JP4868522B2 - Epitaxial wafer manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for manufacturing an epitaxial wafer, and more particularly to a method and apparatus for manufacturing an epitaxial wafer with high flatness.

  Epitaxial silicon wafers generally have excellent characteristics such that there are no oxygen-induced defects or grown-in defects (including COPs) introduced during the growth of a single crystal ingot in the epitaxial layer on the surface where the device is formed.

  In recent years, epitaxial silicon wafers are being used for high-performance devices such as MPU and flash memory, and high-performance power devices such as MOS FET and IGBT. On the other hand, along with the high integration of devices, high planarization is especially emphasized in order to improve the quality of a semiconductor substrate and produce a miniaturized pattern.

  In the epitaxial growth of a wafer requiring high flatness, the film thickness uniformity is improved by single wafer processing. Further, the film thickness is made more uniform by controlling the flow of the gas for epitaxial growth by partitioning or the like (for example, Patent Document 1).

However, an abrupt change in the formation thickness of the epitaxial layer is likely to occur at the peripheral portion of the silicon single crystal wafer serving as the substrate, and it is particularly difficult to flatten the peripheral portion.
Also, in the vicinity of the peripheral portion (or outer peripheral portion) of a semiconductor wafer (for example, a silicon single crystal wafer) serving as a substrate, an abrupt change in the formation thickness of the epitaxial layer is likely to occur due to various factors, and the flow of gas for epitaxial growth It is difficult to obtain a uniform thickness only by making the thickness uniform.

  Thus, many methods have been proposed for optimizing the epitaxial growth conditions and reducing the non-uniform distribution of the film thickness, but this is not sufficient. Furthermore, if a flatness defect occurs after epitaxial growth, the flattening process cannot be performed again, and the product becomes a defective product and is wasted.

For example, a substrate that satisfies the required flatness simulates the flatness after epitaxial growth in the substrate flatness prediction process, and the substrate that is determined to satisfy the target flatness after film formation is the next process. An epitaxial silicon wafer manufacturing method has been proposed in which a substrate that has been sent to epitaxial growth and does not satisfy the standard is returned to the planarization process again (for example, Patent Document 2).
JP 2005-353665 A JP 2001-302395 A

  However, Patent Document 2 does not specifically disclose a method of simulating film formation in epitaxial growth. In general, simulation of film formation is not always easy because various factors influence each other. Therefore, it is extremely difficult to perform simulation to predict the flatness of the epitaxial silicon wafer on which the epitaxial layer is formed using the method of Patent Document 1.

  In view of the circumstances as described above, an apparatus and method for forming an epitaxial layer for improving the uniformity of the film thickness of an epitaxial silicon wafer, and more particularly, an apparatus and method for controlling the film thickness of the epitaxial layer at the peripheral edge of the wafer are provided. The purpose is to do.

  According to the present invention, it is possible to control the epitaxial layer thickness at the peripheral edge of the wafer and make the epitaxial layer thickness uniform, but it is not sufficient to make the gas flow for conventional epitaxial growth uniform. It was the first time that I discovered it. That is, the background is that the uniformity of the epitaxial layer thickness is desired up to the peripheral edge, which has been excluded from the edges, in response to a request to increase the use area of the epitaxial wafer. Even if the film thickness is uniform on the inner side of the wafer, the film thickness of the epitaxial layer at that position and in the vicinity in the vicinity of the outer periphery is accompanied by a large change in the shape (for example, a large change in thickness such as chamfering). Large changes such as a sudden decrease in the value may occur. The epitaxial layer film thickness (thickness including the substrate) due to this change can be as close as possible to the outer peripheral side, and a wider area of the flat wafer can be secured. Further, it has been found that the epitaxial layer thickness at the peripheral edge of the wafer periodically increases / decreases with respect to the crystal orientation, but if this increase / decrease is reduced, the area of the flat wafer can be increased. Incidentally, this periodic increase / decrease occurs because the epitaxial layer formation rate differs depending on the crystal orientation. Therefore, it is insufficient to simply make the gas flow uniform as a whole, and it is preferable to perform finer control based on the crystal orientation.

  As described above, the control of the epitaxial layer film thickness at the wafer peripheral portion is not dependent on the orientation-dependent control method and the orientation-dependent control means that change along the circumferential direction of the outer periphery of the wafer, and the circumferential direction of the outer periphery of the wafer. The azimuth independent control method and the azimuth independent control means can be used individually or in appropriate combination. In addition, the control of the film thickness of the epitaxial layer at the periphery of the wafer can be controlled by surrounding conditions such as a wafer substrate, a peripheral member such as a susceptor, a flow rate, concentration, temperature, etc. of a source gas such as trichlorosilane, or a combination thereof. This can be done by changing

  As the above-described orientation dependent control method or orientation dependent control means, for example, by fixing the semiconductor wafer substrate to the susceptor, the structure and / or shape of the susceptor that is uniquely fixed to the crystal orientation, other characteristics, etc. Are periodically changed along the crystal orientation. On the other hand, the orientation independent control method and the orientation independent control means include, for example, controlling and controlling the structure and / or shape of the susceptor and the environmental conditions independently of the crystal orientation.

More specifically, the following are provided.
(1) An epitaxial wafer manufacturing apparatus for growing an epitaxial by reacting a semiconductor wafer and a source gas in a reaction furnace, comprising a pocket having an opening in which the semiconductor wafer is disposed, and fixing the semiconductor wafer An apparatus for manufacturing an epitaxial wafer, comprising: a susceptor that includes a susceptor, the orientation dependent control means depending on the crystal orientation of the semiconductor wafer, and / or an independent orientation independent control means independent of the crystal orientation of the semiconductor wafer.

(2) The orientation dependent control means includes the susceptor whose structure and / or shape periodically changes in accordance with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. The epitaxial wafer manufacturing apparatus according to (1) above.

(3) The epitaxial wafer according to (2), wherein the susceptor has a counterbore depth that changes in synchronism with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. Manufacturing equipment.

(4) In the epitaxial wafer according to (2), the pocket width of the susceptor changes in synchronization with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. Manufacturing equipment.

(5) The apparatus for manufacturing an epitaxial wafer according to (2), wherein the susceptor changes in heat capacity in synchronization with a change in crystal orientation of the semiconductor wafer.

(6) The azimuth independent control means is a ledge portion that extends a predetermined length on the inner peripheral side of the opening of the susceptor and is provided at a lower portion of the opening so that the semiconductor wafer is placed thereon. The apparatus for producing an epitaxial wafer according to any one of (1) to (5) above, wherein the apparatus has a predetermined length and / or a shape of a peripheral portion of the semiconductor wafer.

(7) The epitaxial wafer manufacturing apparatus according to (6), wherein the predetermined length of the ledge portion is 2 mm or more and less than 6 mm.

(8) The azimuth independent control means is a control device capable of controlling the concentration and / or temperature of the raw material gas, and controls the concentration to be below a predetermined concentration and / or above a predetermined temperature. The epitaxial wafer manufacturing apparatus according to any one of (1) to (7) above.

  Here, the predetermined concentration is preferably 3.5% or less in the case where, for example, the orientation dependent control means is not used and in the case of trichlorosilane. Furthermore, it is preferably 2.5% or less. Furthermore, it is preferably 1.5% or less. In general, the lower the concentration of the raw material gas, the slower the epitaxial growth rate. Therefore, a higher concentration is preferable from the industrial viewpoint because productivity increases. The predetermined temperature is preferably 1100 ° C. or higher, for example. More preferably, it is 1110 degreeC or more. More preferably, it is 1120 degreeC or more. In particular, 1.5% or less and 1120 ° C. or more are preferable. In general, when the temperature is high, the surface of the epitaxial layer tends to be rough, which is not preferable. From the above, if the direction-dependent control means is not used, it is possible to obtain a comprehensively preferable condition in consideration of reduction in variation in angular periodic film thickness distribution, industrial productivity, product quality, and the like. it can. Further, when using the azimuth-dependent control means, it is possible to obtain optimum manufacturing conditions by appropriately combining such concentration conditions and temperature conditions.

(9) In a method of manufacturing an epitaxial wafer in which a semiconductor wafer and a source gas are reacted in a reactor to grow epitaxial, the semiconductor wafer is arranged from an opening of a susceptor pocket and depends on the crystal orientation of the semiconductor wafer An epitaxial layer in which an epitaxial layer is formed by fixing the semiconductor wafer to the susceptor of an epitaxial wafer manufacturing apparatus having an orientation dependent control means and / or an independent orientation independent control means, and rotating the susceptor together with the semiconductor wafer. Wafer manufacturing method.

(10) The orientation dependent control means includes the susceptor whose structure and / or shape periodically changes in accordance with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. The manufacturing method of the epitaxial wafer as described in said (9).

(11) The method for producing an epitaxial wafer according to (9) or (10), wherein the epitaxial layer is formed at a temperature of 1120 ° C. or higher.

(12) The method for producing an epitaxial wafer as described in (11) above, wherein the epitaxial layer is formed by controlling the concentration to a predetermined raw material concentration or less.

(13) An epitaxial wafer manufacturing method capable of reducing variations in angular periodic film thickness distribution of an epitaxial layer at an edge portion of an epitaxial wafer manufactured using a silicon wafer substrate having a crystal orientation of (110).

(14) An epitaxial wafer manufactured by the method according to (9) above, wherein the flatness is better than the flatness of the semiconductor wafer as the substrate.

