JP4676812B2 - UIM IC card, and method for manufacturing UIM and UIM IC card - Google Patents

Description

The present invention relates to a UIM IC card and a method for manufacturing a UIM and UIM IC card.
Here, a UIM IC card is generally formed in a cardboard-size card substrate so that the outer shape of the UIM can be folded by a peripheral slit and a connecting portion (bridge), and the UIM can be folded from the connecting portion. The present invention relates to an IC card that is used by attaching a UIM to a mobile phone or the like. In the present invention, the IC module portion in the normal size UIM is provided with a smaller size UIM outer shape, and the small size The present invention relates to a UIM IC card that can be used by selecting and removing either a size UIM or a normal size UIM, a UIM that is broken from the UIM IC card, and a method for manufacturing the UIM IC card.

Of the various IC cards, what is called a contact IC card is folded into a 53.98 mm x 85.60 mm (ID-1 type) wallet size specified by ISO or JIS, and a size slightly smaller than this. There is a card called UIM (Universal / User Identity Module) or SIM (Subscriber Identity Module) that is used for processing that can be taken off and inserted into a mobile terminal or other device. Since UIM is based on SIM, it is also called USIM (Universal SIM).
UIM or SIM has GSM (Global System for Mobile Communication) standards and 3GPP (3rd Generation Partnership Project) standards, which are known to determine the shape, position (see Fig. 7), and electrical characteristics during use. .
Although the names are different, they are substantially the same in terms of outer shape (25.0 mm in width, 15.0 mm in length) and configuration, and are functionally similar. Therefore, the term “UIM” in this specification refers to a normal size UIM including SIM and USIM.

  By the way, UIM or SIM has been standardized in this way in order to ensure compatibility between devices of small portable electronic devices (such as mobile phones), but recently, in order to respond to the demand for further device miniaturization, The size of the built-in SIM module is not restricted by the standard, and there is an increasing need for using the SIM module with a minimum size. This minimum size is a region smaller than the SIM region, including a region (specified by ISO 7816/2) that should be secured as a terminal region at the minimum, although the required size varies depending on the device manufacturer. .

  If a card corresponding to only such special size is manufactured, it cannot be used as a general GSM standard size SIM or 3GPP standard UIM, and this special size UIM is dedicated to the special size. Check the UIM compatible size in the device of a small portable electronic device (cell phone, etc.), determine whether this is a product for a normal size UIM or a product for a small size UIM, and find a UIM that incorporates the corresponding UIM It must be received from the dealer and attached to the device.

For this reason, the store side must stock at least two types of UIMs corresponding to both the normal size and the small size UIM, and appropriately select a card suitable for the device. The problem is that the stock of cards increases.
In order to avoid this, making a normal size UIM including a small size UIM break-up processing part also leads to a decrease in inventory, which increases convenience. Therefore, as will be described later, there has already been proposed this type of UIM.

The small size UIM is an IC card in which the normal size UIM is further reduced in size, and is substantially the same size as the terminal board outline of the IC module for the IC card.
Usually, the size is 15.0 mm in width and 12.0 mm in length, which was established by the European Telecommunications Standards Institute as ETSI TS102 221 in February 2004 as 3FF standard (3rd Form Factor). In this case, the approximate shape is included unless it deviates significantly from the specified size.

  By the way, the terminal board position of the IC module of the IC card is defined by ISO7816 / JISX6303, and is arranged at a predetermined position of the card (see FIG. 7). The UIM IC card of the present invention also defines the position of the contact terminal board based on the standard. In addition, the function of each contact terminal is defined, and each terminal in the figure includes C1 (Vcc; supply voltage), C2 (RST; reset signal), C3 (CLK; clock signal), C5 (GND; ground), C6 (VPP; variable supply voltage such as a program), C7 (I / O; data input / output), and C4 and C8 (RFU: Reserved for Future Use). Therefore, the lower two terminals (C4 and C8) are not normally used. The five terminals C1, C2, C3, C5, and C7 are generally used in mobile phones.

