JP4915940B2 - Image processing data creation method and image processing data creation device - Google Patents

Description

  The present invention relates to an image processing data creation method and an image processing data creation device for creating image processing data by taking in image data of a leaded part or a BGA type part.

As described in Patent Document 1 (Japanese Patent Laid-Open No. 7-122900), image data of electronic parts photographed with a camera is taken into an image processing CPU to automatically create image processing data. There is something.
Japanese Patent Laid-Open No. 7-122900

  When image processing data is created from image data of a leaded part or a BGA type part, the actual part size has a manufacturing variation (tolerance) of about several μm to several tens of μm with respect to a specification value. Moreover, if image processing data is created based on parts with manufacturing variations, an inappropriate part center is obtained, and as a result, if the part is mounted at an angle different from the photographed angle, a mounting position shift occurs. There is a possibility that.

  The present invention has been made in consideration of such circumstances. Therefore, the object of the present invention is to automatically create image processing data from image data obtained by photographing a part and differ from the photographing angle at the time of creating the data. An object of the present invention is to provide an image processing data creation method and an image processing data creation apparatus capable of creating image processing data capable of preventing mounting position deviation even when parts are mounted at an angle.

  In order to achieve the above-mentioned object, the present invention creates image processing data by taking in image data of a leaded part that is a target for creation of image processing data. When recognizing the lead row of the side and creating coordinate data of the center position of the lead row of each side, the lead pitch direction coordinate of the center position is made to coincide with the origin of the reference coordinate, and the lead length of the center position The direction coordinates are set to actual measurement values actually measured from the image data. By mounting components using the image processing data created in this way, mounting position deviation can be prevented even when components are mounted at an angle different from the shooting angle at the time of image processing data creation.

In this case, the reference coordinates may be XY coordinates in which the center of the component is the origin and each coordinate axis is parallel to the lead pitch direction and the lead length direction of the lead row on each side.
Further, the image processing data may include data on the coordinates of the center position of the lead row on each side, the number of leads on each side, the lead pitch, the lead width, and the lead length.

  Further, the lead pitch direction coordinates of the center positions of the two opposing lead rows are measured based on the image data of the leaded parts, and only when the deviation between the measured values of the two coordinates is within a predetermined value, If the lead pitch direction coordinate of the reference line coincides with the origin of the reference coordinate and the deviation of the measured value of the coordinate exceeds a predetermined value, the lead pitch direction coordinate of the center position of the lead row on the two sides is offset. It may be determined that the component is a component, and the lead pitch direction coordinate of the center position is set to the actually measured value. In this way, it is possible to prevent the problem of creating image processing data by confusing a part with a specification in which the lead pitch direction coordinates of the center position of the two opposing lead rows are offset with a part having no offset.

  In addition, the lead row of each side is recognized based on the image data of the leaded component, and the symmetrical part of the two opposing lead rows is grouped as a symmetrical lead row, and the two opposite sides of each group When the coordinate data of the center position of the symmetrical lead row is created, the lead pitch direction coordinates of the center positions of the two opposing sides of each group are matched, and the lead length direction coordinates of the center position are You may make it set to the actual value measured from image data. Even in this case, it is possible to create image processing data with high image processing accuracy from the image data of the leaded component.

Further, when image processing data is created by taking in image data on the mounting surface side of a BGA type component that is a target for creating image processing data, the image processing data is generated based on the image data on the mounting surface side of the BGA type component. When recognizing a ball of a part and creating image processing data for the ball, a circumscribed rectangle circumscribing the ball located on the outermost side of each side of the part is calculated, and the center of this circumscribed square is the origin of the reference coordinates The image processing data including the data of the ball diameter of the BGA type component , the ball pitch, and the coordinates of the ball located on the outermost side may be created. In this way, effective center correction can be easily performed, and image processing data with high image processing accuracy can be created from image data of BGA type components.

  In this case, the reference coordinates may be XY coordinates in which each coordinate axis is parallel to each side of the component. Further, the coordinates of the center position of the circumscribed rectangle are measured, and the center of the circumscribed rectangle is set as the reference coordinate origin only when the deviation between the measured value of the center position coordinate and the reference coordinate origin is within a predetermined value. When the deviation exceeds the predetermined value, it is determined that the ball is an offset specification part, and the coordinate of the center position of the circumscribed rectangle is set to the actual measurement value. good. In this way, it is possible to prevent the problem of creating image processing data by mistaking a part having a specification with an offset ball arrangement as a part having no offset.

  Hereinafter, three Examples 1 to 3 embodying the best mode for carrying out the present invention will be described.

