JPH02236979A - Mounting connector on substrate - Google Patents
Mounting connector on substrateInfo
- Publication number
- JPH02236979A JPH02236979A JP1056742A JP5674289A JPH02236979A JP H02236979 A JPH02236979 A JP H02236979A JP 1056742 A JP1056742 A JP 1056742A JP 5674289 A JP5674289 A JP 5674289A JP H02236979 A JPH02236979 A JP H02236979A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- connector
- supply area
- soldering
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910001006 Constantan Inorganic materials 0.000 abstract description 2
- 230000005679 Peltier effect Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000155 melt Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、信号層と電源層とを有して成る基板にコネク
タを半田付け実装する際に適用されるコネクタの実装方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connector mounting method applied when a connector is soldered and mounted on a substrate having a signal layer and a power supply layer.
３． 発明の詳細な説明
〔概 要〕
信号層と電源層とを有して成る基板にコネクタ〔従来の
技術〕
最近は熱容量の大きい電源供給Ｎ（以下電源層と呼ぶ）
と信号中継層（以下信号層と呼ぶ）の入った基板にコネ
クタを半田イ」け実装する作業が益々増加している。3. Detailed Description of the Invention [Summary] A connector on a substrate having a signal layer and a power layer [Prior art] Recently, a power supply N with a large heat capacity (hereinafter referred to as a power layer) is used.
The work of soldering and mounting connectors onto a board containing a signal relay layer (hereinafter referred to as a signal layer) is increasing.
第２図（ａｌと（ｂｌは基板に対するコネクタの実装方
法（以下コネクク実装方法と称する）の従来例を示す要
部側断面図であって、（ａ）はコネクタ実装前の状態を
、（ｂｌはコネクタ実装後の状態をそれぞれ示す。FIG. 2 (al and (bl) are main part side sectional views showing a conventional example of a method for mounting a connector on a board (hereinafter referred to as the "Connection mounting method"), (a) shows the state before mounting the connector, and (bl) indicates the state after the connector is mounted.
第２図（ａ）と（ｂｌに示すように、この基板５０は、
内部に電源層１１と信号層１３を備えている。なお、こ
れら電源層１ｌと信号層ｌ３が電源用スルーホール１２
と信号用スルーホール１４にそれぞれ電気的に接続され
ていることは一般の多層プリント板と同様である。一方
、コネクタ１は該電源用スルーボール１２内および信号
用スルーホール１４内に係入可能に構成された電源ビン
２と信号ピン３を装備している。このコネクタ１は、基
板５０に実装された場合は、第２図（ｂ）に示すように
、電源ピン２と信号ピン３の先端部分が基板５０の面か
ら突出し、その突出部分に図示しない別のコネクタが挿
抜可能な形で実装される構成になっている。As shown in FIGS. 2(a) and (bl), this substrate 50 is
A power supply layer 11 and a signal layer 13 are provided inside. Note that these power supply layer 1l and signal layer l3 are connected to the power supply through hole 12.
and the signal through-hole 14 are electrically connected to each other, as in a general multilayer printed board. On the other hand, the connector 1 is equipped with a power supply bottle 2 and a signal pin 3 that can be inserted into the power supply through ball 12 and the signal through hole 14. When this connector 1 is mounted on a board 50, the tip portions of the power pin 2 and signal pin 3 protrude from the surface of the board 50, as shown in FIG. The connector is mounted in a removable manner.
以下第２図（ａｌと（ｂ）を用いてコネクタ１を基ｔｒ
Ｊｉ５ｏに実装する際の手順を説明する。Below, using Figure 2 (al and (b)), connector 1 is based on tr.
The procedure for implementing it on Ji5o will be explained.
■．コネクタｌ側の電源ピン２と信号ビン３のそれぞれ
に環状の半田５を挿入する。■． A ring-shaped solder 5 is inserted into each of the power pin 2 and the signal pin 3 on the connector l side.
■．このコネクタｌの電源ビン２と信号ビン３を基板５
０の電源用スルーホール１２および信号用スルーホール
１４内に挿入する〔以上第２図（ａ）参照〕。■． Connect the power supply bin 2 and signal bin 3 of this connector l to the board 5.
