring 3 are (1 / 2) W1 ≦ W2 ≦ (4/5) W1 and (1/2) W2 <W3 <(4/5) W2. Further, when the height of the second layer portion 2b is T1, it is selected so as to satisfy the relationship of T1 ≦ (W1-W2) / 2.

このように構成することにより、電子部品収納用パッケージの製造工程において、側壁
１ｂとメタライズ層２とシールリング３との間に生じる熱膨張係数差に起因した熱応力が抑制、緩和されるとともに、側壁１ｂとシールリング３との接合強度が向上する。すなわち、シールリング３の幅Ｗ３に応じて、第２層部分２ｂの幅Ｗ２が第１層部分２ａの幅Ｗ１より狭くなることにより、シールリング３との接合面積が小さくなり、また第２層部分２ｂとシールリング３との間の接合材４の量を少なくできることから、メタライズ層２とシールリング３との間の熱膨張係数差による熱応力は減少する。一方、メタライズ層２と接合材４との接合面積が大きくなることから、接合強度が向上する。
By configuring in this way, in the manufacturing process of the electronic component storage package, thermal stress due to the difference in thermal expansion coefficient generated between the side wall 1b, the metallized layer 2, and the seal ring 3 is suppressed and alleviated, bonding strength between the side wall 1b and the seal ring 3 you improved. That is, according to the width W3 of the seal ring 3, the width W2 of the second layer portion 2b is narrower than the width W1 of the first layer portion 2a, thereby reducing the bonding area with the seal ring 3 and the second layer. Since the amount of the bonding material 4 between the portion 2b and the seal ring 3 can be reduced, the thermal stress due to the difference in thermal expansion coefficient between the metallized layer 2 and the seal ring 3 is reduced. On the other hand, since the bonding area between the metallized layer 2 and the bonding material 4 is increased, the bonding strength is improved.

また、第１層部分２ａと第２層部分２ｂとの間に接合材４によるメニスカスが形成され、第２層部分２ｂとシールリング３の下端部の側面との間にも接合材４によるメニスカスが形成される。これによって、メタライズ層２とシールリング３との間に設けられる接合
材４の量が増え、メタライズ層２とシールリング３との接合強度の低下を抑制できる。 Further, a meniscus is formed by the bonding material 4 between the first layer portion 2a and the second layer portion 2b, and the meniscus by the bonding material 4 is also formed between the second layer portion 2b and the side surface of the lower end portion of the seal ring 3. Is formed. Thereby, the amount of the bonding material 4 provided between the metallized layer 2 and the seal ring 3 is increased, and a decrease in the bonding strength between the metallized layer 2 and the seal ring 3 can be suppressed.

なお、第２層部分２ｂとシールリング３とを接合する接合材４のうち、余剰な接合材４が第２層部分２ｂの上面から第１層部分２ａの上面に流れるとともに、第１層部分２ａの上面と第２層部分２ｂの外周との間にメニスカスが形成されるので、第２層部分２ｂとシールリング３との間の接合材４の厚さを一定に保つのが容易である。   Of the bonding material 4 for bonding the second layer portion 2b and the seal ring 3, excess bonding material 4 flows from the upper surface of the second layer portion 2b to the upper surface of the first layer portion 2a, and the first layer portion. Since a meniscus is formed between the upper surface of 2a and the outer periphery of the second layer portion 2b, it is easy to keep the thickness of the bonding material 4 between the second layer portion 2b and the seal ring 3 constant. .

また、接合材４の表面が、第１層部分２ａ、第２層部分２ｂ、シールリング３の側方に凹凸のないなめらかなメニスカスを描くように形成されているのがよい。   The surface of the bonding material 4 is preferably formed so as to draw a smooth meniscus having no irregularities on the sides of the first layer portion 2a, the second layer portion 2b, and the seal ring 3.

