JP4768798B2 - Tape collection method, mounting machine and component mounting system - Google Patents

Description

  The present invention relates to a technique for cutting and collecting an empty tape generated when a component is mounted by a mounting machine equipped with a plurality of tape feeders for supplying a tape containing a component.

  Conventionally, a mounting machine that mounts chip components on a printed circuit board has been equipped with a tape feeder for supplying components, so that a large number of chip components can be sent one after another to a predetermined position, while the above-described movable suction head is used. A device in which a chip part is taken out from a tape feeder at a predetermined position is known.

  In each tape feeder, for example, a tape that holds a large number of chip components by attaching a cover tape to a carrier tape that stores a large number of chip components at regular intervals is wound around a reel in advance. Installed at the rear. Then, the tape led out from the reel is guided to the component take-out portion in front of the feeder, and the cover tape is peeled off from the carrier tape so that the chip component can be taken out. Further, the chip parts are taken out one after another while the tape is intermittently fed by the feeding mechanism.

  In addition, the carrier tape (empty tape) that has been emptied due to the component supply is sent from each tape feeder to the tape collecting device. In this tape collection device, for example, as described in Patent Document 1, a cutting unit having a long fixed blade and a movable blade and a collection box are provided, and a plurality of empty tapes are cut at once, Collected in a collection box.

JP 2006-237316 A (FIG. 2)

  In the apparatus described in Patent Document 1, mounting of all the components on the board is completed, and the empty tape is cut and collected at the timing when the board is unloaded from the component mounting position. For this reason, the following inconvenience may occur. In other words, the empty tape is intermittently sent to the tape collecting device while the parts are being mounted. Therefore, when the number of mounted parts is large, the amount of empty tape that is fed becomes longer, and the fixed and movable blades After the leading end of the empty tape that hangs down reaches the bottom of the recovery box (container 31 in Patent Document 1), the empty tape may be bent in the recovery box or the empty tapes may be entangled with each other. In such a state, there may be a problem that the empty tape cannot be cut satisfactorily or a problem that the empty tape cannot be sent to the tape collecting device.

  Therefore, in order to solve such a problem, it has been conventionally performed to cut and collect the empty tape in parallel with the component mounting. That is, every time it is confirmed that the empty tape reaches the cutting position, the cutting unit is operated to cut the empty tape until it is sent to the bottom of the collection box. In this way, the tape is frequently cut to cut the empty tape before the empty tape reaches the preset cutting limit position, thereby preventing the occurrence of the above problem.

  However, in the past, when even one of the plurality of empty tapes reaches the cutting position, the cutting unit is activated to cut the tapes at once, so it is executed until component mounting on the board is completed. Since the number of times of cutting is increased and the tape cannot be fed by the feeding mechanism during the cutting operation, the suction operation may be stopped until the cutting operation is completed, and the time required for mounting all the components on one board That is, there is a problem that the cycle time becomes long. In addition, an increase in the number of times of cutting leads to accelerated deterioration of the blade portion.

  This invention is made in view of the said subject, and it aims at cut | disconnecting an empty tape reliably and favorably, suppressing the frequency | count of cutting of an empty tape.

  In the tape collecting method according to the present invention, the operation from the component extraction from the tape to the component mounting on the substrate by the mounting machine equipped with a plurality of tape feeders for supplying the tape containing the component is defined as the mounting group, and the mounting group is defined as the mounting group. In parallel with the repeated execution according to the production program, the tape recovery method of sending the empty tape after the part removal to the recovery means side via the cutting position of the cutting mechanism, cutting at the cutting position and recovering to the recovery means In order to achieve the above object, the first mounting group, which is expected to reach the cutting limit position preset on the collecting means side with respect to the cutting position during the execution of the mounting group, is assumed. The first step determined based on the production program and the empty step exceeding the cutting position in parallel with the second mounting group executed before the first mounting group. It is characterized in that a second step of recovering the recovery means is cut by collectively cutting mechanism all flops.

  Further, in order to achieve the above object, the mounting machine according to the present invention is held on a head unit having a head capable of sucking and detaching components, above a component supply unit disposed on the base, and on the base. The head unit drive mechanism that allows the head unit to move between the upper part of the board and the operation from the removal of the component from the tape placed in the component supply unit to the mounting of the part on the board are set as a mounting group. Control means for controlling and repeatedly executing the mounting group according to the production program, the control means being arranged in the vicinity of the base and cutting the empty tape after taking out the components, and the cutting position of the cutting mechanism Control the drive timing of the cutting mechanism for the tape recovery device with recovery means for recovering the empty tape sent via In addition, the cutting mechanism is installed in parallel with the second mounting group executed before the first mounting group, in which the leading end of the empty tape is expected to reach the cutting limit position preset on the collecting means side with respect to the cutting position. It is characterized in that all the empty tapes that have been driven to exceed the cutting position are collectively cut and collected by the collecting means.

