JP4845914B2 - Electronic equipment cooling structure - Google Patents

Description

  The present invention relates to a cooling structure for an electronic device that effectively cools a heat generating component mounted on a substrate housed in a housing.

  Conventionally, a heat generating element such as a transistor is fixed to a printed circuit board by soldering, and the heat generating element is attached in close contact with a heat radiating plate to dissipate heat. And this heat sink is accommodated in the housing | casing which provided the vent hole by screwing etc., and is thermally radiated in the air (refer patent document 1).

Moreover, in order to raise the efficiency of a heat sink, the prior art which enlarged the heat sink and raised the heat dissipation action is known (refer patent document 2).
According to this prior art, as shown in FIG. 6, the heating element 100 such as a transistor is fixed to the printed circuit board 101 by soldering. A printed circuit board 102 is disposed in parallel on the printed circuit board 101, and a support plate 103 is disposed between the printed circuit boards 101 and 102 and supported by a mounting rod 104. A U-shaped heat radiating plate 105 is attached between the printed board 101 and the support plate 103 via screws 106 and 107. The heat generating element 100 is attached to the heat radiating plate 105 via screws 109 with an insulator 108 interposed therebetween. A cushion material 110 is disposed and fastened between the printed board 101 and the heat sink 105 (see Patent Document 1).

Thus, since the support plate 103 is connected to the heat radiating plate 105 to provide a heat radiating action, it is not necessary to provide a large heat radiating plate on the printed circuit board, and a wide area radiator can be configured.
JP 2001-67930 A Reality 4-19836

  However, according to the above prior art, a large amount of screws 106 and 107 for stopping the heat sink 105 and a support plate 103 in addition to the heat sink 105 are required, resulting in an increase in the number of parts and an increase in work processes. It was.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device cooling structure that can solve the above-described problems and can reduce the number of components and simplify the work process.

In order to solve the above problems, the present invention provides a cooling structure for an electronic device in which a substrate on which a heat generating component is mounted and a heat radiating body for radiating heat generated by the heat generating component are housed in a housing. Opposing support surfaces are provided in the housing with the heat generating component and the heat sink interposed therebetween, and the heat sink is supported between the substrate and the support surface, and between the base portion of the heat radiator and the heat generating component. A heat transfer material that is elastically deformable and is thicker than a spatial distance between the heat generating component and the base portion of the radiator, and at least a pair of legs are provided at both ends of the base of the radiator. Extending in a direction perpendicular to the base, and an engagement portion that engages with the tip of the leg is provided on the substrate, a step is provided at the tip of the leg, and the tip of the step is provided on the engagement portion. Engage with and position the radiator, opposite to the legs A support arm that extends to the base of the heat dissipator, an engagement portion that engages with a tip of the support arm is formed on the support surface, and a support substrate that faces the substrate is formed in the housing. The support surface is formed on the support substrate .
In the present invention, a support portion for supporting the support substrate at a set position is provided on the inner wall surface of the housing.
Further, according to the present invention, a guide portion that guides the substrate to a set position of the support portion is provided on the inner wall of the housing.

The present invention has the following effects.
According to the first aspect of the present invention, in a cooling structure for an electronic device in which a substrate on which a heat generating component is mounted and a radiator for dissipating heat generated by the heat generating component are housed in a housing, Opposing support surfaces are provided in the housing with the heat generating component and the heat sink interposed therebetween, and the heat sink is supported between the substrate and the support surface, and between the base portion of the heat radiator and the heat generating component. A heat transfer material that is elastically deformable and is thicker than a spatial distance between the heat generating component and the base portion of the radiator, and at least a pair of legs are provided at both ends of the base of the radiator. Extending in a direction perpendicular to the base, and an engagement portion that engages with the tip of the leg is provided on the substrate, a step is provided at the tip of the leg, and the tip of the step is provided on the engagement portion. To position the heat dissipating member in the direction opposite to the leg The extended support arm is provided on the base portion of the heat dissipating body, the engaging portion with which the tip of the support arm engages is formed on the support surface, and the support substrate facing the substrate is provided in the housing. Since the support surface is formed on the support substrate, it is configured with a small number of parts and can be miniaturized, and the adhesion between the heat generating component and the heat transfer material, or between the heat transfer material and the base of the radiator is increased, Excellent cooling effect is obtained. Further , at least a pair of leg portions are extended at both ends of the base portion of the heat dissipating member in a direction orthogonal to the base portion of the heat dissipating member, and an engagement hole is provided in the substrate to engage the tip end portion of the leg portion. Therefore, the positioning of the substrate and the heat radiating body is simple, and the effect that the assembling work becomes easy can be obtained. Furthermore, since the step portion is provided at the tip of the leg portion, and the tip of the step portion is engaged with the engagement hole to position the heat radiator, the amount of elastic deformation of the heat transfer material can be made constant. Heat dissipation effect. Furthermore, since the support arm extending in the direction opposite to the leg portion is provided in the base portion of the heat dissipating body, and the engagement hole for engaging the tip end portion of the support arm is formed in the support surface, the heat dissipating member is mounted on the substrate. And the support surfaces can be supported with each other, so that a screw can be omitted for fixing the heat-generating component and the radiator. By omitting the screws, the number of parts can be reduced, and costs can be reduced and space can be saved. In addition, since the support substrate facing the substrate is provided in the housing and the support surface is formed on the support substrate, the heat radiator can be supported between the support surfaces of the substrate and the support substrate. And screws can be omitted to fix the radiator. By omitting the screws, the number of parts can be reduced, and costs can be reduced and space can be saved.
In addition, since the support portion for supporting the support substrate at the set position is provided on the inner wall surface of the housing, the work of inserting the support substrate into the housing is facilitated, so that the assembling work is facilitated. It is done.
Furthermore, since the guide portion for guiding the substrate to the set position of the support portion is provided on the inner wall of the housing, the work of inserting the support substrate into the housing is facilitated, so that the assembly work is facilitated. Is obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 is a cross-sectional view showing a cooling structure of an electronic device according to an embodiment of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is an exploded perspective view of FIG.

