JP4722715B2 - socket - Google Patents

Description

  The present invention relates to a socket.

  Conventionally, when a semiconductor device such as an IC or an LSI (Large Scale Integrated Circuit) is connected to a circuit board such as a printed wiring board, the terminal is electrically connected to the circuit board via a socket attached to the circuit board. It is designed to be electrically connected to the trace. When inspecting the electrical characteristics of the packaged semiconductor device in the assembly process, the circuit board for inspection in which the circuit for inspection is formed on the terminal of the packaged semiconductor device through the socket for the semiconductor inspection device (For example, refer to Patent Document 1).

  FIG. 8 is a cross-sectional view of a conventional socket.

  In the figure, reference numeral 301 denotes a socket used in a semiconductor inspection apparatus, which electrically connects each terminal 302a of a packaged semiconductor device 302 and each electrode 303a of an inspection circuit board 303 connected to a semiconductor inspection apparatus (not shown). The semiconductor device 302 is inspected for electrical characteristics.

  Here, the socket 301 includes a housing 311 formed of an insulating material such as a resin and having a plurality of insertion holes (cuts) formed at predetermined intervals so as to correspond to the respective terminals 302 a of the semiconductor device 302. A probe (probe) is attached inside each of the insertion holes. The probe is commonly referred to as a pogo pin, a spring probe, or the like, and is formed of a conductive cylinder 312 and a conductive material, and is inserted into the guide cylinder 312 from the upper and lower ends. First and second probe pins 315 and 316 are provided. A spring (not shown) is disposed in the guide tube 312, and the spring is interposed between the first probe pin 315 and the second probe pin 316. And since the said spring expands and contracts, the space | interval of the 1st probe pin 315 and the 2nd probe pin 316 can change, and the whole length of a probe can expand and contract. As a result, even if there is distortion (distortion) on the lower surface of the semiconductor device 302 or the upper surface of the inspection circuit board 303, the distortion is absorbed by the expansion and contraction of the entire length of the probe, and the terminals 302a of the semiconductor device 302 The electrodes 303a of the inspection circuit board 303 can be electrically connected.

The socket 301 includes a conductive sheet 317 disposed between the first probe pins 315 and the inspection circuit board 303. The conductive sheet 317 is formed on one surface of a resinous elastic sheet 317a in which a large number of minute conductive balls are embedded, and is in contact with the first probe pin 315. And the second electrode 317c formed on the other surface of the elastic sheet 317a and in contact with the electrode 303a of the inspection circuit board 303.
JP 2003-84047 A

  However, in the conventional socket 301, since the probe includes the guide tube 312, the first and second probe pins 315 and 316, and the spring, the structure is complicated and the cost is increased. Further, since the probe has a structure in which a spring is interposed between the first probe pin 315 and the second probe pin 316, the length thereof is 3 to 5 [mm] or more. As a result, the electrical characteristics such as impedance deteriorate. Furthermore, since the probes are enlarged, the distance between the probes, that is, the pitch of the probes cannot be sufficiently narrowed.

  However, a socket that absorbs distortion without using a probe that expands and contracts has also been proposed. In the socket, a conductive film in which conductive terminals are embedded in an elastomer such as gel or rubber is used. However, in such a socket, depending on the material of the elastomer, the elastomer may become hard under a low temperature environment, and the elastomer may deteriorate under a high temperature environment. Further, since the slipperiness of the elastomer is inferior, the workability of the work of connecting the semiconductor devices is deteriorated.

  The present invention solves the problems of the conventional socket and absorbs the distortion of the connection target device and the connection target circuit board by connecting the connection pin to the conductive portion of the film made of porous fluororesin. Provides a socket that can reduce the cost by simplifying the structure, shortening the length of the electrical conduction path, improving the electrical characteristics, and narrowing the pitch of the electrical conduction path The purpose is to do.