0 into the power supply through-hole 12 and the signal through-hole 14 [see FIG. 2(a) above].
■．これらを例えば熱媒体としてフロリナートを用いた
ベーパ槽（図示せず）内に収容して加熱する。この加熱
によって半田５が溶融し、電源ピン２と電源用スルーボ
ール１２を，そして信号ピン３と信号用スルーホール１
４をそれぞれ半田付むＪずる〔以上第２図（ｂ）参照〕
。■． These are housed and heated in a vapor tank (not shown) using, for example, Fluorinert as a heat medium. This heating melts the solder 5 and connects the power pin 2 and the power through ball 12, and the signal pin 3 and the signal through hole 1.
4 respectively (see Figure 2 (b) above)
.
しかしながら上記従来のコネクタ実装方法は、フロリナ
ートの蒸気で全体加熱を行うため、熱容量の大きい電源
層１１に接続されている電源用スルーホール１２も、熱
容量の小さい信号層１３に接続されている信号用スルー
ポール１４も均等に加熱されるため、両者間に温度差が
発生し、熱容量の小さい信号用スルーホール１４側の半
田５が溶融した後も熱容遣の大きい電源用スルーホール
１２側の半田５は溶融しないといった事態が生じる。ま
た、電源用スルーホール１２側の半田５が溶けるまで加
熱を続けると、今度は信号用スルーホールｌ４内の溶融
半田５が膨脹して信号ビン３の先端までその半田５が上
がってしまい、相手コネクタの接続が不可能になるとい
った障害が発生ずる〔第２図（ｂ）参照〕。However, in the conventional connector mounting method described above, the entire body is heated with Fluorinert vapor, so that the power through hole 12 connected to the power layer 11 with a large heat capacity is also used for the signal through hole 12 connected to the signal layer 13 with a small heat capacity. Since the through pole 14 is also heated evenly, a temperature difference occurs between the two, and even after the solder 5 on the signal through hole 14 side, which has a small heat capacity, melts, the solder on the power supply through hole 12 side, which has a large heat dissipation, melts. 5 may not melt. Furthermore, if heating is continued until the solder 5 on the side of the power supply through-hole 12 melts, the molten solder 5 inside the signal through-hole l4 will expand and rise to the tip of the signal bottle 3, causing the A failure occurs in which the connector becomes impossible to connect (see FIG. 2(b)).
本発明によるコネクタ実装方法は、第１図に示すように
、基板１０側にその電源層１１と電気的に接続された導
電性金属より成る電源供給エリアｌ５を設けると共に、
該電源供給エリア１５と電源部２０とを前記電源供給エ
リア１５の構成材料と異なる種類の導電性金属より成る
給電部材１６で結合してこれに通電を行いながら前記コ
ネクタｌの半田付け実装を行う構成になっている。As shown in FIG. 1, the connector mounting method according to the present invention provides a power supply area 15 made of conductive metal electrically connected to the power layer 11 on the board 10 side, and
The power supply area 15 and the power supply unit 20 are connected by a power supply member 16 made of a conductive metal different from that of the constituent material of the power supply area 15, and the connector l is soldered and mounted while being energized. It is configured.
このような方法を採用することにより、給電部材ｌ６と
電源供給エリア１５間にペルティエ効果による熱が発生
し、この熱によって熱容量の大きい電源層１１が加熱さ
れ、電源ピン２と信号ビン３が同一条件下で半田付け実
装されることから、コネクタ実装時の信頬性が向上する
。By adopting such a method, heat due to the Peltier effect is generated between the power supply member l6 and the power supply area 15, and this heat heats the power supply layer 11 with a large heat capacity, and the power supply pin 2 and the signal bin 3 are connected to the same Since the connector is mounted by soldering under certain conditions, reliability when mounting the connector is improved.
以下実施例図に基づいて本発明を詳細に説明する。 The present invention will be described in detail below based on embodiment figures.
