JP2005221287A - Method and apparatus for inspecting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an efficient and highly accurate method and an apparatus for inspecting substrates capable of improving inspection accuracy while shortening the time required for inspection. <P>SOLUTION: In substrate inspections, images of inspection points of the mounting locations of parts, circuit patterns, etc. arranged on substrates are acquired by scanning with a scanning type sensor to inspect the location of each inspection point. By measuring the location of each base mark on the substrate in each substrate, the amount of locational displacement of the substrate itself is computed. By relating data on the reference locations of adjacent marks arranged adjacently to the inspection points on the substrate to computation results, the locations of the adjacent marks and the inspection points are measured with high locational accuracy. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection method and an inspection apparatus for a component mounting board in which components are mounted on a substrate, and images a mounting position of a component mounted on the substrate and an image of a formed circuit pattern using a line sensor camera. Thus, the present invention relates to a board inspection method and a board inspection apparatus for inspecting the mounting position of the component and the formation position of a circuit pattern.

  Conventionally, inspection points on a component mounting board on which a component is mounted on a substrate (circuit board), for example, a component mounting position of a component (electronic component etc.) mounted on the substrate and an electronic circuit pattern formed on the substrate In the inspection of the formation position (inspection point), the component mounting position and the electronic circuit pattern are scanned by scanning the substrate using a scanning sensor, for example, a line sensor camera (so-called scanning camera or the like). The image of the formation position is acquired, and by analyzing the acquired image, each position is measured to check whether the position is as designed.

  In addition, when acquiring an image by scanning with such a line sensor camera, all the positions on the substrate are scanned to acquire an image of the entire substrate, and a necessary image is obtained based on the image. Although it is theoretically possible to take out the image of the inspection point and perform the above inspection, acquiring and analyzing the image of the entire substrate is a huge amount of data. The processing capability of an arithmetic unit or the like takes a long processing time, and is not practical for substrate inspection that is performed continuously on a large number of substrates. For example, when an image of a 1 mm wide area on a substrate is acquired with a resolution that can perform such an inspection process, the amount of data is as large as 2 MB. For example, in the case of a motherboard of a notebook personal computer having a size of 119.5 mm × 235 mm, the image data on the surface is about 1056 MB.

  Therefore, in such a substrate inspection, in order to shorten the processing time, the above inspection is performed by acquiring only images of necessary positions (regions) on the substrate. In addition, in order to reliably specify the necessary position, that is, the position of the inspection point and to reliably acquire the image, two predetermined marks on the substrate are measured, and the result is the substrate. The overall positional deviation and rotational deviation are calculated, and the position (incorrection) of the position of each inspection point is calculated based on the result (see, for example, Patent Document 1).

  FIG. 14 is a schematic explanatory view showing the contents of such a conventional substrate inspection method. As shown in FIG. 14, four flexible substrates 502 are attached to the upper surface of the multi-sided substrate 501 (substrate assembly) in a state of being aligned and adjacent to each other. The board 502 includes inspection points 504 and 505 such as component mounting positions. The multi-sided substrate 501 has a function as a conveyance support member for efficiently and surely conveying each flexible substrate 502. Furthermore, a base serving as a reference position for detecting a positional deviation or a rotational deviation in the arrangement of the entire multi-sided substrate 501 is provided at each corner of a pair of diagonals on the upper surface of the substantially square-shaped multi-sided substrate 501. A mark 503 is provided. Further, as shown in FIG. 14, the inspection points 504 and 505 arranged on the respective substrates 502 can be roughly divided into two types, and the inspection accuracy compared with the other type of inspection points. There are an inspection point 504 that requires high accuracy and an inspection point 505 that requires inspection accuracy lower than the inspection point 504, for example, a normal inspection accuracy. In order to ensure the inspection accuracy required for such inspection points 504, adjacent marks 506 serving as reference positions for detecting the positions of the respective inspection points 504 are provided in the vicinity of the respective inspection points 504. ing. Further, a line sensor camera 510 that acquires images of necessary portions by scanning these substrates 502 is provided. As shown in FIG. 14, the visual field width of the line sensor camera 510 (that is, scanning). The width at which an image can be acquired without the movement of the shaft is set to be substantially the same as or slightly larger than the width of each substrate 502.

  The procedure for acquiring the images of the respective inspection points 504 and 505 by scanning the multi-sided substrate 501 having such a configuration, that is, each of the substrates 502, with the line sensor camera 510 is specifically described. explain.

  First, alignment of the line sensor camera 510 and the multi-surface substrate 501 is performed so that the line sensor camera 510 is disposed in the vicinity of the end portion of the substrate 502 disposed in the lower left of the multi-surface substrate 501 in the figure. Thereafter, the line sensor camera 510 is moved rightward in the X-axis direction in the figure, and scanning on each substrate 502 is started. When the scanning starts, first, the line sensor camera 510 acquires an image of the base mark 503 on the substrate 502 arranged at the lower left, and measures its position. Further, the line sensor camera 510 is scanned to acquire an image of the correction mark 506 included in the substrate 502, and the position is measured. Thereafter, the line sensor camera 510 is moved to measure the position of the correction mark 506 included in the substrate 502 arranged at the lower right in the drawing. Thereafter, the line sensor camera 510 is moved axially upward in the Y-axis direction in the figure, and is arranged near the right end of the substrate 502 arranged in the upper right side in the figure, and is moved leftward in the X-axis direction in the figure. A scan is performed. As a result, an image of the base mark 503 included in the substrate 502 is acquired and its position is measured. Further, the scanning is continued and the positions of the remaining correction marks 506 are measured.

  When the acquisition of the images of all the base marks 503 and the correction marks 506 and the position measurement thereof are completed, the line sensor camera 510 is returned to the initial position again, and each inspection point is determined based on the respective position measurement results. The reference positions 504 and 505 are corrected. Specifically, based on the position measurement result of each base mark 503, the position shift and the rotation shift of the entire multi-sided substrate 501 are corrected, and further, based on the position measurement result of each correction mark 506, The reference position (designed position) of each inspection point 504 is corrected.

  Thereafter, the line sensor camera 510 is moved through the same route as the first scanning movement in a state where the positions of the respective inspection points 504 and 505 are specified based on these correction results. Images of the inspection points 504 and 505 are acquired. Further, based on these acquired images, position measurement of the respective inspection points 504 and 505, that is, position inspection is performed.

  Furthermore, as another conventional board inspection method, the position of a plurality of components is measured, and based on the average value of the positional deviation amount in the measurement result, the positional deviation and the rotational deviation of the entire board are calculated, and the inspection point There is also a technique for correcting the position (for example, see Patent Document 2).

JP 2000-36698 A Japanese Patent Laid-Open No. 7-50500

  However, in such a conventional inspection method, each substrate 502 is scanned by the line sensor camera 510 to acquire images of the respective base marks 503 and correction marks 506, and the respective positions are measured. The positional deviation and the rotational deviation of the chamfered substrate 501 or each substrate 502 are detected, and the detection result is used to further scan each substrate 502 to obtain images of the respective inspection points 505 and 506. Since the position measurement is performed, the scanning on each substrate 502 by the line sensor camera 510 is substantially performed twice, and there is a problem that the time required for the imaging inspection is increased.

  In addition, each base mark 503 provided on the diagonal of the multi-planar substrate 501 serves as a reference for detecting a positional shift and a rotational shift of the entire multi-planar substrate 501, and in particular, with respect to the rotational shift. Can be detected by accurately detecting the positions of the two base marks 503, but in order to acquire the images of the two base marks 503, the scanning axis of the line sensor camera 510 in the Y-axis direction shown in the figure. Need to be accompanied by a move to. In such a case, the movement error of the scanning axis is included as the position detection error of each base mark 503 as it is, and directly affects the inspection accuracy. For example, in the case where inspection points are arranged in an ultra-high density mounting area, it is not possible to obtain a good correction accuracy of the reference position for the inspection points, and a high-precision inspection is performed. There is a problem that it cannot be done.

  The above-described problem will be further described with a specific example with reference to FIG. 14. For example, the time required to scan from the lower left substrate 502 to the lower right substrate 502 is 10 seconds, and the error in the scan The amount is (3, 0) um (indicating that it is 3 um in the X-axis direction and 0 um in the Y-axis direction), and is required for the axial movement of the scanning axis from the lower right substrate 502 in the figure to the upper right substrate 502 in the figure. The time is 2 seconds, the error amount is (0,3) um, the time required to scan from the upper right substrate 502 to the upper left substrate 502 is 10 seconds, and the error amount in the scan is (3,3). 0) um, and when the time required to move the scanning axis from the upper left substrate 502 to the lower left substrate 502 is 2 seconds and the error amount is (0,3) um, Total time required for board inspection operations 46 seconds, the error is (12, 9) um, and the both test time and accuracy, it is hard to say that it is good.

  Further, in the case where each substrate 502 is a flexible substrate as described above, the correction mark 506 itself is caused by the above-described deflection or the like due to the property of having elasticity and being easily bent. In some cases, the position may not be located at a predetermined position. In such a case, there is a problem that accurate inspection processing may not be performed smoothly.

  Furthermore, in the multi-sided board 501, each board 502 is stuck and its arrangement relation is fixed, but only one set of base marks 503 provided at the diagonal of the multi-sided board 501 is detected. Then, there also exists a problem that the sticking position of each board | substrate 502 cannot be detected correctly.

  Accordingly, an object of the present invention is to solve the above-described problem, and obtain an image of inspection points such as a component mounting position and a circuit pattern arranged on a substrate by scanning a scanning method sensor, To provide an efficient and highly accurate substrate inspection method and apparatus capable of improving the inspection accuracy while shortening the time required for the inspection in the substrate inspection for performing the position inspection of each inspection point. It is in.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, in the substrate assembly in which the (substantially square) first substrate and the second substrate are arranged adjacent to each other and the arrangement relationship is maintained, the substrate An image of each inspection point arranged on the first substrate and the second substrate is acquired using a scanning sensor that is scanned substantially along the surface of the assembly, and the above-described image is acquired based on the image. A board inspection method for inspecting the position of each inspection point,
The scanning method sensor is scanned along the first substrate, images of at least two base marks included in the first substrate are acquired by the scanning method sensor, and based on the acquired image, Measure the position of each of the above base marks,
Correcting the reference position data of the adjacent mark arranged in the vicinity of the inspection point on the first substrate using the position measurement result of the base mark;
Based on the corrected reference position data, the image of the adjacent mark is acquired by the scanning method sensor, and the position of the adjacent mark is measured based on the acquired image.
The reference position data of the inspection point is corrected using the position measurement results of the respective base marks and the adjacent marks,
Based on the corrected reference position data, an image of the inspection point is acquired by the scanning method sensor, and based on the acquired image, a position inspection of the inspection point is performed.
Thereafter, by scanning the scanning method sensor along the second substrate, images of at least two base marks included in the second substrate are acquired by the scanning method sensor, and the acquired image is acquired. In accordance with the present invention, a substrate inspection method (or substrate measurement method) is provided, wherein the position inspection of the inspection point of the second substrate is performed.
Here, the position inspection of the inspection point is performed by measuring the position of the inspection point based on the acquired image and comparing the position measurement result with the corrected reference position data. it can. Moreover, it can be determined that the inspection result is good because the comparison result is within a predetermined allowable range.

  According to the second aspect of the present invention, on the first substrate and the second substrate, the respective base marks face each other in a direction substantially perpendicular to the scanning direction of the scanning sensor. The board | substrate inspection method as described in the 1st aspect arrange | positioned is provided.

According to the third aspect of the present invention, on each of the first substrate and the second substrate, each of the base marks is one end in the scanning direction of the scanning method sensor (of the rectangular substrate). Near the edge)
The scanning along the respective substrates by the scanning method sensor provides the substrate inspection method according to the second aspect in which the scanning is started from the one end side.