  In order to achieve the above object, the component mounting system according to the present invention is equipped with a plurality of feeders for supplying a component by feeding out a tape containing the component, and an operation from taking out the component from the tape to mounting the component on the board. And a mounting machine that repeatedly executes the mounting group according to the production program, and in parallel with the execution of the mounting group, after the removal of the components sent to the collection means side via the cutting position of the cutting mechanism A tape collecting device that cuts the empty tape at the cutting position and collects it in the collecting means; and a control means that controls the drive timing of the cutting mechanism. The second mounting group executed before the first mounting group is expected to reach the cutting limit position set in advance on the collecting means side. It is characterized in that collected in the collection means and collectively cut all the empty tape beyond the cutting position by driving the parallel cutting mechanism and flop.

  In the invention thus configured (tape collecting method, mounting machine and component mounting system), a predetermined position on the collecting means side with respect to the cutting position, for example, a position immediately above the bottom surface of the collecting means is preset as a cutting limit position. Then, during the execution of the mounting group, the leading end of the empty tape is expected to reach the cutting limit position, and a first mounting group is obtained, and cutting is performed in parallel with the second mounting group executed before this first mounting group. Batch cutting / collecting of empty tapes exceeding the position is executed. Therefore, the empty tapes are collectively cut with the effort that the leading end of the empty tape reaches the cutting limit position.

  Alternatively, the batch cutting timing of the empty tape (execution timing of the second step) may be written in the production program, and component mounting and tape collection may be performed based on the production program. In this way, by creating a production program including information related to batch cutting timing in advance, when mounting components in the same manner, component mounting and tape collection can be performed using the same production program. As a result, it is not necessary to perform the first step, and the processing efficiency can be further improved.

  In some cases, the execution of the mounting group may fail. In this case, the cutting mechanism is operated to cut all the empty tapes exceeding the cutting position in a lump and collect them in the collecting means. Is desirable. This is because the production program does not assume such a case, and it is possible to surely prevent the leading end of the empty tape from exceeding the cutting limit position by executing batch cutting of the empty tape.

  In addition, when a mounting group is resumed based on the same production program or another production program after the mounting group based on the production program cannot be continuously executed, an empty tape can be used as in the case of the mounting group failure. Batch cutting may be performed.

  Further, when the blank tape is collectively cut (third step) as described above, the first step is performed again to obtain the first mounting group again, and the execution timing of the second step is adjusted. desirable. Thereby, the tape recovery after the timing adjustment can be efficiently performed as before.

  As described above, according to the present invention, in parallel with the second mounting group executed before the first mounting group, the leading end of the empty tape is expected to reach the cutting limit position during the execution of the mounting group. Since all the empty tapes that exceed the cutting position are collectively cut by the cutting mechanism and collected in the collecting means, the empty tape is always cut in a lump with the effort that the leading edge of the empty tape reaches the cutting limit position. It can be recovered. As a result, the empty tape can be reliably and satisfactorily cut while suppressing the number of cuts of the empty tape.

  FIG. 1 is a block diagram showing an embodiment of a component mounting system according to the present invention. In this component mounting system, a control device 1 such as a host computer or a personal computer or a server PC is connected to the mounting machine 10 via a LAN (= Local Area Network) cable or the like. The control device 1 has a controller 2 that controls the entire component mounting system. The controller 2 includes an arithmetic processing unit 2a configured by a CPU or the like, a storage unit 2b such as a hard disk drive, and a communication control unit 2c. In the storage unit 2b, production programs created based on board data such as a feed pitch for each component, a component mounting order, and a component suction order are stored in a list format, for example. In this embodiment, the arithmetic processing unit 2a simulates the mounting operation (execution of the mounting group) based on the board data when creating the production program, obtains the timing of the empty tape cutting operation, and incorporates it into the production program. Such an operation will be described in detail later.

  Further, the arithmetic processing unit 2a can transmit the production program to the mounting machine 10 to the mounting machine 10 that executes the program via the communication control unit 2c. As described above, the communication control unit 2 c functions as an output unit that outputs the production program to the mounting machine 10. The production program once created is registered in the storage unit 2b, and is loaded into the mounting machine 10 as necessary to allow component mounting. Reference numeral 3 in the figure displays a production program created by the arithmetic processing unit 2a, a correlation data list, and the like, and a display for an operator to input information such as various data and commands to the controller 2. / Operation unit. Moreover, in this embodiment, although communication between the control apparatus 1 and the mounting machine 10 is performed by wired LAN, a communication system and an aspect are not limited to this.

  FIG. 2 is a plan view showing a schematic configuration of the mounting machine. FIG. 3 is a front view of the mounting machine of FIG. Further, FIG. 4 is a diagram showing a component supply unit and a tape recovery device mounted on the mounting machine of FIG. In these drawings, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship between the drawings.

