JP4803071B2 - Circuit board and circuit board with electronic components - Google Patents

Description

  The present invention relates to a circuit board on which lands formed on a substrate and leads formed on an electronic component are soldered by a jet-type soldering method and a circuit board with an electronic component.

  As the circuit board described above, there is a configuration in which an electronic component is surface-mounted on a part of the substrate, and another electronic component, for example, a connector is mounted by soldering in the vicinity of the surface-mounted component. In this soldering, a lead provided in the connector is inserted into a through hole provided in a through state in the board, and a portion protruding from the board of the lead and a land provided around the through hole are connected by solder. To be done. In this soldering, a jet-type soldering method capable of soldering in a state in which the solder is prevented from adhering to a surface-mounted component already mounted is used (see, for example, Patent Document 1).

In the jet soldering method, the molten solder 101 is ejected from the upward nozzle 100 as shown in FIGS. 10 and 11, and the solder 101 is attached to the lands of the circuit board 102 arranged above the nozzle 100. A basic method is adopted in which the solder is refluxed to the solder bath 103 through the outside of the nozzle 100. In the case of this method, the opening cross section of the nozzle 100 is formed to have a size corresponding to the mounting surface. Can be soldered together. Further, by using a plurality of nozzles 100, soldering can be performed even on a plurality of mounting surfaces. In Patent Document 1, instead of the nozzle 100, nozzles 110 and 111 having gaps 110a and 111a as shown in FIGS. It has been proposed to perform soldering in a state in which the solder is prevented from adhering.
JP 2002-368404 A

  By the way, in the case of the above jet type soldering method, the board portion to be soldered by the nozzle receives heat from the molten solder, and the heat is transmitted to the peripheral portion, so that it has already been mounted around the connector. It is necessary to prevent the solder portion of the surface mount component from melting. Therefore, by keeping the distance between the soldered portion and the surface-mounted component at an appropriate length, heat that melts the solder portion of the surface-mounted component is prevented from being transmitted.

  However, the portion corresponding to the distance is a so-called dead space in which surface-mounted components cannot be arranged. Therefore, it is preferable that the portion is narrow in order to improve the mounting density, and there is room for improvement here.

  The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a circuit board and a circuit board with electronic components that can narrow the dead space.

The circuit board of the present invention according to claim 1 is a circuit board on which an electronic component having a plurality of leads arranged in a plurality of rows is mounted, and has a mounting portion on which the electronic component is mounted. A circuit board body having a plurality of through holes provided in a plurality of rows corresponding to the arrangement of the leads in the mounting portion, and provided corresponding to each through hole of the circuit board body, and inserted into each through hole. A plurality of lands soldered to the leads, and a plurality of wiring patterns formed on the circuit board main body so as to be connected to the lands. The through hole of the circuit board main body includes the through hole each for each row are arranged at different distances from the edge of the circuit board main body, wherein the plurality of wiring patterns, the wiring patterns formed between the periphery of the circuit board body and the mounting portion of the who is, The peripheral edge of the circuit board main body of the serial mounting portion formed on so that Do large heat capacity and wider than the wiring patterns formed on the opposite side, a large wiring pattern of the heat capacity, the circuit board A wiring pattern that is connected to a land provided in a row closest to the peripheral edge of the main body and is formed on the side opposite to the peripheral side of the circuit board main body of the mounting portion has a narrow width and a small heat capacity. It is connected to lands provided in rows farther from the periphery of the circuit board body .

A circuit board according to a second aspect of the present invention is the circuit board according to the first aspect , wherein each of the lands is soldered to the corresponding lead by a jet soldering method.

The circuit board according to a third aspect of the present invention is the circuit board according to the first or second aspect , wherein the wiring pattern formed between the mounting portion and the peripheral edge of the circuit board main body is connected to a power source or a ground. It is a wiring pattern to be connected.

A circuit board with electronic components according to a fourth aspect of the present invention is the circuit board according to any one of the first to third aspects, wherein a narrow portion is formed on a land provided in a row closest to a peripheral edge of the circuit board main body. The thermal land which has is used, It is characterized by the above-mentioned.

