JP4531430B2 - IC card for UIM - Google Patents

Description

The present invention relates to a UIM IC card having both contact and non-contact communication functions.
Here, the UIM IC card is generally formed in a wallet-sized card base so that the outer shape of the UIM can be folded off by a peripheral slit, and the UIM is folded from the peripheral slit so that the UIM can be The present invention relates to an IC card that is used by being attached to a reader / writer. In the present invention, the UIM is provided in the UIM contour portion of the card base of the wallet size so that it can be removed and reassembled, and the IC module is in contact with the IC card. A card that is non-contact use and has an antenna coil in the card base.

Such a UIM IC card can be used as a contact / non-contact IC card (generally also referred to as a combination card or dual interface card) before removing the UIM, and as a UIM in the removed state, First, it can be applied to adapters and reader / writers as an introductory card for opening and closing non-contact gates of facilities and transportation facilities, or for payment transactions such as non-contact shopping. There are features that can be used for identification. Further, there is an advantage that it can be used as a contact / non-contact IC card even when the UIM is re-assembled into the original card base.
Therefore, the technical field related to the present invention relates to the field of manufacture and use of UIM IC cards and UIMs.

In recent years, an IC card having a contact defined by ISO 7816-2 and ISO 7816-3 and a non-contact interface defined by ISO 14443 has been put into practical use.
On the other hand, security ID modules called SIM, UIM, and USIM cards, which are small IC cards, have been incorporated in mobile phones. In Japan, it has already been put into practical use by being incorporated into the latest mobile phones.
A UIM (User Identity Module) is a small IC card in which contractor information issued by a mobile phone company is recorded, and is incorporated in a mobile phone and used to identify a user.

This is an extension of functionality from a SIM (Subscriber Identity Module) that has the same function. In addition to contractor information, private information such as a phone book and personal identification information for credit payments are encrypted and registered. Is possible. Since it is based on SIM, it is sometimes called USIM (Universal SIM). The SIM is intended to use the GSM mobile phone service, but the UIM can be used, for example, by inserting it into an American cdma2000 mobile phone and receiving an international roaming service.
Since such a SIM or UIM has an existing technology for IC card manufacturing, if it has a card body with the same size as the IC card, its manufacturing and issuing processing is easy.

A SIM or UIM, which is a small IC card, is also called an IC carrier, and the IC carrier is held in a wallet-sized card. An application like this has been filed. These patent documents mainly propose a connection form between the plate-shaped frame and the IC carrier.
On the other hand, there is a prior art of Patent Document 3 for a contact non-contact type shared IC module. Patent Document 3 proposes that an antenna connection terminal is provided on the outside of an IC module in which an IC chip and a wire portion are covered with a sealing resin, and the antenna is connected to the antenna in the IC card by the connection terminal.

Patent Document 4 relates to a “SIM and SIM holder”, which is a SIM having a dual interface for contact and non-contact communication, in which an antenna coil is formed on the SIM itself, and an antenna coil is not formed on the SIM itself. Both the SIM and the SIM connected to the antenna coil of the SIM holder are proposed.
Also, as a conventional UIM IC card having an Anna coil, the one shown in FIG. 17 has been proposed by the present applicant.
FIG. 17A is an external view of a UIM IC card, FIG. 17B is a diagram showing the antenna coil 11 in the IC card, and FIG. In this case, when the UIM 2 surrounded by the peripheral slit 2s is broken, the connection portion with the antenna coil 11 in the card base 10 is cut at the bridge portion 2b. Therefore, even if the UIM 2 is reinserted into the original position, There is a problem that the non-contact communication function cannot be used.

JP 2002-163626 A JP 2002-236895 A JP 2002-123808 A Japanese Patent Application No. 2002-244613

As described above, an IC card having a dual interface of contact and non-contact is known and actually used in the market. A UIM for both contact and non-contact has also been proposed by the present applicant.
However, the UIM is held in a wallet-size card so that it can be folded, and the conventional UIM having both contact and non-contact communication functions has no antenna coil formed in the wallet-size card. There were inconvenient problems that could not be used as.
In addition, once folded, there is a problem that it cannot be used again as an IC card by being incorporated again in its original position. That is, there is a problem that the use application is limited even if an IC chip having a high function and high price is used.

  Therefore, the inventor of the present application can use the UIM as a contact and non-contact IC card in a state where the UIM is incorporated in a wallet-size card. Further, the UIM can be detached from the wallet-size card and can be reassembled. However, the present invention has been completed by studying forms that can always be used as an IC card.