  In the mounting machine 10, the substrate transport mechanism 20 is disposed on the base 11, and the substrate 30 can be transported in a predetermined transport direction X. More specifically, the substrate transport mechanism 20 has a pair of conveyors 21 and 21 that transport the substrate 30 from the right side to the left side of FIG. These conveyors 21 and 21 are controlled by the controller 40 (refer FIG. 1) which controls the mounting machine 10 whole. That is, the conveyors 21 and 21 operate according to a drive command from the controller 40, and stop the board 30 that has been carried in at a predetermined mounting work position (position of the board 30 shown in FIG. 2). The substrate 30 is fixed and held by a holding device (not shown). Then, electronic components (not shown) supplied from the component supply unit 50 to the substrate 30 are transferred by a plurality of suction nozzles 61 mounted on the head unit 60. Thus, when the head unit 60 reciprocates a plurality of times between the upper part of the component supply unit 50 and the upper part of the substrate 30 to complete the mounting process for all the components to be mounted on the substrate 30, the substrate transport mechanism 20 starts from the controller 40. The substrate 30 is unloaded in response to the drive command.

  In this embodiment, the component supply units 50 are provided at a total of four locations on the front (+ Y) side and the rear (−Y) side of the conveyors 21 and 21, respectively. In the unit 50, a plurality of feeders 51 are mounted. Further, in this embodiment, as shown in FIG. 4, a plurality of feeders 51 can be attached to and detached from the mounting machine 10 by using a feeder mounting carriage 52. Two reel holding portions 521 and 522 are provided at the rear portion of the feeder mounting carriage 52. Among these, the first reel holding part 521 is arranged below the feeder 51 and the second reel holding part 522 is arranged below the first reel holding part 521. These reel holding portions 521 and 522 are formed separately from the feeder 51, the first reel holding portion 521 has the first reel R1, and the second reel holding portion 522 has the second reel R2 in the width direction. It can be held while being arranged in parallel in a direction (perpendicular to the paper surface). Each reel R1, R2 is provided corresponding to the first feeder group and the second feeder group, respectively. That is, in this embodiment, a plurality of feeders 51 are attached to the carriage 52 at a predetermined pitch in the width direction X, and the first feeder group is formed by the feeders 51 that are arranged oddly from the front side in the width direction X. On the other hand, the second feeder group is formed by the evenly arranged feeders 51. The first reel holding unit 521 can hold a plurality of first reels R1 at a pitch twice that of each feeder 51. The tape TP of each first reel R1 can be fed from the upper side of the first reel R1 to the tape guide 512 of the feeder 51 corresponding to the first reel R1.

  The second reel holding unit 522 can also hold a plurality of second reels R2 at a pitch twice the pitch of each feeder 51. The tape TP of each second reel R2 is guided on the radially outer side of the first reel R1 disposed in the first reel holding portion 521, and is sent to the tape guide 512 of the feeder 51 corresponding to the second reel R2. It is possible to pay. With the above reel arrangement, even if the width of each reel R1, R2 is larger than the width of each feeder 51, the arrangement pitch of each feeder 51 can be arranged at an equal pitch narrower than the width of each reel R1, R2. .

  Each feeder 51 is configured as an electric tape feeder, and has a box-type feeder body 511 that is flat in the width direction (X direction) as shown in FIG. The feeder main body 511 includes a tape guide 512 in the front-rear direction. And the feeder 51 is set and fixed to the feeder attachment carriage 52 in the state which turned the front end side (right hand side of the figure) of the feeder 51, ie, the feeder main body 511, to the conveyor 21 (FIG. 2) side.

  As described above, the reels R 1 and R 2 are arranged behind the tape guide 512 (left end portion in FIG. 4), and the tape TP is led out to the feeder body 511 in the front. As is well known in the art, this tape TP is for storing and holding small pieces of components such as ICs, transistors, capacitors, etc. at regular intervals. Carrier tape (symbol CR in FIG. 4) and this It is comprised from the cover tape (code | symbol CV in FIG. 4) stuck. More specifically, the carrier tape CR has hollow component storage recesses opened upward at regular intervals, and components such as ICs are stored in the respective component storage recesses. Further, on one side of the carrier tape CR, engagement holes that penetrate in the tape thickness direction along the edge thereof are provided at regular intervals, and can be engaged with the sprocket 513 of the tape feeding mechanism. On the other hand, the cover tape CV is bonded to the upper surface of the carrier tape CR so as to cover the part where the mouth of the component housing recess opens.

  In addition, a tape guide extending in the front-rear direction (Y direction) is provided on the upper portion of the feeder main body 511, and a cover member is provided so as to cover the upper portion. Then, the tape TP led out from the reel is guided below the cover member along the tape guide.

  In the feeder 51, a sprocket 513 is arranged at a position where components are picked up by the head unit 60, that is, below the component suction position for the suction nozzle 61, in order to feed the tape TP from the reels R1 and R2 along the tape guide. Has been. And a part of the outer edge part faces the tape guide through an opening formed in the inner ceiling part of the feeder main body 511, and a part of the pin provided on the outer periphery is on the side of the carrier tape CR, the cover The outer side of the tape CV is engaged with the tape TP by fitting in an engagement hole provided at a predetermined pitch that coincides with the pitch of the pins in the longitudinal direction. When the sprocket 513 is driven to rotate, the tape TP is intermittently pulled at a constant pitch feed amount corresponding to the pitch of the component storage recesses of the tape TP while the tape TP is pulled out from the reels R1 and R2 with this rotation. Sent out.