第１図は本発明の一実施例を示す模式的要部側断面図で
あるが、前記第２図と同一部分には同一符号を付してい
る。FIG. 1 is a schematic side sectional view of essential parts showing one embodiment of the present invention, and the same parts as in FIG. 2 are given the same reference numerals.
第１図に示すように、本発明によ′るコネクク実装方法
は、基板１０側にその電ｍ層１１と電気的に接続された
導電性金属，例えば鋼材より成る電源供給エリア１５を
設けると共に、該電源供給エリア１５と電源部２０とを
前記電源供給エリア１５の構成材料と異なる種類の導電
性金属．例えばコンスタンタン（ニッケル４５％、銅５
５％の合金）より成る給電部材１６で結合してこれに通
電を行いながら前記コネクタ１の半田付け実装をベーパ
槽（図示せず）内で行う構成になっている。前記電源供
給エリアｌ５は例えばスルーホールと同等の手段で形成
され、その内部には前記給電部材１６を電源供給エリア
ｌ５に固定するためのネジ３０を螺入するためのネジ孔
３１が設けられている。As shown in FIG. 1, the connector mounting method according to the present invention provides a power supply area 15 made of a conductive metal, such as steel, electrically connected to the conductive layer 11 on the board 10 side. , the power supply area 15 and the power supply section 20 are made of a conductive metal of a different type from the constituent material of the power supply area 15. For example, constantan (45% nickel, 5% copper)
5% alloy), and the connector 1 is soldered and mounted in a vapor tank (not shown) while being energized. The power supply area l5 is formed, for example, by a means equivalent to a through hole, and a screw hole 31 is provided therein into which a screw 30 for fixing the power supply member 16 to the power supply area l5 is inserted. There is.
第１図に示すように、本発明によるコネクタ実装方法の
特徴は、基板１０側にその電源Ｎｌｌと電気的．かつ機
械的に接続された銅材料より成る電源供給エリア１５が
設けられた点と、該電源供給エリア１５と電源部２０と
を接続する給電部材１６が当該電源供給エリア１５と異
なる導電材料，例えばコンスタンクンで構成されている
点にある。As shown in FIG. 1, the feature of the connector mounting method according to the present invention is that the power supply Nll and the electrical connection are connected to the board 10 side. In addition, the power supply area 15 made of mechanically connected copper material is provided, and the power supply member 16 connecting the power supply area 15 and the power supply part 20 is made of a conductive material different from that of the power supply area 15, for example. It consists of constants.
このように本発明は、コンスタンクン製の給電部材１６
を介して鋼材より成る電源供給エリア１５に電源部２０
からの電力を供給し、ペルチュエ効果によって発生する
熱によって電源層１１および電源用スルーホール１２の
温度を上げて当該電源用スルーホール１２の温度信号用
スルーポール１４の温度を等しくして電源ピン２と信号
ピン３に対する半田付け条件を等しくするようにしてい
る。このため、前記第２図で説明したような障害．即ち
信号ピン３側の半田５が先に溶けてそれが信号ビン３の
先端部に付着するといった現象が無くなり、電源ピン２
と信号ピン３は均等に半田付けされる。In this way, the present invention provides the power supply member 16 made by Constantun.
A power supply unit 20 is connected to a power supply area 15 made of steel through a
The temperature of the power supply layer 11 and the power supply through-hole 12 is increased by the heat generated by the Pelthue effect, and the temperature of the temperature signal through-hole 14 of the power supply through-hole 12 is made equal to the temperature of the power supply pin 2. The soldering conditions for signal pin 3 and signal pin 3 are made equal. As a result, problems such as those explained in FIG. 2 above occur. In other words, the phenomenon that the solder 5 on the signal pin 3 side melts first and adheres to the tip of the signal bottle 3 is eliminated, and the
and signal pins 3 are evenly soldered.
なお、本実施例では銅とコンスタンクンによるペルチュ
エ効果を利用する構成になっているが、これは互いに異
種金属であれば他の導電材料を用いてもかまわない。Although this embodiment uses the Perthue effect due to copper and constancouple, other conductive materials may be used as long as they are different metals.