According to the fourth aspect of the present invention, on the first substrate, the respective base marks are arranged to face each other in a direction substantially perpendicular to the scanning direction of the scanning method sensor,
On the second substrate, there is provided the substrate inspection method according to the first aspect, in which the respective base marks are arranged to face each other in a direction inclined from a direction substantially orthogonal to the scanning direction.

  According to the fifth aspect of the present invention, before the scanning of the first substrate by the scanning method sensor is started, the reference position data of the respective base marks on the respective substrates is acquired, and the acquired respective respective marks are acquired. The substrate inspection method according to the third aspect, in which the scanning path of the substrate assembly is determined by the scanning method sensor based on reference position data.

  According to the sixth aspect of the present invention, the reference position data of the respective base marks on the first substrate and the reference position data of the adjacent marks before the scanning of the first substrate by the scanning method sensor is started. And the first mode to the fifth mode in which the scanning of the first substrate by the scanning method sensor is started based on the obtained reference position data. The board | substrate inspection method as described in any one of these is provided.

According to the seventh aspect of the present invention, when the first substrate has another inspection point that does not have the adjacent mark, the position measurement result of each base mark is used to Correct the reference position data of the inspection point of
A first mode in which an image of the other inspection point is acquired by the scanning method sensor based on the corrected reference position data, and the position inspection of the other inspection point is performed based on the acquired image. To a substrate inspection method according to any one of the sixth aspect.

According to the eighth aspect of the present invention, in the correction of the reference position data of the inspection point of the first substrate,
Based on the position measurement results of the respective base marks, the positional deviation of the reference position data of the inspection point due to the rotational movement of the first substrate is corrected,
One of the first to seventh aspects that corrects the positional deviation of the reference position data of the inspection point caused by the parallel movement along the surface of the first substrate based on the position measurement result of the adjacent mark. A substrate inspection method according to one aspect is provided.

According to the ninth aspect of the present invention, in the substrate assembly in which the first substrate and the second substrate are disposed adjacent to each other and the positional relationship is maintained, generally along the surface of the substrate assembly. The image of each inspection point arranged on the first substrate and the second substrate is acquired using a scanning type sensor that is scanned in the position, and the position of each inspection point based on the image is acquired. A substrate inspection method for performing inspection,
The scanning sensor is scanned along the substrate assembly, and an image of at least two base marks included in the first substrate and an image of at least two base marks included in the second substrate are described above. Acquired by a scanning method sensor, based on each acquired image, to measure the position of each base mark,
Thereafter, the reference position data of the adjacent mark arranged in the vicinity of the inspection point of either the first substrate or the second substrate is used as the position of each base mark on the one substrate. While correcting using the measurement result, the scanning method sensor is scanned along the one substrate, and based on the corrected reference position data, an image of the adjacent mark is acquired by the scanning method sensor. , Based on the acquired image, measure the position of the adjacent mark,
The reference position data of the inspection point is corrected using the position measurement results of the respective base marks and the adjacent marks,
Based on the corrected reference position data, an image of the inspection point is acquired by the scanning method sensor, and the position of the inspection point is inspected based on the acquired image.
Thereafter, the scanning sensor is scanned along one of the other substrates, and the position measurement result of each of the base marks on the other substrate is used to perform the position inspection of the inspection point on the other substrate. A substrate inspection method is provided.

  According to the tenth aspect of the present invention, on each of the first substrate and the second substrate, each of the base marks is inclined from a direction substantially orthogonal to the scanning direction of the scanning sensor. Further, the substrate inspection method according to the ninth aspect, which is disposed to face each other, is provided.

According to the eleventh aspect of the present invention, on the first substrate, the base marks are opposed to each other in a direction inclined from a direction substantially perpendicular to the scanning direction of the scanning sensor. Arranged,
On the second substrate, the respective base marks are arranged to face each other in a direction orthogonal to the scanning direction,
After performing image acquisition of the respective base marks on the first substrate, performing image acquisition of the respective base marks on the second substrate,
Then, the board | substrate inspection method as described in a 9th aspect which performs the position inspection of the said test | inspection point by making said 2nd board | substrate into said one board | substrate is provided.

  According to the twelfth aspect of the present invention, by acquiring an image of the position on the substrate specified based on the corrected reference position data for the adjacent mark or the inspection point, the adjacent mark or the A substrate inspection method according to any one of the first to eleventh aspects for obtaining an image of an inspection point is provided.

  According to the thirteenth aspect of the present invention, any one of the first to twelfth aspects, wherein the moving speed of the scanning method sensor when the image acquisition is not performed is higher than the movement speed when the image acquisition is performed. A method for inspecting a substrate as described in the above is provided.

  According to a fourteenth aspect of the present invention, there is provided the substrate inspection method according to any one of the first aspect to the thirteenth aspect, wherein each of the substrates is a flexible substrate.

According to the fifteenth aspect of the present invention, in the substrate aggregate in which a plurality of substrates are arranged adjacent to each other and the arrangement relationship is maintained, images of the respective inspection points arranged on the respective substrates. A board inspection apparatus that performs position inspection of each inspection point based on the respective images,
A scanning type sensor for acquiring an image of a position to be measured on the substrate assembly while relatively scanning along a substantially surface of the substrate assembly;
A scanning drive device for driving the relative scanning of the scanning method sensor and the substrate assembly;
A position measuring means for measuring the position of the measurement target position based on the acquired image of the measurement target position;
Reference position correction means for correcting reference position data of a measurement target position different from the measurement target position based on the position measurement result of the measurement target position by the position measurement means;
Each of the scanning method sensor, the scanning drive device, the position measuring unit, and the reference position correcting unit can be controlled, and the scanning method sensor is scanned by the scanning drive device on each of the substrates. The at least two base marks arranged on the substrate are used as the measurement target positions, and images of the respective base marks are acquired by the scanning method sensor, and the position measurement means is used to acquire the respective base marks. Position measurement is performed, and the adjacent mark arranged in the vicinity of the inspection point on the substrate is set as the other measurement target position, and the reference position correction unit calculates the reference position data of the adjacent mark by the reference position correction unit. Correction is performed using the measurement result, and the image of the adjacent mark is scanned based on the corrected reference position data. The position of the adjacent mark is measured by the position measuring means, and the reference position correction means is used to obtain the reference position data of the inspection point as the other measurement target position. The position measurement means corrects the position measurement result of each of the base marks and the adjacent marks, acquires an image of the inspection point by the scanning method sensor based on the corrected reference position data, and Thus, a substrate inspection apparatus (or a substrate measurement apparatus) is provided that includes a control device that performs position inspection of the inspection point.

  According to a sixteenth aspect of the present invention, in the fifteenth aspect, the position measuring means measures the absolute position of the measurement target position on each of the substrates based on the acquired image of the measurement target position. A substrate inspection apparatus as described is provided.

  According to the seventeenth aspect of the present invention, the reference position correcting means is a position shift caused by a parallel movement in a direction along the surface of the substrate from the absolute position of each of the base marks measured by the position measuring means. And a positional shift amount caused by rotational movement in the direction along the surface of the substrate, and a reference position data of the adjacent mark is corrected using the calculated positional shift amounts. A substrate inspection apparatus according to an aspect is provided.

  According to an eighteenth aspect of the present invention, the reference position correcting means calculates a positional deviation amount caused by parallel movement in a direction along the surface of the substrate from the absolute position of the adjacent mark measured by the position measuring means. While calculating, using the positional displacement amount due to the parallel movement calculated based on the absolute position of the adjacent mark, and the positional displacement amount due to the rotational movement calculated based on the absolute position of the respective base mark, A substrate inspection apparatus according to a seventeenth aspect for correcting the reference position data of the inspection point is provided.

  According to the nineteenth aspect of the present invention, the width dimension of the imaging field of view of the scanning sensor in the direction along the surface of the substrate assembly and perpendicular to the scanning direction is the width dimension in the direction of the respective substrates. A substrate inspection apparatus according to any one of the fifteenth to eighteenth aspects having the above dimensions is provided.

According to the twentieth aspect of the present invention, the reference position data of the respective base marks on the respective substrates, the reference position data of the adjacent marks, and the reference position data of the respective inspection points are acquired and held. A position data acquisition unit;
The reference position data acquisition unit acquires any one of the fifteenth to nineteenth aspects for acquiring and holding the respective reference position data relating to the substrate before the scanning of the respective substrate by the scanning method sensor is started. The board | substrate inspection apparatus as described in 1 is provided.

  According to a twenty-first aspect of the present invention, there is provided the substrate inspection apparatus according to any one of the fifteenth to twentieth aspects, wherein each of the substrates is a flexible substrate.

  According to the first aspect of the present invention, in a substrate assembly in which a plurality of substrates (first substrate and second substrate) are arranged in alignment and the arrangement relationship is maintained, The base marks for detecting the positional deviation are not provided as a whole substrate assembly, but each base substrate is provided with a base mark for each of the substrates, so that each of the substrates is individually provided. The amount of positional deviation that occurs can be reliably detected.

  In addition, since at least two or more of the respective base marks are provided for each of the substrates, the positional shift amount that occurs individually for each of the substrates is caused by parallel movement along the surface of the substrate. In addition to the positional deviation amount, it is possible to reliably detect the positional deviation amount caused by the rotational movement along the surface of the substrate.

  Further, in each of the substrates, first, the position shift amount of the substrate itself is calculated by measuring the position of each base mark on the substrate, and the substrate is arranged adjacent to the inspection point on the substrate. By associating the reference position data of the adjacent mark with the calculation result, the position of the adjacent mark and the inspection point can be measured with high position accuracy.

  Specifically, the reference position data of the adjacent mark is corrected using the position measurement result of each of the base marks calculated in advance, and the scanning method sensor is based on the corrected reference position data. When scanning by the above, it is possible to reliably specify the formation position of the adjacent mark, and it is possible to reliably acquire the image of the adjacent mark. Thereafter, based on the acquired image, the position measurement of the adjacent mark is performed, and the position measurement result of the respective base mark and the adjacent mark is used to correct the reference position data of the inspection point. Based on the corrected reference position data, the formation position of the inspection point can be reliably specified, and an image of the inspection point can be reliably acquired. Therefore, even if the substrate is bent or misaligned, an image of the inspection point can be reliably acquired on the substrate, and by acquiring the image, Highly accurate position inspection for the inspection point (that is, the position inspection is performed by measuring the position of the inspection point based on the image and comparing the position measurement result with the corrected reference position data). You can do that.

  According to the second aspect of the present invention, the respective base marks are arranged on the respective substrates so as to face each other in a direction substantially perpendicular to the scanning direction of the scanning sensor. The respective base marks can be handled as so-called parallel marks. Specifically, in each of the substrates, the position measurement is performed so that the parallel marks, the adjacent marks, and the inspection points are in order by the scanning of the scanning system sensor, thereby requiring the substrate inspection. An efficient inspection method capable of reducing time can be provided.

  According to the third aspect of the present invention, further, scanning by the scanning method sensor is started from one end portion of the substrate on which the respective base marks are arranged. The effect according to the aspect can be obtained with certainty.

  According to the fourth aspect of the present invention, each of the base marks provided on the first substrate in the substrate assembly has a function as the parallel mark, and is provided on the second substrate. Even if each of the base marks has a function as a so-called diagonal mark arranged opposite to each other in a direction inclined from a direction substantially orthogonal to the scanning direction, the first mark The same effect as the effect by 1 aspect can be acquired. In particular, it is possible to perform more reliable and highly accurate inspection efficiently by using the second substrate as a substrate that requires a more accurate position inspection.

  According to the fifth aspect of the present invention, before the start of scanning of the first substrate, the reference position data of the respective base marks of the respective substrates in the substrate assembly is acquired, and each of the acquired each is acquired. The scanning path by the scanning method sensor is determined based on the reference position data, and an efficient scanning path is selected and determined while referring to the arrangement of the base marks on the respective substrates. be able to.

