JP4785878B2 - 冷却装置及び該冷却装置を備える電気車両 - Google Patents
冷却装置及び該冷却装置を備える電気車両 Download PDFInfo
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- JP4785878B2 JP4785878B2 JP2008026446A JP2008026446A JP4785878B2 JP 4785878 B2 JP4785878 B2 JP 4785878B2 JP 2008026446 A JP2008026446 A JP 2008026446A JP 2008026446 A JP2008026446 A JP 2008026446A JP 4785878 B2 JP4785878 B2 JP 4785878B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
- B60L58/30—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells
- B60L58/32—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells for controlling the temperature of fuel cells, e.g. by controlling the electric load
- B60L58/33—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells for controlling the temperature of fuel cells, e.g. by controlling the electric load by cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
- B60L58/30—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells
- B60L58/32—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells for controlling the temperature of fuel cells, e.g. by controlling the electric load
- B60L58/34—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling fuel cells for controlling the temperature of fuel cells, e.g. by controlling the electric load by heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
- B60L58/40—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for controlling a combination of batteries and fuel cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/40—Application of hydrogen technology to transportation, e.g. using fuel cells
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
- Fuel Cell (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
20a、20b…電気車両 22…燃料電池
23…DC/DCコンバータ装置 24…蓄電装置
26…モータ 34…インバータ
36…DC/DCコンバータ 91、91u〜91w…上チップ
92、92u〜92w…下チップ 94…放熱板
98…スイッチングモジュール 100…ケーシング
102…冷却液流路 104…折り返し部
106…入口ポート 108…出口ポート
118…切欠部 120…冷却フィン
121…R部 122…チャンバー
Claims (7)
- 発熱体を冷却するための冷却装置であって、
複数の冷却フィンが設けられ、冷却液が流通する冷却液流路を備え、
前記冷却フィンは、前記冷却液の流通方向で前記発熱体の少なくとも中央部に対応する位置に切欠部が形成され、該切欠部により、追加冷媒の導入口がないチャンバーが前記冷却液流路中に形成されており、
前記発熱体と前記冷却液流路とが積み重なる方向に見た平面視において、前記発熱体の発熱中心部が、前記チャンバー内に位置することを特徴とする冷却装置。 - 発熱体を冷却するための冷却装置であって、
複数の冷却フィンが設けられ、冷却液が流通する冷却液流路を備え、
前記冷却フィンは、前記冷却液の流通方向で前記発熱体の少なくとも中央部に対応する位置に切欠部が形成され、該切欠部により前記冷却液流路中にチャンバーが形成されており、
前記冷却フィンの高さより前記チャンバーの高さが大きいことを特徴とする冷却装置。 - 発熱体を冷却するための冷却装置であって、
複数の冷却フィンが設けられ、冷却液が流通する冷却液流路を備え、
前記冷却フィンは、前記冷却液の流通方向で前記発熱体の少なくとも中央部に対応する位置に切欠部が形成され、該切欠部により、追加冷媒の導入口がないチャンバーが前記冷却液流路中に形成されており、
前記切欠部は、前記冷却液の流通方向における前記発熱体の発熱中心部に対応する位置で前記冷却液の乱れを発生させることを特徴とする冷却装置。 - 請求項1〜3のいずれか1項に記載の冷却装置において、
前記冷却フィンは、少なくとも前記冷却液の流通方向での端部にR部が形成されていることを特徴とする冷却装置。 - 請求項1〜4のいずれか1項に記載の冷却装置において、
前記発熱体と前記冷却フィンとの間にはヒートスプレッダが配置され、
複数の前記発熱体が共通のヒートスプレッダ上に配置されることを特徴とする冷却装置。 - 請求項1〜5のいずれか1項に記載の冷却装置と、
車輪を回転させる電動機と、
前記電動機に電力を並列的に供給する発電装置及び蓄電装置と、
前記蓄電装置と前記発電装置との間に接続され前記蓄電装置に発生する電圧を変換して前記電動機側に印加すると共に前記電動機の回生動作による回生電圧又は前記発電装置の発電電圧を変換して前記蓄電装置側に印加するDC/DCコンバータと、
を備え、
前記発熱体は、前記DC/DCコンバータに設けられたスイッチング素子を含むことを特徴とする電気車両。 - 請求項6記載の電気車両において、
前記発電装置は燃料電池であることを特徴とする電気車両。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008026446A JP4785878B2 (ja) | 2008-02-06 | 2008-02-06 | 冷却装置及び該冷却装置を備える電気車両 |
EP09707911.5A EP2242100B1 (en) | 2008-02-06 | 2009-01-22 | Cooling device and electric vehicle using the cooling device |