また、本実施例は基板１０の表裏両側から電源供給エリ
ア１５に電源電流を直接供給しているが、この通電経路
中に電源層１１を含めるようにしても良い。Further, in this embodiment, the power supply current is directly supplied to the power supply area 15 from both the front and back sides of the substrate 10, but the power supply layer 11 may be included in this current supply path.
電源部２０から電源供給エリア１５に供給する電流量は
、電源ピン２と信号ピン３の各半田付け状況をチェック
しながら調整されることになる。The amount of current supplied from the power supply section 20 to the power supply area 15 is adjusted while checking the soldering conditions of the power supply pin 2 and the signal pin 3.
以上の説明から明らかなように本発明は、熱容量の大き
い電源供給層部を強制的に昇温させ、当該電源供給部の
温度と熱容量の小さい信号層部の温度を均等化して半田
付けを行う方式であることから、信頼性の高いコネクタ
実装が可能となる。As is clear from the above description, the present invention forcibly raises the temperature of the power supply layer section with a large heat capacity, equalizes the temperature of the power supply section and the temperature of the signal layer section with a small heat capacity, and then performs soldering. This method enables highly reliable connector mounting.
第１図は本発明の一実施例を示す模式的要部側断面図、
第２図（ａ）と（ｂ）は従来のコネクタ実装方法を示す
要部側断面図である。
１３は信号層、
１４は信号用スルーホール、
１５は電源供給エリア、
１６は給電部材、
２０は電源部、
３０はネジ、
３１はネジ孔、
をそれぞれ示す。
図において、１はコネクタ、
２は電源ピン、
３は信号ピン、
５は半田、
１０と５０は基板、
ｌ１は電源層、
１２は電源用スルーホール、
矛発明６一欠抱例口
第１図
従圭一コ年７９宍３仁方５天ｔぶＴ図FIG. 1 is a schematic side sectional view of the main part showing an embodiment of the present invention, and FIGS. 2(a) and (b) are side sectional views of the main part showing a conventional connector mounting method. 13 is a signal layer, 14 is a signal through hole, 15 is a power supply area, 16 is a power supply member, 20 is a power supply section, 30 is a screw, and 31 is a screw hole. In the figure, 1 is a connector, 2 is a power pin, 3 is a signal pin, 5 is solder, 10 and 50 are a board, 11 is a power layer, 12 is a power supply through hole, Figure 1 Jukei Kazuko Year 79 Shishi 3 Nikata 5 Ten Tbu T Map
Claims (1)
１０）にコネクタ（１）を半田付け実装する際に適用さ
れるコネクタの実装方法であって、 基板（１０）側にその電源層（１１）と電気的に接続さ
れた導電性金属より成る電源供給エリア（１５）を設け
ると共に、該電源供給エリア（１５）と電源部（２０）
とを当該電源供給エリア（１５）の構成材料と異なる種
類の導電性金属より成る給電部材（１６）で結合してこ
れに通電を行いながら前記コネクタ（１）の半田付けを
行うようにしたことを特徴とする基板に対するコネクタ
の実装方法。[Claims] A substrate comprising a signal layer (13) and a power layer (11) (
10) A connector mounting method applied when mounting the connector (1) by soldering on the board (10), which includes a power supply made of conductive metal electrically connected to the power supply layer (11) on the board (10) side. A supply area (15) is provided, and the power supply area (15) and the power supply section (20) are provided.
and a power supply member (16) made of a conductive metal different from the constituent material of the power supply area (15), and the connector (1) is soldered while energizing the power supply member (16). A method for mounting a connector on a board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056742A JPH02236979A (en) | 1989-03-08 | 1989-03-08 | Mounting connector on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056742A JPH02236979A (en) | 1989-03-08 | 1989-03-08 | Mounting connector on substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02236979A true JPH02236979A (en) | 1990-09-19 |
Family
ID=13035982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056742A Pending JPH02236979A (en) | 1989-03-08 | 1989-03-08 | Mounting connector on substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02236979A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218644A (en) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | Circuit board and circuit board with electronic component |
-
1989
- 1989-03-08 JP JP1056742A patent/JPH02236979A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218644A (en) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | Circuit board and circuit board with electronic component |
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