  In FIG. 1 to FIG. 3, reference numeral 1 denotes a housing for storing an electronic device. The housing 1 includes a housing body 2 having an opening 2 a on one side and a vent 2 b on the other side, and the housing body 2. It is comprised with the cover body 3 which block | closes the opening 2a. The casing 1 includes a substrate 5 such as a printed circuit board on which a heating element 4 such as a transistor serving as a heating component is mounted, and a heat transfer material having elasticity and insulation placed on the heating element 4. 6, a heat dissipating body 7 disposed on the heat transfer material 6, and a support substrate 9 that is disposed to face the substrate 5 and has a support surface 8 that supports the heat dissipating body 7. As the support substrate 9, a transistor or other electronic component may be attached using a printed circuit board similar to the substrate 5.

  The casing 1 is provided with a pair of concave and convex portions 20, 21, 30, and 31 in the vertical direction on the inner surface of the casing body 2 and the back surface of the lid body 3 facing each other, at positions corresponding to each other in the vertical direction. ing. The pair of concavo-convex portions 20, 21, 30, 31 may be formed so as to be continuous in the width direction on the inner surface of the housing body 2 and the back surface of the lid body 3, or may be provided intermittently in the width direction. Also good. The pair of concave and convex portions 20, 21, 30, 31 provided in the vertical direction are provided on the inner surface of the housing body 2 and the back surface of the lid 3, and the concave portions 20 a, 21 a, 30 a, 31 a Is formed.

  The substrate 5 on which the heat generating element 4 is mounted and the support substrate 9 having the support surface 8 are assembled in the casing 1 with both ends inserted into the recesses 20a, 21a, 30a, 31a. The substrate 5 is inserted into the recesses 20a and 30a on the lower side with the heating element 4 facing up, and the support substrate 9 is inserted into the recesses 21a and 31a on the upper side and assembled in the housing 1. Yes.

  The substrate 5 on which the heating element 4 is mounted and the support substrate 9 having the support surface 8 have engagement holes 5a and 9a formed at positions corresponding to each other on the plate surface, and correspond to each other on one side. Notches 5b and 9b are formed at the positions. The radiator 7 is mounted between the substrate 5 and the support substrate 9 through the engagement holes 5a and 9a and the notches 5b and 9b.

  The heat radiating body 7 is composed of a flat base portion 70 and a plurality of heat radiating plates 71 erected from the base portion 70 at regular intervals. A pair of leg portions 72 are extended. A protrusion 72 a is provided at the tip of the leg 72 to form a stepped portion 72 b, and the distance L between the stepped portion 72 b and the base 70 is kept constant. On the other hand, a pair of support arms 73 extending upward are provided at the upper end of the central heat radiating plate 71, and a protrusion 73a is provided at the tip of the support arm 73 to form a stepped portion 73b. The distance M between the stepped portion 73b and the upper end of the heat sink 71 is kept constant.

  The heat transfer material 6 provided between the heat generating element 4 and the base part 70 of the radiator 7 is formed thicker than the distance L between the stepped part 72b of the leg part 72 and the base part 70, and The base part 70 of the radiator 7 and the heat generating element 4 are compressed and brought into close contact with each other.