As described above, the prior art already exists for the small size UIM.
Patent Document 1, Patent Document 2, and Patent Document 3 select either a normal standard-compliant UIM size or a smaller mini-size UIM when folding a small IC card area from a card-sized card outer shape. Proposed UIIM break-off shapes. Patent Document 4 proposes a normal size UIM including a small size UIM having a plurality of outer shapes.
Patent Document 5, Patent Document 6, and Patent Document 7 are contents related to the prior application of the present application, but describe various inner frame structures into which a mini size UIM (small size UIM) is fitted.

Japanese translation of PCT publication No. 2002-535783 Special Table 2002-537609 Japanese translation of PCT publication No. 2002-537610 JP 2004-326381 A JP-A-2005-71316 Japanese Patent Application No. 2003-355215 Japanese Patent Application No. 2004-239007

  However, if the peripheral size slit of the small size UIM is formed without limitation in the normal size UIM as in the above-mentioned Patent Document 4, the UIM incorporates the small size UIM, so that it is provided at a predetermined position on the mobile phone side and protrudes. The terminal (pin) and the peripheral slit of the small size UIM come into contact with each other or are entangled with each other during insertion, and the terminal (pin) is likely to be damaged or deformed. This problem is particularly noticeable in applications where UIMs are frequently inserted and removed.

  In order to solve the above inconveniences, it is necessary to regulate the peripheral slit forming position of the small size UIM within the normal size UIM so as not to contact the terminal (pin) on the mobile phone side. The present invention has been studied to solve the above problems.

The first of the gist of the present invention that solves the above problems is that the outer shape of the normal size UIM is formed in a wallet-sized card substrate by a plurality of connecting portions and peripheral slits that have been processed to facilitate folding, Further, for the UIM, the outer shape of the small size UIM is formed by a plurality of connecting portions and peripheral slits that are similarly processed to facilitate folding in a portion surrounding the IC module contact terminal board in the normal size UIM. In the IC card, at least one connection part among the connection parts on which the small size UIM has been easily broken is parallel to a part adjacent to the short side of the left or right of the IC module contact terminal plate. provided, and the C1, C2, C3, C4, C5, C6, C7, C8 portions parallel to the short side of the terminal of the contact terminal plate peripheral slit UIM for IC card, characterized in that not performed, in.

The second of the gist of the present invention that solves the above problems is that the outer shape of the normal size UIM is formed in a wallet-sized card substrate by a plurality of connecting portions and peripheral slits that have been processed to facilitate folding, Further, for the UIM, the outer shape of the small size UIM is formed by a plurality of connecting portions and peripheral slits that are similarly processed to facilitate folding in a portion surrounding the IC module contact terminal board in the normal size UIM. In the IC card, at least one connection part among the connection parts on which the small size UIM has been easily broken is parallel to a part adjacent to the short side of the left or right of the IC module contact terminal plate. provided, and C1 of the contact terminal plate, C2, C3, C5, C6, C7 is a portion parallel to the short side of the terminal are formed peripheral slit UIM for the IC card which is characterized that no, there is in.

The third of the gist of the present invention for solving the above-mentioned problems is a plurality of connecting portions in which the outer shape of the small size UIM is processed to facilitate folding in the portion surrounding the IC module contact terminal plate in the normal size UIM. In the UIM formed by the peripheral slit, at least one of the connection portions that have been processed for facilitating folding of the small size UIM is adjacent to the left and right short sides of the IC module contact terminal plate. It is provided in parallel with the part, and no peripheral slit is formed in the part parallel to the short side of the C1, C2, C3, C4, C5, C6, C7, C8 terminal of the contact terminal plate. The UIM is characterized by

The fourth of the gist of the present invention for solving the above-mentioned problem is a plurality of connecting portions in which the outer shape of the small size UIM is processed to facilitate folding in the portion surrounding the IC module contact terminal plate in the normal size UIM. In the UIM formed by the peripheral slit, at least one of the connection portions that have been processed for facilitating folding of the small size UIM is adjacent to the left and right short sides of the IC module contact terminal plate. It is provided in parallel with the part, and no peripheral slit is formed in the part parallel to the short side of the C1, C2, C3, C5, C6, C7 terminal of the contact terminal plate. UIM.