さらに、側壁１ｂの上面には、側壁１ｂの上面の幅よりも狭い幅の第１層部分２ａ、第１層部分２ａの幅よりも狭い幅の第２層部分２ｂを介して、第２層部分２ｂの幅よりも狭い幅のシールリング３が接合材４を介して接合されるのが好ましい。すなわち、側壁１ｂの上面、メタライズ層２の第１層部分２ａ、第２層部分２ｂ、シールリング３の順に幅が狭くなるように構成されるのが好ましい。   Further, a second layer is provided on the upper surface of the side wall 1b via a first layer portion 2a having a width smaller than that of the upper surface of the side wall 1b and a second layer portion 2b having a width smaller than that of the first layer portion 2a. It is preferable that the seal ring 3 having a narrower width than the width of the portion 2 b is bonded via the bonding material 4. That is, it is preferable that the width is narrowed in the order of the upper surface of the sidewall 1b, the first layer portion 2a, the second layer portion 2b, and the seal ring 3 of the metallized layer 2.

このように構成することにより、シールリング３を接合する際の余剰な接合材４が、露出している側壁１ｂの上面を越えて流れることがない。よって、接合材４が凹部１ｃ内に流れ込んだり、パッケージの外側側面へ漏れ出たりすることを抑制でき、筐体１の内部に形成された配線パターンや端子６に接合材４が付着することによる電気的な接続不良を抑制することができる。   By constituting in this way, the excessive joining material 4 when joining the seal ring 3 does not flow beyond the upper surface of the exposed side wall 1b. Therefore, it can suppress that the joining material 4 flows into the recessed part 1c, or leaks to the outer side surface of a package, and it is because the joining material 4 adheres to the wiring pattern and the terminal 6 which were formed in the inside of the housing | casing 1. Electrical connection failures can be suppressed.

また、側壁１ｂとメタライズ層２（第１層部分２ａ，第２層部分２ｂ）およびシールリング３は、図２の断面図において幅方向における中心線がそれぞれ一致するように配置されるのが好ましい。この場合、接合材４は、中心線を軸対称として第１層部分２ａの上面、第２層部分２ｂの上面および外周エッジ、シールリング３の下端部の側面に対称に設けられやすくなり、側壁１ｂ、メタライズ層２、シールリング３および接合材４との熱膨張係数差に起因して生じる熱応力が中心線に関して対称に分散される。   Further, the side wall 1b, the metallized layer 2 (the first layer portion 2a, the second layer portion 2b), and the seal ring 3 are preferably arranged such that the center lines in the width direction in the sectional view of FIG. . In this case, the bonding material 4 is easily provided symmetrically on the upper surface of the first layer portion 2a, the upper surface and the outer peripheral edge of the second layer portion 2b, and the side surface of the lower end portion of the seal ring 3 with the center line being axially symmetric. The thermal stress generated due to the difference in thermal expansion coefficient between 1b, metallized layer 2, seal ring 3 and bonding material 4 is distributed symmetrically with respect to the center line.

本発明の基体１ａは、略直方体とされ、上面に形成された凹部１ｃの底面に半導体素子等の機能素子や、受動電子回路素子、中継回路基板等の電子部品を載置するための載置部が設けられ、対向する側壁１ｂの下部基体１ａ表面にメタライズ導体層から成る入出力用等の接続端子６がそれぞれ形成されている。基体１ａは、アルミナ系セラミックス、窒化珪素系セラミックス、炭化ケイ素系セラミックス、銅（Ｃｕ）−タングステン（Ｗ）合金等の良熱伝導性の金属材料等から成る。この基体１ａは、電子部品の作動時に発する熱を外部電気回路基板（図示せず）に伝熱する、所謂放熱板として機能するとともに、電子部品を支持する支持部材として、さらには外部電気回路基板に固定される固定用基板として機能する。   The base body 1a of the present invention has a substantially rectangular parallelepiped shape, and is used for mounting functional elements such as semiconductor elements, electronic components such as passive electronic circuit elements and relay circuit boards on the bottom surface of the recess 1c formed on the upper surface. A connection terminal 6 for input / output composed of a metallized conductor layer is formed on the surface of the lower base 1a of the opposite side wall 1b. The substrate 1a is made of a highly heat conductive metal material such as alumina ceramic, silicon nitride ceramic, silicon carbide ceramic, copper (Cu) -tungsten (W) alloy, or the like. The base body 1a functions as a so-called heat radiating plate that transfers heat generated during operation of the electronic component to an external electric circuit board (not shown), and as a support member for supporting the electronic component, and further, an external electric circuit board. It functions as a fixing substrate fixed to the substrate.