(15) An epitaxial wafer manufactured by the method according to (9) above, wherein the peripheral epitaxial film thickness distribution has a good flatness suitable for a device process. Epitaxial wafer.

(16) An epitaxial wafer having a variation in film thickness distribution in the circumferential direction at the periphery of the epitaxial layer of 0.5% or less.

  Here, for example, the peripheral portion can be, for example, 1 mm inside from the outer peripheral end of the epitaxial wafer. In addition, if the diameter of the epitaxial wafer on the disk is d, the vicinity of the outer periphery of a concentric circle having a diameter of 98% of d can be considered as the peripheral portion. Further, since the variation in the film thickness distribution tends to increase toward the outer periphery, if the vicinity of the outer periphery of a concentric circle having a diameter of 99% of d is considered as the peripheral portion, the flat portion can be maintained in a wider area. Furthermore, if the vicinity of the outer periphery of a concentric circle having a diameter of 99.5% of d is considered as the peripheral portion, the flat portion can be maintained in a wider area.

(17) A method for determining manufacturing conditions of an epitaxial wafer in which a semiconductor wafer is reacted with a source gas in a reaction furnace to grow an epitaxial, and the epitaxial wafer is manufactured under predetermined initial manufacturing conditions. Condition Measure the flatness in the circumferential direction at the peripheral edge of the epitaxial wafer, and influence the influence on the flatness of the peripheral edge of the epitaxial wafer in the orientation dependent control means that depends on the crystal orientation of the semiconductor wafer or the independent orientation control means that does not depend on it. And determining or combining the azimuth-dependent control means or the azimuth-independent control means according to the result of the measured flatness of the peripheral edge of the initial condition epitaxial wafer to improve the flatness of the peripheral edge of the semiconductor wafer. A method for determining manufacturing conditions.

(18) An epitaxial wafer manufacturing apparatus for growing an epitaxial by reacting a semiconductor wafer and a source gas in a reaction furnace, including a susceptor having a pocket having an opening in which the semiconductor wafer is disposed, and the semiconductor An epitaxial wafer characterized in that the wafer is fixed to the susceptor, and the structure and / or shape of the susceptor is periodically changed in accordance with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. Manufacturing equipment.

  The growth rate of the epitaxial layer may vary depending on the crystal orientation. For example, in the case of a silicon single crystal, as represented by {111} facet and {311} facet in (100) crystal, the growth rate depends on the crystal orientation at the peripheral part of the wafer depending on the chamfered shape. It is known to occur.

  As a result, the thickness of the peripheral edge portion of the epitaxial wafer is increased or decreased in a cycle of 90 degrees. In order to effectively prevent this, it is desirable to provide compensation means in accordance with the crystal orientation in the vicinity of the peripheral edge of the semiconductor wafer serving as the substrate.

  On the other hand, a semiconductor wafer serving as a substrate rotates while forming an epitaxial layer in a chamber of an epitaxial manufacturing apparatus at a predetermined rotation speed in order to obtain a uniform film thickness as a whole. Therefore, the crystal orientation always changes with respect to the epitaxial manufacturing apparatus main body. Therefore, if the compensation means is fixed to the epitaxial manufacturing apparatus main body, a movable member synchronized with the rotation of the semiconductor wafer is used. On the other hand, since the semiconductor wafer is fixed to a susceptor having pockets as described below, the crystal orientation of the semiconductor wafer is fixed to the susceptor and rotates together with the semiconductor wafer. It would be advantageous if the growth rate could be adjusted by bringing about changes in structure and / or shape and other characteristics in line with the crystal orientation. Here, the structure refers to the whole of various elements that are related to each other, and refers to the mutual relationship between the elements. For example, a combination of materials, a combination of members, and the like are included. The shape refers to the form, shape, and state of things, and includes, for example, a triangle, a circle, a box shape, and the like. The size may be included as a difference in shape. The pocket provided in the susceptor can basically have a circular concave shape (a shape that can accommodate a disk-shaped wafer) having a flat bottom surface. That is, the circular concave shape of the pocket is generally defined by a substantially vertical surface (hereinafter referred to as “inner peripheral surface”) and a bottom surface.

  In general, the growth rate of the epitaxial layer depends on the flow rate of the growth gas, the concentration of the silicon component, the temperature, and the like. Therefore, a member or the like that changes them is included in the opening of the pocket containing the susceptor semiconductor wafer. It is preferable to provide in the vicinity of the peripheral surface. Specifically, this will be described in detail below.

(19) The epitaxial wafer according to (18), wherein the susceptor changes a counterbore depth in synchronization with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening. Manufacturing equipment.

  Here, the counterbore depth of the susceptor may be a distance from an upper surface of a member that defines a pocket of the susceptor to a ledge that holds the semiconductor wafer. Since the thickness of the semiconductor wafer is constant in the circumferential direction and the height of the ledge holding it is also constant, in order to change the counterbore depth, the position of the upper surface of the member defining the pocket is changed. That is, the upper surface of the member of the susceptor that defines the pocket repeats unevenness at a predetermined cycle along the circumference of the pocket. This predetermined period is synchronized with the period of crystal orientation that affects the growth rate of the epitaxial layer, and specifically includes periods of about 90 degrees, about 180 degrees, and about 270 degrees. The same applies to the following “predetermined period”.

  When the unevenness is developed along the circumferential direction, it may be curvilinear such as a sine curve, or may be linear composed of rectangular elements and / or triangular elements. For example, in the case of a silicon semiconductor wafer, it is more preferable that the depth of the counterbore is small in the [100] direction and the depth of the counterbore is deep in the [110] direction.

(20) The epitaxial wafer manufacturing method according to (18), wherein the pocket width of the susceptor changes in the vicinity of the inner peripheral surface of the opening in synchronization with a change in crystal orientation of the semiconductor wafer. apparatus.

  Here, the pocket width of the susceptor may mean the width of the pocket when viewed from above the pocket of the susceptor in which the semiconductor wafer is disposed. At this time, since the semiconductor wafer has a substantially circular shape when viewed from above, if the pocket width changes at a cycle of 90 degrees, the gap between the outer peripheral surface of the semiconductor wafer and the inner peripheral surface of the opening of the pocket is also about 90 degrees. It varies widely with period.

  This wide and narrow change may be curvilinear like a sine curve when developed along the circumferential direction, or may be linear such as a rectangular element and / or a triangular element. For example, in the case of a silicon semiconductor wafer, it is more preferable that the gap is widened in the [100] direction and the gap is narrowed in the [110] direction.

  In addition, when the semiconductor wafer is not substantially circular when viewed from above, the gap between the outer peripheral surface of the semiconductor wafer and the inner peripheral surface of the opening of the pocket is 90 ° cycle rather than the change in pocket width of 90 ° cycle. It is preferable to change with. The manner of change is the same as in the above case.

(21) The epitaxial wafer manufacturing apparatus according to (18), wherein the susceptor changes in heat capacity in the vicinity of the inner peripheral surface of the opening in synchronization with a change in crystal orientation of the semiconductor wafer. .

  Here, the change in the heat capacity of the susceptor may mean that the partial heat capacity of the susceptor changes at a period of 90 degrees in the circumferential direction of the opening of the pocket. For example, the diameter of the susceptor may increase or decrease in the vicinity of the opening with a period of 90 degrees, and the thickness of the susceptor may increase or decrease. Further, even if the shape of the susceptor in the circumferential direction does not change, it may include changing the material and increasing or decreasing the heat capacity. For example, it is possible to change the structure such as embedding a lump of iron in a susceptor made of carbon.

  The change in the heat capacity may be curvilinear such as a sine curve when developed along the circumferential direction, or may be linear such as a rectangular element and / or a triangular element. For example, in the case of a silicon semiconductor wafer, it is more preferable that the heat capacity increases in the [100] direction and decreases in the [110] direction.

  As described above, the counterbore depth, the pocket width, and the heat capacity have been separately set, but these can be combined with any one or two. For example, counterbore depth and pocket width, pocket width and heat capacity, heat capacity and counterbore depth, and counterbore depth, pocket width and heat capacity.

(22) A susceptor for holding the semiconductor wafer used in an epitaxial wafer manufacturing apparatus for growing an epitaxial by reacting a semiconductor wafer with a source gas in a reaction furnace, and having an opening in which the semiconductor wafer is disposed A susceptor comprising: a pocket having a shape; and a member whose shape changes in a predetermined cycle along the circumference in the vicinity of the inner circumferential surface of the opening.

(23) In an epitaxial wafer manufacturing method in which a semiconductor wafer and a source gas are reacted in a reaction furnace to grow epitaxial, the semiconductor wafer is disposed from an opening of a pocket of a susceptor, and an inner peripheral surface of the opening is The structure and / or shape of a nearby member changes at a predetermined period along its circumference, but the change in the structure and / or shape and the crystal orientation of the semiconductor wafer are synchronized to fix the semiconductor wafer to the susceptor. An epitaxial wafer manufacturing method in which an epitaxial layer is formed while rotating the susceptor together with the semiconductor wafer.

  Up to now, the epitaxial growth of the (100) plane of silicon has been described as an example. However, the present invention is not limited to this, and is used for an epitaxial manufacturing apparatus of any substance having an epitaxial growth rate having crystal orientation dependence and the apparatus. It can be used for susceptors and other jigs. At this time, by changing the period, the degree of increase / decrease, and other conditions according to the respective characteristics of the crystal orientation dependence, an epitaxial wafer having a peripheral portion having a uniform film thickness with little crystal orientation dependence is obtained. Can be manufactured.