The fifth of the gist of the present invention for solving the above-mentioned problems is a step of manufacturing a card substrate by superimposing a plurality of substrate sheets and applying heat pressure to integrate them, and a recess for mounting an IC module on the card substrate. Forming the IC module in the recess for mounting the IC module, and forming the outer shape of the small size UIM around the mounted IC module by the peripheral slit and the connection part that is easy to break off. And a process for forming an outer shape of a normal size UIM on the outer side thereof with a peripheral slit and a connection part that has been made easy to break off. of the break-off facilitating processing connection portion of the shaped connection portions of at least one location is adjacent to the short sides of the left and right of the IC module contact terminal plate Min provided in parallel, and C1 of the contact terminal plate, C2, C3, C4, C5 , C6, C7, C8 in a portion parallel to the short side of the terminal, characterized in that so as not to form a peripheral slit And a method for manufacturing a UIM IC card.

The UIM IC card and UIM of the present invention are used for a small UIM in a portion parallel to the C1, C2, C3, C5, C6, C7 terminals (or a portion including the C4 and C8 terminals) that the mobile phone normally has. Since the peripheral slit is not formed, when the UIM is slid and mounted on the mobile phone, the terminal (pin) on the mobile phone side is fitted or pulled to break or damage the terminal (pin). There is no problem of deformation.
Therefore, even if a normal size UIM mobile phone repeatedly inserts and removes from the connector section, the constant pressure spring pin does not give an extra load or impact to the UIM, and the product life of both the connector pin and the UIM is increased. Benefits can be expected.

By adopting the shape of the UIM IC card and UIM of the present invention, it is possible to select whether to use as a normal size UIM or to be used as a small size UIM depending on the actual use of the device. A double-structure UIM that can be improved in reliability due to unnecessary impact and load on the contact pins and UIM can be realized by repeatedly inserting and removing the terminal device while providing advantages.
According to the method for manufacturing a UIM IC card of the present invention, a UIM IC card or UIM that is mounted on a mobile phone and produces the effects as described above can be mass-produced in a normal IC card manufacturing process.

The UIM IC card and UIM of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram illustrating an example of a UIM IC card according to the present invention, FIG. 2 is a diagram illustrating another example of a UIM IC card according to the present invention, and FIG. 3 is still another example of a UIM IC card according to the present invention. FIG. 4 is a diagram showing the UIM of the present invention, FIG. 5 is a diagram for explaining the positional relationship between the UIM and a terminal (pin) of the mobile phone, and FIG. 6 is a manufacture of an IC card for UIM FIGS. 7A and 7B are diagrams illustrating the process, and FIG.

1A and 1B are diagrams showing an example of a UIM IC card according to the present invention. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG.
The UIM IC card 10 shown in FIG. 1 has a normal size UIM1 in a wallet-size card substrate 3, and a small size UIM2 is surrounded by a portion surrounding the IC module contact terminal board 6 in the normal size UIM1. Is formed. The normal size UIM1 has an outer shape formed by a groove-shaped peripheral slit 1s that completely penetrates the card substrate 3 and a plurality of connection portions (bridges) 1b1 and 1b2 that cut the card substrate 3 incompletely. .
The outer shape of the small size UIM2 also includes a groove-shaped peripheral slit 2s that completely penetrates the card substrate 3 and a plurality of connecting portions 2b1 and 2b2 that are processed to facilitate folding to cut the card substrate 3 incompletely. It is formed by. In addition, the connection part may generally be called a bridge. The cutout portion 1K of the UIM1 is used for alignment alignment when the UIM1 is mounted on a mobile phone or the like, and the small size UIM2 usually has the same cutout portion 2K.

  In the case of the UIM IC card 10 in FIG. 1, both the normal size UIM1 and the small size UIM2 have two connection portions 1b1, 1b2, 2b1, 2b2, and each connection portion is parallel to the short side of the card substrate 3. It has a length direction in the direction. 1 are arranged as described above, but a plurality of connection portions can be provided in each UIM IC card 10, and the direction thereof is also short of the card substrate 3. It is not limited to the direction parallel to the side. The multiple places are usually about 1 to 4 places.