  Next, the assembly procedure of the cooling structure of the electronic device will be described. The heat transfer material 6 is arranged on the substrate 5 on which the heat generating element 4 is mounted, and the heat radiating body 7 is assembled on the heat transfer material 6. The radiator 7 inserts one of the protrusions 72a at the tip of the leg 72 into the engagement hole 5a, and engages the other of the protrusions 72a with the notch 5b. In this way, the heat transfer material 6 is compressed and brought into close contact between the heating element 4 and the base portion 70 of the radiator 7. Further, the protrusion 73a at the tip of the support arm 73 is inserted into the engagement hole 9a of the support substrate 9 and engaged with the notch 9b. Then, the substrate 5 and the support substrate 9 are assembled in the recesses 20a and 21a provided on the inner surface of the housing body 2, and the lid 3 is mounted while the recesses 30a and 31a are aligned with the ends of the substrate 5 and the support substrate 9. Assembling is completed by attaching to the body 2.

According to this embodiment, since the heat transfer material 6 is compressed and the base portion 70 of the heat generating element 4 and the heat radiating body 7 is assembled, the heat transfer material 6 and the heat generating element 4, the heat transfer material 6 and the base of the heat radiating body 7 are assembled. Since the portion 70 can be attached in close contact, the heat generated from the heat generating element 4 is effectively transmitted to the heat radiating body 7 through the heat transfer material 6 and can be efficiently radiated through the heat radiating body 7.
Since a pair of concave and convex portions 20, 21, 30, and 31 are provided in the vertical direction on the inner surface of the housing body 2 and the back surface of the lid body 3 at the positions corresponding to each other in the vertical direction, the concave and convex portions 20, 21, and 30 are provided. , 31 form recesses 20a, 21a, 30a, 31a on the inner surface of the housing body 2 and the back surface of the lid 3 in the width direction of the housing 1, so that the substrate 5 on which the heating element 4 is mounted and The support substrate 9 having the support surface 8 can be arranged in parallel at regular intervals. Since the radiator 7 can be supported between the substrate 5 and the support substrate 9 having the support surface 8 without using screws or the like, the number of parts can be reduced and the assembly work can be easily performed. The radiator 7 is inserted into the substrate 5 by inserting one of the protrusions 72 a at the tip of the leg 72 into the engagement hole 5 a of the substrate 5 and engaging the other of the protrusions 72 a with the notch 5 b of the substrate 5. Since it is assembled, positioning with respect to the substrate 5 is performed, and the distance between the base portion 70 of the radiator 7 and the substrate 5 can be kept constant. Accordingly, the heat transfer material 6 is elastically deformed between the base portion 70 of the heat radiating body 7 and the heat generating element 4 and is compressed to a certain thickness so as to be in close contact with the base portion 70 of the heat radiating body 7 and the heat generating element 4. Therefore, heat can be efficiently radiated through the radiator 7.

4 and 5 show another embodiment of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description of the same parts is omitted.
In the embodiment of FIG. 4, a guide member 10 that guides the substrate 5 and the support substrate 9 is provided on the inner surface of the housing body 2. These guide members 10 are formed in a U-shape having an upper piece 10a and a lower piece 10b, and the upper and lower inner surfaces of the upper piece 10a and the lower piece 10b are formed into a taper 11 that gradually narrows in the depth direction. It is. These guide members 10 can be provided at positions corresponding to the concavo-convex portions 20, 21, for example, above and below the left and right sides of the inner surface of the housing body 2. The length of the upper piece 10a and the lower piece 10b of the guide member 10 can be arbitrarily set as required. In the example of FIG. 4, the cover 3 is formed to extend to the positions of the uneven portions 30 and 31. Thus, when the substrate 5 and the support substrate 9 are assembled, the substrate 5 and the support substrate 9 can be inserted along the upper piece 10a and the lower piece 10b of the guide member 10, so that the assembly operation is easy. The work efficiency can be improved.

In the case of the embodiment of FIG. 5, the support substrate 9 is eliminated and the upper end of the radiator 7 is directly supported on the inner surface of the housing body 2. In this case, the inner surface of the housing body 2 is used as the support surface 8 of the support substrate 9.
Thereby, the support substrate 9 can be abolished and the number of parts can be further reduced. Since the concave and convex portions 21 and 31 for the support substrate 9 provided on the inner surface of the housing body 2 and the back surface of the lid body 3 can be eliminated, the mold structure can be simplified when the housing body 2 and the lid body 3 are molded.