(24) In an epitaxial wafer manufacturing method in which a semiconductor wafer and a source gas are reacted in a reaction furnace to grow epitaxially, the semiconductor wafer is placed in a ledge portion of a susceptor having an opening in which the semiconductor wafer is disposed. The ledge portion is extended to a predetermined length on the inner peripheral side of the opening of the susceptor, and is provided at a lower portion of the opening so that the semiconductor wafer is placed thereon. A method for manufacturing an epitaxial wafer, comprising controlling the film thickness of an epitaxial layer grown by changing the predetermined length.

  Here, the semiconductor wafer is held by a ledge formed in a pocket which is an opening of the susceptor. For example, the pocket may have a circular concave shape (a shape that can accommodate a disk-shaped wafer) having a basically flat bottom surface. That is, the circular concave shape of the pocket is defined by a substantially vertical surface (hereinafter referred to as “inner peripheral surface”) and a bottom surface. The ledge portion may be a member provided on the bottom surface along the circumferential direction of the opening portion having a tapered (sloppy mortar-shaped) upper surface extending from the inner peripheral surface to the inner peripheral side by a predetermined length. The ledge portion has a tapered upper surface in order to securely hold the semiconductor wafer while minimizing contact with the semiconductor wafer. To do. That is, there, it is led to the bottom surface of the pocket by a wall that cuts substantially vertically. As described above, the ledge portion has a shelf shape having a step formed by a shelf drop. This is similar to a shelf shape in which a washer just fitted into a circular concave shape is fixed to the bottom surface. Since the upper surface is tapered, the washer may be like a disc spring. The ledge portion may be formed integrally with the susceptor, not as a separate part. The semiconductor wafer is held by the ledge portion by directly or indirectly contacting the ledge portion with a part of the back surface thereof (for example, an annular ring). Therefore, the ledge portion is close to the back surface of the semiconductor wafer, but the distance from the back surface of the semiconductor wafer is remarkably increased at the bottom of the opening portion shelved from the ledge portion.

  When the ledge portion becomes hot due to the heat supplied from the susceptor, the heat from the ledge portion is easy to be transmitted because the distance from the back surface of the semiconductor wafer is short, and the peripheral portion of the semiconductor wafer (hereinafter referred to as “ledge” The “region” is likely to be hot. For this reason, in this ledge region of the semiconductor wafer, it is considered that the growth rate of the epitaxial layer on the surface of the semiconductor wafer which has become higher due to the heat transferred from the side surface and the back surface is increased. Therefore, the thickness of the epitaxial layer increases rapidly toward the outer peripheral side in the ledge region. Here, the ledge region where the semiconductor wafer overlaps with the ledge portion is the semiconductor wafer corresponding to the position where the ledge portion is provided on the upper surface of the semiconductor wafer (the surface opposite to the back surface of the semiconductor wafer in contact with the ledge portion). It means the peripheral part of the upper surface of

(25) The semiconductor wafer includes at least one surface composed of a device use region and a peripheral portion surrounding the device, and the predetermined length of the ledge portion is the use region of the semiconductor wafer to be mounted. The method for producing an epitaxial wafer according to (24), wherein the ledge portion is adjusted so as not to reach a corresponding position on the wafer surface.

  As described above, the thickness of the epitaxial layer in the ledge region of the semiconductor wafer is likely to change greatly, but the flatness requirement of the finished epitaxial silicon wafer becomes stricter, so it is only necessary to adjust the thickness of the semiconductor wafer as the substrate. It has become difficult to maintain high flatness of the epitaxial silicon wafer. In addition, in order to increase the use area of the epitaxial silicon wafer, reduction of the edge exclusion area and improvement of the flatness of the peripheral part of the epitaxial silicon wafer are strongly desired. Here, the flatness generally means the degree of flatness, but it is not flat when the flatness is low, and can be considered flat when the flatness is high.

  As described above, when the predetermined length of the ledge portion is not extended to the use area (or when the ledge area is reduced), the flatness in the use area of the epitaxial silicon wafer is improved.

(26) The predetermined length of the ledge portion is variable along the circumferential direction of the opening, and can be changed according to the shapes of the semiconductor wafer and the opening. 24) The manufacturing method of the epitaxial wafer of (25) description.

  On the other hand, in the outer periphery of a semiconductor wafer, when a large change such as a sharp decrease in the thickness of the epitaxial layer at or near the position occurs due to a large change in the shape (for example, a large change in thickness such as chamfering) There is. At this time, by offsetting the change (rapid increase) in the thickness of the epitaxial layer accompanying the change in the length of the ledge as described above, an epitaxial wafer with higher flatness can be manufactured as a result. Here, “variable along the circumferential direction of the opening” means, for example, that the distance from the inner circumferential surface of the upper surface of the ledge portion changes clockwise along the circular circumferential direction of the opening as viewed from above. Can mean that.

(27) The method for manufacturing an epitaxial wafer according to any one of (24) to (26), wherein the predetermined length of the ledge portion is 2 mm or more and less than 6 mm.

  For example, if the length of the ledge portion is less than 6 mm, a large change point of the film thickness as described above can be easily made at the boundary of the ledge region, so the position of the change point is 6 mm or less from the outer periphery of the epitaxial silicon wafer. Therefore, it is easy to maintain high flatness in the use region of the epitaxial silicon wafer on the inner peripheral side. That is, the change point of the film thickness can be taken out of the device use area. As described above, it is possible to improve the film thickness distribution of the outer peripheral epitaxial layer and reduce the deterioration of flatness due to epitaxial growth. If the length of the ledge portion is shorter, for example, less than 4 mm, the higher flatness may be maintained up to the peripheral region.

  On the other hand, the ledge portion must maintain the function of holding the semiconductor wafer, and for this purpose, the ledge portion preferably has a length of at least 2 mm. However, if the function of holding the semiconductor wafer can be maintained, it can be made shorter.

(28) In an epitaxial wafer manufacturing apparatus for growing an epitaxial by reacting a semiconductor wafer and a source gas in a reaction furnace, a susceptor having an opening in which the semiconductor wafer is disposed, and along a circumferential direction of the opening And a ledge portion provided at a lower portion of the opening so that the semiconductor wafer is placed thereon, and at least one surface thereof is a device. Manufacturing of an epitaxial wafer characterized in that the ledge portion does not reach a corresponding position on the wafer surface of the semiconductor wafer composed of a use region of the semiconductor wafer and a peripheral portion surrounding the use region. apparatus.

(29) The epitaxial wafer manufacturing apparatus according to (28), wherein the predetermined length of the ledge portion is 2 mm or more and less than 6 mm.

  As described above, according to the present invention, a large change point of the film thickness of the epitaxial layer can be out of the device use region, and it is possible to contribute to uniform film thickness distribution in the device use region. The flatness of the epitaxial wafer can be improved. Further, the flatness of the epitaxial wafer can be increased (or improved) by the combination of the shape with the semiconductor wafer as the substrate. That is, even if the film thickness distribution of the epitaxial layer is not very uniform (the degree of non-uniformity is high), even if the flatness of the semiconductor wafer that is the substrate is not so high, the flatness of the epitaxial wafer that is a combination of the two can be improved. As a result, it can be improved.

  Furthermore, according to the present invention, the film thickness variation in the circumferential direction at the peripheral edge of the epitaxial layer can be reduced and uniformized. Conversely, when a change in the film thickness in the circumferential direction at the peripheral edge of the epitaxial layer is desired, it is possible to form a desired film thickness distribution in the circumferential direction at the peripheral edge of the epitaxial layer using the above-described apparatus or method. Is possible.

  Embodiments of the present invention will be described below in more detail with reference to the drawings. In addition, the same code | symbol is used for the same element and the overlapping description is abbreviate | omitted.

  FIG. 1 is a diagram schematically showing a longitudinal section of the susceptor 4. The bottom part of the pocket 13 which is an opening part of the susceptor 4 is composed of a shelf part and a tapered surface as described below. For example, in an apparatus for epitaxially forming a wafer having a diameter of 300 mm, a disk member having a diameter of 350 to 400 mm and a thickness of 3 to 6 mm is used as the susceptor 4.

  A pocket 13, which is a circular recess for receiving the semiconductor wafer 12 serving as a substrate, is provided from a position facing the center of the upper surface of the susceptor 4 by 20 to 40 mm, and a tapered surface 31 is provided at the bottom thereof. The tapered surface 31 has a gentle slope.

  A shelf 32 that is a circular recess is provided further from the tapered surface 31 toward the center. The shelf portion 32 is a circular flat surface provided at a position slightly lower than the tapered surface 31, and is a horizontal plane parallel to the upper surface of the susceptor 4.

  Although only two are illustrated in FIG. 1 for the sake of explanation, the shelf portion 32 is provided with three through holes 22, and the upper portion of each through hole 22 is a dish-like hole 22 that opens upward. ′ Is formed. Wafer support lift pins 23 are inserted into the three through holes 22, respectively. The diameter of the through hole 22 is larger than the diameter of the lift pin 23, and is formed to have a size that does not come into contact with the susceptor 4 when the lift pin 23 moves up and down.