  The peripheral slits 1s and 2s are formed so as to penetrate the card substrate 3, but the cross section does not appear in FIG. Since the cutting width of the peripheral slit 2s is normally about 0.2 mm to 1.0 mm, the terminal (pin) on the mobile phone side is likely to be fitted or caught. The connecting portions 1b1, 1b2, 2b1, 2b2 are half-cut from the upper and lower surfaces of the card substrate 3 with a finer cutting blade type, and are perforated, grooved in a broken line shape, or a combination thereof. Since the cut width of the cut portion is approximately 0.1 mm or less, there is little possibility that the terminal (pin) on the mobile phone side will be fitted or caught, and the surface of the card substrate 3 is almost smooth. . In the case of FIG. 1 (B), it is formed by a half-cut line that leaves the central portion of the card substrate 3, and is folded off from that portion. Such a process is called a break-up facilitating process.

The feature point of the IC card 1 for UIM in FIG. 1 is that the connection portions 2b1 and 2b2 are provided in parallel to the portions adjacent to the short sides of the left and right sides of the contact terminal plate 6 of the IC module, and the terminal plate. The peripheral slit 2s is not formed up to a portion parallel to the short side of all terminals of C1, C2, C3, C4, C5, C6, C7, and C8. Or you may make it the short side side whole area become a connection part with the outer side area | region.
In FIG. 1 (A), a rectangular portion with oblique hatching indicates a range in which contact with a terminal (pin) on the mobile phone side occurs when a normal size UIM1 is slid and inserted into the mobile phone. ing. In this case, contact occurs in a wide range over the left and right regions of the small size UIM2. Therefore, by forming the connecting portions 2b1 and 2b2 on the short sides on both the left and right sides in this way, when the UIM 1 is mounted on the mounting portion of the mobile phone, the above-described terminal (pin) is not contacted or caught. Can be demonstrated. Since the normal size UIM1 is used after being broken, the position of the peripheral slit 1s of the UIM1 is not particularly limited.

In claims 1 to 4, “at least one connecting portion is”. However, the present invention is also applicable to the case shown in FIG. 1 in which two connecting portions 2 b 1 and 2 b 2 correspond. Of course, it belongs to the technical scope of Item 1.
In addition, the left and right short sides of the contact terminal plate 6 are two sides parallel to the short side of the IC card among the four sides of the contact terminal plate 6 of the IC module. When there is only one connecting portion, the short side on the right side in the normal drawing is the connecting portion. The UIM mounting part (connector) mechanism of the cellular phone is overwhelmingly a system in which the UIM long side (upper and lower sides) is slid and fixed so that the contact area with the UIM can be increased and positioning can be performed with less inclination. This is because there are many.

FIG. 2 is a view showing another example of the UIM IC card of the present invention, but a cross-sectional view is omitted. In the UIM IC card 10 shown in FIG. 2, a normal size UIM1 and a small size UIM2 are similarly formed in a wallet-sized card substrate 3.
The normal size UIM1 has an outer shape formed by groove-shaped peripheral slits 1s that completely penetrate the card substrate 3 and connection portions 1b1 and 1b2 that cut the card substrate 3 incompletely, and the small size UIM2 also has an outer shape. This is the same as that formed by the groove-shaped peripheral slit 2s that completely penetrates the card substrate 3 and the connection portions 2b1 and 2b2 that cut the card substrate 3 incompletely.

  2 is characterized in that the connection portions 2b1 and 2b2 are provided in parallel with the portion adjacent to the short side of either the left or right of the contact terminal plate 6 of the IC module, and on the right side. The connecting portion 2b1 is formed in a portion of the terminal plate parallel to the C1, C2, C3, C5, C6, and C7 terminals, and the peripheral slit 2s is not formed up to the portion covering the terminal plate. In other words, the peripheral slit 2s may be formed in a portion covering the C4 and C8 terminals. In the case of the connection part 2b2, it is set as the connection part of a narrower range.