A first embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the image processing data creation device includes a computer 11 such as a personal computer, image data capturing means 12 such as a camera for capturing image data of components, an input device 13 such as a keyboard and a mouse, and the like. The display device 14 includes a liquid crystal display, a CRT, and the like, and a storage device 15 that stores programs and data described later. The computer 11 functions as a lead recognizing unit that recognizes the lead row of each side based on the image data of the component with lead according to the image processing data creation procedure of FIG. It functions as data creation means for creating coordinate data of the center position of the lead row on each side.

Hereinafter, a method of creating data for image processing of the leaded component 21 according to the first embodiment will be described with reference to FIG.
First, in step 101, the temporary center of the leaded component 21 captured by the image data capturing means 12 is designated by a caliper as the origin of XY coordinates (reference coordinates) (see FIG. 3). At this time, the coordinate axes of the XY coordinates are parallel to the lead pitch direction and the lead length direction of the lead rows AD of each side of the component 21 (that is, to be parallel to each side of the component 21). The XY coordinates or the orientation (angle) of the image of the component 21 is corrected with a caliper.

  Thereafter, the process proceeds to step 102, and the size of the body (chip portion) of the component 21 is input. For example, the size of the body of the component 21 is automatically input by dragging a rectangular frame displayed on the screen of the display device 14 with a mouse or the like and overlapping the outline of the body of the component 21. You should do so.

  Thereafter, the process proceeds to step 103, where the lead length, lead pitch and lead width of each side outside the body of the component 21 are measured, and the coordinates of the center positions Ea to Ed of the lead rows A to D of each side are measured. Measure. This step 103 is performed for all four sides (step 104). At this time, the center positions Ea to Ed of the lead rows A to D are set on the outline of the body of the component 21 as shown in FIG.

  Thereafter, the process proceeds to step 105, and the lead length, lead pitch, and lead width variation (for example, the difference between the maximum value and the minimum value or the standard deviation) is calculated. Then, in the next step 106, it is determined whether or not the variation is equal to or smaller than a predetermined value. If the variation is equal to or smaller than the predetermined value, it is determined that all the leads of the component 21 have the same specification. In step 107, the average value of the lead length, the lead pitch, and the lead width of each side is calculated, and the lead rows A to D having the average value are copied to each side.

  On the other hand, if it is determined in step 106 that the variation is equal to or greater than a predetermined value, it is determined that the lead of the component 21 has a different specification, and the average value in step 107 is not copied.

Thereafter, the process proceeds to step 108, and whether or not the deviation in the lead pitch direction of the center positions Ea and Ec of the upper and lower lead rows A and C (deviation of the X coordinates of the center positions Ea and Ec) is ½ or less of the lead pitch. If the deviation is equal to or less than ½ of the lead pitch, it is determined that the center positions Ea and Ec of the upper and lower lead rows A and C are not offset in the lead pitch direction (X-axis direction). In step 109, the X coordinate, which is the lead pitch direction coordinate of the center positions Ea, Ec of the upper and lower lead rows A, C, is corrected to the origin (0) (see FIG. 4) and is the lead length direction coordinate. Only the Y coordinate is the actual measurement value.
Ea (0, measured value)
Ec (0, measured value)

On the other hand, if it is determined in the above step 108 that the deviation in the lead pitch direction of the center positions Ea and Ec of the upper and lower lead rows A and C is 1/2 or more of the lead pitch, the upper and lower lead rows A , C center positions Ea, Ec are determined to be offset in the lead pitch direction (X-axis direction), and the processing of step 109 is not performed. In this case, both the X and Y coordinates of the center positions Ea and Ec are actually measured values.
Ea (actual value, actual value)
Ec (actual value, actual value)

Thereafter, the process proceeds to step 110, where the deviation of the center positions Eb, Ed of the left and right lead rows B, D in the lead pitch direction (deviation of the Y coordinates of the center positions Eb, Ed) is ½ or less of the lead pitch. If the deviation is 1/2 or less of the lead pitch, it is determined that the center positions Eb and Ed of the left and right lead rows B and D are not offset in the lead pitch direction (Y-axis direction). In step 111, the Y coordinate, which is the lead pitch direction coordinate of the center positions Eb, Ed of the left and right lead rows B, D, is corrected to the origin (0) (see FIG. 4) and is the lead length direction coordinate. Only the X coordinate is the actual measurement value.
Eb (actual value, 0)
Ed (actual value, 0)

On the other hand, if it is determined in step 110 that the shift in the lead pitch direction of the center positions Eb, Ed of the left and right lead rows B, D is equal to or greater than ½ of the lead pitch, the left and right lead rows B , D center positions Eb, Ed are determined to be offset in the lead pitch direction (Y-axis direction), and the processing of step 111 is not performed. In this case, both the X and Y coordinates of the center positions Eb and Ed are actually measured values.
Eb (actual value, actual value)
Ed (actual value, actual value)

  In steps 108 and 110, the determination value for determining the deviation of the center positions Ea to Ed in the lead pitch direction is set to ½ of the lead pitch, but is set to a value smaller or larger than this. You may do it.