  The lift pins 23 are made of quartz, carbon C, silicon carbide SiC, or the like. The lift pin 23 has a columnar shape or a cylindrical shape, and a head 24 having a tapered surface 24b on the outer periphery of the lower portion so as to correspond to the dish-shaped hole 22 ′. The taper angle of the taper surface 24b of the head 24 matches the taper angle of the taper surface of the countersunk hole 22 '.

  The upper portion 24a of the head 24 has a conical shape with an apex angle being an obtuse angle, and the contact area when supporting the wafer back surface is made extremely small, thereby preventing the lift pins 23 from causing scratches on the wafer back surface. The lift pin 23 is vertically suspended by its own weight when the head 24 is engaged with the inner wall of the dish-like hole 22 ′ of the susceptor 4 and the lift pin 23 is lowered. At this time, the upper portion 24 a of the head 24 does not protrude from the upper surface of the shelf portion 32.

  FIG. 2 is a longitudinal section showing a schematic structure of the epitaxial wafer manufacturing apparatus 1 in which the susceptor 4 of FIG. 1 is used. In this single wafer type epitaxial wafer manufacturing apparatus, normally, a susceptor 4 (wafer support) for horizontally supporting only one wafer is provided in the processing chamber 2. In addition, a lift mechanism for moving the wafer 12 up and down relative to the susceptor 4 is provided in order to transport the wafer 12 onto the susceptor 4. The lift mechanism has a plurality of lift pins 23 extending through the susceptor 4. The wafer 12 is placed on the upper ends of these lift pins 23, and the lift pins 23 are moved up and down relative to the susceptor 4. Wafer 12 is moved up and down. With such a lift mechanism, the wafer 12 placed on the hand of the transfer arm and carried into the chamber 2 is transferred onto the susceptor 4, or vice versa, the wafer 12 is transferred from the susceptor 4 to the hand. It becomes possible to do.

  In order to grow an epitaxial layer, it is necessary to heat the wafer 12 supported on the susceptor 4 to a high temperature. For this reason, heat sources 8 and 9 such as a large number of halogen lamps (infrared lamps) are arranged above and below the processing chamber 2 to heat the susceptor 4 and the wafer 12.

  The susceptor 4 is a carbon C base material coated with a silicon carbide SiC film, and serves as a soaking plate for keeping the temperature of the entire wafer 12 uniform when the wafer 12 is heated. As shown in FIG. 1, on the upper surface of the susceptor 4, for example, a pocket 13 is formed which is slightly larger than the wafer 12 and is a recess having a depth of about 1 to 2 mm to accommodate a silicon wafer. The bottom surface of the pocket 13 has a tapered surface so as to be in contact with only the outer peripheral portion of the semiconductor wafer 12, and is devised to reduce the surface contact between the bottom surface and the wafer 12 as much as possible. The wafer 12 is accommodated in the recess, and the susceptor 4 is held in a carrier gas containing a source gas at a predetermined temperature, whereby an epitaxial layer made of a silicon thin film grows on the surface of the wafer 12. Here, the source gas refers to a silicon source gas and a dopant gas.

A chlorosilane-based gas such as trichlorosilane SiHCl ₃ or dichlorosilane SiH ₂ Cl ₂ is generally used as the silicon source gas, and diborane (P-type) or phosphine (N-type) is generally used as the dopant gas. . These gases are introduced into the chamber together with hydrogen H ₂ which is a carrier gas.

  The chamber 2 is formed by sandwiching a cylindrical base ring 3 from above and below by a disk-like upper window 5 and a saucer-like lower window 6, and an internal closed space forms a reaction furnace. The upper window 5 and the lower window 6 are made of translucent quartz so as not to block light from the heat source. The reaction furnace formed in the chamber 2 is roughly divided into an upper chamber 7 a that is a space above the wafer 12 and a lower chamber 7 b that is a space below the wafer 12.

  Furthermore, heat sources 8 and 9 for heating the reaction furnace are provided above and below the chamber 2. In the present embodiment, the upper and lower heat sources 8 and 9 are each composed of a plurality of halogen lamps (infrared lamps).

  The chamber 2 houses a susceptor 4 that supports the wafer 12 on the top. The susceptor 4 has a disk shape when viewed from above, and has a diameter larger than that of the wafer 12. On the upper surface of the susceptor 4, a pocket 13, which is a circular concave opening for accommodating the wafer 12, is provided. In this example, the susceptor 4 is a carbon C base material coated with a silicon carbide SiC film, and serves as a soaking plate for keeping the temperature of the entire wafer 12 uniform when the wafer 12 is heated. . Therefore, the susceptor 4 has a thickness several times that of the wafer 12 and a heat capacity several times that of the wafer 12. Further, the temperature is usually higher than that of the wafer 12.

  During the epitaxial layer growth processing operation, the susceptor 4 rotates about the vertical axis in the plane parallel to the plate surface of the wafer 12 so that a uniform epitaxial layer is formed on the upper surface of the wafer 12. As a matter of course, the center of the pocket 13 provided in the susceptor 4 coincides with the rotation center of the susceptor 4.

  Below the susceptor 4, a columnar or cylindrical susceptor support shaft 14 serving as a rotation axis of the susceptor 4 is vertically arranged, and above the susceptor support shaft 14, three susceptor arms that horizontally support the susceptor 4. 15. The three susceptor arms 15 are arranged radially so that each of them forms an angle of 120 ° when viewed from above, and the upward convex portion provided at the tip of the susceptor arm 15 abuts the lower surface of the susceptor 4 and 4 is supported.

  The susceptor support shaft 14 is disposed perpendicularly to a position where the axis of the susceptor support shaft 14 coincides with the center of the disc of the susceptor 4, and the susceptor 4 rotates as the susceptor support shaft 14 rotates. The rotation to the susceptor support shaft 14 is given by a rotation drive mechanism (not shown). The susceptor support shaft 14 and the susceptor arm 15 are made of translucent quartz so as not to block light from the lower heat source 9.

(Measurement of film thickness distribution)
3A and 3B are top views of a semiconductor wafer (silicon single crystal wafer) 12 serving as an epitaxial wafer substrate. The semiconductor wafer 12 is set on a susceptor with the epitaxial layer forming surface (100) facing upward, and a notch 12a is engraved to clarify the crystal orientation on the epitaxial layer forming surface. In this specification, when the crystal orientation is described, as shown in the top view of the semiconductor wafer 12, the origin 12b is set to 0 degree and an angle of 360 degrees counterclockwise is used. The film thickness distribution is shown. FIG. 3B is a diagram showing a crystal direction according to the Miller index of the wafer. As can be seen from this figure, it can be seen that the crystal orientation is repeated such that the crystal orientation is turned back by a mirror every 0 to 45 degrees, and the crystal orientation is repeated at a period of 90 degrees. As a result, the film thickness distribution depending on the crystal orientation is expected to change with a mirror every 90 degrees and every 0 to 45 degrees.

  FIG. 4A is a plot of the change from the average film thickness of the formed epitaxial layer as a function of the angle of FIG. 3 in the ratio to the target film thickness value (the same applies to similar graphs below). ). The vertical axis represents the formation thickness of the epitaxial layer, and the horizontal axis represents the angle according to FIG. In the figure, the black circle indicates the thickness of the epitaxial layer formed 1 mm from the outer periphery, the black triangle indicates the thickness of the epitaxial layer 2 mm from the outer periphery, and the cross indicates 3 mm from the outer periphery. The result of having measured the formation film thickness of the epitaxial layer in the inside with respect to the angle of FIG. 3A is shown.

  The epitaxial layer was formed by using a single wafer type epitaxial manufacturing apparatus shown in FIG. 2 and fixing the semiconductor wafer 12 as shown in FIG. 3A to an ordinary susceptor. Since the susceptor generally used in the apparatus shown in FIG. 2 is used, the structure and / or shape of the vicinity of the inner peripheral surface 13b of the opening of the pocket 13 changes with a period of about 90 degrees. There was almost no uniform structure and shape from 0 to 360 degrees.

  As can be seen from the figure, the film thicknesses are maximum at 0 degrees (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and the film thickness valleys at 45 degrees, 135 degrees, 230 degrees, and 315 degrees. The effect of crystal orientation on the film formation rate is clear. In particular, it can be seen that this effect is large in the black circle plot close to the outer periphery, and the influence becomes larger toward the outer periphery. Therefore, the uniformity of the epitaxial layer film thickness distribution at the peripheral edge of the wafer deteriorates due to the film thickness variation having angular periodicity. When the degree of variation in the epitaxial layer thickness distribution was evaluated by the following formula (Formula 1), the variation in the thickness distribution at 1 mm from the outer periphery was Δt = 2.01%.

  FIG. 4B is a plot of the formed film thickness of the epitaxial layer that entered 1 mm from the outer periphery in the same manner as FIG. 4A, but the black circles indicate that there are few disturbances other than angular periodicity. The mark shows a large disturbance other than the angular periodicity. As in FIG. 4A, the vertical axis represents the deviation of the epitaxial film thickness from the target value as a ratio. That is, when the film thickness ratio is 0, it is the same as the target film thickness, and when +0.02, the film thickness is 0.02 thicker than the target. As in FIG. 4A, the black circle plots show maximum values at 0 degree (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and are around 45 degrees, 135 degrees, 230 degrees, and 315 degrees. There is a valley in the film thickness, and the influence of the crystal orientation on the film formation rate is clear. On the other hand, the x-marked plot shows a similar maximum, but is a slightly downward-sloping plot from 0 to 360 degrees. In such a plot, in order to analyze periodicity, the following normal autocorrelation function (Equation 2) is used.