Therefore, in the socket of the present invention, a porous fluororesin having an electrode hole penetrating in the thickness direction and a conductive portion formed by adhering a conductive metal to the resin fiber on the inner wall of the electrode hole and possible shrinkage in the thickness direction the film made of, with a connection pin receiving hole penetrating in the thickness direction, faces the one surface the film, the other surface opposite to the surface on which the terminal is arranged to be connected device a socket for chromatic and the plate-like frame, a connecting pin you electrically connect the conductive portion of the terminal and the film before SL connected device, the connecting pin, a flange portion, one face of the flange portion One end portion having a smaller diameter than the flange portion projecting from the flange portion, and the other end portion having a smaller diameter than the flange portion projecting from the other surface of the flange portion, and the one end portion is accommodated in one end of the electrode hole of the film. Conductive part Contacted and electrically connected, one surface of the flange portion is opposed to one surface of the film, and the other end portion is accommodated in a connection pin accommodation hole of the plate-like frame so as to be movable in the axial direction, and the connection object It is electrically connected to a terminal of the device, and the other surface of the flange portion faces one surface of the plate-like frame .

In another socket of the present invention further includes a conductive through hole penetrating in the thickness direction, one surface facing the other surface of the film, the electrical end of the through hole in the conductive portions of the film A substrate member connected to the substrate.

  In still another socket according to the present invention, the plate-like frame further includes a connection portion connected to the board member, the other surface of the board member faces the circuit board to be connected, and the other end of the through hole is It is electrically connected to the conductive trace of the circuit board to be connected.

In yet another socket of the present invention, furthermore, the plate-like frame is connected to a connection target circuit board, the other surface of said film opposite to the connection target circuit board, opposite to the connecting pins of the conductive portion of the film Is electrically connected to the conductive trace of the circuit board to be connected.

  In still another socket according to the present invention, the number of the plate-like frames is two, and each plate is disposed to face both sides of the film, and one plate-like frame is connected to the other plate-like frame. A connection part for connection is provided.

  According to the present invention, in the socket, the connection pin is connected to the conductive portion of the film made of porous fluororesin. Therefore, the distortion of the connection target device or the connection target circuit board can be absorbed, the structure can be simplified and the cost can be reduced, and the length of the electrical conduction path can be shortened to improve the electrical characteristics. And the pitch of the electrical conduction paths can be narrowed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a socket in the first embodiment of the present invention, FIG. 2 is an exploded view of the socket in the first embodiment of the present invention, and FIG. 3 is a first embodiment of the present invention. It is a perspective view which shows the anisotropic conductive film in.

  In the figure, reference numeral 10 denotes a socket according to the present embodiment, which is connected to the top plate 12 as a substantially square or rectangular plate-shaped frame and the periphery of the top plate 12 and is perpendicular to the top plate 12. It has a guide frame 11 with a side plate 13 that extends. A part of the side plate 13 is formed with a connecting portion 13a that is connected to a substantially square or rectangular plate-like substrate member 31, and between the substrate member 31 and the top plate 12 connected by the connecting portion 13a. In addition, an anisotropic conductive film 21 as a plate-like film having a substantially square or rectangular shape is sandwiched.

  In the socket 10, the top surface of the top plate 12 faces the surface on which the terminals of the connection target device are disposed, and the bottom surface of the board member 31 faces the surface on which the electrodes of the connection target circuit board (not shown) are disposed. In addition, it is attached to the circuit board to be connected, and is used to electrically connect each terminal of the apparatus to be connected and a corresponding conductive trace of the circuit board to be connected. Here, the connection target device is, for example, a semiconductor device such as an IC or an LSI, but may be any kind of electric device or electronic device as long as it has a terminal on at least one surface. The terminal is, for example, a solder ball, a flat electrode pad, an elongated plate-like lead, a needle-like electrode pin, or the like, but may be in any form. In the present embodiment, a case will be described in which the device to be connected is a semiconductor device having a plurality of solder balls as terminals on the lower surface. The circuit board to be connected is, for example, a circuit board for inspection of a semiconductor inspection apparatus, but is a wiring circuit board such as a mother board or daughter board in an electronic device such as a computer, a television, a game machine, a camera, or a navigation device. It may be any kind of circuit board.

  In the present embodiment, the expressions indicating directions such as upper, lower, left, right, front, rear, etc. used for explaining the configuration and operation of each part of the socket 10 are not absolute but relative. This is appropriate when each part of the socket 10 has the posture shown in the figure, but when the posture changes, it should be interpreted according to the change in posture. .