  Further, in order to enable component supply at the component supply position in the tape TP below the component suction position, the cover tape CV is peeled off from the tape TP on the upstream side of the component supply position. That is, on the upstream side of the component supply position (the left hand side in the figure), the cover tape CV is peeled off by a part of the cover member from the tape TP guided along the tape guide and folded back. As a result, the component storage recess of the tape TP (carrier tape CR) is opened upward, and the component is sucked by the suction nozzle 61 which is sent to the component supply position and mounted on the head unit 60 in that state. Yes. On the other hand, the cover tape CV folded back as described above is sent to the rear side by the take-up mechanism 514 and further sent into the rear cover tape accommodating portion 517. On the other hand, the empty carrier tape CR (corresponding to the “empty tape” of the present invention), which has been emptied by removing the parts, is sent to the tape recovery device 80 and cut into an appropriate size by the cutting mechanism 84 before the recovery box. 82 is collected. This configuration and operation will be described in detail later.

  Returning to FIG. 2, the description of the mounting machine 10 will be continued. In the mounting machine 10, the front-side image reading unit 90 is disposed between the component supply units 50 arranged in parallel in the X direction on the front (+ Y) side as described above, and also on the rear (−Y) side. Similarly, a rear side image reading unit 90 is disposed. Each image reading unit 90 includes an illumination unit composed of a large number of LEDs (Light Emitting Diodes) and a line sensor. Among these components, the line sensor is provided in the direction (Y-axis direction) orthogonal to the arrangement direction (X-axis direction) of the suction nozzles 61 with the imaging surface of the CCD solid-state imaging element facing upward. Therefore, a component image of the lower surface of the electronic component sucked by each suction nozzle 61 in a one-dimensional manner through a slit portion formed in the illumination portion is captured.

  The mounting machine 10 is provided with a head unit driving mechanism 70 in addition to the substrate transport mechanism 20. The head unit driving mechanism 70 is a mechanism for moving the head unit 60 in the X-axis direction and the Y-axis direction (directions orthogonal to the X-axis and Z-axis directions) over a predetermined range of the base 11. Then, the electronic component sucked by the suction nozzle 61 by the movement of the head unit 60 is transported from the position above the component supply unit 50 to the position above the substrate 30. That is, the head unit driving mechanism 70 has a mounting head support member 71 extending in the X-axis direction, and the mounting head support member 71 supports the head unit 60 so as to be movable along the X-axis. . The mounting head support member 71 is supported at both ends by a fixed rail 72 in the Y-axis direction positioned above the substrate transport mechanism 20, and is movable along the fixed rail 72 in the Y-axis direction. . Further, the head unit drive mechanism 70 has an X-axis servo motor 73 as a drive source for driving the head unit 60 in the X-axis direction, and a Y-axis servo motor 74 as a drive source for driving the head unit 60 in the Y-axis direction. is doing. The motor 73 is connected to the ball screw 75, and the head unit 60 is driven in the X-axis direction via the ball screw 75 when the motor 73 is operated in accordance with an operation command from the controller 40 (FIG. 1). On the other hand, the motor 74 is connected to the ball screw 76, and the mounting head support member 71 is moved via the ball screw 76 by operating the motor 74 in accordance with an operation command from the arithmetic processing unit 41 (FIG. 1). Driven in the axial direction.

  In this head unit 60, eight mounting heads (not shown) extending in the vertical direction Z are arranged in a line at equal intervals in the X-axis direction (the direction in which the substrate 30 is transferred by the substrate transfer mechanism 20). A suction nozzle 61 is attached to each tip of the mounting head. Mounted on the head unit 60 are an R-axis motor 66 that rotates each mounting head around the Z-axis, and a Z-axis motor 65 that raises and lowers each mounting head in the Z-axis direction. The head unit driving mechanism 70 causes the head unit 60 to transport the electronic component to the substrate 30 while being sucked and held by the suction nozzle, and to transfer the electronic component to a predetermined position with the mounting direction of the electronic component being a predetermined direction.

  The head unit driving mechanism 70 moves the head unit 60 above the component supply unit 50, and the suction nozzle 61 is positioned at a component suction position above the feeder on which the suction target component is mounted. 61 descends, the tip of the suction nozzle 61 comes into contact with and holds the electronic component in the component storage recess 50 located at the component supply position, and the suction nozzle 61 rises. This suction operation is sequentially performed on the plurality of suction nozzles 61. In this way, the head unit 60 is conveyed above the substrate 30 while the plurality of electronic components are adsorbed and held by the respective adsorbing nozzles 61, and the electronic components are adsorbed to the adsorbing nozzles 61 by passing over the image reading unit 90 on the way. The state image is captured, and each electronic component is transferred onto the substrate 30 in each predetermined direction at each predetermined position.