このような基体１ａの上面には、載置部を囲繞するように側壁１ｂが配置され、基体１ａとともに筐体１を構成する。側壁１ｂには、貫通孔が形成され、そこにリード端子、同軸コネクタ、高周波回路基板等の接続端子等が取り付けられ、パッケージの内外を電気的に導通する接続端子が嵌着される場合もある。
Thus the upper surface of a substrate 1a, side walls 1b so as to surround the mounting portion is arranged to form a housing 1 with a substrate 1a. A through hole is formed in the side wall 1b, and a connection terminal such as a lead terminal, a coaxial connector, and a high-frequency circuit board is attached thereto, and a connection terminal that is electrically connected to the inside and outside of the package may be fitted. .

側壁１ｂは、アルミナ系セラミックス、窒化珪素系セラミックス、炭化ケイ素系セラミックス等のセラミックスから成り、例えばセラミックグリーンシートを積層して枠状に成形し、これを焼結させて形成される。   The side wall 1b is made of ceramics such as alumina-based ceramics, silicon nitride-based ceramics, silicon carbide-based ceramics, and is formed, for example, by laminating ceramic green sheets into a frame shape and sintering them.

側壁１ｂの上面には凹部１ｃの周囲を取り囲むような枠形状のメタライズ層２が形成される。メタライズ層２は、タングステン（Ｗ），モリブデン（Ｍｏ）−マンガン（Ｍｎ）
，銅（Ｃｕ）等の金属粒子と樹脂バインダとをペースト状にしたものを側壁１ｂの上面に塗布し、焼結させて形成される。第１層部分２ａとなる部分を塗布した後に、第２層部分２ｂとなる部分を塗布する等の方法によってメタライズ層２の形状に形成される。また、真空蒸着等の他の方法を用いてもよい。 A frame-shaped metallization layer 2 is formed on the upper surface of the side wall 1b so as to surround the recess 1c. Metallized layer 2 is made of tungsten (W), molybdenum (Mo) -manganese (Mn)
, Copper (Cu) or other metal particles and a resin binder in a paste form are applied to the upper surface of the side wall 1b and sintered. After the portion to be the first layer portion 2a is applied, it is formed into the shape of the metallized layer 2 by a method such as applying the portion to be the second layer portion 2b. Further, other methods such as vacuum deposition may be used.

またシールリング３は、鉄（Ｆｅ）−Ｎｉ−コバルト（Ｃｏ）合金や４２アロイ、５０アロイ、ステンレス鋼、鉄、銅等の金属材料から成り、これらの金属材料から成る板材を打抜き金型で打ち抜いたり、プレス加工，切削加工または板材の上下所定部（接合面）にマスキングを施してエッチング加工により枠形状に製作される。
The seal ring 3 is made of a metal material such as an iron (Fe) -Ni-cobalt (Co) alloy, 42 alloy, 50 alloy, stainless steel, iron, copper, etc., and a plate material made of these metal materials is punched with a die. It is manufactured into a frame shape by punching, pressing, cutting, or masking the upper and lower predetermined parts (joint surfaces) of the plate material and etching.

なお、メタライズ層２の表面およびシールリング３の表面には、耐食性に優れかつろう材等の接合材４との濡れ性に優れる金属、具体的には厚さ０．５〜９μｍのニッケル（Ｎｉ）層と、厚さ０．５〜９μｍの金（Ａｕ）層とを順次メッキ法により被着して成る金属層を形成しておくことが好ましい。   The surface of the metallized layer 2 and the surface of the seal ring 3 are made of a metal excellent in corrosion resistance and wettability with the bonding material 4 such as a brazing material, specifically nickel (Ni) having a thickness of 0.5 to 9 μm. ) Layer and a gold (Au) layer having a thickness of 0.5 to 9 μm are preferably deposited sequentially by a plating method to form a metal layer.