The peripheral slit 2s is formed in this manner because the terminal (pin) on the mobile phone side is usually not formed in the C4 terminal or C8 terminal portion. In such a case, the C4 terminal or C8 terminal is used. This is because even if the peripheral slit 2s is formed up to the part, the terminal (pin) on the mobile phone side does not contact or get caught by the peripheral slit 2s.
A rectangular portion with diagonal hatching in FIG. 2 indicates a range where contact with a terminal (pin) occurs when the normal size UIM1 is slid and inserted into the mobile phone. In this case, it is shown that contact occurs only in the right region of the small size UIM2. Therefore, in this case, even if the range of the connection portion 2b2 on the left side of the small size UIM2 is narrowed as shown in FIG. 2, the peripheral slit 2s and the terminal (pin) of the mobile phone do not contact each other.

FIG. 3 is a view showing still another example of the UIM IC card of the present invention, but a cross-sectional view is omitted. The UIM IC card 10 shown in FIG. 3 is similarly formed with a normal size UIM1 and a small size UIM2 in a wallet-sized card substrate 3.
In the case of the UIM IC card 10 of FIG. 3, the normal size UIM1 has two connection portions 1b1 and 1b2, and the small size UIM2 has three connection portions 2b1, 2b2 and 2b3. The connection portions 1b1, 1b2, and 2b1 have a length direction in a direction parallel to the short side of the card substrate 3, while the connection portions 2b2 and 2b3 have long sides of the card substrate 3 (the length of the IC module). (Length) in the direction parallel to the side.

In FIG. 3, a rectangular portion including oblique hatching indicates a range where contact with a terminal (pin) occurs when the normal size UIM1 is slid and inserted into the mobile phone.
In this case, contact occurs only in the area on the right side of the small size UIM2, so that the peripheral slit is not formed in the short side C5, C6, C7 terminal portion on the right side of the small size UIM2, and the connection portion 2b1 is formed. In the case of FIG. 3 as well, the portion on the left side of FIG. 3 of the small size UIM2 is the peripheral slit 2s, but it does not reach the contact area with the terminal (pin), so the above problem does not occur.

4A and 4B are diagrams showing the UIM of the present invention. FIG. 4A is a diagram in which the normal size UIM1 is taken out from the UIM IC card in FIG. 1, and FIG. 4B is a diagram showing the UIM1 from FIG. FIG. 4 (C) is a diagram in which UIM1 is extracted from FIG. As shown in FIG. 4 (A3), the small size UIM2 can be used by folding it from the normal size UIM1, but the present invention assumes that the normal size UIM1 itself is mounted on a mobile phone or the like. Is. When the small size UIM2 is folded from the normal size UIM1, the UIM1 has a frame shape without an IC module (FIG. 4 (A2)).
Although the small size UIM2 (FIG. 4 (A3)) can be used for a mobile phone or the like that uses the size exclusively, in the present invention, the small size UIM2 is used by being re-fitted into the frame shape of the normal size UIM1. Not considered.

FIG. 5 is a diagram illustrating the positional relationship between the UIM and the terminal (pin) of the mobile phone.
The plan view of FIG. 5A shows the relationship between a conventional UIM 1j and a terminal (pin) 8 on the mobile phone side. The conventional UIM 1j is slid and inserted into the mobile phone, and stops at a position indicated by a broken line on the lower surface of the terminal (pin) 8 on the mobile phone as shown on the right side of FIG.
As shown in the cross section of FIG. 5B (cross section taken along the lines aa and bb in FIG. 5A), the terminal (pin) 8 on the mobile phone side protrudes toward the UIM1j side. It is easy to get caught by contacting or fitting into the peripheral slit 2s. Therefore, as shown in FIG. 5C, there is a problem that the portion marked with “x” in the peripheral slit 2s easily breaks or deforms the terminal (pin) 8 of the mobile phone.

  The shape of the connector (UIM mounting part) of the portable terminal varies depending on the manufacturer, but the mainstream is a slide type or constant pressure type spring pin type connector, which has a large merit in terms of simplified structure and low cost. This is because the UIM 1 is slid and inserted along the long side direction into a slit with a built-in spring pin in advance (a constant pressure is always applied to the UIM during sliding). This is because a predetermined contact pin is brought into pressure contact with the terminal surface contact region at the above position.