  The guide frame 11 is integrally formed of an insulating material such as a synthetic resin and penetrates the top plate 12 in the thickness direction as shown in FIG. 2, that is, the top surface of the top plate 12. And a plurality of connection pin accommodating holes 14 formed so as to penetrate the lower surface and the lower surface. A connection pin 15 made of a conductive material such as metal is accommodated in the connection pin accommodation hole 14.

  Here, the connection pin 15 has an upper end portion 15a, a flange portion 15b having a diameter larger than that of the upper end portion 15a, and a lower end portion 15c having a diameter smaller than that of the flange portion 15b. The upper end portion 15a is inserted into the connection pin accommodation hole 14 from the lower surface side of the top plate 12, and is accommodated so as to be movable in the axial direction, that is, the vertical direction. Further, since the flange portion 15b has a larger diameter than the connection pin accommodating hole 14, the flange portion 15b abuts on the lower surface of the top plate 12 and functions as a stopper. In the illustrated example, the upper end portion 15a has a shape suitable when the terminal of the device to be connected is a solder ball, has a substantially cylindrical shape, the periphery of the upper end surface protrudes, the center is recessed, and the inner surface is Since it has a shape that inclines toward the center and becomes narrower as it goes down, it can easily accommodate the solder balls. When the upper end portion 15 a is accommodated in the connection pin accommodation hole 14, the periphery of the upper end surface protrudes from the upper surface of the top plate 12.

  The shape of the upper end portion 15a can be changed as appropriate according to the type of terminal of the connection target device. For example, when the terminal of the connection target device is a sharp pin as in the case of PGA (Pin Grid Array), it is desirable that the upper end surface be a spherical recess. Further, when the terminal of the connection target device is a flat pad, it is desirable that the upper end surface is a flat or spherical convex portion. Furthermore, when the terminal of the device to be connected is a flat pad, the entire upper end portion 15a can be shaped like a cone with a sharp tip.

  In the present embodiment, the anisotropic conductive film 21 is a known one (for example, see Japanese Patent Application Laid-Open No. 2005-46993).

  The substrate member 31 is integrally formed of an insulating material such as a synthetic resin, and as shown in FIG. 2, penetrates the substrate member 31 in the thickness direction, that is, the upper surface of the substrate member 31 and There are a plurality of conductive through holes 32 formed so as to penetrate the lower surface. The through holes 32 are formed at positions corresponding to the electrode holes 22 with the same arrangement and pitch as the electrode holes 22. That is, it is formed at a position corresponding to each of the connection pin accommodation holes 14 with the same arrangement and pitch as the connection pin accommodation holes 14.

  The through hole 32 has the same structure as a normal through hole formed in a printed circuit board such as a mother board or a daughter board in an electronic device, and a conductive metal is adhered to the surface of the inner wall by electroless plating or the like. ing. Therefore, the through hole 32 is made of a conductive metal and provides a cylindrical conductive trace that connects the upper surface and the lower surface of the substrate member 31. The conductive metal is also attached to portions surrounding the through hole 32 on the upper surface and the lower surface of the substrate member 31 to form a flange-shaped portion, so that the conductive trace has flanges connected to both ends. It becomes a cylindrical shape. The flange-shaped portion increases the range in which the through-hole 32 can come into contact with the conductive member of another member adjacent to the upper surface and the lower surface of the substrate member 31. Even if the position of the conductive portion 23 is slightly shifted, the conductive portion 23 can be electrically connected.

  In the example shown in FIG. 2, bumps 33 made of a conductive metal are formed at the end portions of the through holes 32 on the upper surface of the substrate member 31. The bump 33 is connected to the conductive trace, has a truncated cone shape, and protrudes upward from the upper surface of the substrate member 31. The bump 33 has a diameter enough to be accommodated in the electrode hole 22 of the anisotropic conductive film 21, and enters the electrode hole 22 to align the through hole 32 and the conductive portion 23. Plays the function to be performed. The bump 33 can be omitted as appropriate.

  A solder ball 41 is attached to the lower surface of the substrate member 31. The solder ball 41 has a diameter larger than the diameter of the through hole 32, is attached to the end of the through hole 32 on the lower surface of the board member 31, and is electrically connected to the corresponding conductive trace of the circuit board to be connected. It functions as a connection terminal. The solder ball 41 can be omitted, and the end of the through hole 32 can be directly connected to the corresponding conductive trace of the circuit board to be connected. In this case, it is desirable that the end portion of the through hole 32 and the conductive trace are bonded by a conductive bonding agent such as solder. Further, instead of the solder balls 41, terminals having other shapes such as a flat electrode pad, an elongated plate-like lead, and a needle-like electrode pin can be connected to the end of the through hole 32.