  According to the sixth aspect of the present invention, before starting the scanning of the first substrate, the base position data of the respective base marks, the correction marks, and the inspection points on the first substrate are acquired, Based on these data, scanning of the first substrate by the scanning method sensor is started, so that continuous scanning is realized without performing data acquisition during the scanning, and efficient inspection is performed. Can be performed.

  According to the seventh aspect of the present invention, when the first substrate has another inspection point that does not have the adjacent mark, the position measurement result of each of the base marks is used. The reference position data of the inspection point is corrected, the image of the other inspection point is acquired based on the corrected reference position data, and the position of the other inspection point is acquired based on the acquired image. By performing the inspection, it is possible to flexibly cope with the inspection of another inspection point having an inspection accuracy different from that of the inspection point, and it is possible to cope with diversified inspections.

  According to the eighth aspect of the present invention, in the correction of the reference position data of the inspection point, based on the position measurement result of each of the base marks, the inspection point caused by the rotational movement of the first substrate is corrected. The positional deviation of the reference position data of the inspection point caused by the parallel movement along the surface of the first substrate is corrected based on the position measurement result of the adjacent mark based on the positional measurement result of the adjacent mark. By performing the correction, the positional shift amount due to the parallel movement can be corrected with high accuracy using the position measurement result of the adjacent mark arranged closer to the inspection point, and the rotation. The positional shift amount due to the movement can be corrected with high accuracy by using the position measurement result of each of the above-mentioned base marks arranged at least two.

  According to the ninth aspect of the present invention, only the images of the respective base marks on the respective substrates are acquired in advance, and the adjacent marks and the inspections on the respective substrates are obtained based on the acquired images. Even in the case where a point image is acquired and its position is inspected, an effect similar to the effect of the first aspect can be obtained.

  According to the tenth aspect of the present invention, in each of the substrates, the base marks are arranged so as to have a function as the diagonal mark, thereby further improving the effect of the ninth aspect. It can be a typical one.

  According to the eleventh aspect of the present invention, each base mark arranged on the first substrate has a function as the diagonal mark, and each base mark arranged on the second substrate is Even in the case of having the function as the parallel mark, after the image acquisition of the respective base marks on the first substrate, the respective base marks on the second substrate are acquired. By performing image acquisition and then performing the position inspection of the inspection point using the second substrate as the one substrate, the efficient inspection according to the ninth aspect can be realized.

  According to the twelfth aspect of the present invention, by acquiring an image of the position on the substrate specified based on the corrected reference position data for the adjacent mark or the inspection point, the adjacent mark or It is possible to reliably acquire an image of the inspection point.

  According to the thirteenth aspect of the present invention, the scanning method sensor has two types of movement speeds, and the movement speed when the image acquisition is not performed is the movement speed when the image acquisition is performed. By setting it larger than that, the time required for the movement for the inspection can be shortened, and an efficient inspection can be realized.

  According to the fourteenth aspect or the twenty-first aspect of the present invention, each of the substrates has flexibility, is easy to bend, the positional deviation of the arrangement position as the substrate assembly, and the surface of the substrate Since the flexible substrate has a feature that its own positional deviation is likely to occur, the inspection method according to each of the above aspects can be made more effective.

  According to the fifteenth aspect of the present invention, the scanning method sensor, the scanning drive device that drives scanning of the scanning method sensor, and the position that measures the position of the measurement target position based on the acquired image The control means, the reference position correction means for correcting the reference position data of the measurement target position different from the measurement target position based on the position measurement result, and the control of each of these, the same as in the first aspect By providing a control device that performs position inspection of the inspection point of the substrate by a simple technique, it is possible to realize efficient and highly accurate inspection in the substrate inspection device.

  According to the sixteenth aspect of the present invention, the position measurement unit can reliably perform the position measurement by measuring the absolute position of the measurement target position based on the image.

  According to the seventeenth aspect of the present invention, further, the reference position correction unit is configured to detect a positional shift amount and a rotational movement due to the parallel movement of the substrate from the absolute position of each of the base marks measured by the position measurement unit. In addition to calculating the positional deviation amount due to the above, the correction of the reference position data of the adjacent mark can be reliably performed by using the calculated positional deviation amounts.

  According to the eighteenth aspect of the present invention, the reference position correcting means further calculates the amount of positional deviation due to the parallel movement based on the absolute position of the adjacent mark, and based on the absolute position of the respective base mark, By calculating the positional shift amount due to the rotational movement and using the respective positional shift amounts, it is possible to reliably correct the reference position data of the inspection point.

  According to the nineteenth aspect of the present invention, since the width dimension of the imaging field of view of the scanning sensor is greater than or equal to the width dimension of the respective substrates, image acquisition by scanning on the substrates is performed. It can be done efficiently.

  According to the twentieth aspect of the present invention, the reference position data acquisition unit can determine the scanning path in advance by acquiring the respective reference position data before the start of scanning. An efficient inspection can be realized.

(Definition of terms)
Prior to the description of embodiments of the present invention, definitions of terms used in the specification or claims of the present invention will be described.

  The term “substrate” refers to a circuit board that can form an electronic circuit by mounting components and the like at predetermined positions. Furthermore, in the present invention, high accuracy is required for the position accuracy of the component mounting position, but it has flexibility, and the board itself is bent by applying external force or supporting form thereof, so that the component mounting position is A substrate having such a feature that its two-dimensional absolute position is changed. Specific examples of the substrate include a flexible substrate having flexibility, and such a substrate generally has a substantially rectangular shape in many cases.

  The term “substrate assembly” refers to a substrate in which a plurality of the substrates are arranged adjacent to each other and the arrangement relationship is maintained. In the case where the plurality of substrates are formed in a collective manner, a case where a single substrate has a plurality of substrate formation regions that can be divided into a plurality of substrates is also included. The substrate assembly may include a substrate holding member (or substrate support) for arranging and holding the plurality of substrates.

  The term “base mark” refers to an identification mark serving as a reference position for specifying the measurement target position on the substrate. The substrate is arranged on each substrate constituting the substrate assembly, and serves as a reference for detecting a positional displacement amount due to the parallel movement of each of the substrates relative to the substrate assembly and a positional displacement amount due to the rotational movement, and the substrate. It also serves as a reference for detecting the amount of positional deviation of the aggregate itself. In order to reliably detect the amount of positional deviation due to the rotational movement, it is preferable that at least two base marks are arranged on one substrate, and in order to improve the recognition accuracy, More preferably, the respective base marks are arranged apart from each other on the substrate. As a specific example, when the substrate has a substantially square shape, a diagonal mark in which the respective base marks are arranged on a pair of diagonals on the substrate, or scanning by the scanning sensor. On the substrate in a direction orthogonal to the direction, there are parallel marks or the like in which the respective base marks are arranged so as to face each other.

  The term “adjacent mark” refers to an identification mark serving as a reference position for specifying the measurement target position on the substrate. However, it is not limited to the case where it is formed independently as such an identification mark, but as its shape, pattern and color, or a combination (ie, form) thereof on the substrate. Even in the case of being integrally formed, it is only necessary to be formed so as to be distinguishable from other positions on the substrate.

  The term “inspection point” refers to a position on the substrate whose position accuracy is to be inspected. For example, there are a mounting position of components on the substrate and a formation position of connection terminals such as electrodes. The inspection point is not limited to the “position” to be inspected, and may be a “region” to be inspected on the substrate. Examples of such a region to be inspected include a high-density mounting region of a plurality of minute parts on the substrate.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic configuration diagram showing a schematic configuration of an imaging inspection apparatus 100 that is an example of a substrate inspection apparatus that performs the substrate inspection method according to the first embodiment of the present invention. An example of a substrate handled by the imaging inspection apparatus 100 is shown in the schematic plan view of FIG.

  First, as shown in FIG. 2, in the imaging inspection apparatus 100, a plurality of substrates 2 are disposed adjacent to each other, and are handled as a substrate aggregate in which the positional relationship is maintained and integrated. Specifically, the substrate assembly is formed by adhering and holding four substantially square-shaped substrates 2 so as to be adjacent to each other on the upper surface of the substrate support 1a having a substantially rectangular plate shape. A multi-sided substrate 1 that is an example of a body is formed. Each substrate 2 is, for example, a flexible flexible substrate or a film-like substrate, and an electronic circuit is formed on the surface or inside of the substrate 2 so that the component can be mounted (or the component has already been formed). May be implemented). In this way, the substrate 2 having flexibility and being difficult to carry out reliably by itself is attached to the substrate support 1a and the arrangement and form thereof are maintained. Each substrate 2 can be reliably conveyed.

  In addition, as shown in FIG. 2, one or a plurality of inspection points 4 and 5 to be inspected by the imaging inspection apparatus 100 are arranged on the component mounting side surface (for example, the upper surface) of each substrate 2. . Such inspection points 4 and 5 correspond to positions in which the formation position accuracy is regarded as important in the electronic circuit formed on the substrate 2. For example, the mounting positions of components on the substrate 2, electrode terminals, etc. Can be an inspection point. Further, such an inspection point is not only a position (point) but also a region. For example, a high-density mounting area of a plurality of components on the board 2 can be an inspection point for such an area. Further, the required position accuracy may differ depending on the type of each of the inspection points 4 and 5. For example, in each substrate 2 shown in FIG. 2, the inspection point 4 is an inspection point that requires higher positional accuracy than the inspection point 5.

  Furthermore, each substrate 2 has a plurality of types serving as reference marks for recognizing the positional deviation of the arrangement position of the substrate 2 on the substrate support 1a and the positional deviation in the vicinity of the inspection point on each substrate 2. For example, two types of correction marks are provided. One type of these correction marks is a correction mark referred to as a base mark 3 for recognizing a positional shift of the entire substrate 2, and the remaining one type recognizes a positional shift near a predetermined inspection point. This is a correction mark referred to as an adjacent mark 6.

  Each substrate 2 is provided with at least two base marks 3, and each substrate 2 shown in FIG. 2 is provided with two base marks 3. As described above, two or more base marks 3 are provided on a single substrate 2 in addition to recognizing misalignment due to parallel movement along the surface of the substrate 2 as well as rotational movement along the surface of the substrate 2. This is because it is also possible to recognize the positional deviation (angle deviation) due to. Further, as shown in FIG. 2, the base marks 3 are disposed on the respective ends of the respective substrates 2 in the Y-axis direction in the figure so as to face each other. Each base mark 3 having such an arrangement form is referred to as a parallel mark, and is distinguished from a diagonal mark having an arrangement form on the substrate 2 to be described later. In the parallel mark, the X coordinate of each base mark 3 is the same and the Y coordinate is different. On the other hand, in the diagonal mark, both the X coordinate and the Y coordinate of each base mark are different.

  Further, in the two substrates 2 arranged in the lower part of the figure, the respective base marks 3 are arranged at the left end in the X-axis direction in the figure. In the two boards 2 arranged in the upper part of the figure, Each base mark 3 is arranged at the end on the right side in the X-axis direction in the figure. Such an arrangement can be determined by the relationship between the scanning direction of the scanning method sensor and the scanning path, which will be described later, and each base 2 has its base at the end on the near side in the scanning direction of the scanning method sensor. The mark 3 is preferably arranged. In FIG. 2, with respect to the respective substrates 2 arranged below, the right direction in the X-axis direction shown in the drawing is the scanning direction of the scanning system sensor, and the respective substrates 2 arranged above are arranged. As for, the leftward direction in the X-axis direction in the figure is the scanning direction of the scanning method sensor. In addition, in FIG. 2, an example in which two base marks 3 are arranged on each substrate 2 has been described. However, three or more base marks 3 are arranged, which corresponds to the above arrangement. There may be a case where only two base marks 3 are used as parallel marks. In FIG. 2, the illustrated X-axis direction and Y-axis direction are directions along the surface of the substrate 2 and are orthogonal to each other.