  However, with this structure, if even a part of the peripheral slit (groove) 2s is present in the left and right regions of the UIM 1 (the region where the contact pin contacts and slides), the pin fits into this groove, and the groove is inserted into the groove during insertion / extraction. Since an unreasonable load is applied due to collision, there is a problem that deterioration of the contact pin is promoted when it is repeatedly inserted and removed. In addition, since the impact is also applied to the UIM side, there is a concern that the UIM is deformed or, in the worst case, the small size UIM2 is dropped from the UIM1. The present invention solves the above problems.

Next, a method for manufacturing a UIM IC card will be described with reference to FIG.
First, as shown in FIG. 6A, an IC card card substrate 3 is manufactured. For example, the card substrate 3 is formed by temporarily stacking white hard vinyl chloride sheets 31 and 32 serving as core layers and transparent vinyl chloride sheets 33 and 34 serving as surface layers, and then introducing them into a press machine and applying hot pressure to the card substrate 3. Then, the integrated card substrate 3 is formed by heat-sealing the layers. However, it is not limited to the exemplified vinyl chloride sheet, and may be a PET-G sheet or a polyethylene terephthalate (PET) sheet. In the case of a PET sheet, an adhesive sheet is used in combination to bond the layers.

Next, after the IC card card substrate 3 is cut into individual card sizes, an IC module mounting recess 20 for mounting an IC module (hereinafter also referred to as “COT”) 5 is excavated. This is done using a numerically controlled milling device or the like. The IC module mounting recess 20 is excavated to include a first recess 21 that suspends the printed circuit board 7 portion of the IC module and a second recess 22 that houses the mold resin portion 17 of the IC module. A thermal adhesive tape 19 is attached in advance to the printed circuit board 7 portion of the IC module 5 (FIG. 6B). Alternatively, a liquid adhesive may be coated.
When the IC module 5 is loaded in the mounting recess 20 and then lightly heated and pressed from the surface of the contact terminal plate 6, the IC module 5 is fixedly mounted in the mounting recess 20.

  Next, as finishing processing, cutting of the peripheral slits 1s and 2s of the normal size UIM and the small size UIM, half cutting of the connection portions 1b and 2b, and the like are performed. The peripheral slits 1s and 2s penetrate the IC card substrate 3, and the width of the peripheral slit 1s can be about 0.2 to 2.0 mm. In the case of FIG. 6C, the cross section of the peripheral slit 1s appears in the drawing. However, in the case of the cross section along line AA in FIG. 1, the peripheral slit 1s does not actually appear in the drawing. Since the peripheral slit 2s is cut into the normal size UIM1, it is preferable that the upper limit of the width is fine up to about 1.0 mm. The peripheral edge 2r of the small size UIM usually has a width of 1 mm or less.

As described above, there are various methods for forming the connecting portions 1b1, 1b2, 2b1, 2b2, etc., as shown in FIG. 6 (C), a method in which a center layer is left by cutting from the upper and lower surfaces of the card substrate 3, In other words, the half-cut method is often used. In the case of half-cutting, the card substrate 3 is cut from the upper and lower surfaces so that the central portion remains about 0.2 mm to 0.5 mm.
As long as the mounting (mounting) of the IC module 5 is not hindered, the peripheral slit and the half-cut processing may be performed in a process continuous with the excavation of the recess 20 for mounting the IC module. After the end of cutting and the like, the IC chip is inspected and issued. If necessary, transfer sign panels, hologram labels, etc.

(Preparation of IC module)
A COT (Chip On Tape; glass epoxy base material, thickness 160 μm) IC chip on which a contact terminal board 6 is formed and a contact type IC chip is mounted is surrounded by a wire bonding part, and an epoxy resin is dropped to form a resin mold. did.
The size of the IC module contact terminal plate 6 is 12.0 mm × 11.0 mm, the mold resin portion 17 is size, 8.0 mm × 8.0 mm, and the height of the mold resin portion 17 not including the base material thickness is 440 μm.

