JP4948777B2 - Optical communication module - Google Patents

Description

The present invention relates to an optical communication module used for example in data communication using infrared rays.

  As an optical communication module capable of bidirectional communication by including a light emitting element and a light receiving element, for example, there is an IrDA compliant infrared data communication module. Such infrared data communication modules are widely used in notebook computers, mobile phones, electronic notebooks, and the like.

  An example of this type of conventional infrared data communication module is shown in FIG. The infrared data communication module X includes a substrate 91, a light emitting element 92 mounted on the substrate 91, and a resin package 93 having a lens portion. A concave portion 91a is formed in the substrate 91, and a light emitting element 92 is mounted on the bottom surface. The light emitting element 92 is configured to be able to emit infrared rays upward and laterally in the drawing. If the inner surface of the recess 91a is covered with metal plating, this inner surface can be made a reflective surface having a relatively high reflectance. As a result, light traveling from the light emitting element 92 to the side in the figure can be reflected by the inner surface and directed upward in the figure. As described above, in the infrared data communication module X, the data communication is ensured by increasing the amount of emitted infrared light.

  However, in recent years, there is an increasing need for the infrared data communication module X to be used not only for IrDA-compliant data communication but also for remote control for operating electrical appliances such as televisions. In the case of a remote control application, the distance from the electrical appliance that is the object to be irradiated with infrared rays is significantly longer than that in a data communication application. In order to cope with this, it is necessary to increase the amount of infrared light emitted from the light emitting element 92. As a measure for increasing the amount of light of the light emitting element 92, there is a method of increasing the power supply for the purpose of increasing the output. In this increase in current, for example, the current supplied to the light emitting element 92 is about several tens of mA in the case of data communication use, whereas it is necessary to pass a current of about 200 mA in the case of remote control use. is there. When the current is increased, the amount of heat generated from the light emitting element 92 increases. However, the substrate 91 and the resin package 93 generally have a low thermal conductivity. For this reason, it is difficult to appropriately dissipate the heat generated from the light emitting element 92 to the outside of the infrared data communication module X. In such a case, the infrared data communication module X may be unduly heated. Therefore, the infrared data communication module X has a problem that it cannot sufficiently cope with the high output for realizing the remote control application.

JP 2003-244077 A

The present invention has been conceived under the circumstances described above, and is an optical communication module that can be used for remote control applications and the like by increasing heat dissipation and supporting higher output of light emitting elements. The challenge is to provide the

  In order to solve the above problems, the present invention takes the following technical means.

An optical communication module provided by the present invention is mounted on a substrate having a recess formed on the surface thereof, a bonding conductor layer formed so as to cover at least the bottom surface of the recess, and the bonding conductor layer. The substrate includes a first layer having an opening of the recess, and a second layer laminated on the opposite side of the opening with respect to the first layer. A laminated substrate including a layer, further comprising a heat-dissipating conductor layer sandwiched between the first layer and the second layer and connected to the bonding conductor layer, and the concave portion includes the first layer. And the bottom surface of the heat-dissipating conductor layer is located in the second layer, and the portion of the inner surface of the recess formed in the first layer and the second layer What is the formed part? The heat dissipating conductor layer is patterned in a region avoiding the bonding conductor layer, and its outer periphery is surrounded by an adhesive, covering the light emitting element, A resin package having a lens portion located in front of the light-emitting element; and a surface of the second layer opposite to the opening of the concave portion from the surface on which the heat-dissipating conductor layer is formed. A through-hole leading to the surface is formed, and a through-hole conductor layer connected to the heat-dissipating conductor layer is formed on the inner surface of the through-hole, and is opposite to the opening of the concave portion of the substrate An additional heat radiation conductor layer connected to the through-hole conductor layer is further formed on the side surface, and a groove portion extending in the thickness direction is formed on the side surface of the substrate. It is characterized in that the bonding conductor layer and the groove conductor layer connected to both said additional radiating conductor layer is formed.