接合材４には、Ａｕ−Ｓｎ，Ａｕ−Ｓｉ、Ａｕ−Ｇｅ、Ｓｎ−Ａｇ−Ｃｕ，Ｓｎ−Ａｇ等の高融点ろう材、低融点ろう材が用いられる。この他、樹脂接着剤，ガラス接合材等を用いてもよい。ろう接合材を用いる場合は、例えば、メタライズ層２の第２層部分２ｂの上面の形状と同じ枠形状のろう材のプリフォームに成形しておき、メタライズ層２とシールリング３との間に挟んだ状態にしてろう材の接合に適した温度に設定した溶融炉中に投入する。そして、溶融炉中でろう材を溶融させ、後に徐冷する。これによって、第１層部分２ａからシールリング３の側面にかけて良好なろう材のメニスカスを形成し、シールリング３を側壁１ｂの上面に接合することができる。
As the bonding material 4, a high melting point brazing material such as Au—Sn, Au—Si, Au—Ge, Sn—Ag—Cu, Sn—Ag, or a low melting point brazing material is used. In addition, a resin adhesive, a glass bonding material, or the like may be used. In the case of using a brazing material , for example, it is formed into a preform of a brazing material having the same frame shape as the shape of the upper surface of the second layer portion 2 b of the metallized layer 2, and between the metallized layer 2 and the seal ring 3. It is put in a melting furnace set to a temperature suitable for joining the brazing filler metal in a sandwiched state. Then, the brazing filler metal is melted in a melting furnace and then gradually cooled. As a result, a good meniscus of brazing material can be formed from the first layer portion 2a to the side surface of the seal ring 3, and the seal ring 3 can be joined to the upper surface of the side wall 1b.

上記電子部品収納用パッケージの凹部１ｃ内に、電子部品を樹脂系接着剤、ろう接合材などの接着剤を介して接着固定するとともに、電子部品の電極を中継回路基板やボンディングワイヤ等を介して接続端子６に接続し、しかる後、蓋体５をシールリング３の上面に接合することによって、電子装置となる。   In the recess 1c of the electronic component storage package, the electronic component is bonded and fixed via an adhesive such as a resin-based adhesive or a brazing joint, and the electrode of the electronic component is connected via a relay circuit board or a bonding wire. By connecting to the connection terminal 6 and then bonding the lid 5 to the upper surface of the seal ring 3, an electronic device is obtained.

蓋体５は、シールリング３と同様に、Ｆｅ−Ｎｉ−Ｃｏ合金や４２アロイ、５０アロイ、ステンレス鋼、鉄、銅等の金属材料から成り、シールリング３とシーム溶接や低温溶融ろう接合材等によって接合される。   The lid 5 is made of a metal material such as Fe-Ni-Co alloy, 42 alloy, 50 alloy, stainless steel, iron, copper, etc., like the seal ring 3, and the seal ring 3 and seam welding or low-temperature melting brazing joint material. Joined by etc.

かくして、本発明の一実施形態に係る電子部品収納用パッケージでは、メタライズ層２が幅の広い第１層部分２ａと第１層部分２ａより幅の狭い第２層部分２ｂと第２層部分２ｂより幅の狭いシールリング３とを有し、シールリング３を接合材４を介して第２層部分２ｂの上面に接合することによって、側壁１ｂに加わる熱応力を緩和して側壁１ｂ、メタライズ層２等にクラック等が生じる可能性を少なくできる。そして、電子装置となったときに、パッケージに生じるクラック等により、電子装置の封止性能に問題が生じる可能性を少なくできる。   Thus, in the electronic component housing package according to the embodiment of the present invention, the metallized layer 2 has a wide first layer portion 2a and a second layer portion 2b and a second layer portion 2b that are narrower than the first layer portion 2a. The seal ring 3 has a narrower width, and the seal ring 3 is bonded to the upper surface of the second layer portion 2b via the bonding material 4, thereby relieving the thermal stress applied to the side wall 1b and reducing the side wall 1b and the metallized layer. The possibility that a crack or the like occurs in 2 etc. can be reduced. And when it becomes an electronic device, the possibility that a problem will arise in the sealing performance of an electronic device by the crack etc. which arise in a package can be decreased.

なお、本発明は、上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更を行うことは何等支障ない。例えば、電子部品として、半導体レーザ（ＬＤ）、フォトダイオード（ＰＤ）などの光信号により作動する光半導体素子であっても良い。この場合、光半導体素子を収納する容器は、光ファイバや光アイソレーターなどの光学部品も実装する光半導体パッケージということになる。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the electronic component may be an optical semiconductor element that operates by an optical signal such as a semiconductor laser (LD) or a photodiode (PD). In this case, the container for storing the optical semiconductor element is an optical semiconductor package on which optical components such as an optical fiber and an optical isolator are also mounted.