  Since equation (2) is a story of a continuous signal, the following equation (3) is used when considering a discrete system in which the signal is sampled.

  At this time, since the film thickness distribution in the circumferential direction is a periodic function that returns to the original position at 360 degrees, numerical processing using the original measurement value at 360 degrees can be performed. The correlation function values obtained in this way are plotted against the angle in FIG. 4C (those with less disturbance other than angular periodicity) and FIG. 4D (those with larger disturbance other than angular periodicity), respectively. . In these figures, the horizontal axis represents the angle, but the vertical axis represents a relative value with respect to a certain value. That is, 0% is the same as a reference value, and -0.002% is 0.002% smaller than the value. As can be seen from these figures, a maximum appears every 90 degrees, and it can be seen that the film thickness distribution changes at a period of 90 degrees. Further, when FIG. 4C is compared with 4D, the swing width of FIG. 4C is considerably larger.

  In addition, since the film thickness distribution changes by 45 degrees as described above, the data shown in FIG. 4B is rearranged. That is, the data from 0 to 45 degrees is left as it is, the angle from 45 degrees to 90 degrees corresponds to the angle from 45 degrees to 0 degrees, and the angle from 90 degrees to 135 degrees. 0 to 45 degrees is supported, 135 to 180 degrees is associated with the angle from 45 degrees to 0 degrees, and 180 to 225 degrees is represented with an angle of 0 to 45 degrees. Corresponding, the data from 225 degrees to 270 degrees correspond to the angle from 45 degrees to 0 degrees in the opposite direction, the data from 270 degrees to 315 degrees to correspond the angle from 0 to 45 degrees, 315 degrees The angle from 45 degrees to 360 degrees corresponds to the angle from 45 degrees to 0 degrees in the opposite direction. When plotted in this way, the curves that are translated in the vertical direction are drawn in a substantially similar shape, and the curve group consisting of the ones having a large disturbance other than the angular periodicity has a larger vertical variation.

  Here, the arithmetic average (or arithmetic average) of the film thickness corresponding to 0 to 45 degrees for each of those having a small disturbance other than the angular periodicity and those having a large disturbance other than the angular periodicity is set to 0. When plotted in the range of 45 degrees to 45 degrees, those having little disturbance other than angular periodicity and those having large disturbance other than angular periodicity have similar shapes that are translated in the vertical direction. Therefore, when the film thickness ratio at 0 degrees is normalized and the film thickness ratio is plotted in the range of 0 to 45 degrees, a diagram as shown in FIG. 4E is obtained. From this figure, the plots consisting of those with little disturbance other than angular periodicity and those with large disturbance other than angular periodicity almost overlap each other, and disturbances other than angular periodicity are almost equal to angular periodic disturbances. It turns out that it is independent. Further, if the disturbance of the angular periodicity can be removed or offset, it is expected that the variation in the film thickness distribution can be reduced by itself.

  Next, using the same apparatus equipped with a susceptor having no angular periodicity, variations in the film thickness distribution of epitaxial wafers manufactured by changing the concentration of trichlorosilane and the temperature conditions were examined. FIG. 4F shows the variation in the angular periodic film thickness distribution at the peripheral edge (1 mm from the end) when epitaxial growth is performed at high and low temperatures while changing the concentration of trichlorosilane. As can be seen from this figure, in the case of high-temperature growth, when the concentration of trichlorosilane is 3.5% or less, more preferably 2% or less, the variation becomes small and a flat and preferable epitaxial wafer is manufactured. Here, since the temperature during epitaxial growth contributes to the angular periodic film thickness distribution, the baking temperature and the like need not be considered. Note that the epitaxial growth temperature is kept substantially constant. As the epitaxial growth temperature, for example, a value obtained by reading the temperature at the center of the wafer with a pyrometer can be used. Although the temperature contributing to the angular periodic film thickness distribution is considered to be the temperature at the outer peripheral portion, there is almost no temperature difference between the wafer central portion and the outer peripheral portion, and the temperature at the central portion can be substituted. On the other hand, the concentration of trichlorosilane (TCS) is the concentration of trichlorosilane in the gas flowing in the upper region of the heat ring and the susceptor 4, and the source gas (if diluted in advance with a gas such as hydrogen) And flow rate of carrier gas (for example, each flow rate per minute. Specifically, slm (standard liter / min). The flow rate per minute at 1 atm and 0 ° C. is displayed in liters. Unit).) Here, it is considered that the lower carrier gas (10b in FIG. 2) generally does not affect the trichlorosilane concentration. Therefore, it is not necessary to consider when determining the trichlorosilane concentration. If the concentration of trichlorosilane in the gas flowing in the region is affected, it may be considered. As described above, according to this method, despite the use of means having no angular periodicity, the angular periodicity of the film thickness distribution of the resulting epitaxial wafer becomes very small.

  FIG. 4G shows the concentration of trichlorosilane and the contour line of the variation of the angular periodic film thickness distribution on the epitaxial wafer manufactured by changing the concentration of trichlorosilane and the temperature condition in the same apparatus including the susceptor having no angular periodicity. A map for temperature is shown. In this figure, the variation in the angular periodic film thickness distribution becomes smaller toward the lower right. Therefore, the trichlorosilane concentration and temperature conditions in the triangle drawn with a broken line at the lower right corner in the figure are preferable. The area in the triangle can be expressed by the following formula, assuming that the trichlorosilane concentration is C (%) and the temperature is T (° C.).

  This figure is for the same apparatus provided with a susceptor having no angular periodicity. However, when a special susceptor is used as the orientation dependent control means, another figure mapped to the concentration condition and the temperature condition is drawn. Will be. According to such a diagram, optimum manufacturing conditions can be obtained by appropriately combining concentration conditions and temperature conditions in each apparatus condition.

  Next, an attempt is made to offset the difference in epitaxial growth due to crystal orientation by taking measures with angular periodicity. For example, in order to reduce such variation in film thickness distribution, a susceptor whose structure and / or shape changes according to the film thickness distribution can be used. Specifically, the structure and / or shape in the vicinity of the inner peripheral surface 13b of the opening portion of the pocket changes with a period of 90 degrees. More specific description will be given below with reference to FIGS.

  5 and 6 show the shape in the vicinity of the inner peripheral surface 13b of the opening of the susceptor in which only the pocket depth of the pocket is changed in the same susceptor. 5 is a partially enlarged cross-sectional view around 0 degrees (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and FIG. 6 is a partially enlarged cross-sectional view around 45 degrees, 135 degrees, 225 degrees, and 315 degrees. is there. In either case, the semiconductor wafer 12 is held on the tapered surface 31 of the susceptor 4 so as to avoid surface contact, and is disposed in the pocket 13 with a gap 13 a therebetween.

  When the counterbore depth D of the susceptor is reduced, the silicon source gas is smoothly supplied to the peripheral portion of the wafer, and the epitaxial layer growth rate at the peripheral portion is increased. As the counterbore depth of the susceptor increases, the reverse phenomenon occurs and the growth rate slows down. Since the holding position (height) of the semiconductor wafer 12 is the same in the susceptor 4, in order to change the counterbore depth of the pocket 13, the positions of the upper surfaces 51 and 52 of the members near the opening of the pocket are changed. It will be. That is, in FIG. 5, the upper surface of the semiconductor wafer 12 is located at a position lower than the upper surface 51 of the member in the vicinity of the opening of the susceptor 4, and the flow of the source gas (or source gas) indicated by the arrow F1 exceeds the gap 13a. It is thought to bend at. Therefore, it is considered that a stagnation X of the flow occurs and the gas supply amount in the peripheral portion is slightly reduced.

  On the other hand, in FIG. 6, the upper surface of the semiconductor wafer 12 is almost at the same position as the upper surface 51 of the member in the vicinity of the opening of the susceptor 4. It is considered that the layer formation speed is sufficiently accelerated. The counterbore depth D at this time may be substantially equal to or less than the thickness of the semiconductor wafer 12. Such a height ratio can be appropriately determined according to the film thickness distribution when the epitaxial layer is actually formed. In general, when the variation in the film thickness distribution is large, the height ratio becomes larger. The counterbore depth is preferably changed within a range of ± 0.5 mm of the thickness in consideration of the thickness of the semiconductor wafer 12. Further, the transition from the state of FIG. 5 to the state of 6 can be performed in a curvilinear and / or linear manner. The transition from the state of FIG. 5 to 6 (or 6 to 5) is preferably a simple decrease (or simple increase).

  7 and 8 show the shape in the vicinity of the inner peripheral surface 13b of the opening of the susceptor in which only the width of the pocket 13 is changed in the same susceptor. 7 is a partially enlarged cross-sectional view around 0 degrees (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and FIG. 8 is a partially enlarged cross-sectional view around 45 degrees, 135 degrees, 225 degrees, and 315 degrees. is there. In either case, the semiconductor wafer 12 is held on the tapered surface 31 of the susceptor 4 so as to avoid surface contact, and is disposed in the pocket 13 with a gap 13 a therebetween. When the pocket width of the susceptor is increased, the silicon source gas is smoothly supplied to the peripheral portion of the wafer, and the epitaxial layer growth rate at the peripheral portion is increased. When the pocket width of the susceptor is narrowed, the reverse phenomenon occurs and the growth rate becomes slow. Since the semiconductor wafer 12 has a substantially circular shape (disk shape), the interval L of the gap 13a changes when the pocket width is changed. Therefore, it is considered that the flow of the source gas (or source gas) indicated by the arrow F3 reaches the upper surface of the semiconductor wafer 12 after exceeding the outer edge of the semiconductor wafer 12 (FIG. 7). On the other hand, the flow of the source gas (or source gas) indicated by the arrow F4 is considered to reach the upper surface of the semiconductor wafer 12 beyond the gap 13a opened by the interval L (FIG. 8). That is, the stagnation X region deviates from the semiconductor wafer 12.