According to such a configuration, heat generated by energization of the light emitting element can be appropriately dissipated. That is, most of the heat generated in the light emitting element is transferred to the bonding conductor layer having a relatively high thermal conductivity. Since the bonding conductor layer is connected to the heat dissipation conductor layer, the heat is transferred from the bonding conductor layer to the heat dissipation conductor layer. Thereby, it is possible to avoid the heat from being trapped around the light emitting element, and to prevent the optical communication module from being excessively heated. Therefore, it is possible to increase the current for supplying power to the light emitting element, and the light quantity of the optical communication module can be increased by increasing the output. This is suitable for enabling the optical communication module to be used not only for data communication but also for remote control. Moreover, according to such a structure, it is possible to connect the said bonding conductor layer and the said heat radiating conductor layer directly. Therefore, heat transferability between the bonding conductor layer and the heat dissipation conductor layer can be improved. Moreover, according to such a structure, the said heat radiating conductor layer can be connected so that it may cross | intersect the said conductor layer for bonding. Thereby, it is possible to reliably bond the heat-dissipating conductor layer and the bonding conductor layer, and it is suitable for improving mutual heat transfer properties. Further, according to such a configuration, the heat transferred to the heat dissipation conductor layer can be released to the additional heat dissipation conductor layer via the through-hole conductor layer. Therefore, it is suitable for dissipating the heat generated from the light emitting element to the outside of the optical communication module.

  In a preferred embodiment of the present invention, the heat dissipation conductor layer is made of Cu or a Cu alloy. According to such a configuration, heat transfer from the light emitting element to the heat radiating conductor layer can be promoted.

  In a preferred embodiment of the present invention, the heat dissipating conductor layer is larger in size in the thickness direction of the substrate than the recess. Such a configuration is advantageous for enlarging the joint portion between the heat dissipating conductor layer and the bonding conductor layer.

In a preferred embodiment of the present invention, the additional heat dissipation conductor layer is made of Cu or a Cu alloy. According to such a configuration, heat transfer to the additional heat radiating conductor layer can be promoted .

  In a preferred embodiment of the present invention, the concave portion has a tapered shape whose diameter increases from the bottom surface toward the opening. According to such a structure, the said recessed part will have a slope. If this slope is a highly reflective surface, the light from the light emitting element can be reflected and directed in the emission direction of the optical communication module.

  In a preferred embodiment of the present invention, the light emitting element further includes a light receiving element capable of emitting infrared light and receiving the infrared light, and a drive IC for driving and controlling the light emitting element and the light receiving element. Thus, an infrared data communication module is configured. According to such a configuration, it can be used for bidirectional data communication using infrared rays, and can also be used for remote control applications of electronic devices.

  In a preferred embodiment of the present invention, the heat-dissipating conductor layer overlaps each of the light-emitting element, the light-receiving element, and the driving IC when viewed in the thickness direction of the substrate. According to such a configuration, it is possible to increase the heat capacity of the heat-dissipating conductor layer, which is advantageous for releasing heat from the light-emitting element.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show an example of an infrared data communication module according to the first aspect of the present invention. As shown in FIG. 1, the infrared data communication module A1 includes a substrate 1, a light emitting element 2, a light receiving element 3, a driving IC 4, a resin package 5, and wires 8. In FIG. 2, the resin package 5, the wires 8, and the wiring pattern to which the wires 8 are connected are omitted for convenience.

  The substrate 1 has a rectangular shape in plan view as shown in FIG. 2, and is configured as a so-called laminated substrate having a first layer 1A and a second layer 1B as shown in FIG. Both the first layer 1A and the second layer 1B are formed of a resin such as glass epoxy. The first layer 1A and the second layer 1B are joined to each other by an adhesive 71.

  A heat radiation conductor layer 6C is formed on the upper surface of the second layer 1B in the drawing. The heat dissipating conductor layer 6C is made of, for example, Cu or Cu alloy, and has a substantially long rectangular shape slightly smaller than the outer shape of the substrate 1 in a plan view as shown in FIG. In the present embodiment, the periphery of the heat dissipation conductor layer 6C is retreated inward by about 0.15 mm from each side surface of the substrate 1. The thickness of the heat dissipating conductor layer 6C is, for example, 18 μm, and is preferably about 10 to 30 μm in order to appropriately exhibit the effects of the present invention described later. In the second layer 1B, a through hole 12 penetrating in the thickness direction is formed. A through-hole conductor layer 6E made of Cu or Cu alloy is formed on the inner surface of the through-hole 12, and the inside thereof is filled with a through-hole resin 73. A heat radiation conductor layer 6D is formed on the lower surface of the second layer 1B in the figure. The heat radiation conductor layer 6D is made of, for example, Cu or Cu alloy, and is an example of the additional heat radiation conductor layer referred to in the present invention. The heat dissipating conductor layers 6C and 6D are connected to each other through the through-hole conductor layer 6E.