  In addition, as shown in FIG. 2, in each substrate 2, the adjacent mark 6 is provided adjacent to the vicinity of the inspection point 4 for which position measurement with higher accuracy is required. Further, the adjacent mark 6 for each inspection point 4 is arranged on the front side in the scanning direction of the line sensor camera with respect to each inspection point 4. It is possible to recognize the adjacent mark 6 for the inspection point 4 before the inspection point 4. In addition, instead of the case where one adjacent mark 6 is provided for each inspection point 4, a case where two or more adjacent marks 6 are provided may be used. From the viewpoint of manufacturing cost reduction and miniaturization, it is preferable to minimize the number of correction marks to be arranged. In each substrate 2, the adjacent mark 6 is not provided in the vicinity of the inspection point 5. Further, in each substrate 2, instead of the case where one adjacent mark 6 is provided for one inspection point 4, a plurality of adjacent points individually corresponding to two or more inspection points 4 are provided. It may be either the case where the mark 6 is provided or the case where only one adjacent mark 6 is provided for two or more inspection points 4. Moreover, the distance dimension between the inspection point 4 and the adjacent mark 6 arranged in the vicinity thereof is, for example, about 5 mm, and such a distance dimension may be determined in a range of about 3 to 15 mm. desirable. When a component is mounted on the inspection point 4, ensure at least a distance dimension that prevents the adjacent mark 6 from being hidden by the component due to the displacement of the mounting position, the dimensional tolerance of the component, and the like. This is in consideration of preventing the image data from becoming too large when the adjacent mark 6 adjacent thereto is stored in one image.

  Next, an imaging inspection apparatus that images each of the inspection points 4 and 5 provided on each substrate 2 of the multi-sided substrate 1 and inspects the formation position based on the images. The configuration of 100 will be described with reference to FIG.

  As shown in FIG. 1, the imaging inspection apparatus 100 includes a substrate holding unit 12 that releasably holds a multi-sided substrate 1 to be inspected and a multi-sided substrate 1 held by the substrate holding unit 12. A line sensor camera 10 which is an example of a scanning sensor that captures and acquires an image while scanning the surface of the substrate 2 is provided. Furthermore, the imaging inspection apparatus 100 includes a scanning drive device 14 that performs the above scanning by moving the line sensor camera 10 along the scanning axis P of the line sensor camera 10 disposed along the X-axis direction in the figure, and a substrate. By moving the holding unit 12 along the Y-axis direction in the drawing, the line sensor camera 10 is moved in the Y-axis direction relative to the multi-sided substrate 1 held by the substrate holding unit 12, and the scanning axis And a holding unit moving device 16 that performs relative movement of P in the Y-axis direction. The scanning drive device 14 and the holding unit moving device 16 are, for example, a ball screw shaft, a nut portion screwed to the ball screw shaft, and the ball screw shaft as a moving mechanism for the line sensor camera 10 and the substrate holding unit 12. A moving mechanism using a drive motor can be used.

  The line sensor camera 10 has a linear field of view along the Y-axis direction shown in the figure, which is a direction orthogonal to the scanning axis P, and the line sensor camera 10 is moved along the scanning axis P. The linear field of view is moved along the surface of the substrate 2, and as a result, two-dimensional image data on the surface of the substrate 2 can be acquired. Thus, an area formed by moving the visual field of the line sensor camera 10 along the scanning axis P is an imaging area R of the line sensor camera 10. As shown in FIG. 1, when the imaging region R of the line sensor camera 10 is positioned on the left side in the Y-axis direction of the multi-sided substrate 1, the imaging region is on the right side of the multi-sided substrate 1 in the Y-axis direction of the illustration. When it is desired to position R, the movement of the imaging region R is performed by moving the scanning axis P of the line sensor camera 10 relative to the multi-sided substrate 1 to the right in the Y-axis direction in the figure by the holding unit moving device 16. Can be performed. Note that the width dimension of the linear field of view of the line sensor camera 10 (that is, the dimension in the Y-axis direction shown in the figure) is substantially the same as the width dimension in the Y-axis direction shown in each substrate 2 shown in FIG. It is formed to be large.

  As shown in FIG. 1, the imaging inspection apparatus 100 includes an imaging operation by the line sensor camera 10, a scanning operation of the line sensor camera 10 by the scanning drive device 14, and holding / holding the multi-sided substrate 1 by the substrate holding unit 12. The operation control of the release operation, the relative movement operation of the scanning axis P of the line sensor camera 10 by the holding unit moving device 16, and the position inspection operation of the respective inspection points 4 and 5 based on the captured images are mutually performed. A control device 20 is provided that performs overall while associating.

  The configuration of the control device 20 will be described below with reference to the schematic configuration diagram shown in FIG. Note that this schematic explanatory diagram shows only the main configuration of the configuration of the control device 20.

  As shown in FIG. 3, the control device 20 includes a data acquisition unit 22 that acquires data from the outside of the control device 20, and an operation of the imaging inspection device 100 based on analysis processing of the acquired data or the analysis result. An imaging inspection control unit 21 that performs control and the like, and a memory unit 23 that stores the acquired data, the analysis processing result, and the like in a releasable manner are provided.

  Specifically, as shown in FIG. 3, the data acquisition unit 22 includes an image data acquisition unit 27 that acquires image data acquired through the line sensor camera 10, and substrate data regarding each substrate 2 to be inspected, For example, it includes a substrate data acquisition unit 28 that acquires substrate data including position information of reference position data (position data determined by design) of the base mark 3, the adjacent mark 6, and the inspection point 5. The board data is included in, for example, CAD data including component mounting data for each board 2 and the like. Further, the image data acquired by the image data acquisition unit 27 is stored in the memory unit 23 so that it can be taken out, and the board data acquired by the board data acquisition unit 28 is also stored in the memory unit 23 so that it can be taken out.

  In addition, the imaging inspection control unit 21 takes out image data of the measurement target position on the substrate 2 stored in the memory unit 23, and an example of a position measurement unit that measures the position of the measurement target position based on the image data. And a reference position correction unit that is an example of a reference position correction unit that corrects reference position data of a measurement target position different from the measurement target position based on the position measurement result of the measurement target position. 26 and a camera scanning unit 25 that takes out the substrate data stored in the memory unit 23 and controls the scanning operation (that is, the image capturing operation) of the line sensor camera 10 by the scanning drive device 14 based on the substrate data. I have. The position measuring unit 24 measures the position of the measurement target position by detecting the absolute position of the measurement target position based on the image data. Further, the position measurement result data by the position measurement unit 24 and the reference position data correction result data by the reference position correction unit 26 can be stored in the memory unit 23 so as to be retrievable. Furthermore, the camera scanning unit 25 takes out the position measurement result data and the reference position correction result data stored in the memory unit 23, and controls the scanning operation of the line sensor camera 10 based on these data. it can. Since the control device 20 has such a configuration, it is possible to inspect the formation positions of the respective inspection points 4 and 5 included in the respective substrates 2 of the multi-sided substrate 1. Although not shown in the schematic configuration diagram shown in FIG. 3, this is a case where an output unit is provided that enables the control device 20 to output the inspection result to the outside of the control device 20. May be. The absolute position is a common coordinate system that serves as an absolute reference in the position measurement. For example, the absolute position is a position determined with respect to the base mark 3 for each substrate 2. Moreover, it may replace with such a case and the case where the adjacent mark 6 is made into a reference | standard may be sufficient.

  In the imaging inspection apparatus 100 having such a configuration, a schematic explanatory view of an inspection processing procedure using a schematic plan view of the multi-surface substrate 1 shown in FIG. This will be described below with reference to a flowchart describing the basic flow of the inspection procedure shown in FIG. In the inspection process described below, the control device 20 performs overall control while the respective components of the imaging inspection device 100 are associated with each other.

  First, in the imaging inspection apparatus 100, the multi-sided board 1 is held by the board holding unit 12, and the board data related to the multi-sided board 1 is input to the board data acquisition unit 28 of the control device 20 and acquired, and the memory It is stored in the unit 23 so as to be removable. Thereafter, in the camera scanning unit 25, the substrate data is extracted from the memory unit 23, and based on the substrate data, the number and arrangement of the substrates 2 in the multi-sided substrate 1, and further, the respective base marks 3, adjacent marks 6, Each reference position data of the inspection points 4 and 5 is recognized. In the camera scanning unit 25, based on these pieces of substrate data, the image sensor R is assigned by the line sensor camera 10, and the image pickup order of the assigned image pickup regions R is determined (step in FIG. 5). S1).

  Specifically, in the multi-planar substrate 1 shown in FIG. 4, the substrate 2 arranged at the lower left in the drawing is a first substrate 2-1, and in order from the first substrate 2-1 in the illustrated counterclockwise direction, When the second substrate 2-2, the third substrate 2-3, and the fourth substrate 2-4 are used, the visual field width of the line sensor camera 10 is substantially the same as the width dimension of each substrate 2 in the illustrated Y-axis direction. Alternatively, the first substrate 2-1 and the second substrate can be used as the imaging region R that can be acquired at a time by continuous scanning without moving the scanning axis P because it is formed slightly larger. The imaging region R formed by 2-2 and the imaging region R formed by the third substrate 2-3 and the fourth substrate 2-4 can be distributed. However, in this case, since the two substrates 2 are included in each imaging region R, the two substrates 2 are divided, resulting in four imaging regions for each substrate 2. Sort to R. The four imaging regions R are divided into a first imaging region R1 for the first substrate 2-1, a second imaging region R2 for the second substrate 2-2, a third imaging region R3 for the third substrate 2-3, The fourth imaging region R4 is assumed for the fourth substrate 2-4.

  Further, the determination of the imaging order of the respective imaging areas R performed together with the allocation of the respective imaging areas R is performed in consideration of the arrangement of the base marks 3 formed on the respective substrates 2 and the like. For example, in the case where a parallel mark is used as the base mark 3 as in the present embodiment, when each substrate 2 is scanned by the line sensor camera 10, the substrate 2 must always be started first. A scanning path in which the base mark 3 is recognized and the entire scanning path is the shortest is considered. As a result, scanning is performed in the order of the first substrate 2-1 and the second substrate 2-2 with the right direction in the X-axis direction in the drawing as the scanning direction, and then the axis movement of the scanning axis P in the Y-axis direction in the drawing is performed. A scanning path is employed in which scanning is performed in the order of the third substrate 2-3 and the fourth substrate 2-4 with the left direction in the X-axis direction as the scanning direction. Accordingly, the imaging order is determined as the order of the first imaging area R1, the second imaging area R2, the third imaging area R3, and the fourth imaging area R4.

  After the image areas are allocated, the camera scanning unit 25 of the control device 20 selects the first image area R1 as the first image area R (step S2), and the line sensor camera 10 by the scanning drive device 14 is selected. And the movement of the substrate holding unit 12 by the holding unit moving device 16, the line sensor camera 10 is positioned on the left side in the X-axis direction of the first substrate 2-1 of the multi-sided substrate 1. This state is the state shown in FIG. In this arrangement state, the scanning axis P of the line sensor camera 10 is located in the vicinity of the approximate center in the Y-axis direction of the first substrate 2-1 and the second substrate 2-2. Thereafter, the scanning drive device 14 starts moving the line sensor camera 10 rightward in the X-axis direction in the figure, and starts scanning the upper surface of the first substrate 2-1 (step S3).