  The ratio of such pocket widths can be appropriately determined according to the film thickness distribution when the epitaxial layer is actually formed. In general, when the variation in the film thickness distribution is large, the width ratio becomes larger. The pocket width is preferably changed within a range of +1 to 10 mm of the diameter of the semiconductor wafer 12. Further, the transition from the state of FIG. 7 to the state of 8 can be performed in a curved line and / or linearly. The transition from the state of FIG. 7 to the state of 8 (or from 8 to 7) is preferably a simple decrease (or simple increase).

  9 and 10 show the shape in the vicinity of the opening of the same susceptor in which only the thickness is changed to change the heat capacity. 9 is a partially enlarged cross-sectional view around 0 degrees (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and FIG. 10 is a partially enlarged cross-sectional view around 45 degrees, 135 degrees, 225 degrees, and 315 degrees. is there. In either case, the semiconductor wafer 12 is held on the tapered surface 31 of the susceptor 4 so as to avoid surface contact, and is disposed in the pocket 13 with a gap 13 a therebetween. When the thickness of the susceptor is increased or the diameter is increased, the heat capacity of the susceptor at that portion is increased, and the epitaxial layer growth rate is increased. When the thickness of the susceptor becomes shallower or the diameter becomes smaller, the reverse phenomenon occurs and the growth rate becomes slower. Since the semiconductor wafer 12 has a substantially circular shape (disk shape), the radial shape in the vicinity of the opening of the susceptor 4 is also uniform. However, when the height H is about 20% thicker than that of FIG. 9 as shown in FIG. 10, the heat capacity increases accordingly. Since the flow path shape of the flow of the source gas (or source gas) does not change, the crystal orientation is the same in the source supply, but the higher the heat capacity, the faster the formation rate of the epitaxial layer, which can be utilized. .

  Such a difference in heat capacity is because the susceptor 4 is a single lump as a whole, and even if the shape changes linearly and abruptly, it is smoothed to some extent, so it is an effective means when a gentle transition is required. is there.

  FIGS. 11 and 12 show the shape near the opening of another type of susceptor with varying heat capacity. FIG. 11 is a partially enlarged cross-sectional view around 0 degrees (360 degrees), 90 degrees, 180 degrees, and 270 degrees, and FIG. 12 is a partially enlarged cross-sectional view around 45 degrees, 135 degrees, 225 degrees, and 315 degrees. is there. In either case, the semiconductor wafer 12 is held on the tapered surface 31 of the susceptor 4 so as to avoid surface contact, and is disposed in the pocket 13 with a gap 13 a therebetween. Since the semiconductor wafer 12 has a substantially circular shape (disk shape), the radial shape in the vicinity of the opening of the susceptor 4 is also uniform. However, if the width W is significantly increased as compared with FIG. 11 as shown in FIG. 12, the heat capacity is increased accordingly. Since the flow path shape of the flow of the source gas (or source gas) is slightly longer in FIG. 12, there is a possibility that the supply rate is reduced due to the flow resistance, but the shape is appropriately selected by experiment. Since the mechanism is the same as that described above, description thereof is omitted here.

  As described above, the film thickness distribution of the epitaxial layer in the peripheral portion can be improved by applying the above processing to the susceptor so as to offset the growth rate angle dependency of the epitaxial layer in the peripheral portion of the wafer. . By adjusting the counterbore depth, pocket width, and heat capacity (depth, width, thickness, processing angle), it is possible to handle wafers with various crystal orientations and chamfered shapes.

Example 1
FIGS. 13 to 17 show the results of film thickness distribution measurement when the epitaxial layer is formed by changing the counterbore depth. Since it is similar to FIGS. 5 and 6, redundant description is omitted. 13 and 14 are partially enlarged sectional views of the susceptor and the like, and FIG. 15 is a top view of the susceptor 4. FIG. 16 is a graph showing the counterbore depth developed at an angle. The counterbore depth this time is thinner than the thickness D1 of the semiconductor wafer 12. As shown in FIGS. 15 and 16, the counterbore depth changes in a cycle of about 90 degrees.

  In the (100) substrate (notch orientation 0 °) which is a semiconductor wafer, the growth rate of the epitaxial layer at the peripheral portion gradually decreases as it goes from 0 ° to 45 °. When the wafer was loaded on the susceptor, the susceptor was processed so that the counterbore depth of the portion where the 45 ° direction of the wafer was positioned was the smallest, and epitaxial growth was performed. As can be seen from FIG. 17, the variation in film thickness due to crystal orientation is considerably reduced. When the film thickness distribution at 1 mm from the outer periphery was evaluated by the above (Equation 1), Δt was improved from 2.01% to 0.88%.

(Example 2)
FIGS. 18A to 20A and 21A show the film thickness distribution measured when the epitaxial layer is formed by changing the pocket width. Since it is similar to FIGS. 7 and 8, redundant description is omitted. 18 and 19 are partially enlarged sectional views of the susceptor and the like, and FIG. 20 is a top view of the susceptor 4. FIG. 21A is a graph showing the effect of the pocket width developed at an angle on the film thickness. The pocket width this time is slightly wider than the diameter of the semiconductor wafer 12 in a narrow area, and is about 5 mm wider than the diameter in a wide area. As shown in FIG. 20A, the pocket width changes in a cycle of 90 degrees.

  In the (100) substrate (notch orientation 0 °) which is a semiconductor wafer, the growth rate of the epitaxial layer at the peripheral portion gradually decreases as it goes from 0 ° to 45 °. When the wafer was loaded on the susceptor, the susceptor was processed so that the pocket width of the portion located in the 45 ° direction of the wafer was the widest, and epitaxial growth was performed. As can be seen from FIG. 21A, the variation in film thickness due to crystal orientation is considerably reduced. When the film thickness distribution at 1 mm from the outer periphery was evaluated by the above (Equation 1), Δt was improved from 2.01% to 0.97%.

  Here, in FIGS. 20A, 20B, and 21B, the relationship between the distance of the gap 13a that is the difference in the pocket width of the susceptor and the variation in the angular periodic film thickness distribution will be described. As shown in FIG. 20A, the pocket width when rotated 45 ° counterclockwise from the reference point is wider than the pocket width when rotated 90 °. FIG. 20B shows the difference between the widths on the horizontal axis and the variation in the angular periodic film thickness distribution on the vertical axis. In the production of this epitaxial wafer, the ones grown at a low temperature are indicated by white diamonds, and the others are all grown at a high temperature. The white square has a trichlorosilane concentration of 1.60%, and the white triangle has 2.33%. Those grown at a low temperature (open diamonds) were also epitaxially formed at a concentration of 2.33%. The white circles were 3.66% and the black squares were 7.14%.

  In this figure, each measurement point is plotted, and an approximate expression of several orders is obtained from the plot by the least square method, and the plots are connected by the approximate expression. Referring to these curves, each plot shows a minimum due to the difference in the susceptor pocket widths, as seen by the variation in the angular periodic film thickness distribution as a function of the difference in the optimal susceptor pocket width. It can be seen that the variation increases even if it is too large or too small. If the concentration is the same, the higher temperature produces a minimum value of about 0.1% at a pocket width difference of about 1.5 mm. On the other hand, the low temperature produces a minimum value of about 0.3% at about 3 mm. From this, it can be understood that the growth rate difference depending on the crystal orientation is easier to adjust at higher temperatures without taking a larger pocket width difference. It can also be seen that the degree of variation that is minimized is smaller at higher temperatures. Next, if the temperature is fixed at a high temperature, it can be seen that the lower the concentration, the smaller the difference in the susceptor pocket width. However, when the concentration is 3.66% or more, the same difference in the susceptor pocket width is preferable. I understand that. Once you have plotted such a figure, you can see how much difference you need in the susceptor pocket width.

  FIG. 21B illustrates the effect of variation on the improvement process and the normal process. As can be seen from this figure, an improvement process (raw material concentration and temperature) is necessary to make the variation of the angular periodic film thickness distribution 0.5% or less.

  FIG. 21C shows the angular periodic film thickness distribution as a function of the angle in FIG. 3A when epitaxial formation is performed at a high temperature with a trichlorethylene concentration of 2.3% using a normal susceptor and a special susceptor. The special susceptor is prepared so as to reduce the variation in the angular periodic film thickness distribution by the method described above. As can be seen from this figure, when a normal susceptor is used, the angular periodic film thickness distribution changes with a period of about 90 degrees, but this is not necessarily the case with a special susceptor.