  As shown in FIG. 1, a recess 11 is formed in the upper portion of the substrate 1 in the drawing. The recess 11 is for disposing the light emitting element 2 closer to the center of the substrate 1 in the thickness direction. The concave portion 11 is open upward in the figure, and has a tapered shape with a cross-sectional diameter increasing from the bottom surface 11a toward the upper side in the figure. In the present embodiment, the recess 11 penetrates the first layer 1A and the heat radiating conductor layer 6C, and the tip thereof reaches the second layer 1B.

  The recess 11 is covered with a bonding conductor layer 6A. The bonding conductor layer 6A is for bonding the light emitting element 2 and has, for example, a laminated structure including a Cu layer, a Ni layer, and an Au layer. The thicknesses of these Cu layer, Ni layer, and Au layer are, for example, about 5 μm, 5 μm, and 0.5 μm, respectively. The light emitting element 2 is bonded to the bottom 6Aa of the bonding conductor layer 6A. Of the bonding conductor layer 6A, the slope portion 6Ab covering the slope 11b of the recess 11 surrounds the periphery of the light emitting element 2, and reflects the infrared rays traveling from the light emitting element 2 to the upper side in the figure. Used for The slope portion 6Ab of the bonding conductor layer 6A and the heat radiation conductor layer 6C are connected to each other. Thus, the bonding conductor layer 6A, the heat radiation conductor layers 6C and 6D, and the through-hole conductor layer 6E are not only electrically connected, but also have good heat transfer properties.

  As shown in FIG. 2, the bonding conductor layer 6 </ b> A is formed with a donut-shaped flange portion 6 </ b> Ac in a plan view so as to surround the recess 11. An extending portion 6Ad extends from the flange portion 6Ac. On the other hand, a plurality of arc-shaped groove portions 13 are formed on the lower end surface of the substrate 1 in the drawing. Terminal conductor layers 6B are formed at portions where the grooves 13 and the surface of the first layer 1A intersect each other. Of these terminal conductor layers 6B, the one at the right end in the figure is connected to the extending portion 6Ad.

  As shown in FIG. 3, a groove conductor layer 6 </ b> F made of Cu or Cu alloy is formed on the inner surface of the groove 13. The groove conductor layer 6F is connected to the heat dissipation conductor layer 6D. As a result, the bonding conductor layer 6A is electrically connected to the heat dissipation conductor layer 6D and has good heat transfer properties through the groove conductor layer 6F. Furthermore, the lower surface of the heat dissipation conductor layer 6D in the figure is covered with an insulating layer 72. The insulating layer 72 is made of, for example, an epoxy resin. On the lower surface of the insulating layer 72 in the figure, a plurality of mounting terminals 6G are formed corresponding to the plurality of groove portions 13 shown in FIG. Among the plurality of mounting terminals 6G, those shown in FIG. 3 are electrically connected to the heat radiation conductor layer 6D and the bonding conductor layer 6A through the groove conductor layer 6F. The mounting terminal 6G is used for ground connection.

  The light emitting element 2 is made of, for example, an infrared light emitting diode capable of emitting infrared rays, and is connected to a wiring pattern illustrated by wires 8 as shown in FIG. The light receiving element 3 is composed of, for example, a PIN photodiode capable of sensing infrared rays, and is connected to the wiring pattern illustrated by the wire 8. The driving IC 4 is for driving and controlling the transmission / reception operation by the light emitting element 2 and the light receiving element 3, and is connected to the wiring pattern illustrated by the wire 8 and connected to the light emitting element 2 and the light receiving element 3 through the wiring pattern. Has been.