  A heat-reactive adhesive tape (polyester resin system; thickness 50 μm) 19 is formed so as to cover the COT back surface (opposite surface of the contact terminal plate 6) and in contact with the first recess 21 except for the mold resin portion 17. And then laminated. The pressing conditions were 130 ° C. and time 5 seconds. During the lamination, the adhesive tape 19 was compressed by about 10 μm.

(Manufacture of IC card substrates)
A biaxially stretched white PET-G sheet (thickness: 360 μm) having a surface printed thereon is used as the core sheets 31 and 32 of the card substrate 3, and a biaxially stretched transparent PET having a thickness of 50 μm as the oversheets 33 and 34 on the upper and lower surfaces thereof. -Two G sheets were used. After these were temporarily stacked and stacked, they were introduced into a press machine, heat-pressure fused and press-laminated to prepare a card substrate 3.
The conditions for the pressing process were 150 ° C., 2.0 MPa, and molding (heating) time 30 minutes. After pressing, the card substrate 3 had a total thickness of 800 μm due to some shrinkage.

(Installation of IC module)
Next, as shown in FIG. 6B, the IC module mounting recess 20 was formed on the card substrate 3 by end milling under NC control. The first recess was excavated to a depth corresponding to the total thickness of the COT printed circuit board (thickness 160 μm) 7 and the adhesive tape 19, 200 μm.
Further, the second concave portion was excavated so that the total depth became 640 μm by further cutting so as to accommodate the mold resin portion 17 of the IC module 5 in the center portion.
The size of the opening of the first recess was 12.1 mm × 11.1 mm, and the second recess was substantially at the center thereof, and the size was 8.1 mm × 8.1 mm. The previously prepared IC module 5 was mounted (mounted) in the IC module mounting recess 20, and the IC module was fixed in the recess by applying heat pressure from the contact terminal plate surface. Thereby, the IC card substrate 3 mounted with the IC module was completed.

(Finishing)
A peripheral edge 2r having a width of 0.5 mm is left around the contact terminal plate 6 of the IC module 5 of the IC card substrate 3 and a peripheral slit 2s and connecting parts 2b1 and 2b2 are formed outside thereof as shown in FIG. Provided. The peripheral slit 2s had a width of 0.5 mm and was cut with an end mill.
The connecting portions 2b1 and 2b2 were cut from the upper and lower surfaces of the card substrate with an end mill having a width (diameter) of 0.2 mm to a depth of 0.2 mm so that the central layer remained with a thickness of 0.4 mm. The inside of the peripheral slit 2s and the connecting portions 2b1 and 2b2 is a small size UIM2.

  Furthermore, the peripheral slit 1s and the connection portions 1b1 and 1b2 were cut as shown in FIG. 1 so that the outer shape of the small size UIM2 was 15 mm × 25 mm. The peripheral slit 1s had a width of 1.0 mm and was cut with an end mill. The connection portions 1b1 and 1b2 were cut from the upper and lower surfaces of the card substrate 3 with an end mill having a width (diameter) of 0.2 mm to a depth of 0.2 mm so that the center layer remained with a thickness of 0.4 mm. The inside of the peripheral slit 1s and the connecting portions 1b1 and 1b2 is the normal size UIM1. Thereafter, inspection and issue processing were performed, and the UIM IC card 10 shown in FIG. 1 was completed.

  The UIM IC card 10 completed as described above can be easily folded with a fingertip, whether it is a normal size UIM1 or a small size UIM2, and can be folded as a normal size UIM1 like a conventional UIM IC card 10j. If the peripheral slit 2s comes into contact with or fits into the terminal (pin) on the portable device side when it is repeatedly used for a portable terminal or a cellular phone, the terminal (pin) may be deformed or broken. It never happened.

It is a figure which shows the example of the IC card for UIM of this invention. It is a figure which shows the other example of IC card for UIMs of this invention. It is a figure which shows the further another example of the IC card for UIM of this invention. It is a figure which shows UIM of this invention. It is a figure explaining the positional relationship of UIM and the terminal (pin) of a mobile telephone. It is a figure explaining the manufacturing process of IC card for UIM. It is a figure which shows the standard value regarding the shape etc. of UIM.