  According to the first embodiment described above, only when the deviation in the lead pitch direction at the center position of the two opposing lead rows is equal to or less than a predetermined determination value (1/2 or less of the lead pitch) The lead pitch direction coordinate of the center position of the lead row on the two sides is made to coincide with the origin of the XY coordinate (reference coordinate), and the lead length direction coordinate of the center position is set to an actual measurement value measured from the image of the component 21. ing.

  FIG. 7 shows an example of image processing data created by the method of the first embodiment in comparison with actual measurement values and specification values (each data in FIG. 7 is an example different from those in FIGS. 3 and 4). Is shown). The image processing data includes data on the coordinates of the center positions Ea to Ed of the lead rows A to D on each side, the number of leads on each side, the lead pitch, the lead width, and the lead length. The lead pitch, lead width, and lead length are values averaged for each of the lead rows A to D on each side. Regarding the lead pitch direction coordinates of the center positions Ea to Ed of the lead rows A to D on each side, the image processing data matches the specification value (0).

  By the way, in the positioning algorithm of the component 21 having the lead rows A to D on the four sides, as shown in FIG. 5, straight lines passing through the center positions Ea and Ec of the upper and lower lead rows A and C and the left and right lead rows B and The intersection point of the straight line passing through the center positions Eb and Ed of D is the coordinate of the center position F of the component 21. This is to cancel a positioning error due to a difference in lead length.

  However, the center position F varies considerably depending on the angle (orientation) of the component 21 as shown in FIGS. For this reason, when image processing data is created using the center position F as the origin of the XY coordinates (reference coordinates), when the component 21 is mounted at an angle different from the shooting angle at the time of the data creation, the mounting position shift is not performed. May occur.

  On the other hand, in the first embodiment, the lead pitch direction coordinates of the center positions Ea to Ed of the lead rows A to D on each side are made to coincide with the origin of the XY coordinates (reference coordinates), and the center positions Ea to Ed are set. Since the image data is generated by setting the lead length direction coordinate to the actual measurement value measured from the image of the component 21, if the component 21 is mounted using the image processing data, the image processing data is used. Even when the component 21 is mounted at an angle different from the shooting angle at the time of data creation, the mounting position shift can be prevented.

  Moreover, in the first embodiment, only when the deviation in the lead pitch direction at the center position of the two opposing lead rows is equal to or less than a predetermined determination value (less than 1/2 of the lead pitch), Since the lead pitch direction coordinates of the center position of the lead row are made to coincide with the origin of the XY coordinates (reference coordinates), the parts having the specifications in which the lead pitch direction coordinates of the center positions of the lead rows on the opposite sides are offset are used. Therefore, it is possible to prevent a problem that the image processing data is created by being confused with a component having no offset.

A second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, when the ball image processing data of the component is recognized based on the image data on the mounting surface side of the BGA component shown in FIGS. A circumscribed rectangle circumscribing the ball located on the outermost side of each side is calculated, and the center of the circumscribed rectangle is made coincident with the origin of the reference coordinates (XY coordinates) to create image processing data for the BGA type part.

  Here, FIG. 9 is an image obtained by photographing a ball arrangement of a BGA type part having a general matrix bump, FIG. 10 is an image obtained by photographing a ball arrangement of a BGA type part having a hollow ball arrangement, and FIG. FIG. 12 is an image obtained by photographing a ball arrangement of a BGA type component in which balls are randomly arranged.

Hereinafter, a method for creating data for image processing of a BGA type part according to the second embodiment will be described with reference to FIG.
First, in step 201, the temporary center of the BGA type part captured by the image data capturing unit 12 is designated by a caliper as the origin of the XY coordinates (reference coordinates). At this time, the orientation of the XY coordinates or the image of the component is corrected by a caliper so that each coordinate axis of the XY coordinate is parallel to each side of the component.

  Thereafter, the process proceeds to step 202, and after inputting the size of the body (chip portion) of the part, the process proceeds to step 203, and the ball diameter and the ball pitch inside the body are calculated. In the next step 204, all balls are searched and grouped.