  21D and 21E are plots of the autocorrelation function as a function of angle, similar to FIGS. 4C and 4D. The normal susceptor clearly shows a periodicity of 90 degrees, but the special susceptor shows a slight maximum at every 90 degrees, but the periodicity cannot be clearly confirmed. Also, the rate of change of the autocorrelation function is considerably smaller in the special susceptor than in the normal susceptor. FIG. 21F shows an average epitaxial layer thickness ratio obtained by 45-degree folding obtained in the same manner as in FIG. 4E. From this figure, it can be seen that when the special susceptor is used, the variation in the angular periodic film thickness distribution is reduced. In addition, the angular periodicity is not observed so much, and the decrease in variation indicates that the difference in the epitaxial formation rate based on the crystal orientation can be offset by the special susceptor. FIG. 21G shows the average epitaxial layer thickness ratio by 45 degree folding when epitaxially formed at a low temperature. Compared with FIG. 21F, it can be seen that the degree of variation in the film thickness ratio is slightly large. However, even when epitaxial formation is performed at a low temperature, when the special susceptor is used, the variation in the angular periodic film thickness distribution is reduced. It also shows that the difference in the epitaxial formation rate based on the crystal orientation can be offset by the special susceptor.

(Example 3)
FIGS. 22 to 26 show the film thickness distribution measured when the epitaxial layer is formed by changing the heat capacity (susceptor partial thickness). Since it is similar to FIGS. 9 and 10, redundant description is omitted. 22 and 23 are partially enlarged sectional views of the susceptor and the like, and FIG. 24 is a schematic view of the bottom surface of the susceptor 4. FIG. 25 shows the change in the thickness of the susceptor developed at an angle. FIG. 26 is a graph showing the influence of the thickness of the susceptor developed at an angle on the film thickness. The partial change in the thickness of the susceptor this time is about 20% of the thickness of the thin susceptor at the thick part. As shown in FIGS. 24 and 25, the thickness of the susceptor changes with a period of about 90 degrees.

  In the (100) substrate (notch orientation 0 °) which is a semiconductor wafer, the growth rate of the epitaxial layer at the peripheral portion gradually decreases as it goes from 0 ° to 45 °. When the wafer was loaded on the susceptor, the susceptor was processed so that the thickness of the portion located in the 45 ° direction of the wafer was the thickest, and epitaxial growth was performed. As can be seen from FIG. 26, the variation in film thickness due to crystal orientation is considerably reduced. When the film thickness distribution at 1 mm from the outer periphery was evaluated by the above (Equation 1), Δt was improved from 2.01% to 1.10%.

  Moreover, the flatness of the manufactured epitaxial wafer can be improved by combining with the unevenness | corrugation of the epitaxial layer formation surface of the semiconductor wafer used as a board | substrate.

  FIG. 27 shows the angular periodic film thickness distribution as a function of the angle in FIG. 3A when epitaxial formation is performed using a silicon wafer substrate having an upper surface of (110) using a normal susceptor and a special susceptor. The special susceptor is prepared so as to reduce the variation in the angular periodic film thickness distribution by the method described above. As can be seen from this figure, when a normal susceptor is used, the angular periodic film thickness distribution changes with a period of about 180 degrees, but this is not necessarily the case with a special susceptor.

  FIGS. 28A and 28B are plots of the autocorrelation function based on the film thickness distribution as a function of angle when the normal susceptor and the special susceptor of FIG. 27 are used, respectively, in the same manner as FIGS. 4C and 4D. is there. The normal susceptor clearly shows a periodicity of 180 degrees, but the special susceptor shows a slight maximum of every 90 degrees, but the periodicity cannot be clearly confirmed. Also, the rate of change of the autocorrelation function is considerably smaller in the special susceptor than in the normal susceptor.

  Here, the relationship between the silicon wafer substrate and the special susceptor will be described with reference to FIG. FIG. 29A shows the silicon wafer substrate placed on the special susceptor in the 0 degree direction shown in FIG. FIG. 29B shows a silicon wafer substrate placed on the special susceptor in the 90-degree direction shown in FIG. As shown in FIGS. 29A and 29B, the gap is larger in the 90 degree direction (or 270 degree direction), thereby increasing the epitaxial formation speed in the 90 degree direction (or 270 degree direction). I understand that.

  FIG. 30 shows an average epitaxial layer thickness ratio obtained by 45-degree folding obtained in the same manner as in FIG. 4E. From this figure, it can be seen that when the special susceptor is used, the variation in the angular periodic film thickness distribution is reduced. In addition, the angular periodicity was not observed, and this decrease in variation represents that the difference in the epitaxial formation rate based on the crystal orientation could be offset by the special susceptor.

  As described above, even if the crystal plane of epitaxial formation of the silicon wafer substrate is (110), if a special susceptor is used, the variation in the angular periodic film thickness distribution is reduced, and the difference in the epitaxial formation rate based on the crystal orientation Is offset by the special susceptor. From the above, it can be seen that the film thickness can be flattened by the special susceptor regardless of the crystal plane of epitaxial formation of the silicon wafer substrate.

Example 4
FIG. 31 is a schematic view showing the right end portion of the susceptor 4 in FIG. 1 in an enlarged manner and a graph of the film thickness distribution of the epitaxial layer formed by this apparatus. The susceptor 4 has a pocket width of 302 mm. The ledge length L of the ledge portion 33 having the tapered surface 31 is 6.0 mm. The space 13a defined by the outer peripheral surface of the semiconductor wafer 12, the tapered surface 31, and the inner peripheral surface of the pocket 13 has a width of about 1 mm. The film thickness of the epitaxial layer formed by such an apparatus becomes minimum at P of about 145 mm from the center of the wafer 12, and the film thickness rapidly increases from there. At this time, the film thickness distribution of the outer peripheral epitaxial layer in the device use region was 0.90%. Here, the vertical axis of FIG. 3 shows the change from the average value of the epitaxial layer thickness as a relative value to the target thickness of the epitaxial layer. Hereinafter, the same applies to the vertical axis of the same graph.

(Example 5)
FIG. 32 is basically the same as FIG. 31 except that a ledge length L of a ledge portion 33 having a tapered surface 31 is set to 3.0 mm. Similarly, the space 13 a defined by the outer peripheral surface of the semiconductor wafer 12, the tapered surface 31, and the inner peripheral surface of the pocket 13 has a width of about 1 mm. When an epitaxial layer of several microns is formed with such an apparatus, the thickness of the formed epitaxial layer becomes a minimum with a Q of about 148 mm from the center of the wafer 12, and the film thickness suddenly increases from there. Rose.

  If the use area of the prepared epitaxial wafer is, for example, an area 2 mm or more from the outer periphery of the wafer (that is, edge exclusion 2 mm), the film thickness of the epitaxial layer at the boundary of Example 2 is Minimal. That is, if the length L of the ledge portion 33 is set to 3.0 mm, the point Q at which the film thickness is minimum does not enter the device use area. At this time, the film thickness distribution of the outer peripheral epitaxial layer in the device use region was improved from 0.90% in Example 4 to 0.53% in Example 5.

(Example 6)
FIG. 33 shows a case where the ledge length L of the ledge portion 33 is 4.0 mm in the susceptor 4 having a pocket width of 302 mm. The same manufacturing conditions as in the above example were used, and an epitaxial layer of several microns was formed using this susceptor 4 to obtain an epitaxial layer thickness distribution as shown in FIG. It was. The minimum film thickness was 147 mm from the center (3 mm from the end). At this time, the thickness of the semiconductor wafer 12 serving as the substrate was as shown in FIG. This wafer had a maximum surface height of about 147 mm from the center (3 mm from the end). The thickness distribution of the epitaxial wafer, which is a combination of such a substrate and a film, is as shown in FIG. As can be seen from this figure, such a combination results in high flatness of the resulting epitaxial wafer.

  As described above, the thickness of the formed epitaxial layer can be changed by changing the length of the ledge portion. In particular, it is possible to control the position where the increase in the thickness of the epitaxial layer near the outer periphery of the epitaxial wafer starts and the degree of the increase. Furthermore, since the ledge length can be freely changed within a range satisfying the function of holding the semiconductor wafer in the ledge portion, it can be easily controlled. Furthermore, if the ledge length suitable for the substrate shape is selected, the flatness in the device use region can be kept high up to the vicinity of the periphery.

  Moreover, the flatness of the manufactured epitaxial wafer can be improved by combining with the unevenness | corrugation of the epitaxial layer formation surface of the semiconductor wafer used as a board | substrate. Further, the difference in the epitaxial formation speed due to the difference in crystal orientation can be offset by utilizing the difference in the epitaxial formation film thickness due to the difference in the length of the ledge portion. Further, by combining these techniques, an epitaxial silicon wafer having a high flatness can be provided.

  As mentioned above, although the embodiment of the invention made by the present inventor has been described, the present invention is not limited to such an embodiment, and it goes without saying that various modifications are possible without departing from the scope of the present invention. Nor.