  The resin package 5 is made of, for example, an epoxy resin containing a pigment, and has no translucency for light of any wavelength other than infrared rays, but has transparency for infrared rays. The resin package 5 is formed by a transfer molding method or the like, and is provided on the substrate 1 so as to cover the light emitting element 2, the light receiving element 3, and the driving IC 4 as shown in FIG. As shown in FIGS. 1 and 3, two lens portions 51 and 52 are integrally formed in the resin package 5. Each of the lens portions 51 and 52 has a shape bulging upward in the drawing. The lens unit 51 is positioned in front of the light emitting element 2 and is configured to emit infrared light emitted from the light emitting element 2 while condensing. The lens unit 52 is positioned in front of the light receiving element 3 and is configured to collect the infrared light transmitted to the infrared data communication module A <b> 1 and enter the light receiving element 3.

  Next, the manufacturing method of infrared data communication module A1 is demonstrated below, referring FIGS.

  First, as shown in FIG. 4, a substrate material 10B is prepared. The substrate material 10B is made of a resin such as glass epoxy. The substrate material 10B has a size capable of manufacturing a plurality of the infrared data communication modules A1 described above. 4 to 11 show members necessary for configuring at least one infrared data communication module A1 shown in FIGS. Through holes 12 are formed in the substrate material 10B by machining or the like.

  Next, as shown in FIG. 5, a conductor layer 60B is formed. The conductor layer 60B is formed by plating using Cu, for example. The conductor layer 60B covers the upper and lower surfaces of the substrate material 10B and the inner surface of the through hole 12 in the drawing. A portion of the conductor layer 60B that covers the inner surface of the through hole 12 is a through hole conductor layer 6E.

  After the conductor layer 60B is formed, a heat radiating conductor layer 6C is formed as shown in FIG. The heat radiation conductor layer 6C is formed by patterning the portion of the conductor layer 60B that covers the upper surface of the substrate material 10B in the drawing using, for example, etching. As a result, as shown in FIG. 2, a heat radiation conductor layer 6 </ b> C having a long rectangular shape slightly smaller than the outer shape of the substrate 1 is obtained. For example, in the infrared data communication module A1 shown in FIG. 1, when it is necessary to provide a through hole that penetrates the first layer 1A and the second layer 1B, the heat-dissipating conductor layer is avoided so as to avoid these formed portions. 6C is formed. According to the etching, a portion of the substrate 1 is overlapped with the light emitting element 2, the light receiving element 3, and the driving element IC4 in a plan view while appropriately avoiding the formation portion of the through hole as shown in FIG. The occupying heat dissipating conductor layer 6C can be formed.

  Next, as shown in FIG. 7, a substrate material 10A is prepared, and the substrate material 10A and the substrate material 10B are joined. The substrate material 10A is made of a resin such as glass epoxy, similar to the substrate material 10B, and has a size capable of manufacturing a plurality of infrared data communication modules A1. Bonding of the substrate material 10 </ b> A and the substrate material 10 </ b> B is performed using an adhesive 71. In this bonding, the surface of the substrate material 10B on which the heat radiating conductor layer 6C is formed is directed upward in the drawing, and this surface is bonded to the lower surface of the substrate material 10A in the drawing. Thereby, the laminated substrate material 10 in which the substrate material 10A and the substrate material 10B are laminated via the heat radiation conductor layer 6C is obtained.

  After the laminated substrate material 10 is formed, a recess 11 is formed as shown in FIG. The concave portion 11 is formed, for example, by machining using a cone-shaped drill blade having a flat tip surface. At this time, processing is performed from the upper surface of the laminated substrate material 10 in the drawing, and the tip of the drill blade penetrates through the substrate material 10A, the adhesive 71 and the heat radiation conductor layer 6C, and digs up to a depth that reaches the substrate material 10B. . Thereby, the bottom surface 11a reaches the substrate material 10B, and the recess 11 having the inclined surface 11b is formed. Moreover, the hole as one cross section of the recessed part 11 is formed in 6 C of heat dissipation conductor layers by this machining. In the formation of the heat dissipation conductor layer 6C shown in FIG. 6, if the heat dissipation conductor layer 6C is formed so as to be larger than the recess 11 in the plan view of FIG. The hole can be reliably formed in the layer 6C.