  In the camera scanning unit 25, the line sensor camera 10 that has already started moving is positioned above each base mark 3 based on the reference position data of each base mark 3 of the first substrate 2-1 in the substrate data. When it is determined that the image has been positioned, an image of each base mark 3 is acquired through the image data acquisition unit 27. The acquired image data is held in the memory unit 23 and taken out by the position measurement unit 24, and the formation position of each base mark 3 is measured based on the image data (step S4). The result of the position measurement is stored in the memory unit 23.

  Thereafter, the camera scanning unit 25 determines whether or not there is an inspection point in the scanning direction of the line sensor camera 10 on the first substrate 2-1 based on the substrate data (step S5). In the case where a plurality of inspection points are arranged in the scanning direction, the inspection point located at the closest position in the scanning direction is selected. In FIG. 4, the inspection point 4 of the first substrate 2-1 is selected. Further, it is determined whether or not the selected inspection point 4 has an adjacent mark 6 (step S6). Since the selected inspection point 4 has the adjacent mark 6, the reference position correction unit 26 stores the reference position data of the adjacent mark 6 and the data of the position measurement result of each base mark 3 from the memory unit 23. Is acquired, and the positional deviation amount of the reference position of the adjacent mark 6 is corrected based on the data of the position measurement result of each base mark 3 (step S7).

  Specifically, based on the respective XY coordinates in the position measurement result of each base mark 3, the rotation angle of each base mark 3 with respect to the reference position, which is the amount of positional deviation caused by the rotational movement along the surface of the substrate 2. The amount of displacement and the amount of XY position displacement in the X direction and the Y direction, which are amounts of displacement due to parallel movement along the surface of the substrate 2, are calculated, and the calculated rotational angle displacement amount and XY position displacement amount are calculated. By reflecting in the reference position data of the adjacent mark 6, the reference position data is corrected. Such correction is performed at a position on the first substrate 2-1 specified by the reference position data due to the positional deviation of the first substrate 2-1 itself or the multi-planar substrate 1 itself. This is because it is possible to prevent the occurrence of a situation in which the correction mark 6 that should originally be located does not exist and the image cannot be acquired, and to perform reliable image acquisition. The corrected reference position data is stored in the memory unit 23.

  Thereafter, the camera scanning unit 25 retrieves the corrected reference position data of the adjacent mark 6 from the memory unit 23 and determines that the line sensor camera 10 is positioned above the adjacent mark 6 based on the data. The image of the adjacent mark 6 is acquired through the image data acquisition unit 27 and stored in the memory unit 23. Further, the image data is extracted from the memory unit 23 to the position measurement unit 24, and the formation position of the adjacent mark 6 is measured based on the image data (step S8). The result of the position measurement is stored in the memory unit 23.

  Thereafter, the reference position correction unit 26 acquires the reference position data of the selected inspection point 4 and the data of the position measurement result of the adjacent mark 6 from the memory unit 23, and the XY in the position measurement result of the adjacent mark 6 is acquired. Based on the coordinates, an XY position shift amount with respect to the reference position of the adjacent mark 6 is calculated. The calculated XY position deviation amount is reflected in the reference position data of the inspection point 4 to correct the XY position deviation amount, and the previously calculated rotation angle deviation amount of each base mark 3 is inspected. Reflecting the reference position data of the point 4, the rotational angle deviation amount is corrected (step S9). The corrected reference position data is stored in the memory unit 23.

  Thereafter, in the camera scanning unit 25, the corrected reference position data of the inspection point 4 is extracted from the memory unit 23, and it is determined that the line sensor camera 10 is positioned above the inspection point 4 based on the data. The image of the inspection point 4 is acquired through the image data acquisition unit 27 and stored in the memory unit 23. Further, the image data is extracted from the memory unit 23 to the position measurement unit 24, and the position measurement of the inspection point 4, that is, the position inspection is performed based on the image data (step S11). Specifically, the inspection point 4 is determined in advance by comparing the reference position data of the corrected inspection point 4 with the position measurement result data (that is, the absolute position of the XY coordinates). It is determined whether or not it is formed at the position. This inspection result is stored in the memory unit 23 so that it can be taken out. If necessary, the inspection result can be output from the memory unit 23 so as to be recognizable.

  Further, after that, it is determined whether or not there is another inspection point in the scanning direction of the line sensor camera 10 on the first substrate 2-1 (step S 5). It is determined whether or not has an adjacent mark 6 (step S6). In the first substrate 2-1 shown in FIG. 4, the inspection point 5 having no adjacent mark 6 is selected. Thereafter, the reference position correction unit 26 acquires the reference position data of the inspection point 5 from the memory unit 23, and the XY position shift amount and the rotation angle shift amount of each base mark 3 calculated previously. Is reflected in the reference position data of the inspection point 5 to correct the reference position data (step S10). The corrected reference position data is stored in the memory unit 23.

  Thereafter, in step S <b> 11, the image of the inspection point 5 is acquired through the image data acquisition unit 27 by the line sensor camera 10 in the same procedure as described above, and the image data is stored in the memory unit 23. . Further, the image data is extracted from the memory unit 23 to the position measurement unit 24, and the position inspection of the inspection point 5 is performed based on the image data.

  Thereafter, in step S5, it is determined whether or not there is another inspection point on the first substrate 2-1 in the scanning direction of the line sensor camera 10, and it is determined that there is no other inspection point. Is determined whether or not the next imaging region R exists (step S12). When the next imaging area R exists, the imaging area R, that is, the second imaging area R2 is selected (step S13). Thereafter, the same procedure as described above from steps S3 to S11 is performed on the second imaging region R2, that is, the second substrate 2-2, so that the second substrate 2-2 is installed on the second substrate 2-2. A position inspection for inspection points 4 and 5 is performed.

  When the position inspection for all the inspection points 4 and 5 on the second substrate 2-2 is completed, the third imaging region R3 is selected in steps S12 and S13. Thereafter, the operation of the scanning drive device 14 is controlled by the camera scanning unit 25 of the control device 20, and the scanning axis P of the line sensor camera 10 is moved. This scanning axis P is the third substrate 2−. The line sensor camera 10 is positioned on the right side in the X-axis direction of the third substrate 2-3 while being positioned near the center in the Y-axis direction of the third and fourth substrates 2-4. Thereafter, the procedures from step S3 to S11 are sequentially performed, so that the position inspection of the respective inspection points 4 and 5 on the third substrate 2-3 is performed. Thereafter, the same procedure is repeatedly performed, whereby each position inspection with respect to the fourth substrate 2-4 is performed. Fourth, when the position inspection with respect to the substrate 2-4 is completed, it is determined whether or not the next imaging region R exists in step S12, and the position inspection with respect to all the imaging regions R has been completed. Is completed.

  In the description of the inspection procedure, the case where the line sensor camera 10 is moved by the scanning drive device 14 and the upper surfaces of all the substrates 2 are scanned has been described. However, this embodiment is limited to such a case. Is not something Instead of such a case, the upper surface of each substrate 2 may be scanned only above the measurement target position. Here, the measurement target positions are the base mark 3, the adjacent mark 6, and the inspection points 4 and 5. When such a line sensor camera 10 scans only above each measurement target position, the line sensor camera 10 is moved at high speed in a portion where the measurement target position does not exist (that is, image acquisition). And the time required for the inspection of the multi-sided substrate 1 by the imaging inspection apparatus 100 can be shortened.

  In order to reduce the time required for such inspection, the scanning axis P of the line sensor camera 10 is moved, and the movement of the line sensor camera 10 in the X-axis direction is also required. In such a case, while the scanning sensor 14 moves the line sensor camera 10 in the illustrated X-axis direction, the holding unit moving device 16 moves the substrate holding unit 12 in the illustrated Y-axis direction in parallel. Can be done.

  In the first embodiment, each base mark 3 is used as a parallel mark. Therefore, in each imaging region R, that is, in each substrate 2, the position where scanning by the line sensor camera 10 is started is It is an end portion on the side where each base mark 3 is formed. Therefore, if the arrangement of the base marks 3 is different, the scanning path of the line sensor camera 10 also differs depending on the arrangement.

  Further, in the multi-planar substrate 1, the position information such as the base mark 3 and the adjacent mark 6 included in one substrate 2 is not related to the position information of the other substrate 2 and has no influence.

  According to the first embodiment, the following various effects can be obtained.

  First, in the multi-sided substrate 1 formed by being affixed to the substrate support 1a in a state where the plurality of substrates 2 are arranged in alignment and the arrangement relationship is maintained, In addition, the base marks as a whole of the multi-planar substrate 1 are not provided, but the respective base marks 3 are provided for the individual substrates 2, whereby each substrate 2 is attached to the substrate support 1a. As the amount of positional deviation that occurs, the amount of rotational angle deviation and the amount of XY positional deviation can be reliably detected.

  In such a case, each of the substrates 2 is a plastic substrate that does not have high flexibility, and the multi-planar substrate is formed by integrally forming a plurality of plastic substrates. In this case, it is unlikely that a deflection with a positional deviation occurs for each individual substrate or a positional deviation due to the attachment to the substrate support 1a. However, as in the first embodiment, each of the substrates 2 is a flexible substrate having high flexibility, and each substrate 2 is manufactured individually, and then transferred for various processes. In the case where the substrate support 1a is affixed for the purpose of improving the handleability, the individual substrates 2 may bend with a positional shift. Due to the attachment, there may be a positional deviation for each individual substrate 2, so that it is effective to be able to detect the positional deviation amount for each substrate 2.

  In each substrate 2, first, the formation position of each base mark 3 is measured, the XY coordinates of the reference position are compared with this measurement result, and the amount of positional deviation of the substrate 2 itself is calculated. By correcting the reference position data of the inspection point 5 using the calculation result, when it is determined that the line sensor camera 10 is positioned above the inspection point 5 based on the corrected reference position data, it is ensured. An image of the inspection point 5 can be acquired.

  Further, for the inspection point 4 that requires higher position inspection accuracy, the adjacent mark 6 disposed adjacent to the inspection point 4 is used, and the adjacent mark 6 is associated with the base mark 3. Further, high position inspection accuracy can be achieved. Specifically, the reference position data of the adjacent mark 6 is corrected using the position shift amount data of each base mark 3 calculated previously, and the line sensor is based on the corrected reference position data. When it is determined that the camera 10 is positioned above the adjacent mark 6, the image of the adjacent mark 6 can be reliably acquired. Thereafter, based on the acquired image, the formation position of the adjacent mark 6 is measured, and the measurement result is compared with the corrected reference position of the adjacent mark 6 to calculate the amount of XY displacement. Based on the calculated XY position shift amount data, the XY position shift amount in the reference position data of the inspection point 4 is corrected and the previously calculated rotation angle shift amount data of the base mark 3 is corrected. Based on this, the rotational angle deviation amount in the reference position data of the inspection point 4 can be corrected. Therefore, even if the substrate 2 is bent or misaligned, the position of the inspection point 4 can be more reliably specified on the substrate 2 and the image data can be acquired. The position inspection with respect to the inspection point 4 can be performed with high accuracy.

  Further, by using parallel marks arranged in a direction perpendicular to the scanning direction of the line sensor camera 10 as the base marks 3 provided on the respective substrates 2, the line sensor camera 10 of each substrate 2 is used. The arrangement of the marks and the like on the substrate 2 and the scanning path of the line sensor camera 10 are determined so that the parallel marks, the adjacent marks, and the inspection points are arranged in the order along the scanning direction. The scanning path of the line sensor camera 10 can be further shortened, and the time required for substrate inspection can be shortened.