A circuit board with electronic components according to a fifth aspect of the present invention includes the circuit board according to any one of the first to fourth aspects and a plurality of leads arranged in a plurality of rows, each lead being the circuit board. And an electronic component mounted on the mounting portion by connecting the lands provided on the circuit board and the respective leads.

A circuit board with electronic components according to a sixth aspect of the present invention is the circuit board with electronic components according to the fifth aspect, wherein the leads and the electronic circuit board are jet soldered from the side opposite to the electronic component mounting surface of the mounting portion. Soldering with a land is performed, and another electronic component mounted before the soldering is provided on the soldering side surface.

  In the case of the circuit board according to the present invention, the heat capacity of each wiring pattern formed between the mounting portion and the peripheral edge of the circuit board main body is each formed on the side opposite to the peripheral edge side of the circuit board main body of the mounting portion. Each wiring pattern is arranged so as to exceed the heat capacity of the wiring pattern. In other words, a wiring pattern having a large heat capacity is formed between the mounting portion and the periphery of the circuit board body, and a wiring pattern having a small heat capacity is formed on the side opposite to the periphery side of the circuit board body of the mounting portion. . As a result, the wiring pattern formed on the inner side (the far side from the periphery of the circuit board body) than the mounting part has a small heat capacity, that is, a narrow width, thereby reducing heat escaping inward from the mounting part. It is possible to narrow the dead space inside the mounting portion. Note that the outside of the mounting part of the circuit board main body is not mounted because it is easy to be dropped during transportation in the soldering process if electronic components are mounted here. There is little need for reduction.

Further, according to the present invention, when connecting the wiring pattern to the corresponding land, the frequency of detouring the wiring pattern can be reduced, and the wiring pattern can be simplified in shape.

According to the second aspect of the present invention, since the lands and the corresponding leads are soldered by the jet soldering method, all the lands and the leads can be soldered all at once.

According to the fourth aspect of the present invention, when a thermal land having a narrow width portion is provided for a wide wiring pattern having a large heat capacity, a decrease in soldering temperature can be prevented. In other words, when a normal land is used instead of a thermal land, the temperature rise is low in the vicinity of the wiring pattern having a large heat capacity, and there is a possibility that the temperature becomes unsuitable for soldering. By providing this, it is possible to reduce the heat escaped by the narrow width portion, so that the temperature rise can be improved and the soldering temperature can be prevented from lowering. Thereby, it becomes possible to perform soldering easily.

In the circuit board with electronic component according to claim 5 of the present invention, the use of the lead is determined based on the heat capacity of the corresponding wiring pattern from the connection state of the lead, the land, and the wiring pattern. The same effect as the circuit board can be obtained.

In the circuit board with an electronic component according to claim 6 , it is possible to provide a circuit board with an electronic component in which an electronic component to be mounted by a jet soldering method and an electronic component that makes the jet soldering method inappropriate are arranged. .

  The present invention will be specifically described below.

  First, the circuit board of the present invention and the soldering method used in the present invention will be briefly described with reference to FIGS. FIG. 1 is an exploded perspective view showing the circuit board main body 20, and FIG. 2 is a front view showing the circuit board 1 with electronic components.

This circuit board 1 with an electronic component has, for example, through-holes 6 and 16, lands 7 and 17, and a circuit board body 20 ′ configured by laminating four layers of boards 2, 3, 4, and 5, Land 7
, 17 and a circuit board 20 provided with a wiring pattern (not shown) electrically connected. The through holes 6 and 16 are formed in the electronic component mounting portions A and B of the circuit board main body 20 ′.
The lands 7 and 17 are formed on the upper surface or the lower surface of the substrates 2 to 5 and around the through holes 6 and 16. A wiring pattern (not shown) is formed in electrical connection with the lands 7 and 17. Note that the electronic component mounting portions A and B are disposed at positions separated from the peripheral edge 20a of the circuit board 20 by a predetermined distance d.