  Next, the operation when the connection target device is connected to the connection target circuit board via the socket 10 will be described.

  FIG. 4 is a first cross-sectional view showing the operation of attaching the connection target device to the connection target circuit board via the socket in the first embodiment of the present invention, and FIG. 5 is the connection in the first embodiment of the present invention. It is a 2nd sectional view showing operation which attaches a target device to a connection target circuit board via a socket.

  4 and 5, reference numeral 55 denotes a circuit board to be connected, and on the upper surface, flat connection pads 56 are formed as terminals connected to conductive traces (not shown). The connection pads 56 are formed at positions corresponding to the solder balls 41 with the same arrangement and pitch as the solder balls 41 on the lower surface of the substrate member 31. Then, it is assumed that the socket 10 is attached to the connection target circuit board 55 in advance by connecting each solder ball 41 to the corresponding connection pad 56. Reference numeral 51 denotes an apparatus to be connected, which includes a plurality of solder balls 52 as terminals on the lower surface. The solder balls 52 are formed at positions corresponding to the connection pins 15 with the same arrangement and pitch as the connection pins 15 of the top plate 12.

  In the socket 10, as shown in FIG. 4, the lower end portion 15 c of the connection pin 15 is accommodated in the upper end of the electrode hole 22, and the conductive portion 23 formed on the inner wall of the connection pin 15 and the electrode hole 22. Is connected. Further, a bump 33 formed at the upper end of the through hole 32 is accommodated at the lower end of the electrode hole 22, and the through hole 32 and the conductive portion 23 formed on the inner wall of the electrode hole 22 are connected. A solder ball 41 is connected to the lower end of the through hole 32. Thereby, each connection pin 15 is in a state of being electrically connected to the corresponding connection pad 56 via the conductive portion 23, the through hole 32, and the solder ball 41.

  And as FIG. 4 shows, the connection object apparatus 51 and the connection object circuit board 55 which attached the socket 10 were moved relatively, and the lower surface of the connection object apparatus 51 and the upper surface of the top plate 12 were made to oppose. State. In this case, the lower surface of the connection target device 51 and the upper surface of the top plate 12 are substantially parallel, and the positions of the solder balls 52 on the lower surface of the connection target device 51 and the connection pins 15 of the top plate 12 are substantially aligned. Aligned.

  Subsequently, the connection target device 51 and / or the connection target circuit board 55 is moved to the other side, and the solder balls 52 on the lower surface of the connection target device 51 are moved over the upper end portion 15a of the connection pin 15 as shown in FIG. Press against the end face. In this case, the upper end surface of the upper end portion 15a has a shape in which the periphery protrudes, the center is recessed, the inner side surface is inclined toward the center, and becomes narrower toward the bottom. A self-alignment effect is exhibited when pressing against the upper end surface.

  That is, even if the central axis extending in the vertical direction of the solder ball 52 and the central axis extending in the vertical direction of the upper end portion 15a of the connection pin 15 do not coincide with each other, the solder ball 52 is positioned at the upper end surface of the upper end portion 15a. The center axis extending in the vertical direction of the solder ball 52 and the upper and lower portions of the upper end portion 15a are combined by the combination of the cross-sectional shape of the solder ball 52 and the cross-sectional shape of the upper end surface of the upper end portion 15a. The central axis extending in the direction automatically matches. Therefore, even if the connection target device 51 and the connection target circuit board 55 are not perfectly aligned in the horizontal direction, that is, in the horizontal direction, all the solder balls 52 are placed on the corresponding upper ends 15a by the self-alignment effect. The connection target device 51 can be securely connected to the connection target circuit board 55 via the socket 10 by fitting (clamping) into the recess of the end surface.

