JP4887332B2 - 基板の処理装置 - Google Patents
基板の処理装置 Download PDFInfo
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- JP4887332B2 JP4887332B2 JP2008137444A JP2008137444A JP4887332B2 JP 4887332 B2 JP4887332 B2 JP 4887332B2 JP 2008137444 A JP2008137444 A JP 2008137444A JP 2008137444 A JP2008137444 A JP 2008137444A JP 4887332 B2 JP4887332 B2 JP 4887332B2
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- 238000012545 processing Methods 0.000 title claims description 172
- 239000000758 substrate Substances 0.000 title claims description 62
- 238000012546 transfer Methods 0.000 claims description 158
- 230000007246 mechanism Effects 0.000 claims description 66
- 230000032258 transport Effects 0.000 claims description 27
- 235000012431 wafers Nutrition 0.000 description 148
- 238000000576 coating method Methods 0.000 description 59
- 239000011248 coating agent Substances 0.000 description 58
- 238000010438 heat treatment Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- 238000011161 development Methods 0.000 description 13
- 238000000059 patterning Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
2 カセットステーション
3 処理ステーション
10 カセット搬入出部
12 カセット載置台
13 載置板
20、21 空カセット載置台
22 空カセット移送機構
30 カセット移動装置
31 駆動ベルト
C カセット
W ウェハ
Claims (7)
- 基板の処理装置であって、
基板を収容するカセットを載置するカセット載置部と、
基板を処理する基板処理部と、
前記カセット載置部のカセット内の基板を前記基板処理部に搬送し、なおかつ前記基板処理部で処理の終了した基板を前記カセット載置部のカセットに搬送する基板搬送部と、
基板が基板処理部に搬送されて空になったカセットを一時的に載置する空カセット載置部と、
前記空カセット載置部と前記カセット載置部との間で空のカセットを移送する空カセット移送機構と、を有し、
前記空カセット移送機構は、カセットを支持するアームと、前記アームを上下方向及び水平方向に移動させるアーム移動部と、を備え、
前記アームは、前記空カセット載置部と前記カセット載置部の側方から水平方向に移動して、前記空カセット載置部と前記カセット載置部に対してカセットを移送し、
前記空カセット載置部は、前記カセット載置部の上方に配置され、
前記空カセット載置部は、水平方向に複数のカセットを載置可能であり、
前記空カセット載置部内には、処理装置の外部から搬入したカセットを一時的に載置する搬入スペースと、処理装置の外部に搬出するカセットを一時的に載置する搬出スペースと、が設けられていることを特徴とする、基板の処理装置。 - カセットは、基板を収容する本体部と、前記本体部の上面から上方に突出し、前記空カセット移送機構のアームに係止される係止部と、を有することを特徴とする、請求項1に記載の基板の処理装置。
- 前記搬入スペースと前記搬出スペースに対するカセットの搬入出は、処理装置の外部のカセット搬送装置により行われ、
前記カセット搬送装置は、処理容器の外部から上下方向に移動して前記搬入スペースと前記搬出スペースに対してカセットを搬送することを特徴とする、請求項1又は2に記載の基板の処理装置。 - 前記搬入スペースと前記カセット載置部との間のカセットの移送、及び前記搬出スペースと前記カセット載置部との間のカセットの移送は、前記空カセット移送機構により行われることを特徴とする、請求項1〜3のいずれかに記載の基板の処理装置。
- 前記空カセット載置部は、複数段に設けられ、
前記搬入スペースと前記搬出スペースは、それぞれ最上段の前記空カセット載置部に設けられていることを特徴とする、請求項1〜4のいずれかに記載の基板の処理装置。 - 前記空カセット移送機構によるカセットの移送を制御する制御部をさらに有し、
前記制御部は、
前記搬入スペースのカセットを前記カセット載置部に移送し、
前記カセット載置部のカセット内の基板が前記基板処理部に搬送された後、当該空になったカセットを前記空カセット載置部に移送し、
前記基板処理部内での基板に対する所定の処理が終了した際に、前記空カセット載置部のカセットを前記カセット載置部に移送し、
前記カセット載置部のカセット内に処理が終了した基板が収容された後、当該カセットを前記搬出スペースに移送するように、前記空カセット移送機構を制御することを特徴とする、請求項1〜5のいずれかに記載の基板の処理装置。 - 前記所定の処理の処理状況は、前記基板処理部から前記制御部に出力され、
前記制御部は、前記基板処理部からの出力結果に基づいて、前記所定の処理が終了した際に、前記空カセット載置部のカセットを前記カセット載置部に移送するように前記カセット移送機構を制御することを特徴とする、請求項6に記載の基板の処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008137444A JP4887332B2 (ja) | 2007-09-20 | 2008-05-27 | 基板の処理装置 |
US12/207,809 US8043039B2 (en) | 2007-09-20 | 2008-09-10 | Substrate treatment apparatus |
KR1020080091185A KR101516819B1 (ko) | 2007-09-20 | 2008-09-17 | 기판의 처리 장치 |
Applications Claiming Priority (3)
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JP2007243470 | 2007-09-20 | ||
JP2007243470 | 2007-09-20 | ||
JP2008137444A JP4887332B2 (ja) | 2007-09-20 | 2008-05-27 | 基板の処理装置 |
Related Child Applications (1)
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JP2011172555A Division JP5161347B2 (ja) | 2007-09-20 | 2011-08-08 | 基板の処理装置 |
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JP2009094460A JP2009094460A (ja) | 2009-04-30 |
JP4887332B2 true JP4887332B2 (ja) | 2012-02-29 |
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JP2008137444A Active JP4887332B2 (ja) | 2007-09-20 | 2008-05-27 | 基板の処理装置 |