  To explain with a specific example, for example, the time required to scan from the first substrate 2-1 to the second substrate 2-2 in FIG. (3,0) um, and the time required for the axis movement of the scanning axis P of the line sensor camera 10 from the second substrate 2-2 to the third substrate 2-3 is 2 seconds, and an error caused by the movement is 2 seconds. The amount is (0, 3) um, and the time required for scanning from the third substrate 2-3 to the fourth substrate 2-4 is 10 seconds, and the amount of error caused by the scanning is (3, 3). In the case of 0) um, the total time required for the inspection processing of the present embodiment is 22 seconds, and the amount of error generated is (6,3) um. This is because the total time required for the inspection process in the conventional inspection method is 46 seconds and the generated error amount (12,9) um can be greatly improved. The time can be shortened, and the amount of error caused by this can be raised to about half of the conventional accuracy.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, in the substrate inspection method according to the second embodiment of the present invention, each base mark 3 is formed by each substrate 2 arranged as a parallel mark as in the substrate inspection method of the first embodiment. It is suitable for the above-mentioned diagonal mark that the multi-sided board 1 formed by the board in which each base mark is arranged as a diagonal mark is not the target to be inspected. Although it differs from the substrate inspection method of the first embodiment in that an inspection procedure is used, it is the same as the substrate inspection method of the first embodiment in other points. Hereinafter, only the differences will be described for the substrate inspection method of the second embodiment. Note that the substrate inspection method of the second embodiment can be performed by the imaging inspection apparatus 100 as in the first embodiment.

  First, a schematic explanatory view for explaining the substrate inspection method of the second embodiment using a schematic plan view of a multi-planar substrate 31 is shown in FIG. FIG. 7 is a flowchart showing the procedure of the inspection process in this substrate inspection method. In the flowchart shown in FIG. 7, for the purpose of facilitating understanding of the description, the main procedure in the procedure is mainly shown.

  As shown in FIG. 6, the multi-sided board 31 includes four flexible boards 32 that are aligned and arranged adjacent to each other, and are affixed to the board support 31 a so that the arrangement is maintained. It is formed with. Further, in each substrate 32, diagonal marks are formed by arranging base marks 33 at respective ends of the pair of diagonals. Here, the diagonal marks are a set of base marks arranged on the substrate so as to face each other in a direction inclined from a direction substantially orthogonal to the scanning direction of the line sensor camera 10. Specifically, in FIG. 6, base marks 33 are arranged at the upper right end and the lower left end of each substrate 2. Note that the arrangement of the diagonal marks is not limited to such an arrangement, and instead of such a case, for example, the respective base marks 33 are arranged at the upper left end and the lower right end of the substrate 2. This may be the case, and furthermore, the arrangement position of the diagonal mark may be different for each substrate 2.

  Further, as shown in FIG. 6, each substrate 32 of the multi-planar substrate 31 is adjacent to each inspection point 4, 5 and further to the inspection point 4, similarly to each substrate 2 of the first embodiment. Adjacent marks 4 are provided.

  Further, the multi-planar substrate 31 and the respective substrates 32 have the same shape as the multi-planar substrate 1 and the respective substrates 2 of the first embodiment. Furthermore, in the multi-sided board 31, the board 32 arranged on the lower left side in the figure is the first board 32-1, and the second board 32-2, the third board 32-3, When the fourth substrate 32-4 is used, the region on the upper surface of the first substrate 32-1 is defined as the first imaging region R1 and the region on the upper surface of the second substrate 32-2, as in the case of the first embodiment. Can be the second imaging region R2, the upper surface region of the third substrate 32-3 can be the third imaging region R3, and the upper surface region of the fourth substrate 32-4 can be the fourth imaging region R4.

  A procedure for inspecting the multi-planar substrate 31 having such a structure by the imaging inspection apparatus 100 will be described below with reference to a schematic explanatory diagram of FIG. 6 and a flowchart of FIG. Note that, in the procedure of the inspection process described below, the respective processes are comprehensively controlled while being associated with each other by the control device 20 included in the imaging inspection apparatus 100.

  First, in the imaging inspection apparatus 100, the multi-sided substrate 31 is held by the substrate holding unit 12, and board data related to the multi-sided board 31 is input to the board data acquisition unit 28 of the control device 20 and acquired, and the memory It is stored in the unit 23 so as to be removable. Thereafter, in the camera scanning unit 25, the substrate data is taken out from the memory unit 23, and based on the substrate data, the number and arrangement of the substrates 32 in the multi-sided substrate 31, the base marks 33, the adjacent marks 6 are arranged. The reference positions of the inspection points 4 and 5 are recognized. Based on these substrate data, the camera scanning unit 25 assigns the imaging areas R by the line sensor camera 10 and determines the imaging order of the assigned imaging areas R (step in FIG. 7). S31).

  In addition to such distribution to the plurality of imaging regions R, diagonal marks are used from the arrangement form of the base marks 33 arranged on the respective substrates 2 based on the acquired substrate data. Is recognized by the camera scanning unit 25. Here, when it is recognized that the diagonal mark is used, the acquisition of the image of each diagonal mark is first performed on the multi-sided board 31. This is due to the characteristics of the positions of the diagonal marks on the substrate 32. For example, the base marks 33 are arranged on the start point and the end point on the scanning path of the line sensor camera 10 on one substrate 32, for example. This is because it is necessary to move the line sensor camera 10 from the start point to the end point of the substrate 32 in order to acquire the respective images of the two base marks 33. At the same time, if the formation positions of the respective base marks 33 are not measured on the substrate 32, the formation positions of the adjacent marks 6 and the inspection points 4 and 5 cannot be specified reliably.

  Specifically, in the imaging inspection apparatus 100, the line sensor camera 10 is moved by the scanning drive device 14 and the substrate holding unit 12 is moved by the holding unit moving device 16, so that The XY movement of the line sensor camera 10 is performed, and the line sensor camera 10 is positioned above the left side of the first substrate 32-1 of the multi-sided substrate 31 as shown in FIG. In this state, the scanning axis P of the line sensor camera 10 is positioned in the vicinity of the approximate center in the Y-axis direction of the first substrate 32-1 and the second substrate 32-2. . Thereafter, the scanning drive device 14 starts moving the line sensor camera 10 to the right in the X-axis direction in the figure, and scanning for image acquisition of each base mark 33 is started (step S32).

  First, when the line sensor camera 10 is positioned above the base mark 33 disposed at the lower left end in the figure above the first substrate 32-1, the camera scan is performed based on the reference position data of the base mark 33. When the unit 25 determines, the image of the base mark 33 is acquired through the image data acquisition unit 27 so as to be positioned below the line sensor camera 10. Furthermore, when it is determined that the line sensor camera 10 is positioned above the base mark 33 arranged at the upper right end in the figure, an image of the base mark 33 is acquired through the image data acquisition unit 27. Each acquired image data is stored in the memory unit 23, and further, each image data is taken out from the memory unit 23, and the position measurement unit 24 measures the position where each base mark 33 is formed ( Step S33). The measurement result is stored in the memory unit 23. After that, the position of each base mark 33 on the second substrate 32-2 is measured in the same procedure.

  When the image acquisition of the respective base marks 33 on the second substrate 32-2 is completed, the axis movement of the scanning axis P of the line sensor camera 10 is performed, and the third substrate 32-3 and the fourth substrate 32- 4, the scanning axis P is located near the approximate center in the Y-axis direction in the figure, and the line sensor camera 10 is located above the right side of the third substrate 32-3 in the figure. Thereafter, the line sensor camera 10 is moved leftward in the X-axis direction in the figure by the scanning drive unit 14, and scanning of the upper surfaces of the third substrate 32-3 and the fourth substrate 32-4 is started. As a result, images of the base marks 33 on the third substrate 32-3 and the fourth substrate 32-4 are acquired in the same procedure as described above, and based on the acquired image data. Then, the position is measured.

  When the images of all the base marks 33 are acquired and their positions are measured, the first imaging region R1, that is, the first substrate 32, is selected as the first imaging region from among the four imaged regions R thus distributed. -1 is selected (step S34). By this selection, the axis of the scanning axis P of the line sensor camera 10 is moved, the line sensor camera 10 is positioned on the left side of the first substrate 32-1, and the line sensor camera 10 is in the X-axis direction in the figure. Moving to the right, scanning of the upper surface of the first substrate 32-1 is started.

  With the start of this scanning, it is determined whether or not there is an inspection point in the scanning direction on the first substrate 32-1 (step S35). If there is an inspection point, the adjacent mark 6 is adjacent to the inspection point. Is determined (step S36). Specifically, in FIG. 6, the inspection point 4 is selected, and the adjacent mark 6 included in the inspection point 4 is selected. Thereafter, similarly to the procedure from steps S7 to S11 shown in the flowchart of FIG. 5 in the first embodiment, the procedure from steps S37 to S41 shown in the flowchart of FIG. 5 position inspection is performed.

  If it is confirmed in step S35 that the position inspection has been completed for all the inspection points 4 and 5 on the first substrate 32-1, whether or not the next imaging region R exists in step S42. In step S43, the next imaging region R that is the next imaging region R, that is, the second substrate 32-2 is selected. Thereafter, the position inspection for each of the inspection points 4 and 5 included in the selected second substrate 32-2 is performed by sequentially repeating the above-described steps S35 to S41.

  Thereafter, the same procedure is applied to the third imaging region R3 and the fourth imaging region R4, that is, the third substrate 32-3 and the fourth substrate 32-4, and the inspection points 4, 5 are respectively checked. A position check is performed. In step S42, when the completion of the position inspection of the respective inspection points 4 and 5 with respect to all the imaging regions R in the multi-planar substrate 31 is confirmed, the inspection processing is ended.

  In the second embodiment, the case where each base mark 33 is arranged on a pair of diagonals on each substrate 32 of the multi-planar substrate 31 and used as a diagonal mark has been described. The arrangement form is not limited to such a case. In the substrate 32, if the X-axis coordinates of the respective base marks 33 arranged in the vicinity of the respective end portions along the Y-axis direction in the figure are different, they function as diagonal marks even if they are not arranged diagonally. be able to.

  Further, when the image of each base mark 33 is acquired by scanning the line sensor camera 10 on the multi-sided substrate 31, the scanning drive device 14 always performs a line operation at a constant speed regardless of the area of each substrate 32. The substrate inspection method of the second embodiment is not limited only when the sensor camera 10 is moved. Instead of such a case, the moving speed of the line sensor camera 10 by the scanning drive device 14 may be varied. For example, when the line sensor camera 10 is moved above each base mark 33, the moving speed of the line sensor camera 10 by the scanning drive device 14 is set as a scanning speed for image acquisition, and each base mark 10 is moved. When the line sensor camera 10 is moved above an area other than the area above 33, the movement speed of the line sensor camera 10 by the scanning drive device 14 is increased, thereby reducing the time required for the movement. Can be planned.

  Further, in the above description, the case where the visual field width of the line sensor camera 10 is substantially the same as or slightly larger than the width dimension in the Y-axis direction of each substrate 32 has been described. However, a case where the width dimension of each substrate is significantly different will be described below as a modification of the second embodiment.

(First modification)
First, as a first modification, the visual field width is formed to be larger than the width dimension of the substrate 32, for example, so as to be substantially the same as or slightly larger than the width dimension of the multi-sided substrate 31 in the Y-axis direction. This is a case where the substrate inspection method is performed using the line sensor camera 40 formed in (1). 8 and 9 are schematic explanatory views schematically showing this substrate inspection method. In FIGS. 8 and 9, the adjacent marks 6 and the inspection points 4 and 5 formed on the respective substrates 32 are not shown in order to facilitate understanding of the description. These adjacent marks 6 and inspection points 4 and 5 can be understood with reference to the schematic explanatory view of the multi-sided substrate 31 shown in FIG.

  In each schematic explanatory diagram shown in FIGS. 8 and 9, the movement path of the line sensor camera 40 by the scanning drive device 14 is indicated by arrows D1 and D2, and image acquisition is performed in the portion indicated by the arrow D1. The line sensor camera 40 is moved (that is, scanned) at a possible speed, and no image is acquired in the portion indicated by the arrow D2, and high-speed movement is performed in order to shorten the movement time.