  After the recess 11 is formed, a conductor layer 60A is formed as shown in FIG. The conductor layer 60A is formed by sequentially performing Cu plating, Ni plating, and Au plating so as to cover the upper surface of the substrate material 10A and the recess 11 in the drawing. The plating thicknesses of these Cu plating, Ni plating, and Au plating are about 5 μm, 5 μm, and 0.5 μm, respectively. Thereby, the conductor layer 60A has a laminated structure including a Cu layer, a Ni layer, and an Au layer. When forming the conductor layer 60 </ b> A, the heat-dissipating conductor layer 6 </ b> C is exposed at a part of the slope 11 b of the recess 11. For this reason, when the conductor layer 60A is formed by the plating process, the conductor layer 60A can be connected to the exposed portion of the heat dissipation conductor layer 6C. Thus, the manufacturing method of the present embodiment can reliably connect the conductor layer 60A and the heat-dissipating conductor layer 6C, electrically conducting them, and having good thermal conductivity with each other. It is suitable for. From the viewpoint of improving the electrical continuity and heat transfer between the conductor layer 60A and the heat dissipation conductor layer 6C, it is desirable to form the recess 11 so as to penetrate the heat dissipation conductor layer 6C. In the formation of the recess 11 shown in FIG. 8, the tip of the recess 11 may reach at least the heat radiating conductor layer 6C. In this way, at least the conductor layer 60A and the heat radiation conductor layer 6C can be connected.

  Next, by forming a pattern on the conductor layer 60A, the bonding conductor layer 6A shown in FIG. 10 and other wiring patterns are formed. This pattern formation is performed so as to leave a portion covering the recess 11 and a portion surrounding the recess 11 in the conductor layer 60A shown in FIG. Thereby, the bonding conductor layer 6A having the bottom portion 6Aa, the slope portion 6Ab, and the flange portion 6Ac is formed. Further, a heat radiation conductor layer 6D shown in FIG. 10 is formed by forming a pattern on the lower surface portion of the conductor layer 60B shown in FIG.

  After the bonding conductor layer 6A is formed, the light emitting element 2, the light receiving element 3, and the driving IC 4 are mounted as shown in FIG. For example, the light emitting element 2 is bonded to the bottom 6Aa of the bonding conductor layer 6A via a conductive resin or the like. Then, the upper surface of the light emitting element 2 in the drawing and the wiring pattern formed on the substrate material 10A are connected by the wire 8 by a wire bonding technique. Similarly, the light receiving element 3 and the driving IC 4 are mounted on the substrate material 10A, and the upper surface in these drawings and the wiring pattern are connected by the wire 8.

  Thereafter, sealing processing of the light emitting element 2, the light receiving element 3, and the driving IC 4 by resin molding using a transfer molding method or the like, formation of the insulating layer 72 covering the heat radiating conductor layer 6D, and the like are performed. A plurality of infrared data communication modules A1 shown in FIG. 1 can be manufactured by cutting the laminated substrate material 10 so as to be divided.

  In addition, although this embodiment is an example which manufactures several infrared data communication module A1 collectively using board | substrate material 10A, 10B, this is the convenience for improving manufacturing efficiency and reducing cost. . As will be described later, in order to exert the intended effect of the present invention, it is not necessary to manufacture a plurality of pieces at once, and instead of the substrate materials 10A and 10B, the first layer 1A and the second layer shown in FIG. 1B may be formed in advance and the infrared data communication module A1 may be manufactured using these.

  Next, the operation of the infrared data communication module A1 will be described.

  According to the present embodiment, heat generated by energization of the light emitting element 2 can be appropriately dissipated. That is, as shown in FIG. 1, the upper side and the side of the light emitting element 2 in the drawing are covered with a resin package 5 having a relatively low thermal conductivity. For this reason, most of the heat generated in the light emitting element 2 is transmitted to the bonding conductor layer 6A having a relatively high thermal conductivity. Since the bonding conductor layer 6A is connected to the heat radiating conductor layer 6C, the heat is transferred from the bonding conductor layer 6A to the heat radiating conductor layer 6C. Thereby, it can avoid that the said heat accumulates around the light emitting element 2, and can prevent that infrared data communication module A1 becomes high temperature too much. Therefore, it is possible to increase the current for power supply to the light emitting element 2, and to increase the light amount of the infrared data communication module A1 by increasing the output. This is suitable for enabling the infrared data communication module A1 to be used not only for data communication but also for remote control.