In order to solve the above problems, the present invention firstly has a structure in which a UIM having an antenna coil in the UIM itself can be detached and re-installed in a UIM contour portion in a wallet-size card base made of a thin plate having the same thickness as the UIM. The IC card for the UIM attached to the UIM, the IC chip of the IC module attached to the UIM is for both contact and non-contact use, and the non-contact communication function part of the IC chip is connected to the antenna coil of the UIM itself to together, against the antenna coil of the antenna connections wallet size card base body via a which also serves as a support structure for UIM provided so that both of the connection end of the card body side and UIM side overlaps in side the contour A UIM IC card, wherein the non-contact communication function unit is connected to the C4 and C8 terminals of the contact terminal plate; Carry out the means.

In order to solve the above-mentioned problems, the present invention secondly has a structure in which a UIM having an antenna coil in the UIM itself can be detached and re-installed in a UIM contour portion in a wallet-size card base made of a thin plate having the same thickness as the UIM. is instrumentation wearing, and an IC card UIM having the removed one UIM for contour the reincorporation of other possible UIM, contact IC chip of the IC module mounted on the UIM is, For non-contact use, the non-contact communication function part of the IC chip is connected to the antenna coil of the UIM itself, and the connection end parts on both the card base side and the UIM side overlap with the inner side surface of the contour part. also connected to the antenna coil of the wallet size card base body via a contributing antenna connections as UIM of the support structure, and the non-contact communication function part A UIM IC characterized in that it is connected to the C4 and C8 terminals of the touch terminal board, and another antenna coil connected to the other UIM contour is also formed in the same card base. Card, do the means.

Thirdly, in order to solve the above-mentioned problems, the present invention thirdly has a structure in which a UIM having an antenna coil in the UIM itself can be removed and re-installed in a UIM contour portion in a wallet-size card base made of a thin plate having the same thickness as the UIM. in an IC card UIM being instrumentation wear, an IC chip contact and non-contact dual of the IC module mounted on the UIM, the non-contact communication function of the IC chip, the antenna coil of the UIM itself while connected to the antenna coil of said wallet size card base through contributing antenna connections to contour the sides as UIM of the support structure is provided so that both of the connection end of the card body side and UIM side overlaps connect and are non-contact communication function part is connected to the C4, C8 terminal of the contact terminal plate, Boo further not connected to the UIM UIM for an IC card characterized by having a data antenna coil in the card body, performing means.

In the above, the re-installable structure is a convex built-in structure that protrudes parallel to the contour line of the contour part on the IC card base side, and a concave built-in structure that matches the convex built-in structure on the UIM side Alternatively, the shape is formed on the side that is alternately formed on the side on the IC card base side, the side that is widened toward the lower surface, the side that is narrowed toward the lower surface, and the side on the UIM side. It is also possible to consist of sides that narrow alternately toward the bottom surface and sides that widen toward the bottom surface, which are alternately formed to match, or parallel to the contour line of the contour portion on the IC card base side and the structure of the concave trapezoidal shaped to engage with the convex trapezoidal convex trapezoidal shape and UIM side projecting can also be such that the, or parallel to the contour lines of the contour of the IC card base body Then protrude A recessed bearing structure that engages with the convex supporting structure of the convex support structure and UIM side that may be to have.
In these cases, since a strong built-in structure is obtained, a good connection between the UIM and the card base side antenna can be maintained.

In the above, when the UIM is incorporated in the UIM contour portion in the wallet size card base, the contact terminal plate of the IC module can be in a predetermined position of the wallet size card defined by ISO7816. In that case, the issuing process and the inspection can be performed using a normal IC card manufacturing device.

The UIM IC card of the present invention has the following effects.
(1) Since the non-contact communication function part of the IC chip is connected to the antenna coil in the wallet size card (ID-1 type stipulated in JISX6301), it remains in the wallet size card without removing the UIM Therefore, it can be used as a contact / non-contact IC card. (2) When the card is removed from the wallet size card, it can be used as a UIM attached to a reader / writer or a portable device. In that case, the antenna of the device can be used.
(3) The removed UIM can be re-assembled into the wallet size card and used as a contact / non-contact IC card in its original state. For example, it is possible to use an entrance / exit as an employee ID card with a contactless function and a credit / cash function with a contact function.
(4) That is, a cost reduction effect can be expected due to the fact that a single IC chip can be used for multiple functions.
(5) Since the UIM is reassembled firmly, conduction between the antenna coil connection end on the UIM side and the card base side is reliably ensured.
(6) The UIM non-contact communication function can be incorporated into a card base having an antenna coil for testing.

The UIM IC card of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a first embodiment of a UIM IC card of the present invention, FIG. 2 is a plan view showing a second embodiment of the UIM IC card of the present invention, and FIGS. FIG. 8 is a view for explaining the built-in structure between the antenna coil connection terminal and the antenna coil connection end on the card base side, and FIG. 9 is a view for explaining the built-in structure of the IC card base. FIG. 10 is a diagram illustrating a standard value related to the UIM shape and the like, FIG. 11 is a diagram illustrating a contact terminal plate surface of an IC module, and FIG. FIG. 13 is a diagram showing a back surface of an IC module, FIG. 14 is a plan view showing an antenna sheet, FIG. 15 is a diagram showing a laminated structure of an IC card substrate, and FIG. IC Joule mounting sectional diagrams, schematically showing.