  Further, in the head unit 60 configured as described above, the substrate recognition cameras 62 and 63 are fixed with the imaging surfaces facing downward on the respective side surfaces on both sides in the X-axis direction. These board recognition cameras 62 and 63 have a function of recognizing the board position and board direction by photographing a plurality of fiducial marks on the board 30 on the mounting work position. Based on the image relating to the substrate and the suction state image of the electronic component, each of the position of the head unit 60 in the X-axis direction, the position of the X-axis direction, and the position of the suction nozzle 61 in the R-axis direction when the electronic components are transferred to the substrate 30. Correction is performed, and each electronic component is transferred to the substrate 30 in each predetermined direction at each correct predetermined position regardless of the substrate position deviation and the component suction position deviation. Further, by moving the head unit 60 above the component supply position of the feeder 51, it is possible to take an image of components fed from the feeder 51 by the substrate recognition cameras 62 and 63, a component storage recess of the tape, and the like from above. .

  One tape recovery device 80 is provided for each component supply unit 50. As shown in FIG. 4, each tape collecting device 80 is disposed between the mounting machine main body and the reel holding base 523 of the feeder mounting carriage 52 and in the space below the feeder 51. Each tape collection device 80 has a collection main body 81, and an empty carrier tape CR sent from the tape feeder 51 through the opening 82 provided in the center of the upper surface of the collection main body 81 is placed inside the collection main body 81. Guided. Further, a guide member 83, a cutting mechanism 84, and a recovery box 85 are arranged in the recovery body 81. That is, a guide member 83 is provided immediately below the opening 82 to guide the empty carrier tape CR downward. A cutting mechanism 84 is provided on the lower end side of the guide member 83. This cutting mechanism 84 includes one disk-shaped rotary blade 84a fixed to one rotary shaft and another disk-shaped fixed to another rotary shaft in order to efficiently and efficiently cut the empty carrier tape CR. The rotary blade 84b is provided, and the rotary blades 84a and 84b are arranged so that the peripheral end portions of these rotary blades can slide with each other. Then, both the rotary blades 84a and 84b move in the X direction while sliding and rotating, so that the empty carrier tapes CR respectively sent from the tape feeders 51 arranged in the X direction are collectively put on the empty carrier tape CR. Cutting is possible in the X direction substantially orthogonal to the longitudinal direction. The empty carrier tape CR cut in this way is dropped and collected in a collection box 85 disposed below the cutting mechanism 84 by its own weight. Reference signs P1, P2, and P3 in FIG. 4 indicate a cutting position, a cutting possible position, and a cutting limit position, respectively. Of these, the “cutting limit position” is particularly important. As described above, when the leading edge of the empty carrier tape CR exceeds the cutting limit position, it reaches the bottom of the collection box 85, the deflection of the empty carrier tape CR occurs in the collection box 85, or the empty carrier tape CR is entangled. May cause. That is, the cutting limit position P3 indicates a limit position for preventing the above-described problem from occurring.

  Next, the electrical configuration of the mounting machine 10 will be described with reference to FIG. The mounting machine 10 is provided with a controller 40 that controls the entire mounting machine. The controller 40 includes an arithmetic processing unit 41, a storage unit 42, a motor control unit 43, an image processing unit 44, an external input / output unit 45 for controlling external devices such as a cutting mechanism 84, and server communication control. Part 46. The arithmetic processing unit 41 is constituted by a CPU or the like, and controls each part of the mounting machine according to a production program stored in advance in the storage unit 42 and repeatedly executes a mounting group described later to mount components on the board. .

  In addition to the X-axis servo motor 73 and the Y-axis servo motor 74, the motor control unit 43 includes a Z-axis motor 65 that drives the suction nozzles 61 to move up and down in the head unit 60, and rotates the suction nozzles 61 about the vertical axis. An R-axis motor 66 is electrically connected to drive and control each motor. Each of the motors 65, 66, 73, and 74 is provided with an encoder (not shown) that outputs a pulse signal corresponding to the rotation state of the motor. The pulse signal output from each encoder is configured to be captured by the controller 40, and the arithmetic processing unit 41 that receives these signals acquires information on the rotation amount of each of the shaft motors 65, 66, 73, 74, The suction motor 61 can be moved to any position on the base 11 by controlling the motors 65, 66, 73, and 74 along with the motor controller 43.

  In addition, board recognition cameras 62 and 63 and an image reading unit 90 are electrically connected to the image processing unit 44, and imaging signals output from these are respectively taken into the image processing unit 44. Then, in the image processing unit 44, the analysis of the component image and the analysis of the board image are performed based on the captured imaging signal.

  In the mounting machine 10, a server communication control unit 46 is provided to exchange various data such as a production program and a pitch feed amount with the control device (server) 1. Further, reference numeral 47 in the figure denotes a display / operation unit for displaying a production program, a correlation data list, and the like, and for inputting information such as various data and commands to the controller 40 by an operator.