  Then, the lead 11 of the connector 10 is inserted into the through hole 6 from the upper surface (electronic component mounting surface) of the circuit board 20, and the lead 11 A of the connector 10 A is inserted into the through hole 16. The circuit board 1 with an electronic component of the present embodiment is manufactured by soldering the land 7, the part through which the lead 11 </ b> A penetrates, and the land 17 by a jet soldering method.

  The jet soldering method is a method in which molten solder is ejected from the upward nozzle 12 and the solder is attached to the lands 7 and 17 of the circuit board 20 disposed on the nozzle 12. As the nozzle 12, the nozzles 100, 110, 111 and the like are used. Further, reference numerals 13 and 13A in FIG. 2 denote connection terminals of the connector, which are provided corresponding to the leads 11 and 11A, and correspond to the through holes 6 and 16, respectively.

  Next, the circuit board 20 of the present invention will be described in more detail.

  FIG. 3 is a plan view showing a position where the connector 10 is arranged on the circuit board 20.

  Two electronic component mounting portions A and B are set on the circuit board 20 (specifically, the substrate 2) at a predetermined distance d from the peripheral edge 20a. Are provided with connectors 10 and 10A, respectively. The electronic component mounting part A on which the connector 10 is mounted has 10 through-holes 6 in total, each having 10 rows, and the electronic component mounting part B on which the connector 10A is mounted also has 10 rows. A total of 20 through holes 16 in two rows are formed. And among the through holes 6 of the electronic component mounting part A, the left end through hole 61 in the outer row close to the peripheral edge 20a and the right adjacent through hole 62 are used for applications using a large current such as GND, for example. The remaining 18 through-holes 6 are designed for use in applications that use a small current, such as a control signal. On the other hand, among the through holes 16 of the electronic component mounting portion B, one through hole 161 on the right side and three through holes 162, 163, and 164 on the right side of the through hole 16 located on the outer side close to the peripheral edge 20a are, for example, GND For example, the remaining 16 through holes 16 are designed to be used for an application using a small current such as a control signal.

  4 is a plan view showing the upper surface of the uppermost substrate 2 in the circuit board 20 having four layers, FIG. 5 is a plan view showing the upper surface of the second substrate 3 from the top, and FIG. 6 is the third substrate from the top. FIG. 7 is a plan view showing the upper surface of the lowermost substrate 5. 3 to 7 show one end portion of each substrate.

  The wiring pattern electrically connected to the through hole 6 of the electronic component mounting part A is as follows. The wiring pattern for the through hole 61 for use with a large current includes a wiring pattern 21 formed wide on the substrate 2, a wiring pattern 31 formed wide on the substrate 3, and a wiring pattern formed wide on the substrate 5. 51. In addition, the wiring pattern for the through hole 62 for use with a large current is formed in the wiring pattern 22 formed wide on the substrate 2, the wiring pattern 32 formed wide on the substrate 3, and wide on the substrate 5. And a wiring pattern 52. The wiring patterns for the remaining through holes 6 using a small current are the wiring patterns 26 and 56 formed narrowly on the substrates 2 and 5, respectively. Further, in each of the substrates 2 to 5, lands 7 are appropriately provided around the through holes 6 (including 61 and 62) that are electrically connected to the wiring pattern 21 and the like.

  On the other hand, the wiring pattern electrically connected to the through hole 16 of the electronic component mounting part B is as follows. The wiring pattern for the through-hole 161 for use with a large current includes a wiring pattern 23 formed wide on the substrate 2, the wiring pattern 32 formed wide on the substrate 3, and the wiring pattern 23 formed wide on the substrate 5. And a wiring pattern 52. In addition, the wiring pattern for the through hole 162 for use with a large current is formed in the wiring pattern 23 formed wide on the substrate 2, the wiring pattern 32 formed wide on the substrate 3, and wide on the substrate 5. And the wiring pattern 52 thus made. In addition, the wiring pattern for the through-hole 163 for using a large current is formed in the wiring pattern 23 formed wide on the substrate 2, the wiring pattern 32 formed wide on the substrate 3, and wide on the substrate 5. And the wiring pattern 52 thus made. In addition, the wiring pattern for the through-hole 164 for use with a large current is formed in the wiring pattern 24 formed wide on the substrate 2, the wiring pattern 31 formed wide on the substrate 3, and wide on the substrate 5. This is the wiring pattern 53. Narrow wiring patterns 28 and 58 are formed on the substrates 2 and 5 as wiring patterns for the remaining through holes 16 using a small current. Further, among the substrates 2 to 5, lands 17 are appropriately provided around the through holes 16 (including 161 to 164) that are electrically connected to the wiring pattern 23 and the like.