In the first embodiment of the UIM IC card of the present invention, the UIM 2 is detachably and reassembled in the UIM contour portion 10 s of the UIM IC card 1 as shown in FIG. The terminal board for connecting the antenna coil of the IC module (not shown because it is not visible in FIG. 1) is composed of the antenna connecting portion 7 on the card base side and the UIM side antenna connecting portion (in FIG. 1). The antenna coil 11 is connected to the antenna coil 11 in the IC card base 10 via the invisible position.
The UIM 2 has an IC module contact terminal plate 6 on the surface, and a notch 4 for alignment at one corner of the rectangular substrate. Between UIM2 and the card | curd base | substrate 10, it has the convex-shaped built-in structure 10a, 10b, 10c in a suitable location. The UIM built-in structure and antenna connection will be described later.

  In the UIM IC card 1 of the first embodiment, the UIM2 can be used as a contact / non-contact IC card with the UIM2 incorporated in the card base 10, and when the UIM2 is removed, the UIM2 alone is attached to the device. Can be used. Only the antenna coil 11 remains in the card base 10 after the UIM 2 is removed. However, if the UIM 2 is stored, the UIM 2 can be reassembled and used as a contact / non-contact IC card. The antenna coil 11 is embedded in the card base 10 and cannot be observed from the outside.

In the second embodiment of the UIM IC card of the present invention, as shown in FIG. 2, the UIM IC card 1 has two UIM contour portions 10s and 10p, and one UIM contour portion 10s of the contour portion. The UIM 2 is detachably and re-installable inside.
In the case of FIG. 2, a state in which UIM2 is incorporated in both contour portions is illustrated, but the other UIM contour portion 10p has a structure in which UIM2 can be incorporated, but UIM2 itself does not have. Also good.
Unlike the one shown in FIG. 2, the UIM contour portion 10p may be positioned at a predetermined position defined by ISO when the card is turned upside down. In this case, the other UIM 2 is also arranged so as to be parallel to the long side of the card base 10.

Both UIM contour portions 10s and 10p are connected to the antenna coils 11a and 11b in the card base via the antenna base 7 on the card base and the antenna connection on the UIM on the lower surface thereof. Yes.
Since the antenna coil 11a and the antenna coil 11b are inevitably different in antenna size and number of turns, antennas having different communication characteristics can be obtained. For example, if the communication distances are different, it is possible to expect a usage method such as a close contact type for entering and leaving a company and a short range reaction type (about 10 to 20 cm) when entering a concert or the like.

In the UIM IC card 1 of the second embodiment, the UIM 2 can be used as a contact / non-contact IC card in a state where the UIM 2 is incorporated in the card substrate, and the UIM can be used alone in a state where the UIM 2 is removed. This usage is the same as in the first embodiment.
In the case of the second embodiment, there is a feature that UIM2 removed from the contour portion 10s can be incorporated into the contour portion 10p and used as a non-contact IC card having different communication characteristics depending on the antenna coil 11b. Since the antenna coils 11a and 11b remain in the card base after the UIM2 is removed, the UIM2 can be reassembled and used as an IC card if stored. This usage is the same as in the first embodiment.

As shown in FIG. 3, the UIM IC card according to the third embodiment of the present invention has the UIM 2 detachable and re-mountable in the UIM contour portion 10s of the UIM IC card 1, and the antenna coil of the IC module. The connection terminal board is connected to the antenna coil 11a in the IC card base 10 via the antenna base 7 on the card base side. This form is the same as the first embodiment.
A feature of the third embodiment is that, in addition to the antenna coil 11a, a booster antenna coil 11c for expanding communication functions is provided in the IC card base 10. As a result, the antenna coil 11c serves as a booster for the antenna coil 11a. A micro coil 11d and a micro capacitor 11e are mounted on the booster antenna coil 11c. The UIM 2 not only directly forms a closed circuit with the antenna circuit on the card base 10 side but also has a built-in closed circuit independent from this, and can be combined as a structure having a booster effect.