  Next, the operation of the component mounting system configured as described above will be described with reference to FIGS. FIG. 5 is a flowchart showing a procedure for obtaining the optimum drive pattern of the cutting mechanism. FIG. 6 is a diagram schematically showing the operation of the mounting machine and the tape collecting device. Further, FIG. 7 is a schematic diagram showing a procedure for obtaining an optimum driving pattern of the cutting mechanism. In this component mounting system, the arithmetic processing unit 2a of the control device 1 creates a production program based on board data such as a feed pitch for each component, a component mounting order, and a component suction order (step S1). By controlling the mounting machine 10 according to this production program, it is possible to repeat the mounting group.

  More specifically, the “mounting group” includes a plurality of suction nozzles 61 mounted on the head unit 60, from the component extraction from the tape TP to the component mounting on the substrate 30. 6 represents an operation including the operation of moving the head unit 60 from above the substrate 30 to above the component supply unit 50, and as shown in the uppermost column of FIG. 6, the head unit 60 is moved to the suction position. This includes movement, component suction by the suction nozzle 61, component recognition by the image reading unit 90, and component mounting (component mounting) on the substrate 30 by the head unit 60. Note that when the suction nozzle 61 is lifted, the tape TP on which the component has been sucked is driven to drive the sprocket 513 and the take-off mechanism 514 to feed the tape for one pitch of the component housing recess. This tape feed is also included in the mounting group. The mounting group is executed a plurality of turns (= a plurality of times) according to the production program, whereby the mounting of all components on the board 30 is completed. In the figure, the (N-1) th turn, the Nth turn, and the (N + 1) th turn of all the turns are extracted to schematically show the movement of the empty carrier tape CR. For example, as shown in the middle of the figure, when the cutting operation by the cutting mechanism 84 is not executed during the (N−1) turn, the N turn, and the (N + 1) turn, the empty carrier after the components mounted by the mounting group are extracted. The tape CR is sent to the tape collecting device 80 every time the parts are sucked, and the tip of some of the empty carrier tape CR exceeds the cutting limit position P3.

  In order to prevent this, it is preferable to drive the cutting mechanism 84 at the turn before the (N + 1) turn, particularly at the immediately preceding N turn as shown at the bottom of the figure. By doing so, the number of times of cutting can be reduced while reliably preventing the empty carrier tape CR from exceeding the cutting limit position P3 and causing a problem. Therefore, in the present embodiment, the first mounting group (the (N + 1) th mounting group in the case shown in FIG. 6) is predicted that the leading end of the empty carrier tape CR reaches the cutting limit position P3 during the execution of the mounting group. The cutting mechanism 84 is driven in parallel with the second mounting group executed before the first mounting group. As a result, the empty carrier tape CR is cut all at once with the effort that the leading end of the empty carrier tape CR reaches the cutting limit position P3. In this embodiment, in order to minimize the cycle time by optimizing the collective cutting timing of the empty carrier tape CR by the cutting mechanism 84 in this embodiment, the arithmetic processing unit 2a of the control device 1 executes steps S2 to S9. . Thus, in the present embodiment, the arithmetic processing unit 2a functions as the “control unit” of the present invention.

  In step S2, a so-called most frequent drive pattern that drives the cutting mechanism 84 in every turn is created. For example, when the total number of turns is “7”, “pattern 1” shown in FIG. 7 corresponds to the most frequent drive pattern. Further, the mounting time A1 required when all mounting groups are executed with the most frequent drive pattern is set as the initial value of the mounting time N (step S3).

  When the cutting process is performed with the drive pattern in parallel with the execution of all mounting groups by the simulation based on the production program while changing the drive pattern in step S5, at least one as shown in the middle right column of FIG. It is determined whether or not the leading end of the empty carrier tape CR reaches the cutting limit position P3 (step S6). If it is determined that the tip of the all-empty carrier tape CR has not reached the cutting limit position P3 and the “tape cutting result” is OK (“NO” in step S6), all mounting groups are executed. The time A (A2, A3,...) Required for the calculation is calculated (step S7). When the time A thus obtained is shorter than the mounting time N (“YES” in step S8), the mounting time N is rewritten to the time A and the current drive pattern is stored as the optimum drive pattern of the cutting mechanism 84. 2b is temporarily stored (step S9). By executing these series of operations (steps S5 to S9) for all the drive patterns, an optimum drive pattern that minimizes the mounting time N is obtained. In this embodiment, the optimum drive pattern is incorporated in the production program and stored in the storage unit 2b. In addition, the production program in which the optimum drive pattern is incorporated is transmitted to the mounting machine 10, and the mounting machine 10 drives the cutting mechanism 84 with the optimum drive pattern while executing the mounting group based on the production program, and performs component mounting and cutting.・ Recovery processing is performed in parallel.