PCT/JP2009/051003 WO2009098949A1 (ja) | 2008-02-06 | 2009-01-22 | 冷却装置及び該冷却装置を備える電気車両 |
US12/866,518 US8342276B2 (en) | 2008-02-06 | 2009-01-22 | Cooling device and electric vehicle using cooling device |
CN2009801042352A CN101971330A (zh) | 2008-02-06 | 2009-01-22 | 冷却装置及具有该冷却装置的电动车辆 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008026446A JP4785878B2 (ja) | 2008-02-06 | 2008-02-06 | 冷却装置及び該冷却装置を備える電気車両 |
Publications (2)
Publication Number | Publication Date |
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JP2009188181A JP2009188181A (ja) | 2009-08-20 |
JP4785878B2 true JP4785878B2 (ja) | 2011-10-05 |
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JP2008026446A Active JP4785878B2 (ja) | 2008-02-06 | 2008-02-06 | 冷却装置及び該冷却装置を備える電気車両 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8342276B2 (ja) |
EP (1) | EP2242100B1 (ja) |
JP (1) | JP4785878B2 (ja) |
CN (1) | CN101971330A (ja) |
WO (1) | WO2009098949A1 (ja) |
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US11387598B2 (en) * | 2019-02-19 | 2022-07-12 | Aptiv Technologies Limited | Electrical connector assembly with modular cooling features |
US11511636B2 (en) | 2019-04-01 | 2022-11-29 | Aptiv Technologies Limited | Electrical connector assembly with liquid cooling features |
US11495908B2 (en) | 2019-04-01 | 2022-11-08 | Aptiv Technologies Limited | Electrical connector assembly with liquid cooling features |
US11539158B2 (en) * | 2019-09-09 | 2022-12-27 | Aptiv Technologies Limited | Electrical terminal seal and electrical connector containing same |
KR20210076312A (ko) * | 2019-12-13 | 2021-06-24 | 현대자동차주식회사 | 다중 전압 충전을 위한 전력 변환 장치 |
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JP7405025B2 (ja) * | 2020-07-01 | 2023-12-26 | 株式会社デンソー | 電気製品 |
CN115377030A (zh) * | 2021-05-20 | 2022-11-22 | 深圳市英维克科技股份有限公司 | 一种液冷板及电子计算设备 |
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AT377644B (de) | 1981-07-30 | 1985-04-10 | Elin Union Ag | Kuehlkoerper fuer zwangsoelumlaufkuehlung |
JP2002046482A (ja) * | 2000-07-31 | 2002-02-12 | Honda Motor Co Ltd | ヒートシンク式冷却装置 |
JP2003060145A (ja) * | 2001-08-16 | 2003-02-28 | Nippon Alum Co Ltd | 冷却プレート |
JP4015060B2 (ja) * | 2003-05-20 | 2007-11-28 | 株式会社日立製作所 | 直接水冷型パワー半導体モジュール構造 |
FR2861894B1 (fr) | 2003-10-31 | 2008-01-18 | Valeo Equip Electr Moteur | Dispositif de refroidissement d'une electronique de puissance |
JP4555136B2 (ja) | 2005-03-31 | 2010-09-29 | 本田技研工業株式会社 | 燃料電池の電気システム、燃料電池車両及び電力供給方法 |
TW200712421A (en) * | 2005-05-18 | 2007-04-01 | Univ Nat Central | Planar heat dissipating device |
US20060280977A1 (en) * | 2005-06-09 | 2006-12-14 | Denso Corporation | Fuel cell system |
TW200810676A (en) * | 2006-03-30 | 2008-02-16 | Cooligy Inc | Multi device cooling |
JP4649359B2 (ja) | 2006-04-06 | 2011-03-09 | トヨタ自動車株式会社 | 冷却器 |
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EP2242100A4 (en) | 2011-06-22 |
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CN101971330A (zh) | 2011-02-09 |
JP2009188181A (ja) | 2009-08-20 |
US8342276B2 (en) | 2013-01-01 |
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EP2242100A1 (en) | 2010-10-20 |
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