  Since the concave portion 11 penetrates the heat radiating conductor layer 6C, the heat radiating conductor layer 6C is connected so as to intersect the slope portion 6Ab of the bonding conductor layer 6A. Thereby, the heat-dissipating conductor layer 6C and the bonding conductor layer 6A are securely bonded, which is suitable for enhancing the mutual heat transfer property.

  In the present embodiment, as shown in FIG. 2, the heat dissipation conductor layer 6 </ b> C is sized to overlap the light emitting element 2, the light receiving element 3, and the driving IC 4, thereby increasing the heat capacity of the heat dissipation conductor layer 6 </ b> C. Can be planned. The larger the heat capacity, the easier it is to release heat from the light emitting element 2 to the heat radiating conductor layer 6C via the bonding conductor layer 6A. Therefore, it is preferable for increasing the current. In addition, it is convenient to connect the bonding conductor layer 6A and the heat dissipating conductor layer 6C if the heat dissipating conductor layer 6C has a size larger than at least the recess 11.

  Further, the heat transferred to the heat radiating conductor layer 6C can be released to the heat radiating conductor layer 6D through the through-hole conductor layer 6E. As shown in FIGS. 1 and 3, the heat dissipating conductor layer 6 </ b> D is provided on the lower surface of the substrate 1 in the drawing and has a small heat transfer coefficient with the atmosphere. Therefore, the heat transferred to the heat radiating conductor layer 6C is preferably released to the heat radiating conductor layer 6D and further dissipated out of the infrared data communication module A1. As shown in FIG. 3, in this embodiment, heat can be released from the bonding conductor layer 6A to the heat radiation conductor layer 6D through the groove conductor layer 6F. This is preferable for dissipating the heat generated in the light emitting element 2 to the outside of the infrared data communication module A1.

  The heat radiating conductor layers 6C and 6D, the through-hole conductor layer 6E, and the groove conductor layer 6F are made of Cu or Cu alloy having a relatively high thermal conductivity, which is advantageous for promoting the heat dissipation effect.

  According to the experiments by the inventors, in the infrared data communication module A1 of the present embodiment, the heat radiation amount per unit time is improved about twice as much as that of the infrared data communication module having the conventional configuration. I was able to. Thus, for example, when a current of 200 mA is applied to the light emitting element 2, the temperature around the light emitting element 2 is 80 ° C. or higher in the infrared data communication module configured as the conventional example. In the infrared data communication module A1 of the form, it was suppressed to about 65 ° C. The light emitting element 2 is mainly used for the infrared data communication module A1 used for data communication. For example, if a large current of 200 mA can be applied, the light emitting element 2 is placed a few meters away from the infrared data communication module A1. It is possible to emit an infrared ray having a sufficient amount of light to operate the electronic device. Therefore, if the infrared data communication module A1 is mounted on, for example, a mobile phone, the electronic device can be operated by remote control using the mobile phone.

  12 and 13 show another example of an infrared data communication module to which the first aspect of the present invention is applied. In these drawings, elements similar to those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  The infrared data communication module A2 shown in FIG. 12 is different from the above-described embodiment in that a heat radiation conductor layer 6C is formed on the lower surface of the first layer 1A in the drawing. That is, in this embodiment, instead of forming the conductor layer 60B on the upper surface of the substrate material 10B shown in FIG. 5 in the manufacturing method shown in FIGS. 4 to 11, the substrate material 10A shown in FIG. A conductor layer for forming the heat radiating conductor layer 6C is formed on the lower surface in FIG. Also in such an embodiment, the bonding conductor layer 6A and the heat dissipation conductor layer 6C can be reliably connected, and the heat generated from the light emitting element 2 can be appropriately dissipated.

  In the infrared data communication module A3 shown in FIG. 13, the recess 11 does not penetrate the heat dissipation conductor layer 6C, and the tip of the recess 11 reaches the heat dissipation conductor layer 6C. It has not reached 1B. In the present embodiment, it is possible to connect the bonding conductor layer 6A and the heat dissipation conductor layer 6C with a relatively large area. Accordingly, heat transfer from the bonding conductor layer 6A to the heat radiation conductor layer 6C can be promoted. In order to manufacture such an infrared data communication module A3, in the manufacturing method shown in FIGS. 4 to 7, before the substrate material 10A and the substrate material 10B are laminated, the substrate material 10A is tapered. If the through hole is formed, the recess 11 shown in FIG. 13 can be appropriately formed.

