KR101680319B1 - Probe block for testing a liquid crystal panel - Google Patents

Abstract

A probe substrate 240 having a metal pad 242 to which a plurality of probe pins 220 contacting the pad of the liquid crystal panel 210 are bonded; And an MP block 260 to which the probe substrate 240 is assembled. The probe pin 220 of the probe block 200 is manufactured by a MEMS process and is connected to the probe substrate 240 by soldering using a lead or tin Sn and using a laser, A body part 212 formed of an alloy containing nickel (Ni) or nickel (Ni) and serving as an elastic body, and a rhodium material having good hardness and electrical conductivity, and is in direct contact with the pad of the liquid crystal panel 210 , And is designed to allow vertical movement in the appropriate elastic motion.

Description

[PROBE BLOCK FOR TESTING A LIQUID CRYSTAL PANEL]

The present invention relates to a probe block for liquid crystal panel testing.

The liquid crystal display device is composed of a printed circuit board, a TAB IC film, and a panel. The panel and the printed circuit board are electrically connected to each other using a taped film to test whether the product is defective before the finished product is manufactured. A probe block is used to test whether the same panel is defective.

Generally, the probe block for panel test is roughly divided into two types. A pin type using a needle or a pin, and a film type block including a contact pad or a bump in the film.

Fig. 1 shows a side view of a pin-type probe block. 1, the probe card 100 includes a probe pin 40 and a probe pin block 60, which is modularized in units of units. The probe pin block 60 is connected to the card body 10 in a contact manner with the pogo pin 12, . The pitch of the probe pin block 60 is set corresponding to the pitch of the semiconductor elements of the wafer to be tested.

The probe pin block 60 has a portion of the connection board 50 where the bonding portion 41 of the probe pin 40 at the end of the soldering hole 51 is formed under the press block 20, Respectively.

An epoxy 30 is applied to the upper surface of the press block 20 and the fixed portion 42 of the probe pin 40 is fixed by the epoxy 30 and the contact portion 43 of the probe pin 40 Is protruded by a predetermined length from the epoxy 30 and elastically contacts the electrode pads of the semiconductor element.

In the pin-type probe block using the needles or pins, the pins functioning as the probes are individually resilient and contact with the liquid crystal panel during the panel test. Even though there is a slight difference in the flatness of the liquid crystal panel And the stability of the contact is good.

The pin type probe block is fabricated by inserting a probe into a thin metal plate through a nicking process. Since the difference in thickness between the probe body portion having elasticity and the tip portion as the pad contact portion is not large or nearly the same, In the inspection, the contact area of the probe tip is large, and damage to the electrode lines of the panel is caused, so that a pad contact of a small size is impossible. In addition, since the pins must have a narrow pitch in order to test lead lines of narrow pitch, it has been difficult to manufacture the probe block.

2 and 3 are exploded and assembled perspective views showing the structure of a conventional needle type probe pin and a ceramic slit, respectively.

2 and 3, the probe pin 40 and the slit portion 70 are provided with a latching step and a locking pin 70 so that the needle type probe pin 40 can be stably locked or separated from the slit portion 70 in a sliding manner, A groove, or the like.

The slit portion 70 includes a first slit portion 80 and a second slit portion 90 formed by bending the first slit portion 80 at a right angle. The probe pin 40 has an engagement groove 83 or 85 in which the engagement end 45 of the probe pin 40 is inserted and an engagement groove 87 at a position corresponding to the position of the first engagement projection 46 of the probe pin 40. [ The second slit portion 90 is formed with a recess portion 93 and 95 in which the connection end 47 of the probe pin 40 is accommodated. And a fixing groove 97 is formed at a position corresponding to the position of the base 48. The fitting grooves 83 and 85 and the accommodating portions 93 and 95 are both formed in the shape of a slit in which the respective probe pins 40 can be individually accommodated.

As described above, the needle or pin type probe block is fabricated by assembling a probe in a groove like a ceramic slit. At this time, the ceramic slot serves to maintain the position of the probe, and maintains the position of the probe even when the probe is in operation. Thus, the probe can operate in the vertical direction in the ceramic slit. However, since the thickness of the ceramic slit also occupies a space, it is impossible to cope with a liquid crystal panel having a fine pad pitch. In addition, since ceramic slits are used, there is also a disadvantage that price increases are inevitable due to an increase in product prices. Recently, a film type of probe block for testing a panel by directly contacting the film with the panel has been developed.

Fig. 4 shows a side view of the film type probe block. 4, the film type probe block 150 includes a body block 152, a probe sheet 154 corresponding to a contact member, an elastic member 156 having a groove 155, a driving sheet 158, A driving chip 160, and an FPCB 162. A pad electrode 166 protrudes from the panel 164 and a contact portion 168 for contacting the pad electrode 166 protrudes from the probe sheet 154.