  As described above, according to the present embodiment, the first mounting group (for example, (N + 1) in the example of FIG. 6) in which the leading end of the empty carrier tape CR is expected to reach the cutting limit position P3 during execution of the mounting group. The empty carrier tape CR that exceeds the cutting position in parallel with the second mounting group (for example, the N-turn or (N-1) -turn mounting group in the example of FIG. 6) executed before the turn mounting group). It is cut and collected in the collection box 85. As described above, since the empty carrier tape CR is cut in a lump at the time when the leading edge of the empty carrier tape CR reaches the cutting limit position P3, the occurrence of the above-mentioned problem is surely prevented and the empty carrier tape CR is reliably secured. Moreover, it can be cut and collected well. In addition, by verifying all the drive patterns, the number of times of driving of the cutting mechanism 84 is suppressed as much as possible to shorten the mounting time N, and the cycle time can be shortened while reliably preventing the occurrence of the above-mentioned problems. it can. That is, if the period from the moment when the component suction is completed and the head unit is separated from the upper part of the component supply unit to the end of the mounting and the return to the component supply unit is T1, the time T2 required for cutting the tape is T1 < When T = T2, the cycle time can be surely shortened. Even when T1> T2, when the vibration due to the tape cutting adversely affects the main body of the mounting machine 10 or when the cutting mechanism 84 is driven by air pressure, the suction nozzle 61 is sucked by suction due to the consumption of air pressure during cutting. The air pressure to the pneumatic equipment (not shown) that supplies the pressure and the positive pressure for mounting decreases, and as a result, the cutting cannot be performed during the time T1, and the substantial T2 ′ becomes larger than T1, and according to the present embodiment, Cycle time can be shortened. Further, since the number of times of cutting the empty carrier tape CR is reduced, the life of the cutting mechanism 84 can be extended, and the running cost can be effectively reduced.

  In the above embodiment, the drive pattern (collective cutting timing of the empty carrier tape CR) is written in the production program, and the production program is stored in the storage unit 2b. The production program in the storage unit 2b may be transmitted from 1 to the mounting machine 10, and component mounting and tape collection may be performed using the production program. In this case, it is not necessary to set a drive pattern, and the processing efficiency can be improved.

  The cutting limit position P3 changes to a higher position as the amount of empty carrier tape CR that is cut and collected in the collection box 85 increases. The cutting limit position P3 in the determination of S6 in the flowchart of FIG. 5 is made higher as the number of turns in the number of turns becomes higher, and the higher the storage cross-section of the collection box 85, the higher the degree. Those previously set are used. In addition, when the worker temporarily stops the mounting machine and empties the collection box 85 during the mounting based on the production program, the flowchart of FIG. The production program is rewritten.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the first mounting group in which the leading end of the empty carrier tape CR reaches the cutting limit position P3 during the execution of the mounting group is obtained by performing the above verification for all the drive patterns. The method for obtaining the group is not limited to this, the first mounting group is obtained by simulation based on the production program, and the empty carrier tape CR is collectively cut in parallel with the second mounting group to be executed earlier. By doing so, the same effect as the above-described embodiment can be obtained. In particular, from the viewpoint of suppressing the number of disconnections, it is preferable that the mounting group executed immediately before the first mounting group is the second mounting group.

  In addition, when an error such as a lack of suction in the head unit 60, a component dropout, or a missing part due to a splicing failure in the tape feeder 51 provided in the component supply unit 50 occurs, the component mounting on the substrate 30 by the head unit 60 is performed. It is not executed according to the production program. When the execution of the mounting group fails in this way, the controller 40 of the mounting machine 10 operates the cutting mechanism 84 to cut all the empty carrier tapes CR that exceed the cutting position P1 in a lump and collect the collection box 85. It is desirable to collect it. By interrupting the cutting operation in this manner, it is possible to reliably prevent the leading end of the empty carrier tape CR from exceeding the cutting limit position P3.

  Further, when removing the tape feeder 51, resetting the operation, restarting the component mounting system, etc., it is impossible to continue the mounting group based on the production program. In such a case, the current length of the empty carrier tape CR is unknown. Therefore, when the mounting group is executed based on the same production program or another production program, it is desirable to collectively cut the empty carrier tape CR as in the case of the mounting group failure.

  Further, when performing batch cutting (third step) of the empty carrier tape CR as described above, it is desirable to obtain the optimum drive pattern again and adjust the execution timing of the batch cutting. Thereby, the tape recovery after the timing adjustment can be efficiently performed as before.

  Furthermore, in the above embodiment, the cutting mechanism 84 using the rotary blades 84a and 84b is adopted in order to collectively cut the empty carrier tape CR, but the configuration of the cutting mechanism 84 is not limited to this, for example, You may apply this invention with respect to the component mounting system which has the cutting mechanism using the elongate fixed blade and movable blade described in patent document 1. FIG.