Optical communication module according to the present invention is not limited to the embodiments described above. The specific structure of each part of the optical communication module according to the present invention may be modified in various ways.

  The light emitting element and the light receiving element are not limited to those capable of emitting or receiving infrared rays, and those capable of emitting or receiving visible light may be used. That is, the optical communication module is not limited to the infrared data communication module, and may be a communication system using visible light. Further, the optical communication module is not limited to a module capable of bidirectional communication, and may be a data transmission module including only a light emitting element.

It is sectional drawing which shows an example of the infrared data communication module which concerns on this invention. It is a principal part top view which shows an example of the infrared data communication module which concerns on this invention. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the infrared data communication module which concerns on this invention. It is principal part sectional drawing which shows the other example of the infrared data communication module which concerns on this invention. It is principal part sectional drawing which shows the other example of the infrared data communication module which concerns on this invention. It is principal part sectional drawing which shows an example of the conventional infrared data communication module.

A1, A2, A3 Infrared data communication module (optical communication module)
DESCRIPTION OF SYMBOLS 1 Board | substrate 1A 1st layer 1B 2nd layer 2 Light emitting element 3 Light receiving element 4 Driver IC
5 Resin Package 6A Bonding Conductor Layer 6B Terminal Conductor Layer 6C Heat Dissipation Conductor Layer 6D (Additional) Heat Dissipation Conductor Layer 6E Through Hole Conductor Layer 6F Groove Conductor Layer 6G Mounting Terminal 8 Wire 10 Multilayer Substrate Material 10A, 10B Substrate Material 11 Recess 11a (Recess) Bottom 11b (Recess) Slope 12 Through-hole 13 Groove 51, 52 Lens 60A, 60B Conductive layer 71 Adhesive 72 Insulating layer 73 Through-hole resin

Claims (7)

A substrate on which a recess opening on the surface is formed;
A bonding conductor layer formed to cover at least the bottom surface of the recess;
A light emitting device mounted on the bonding conductor layer;
An optical communication module comprising:
The substrate is a laminated substrate including a first layer having an opening of the concave portion and a second layer laminated on the side opposite to the opening with respect to the first layer,
Further comprising a heat dissipation conductor layer sandwiched between the first layer and the second layer and connected to the bonding conductor layer,
The concave portion penetrates the first layer and the heat-dissipating conductor layer, and its bottom surface is located in the second layer, and is formed in the first layer among the inner surfaces of the concave portion. And the portion formed in the second layer are continuous with each other,
The heat dissipating conductor layer is patterned in a region avoiding the bonding conductor layer, and its outer periphery is surrounded by an adhesive,
A resin package that covers the light emitting element and has a lens portion positioned in front of the light emitting element ,
A through hole extending from the surface of the second layer on which the heat-dissipating conductor layer is formed to the surface of the substrate opposite to the opening of the recess is formed, and on the inner surface of the through hole Has a through-hole conductor layer connected to the conductor layer for heat dissipation,
An additional heat radiation conductor layer connected to the through-hole conductor layer is further formed on the surface of the substrate opposite to the opening of the recess,
A groove portion extending in the thickness direction is formed on the side surface of the substrate,
An optical communication module, wherein a groove conductor layer connected to both the bonding conductor layer and the additional heat dissipation conductor layer is formed in the groove .   The optical communication module according to claim 1, wherein the heat dissipation conductor layer is made of Cu or a Cu alloy.   The optical communication module according to claim 1, wherein the heat dissipating conductor layer is larger in size in the thickness direction of the substrate than the concave portion. The optical communication module according to claim 1, wherein the additional heat-dissipating conductor layer is made of Cu or a Cu alloy . The optical communication module according to claim 1 , wherein the concave portion has a tapered shape having a diameter that increases from the bottom surface toward the opening . The light emitting element can emit infrared rays,
A light receiving element for receiving infrared light;
A drive IC for driving and controlling the light emitting element and the light receiving element,
It is configured as an infrared data communication module, the optical communication module according to any one of claims 1 to 5. The optical communication module according to claim 6 , wherein the heat dissipating conductor layer overlaps each of the light emitting element, the light receiving element, and the driving IC in a thickness direction view of the substrate .

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