  In this way, the electronic component mounting portions A and B in which the through-holes 6 and 16 and the lands 27 and 29 are arranged in two rows in 10 rows are read in the same row arrangement as the through-holes 6 and 16. The connectors 10 and 10A on which the connectors 11 and 11A and the connection terminals 13 and 13A are arranged are attached using the jet soldering method described above. That is, the leads 11 and 11A are inserted from the upper surface (electronic component mounting surface) of the circuit board 20 into the through holes 6 and 16 of the electronic component mounting portions A and B, and the leads 11 and 11A and the lands 7 and 17 are connected. Then, soldering is performed from the lower side of the circuit board 20 (the side opposite to the electronic component mounting surface). As the jet soldering method, the technique of Patent Document 1 is applied.

  By this soldering, in the electronic component mounting portion A, the lead 11 inserted into the through hole 61 for use with a large current is electrically connected to the wide wiring patterns 21, 31, 51, and the large current is generated. The lead 11 inserted into the through hole 62 for use and the wide wiring patterns 22, 32, 52 are electrically connected, and the lead 11 inserted into the remaining through hole 6 using a small current has a narrow width. The wiring patterns 26 and 56 and the connection terminal 13 are electrically connected. On the other hand, in the electronic component mounting part B, the lead 11A inserted into the through-hole 161 for use with a large current is electrically connected to the wide wiring patterns 23, 32, 52, and the use for a large current is used. The lead 11A inserted into the through-hole 162 and the wide wiring patterns 23, 32, 52 are electrically connected, and the lead 11A inserted into the through-hole 163 for use with a large current and the wide wiring pattern 23 32, 52 are electrically connected to each other, and the lead 11A inserted into the through hole 164 for use with a large current is electrically connected to the wide wiring patterns 24, 31, 53 to use a small current. The leads 11A inserted into the remaining through holes 16, the narrow wiring patterns 28 and 58, and the connection terminals 13A are electrically connected. However, the narrow wiring pattern 41 formed on the substrate 4 is electrically connected to the corresponding one of the leads 11A inserted into the remaining through holes 16. By such soldering, the electronic component-equipped circuit board 1 of the present embodiment is manufactured.

  The wide wiring patterns 21, 31, 51, 22, 32, 52, 23, 24, and 53 for large current described above have a width dimension corresponding to the magnitude of the current, and It is formed between the component mounting parts A and B and the peripheral edge 20a.

  Therefore, regarding the wiring pattern of the circuit board 1 with electronic components configured in this way, the wiring patterns 21, 31, 51, formed between the electronic component mounting portions A and B and the peripheral edge 20 a of the circuit board 20, The heat capacities of 22, 32, 52, 23, 24, and 53 are the same as the heat capacities of the wiring patterns 26, 56, 28, and 58 formed on the side opposite to the peripheral edge 20a side of the electronic component mounting portions A and B, respectively. It is formed as described above. As a result, narrower wiring patterns 26, 56, 28, and 58 are formed on the inner side (opposite to the peripheral edge 20 a) than the electronic component mounting parts A and B, so It becomes possible to narrow the inner dead space.