  Note that the production program relating to the cutting timing of the empty tape once created and written in the storage unit 42 of the mounting machine 10 is executed in correspondence with the setup of the feeder 51 in the mounting machine 10 and the removal of the empty tape in the recovery body 80. The That is, the controller 40 of the mounting machine 10 serves as a control unit for the cutting mechanism 81. However, the cutting device 81 may be directly controlled by the control device 1.

  In the above embodiment, the empty tape cutting operation timing simulation is performed by the control device 1 connected to the mounting machine 10 via a LAN. However, the simulation is performed by an independent computer, and the resulting program is a CD-ROM. It is also possible to write in the storage unit 42 of the mounting machine 10 via

1 is a block diagram showing an embodiment of a component mounting system according to the present invention. It is a top view which shows schematic structure of a mounting machine. It is the figure which looked at the mounting machine of FIG. 2 from the front side. It is a figure which shows the components supply part and tape collection | recovery apparatus with which the mounting machine of FIG. 2 was mounted | worn. It is a flowchart which shows the procedure which calculates | requires the optimal drive pattern of a cutting mechanism. It is a figure which shows typically operation | movement of a mounting machine and a tape collection | recovery apparatus. It is a schematic diagram which shows the procedure which calculates | requires the optimal drive pattern of a cutting mechanism.

Explanation of symbols

1 ... Control device (control means)
2 ... Controller (control means)
2a ... arithmetic processing unit (control means)
DESCRIPTION OF SYMBOLS 30 ... Board | substrate 50 ... Component supply part 51 ... Tape feeder 80 ... Tape collection apparatus 84 ... Cutting mechanism 85 ... Collection box (collection means)
CR: Empty carrier tape P3: Cutting limit position

Claims (7)

The operation from picking up the component from the tape to mounting the component on the board by the mounting machine, equipped with multiple tape feeders that supply the tape containing the components, is defined as the mounting group, and the mounting group is repeatedly executed according to the production program. In parallel with this, a tape collecting method for sending an empty tape after taking out the component to the collecting means side via the cutting position of the cutting mechanism, cutting at the cutting position and collecting it to the collecting means,
A first step of obtaining a first mounting group based on the production program, in which a leading end of the empty tape is expected to reach a cutting limit position preset on the collecting means side with respect to the cutting position during execution of the mounting group. Process,
A second step of cutting all the empty tapes that have exceeded the cutting position in parallel with the second mounting group that is executed before the first mounting group by the cutting mechanism and collecting them in the collecting means; The tape collection method characterized by comprising.   The tape collecting method according to claim 1, wherein a timing for executing the second step is written in the production program before performing component mounting and tape collecting, and component mounting and tape collecting are performed based on the production program.   3. The third step of further comprising a third step of operating the cutting mechanism to cut all the empty tapes beyond the cutting position in a lump and collect them in the collecting means when execution of the mounting group fails. The tape collection method as described.   When the mounting group is resumed based on the production program or another production program after the mounting group based on the production program cannot be continuously executed, the cutting mechanism is operated to empty the tape beyond the cutting position. The tape recovery method according to claim 1 or 2, further comprising a third step of cutting all of the above together and recovering them to the recovery means.   5. The tape collecting method according to claim 3, wherein when the third step is executed, the first step is executed again to obtain the first mounting group again, and the execution timing of the second step is adjusted. A head unit drive that allows the head unit to move between a head unit having a head that can adsorb and detach components, and an upper part of a component that is arranged on the base and a substrate that is held on the base. The operation from the mechanism and the component extraction from the tape arranged in the component supply unit to the component mounting on the board is set as a mounting group, the head unit driving mechanism is controlled, and the mounting group is repeatedly executed according to the production program. Control means,
The control means is
With respect to a tape recovery device provided near the base and having a recovery device for recovering the empty tape fed through the cutting position of the cutting mechanism and a cutting device for cutting the empty tape after taking out the parts Control the drive timing of the cutting mechanism,
The second mounting executed before the first mounting group, which is predicted that the leading end of the blank tape reaches the cutting limit position preset on the collecting means side with respect to the cutting position during the mounting group. A mounting machine, wherein the cutting mechanism is driven in parallel with the group to cut all the empty tapes exceeding the cutting position in a lump and collect them in the collecting means. A plurality of feeders that supply parts by feeding out a tape containing the parts are mounted, and the operation from taking out the parts from the tape to mounting the parts on the board is set as a mounting group, and the mounting group is repeatedly executed according to the production program. A mounting machine;
In parallel with the execution of the mounting group, a tape recovery device that cuts the empty tape after taking out the components sent to the recovery means side via the cutting position of the cutting mechanism at the cutting position and recovers it to the recovery means; ,
Control means for controlling the drive timing of the cutting mechanism,
The control means is executed before the first mounting group, in which the leading end of the empty tape is expected to reach a cutting limit position preset on the collecting means side with respect to the cutting position during execution of the mounting group. A component mounting system characterized in that, in parallel with the second mounting group, the cutting mechanism is driven to collectively cut all the empty tapes exceeding the cutting position and collect them in the collecting means.

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