  Thereafter, the process proceeds to step 205, where the average value of the ball diameter and the ball pitch is calculated for each group, and the coordinates of the outermost ball are calculated. Then, in the next step 206, the variation in the ball diameter and the ball pitch (for example, the difference between the maximum value and the minimum value or the standard deviation) is equal to or less than a predetermined value (for example, 1/2 or less of the ball diameter and 1/2 of the ball pitch). If the variation is less than or equal to a predetermined value, it is determined that the ball arrangement has the same specification, and the process proceeds to step 207, where the average value of the ball diameter and the ball pitch is assigned to each group. make a copy.

  On the other hand, if it is determined in step 206 that the variation is equal to or greater than a predetermined value, it is determined that the ball arrangement has a different specification, and the average value in step 207 is not copied.

  Thereafter, the process proceeds to step 208, and the process of calculating the coordinates of the outermost balls of the current group and the next group is repeated (step 209). Then, after calculating the coordinates of the outermost balls of all the groups, the process proceeds to step 210, and the size of the circumscribed rectangle circumscribing the outermost balls and the coordinates of the center thereof are calculated.

  Thereafter, the process proceeds to step 211, where it is determined whether or not the deviation of the center of the circumscribed rectangle is equal to or less than a predetermined value (for example, 1/2 or less of the ball pitch). Proceed and correct the center coordinates to the origin (0, 0) of the XY coordinates.

  On the other hand, if it is determined in step 211 that the deviation of the center of the circumscribed rectangle is larger than a predetermined value, the coordinates in the step 211 are not corrected, and the coordinates of the center are used as actual measurement values. Even in the case of the random bump shown in FIG. 12, the coordinates in the above step 211 are not corrected, and the center coordinates are used as the actual measurement values.

  According to the second embodiment described above, the circumscribed rectangle circumscribing the ball located on the outermost side of each side of the BGA type part is calculated, and the center of the circumscribed rectangle coincides with the origin of the reference coordinate (XY coordinate). Since the image processing data for the BGA type part is created, the effective center correction can be easily performed, and the image processing data with high image processing accuracy can be obtained from the image data of the BGA type part. Can be created.

  In the third embodiment of the present invention shown in FIG. 13, the lead row on each side is recognized based on the image data of the leaded component, and the symmetrical portion of the two opposite lead rows is defined as the symmetrical lead row. When creating the coordinate data of the center positions of the symmetric lead rows of the two opposing sides of each group, the lead pitch direction coordinates of the center positions of the symmetric lead rows of the two opposing sides of each group are matched, The lead length direction coordinate of the center position is set to an actual measurement value actually measured from the image data.

  In the example of FIG. 13, the coordinates of the center positions a and b of the symmetric lead rows on the two opposite sides of the first group are a (x1, actually measured value) and b (x1, actually measured value). The coordinates of the center positions c and d of the two-side symmetric lead row are c (x2, actual measured value) and d (x2, actual measured value). Further, the coordinates of the center positions e and f of the two symmetrical symmetrical lead rows of the third group are e (actually measured value, y3) and f (actually measured value, y3).

  In this case, if x1 = -x2, the center positions a and b of the symmetric lead row of the first group and the center positions c and d of the symmetric lead row of the second group are symmetric with respect to the Y coordinate axis. For x1 and x2, for example, values obtained by averaging measured values of the X coordinates of the respective center positions a to d may be used. In the example of FIG. 13, the left and right lead rows only form one group (third group) and are not divided into a plurality of groups. Therefore, as in the first embodiment, the lead pitch at the center positions e and f The Y coordinate (y3), which is the direction coordinate, may be corrected to the origin (0).

1 is a block diagram schematically showing the configuration of an image processing data creation device in Embodiment 1 of the present invention. 3 is a flowchart illustrating a procedure for creating image processing data according to the first exemplary embodiment. It is a figure explaining the process which measures the coordinate of center position Ea-Ed of lead row AD of each side. It is a figure explaining the process which makes the lead pitch direction coordinate of center position Ea-Ed of lead row | line | column AD of each side correspond to the origin of an XY coordinate. It is a figure explaining the positioning algorithm of components provided with lead row AD on four sides. It is a figure explaining that the center position F of components changes with the angle (direction) of components. It is a figure explaining an example of the data for image processing created with the method of Example 1 by comparing with an actual measurement value and a specification value. 10 is a flowchart illustrating a procedure for creating image processing data according to the second embodiment. It is a figure which shows the image which image | photographed the ball | bowl arrangement | sequence of the BGA type | mold part of a general matrix bump. It is a figure which shows the image which image | photographed the ball | bowl arrangement | sequence of the BGA type | mold part of a hollow ball | bowl arrangement | sequence. It is a figure which shows the image which image | photographed the ball | bowl arrangement | sequence of BGA type components without 1 pin. It is a figure which shows the image which image | photographed the ball | bowl arrangement | sequence of the BGA type | mold component by which the ball | bowl was arranged at random. FIG. 10 is a diagram for explaining a grouping method of lead rows in Example 3.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Computer (lead recognition means, data creation means), 12 ... Image data capture means, 13 ... Input device, 14 ... Display device, 15 ... Storage device, 21 ... Parts, AD ... Lead row, Ea- Ed ... The center position of the lead row, ad ... The center position of the symmetric lead row