  A downward force is applied to the connection pin 15 by pressing the solder ball 52 on the lower surface of the connection target device 51 against the upper end surface of the upper end portion 15 a of the connection pin 15. Here, the upper end 15a of the connection pin 15 is accommodated in the connection pin accommodation hole 14 of the top plate 12. However, since the connection pin 15 is gently accommodated and can be moved in the vertical direction, it is applied by the solder ball 52. The connecting pin 15 moves downward with respect to the top plate 12 by the downward force. In this case, since the anisotropic conductive film 21 has a contraction property in the thickness direction, the anisotropic conductive film 21 contracts by receiving a downward force via the flange portion 15b of the connection pin 15, and the lower portion of the connection pin 15 Absorb the movement to. That is, the upper surface of the anisotropic conductive film 21 is displaced downward by the flange portion 15 b of the connection pin 15.

  Incidentally, as shown in FIG. 5, the envelope surface connecting the lower surfaces of the solder balls 52 (in FIG. 5, it is a cross-sectional view and is shown as an envelope) may be distorted rather than uniform. is there. The envelope surface is a surface that functions as a connection surface of the connection target device 51, and the distortion of the connection surface is caused by distortion of the lower surface of the connection target device 51 itself, unevenness of the size of each solder ball 52, and the like. . In this case, the connection pin 15 that is in contact with the solder ball 52 whose lower surface is positioned below is moved downward than the connection pin 15 that is in contact with the solder ball 52 whose lower surface is positioned higher. That is, due to the distortion of the connection surface of the connection target device 51, the downward movement amount of the connection pin 15 becomes non-uniform. However, such non-uniformity in the amount of movement is absorbed when the anisotropic conductive film 21 contracts. That is, in the anisotropic conductive film 21, the electrode hole 22 corresponding to the connection pin 15 having a large downward movement and the peripheral portion thereof are greatly contracted and the upper surface is greatly displaced downward, and the downward movement is small. The electrode hole 22 corresponding to the small connection pin 15 and its peripheral portion contract slightly, and the upper surface is displaced downward downward.

  The conductive portion 23 formed on the inner wall of the electrode hole 22 extends in the thickness direction of the anisotropic conductive film 21 regardless of whether or not the anisotropic conductive film 21 is contracted as described above. Functions as a conductive path. Therefore, each conductive portion 23 electrically connects the corresponding solder ball 52 and the corresponding through hole 32 regardless of the amount of contraction. Thereby, each of the solder balls 52 on the lower surface of the connection target device 51 is electrically connected to the corresponding connection pad 56 via the connection pin 15, the conductive portion 23, the through hole 32, and the solder ball 41 of the socket 10. It becomes a state.

  Thus, in the socket 10 in the present embodiment, the connection pin 15 is connected to the through hole 32 of the substrate member 31 through the anisotropic conductive film 21. Therefore, even when the connection surface of the connection target device 51 is distorted, the anisotropic conductive film 21 contracts to absorb the distortion, and the connection target device 51 is securely connected to the connection target circuit board 55 via the socket 10. Can be connected. Further, even when the connection surface of the connection target circuit board 55 is distorted, similarly, the anisotropic conductive film 21 contracts to absorb the distortion, and the connection target device 51 is connected to the connection target circuit via the socket 10. It can be reliably connected to the substrate 55.

  Further, the lower end portion 15c of the connection pin 15 is accommodated at the upper end of the electrode hole 22, and the conductive portion 23 formed on the side wall of the lower end portion 15c and the inner wall of the electrode hole 22 is also connected to the lower surface of the flange portion 15b and the electrode hole. Electrical connection is made by contact with the conductive portion 23 at the upper end of the contact 22, and the connection pin 15 and the conductive portion 23 are not fixed. Therefore, the distortion of the connection surface of the connection target device 51 is large, and the difference in the position of the lower surface of the adjacent solder balls 52 is large, thereby increasing the difference in the displacement amount of the corresponding connection pin 15 and increasing the anisotropic conductivity. Even if the upper surface of the film 21 is greatly deformed, the electrical contact between the connection pin 15 and the conductive portion 23 is not cut off. In this case, the anisotropic conductive film 21 is made of a highly slidable fluororesin and there is little friction between the lower surface of the flange portion 15b and the upper surface of the anisotropic conductive film 21, so that the connecting pin 15 moves smoothly. The upper surface of the anisotropic conductive film 21 can follow the deformation, and the lower end 15 c of the connection pin 15 does not come off the electrode hole 22.

