JP4711800B2 - Probe card manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a probe card used for testing a semiconductor wafer, and more particularly to a method of manufacturing a probe card using a probe unit.

As one of conventional methods for producing a cantilever type probe card, there is a method in which probes are directly formed on a contact substrate of a probe card using MEMS technology (see Patent Document 1) .

  As a result, a high-density probe card is obtained, which corresponds to the recent high-density arrangement of electrodes such as narrowing of electrode pads and area array due to high integration and high speed of semiconductor wafers.

JP-A-2004-101351

  However, in the conventional probe card manufacturing method, when using MEMS technology to directly form probes on the probe card contact substrate using MEMS technology, various chemicals are used in the probe forming process. The chemical resistance of contact substrates has become an issue.

  In addition, since the probe is formed directly on the electrode of the contact substrate, the unevenness of the electrode may adversely affect the quality of the probe.

  In order to solve the problem that the method of directly forming a probe using the MEMS technology in the conventional probe card manufacturing method, the present invention does not directly form a probe on a contact substrate. It is an object of the present invention to provide a method of manufacturing a probe card that can cope with a high-density probe arrangement.

The method for manufacturing a probe card according to the present invention includes a step of creating a probe unit in which a plurality of probes are arranged on a first substrate in a horizontal row at a predetermined interval, and a predetermined number of the probe units are formed on a second substrate. A method of manufacturing a probe card in which a predetermined number of probes are arranged on the second substrate by a step of arranging at a predetermined interval, and after attaching a first row of probe units to the second substrate, 2 The probe unit in the second row is arranged so that the probe of the probe unit in the row is covered above the probe of the probe unit in the first row without touching, and the subsequent probe units are the same as in the second row. It is characterized by arranging in .

The method for manufacturing a probe card according to the present invention includes a step of creating a probe unit in which a plurality of probes are arranged on a first substrate in a horizontal row at a predetermined interval, and a predetermined number of the probe units are formed on a second substrate. A method of manufacturing a probe card in which a predetermined number of probes are arranged on the second substrate by a step of arranging at a predetermined interval, and after attaching a first row of probe units to the second substrate, 2 The probe unit in the second row is arranged so that the probe of the probe unit in the row is covered above the probe of the probe unit in the first row without touching, and the subsequent probe units are the same as in the second row. By arranging them in a complicated manner, it is possible to arrange a complicated probe with a narrow pitch, and to solve the problem of chemical resistance of the substrate.

The perspective view of the probe unit used for the probe card manufacturing method of this invention. The side view which shows the formation method of a probe unit. The side view which shows the manufacturing method of a probe card. The side view which shows another embodiment of the manufacturing method of a probe card. The side view which shows another embodiment of the manufacturing method of a probe card. The side view which shows the manufacturing method of the conventional probe card.

    The present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view of a probe unit 1 used in a method for manufacturing a probe card according to the present invention, and FIG. 2 is a diagram sequentially showing each step of the method for manufacturing a probe card according to the present invention.

  The method for manufacturing a probe card according to the present invention includes a step of creating a probe unit 1 in which a plurality of probes 2 adjacent to each other at a predetermined interval are arranged on a first substrate 3; A predetermined number of probes 2 are arranged on the second substrate 8 by the step of arranging on the substrate 8. Here, the second substrate 8 corresponds to the conventional contact substrate 8.

The probe 2 used in the present invention includes a support part 4, an arm part 5 extending from the support part 4 and having a spring property, and a contact part that is disposed on the distal end side of the arm part 5 and contacts an electrode of an inspection object. 6 is composed.

First, a process of creating a probe unit in which a plurality of probes are arranged on a first substrate will be described. The probes 2 directly formed on the contact substrate of the probe card using the conventional MEMS technology are directly formed on the contact substrate 8 as shown in FIG. 6, but the probe 2 used in the present invention is a contact. A plurality of layers are formed not on the substrate 8 but on the first substrate 3. A plurality of probes 2 are formed in a horizontal row on the first substrate 3.