また、第１層部分２ａおよび第２層部分２ｂの断面形状は、図に示すように真四角である必要はなく、側面になだらかな傾斜面を有していたり、その傾斜面が曲面であったりしても良く、外周エッジの角部に曲面的な面取りが施されていても良い。この場合、接合材４は、第２層部分２ｂの上面から外周エッジを経由して第１層部分２ａまでより流れやすくなり、第１層部分２ａと第２層部分２ｂとの間に接合材４から成るメニスカスを安定して設けることができる。それにより、接合材４が一部に濡れ広がったり、濡れ広がらなかったりすることによる、応力分布の偏りとそれに応じて生じる特定箇所への応力集中を抑制することができる。 Further, the cross-sectional shapes of the first layer portion 2a and the second layer portion 2b do not have to be true squares as shown in the figure, and the side surfaces have gentle inclined surfaces, or the inclined surfaces are curved surfaces. Alternatively, curved corners may be chamfered at the corners of the outer peripheral edge. In this case, the bonding material 4 flows more easily from the upper surface of the second layer portion 2b to the first layer portion 2a via the outer peripheral edge, and the bonding material is interposed between the first layer portion 2a and the second layer portion 2b. 4 meniscus can be provided stably. Thereby, it is possible to suppress the stress distribution unevenness and the stress concentration to a specific portion caused by the bonding material 4 being partially spread or not being wet spread.

１：筐体
１ａ：基体
１ｂ：側壁
１ｃ：凹部
２：メタライズ層
２ａ：第１層部分
２ｂ：第２層部分
３：シールリング
４：接合材
５：蓋体 1: Housing 1a: Base 1b: Side wall 1c: Recess 2: Metallized layer 2a: First layer portion 2b: Second layer portion 3: Seal ring 4: Bonding material 5: Lid

Claims (2)

上面に電子部品を収容するための凹部を有し、前記上面の前記凹部の周囲にメタライズ層が形成された筐体と、前記メタライズ層の上面に接合材を介して接合されたシールリングとを具備しており、
前記メタライズ層は、前記筐体の上面側の第１層部分と、該第１層部分の上に位置する第２層部分とから成り、
前記筐体の上面、前記メタライズ層の前記第１層部分、前記第２層部分および前記シールリングの順に幅が狭くなっており、前記筐体の上面が前記メタライズ層の前記第１層部分の両側に露出しており、
前記シールリングの幅方向の両側に前記メタライズ層の前記第１層部分および前記第２層部分の上面の両側部分がそれぞれ露出しており、前記第１層部分の上面の両側部分から前記第２層部分の上面の両側部分および前記シールリングの側面にかけてそれぞれ前記接合材が被覆していることを特徴とする電子部品収納用パッケージ。 A housing having a recess for accommodating an electronic component on the upper surface, and a metallization layer formed around the recess on the upper surface, and a seal ring bonded to the upper surface of the metallization layer via a bonding material Has
The metallized layer is composed of a first layer portion on the upper surface side of the housing, and a second layer portion located on the first layer portion,
The width of the upper surface of the housing, the first layer portion of the metallized layer, the second layer portion, and the seal ring are narrowed in this order, and the upper surface of the housing is the first layer portion of the metallized layer. Exposed on both sides,
Both side portions of the upper surface of the first layer portion and the second layer portion of the metallized layer are exposed on both sides in the width direction of the seal ring, respectively, and the second portion from both side portions of the upper surface of the first layer portion. the upper surface of the side portions and the characteristics as that electronic component storing package to that each of the bonding material over the side surface of the seal ring is covered in a layer portion. 請求項１記載の電子部品収納用パッケージと、前記凹部内に収容された電子部品と、前記シールリングの上面に接合された、前記凹部を封止する蓋体とを備えた電子装置。 An electronic component storing package according to claim 1 Symbol placement, and an electronic component accommodated in the recess, said joined to the upper surface of the seal ring, the electronic device provided with a lid for sealing the recess.
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