In the case of the film-type probe block having such a structure, it is possible to correspond to a liquid crystal panel having a fine pad pitch, but since pads or bumps are formed adjacent to each other on the same film, If there is a difference, there is a problem that the reliability of the inspection is deteriorated due to the low contact stability due to the difference in the fine flatness.

Further, since the elasticity of the film itself is very small, there is a problem that the pad contact due to the elastic force is unstable.

Korean Registered Patent No. 10-0560410 (Registered on Mar. 07, 2006) "Probe Pin Block of Probe Card" Korean Registered Patent No. 10-1265049 (registered on May 3, 2013) "Needle Type Probe Pin and Needle Type Probe Board" Korean Registered Patent No. 10-1265050 (registered on March 23, 2013) " Needle Type Probe Pin and Needle Type Probe Board " Korean Registered Patent No. 10-1416161 (registered on Apr. 1, 2014) " Probe block for panel test and elastic member used therein " Korean Utility Model Registration No. 20-0473504 (Registered on July 1, 2014) "Needle type pin board and overdrive sensing device for it"

In order to solve the above-described problems, the present invention has been developed in order to cope with a fine pitch while maintaining the contact stability of the probe type block. The object of the present invention is to provide a probe- All they have is a probe block.

According to one aspect of the present invention, there is provided a probe block for testing liquid crystal panels, comprising: a plurality of probe pins contacting a pad of a liquid crystal panel to be inspected to transmit an electrical signal; A probe substrate having a fine metal pad to which the probe pins are bonded and a metal circuit; And a buffer block on which the probe substrate is assembled; A flexible circuit board for transmitting an electrical signal of the metal circuit of the probe substrate to a main circuit board; And a body block assembled to the buffer block and the main circuit board.

The probe pin may be fabricated by a MEMS process and may be bonded to a fine metal pad of the probe substrate.

The bonding of the probe pins may be performed by soldering using a laser or by electron beam or TIG welding or brazing using lead or tin (Sn).

The probe pin may include a body portion formed of an alloy including nickel or nickel and serving as an elastic body, and a tip portion formed of a rhodium material having good hardness and electrical conductivity and directly contacting the pad of the liquid crystal panel.

The probe substrate may be formed of a PCB or a ceramic material, which is made of a fine metal pad and a metal circuit, and is capable of forming a multilayer circuit.

The buffer block may include first and second buffer blocks, and may include a vertical elastic device between the first and second buffer blocks.

Through the above-mentioned means for solving the problems, the present invention provides the following effects.

According to the various embodiments of the present invention, fine-pitch liquid crystal panel inspection can be performed by using MEMS probes which are made small and thin while the dimensions of several micrometers are managed by the MEMS process.

According to various embodiments of the present invention, unlike a probe block using a conventional probe pin, expensive ceramic slits for fixing the probe are not used, thereby reducing the cost.

According to various embodiments of the present invention, since the pad is brought into contact with the elastic force by the vertical operation of the probe, stable contact is possible and contact reliability is also high.

1 is a side view showing a conventional pin-type probe block for a liquid crystal panel test.
2 and 3 are exploded and combined perspective views showing the structure of a conventional needle type probe pin and a ceramic slit, respectively.
4 is a side view showing a conventional film type probe block for a liquid crystal panel test.
5 is a schematic view showing the structure of a probe block for liquid crystal panel testing according to various embodiments of the present invention.
FIG. 6 is a detailed view showing in detail the bonding state of the probe pins of FIG. 5;

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 5 is a schematic view showing a structure of a probe block for liquid crystal panel testing according to various embodiments of the present invention, and FIG. 6 is a detailed view showing the bonding state of the probe pins of FIG. 5 in detail.

5, a liquid crystal panel testing probe block 200 according to various embodiments of the present invention includes a probe substrate 220 to which a plurality of probe pins 220 contacting a pad of a liquid crystal panel 210 to be inspected are bonded, (240); And a buffer block 260 on which the probe substrate 240 is assembled.

According to one embodiment, each probe pin 220 of the probe block 200 may be fabricated in a MEMS process and bonded to the probe substrate 240. At this time, the bonding may be lead or tin (Sn), and it may be bonded by other methods such as soldering using a laser or electron beam or TIG welding, brazing or the like.

The probe substrate 240 is provided with a fine metal pad 242 to which probe pins 220 are bonded and a metal circuit for transmitting an electrical signal is formed in the metal pad 242. Accordingly, the probe substrate 240 is formed of a fine metal pad and a metal circuit, and a material capable of forming a multilayer circuit, for example, a PCB or a ceramic material capable of realizing a metal circuit can be applied.

The bonding fine metal pads 242 may have the same pitch as the inspection pads of the liquid crystal panel to be inspected and the probe pins 220 to be bonded thereto may have the same pitch as the pads of the liquid crystal panel 210 .