Explanation of symbols

1 Normal size UIM, UIM
1s Periphery slit 1b, 1b1, 1b2 Connection part (bridge)
2 Small size UIM
2s peripheral slit 2b, 2b1, 2b2, 2b3 connection part (bridge)
3 Card board 4 IC chip 5 IC module (COT)
6 Contact terminal board 7 Printed circuit board 8 Mobile phone terminal (pin)
10 UIM IC card 17 Mold resin part 20 IC module mounting recess

Claims (5)

Inside the wallet-sized card board, the outer shape of the normal size UIM is formed by multiple connection parts and peripheral slits that have been processed to facilitate folding, and further encloses the IC module contact terminal board in the normal size UIM In a UIM IC card in which the outer shape of the small size UIM is formed by a plurality of connection portions and peripheral slits that are similarly processed to facilitate folding, the folding processing of the small size UIM is facilitated Among the connected portions, at least one connection portion is provided in parallel with a portion adjacent to the short side of either of the left and right sides of the IC module contact terminal plate, and C1, C2 of the contact terminal plate. , C3, C4, C5, C6 , C7, C8 for UIM that the portions parallel to the short side of the terminal, characterized in that not formed peripheral slit C card. Inside the wallet-sized card board, the outer shape of the normal size UIM is formed by multiple connection parts and peripheral slits that have been processed to facilitate folding, and further encloses the IC module contact terminal board in the normal size UIM In a UIM IC card in which the outer shape of the small size UIM is formed by a plurality of connection portions and peripheral slits that are similarly processed to facilitate folding, the folding processing of the small size UIM is facilitated Among the connected portions, at least one connection portion is provided in parallel with a portion adjacent to the short side of either of the left and right sides of the IC module contact terminal plate, and C1, C2 of the contact terminal plate. , C3, C5, C6, C7 terminals, no peripheral slit is formed in a portion parallel to the short side , UIM IC card. In the UIM in which the outer shape of the small size UIM is formed by a plurality of connection portions and peripheral slits that have been processed to facilitate folding, in a portion surrounding the IC module contact terminal board in the normal size UIM. Of the connection parts that have been processed for facilitating UIM folding, at least one of the connection parts is provided in parallel with the portions adjacent to the left and right short sides of the IC module contact terminal plate, and the contact terminals A UIM characterized in that a peripheral slit is not formed in a portion parallel to the short side of the C1, C2, C3, C4, C5, C6, C7, and C8 terminals of the plate. In the UIM in which the outer shape of the small size UIM is formed by a plurality of connection portions and peripheral slits that have been processed to facilitate folding, in a portion surrounding the IC module contact terminal board in the normal size UIM. Of the connection parts that have been processed for facilitating UIM folding, at least one of the connection parts is provided in parallel with the portions adjacent to the left and right short sides of the IC module contact terminal plate, and the contact terminals A UIM characterized in that a peripheral slit is not formed in a portion parallel to the short side of the C1, C2, C3, C5, C6, and C7 terminals of the plate. A step of manufacturing a card base by superimposing a plurality of base sheets and applying heat pressure to integrate them, a step of excavating a recess for mounting an IC module in the card base, and an IC in the recess for mounting an IC module A step of mounting the module, a step of forming a small size UIM outer shape around the mounted IC module by a peripheral slit and a connecting portion that has been processed to facilitate folding, and an outer shape of a normal size UIM on the outside thereof A method of manufacturing a UIM IC card having a peripheral slit and a connection part that has been made easy to break, and a connection part that has been made easy to break the outer shape of a small UIM , the connecting portion of at least one place, provided in parallel to the portion adjacent to the short sides of the left and right of the IC module contact terminal plate and of the contact terminal plate 1, C2, C3, C4, C5, C6, C7, C8 producing method of UIM for IC card, characterized in that the portions parallel to the shorter side of the terminal so as not to form a peripheral slit.

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