  When an inspection process is performed on the multi-sided substrate 31 using the line sensor camera 40, first, as shown in FIG. Let At this time, the scanning axis P of the line sensor camera 40 is arranged near the center in the Y-axis direction of the multi-sided substrate 31. Thereafter, the line sensor camera 40 is moved to the right in the X-axis direction in the drawing to start scanning the upper surface of each substrate 32. By starting this scanning, the line sensor camera 40 simultaneously acquires images of the respective base marks 33 provided on the first substrate 32-1 and the fourth substrate 32-4, and performs position measurement thereof. . Thereafter, the line sensor camera 40 scans the upper surfaces of the second substrate 32-2 and the third substrate 32-3, so that images of the respective base marks 33 on the respective substrates 32 are simultaneously acquired. Position measurement is performed.

  When the line sensor camera 40 is positioned above the right end of the multi-sided substrate 31 in the figure and image acquisition and position measurement of all the base marks 33 are performed, the scanning of the line sensor camera 40 is performed as shown in FIG. The direction is reversed, and scanning in the left direction in the X-axis direction is started. By scanning with the line sensor camera 40, images of the inspection points 4 and 5 on the second substrate 32-2 and the third substrate 32-3 are simultaneously acquired, and the position inspection is performed. Further, the line sensor camera 40 is moved above the first substrate 32-1 and the fourth substrate 32-4 to perform scanning, so that images of the respective inspection points 4, 5 on the respective substrates 32 are obtained. Are simultaneously acquired and their position is checked. When it is confirmed that the position inspection for all the inspection points 4 and 5 is completed on the multi-sided substrate 31, the inspection process is finished.

  According to the first modified example, the line sensor camera 40 has a visual field width that is approximately the same as or slightly larger than the width dimension of the multi-sided substrate 31, so that the scanning of the line sensor camera 40 Images of the upper surfaces of the two substrates 32 arranged adjacent to each other in the Y-axis direction can be acquired simultaneously. Therefore, the time required for the inspection process can be greatly reduced, and a more efficient substrate inspection method can be provided. Further, since it is possible to simultaneously acquire images of the plurality of substrates 32 as described above, it is possible to eliminate the necessity of moving the scanning axis P of the line sensor camera 40 in the inspection process. Therefore, the error generated due to the movement of the shaft is not included in the position inspection accuracy, and the inspection accuracy can be improved.

(Second modification)
Next, as a second modified example, using a line sensor camera 50 whose width dimension is smaller than the width dimension of the substrate 32, contrary to the first modified example, a substrate is used. This is the case where an inspection method is performed. 10 and 11 are schematic explanatory views schematically showing this substrate inspection method. 10 and 11 also omit the display of inspection points and the like.
Further, in each schematic explanatory view shown in FIGS. 10 and 11, the movement path of the line sensor camera 40 by the scanning drive device 14 is indicated by arrows D1, D2, D3, and D4, and in the portion indicated by the arrow D1. In order to shorten the movement time, the line sensor camera 40 is moved (that is, scanned) by the scanning drive device 14 at a speed at which image acquisition is possible, and the image acquisition is not performed in the portion indicated by the arrow D2. The line sensor camera 40 is moved at high speed by the scanning drive device 14. Further, in the portion indicated by the arrow D3, the relative movement of the scanning axis P by the holding unit moving device 16 is performed while the line sensor camera 40 is moved at the high speed by the scanning drive device 14, and the arrow D4. In the portion indicated by, only the relative movement of the scanning axis P by the holding unit moving device 16 is performed.

  When an inspection process is performed on the multi-sided board 31 using the line sensor camera 50, first, as shown in FIG. 10, the left side in the X-axis direction of the first board 32-1 of the multi-sided board 31 is shown. The line sensor camera 50 is positioned above. At this time, the line sensor camera 50 can pass above the base mark 33 disposed below the first substrate 32-1 by scanning the line sensor camera 50 rightward in the X-axis direction in the figure. The scanning axis P is arranged. Thereafter, the scanning of the line sensor camera 50 is started to acquire an image of the base mark 33 arranged on the lower side of the drawing on each of the first substrate 32-1 and the second substrate 32-2, and the position Measure.

  When an image of the base mark 33 on the lower side of the figure on the second substrate 32-2 is acquired, the axis of the scanning axis P of the line sensor camera 50 is also moved, and in the vicinity of the approximate center of the right end of the figure on the multi-sided board 31 The line sensor camera 50 is positioned above. Thereafter, the scanning direction is reversed, and scanning of the line sensor camera 50 leftward in the illustrated X-axis direction is started. By this scanning, the base mark 33 on the upper side of the second substrate 32-2, the base mark 33 on the lower side of the third substrate 32-3, and the base mark on the upper side of the first substrate 32-1 are shown. 33, and an image of each base mark 3 is acquired in the order of the base mark 33 on the lower side of the figure of the fourth substrate 32-4, and its position is measured.

    Thereafter, the axis of the scanning axis P of the line sensor camera 50 is moved, the line sensor camera 33 is positioned above the base mark 33 on the upper side of the fourth substrate 32-4 in the figure, and the X-axis direction in the figure is shown. Scanning to the right is started, and images are acquired in the order of the base mark 33 and the base mark 33 on the upper side of the third substrate 32-3 in the drawing, and the position is measured.

  When the image acquisition and the position measurement of all the base marks 33 are completed, as shown in FIG. 11, the line sensor camera 50 in a state of being positioned above the upper right end portion of the third substrate 32-3 is illustrated as X An image of inspection points and the like that are moved to the left in the axial direction and are located in the upper region excluding the lower portion of the third substrate 32-3 and the fourth substrate 32-4 in the drawing is acquired, and the position inspection is performed. Do. When the line sensor camera 50 is positioned above the upper left end of the fourth substrate 32-4 in the figure, the scanning axis P is axially moved downward in the Y-axis direction in the figure, and the fourth substrate 32-4 is moved. The line sensor camera 50 is positioned above the illustrated lower left end and the illustrated upper left end of the first substrate 32-1. Thereafter, the line sensor camera 50 is scanned to the right in the X-axis direction in the drawing, so that the lower regions in the drawing of the third substrate 32-3 and the fourth substrate 32-4, the first substrate 32-1, and the first substrate 32-1 An image of inspection points and the like positioned in the upper region of the second substrate 32-2 in the figure is acquired, and the position inspection is performed. Thereafter, the scanning axis P is axially moved downward in the Y-axis direction in the drawing so that inspection points and the like located in the lower regions in the drawing of the first substrate 32-1 and the second substrate 32-2 are displayed. An image is acquired and its position is checked. When it is confirmed that the position inspection of all inspection points has been performed, the inspection process is terminated.

  According to the second modification, even if the visual field width of the line sensor camera 50 is smaller than the width dimension of the substrate 32, the second path can be obtained by devising the scanning path of the line sensor camera 50. A substrate inspection method capable of obtaining the same effects as those of the embodiment can be performed.

  According to the second embodiment, the same effects as in the first embodiment can be obtained, and the base marks 33 formed on the respective substrates 32 are formed not as parallel marks but as diagonal marks. Therefore, by measuring the position of the diagonal mark, not only the positional deviation in the Y-axis direction on the surface of the substrate 32 but also the positional deviation in the X-axis direction can be detected. Therefore, it is possible to reliably detect the positional deviation in the X-axis direction and the Y-axis direction on the surface of the flexible substrate 32 having the characteristics of high flexibility and easy bending. The accuracy of point position inspection can be further increased.

(Third embodiment)
Next, a substrate inspection method according to the third embodiment of the present invention will be described. The substrate inspection method of the third embodiment is formed by arranging the substrate having the parallel mark of the first embodiment and the substrate having the diagonal mark of the second embodiment so as to be mixed and arranged. The multi-planar substrate 61 thus formed is used as a substrate to be inspected. 12 and 13 are schematic explanatory views for explaining the substrate inspection method using the schematic plan view of the multi-planar substrate 61. FIG.

  As shown in FIG. 12, the multi-planar substrate 61 is formed by arranging four substrates 62 so as to be adjacent to each other, and the substrate 62 arranged at the lower left in the drawing is the first substrate 62-. 1, the second substrate 62-2, the third substrate 62-3, and the fourth substrate 62-4 are sequentially formed in the counterclockwise direction in the drawing. The first substrate 62-1 and the third substrate 62-3 are provided with respective base marks 33 as diagonal marks, and the second substrate 62-2 and the fourth substrate 62-4. The base marks 3 are arranged as parallel marks.

  A procedure for inspecting the multi-sided substrate 61 having such a configuration will be described with reference to FIGS. In each of the schematic explanatory diagrams shown in FIGS. 12 and 13, the movement path of the line sensor camera 70 by the scanning drive device 14 is indicated by arrows D1, D2, and D3. In the portion indicated by the arrow D1, The line sensor camera 70 is moved (that is, scanned) by the scanning drive device 14 at a speed at which image acquisition is possible. In the portion indicated by the arrow D2, image acquisition is not performed, and scanning is performed to shorten the movement time. High-speed movement is performed by the driving device 14. Further, in the portion indicated by the arrow D3, the scanning drive device 14 performs the high-speed movement, and the holding portion moving device 16 moves the scanning axis P along with the high-speed movement.

  First, as shown in FIG. 12, the line sensor camera 70 is positioned above the left side of the first substrate 62-1 of the multi-sided substrate 61 in the drawing. Thereafter, the line sensor camera 70 is moved rightward in the X-axis direction in the drawing, whereby images of the respective base marks 33 (diagonal marks) on the first substrate 62-1 are acquired and their positions are measured. In the first substrate 62-1, only image acquisition and position measurement of each base mark 33 are performed first. After that, by continuously moving the line sensor camera 70, images of the respective base marks 3 (parallel marks) arranged at the left end of the second substrate 62-2 in the drawing are acquired, and the position measurement is performed. Do. Further, by scanning the upper surface of the second substrate 62-2 with the line sensor camera 70, the position inspection of each inspection point on the second substrate 62-2 is performed while using the position measurement result.

  When the position inspection of all the inspection points on the second substrate 62-2 is completed, the line sensor camera 70 is moved at high speed so that the line sensor camera 70 is positioned on the upper left side of the fourth substrate 62-4 in the figure. Thereafter, the scanning of the line sensor camera 70 is started with the right direction in the X-axis direction shown in the drawing as the scanning direction, and images of the respective base marks 3 (parallel marks) on the fourth substrate 62-4 are acquired and their positions are measured. Is done. Further, scanning is continued, and the position inspection of each inspection point on the fourth substrate 62-4 is performed using the position measurement result. Thereafter, the line sensor camera 70 scans the third substrate 62-3, whereby an image of each base mark 33 (diagonal mark) on the third substrate 62-3 is acquired, and its position is measured. . At this time, only the image acquisition and the position measurement of each base mark 33 are performed on the third substrate 62-3.

  Next, as shown in FIG. 13, the scanning direction of the line sensor camera 70 positioned on the upper right side of the third substrate 62-3 in the figure is reversed to the left in the X-axis direction in the figure, and the third substrate. The position of each inspection point is inspected by scanning the upper surface of 62-3. When the position inspection of all the inspection points on the third substrate 62-3 is completed, the line sensor camera 70 is moved at high speed so as to be positioned above the left side of the first substrate 62-1. Thereafter, the upper surface of the first substrate 62-1 is scanned by the line sensor camera 70 with the X-axis direction rightward in the drawing as the scanning direction, and the position inspection of each inspection point is performed. When the position inspection of all the inspection points on the first substrate 62-1 is completed, the inspection process ends.