Claims (10)

In an image processing data creation method for creating image processing data by capturing image data of a leaded component that is a creation target of image processing data,
When recognizing the lead row of each side based on the image data of the leaded part and creating the coordinate data of the center position of the lead row of each side, the lead pitch direction coordinate of the center position is the origin of the reference coordinate And setting the coordinates in the lead length direction of the center position to measured values actually measured from the image data.   2. The XY coordinate system according to claim 1, wherein the reference coordinates are XY coordinates in which the center of the component is an origin and each coordinate axis is parallel to a lead pitch direction and a lead length direction of the lead row on each side. Data processing method for image processing.   3. The image processing data includes data on coordinates of a center position of a lead row on each side, the number of leads on each side, a lead pitch, a lead width, and a lead length. To create image processing data.   The lead pitch direction coordinates of the center positions of the two opposing lead rows are measured based on the image data of the leaded parts, and only when the deviation between the measured values of the two coordinates is within a predetermined value, The lead pitch direction coordinate is made coincident with the origin of the reference coordinate, and when the deviation of the measured value of the coordinate exceeds a predetermined value, the lead pitch direction coordinate of the center position is set to the measured value. The image processing data creation method according to claim 1. In an image processing data creation method for creating image processing data by capturing image data of a leaded component that is a creation target of image processing data,
Based on the image data of the leaded parts, the lead row of each side is recognized, and the symmetrical part of the two opposite lead rows is grouped as a symmetrical lead row, and the two opposite sides of each group are grouped. When creating the coordinate data of the center position of the symmetric lead row, the lead pitch direction coordinates of the center positions of the symmetric lead rows of the two opposing sides of each group are matched, and the lead length direction coordinates of the center position are the image. A method for creating data for image processing, characterized in that an actual measured value is set from data. In an image processing data creation method for creating image processing data by capturing image data on the mounting surface side of a BGA type component to be created for image processing data,
Recognizing the ball of the component based on the image data on the mounting surface side of the BGA type component and creating the image processing data of the ball, it circumscribes the ball located on the outermost side of each side of the component Calculate the circumscribed rectangle and make the center of the circumscribed rectangle coincide with the origin of the reference coordinates to create the image processing data including the ball diameter and pitch of the BGA type part and the coordinates of the outermost ball coordinates. A method of creating data for image processing.   The image processing data creation method according to claim 6, wherein the reference coordinates are XY coordinates in which each coordinate axis is parallel to each side of the part.   The coordinates of the center of the circumscribed rectangle are measured, and the center of the circumscribed rectangle matches the origin of the reference coordinates only when the deviation between the measured value of the coordinates of the circumscribed rectangle and the origin of the reference coordinates is within a predetermined value. The image processing data creation method according to claim 6 or 7, wherein when the deviation exceeds a predetermined value, the coordinates of the center position are set to the actually measured value. In an image processing data creation device that creates image processing data by capturing image data of a leaded component that is a target for creation of image processing data,
Lead recognizing means for recognizing a lead row of each side based on image data of the leaded component;
Data creation means for creating the coordinate data of the center position of the lead row of each side using the recognition result of the lead recognition means,
The data creation means matches the lead pitch direction coordinate of the center position of the lead row of each side with the origin of the reference coordinate, and sets the lead length direction coordinate of the center position to an actually measured value measured from the image data. An image processing data creation device characterized by the above. In an image processing data creation apparatus that creates image processing data by taking in image data on the mounting surface side of a BGA type component that is a creation target of image processing data,
Ball recognition means for recognizing the ball of the component based on image data on the mounting surface side of the BGA type component;
Data creation means for creating data for image processing of the ball using the recognition result of the ball recognition means,
The data creation means calculates a circumscribed rectangle circumscribing the ball located on the outermost side of each side of the component, and matches the center of the circumscribed rectangle with the origin of the reference coordinates so that the ball diameter and the ball pitch of the BGA type component. An image processing data creation device for creating image processing data including data of coordinates of the ball located on the outermost side .

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