  Further, the connection pin 15 is held in the socket 10 by having the upper end portion 15 a accommodated in the connection pin accommodation hole 14 of the top plate 12 and the lower end portion 15 c accommodated in the electrode hole 22. Since it is not fixed, it can be easily attached and detached. Therefore, it can change suitably to the connection pin 15 provided with the upper end part 15a of the shape according to the kind of terminal of the connection object apparatus 51. FIG. Even if the connection pin 15 is corroded or damaged, it can be easily replaced.

  Further, the conductive portion 23 is not an assembly of a plurality of components such as a spring and a guide tube, unlike a conventional probe called a pogo pin, a spring probe, etc. The structure of 10 can be simplified and the length in the vertical direction can be shortened. Therefore, the cost can be reduced, the length of the electrical conduction path is shortened, and the electrical characteristics such as impedance are improved. Further, the anisotropic conductive film 21 is made of porous ePTFE and has a low relative dielectric constant, so that the electrical characteristics of the conductive portion 23 are improved, and as a result, the electrical characteristics of the socket 10 as a whole are improved. Become good.

  Furthermore, the anisotropic conductive film 21 is made of ePTFE, has high thermal stability, and is stable in a range of about −120 to +260 [° C.], so that the temperature characteristics of the socket 10 are stable and a wide temperature range is achieved. Can be used in a range.

  Furthermore, the conductive portion 23 is not an assembly of a plurality of parts such as a spring and a guide tube, unlike a probe commonly called a conventional pogo pin, a spring probe, etc. The pitch can be narrowed. Therefore, it is possible to increase the density of the electrical conduction path, and it is possible to obtain the socket 10 corresponding to the connection target device 51 having terminals with a narrow pitch.

  Next, a second embodiment of the present invention will be described. In addition, about what has the same structure as 1st Embodiment, the description is abbreviate | omitted by providing the same code | symbol. The description of the same operation and the same effect as those of the first embodiment is also omitted.

  FIG. 6 is a perspective view showing a socket according to the second embodiment of the present invention.

  In the present embodiment, the socket 10 is connected to a flat cable 61 as a connection target circuit board. The flat cable 61 is a flexible printed circuit (FPC), a flexible flat cable (FFC), or the like, but may be of any type. The flat cable 61 includes wirings 62 as a plurality of conductive traces.

  Here, the socket 10 does not have the substrate member 31 including the through hole 32, and the lower surface of the anisotropic conductive film 21 is directly connected to the upper surface of the flat cable 61. The lower end of each conductive portion 23 of the anisotropic conductive film 21 is connected to the upper surface of the corresponding wiring 62. A bump similar to the bump 33 described in the first embodiment may be formed on the upper surface of the wiring 62, and the bump may enter the electrode hole 22 of the anisotropic conductive film 21. .

  The guide frame 11 includes a side plate 63 extending in a direction perpendicular to the top plate 12, and the side plate 63 is connected to a connection member 64 fixed to the upper surface of the flat cable 61. Here, in the socket 10 of the present embodiment, since the board member 31 is omitted, the vertical dimension of the side plate 63 is shorter than the vertical dimension of the side plate 13 in the first embodiment. It has become. The configuration of other points is the same as that of the first embodiment, and a description thereof will be omitted.

  Next, a third embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st and 2nd embodiment, the description is abbreviate | omitted by providing the same code | symbol. Also, the description of the same operations and effects as those of the first and second embodiments is omitted.

  FIG. 7 is a perspective view showing a socket according to the third embodiment of the present invention.

  The socket 10 in the present embodiment has a top plate 12 provided with connection pins 15 instead of the substrate member 31 provided with the through holes 32 below the anisotropic conductive film 21. That is, the anisotropic conductive film 21 is sandwiched from above and below by the two top plates 12. In this case, the upper and lower top plates 12 have the same configuration, but the connection pins 15 accommodated in the connection pin accommodation holes 14 are arranged to face in opposite directions on the upper and lower top plates 12. That is, in the lower top plate 12, the upper end portion 15 a is positioned on the lower side and is inserted into the connection pin accommodation hole 14 from the upper surface side of the top plate 12, and the lower end portion 15 c is the electrode of the anisotropic conductive film 21. It is inserted into the lower end of the hole 22.