Since the present invention does not require the use of screws for fixing the heat generating element 4 and the radiator 7 as described in the above embodiment, the following effects can be obtained.
Space-saving is possible without fixing with screws.
Since no screws or other parts are required for fixing the radiator 7, the substrate 5, the support substrate 9 and the housing 1 as heat dissipation parts, the number of heat dissipation parts and structural parts can be reduced. Down is possible.
Conventionally, a structure that does not use screws for fixing the heat-dissipating parts, the substrate 5, the support substrate 9, and the housing 1 that do not require measures for fixing with an adhesive or locking with a washer, which was necessary when screws were used for fixing. Therefore, since screws and other parts are not required for fixing the heat dissipating parts, the substrate 5, the supporting substrate 9, and the housing 1 that do not cause malfunction of the device due to loosening of screws due to secular change, the screws and structures that have been conventionally required Since it is not necessary to secure an electrical insulation distance between the component and the electronic component, a heat dissipating component that enables effective use of the board 5 area, and no screws or other parts are required for fixing the substrate 5 and the housing 1. The space-saving design in the apparatus is possible, and the entire apparatus can be downsized.
Since screws and other parts are not required for fixing the heat dissipating component, the substrate 5, the support substrate 9, and the housing 1, the number of components is small, and the number of assembly steps can be reduced and the time can be shortened.
Since screws and other parts are not required for fixing the heat dissipating parts, the substrate 5 and the support substrate 9 and the housing 1, it is possible to efficiently disassemble without using tools for disassembling the device, and the product is highly recyclable. Design becomes possible.

  In addition, the present invention is not limited to the above-described embodiment. For example, the heat radiator 7 has one of the protrusions 72a at the tip of the leg 72 inserted into the engagement hole 5a and the protrusion 72a. The other of the two is engaged with the notch portion 5b and assembled to the substrate 5. However, the number of the leg portions 72 is not limited to two but can be three or more. Further, the shape of the leg portion 72 is not limited to a cylindrical shape, and may be a prismatic shape or a wall shape having a constant thickness. Further, the number of protrusions 72a is not limited to two, and may be three or more. Various shapes can be employed as long as the stepped portion 72b is formed by the protruding portion 72a. Furthermore, when the support substrate 9 that supports the other end of the heat radiating body 7 is omitted, a recess for engaging the protrusion 73 a may be formed on the inner surface of the housing body 2, or the housing body 2. A protrusion may be formed on the inner surface of the support arm 73 to form a recess in the support arm 73. In addition, it goes without saying that the present invention can be appropriately modified and implemented within the scope not changing the gist of the present invention.

It is sectional drawing which shows the cooling structure of the electronic device by embodiment of this invention. It is the elements on larger scale of FIG. It is a disassembled perspective view which shows the cooling structure of the electronic device by embodiment of this invention. It is sectional drawing which shows the cooling structure of the electronic device by other embodiment of this invention. It is sectional drawing which shows the cooling structure of the electronic device by other embodiment of this invention. It is sectional drawing which shows the cooling structure of the conventional electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Housing | casing which accommodates an electronic device 2 Housing | casing main body 3 Cover body 4 Heating element 5 Board | substrate 6 Heat transfer material 7 Heat radiating body 8 Support surface 9 Support substrate 10 Guide member 20, 21, 30, 31 Uneven part 70 Base part 71 Heat radiation Plate 72 Leg part 73 Support arm 5a, 9a Engagement hole 5b, 9b Notch part 20a, 21a, 30a, 31a Recessed part 72a, 73a Projection part 72b, 73b Step part

Claims (3)

In a cooling structure of an electronic device in which a substrate on which a heat generating component is mounted and a heat radiator for dissipating heat generated by the heat generating component are housed in a housing,
A support surface facing the substrate is provided in the housing with the heat generating component and the heat sink interposed therebetween, and the heat sink is supported between the substrate and the support surface, and a base portion of the heat radiator and the heat generating component are provided. In between, the elastically deformable heat transfer material that is thicker than the spatial distance between the heat generating component and the base of the radiator is compressed and sandwiched,
Extending at least a pair of leg portions at both ends of the base of the heat dissipating member in a direction perpendicular to the base portion of the heat dissipating member, and providing an engagement portion with which the front end of the leg engages the substrate;
A step portion is provided at the tip of the leg portion, the tip of the step portion is engaged with the engagement portion, and the radiator is positioned.
A support arm extending in a direction opposite to the leg portion is provided on the base portion of the heat dissipating body, and an engagement portion that engages with a tip portion of the support arm is formed on the support surface.
A cooling structure for an electronic device , wherein a support substrate facing the substrate is provided in the housing, and the support surface is formed on the support substrate . Cooling structure for an electronic apparatus according to claim 1, wherein the inner wall surface of the housing, characterized in that a support portion for supporting the substrate at a set position. The cooling structure for an electronic device according to claim 2 , wherein a guide portion that guides the substrate to a set position of the support portion is provided on an inner wall of the housing.

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