Since the probe pins 220 can be manufactured by a MEMS process, they can be managed in a unit of several micrometers and can be made small and thin. The probe pin 220 may include a body portion 212 that serves as an elastic body and a tip portion 214 that is in direct contact with the pad of the liquid crystal panel.

The body portion 212 may be an alloy containing nickel (Ni) or nickel (Ni) and may be made of a material having good elasticity. The tip portion 214 of the probe directly contacting the pad of the liquid crystal panel may be mainly made of a rhodium material having good hardness and electrical conductivity, but other materials may also be used.

The probe pin 220 of the probe block 200 according to various embodiments of the present invention may be manufactured such that the size of the tip portion 214 is made smaller than the thickness of the body portion 212 by a MEMS process It is possible to cope with a pad size and a pitch of a fine liquid crystal panel.

The probe pins 220 according to various embodiments of the present invention are bonded to the metal pads 242 of the probe substrate 240 by soldering using a laser, Since the probe pins 220 are bonded within a few tens of micro-errors, it is not necessary to provide a position holding device for a probe pin such as a ceramic slit in a conventional probe block, thereby reducing the cost.

In addition, since the probe pin 220 of the probe block 200 according to various embodiments of the present invention is a MEMS probe pin fabricated by a so-called MEMS process, the MEMS probe pin can be designed by a simulation program Because it can be designed to allow vertical motion in elastic motion, smooth vertical movement is possible without position such as ceramic slit, and position accuracy can be ensured.

The probe block 200 according to various embodiments of the present invention can be assembled with the buffer block 260 in which the probe pins 220 are bonded.

The buffer block 260 includes a lower first buffer block 262 and a second buffer block 264 above the first buffer block 262 and includes first and second buffer blocks 262, And may include a vertical elastic device 270 that includes a spring therebetween.

The electrical signal of the probe pin 220 is applied to the main body of the body block 280 via the metal circuit of the probe substrate 240 and connection means such as a flexible printed circuit board (FPCB) 272 or a wire connector. Main) circuit board 282 to the ZIF connector 284 of the circuit board 282.

The vertical elastic device 270 in the buffer block 260 is moved to the vertical elastic device 270 of the buffer block 260 when a certain amount of force is applied to the probe pin 202 during an excessive contact stroke, The probe pin 220 and the liquid crystal panel 210 can be protected by buffering the force applied to the probe pin 220. [ Since the vertical elastic device 270 has a typical configuration, a detailed description of the operation is omitted.

The probe blocks 200 may be assembled to a base frame 280 to form a probe card using the probe block for a liquid crystal panel according to the present invention.

As described above, the probe block for liquid crystal panel testing according to various embodiments of the present invention is capable of inspecting a liquid crystal panel with a fine pitch using a MEMS probe pin, can reduce the unit cost by not using a ceramic slit, Since the contact is made by the elastic force of the vertical movement of the pad, stable contact can be made and the contact reliability is also high, so that the fine pitch and the contact stability can be achieved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. It will be understood by those of ordinary skill in the art that various changes and modifications may be made without departing from the scope of the present invention. It should be understood that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

200: probe block 210: liquid crystal panel
212: body part 214: probe tip part
220: probe pin 240: probe substrate
242: metal pad 260: buffer block
270: elastic device 272: flexible circuit board (FPCB)
280: Body block 282: Main circuit board
284: ZIF connector (Connector)

Claims (6)

In the liquid crystal panel test probe block,
A plurality of probe pins contacting the pads of the liquid crystal panel to be inspected to transmit an electrical signal;
A probe substrate having a fine metal pad to which the probe pins are bonded and a metal circuit;
A buffer block on which the probe substrate is assembled;
A flexible circuit board for transmitting an electrical signal of the metal circuit of the probe substrate to a main circuit board; And
And a body block assembled with the buffer block and the main circuit board,
Wherein the probe pin is fabricated by a MEMS process including a body portion as an elastic body and a tip portion that is in direct contact with a pad of the liquid crystal panel and the size of the tip portion is made smaller than the thickness of the body portion, Bonded to a metal pad
Probe block. delete The method according to claim 1,
The probe pin is bonded to the probe pin by soldering or electron beam or TIG welding or brazing using laser or tin (Sn). The method according to claim 1,
Wherein the probe pin comprises a body part made of an alloy including nickel or nickel and serving as an elastic body, and a tip part made of a rhodium material having good hardness and electrical conductivity and directly contacting the pad of the liquid crystal panel. The method according to claim 1,
Wherein the probe substrate is made of a PCB or a ceramic material capable of fabricating a multilayer circuit. The method according to claim 1,
Wherein the buffer block comprises first and second buffer blocks and a vertical elastic device between the first and second buffer blocks.

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