  The guide frame 11 includes a side plate 67 that extends in a direction perpendicular to the top plate 12, and a connection portion 67 a that connects to the lower top plate 12 is formed on a part of the side plate 67. Yes. The lower top plate 12 does not include the side plate 67. Here, in the socket 10 of the present embodiment, since the board member 31 is replaced by the top plate 12, the vertical dimension of the side plate 67 is the vertical direction of the side plate 13 in the first embodiment. It is shorter than the dimension. The configuration of other points is the same as that of the first embodiment, and a description thereof will be omitted.

  In this embodiment, a socket having 25 connection pins 15 is shown. However, the number of connection pins 15 is not limited to this, and the pitch of the electrical conduction paths may be reduced. Therefore, for example, a socket having 5000 connection pins 15 can be provided.

  The present invention is not limited to the above-described embodiment, and various modifications can be made based on the spirit of the present invention, and they are not excluded from the scope of the present invention.

It is a perspective view which shows the socket in the 1st Embodiment of this invention. It is an exploded view of the socket in the 1st embodiment of the present invention. It is a perspective view which shows the anisotropic conductive film in the 1st Embodiment of this invention. It is 1st sectional drawing which shows the operation | movement which attaches the connection object apparatus in the 1st Embodiment of this invention to a connection object circuit board via a socket. It is a 2nd sectional view showing operation which attaches a connection object device in a 1st embodiment of the present invention to a connection object circuit board via a socket. It is a perspective view which shows the socket in the 2nd Embodiment of this invention. It is a perspective view which shows the socket in the 3rd Embodiment of this invention. It is sectional drawing of the conventional socket.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,301 Socket 11 Guide frame 12 Top plate 13, 63, 67 Side plate 13a, 67a Connection part 14 Connection pin accommodating hole 15 Connection pin 15a Upper end part 15b Flange part 15c Lower end part 21 Anisotropic conductive film 22 Electrode hole 23 Conductive part 31 Board member 32 Through hole 33 Bump 41, 52 Solder ball 51 Connection target device 55 Connection target circuit board 56 Connection pad 61 Flat cable 62 Wiring 64 Connection member 302 Semiconductor device 302a Terminal 303 Inspection circuit board 303a Electrode 311 Housing 312 Guide Tube 315 First probe pin 316 Second probe pin 317 Conductive sheet 317a Elastic sheet 317b First electrode 317c Second electrode

Claims (5)

(A) Shrinkage in the thickness direction composed of a porous fluororesin comprising an electrode hole penetrating in the thickness direction and a conductive portion formed by attaching a conductive metal to the resin fiber on the inner wall of the electrode hole and the film possible,
(B) with a connection pin receiving hole penetrating in the thickness direction, faces one surface to the fill arm, facing the plate-like frame on the surface pin is disposed in the other surface-connected equipment,
(C) the previous SL-connected equipment terminal and a conductive portion of said film to a socket that have a connection pin you electrically connected,
(D) The connection pin includes a flange portion, one end portion having a smaller diameter than the flange portion protruding from one surface of the flange portion, and the other end portion having a smaller diameter than the flange portion protruding from the other surface of the flange portion. The one end portion is accommodated in one end of the electrode hole of the film and is in contact with and electrically connected to the conductive portion, one surface of the flange portion faces one surface of the film, and the other end portion is the plate A connecting pin accommodating hole of the frame-like frame is movably accommodated in the axial direction and is electrically connected to a terminal of the device to be connected, and the other surface of the flange portion faces one surface of the plate-like frame. socket to. Comprising a conductive Suruho Le penetrating in a thickness direction, wherein the one side faces the other surface of the film, one end of the Suruho Le has a substrate member to be electrically connected to the conductive portion of the fill arm socket as claimed in claim 1. The plate-like frame is provided with a connection portion to be connected to the substrate member, the other surface of the substrate member is opposed to a connection target circuit board, conductive at the other end of the Suruho Le is the connection target circuit board socket of claim 2 which is electrically connected to the trace. The plate-like frame is connected to a connection target circuit board, the other surface is the connection target circuit to face the board, the opposite end is the connection object and the connection pin of the conductive portion of the film of the film socket of claim 1 which is electrically connected to the conductive trace of the circuit board. The plate-like frame is two, claim disposed respectively to opposite sides of the plane of the fill-time, one plate-like frame is provided with a connecting portion for connecting the other plate-like frame socket described in 1.

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