It is a longitudinal cross-sectional view which shows the outline of a susceptor. It is a longitudinal cross-sectional view which shows the outline of the epitaxial wafer manufacturing apparatus of this application. It is a top view of a semiconductor wafer. It is a figure which shows the crystal orientation of a semiconductor wafer. It is the figure which expanded and plotted the film thickness of the epitaxial wafer by the angle. It is the figure which expanded and plotted the film thickness of another epitaxial wafer by an angle. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of the epitaxial wafer with few disturbance factors of an angle dependence by the angle. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of the epitaxial wafer with a large disturbance factor of an angle dependence by the angle. It is a figure which shows the average value of the film thickness distribution obtained by 45 degree | times folding method. It is the figure which plotted the dispersion | distribution of the film thickness distribution of the epitaxial wafer grown by changing temperature with respect to the density | concentration of a trichlorosilane. It is the figure which plotted the contour line regarding the variation in the film thickness distribution of the epitaxial wafer grown by changing temperature with respect to epitaxial temperature and trichlorosilane concentration. It is a partial expanded sectional view of the place where the counterbore depth of a susceptor is deep. It is a partial expanded sectional view of a place where the counterbore depth of a susceptor is shallow. It is a partial expanded sectional view of a place where the pocket width of a susceptor is narrow. It is a partial expanded sectional view of the place where the pocket width of a susceptor is wide. It is a partial expanded sectional view in the place where the thickness of a susceptor is small. It is a partial expanded sectional view in the place where the thickness of a susceptor is large. It is a partial expanded sectional view in the place where the diameter of a susceptor is small. It is a partial expanded sectional view of a place where the diameter of a susceptor is large. It is a partial expanded sectional view in the place where the counterbore depth of the susceptor of Example 1 is deep. It is a partial expanded sectional view of a place where the counterbore depth of the susceptor of Example 1 is shallow. FIG. 3 is a top view of the susceptor according to the first embodiment. It is the figure which developed the counterbore depth of the susceptor of Example 1. 2 is a developed view of the film thickness distribution of Example 1. FIG. It is a partial expanded sectional view in the place where the pocket width of the susceptor of Example 2 is narrow. It is a partial expanded sectional view of the place where the pocket width of the susceptor of Example 2 is wide. 6 is a top view of a susceptor holding a semiconductor wafer of Example 2. FIG. It is the figure which plotted the dispersion | variation in the film thickness distribution of epitaxial wafer formation performed by changing temperature and the density | concentration of a trichlorosilane with respect to the pocket width of a susceptor. It is the figure which expanded the film thickness distribution of Example 2. FIG. It is a figure which contrasts the dispersion | variation in the film thickness distribution of the epitaxial wafer formation by an improvement process and a normal process. It is the figure which expanded and plotted the film thickness of the epitaxial wafer formation performed with the density | concentration of 2.3% trichlorosilane at high temperature using the normal susceptor and the special susceptor. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of FIG. 21C using a normal susceptor by an angle. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of FIG. 21C using a special susceptor by an angle. It is a figure which shows the average value of the film thickness distribution obtained by 45 degree | times folding method. It is a figure which shows the average value of the film thickness distribution obtained by the 45 degree | times folding method of another epitaxial wafer. It is a partial expanded sectional view in the place where the thickness of the susceptor of Example 3 is small. It is a partial expanded sectional view in the place where the thickness of the susceptor of Example 3 is large. It is a bottom view of the susceptor of Example 3. It is the figure which expanded and showed the thickness of the susceptor of Example 3. FIG. It is the figure which expanded the film thickness distribution of Example 3. FIG. It is the figure which expanded and plotted the film thickness formed on the (110) epitaxial silicon wafer substrate using the normal susceptor and the special susceptor. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of FIG. 27 using the normal susceptor by the angle. It is the figure which plotted the autocorrelation function regarding the film thickness distribution of FIG. 27 using the special susceptor by the angle. It is a figure which shows the shape of a special susceptor. It is a figure which shows the average value of the film thickness distribution shown in FIG. 27 obtained by 45 degree | times folding method. It is the longitudinal cross-sectional view which shows the outline of the susceptor of Example 4, and the figure which shows the film thickness distribution of the epitaxial layer using the same. It is the longitudinal cross-sectional view which shows the outline of the susceptor of Example 5, and the figure which shows the film thickness distribution of the epitaxial layer using the same. It is a figure which shows the height distribution of the surface of the semiconductor wafer used as the board | substrate of Example 6, the film thickness distribution of an epitaxial layer, and the thickness distribution of the obtained epitaxial wafer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Epitaxial wafer manufacturing apparatus 4 Susceptor 8, 9 Heat source 12 Semiconductor wafer 13 Pocket 13a Gap 13b Inner peripheral surface 31 Tapered surface 32, 32 'Shelves 51, 52, 53 Upper surface F1, F2, F3, F4 gas near opening of susceptor Flow

Claims (15)

An epitaxial wafer manufacturing apparatus for causing an epitaxial growth on a predetermined surface of a semiconductor wafer by reacting a semiconductor wafer with a source gas in a reaction furnace,
A pocket having an opening in which the semiconductor wafer is disposed, and including a susceptor for fixing the semiconductor wafer;
2. The epitaxial wafer manufacturing apparatus according to claim 1, wherein the structure and / or shape of the susceptor is periodically changed in accordance with a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening . The susceptor is periodically structured and / or shaped by changing the partial heat capacity of the susceptor, the counterbore depth of the pocket, or the width of the pocket with a period of 90 degrees, 180 degrees, or 270 degrees. The apparatus for manufacturing an epitaxial wafer according to claim 1, wherein: The epitaxial wafer manufacturing apparatus according to claim 1 , wherein the susceptor includes a ledge portion on which the semiconductor wafer is placed, and a length of the ledge portion is 2 mm or more and 6 mm or less . In the case where the thickness or diameter of the susceptor is varied, 45 degrees of the susceptor, either 135 degrees, 225 degrees, claims 1 to 3, characterized in that increasing the thickness or diameter of the wall thickness at the position of 315 degrees An apparatus for manufacturing an epitaxial wafer according to claim 1. When the counterbore depth of the susceptor is varied, 45 degrees of the susceptor, 135 degrees, 225 degrees, according to 3 claim 1, characterized in that the shallow counterbore depth at the position of 315 degrees Epitaxial wafer manufacturing equipment. In the case of changing the width of the pocket of the susceptor, 45 degrees of the susceptor, 135 degrees, 225 degrees, the 3 claim 1, characterized in that the width of the pocket at the position of 315 degrees The manufacturing apparatus of the described epitaxial wafer. And fixing the semiconductor Kwai Ha on the susceptor in the reactor, in the method for manufacturing an epitaxial wafer for growing the epitaxial to a predetermined surface of the semiconductor wafer by reaction with Sosuga scan,
The semiconductor wafer is disposed from the opening of the susceptor pocket,
Fixing the semiconductor wafer on the susceptor whose structure and / or shape changes periodically according to a change in crystal orientation of the semiconductor wafer in the vicinity of the inner peripheral surface of the opening of the susceptor ;
A method of manufacturing an epitaxial wafer, wherein an epitaxial layer is formed while rotating the susceptor together with the semiconductor wafer. In the step of fixing the semiconductor wafer, the partial heat capacity of the susceptor, the counterbore depth of the pocket, or the width of the pocket is periodically changed by a period of 90 degrees, 180 degrees, or 270 degrees. 8. The method of manufacturing an epitaxial wafer according to claim 7, wherein the semiconductor wafer is fixed on a susceptor whose structure and / or shape changes. 8. The step of fixing the conductive wafer, wherein the susceptor includes a ledge portion having a length of 2 mm to 6 mm, and the semiconductor wafer is placed and fixed on the ledge portion. Epitaxial wafer manufacturing method. The epitaxial wafer manufacturing method according to claim 7 , wherein the epitaxial layer is formed at a temperature of 1120 ° C. or higher. The method for producing an epitaxial wafer according to claim 10 , wherein the epitaxial layer is formed while being controlled to a predetermined raw material concentration or less. The method for producing an epitaxial wafer according to claim 7, wherein the semiconductor wafer is a silicon wafer, and the predetermined surface is a (110) surface or a (100) surface . In the step of placing the semiconductor wafer from the opening of the pocket of the susceptor, combining the unevenness in the vicinity of the outer periphery of the epitaxial layer forming surface of the semiconductor wafer to be the substrate and the film thickness distribution of the formed epitaxial layer, The method for producing an epitaxial wafer according to claim 9, wherein the semiconductor wafer is arranged such that the flatness of the epitaxial wafer produced by the flatness of the semiconductor wafer to be a substrate is improved. In the step of fixing the conductor wafer, a ledge portion having a length of the ledge portion such that a point where the film thickness of an epitaxial layer formed in the vicinity of the periphery of the conductor wafer is minimum is outside the use region is provided. The method for producing an epitaxial wafer according to claim 9, comprising: In the reaction furnace, the semiconductor wafer fixed to a susceptor provided with a ledge for the pockets and placed accept a semiconductor wafer, an epitaxial wafer is grown an epitaxial a predetermined surface of the semiconductor wafer by reaction with a source gas A method for determining manufacturing conditions comprising:
Epitaxial wafers are manufactured under the predetermined initial manufacturing conditions in the reactor ,
Measure the flatness in the circumferential direction at the peripheral edge of the obtained initial condition epitaxial wafer,
The epitaxial wafer periphery of flatness Influence the thickness or diameter of the susceptor, the counterbore depth of the pocket, or calculated for the width of said pocket,
The thickness or diameter of the susceptor included in the structure and / or shape of the susceptor, the counterbore depth of the pocket, or the pocket depending on the measured flatness result of the peripheral edge of the epitaxial wafer. in the vicinity of the width of the inner peripheral surface of the opening portion of the susceptor, manufacturing said that determine as periodically changes according to the change in the crystal orientation of the semiconductor wafer, to improve the flatness of the peripheral portion of the semiconductor wafer How to determine the condition.

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