  According to the third embodiment, the same effects as those of the first embodiment and the second embodiment can be obtained, and a plurality of types of substrates 62 are arranged in the multi-sided substrate 61. In some cases, when the position inspection accuracy on each substrate 62 is different, the parallel mark and the diagonal mark are used properly, thereby ensuring the required inspection accuracy and shortening the time required for the inspection. This makes it possible to perform highly accurate and efficient inspection.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

1 is a schematic configuration diagram of an imaging inspection apparatus according to a first embodiment of the present invention. In the imaging inspection device of the first embodiment, it is a schematic plan view of a multi-sided substrate to be inspected. It is a control block diagram which shows the main structures of the control apparatus with which the said imaging inspection apparatus is provided. It is a schematic plan view of the multi-sided board | substrate used for the board | substrate inspection method of the said 1st Embodiment, Comprising: It is a schematic explanatory drawing for demonstrating the content of the said board | substrate inspection method. It is a flowchart which shows the procedure of the board | substrate inspection method of FIG. It is a model top view of the multi-cavity board | substrate used for the board | substrate inspection method concerning 2nd Embodiment of this invention, Comprising: It is a model explanatory drawing for demonstrating the content of the said board | substrate inspection method. It is a flowchart which shows the procedure of the board | substrate inspection method of FIG. It is a schematic explanatory drawing which shows the board | substrate inspection method concerning the 1st modification of the said 2nd Embodiment, and shows the scanning path | route for the position measurement of each diagonal mark. It is a model explanatory drawing of the board | substrate inspection method of the said 1st modification, and shows the scanning path | route for the position test | inspection of each test | inspection point. It is a schematic explanatory drawing which shows the board | substrate inspection method concerning the 2nd modification of the said 2nd Embodiment, and shows the scanning path | route for the position measurement of each diagonal mark. It is a schematic explanatory drawing of the board | substrate test | inspection method of the said 2nd modification, and shows the scanning path | route for the position test | inspection of each test | inspection point. It is a schematic explanatory drawing which shows the board | substrate inspection method concerning 3rd Embodiment of this invention, and shows the scanning path | route for the position measurement of each base mark in the multi-chamfer board | substrate with which a diagonal mark and a parallel mark are mixed. It is a model explanatory drawing of the board | substrate inspection method of the said 3rd Embodiment, and shows the scanning path | route for the position inspection of each inspection point. It is model explanatory drawing which shows the conventional board | substrate inspection method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multi-cavity board | substrate 2 Board | substrate 3 Base mark 4 Inspection point 5 Inspection point 6 Adjacent mark 10 Line sensor camera 12 Board | substrate holding part 14 Scanning drive apparatus 20 Control apparatus 21 Imaging inspection control part 22 Data acquisition part 23 Memory part 24 Position measurement part 25 Camera scanning unit 26 Reference position correction unit 27 Image data acquisition unit 100 Imaging inspection apparatus P Scanning axis R Imaging region

Claims (21)

In a substrate assembly in which the first substrate and the second substrate are arranged adjacent to each other and the arrangement relationship is maintained, a scanning method sensor that is scanned substantially along the surface of the substrate assembly is used. A substrate inspection method for obtaining an image of each inspection point disposed on the first substrate and the second substrate and performing a position inspection of each inspection point based on the image,
The scanning method sensor is scanned along the first substrate, images of at least two base marks included in the first substrate are acquired by the scanning method sensor, and based on the acquired image, Measure the position of each of the above base marks,
Correcting the reference position data of the adjacent mark arranged in the vicinity of the inspection point on the first substrate using the position measurement result of the base mark;
Based on the corrected reference position data, the image of the adjacent mark is acquired by the scanning method sensor, and the position of the adjacent mark is measured based on the acquired image.
The reference position data of the inspection point is corrected using the position measurement results of the respective base marks and the adjacent marks,
Based on the corrected reference position data, an image of the inspection point is acquired by the scanning method sensor, and based on the acquired image, a position inspection of the inspection point is performed.
Thereafter, by scanning the scanning method sensor along the second substrate, images of at least two base marks included in the second substrate are acquired by the scanning method sensor, and the acquired image is acquired. And performing a position inspection of the inspection point of the second substrate on the basis of the above.   2. The base mark according to claim 1, wherein each of the base marks is disposed on the first substrate and the second substrate so as to face each other in a direction substantially orthogonal to a scanning direction of the scanning sensor. Board inspection method. On the first substrate and the second substrate, the respective base marks are arranged in the vicinity of one end in the scanning direction of the scanning sensor,
The substrate inspection method according to claim 2, wherein scanning along each of the substrates by the scanning method sensor is started from the one end side. On the first substrate, the respective base marks are arranged to face each other in a direction substantially orthogonal to the scanning direction of the scanning method sensor,
The substrate inspection method according to claim 1, wherein each of the base marks is disposed on the second substrate so as to face each other in a direction inclined from a direction substantially orthogonal to the scanning direction.   Before the scanning of the first substrate by the scanning method sensor is started, reference position data of the respective base marks on the respective substrates is obtained, and the scanning method is obtained based on the obtained reference position data. The substrate inspection method according to claim 3, wherein a scanning path of the substrate assembly is determined by a sensor.   Prior to the scanning of the first substrate by the scanning method sensor, the reference position data of the respective base marks on the first substrate, the reference position data of the adjacent marks, and the reference position data of the inspection points The substrate inspection method according to claim 1, wherein scanning of the first substrate by the scanning method sensor is started based on each of the acquired reference position data. When the first substrate has another inspection point that does not have the adjacent mark, the position measurement result of each of the base marks is used to correct the reference position data of the other inspection point. ,
The image of the other inspection point is acquired by the scanning method sensor based on the corrected reference position data, and the position inspection of the other inspection point is performed based on the acquired image. 7. The substrate inspection method according to any one of items 1 to 6. In the correction of the reference position data of the inspection point of the first substrate,
Based on the position measurement results of the respective base marks, the positional deviation of the reference position data of the inspection point due to the rotational movement of the first substrate is corrected,
8. The positional deviation of the reference position data of the inspection point caused by the parallel movement along the surface of the first substrate is corrected based on the position measurement result of the adjacent mark. 4. The substrate inspection method described in 1. In a substrate assembly in which the first substrate and the second substrate are arranged adjacent to each other and the arrangement relationship is maintained, a scanning method sensor that is scanned substantially along the surface of the substrate assembly is used. A substrate inspection method for obtaining an image of each inspection point disposed on the first substrate and the second substrate and performing a position inspection of each inspection point based on the image,
The scanning sensor is scanned along the substrate assembly, and an image of at least two base marks included in the first substrate and an image of at least two base marks included in the second substrate are described above. Acquired by a scanning method sensor, based on each acquired image, to measure the position of each base mark,
Thereafter, the reference position data of the adjacent mark arranged in the vicinity of the inspection point of either the first substrate or the second substrate is used as the position of each base mark on the one substrate. While correcting using the measurement result, the scanning method sensor is scanned along the one substrate, and based on the corrected reference position data, an image of the adjacent mark is acquired by the scanning method sensor. , Based on the acquired image, measure the position of the adjacent mark,
The reference position data of the inspection point is corrected using the position measurement results of the respective base marks and the adjacent marks,
Based on the corrected reference position data, an image of the inspection point is acquired by the scanning method sensor, and the position of the inspection point is inspected based on the acquired image.
Thereafter, the scanning sensor is scanned along one of the other substrates, and the position measurement result of each of the base marks on the other substrate is used to perform the position inspection of the inspection point on the other substrate. A method for inspecting a substrate, comprising:   On the first substrate and the second substrate, the respective base marks are arranged to face each other in a direction inclined from a direction substantially orthogonal to the scanning direction of the scanning sensor. The substrate inspection method according to claim 9. On the first substrate, the respective base marks are arranged to face each other in a direction inclined from a direction substantially orthogonal to the scanning direction of the scanning method sensor,
On the second substrate, the respective base marks are arranged to face each other in a direction orthogonal to the scanning direction,
After performing image acquisition of the respective base marks on the first substrate, performing image acquisition of the respective base marks on the second substrate,
The substrate inspection method according to claim 9, wherein the position inspection of the inspection point is performed using the second substrate as the one substrate.   2. The image of the adjacent mark or the inspection point is acquired by acquiring an image of a position on the substrate specified based on the corrected reference position data for the adjacent mark or the inspection point. To the substrate inspection method according to any one of 11 to 11.   The substrate inspection method according to any one of claims 1 to 12, wherein a moving speed of the scanning method sensor when the image acquisition is not performed is higher than a movement speed when the image acquisition is performed.   The substrate inspection method according to claim 1, wherein each of the substrates is a flexible substrate. In a substrate assembly in which a plurality of substrates are arranged adjacent to each other and the arrangement relationship is maintained, an image of each inspection point arranged on each of the substrates is acquired, and the respective images are obtained. A substrate inspection apparatus for performing a position inspection of each inspection point based on the above,
A scanning type sensor for acquiring an image of a position to be measured on the substrate assembly while relatively scanning along a substantially surface of the substrate assembly;
A scanning drive device for driving the relative scanning of the scanning method sensor and the substrate assembly;
A position measuring means for measuring the position of the measurement target position based on the acquired image of the measurement target position;
Reference position correction means for correcting reference position data of a measurement target position different from the measurement target position based on the position measurement result of the measurement target position by the position measurement means;
Each of the scanning method sensor, the scanning drive device, the position measuring unit, and the reference position correcting unit can be controlled, and the scanning method sensor is scanned by the scanning drive device on each of the substrates. The at least two base marks arranged on the substrate are used as the measurement target positions, and images of the respective base marks are acquired by the scanning method sensor, and the position measurement means is used to acquire the respective base marks. Position measurement is performed, and the adjacent mark arranged in the vicinity of the inspection point on the substrate is set as the other measurement target position, and the reference position correction unit calculates the reference position data of the adjacent mark by the reference position correction unit. Correction is performed using the measurement result, and the image of the adjacent mark is scanned based on the corrected reference position data. The position of the adjacent mark is measured by the position measuring means, and the reference position correction means is used to obtain the reference position data of the inspection point as the other measurement target position. The position measurement means corrects the position measurement result of each of the base marks and the adjacent marks, acquires an image of the inspection point by the scanning method sensor based on the corrected reference position data, and And a control device for inspecting the position of the inspection point.   The substrate inspection apparatus according to claim 15, wherein the position measuring unit measures an absolute position of the measurement target position on each substrate based on the acquired image of the measurement target position.   The reference position correcting means is a positional deviation amount due to a parallel movement in a direction along the surface of the substrate, and a direction along the surface of the substrate, from the absolute position of each base mark measured by the position measuring means. 17. The substrate inspection apparatus according to claim 16, wherein a positional shift amount caused by the rotational movement in is calculated and the reference position data of the adjacent mark is corrected using each of the calculated positional shift amounts.   The reference position correcting unit calculates a positional shift amount caused by the parallel movement in the direction along the surface of the substrate from the absolute position of the adjacent mark measured by the position measuring unit, and also calculates the absolute position of the adjacent mark. Correction of the reference position data of the inspection point using the amount of positional deviation due to the parallel movement calculated based on the position and the amount of positional deviation due to the rotational movement calculated based on the absolute position of each base mark. The board | substrate inspection apparatus of Claim 17 to perform.   The width dimension of the imaging visual field of the scanning sensor in a direction along the surface of the substrate assembly and orthogonal to the scanning direction thereof is greater than or equal to the width dimension in the direction of the respective substrates. The board inspection apparatus according to any one of 15 to 18. A reference position data acquisition unit for acquiring and holding the reference position data of the respective base marks on the respective substrates, the reference position data of the adjacent marks, and the reference position data of the respective inspection points;
20. The reference position data acquisition unit according to claim 15, wherein the reference position data acquisition unit acquires and holds the reference position data regarding the substrate before the scanning of the substrate by the scanning method sensor is started. Board inspection equipment. 21. The substrate inspection apparatus according to claim 15, wherein each of the substrates is a flexible substrate.

Images