JP2011172555A Active JP5161347B2 (ja) | 2007-09-20 | 2011-08-08 | 基板の処理装置 |
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KR (1) | KR101516819B1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5284808B2 (ja) * | 2009-01-26 | 2013-09-11 | 株式会社Sokudo | ストッカー装置及び基板処理装置 |
CN102460675B (zh) * | 2009-05-18 | 2015-04-29 | 布鲁克斯自动化公司 | 与基片容器存储系统交接的集成系统 |
US8882433B2 (en) | 2009-05-18 | 2014-11-11 | Brooks Automation, Inc. | Integrated systems for interfacing with substrate container storage systems |
WO2010135202A2 (en) * | 2009-05-18 | 2010-11-25 | Crossing Automation, Inc. | Substrate container storage system |
KR101126160B1 (ko) | 2009-09-11 | 2012-03-22 | 세메스 주식회사 | 기판 처리 장치 |
JP5429570B2 (ja) * | 2010-03-08 | 2014-02-26 | 株式会社ダイフク | 物品搬送設備 |
JP5382470B2 (ja) * | 2010-11-04 | 2014-01-08 | 村田機械株式会社 | 搬送システム及び搬送方法 |
JP5549757B2 (ja) * | 2010-11-04 | 2014-07-16 | 村田機械株式会社 | 搬送システム |
JP5729415B2 (ja) * | 2010-11-04 | 2015-06-03 | 村田機械株式会社 | 搬送システム及び搬送方法 |
JP5648983B2 (ja) * | 2010-11-04 | 2015-01-07 | 村田機械株式会社 | 搬送システム及び搬送方法 |
US9845193B2 (en) * | 2012-04-05 | 2017-12-19 | Murata Machinery, Ltd. | Conveyance system |
JP5348290B2 (ja) * | 2012-07-17 | 2013-11-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5928304B2 (ja) * | 2012-11-07 | 2016-06-01 | 株式会社ダイフク | 基板搬送設備 |
JP5700107B2 (ja) * | 2013-12-19 | 2015-04-15 | シンフォニアテクノロジー株式会社 | キャリア搬送システム |
JP2015046646A (ja) * | 2014-12-12 | 2015-03-12 | シンフォニアテクノロジー株式会社 | キャリア移載促進装置 |
KR102166638B1 (ko) * | 2015-11-27 | 2020-10-16 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치 |
CN109155270B (zh) * | 2016-03-22 | 2023-08-25 | 株式会社新川 | 基板供给单元及接合装置 |
JP7018779B2 (ja) | 2018-02-13 | 2022-02-14 | 東京エレクトロン株式会社 | 基板搬送装置および基板処理システム |
JP7115947B2 (ja) | 2018-09-21 | 2022-08-09 | 株式会社Screenホールディングス | 基板処理装置 |
JP7213056B2 (ja) * | 2018-10-18 | 2023-01-26 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP7190900B2 (ja) * | 2018-12-28 | 2022-12-16 | 株式会社Screenホールディングス | 基板処理装置、キャリア搬送方法およびキャリアバッファ装置 |
WO2025041629A1 (ja) * | 2023-08-21 | 2025-02-27 | 東京エレクトロン株式会社 | 基板処理装置及び搬送方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09221203A (ja) * | 1996-02-19 | 1997-08-26 | Hitachi Ltd | 自動搬送システム |
JP3248129B2 (ja) * | 1997-01-21 | 2002-01-21 | 東京エレクトロン株式会社 | 基板搬送処理装置 |
JPH11145243A (ja) * | 1997-11-11 | 1999-05-28 | Hitachi Ltd | 半導体の生産方法 |
JP2000124301A (ja) * | 1998-10-13 | 2000-04-28 | Tokyo Electron Ltd | 容器載置ユニット、容器収納装置、及び処理装置 |
KR100646906B1 (ko) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
US6283692B1 (en) * | 1998-12-01 | 2001-09-04 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
JP4155722B2 (ja) * | 2000-04-17 | 2008-09-24 | 株式会社日立国際電気 | 基板処理装置、ポッド開閉装置、基板処理方法、半導体装置の製造方法および基板搬送方法 |
JP2004189361A (ja) * | 2002-12-09 | 2004-07-08 | Murata Mach Ltd | 天井搬送車及びそのシステム |
JP4915051B2 (ja) * | 2005-03-28 | 2012-04-11 | ムラテックオートメーション株式会社 | 自動搬送システム |
JP2008172062A (ja) * | 2007-01-12 | 2008-07-24 | Murata Mach Ltd | 物品供給装置 |
JP2008263004A (ja) * | 2007-04-11 | 2008-10-30 | Rorze Corp | コンテナの受渡、留置、並びに供給装置。 |
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2008
- 2008-05-27 JP JP2008137444A patent/JP4887332B2/ja active Active
- 2008-09-17 KR KR1020080091185A patent/KR101516819B1/ko active Active
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2011
- 2011-08-08 JP JP2011172555A patent/JP5161347B2/ja active Active
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Publication number | Publication date |
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KR20090031255A (ko) | 2009-03-25 |
JP2011233930A (ja) | 2011-11-17 |
JP5161347B2 (ja) | 2013-03-13 |
JP2009094460A (ja) | 2009-04-30 |
KR101516819B1 (ko) | 2015-05-04 |
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