After the plurality of probes 2 are collectively formed on the first substrate 3 by the MEMS technique, the plurality of probes 2 are covered with a protective material 7. Since the first substrate 3 is an insulating substrate and the protective material 7 is removed later, a resin that can be dissolved and removed is used.

  After the probe 2 is covered with the protective material 7 and the probe 2 is protected, the first substrate 3 is cut to remove unnecessary portions. As shown in FIG. 2B, the portion other than the vicinity of the support portion 4 of the probe 2 is left and removed. At this time, as shown in the perspective view of FIG. 1, the first substrate 3 is left so as to hold the probes 2 in a state of being aligned in a horizontal row.

After removing unnecessary portions of the first substrate 3, the protective material 7 is dissolved and removed. As a result, the probe 2 protected by the protective material 7 is exposed as shown in FIG. Then, as shown in FIG. 1, a probe unit 1 in which a plurality of probes 2 are arranged in a horizontal row on a first substrate 3 is formed.

  A plurality of probes 2 can be attached together by attaching the probe unit 1 to the second substrate 8 of the probe card. FIG. 3 is a view showing a method of attaching the probe 1 using the probe unit 2.

  The step of arranging the probe unit 1 on the second substrate 8 will be described in detail. As shown in FIG. 3A, the probe unit 1 is bonded to the second substrate 8. Next, as shown in FIG. 3B, the electrode 9 provided on the second substrate 8 and the probe 2 of the probe unit 1 are joined by a wire bond 10.

  Resin sealing 11 is performed on the wire bond 10 and the electrode 9 joining the probe 2 and the electrode 9 with a dispenser or the like. Thereby, the attachment of the probe 2 to the second substrate 8 is completed.

  As described above, the method of manufacturing a probe card of the present invention using the probe unit 1 makes it possible to attach a plurality of probes 2 at a time, and becomes a problem in the direct collective formation of probes by the conventional MEMS technology. The problem of chemical resistance of the second substrate 8 can also be solved. Furthermore, since the second substrate 8 and the probe 2 can be formed in parallel, the process can be shortened. Further, since the probe 2 is directly formed on the flat first substrate 3, the yield in the probe forming process is improved.

Next, instead of bonding the probe 2 and the electrode 9 by wire bonding 10, a plurality of first wirings 12 are formed on the surface of the first substrate 3 of the probe unit 1 and bonded to the second substrate 8. The case will be described.

FIG. 4 shows a probe card manufacturing method according to this embodiment. A plurality of first wirings 12 are provided on the first substrate 3 of the probe unit 1. A plurality of probes 2 are formed on the first substrate 3 by using the MEMS technique so as to be in contact with each of the first wirings 12. It is preferable to use an insulating substrate for the first substrate 3 and to use a material that can be easily bonded, such as Au, for the first wiring 12.

Then, the probe unit 1 is attached to the second substrate 8, and the electrode 9 on the second substrate 8 and the first wiring 12 provided on the probe unit 1 are joined by the wire bond 10. Thereafter, the first wiring 12, the wire bond 10, and the electrode 9 are sealed with a resin 11 using a dispenser or the like.

Here, the method of directly connecting the first wiring 12 and the probe 2 has been described. However, a method of bonding the first wiring 12 and the probe 2 by wire bonding will be described.

  FIGS. 4C and 4D show a method of joining the first wiring 12 and the probe 2 by wire bonding.

  A plurality of first wirings 12 are formed on the surface of the first substrate 3 that is an insulating substrate, and a plurality of probes 2 corresponding to the first wirings 12 are collectively formed by the MEMS technique. At this time, the first wiring 12 and the probe 2 correspond to each other and are joined by the first wire bond 14.

  A plurality of second wirings 13 are also formed on the surface of the second substrate 8 that is also an insulating substrate. The second wiring 13 is bonded to the first wiring 12 of the first substrate 3 by the second wire bond 15. The probe 2 is bonded to the first substrate 8 by the second wire bond 15.