  The reason will be described in detail below. Generally, copper with good thermal conductivity is used for the land and the wiring pattern. When the land is heated for soldering, the heat is transferred from the land to the surroundings through the wiring pattern. It takes a certain amount of time to heat up to the temperature required for attachment. Under such heat conduction, the wiring pattern that flows a large current is formed wide so that heat easily escapes and the time required for the soldering point to rise to the temperature required for soldering is long. As a result, the heat capacity increases. On the other hand, in the case of a wiring pattern that passes a small current, it is not necessary to form a wide pattern. Short and heat capacity is small. In such a case, as shown in FIG. 8, the arrangement of the land of the wiring pattern using a large current indicated by a black circle and the land of the wiring pattern using a small current indicated by a white circle is random, and the region I close to the periphery of the substrate. When the land of the wiring pattern is arranged in the row on the side and the row on the far side of the region II, the dead space II on the inner side (region II side) from the electronic component mounting portion A (B) is from the electronic component mounting portion A (B). The distance must be the same as the dead space I on the outside (region I side). On the other hand, as shown in FIG. 9, when a land of a wiring pattern using a large current indicated by a black circle is arranged on the column side (region I side) close to the periphery of the substrate, a white circle is formed on the far side (region II side). Only the land of the wiring pattern using the small current shown is used, and in the region II, the wiring pattern may be narrow, and with this, the heat escaping to the surroundings is reduced, and the inside of the electronic component mounting part A (B) This is because the dead space II can be narrowed.

  At this time, with regard to the dead space I outside the electronic component mounting portions A and B, if the electronic component is mounted here, there is a possibility that it will come off at the time of transporting the board or changing the place in the soldering process. In general, it is a non-mounting area where electronic components are not mounted. For this reason, there is little necessity for reduction of the dead space I.

  In the present embodiment, a plurality of lands 7 and 17 are provided in the electronic component mounting portions A and B in an arrangement corresponding to the leads 11 and 11A, and are formed between the electronic component mounting portions A and B and the peripheral edge 20a. The connected wiring patterns 21, 31, 51, 22, 32, 52, 23, 24, 53 are connected to the lands 7, 17 provided in the row closest to the peripheral edge 20a, and the peripheral edges of the electronic component mounting parts A, B Since the wiring pattern formed on the side opposite to the 20a side is connected to the lands 7 and 17 provided in the row farther from the peripheral edge 20a than the nearest row, the wiring pattern is connected to the corresponding land. In this case, the frequency of bypassing the wiring pattern can be reduced, and the wiring pattern can be simplified in shape.

  Further, when a thermal land C (see FIGS. 4 to 7) having a narrow width portion is provided for the wiring pattern 21 or the like having a large heat capacity (see FIG. 4 to FIG. 7), heat is generated by the thermal land C. It is possible to make soldering easier by suppressing the amount of escape to the periphery of the wire. That is, in the portion where the wiring pattern 21 or the like having a large heat capacity is formed, the temperature rise is low, and the time to reach the temperature suitable for soldering becomes long. Therefore, the heat transmitted to the surroundings increases and the dead space must be widened. . In that case, by providing the thermal land C on the wiring pattern 21 or the like having a large heat capacity as described above, the amount of heat escaped is suppressed, and the dead space II inside the electronic component mounting portions A and B is narrowed. This is because it becomes possible to facilitate soldering.

  For example, the land such as the wiring pattern 21 using a large current is arranged on the column side close to the peripheral edge 20a of the circuit board 20, and the thermal land C is provided on the wiring pattern 21 using a large current, thereby adversely affecting the soldering. The dead space II can be narrowed without affecting.

  In the above-described embodiment, the wiring pattern for passing a large current is formed wide and the wiring pattern for passing a small current is narrow, but the present invention is not limited to this. For example, instead of the width dimension, the thickness dimension may be adjusted, or the width dimension and the thickness dimension may be adjusted in combination.

  Moreover, although embodiment mentioned above demonstrated the example using what laminated | stacked the board | substrates 2-5 of 4 layers as circuit board main body 20 ', this invention is not limited to this, A board | substrate of 1 layer, 2 The present invention can be similarly applied to a circuit board body laminated with an arbitrary number of layers or more.

  Further, in the above-described embodiment, an example in which through holes (and lands, pins, and leads) are arranged in two rows has been described. However, the present invention is not limited to this, and the through holes and the like are arranged in three or more rows. The same applies to the arrangement.