After the bonding by the second wire bond 15 is completed, the first wire bond 14 and the second wire bond 15 are sealed with a resin 11 using a dispenser or the like. FIG. 4D shows the case where the first wire bond 14 and the second wire bond 15 are simultaneously sealed with the resin 11, but the first wire bond 14 and the second wire are shown. The resin sealing 11 may be performed separately for the bond 15.

A method for manufacturing a probe card of the present invention that enables the arrangement of probes 2 with a narrower pitch than the prior art will be described using the probe unit 1 shown in FIG. This method is shown in FIG.

  The right probe unit 1 shown in FIG. 5A is first attached by the above-described method. Next, the left probe unit 1 in the second row is attached. At this time, the probe 2 of the left side probe unit 1 in the second row is arranged so as to cover the right side of the probe unit 1 in the first row without touching it. With such an arrangement, the probes 2 can be arranged at a narrower pitch. Repeat this procedure to attach the probe unit.

  Conventionally, since the probes 2 are directly formed on the second substrate 8 by using the MEMS technique, the probe unit 1 is used because the probes 2 cannot be positioned in an overlapping state. Thereby, the arrangement | positioning with which the probe unit 1 overlapped is attained, and the space | interval of the probe 2 can be made narrower.

  Further, as shown in FIG. 5B, by changing the arrangement of the first wirings 12 provided on the first row (right side) probe units 1 and the second row (left side) probe units 1, It is also possible to reduce the interval between the probes 2.

  That is, the probe unit 1 in the first row is provided with the wiring 12 on the right side on the first substrate 3, and is joined to the electrode 9 and the wire bond 10 on the right side, and the probe unit 1 in the second row is placed on the first substrate 3. The wiring 12 is provided on the left side, and the electrode 9 and the wire bond 10 are joined on the left side. Thus, by changing the position of the wiring 12 for each probe unit, the interval between the probes 2 can be made narrower.

  Another method for producing a probe card will be described. FIG. 5C shows the method.

  The rightmost probe unit 1 shown in FIG. 5 (c) is first attached by the method described above. Next, the middle probe unit 1 in the second row is attached. At this time, the middle probe 2 in the second row is placed above the right probe 2 in the first row, on the resin seal 11 of the probe unit 1 in the first row, and the probe 2 in the middle probe unit 1. The probe unit 1 in the middle is arranged so that the arm part 5 is in contact.

  In order to perform such an arrangement, the resin sealing 11 is performed using an elastomer. Thus, by supporting the arm portion 5 of the probe 2 of the probe unit 1 in the next row by the resin seal 11, the needle pressure of the probe 2 can be improved.

  Thus, the probe card manufacturing method of the present invention makes it possible to improve the yield of the probe process and shorten the process. In addition, since the interval between the probes can be narrowed, probes with a narrower pitch can be arranged.

DESCRIPTION OF SYMBOLS 1 Probe unit 2 Probe 3 1st board | substrate 4 Support part 5 Arm part 6 Contact part 7 Protective material 8 Contact board | substrate 9 Electrode 10 Wire bond 11 Resin sealing 12 Wiring

Claims (3)

A step of creating a probe unit in which a plurality of probes are arranged on a first substrate in a horizontal row at a predetermined interval, and a step of arranging a predetermined number of the probe units at a predetermined interval on a second substrate. A method of manufacturing a probe card in which a predetermined number of probes are arranged on a second substrate,
After the first row of probe units are attached to the second substrate, the second row of probe unit probes are covered in two rows so as to cover the probes of the first row of probe units without touching them. A probe card manufacturing method, wherein a probe unit of an eye is arranged, and subsequent probe units are arranged in the same manner as in the second row. When the probe unit is attached to the second substrate, the probe or wiring of the probe unit is bonded to the electrode of the second substrate with a wire bond, and the wire bond and the electrode are covered by resin sealing. The method for producing a probe card according to claim 1.   When placing the probe unit in the second row so that the probe of the probe unit in the second row covers the probe of the probe unit in the first row without touching it, it is provided in the probe unit in the first row. 3. The method for producing a probe card according to claim 2, wherein the resin seal and the probes of the probe units in the second row have a predetermined distance or are in contact with each other.

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