  Furthermore, in the above-described embodiment, the circuit board of the present invention is applied to the installation of the connector. However, the present invention is not limited to this, and other electronic devices having a plurality of rows of leads, such as switches and variable resistors. The same applies to the case where the component is mounted on the electronic component mounting portion close to the periphery of the circuit board.

It is a disassembled perspective view which shows the circuit board main body of this invention. It is a front view which shows the circuit board with an electronic component of this invention. It is a top view which shows the position which arrange | positions a connector on a board | substrate. It is a top view which shows the upper surface of the board | substrate of the uppermost layer in a 4 layer laminated substrate. It is a top view which shows the upper surface of the 2nd board | substrate from the top. It is a top view which shows the upper surface of the 3rd board | substrate from the top. It is a top view which shows the upper surface of the board | substrate of the lowest layer. It is explanatory drawing of the dead space in the case of a prior art. It is a figure for demonstrating the effect in the case of this invention. It is a perspective view which shows an example of the nozzle utilized by this invention disclosed by patent document 1. FIG. It is a front view which shows the soldering state by the nozzle of FIG. It is a perspective view which shows the other example of the nozzle utilized by this invention disclosed by patent document 1. FIG. FIG. 10 is a perspective view showing still another example of a nozzle used in the present invention disclosed in Patent Document 1.

1 Circuit board with electronic components 2, 3, 4, 5 Substrate 6, 16 Through hole (through hole)
7, 17 Land 10, 10A Connector 11, 11A Lead 12 Upward nozzle 20 Circuit board 20 'Circuit board body 20a Periphery 21, 22, 23, 24 Wide wiring pattern 31, 32 Wide wiring pattern 51, 52, 53 Wide Wiring pattern 61, 62, 161, 162, 163, 164 Through hole (through hole)
A, B Electronic component mounting part C Thermal land

Claims (6)

A circuit board on which electronic components having a plurality of leads arranged over a plurality of rows are mounted,
A circuit board main body having a mounting portion on which the electronic component is mounted, and a plurality of through holes provided in a plurality of rows corresponding to the arrangement of the leads in the mounting portion;
A plurality of lands that are provided corresponding to the through holes of the circuit board main body and soldered to the leads inserted into the through holes;
The circuit board body includes a plurality of wiring patterns formed in connection with the lands,
Through hole of the circuit board main body, it is arranged at different distances from the edge of the circuit board main body for each of the rows of the through hole,
Said plurality of wiring patterns, towards the respective wiring patterns formed between the periphery of the circuit board body and the mounting portion, and the peripheral edge of the circuit board main body of the mounting portion is formed on the opposite side that heat capacity and wide than the wiring pattern is formed on the large Do so that a large wiring pattern of the heat capacity is connected to a land provided on the nearest column to the periphery of the circuit board main body, the mounting The wiring pattern formed on the side opposite to the peripheral side of the circuit board main body of the portion is connected to a land provided in a row farther from the peripheral edge of the circuit board main body than the nearest row. A circuit board characterized by being made . The circuit board according to claim 1 ,
Each of the lands is soldered to the corresponding lead by a jet soldering method. The circuit board according to claim 1 or 2 ,
The circuit board, wherein the wiring pattern formed between the mounting portion and the periphery of the circuit board main body is a wiring pattern connected to a power source or a ground. The circuit board according to any one of claims 1 to 3 ,
A circuit board characterized in that a thermal land having a narrow width portion is used for a land provided in a row closest to a peripheral edge of the circuit board main body. A circuit board according to any one of claims 1 to 4 ,
It has a plurality of leads arranged in multiple rows, each lead is inserted through a through hole provided in the circuit board, and the land provided in the circuit board and each lead are connected and mounted on the mounting portion An electronic component-attached circuit board comprising the electronic component. In the circuit board with electronic components according to claim 5 ,
The lead and the land are soldered by a jet soldering method from the side opposite to the electronic component mounting surface of the mounting part, and the soldering side surface is mounted before the soldering. A circuit board with electronic parts, wherein another electronic part is provided.

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