Various types of built-in structures as shown in FIGS. 4 to 7 can be adopted for assembling the UIM 2 and the IC card base 10.
FIG. 4 shows an example of such a structure that can be re-assembled into convex built-in structures 10a, 10b, 10c on the side of the IC card base 10 and the antenna connecting portion 7, and concave built-in structures 2a, 2b on the UIM 2 side. , 2c and the antenna connection portion 21. Two antenna coil connection ends 114 and 115 are exposed at the antenna connection portion 21.
In the case of FIG. 4, although it is a convex built-in structure, there exists the characteristic which is a flat trapezoid built-in structure. Such a flat built-in structure is preferable because it does not significantly erode the UIM area.
When the UIM 2 is incorporated into the contour portion 10s, the antenna connecting portion 21 on the UIM 2 side is inserted below the antenna connecting portion 7 on the card base 10 side, and then each incorporating portion is aligned and pressed with a fingertip. UIM2 can be easily incorporated. In the case of removal, the UIM 2 can be easily removed by pressing from the lower surface side of the UIM 2.

FIG. 5 shows another example in which a re-embeddable structure includes a built-in structure 10a, 10b, 10c having a convex shape on the IC card base 10 side and an antenna connection portion 7, and a built-in structure having a concave shape on the UIM side. Having 2a, 2b, 2c and the antenna connection part 21 is substantially the same as the case of FIG. However, in the case of FIG. 5, the built-in structure 10 b and the antenna connection portion 7 protrude so as to hold the upper half surface of the UIM 2, whereas the embedded structures 10 a and 10 c protrude so as to support the lower half surface of the UIM 2. There are differences. The UIM2 side has a structure corresponding to each.
The same applies to the case of FIG. 6, except that the convex built-in structures 10 a and 10 c on the IC card base 10 side protrude so as to support the entire short side of the UIM 2. The concave embedded structures 2a and 2c on the UIM2 side are also formed in a shape that matches the shape.
The incorporation in the case of FIG. 5 and FIG. 6 requires the use of some elastic deformation of the UIM 2, but an excessive force is not required if the protruding amount of the convex portion is within an appropriate range.

  FIG. 7 is another example in which the IC card base 10 side has a side 10g extending toward the lower surface of the side on the remaining three sides excluding the side where the antenna connection portion 7 is located. The sides 10j that narrow toward the bottom surface are alternately formed for approximately half the length of each side. The side 2g that expands toward the lower surface of the side and the side 2j that narrows toward the lower surface alternately on the side of the UIM2 so as to match the shape are alternately about half the length of each side. Is formed. It is preferable that the side where the notch 4 and the antenna connecting portion 21 are provided be vertical. In the case of FIG. 7 as well, the UIM 2 is lightly pressed from the upper surface after the antenna connection portion 21 of the UIM 2 is inserted into the lower surface of the antenna connection portion 7. Some resistance occurs in the side 2g portion that spreads toward the lower surface of the UIM 2, but if the spreading angle is in an appropriate range, it can be incorporated without any trouble. The change range within the range of about 2 to 30 degrees from the vertical plane is appropriate for the spread angle and the narrow angle.

  However, the above-described built-in structure is an example, and it is needless to say that the present invention is not limited to these shapes, and any shape that can be incorporated can be adopted. Since such a re-embeddable structure allows the UIM 2 to be folded on a single card base and it is difficult to form both structures at the same time, the UIM 2 having each built-in structure is usually The card base 10 is manufactured in a separate process and then integrated and integrated.

Various structures can be adopted for the built-in portion of the antenna connection portion 21 of the UIM 2 and the antenna connection portion 7 on the card base side. However, since the antenna connection portion is a portion for achieving electrical continuity, it must be ensured to have good continuity and durability against repeated use.
FIG. 8 shows an example of the structure in which the antenna coil connection end on the IC card base side is connected to the antenna coil connection terminal plate on the UIM side.
8A is a cross-sectional view taken along the line AA of the antenna connecting portion 7 in FIG. 4, FIG. 8B is a cross-sectional view taken along the line BB of the antenna connecting portion 21 in FIG. 4, and FIG. FIG. 9 is a cross-sectional view showing a state where the built-in antenna connecting portion 7 and the antenna connecting portion 21 are in contact with each other, and FIG. 9 is a cross-sectional view taken along the line CC in FIG.

As shown in FIG. 8A, the connection ends 114 and 115 of the antenna coil 11 are exposed at the antenna connection portion 7 on the card base 10 side.
As shown in FIG. 8B, the antenna coil connection end portions 114 and 115 are also exposed in the antenna connection portion 21 on the UIM2 side. The connection end portions 114 and 115 are for connection to the non-contact communication function portion of the IC chip as will be described later. In order to ensure good conduction, it is preferable that the metal surfaces of the connection end portions 114 and 115 slightly protrude from the plastic material surface of the card base. After the UIM2 is incorporated into the UIM contour portion 10s of the card base, as shown in FIG. 8C, the antenna coil connection ends 114 and 115 on the base side and the antenna coil connection ends of the antenna connection portion 21 on the UIM side. 114 and 115 are in contact with each other.

When the UIM 2 is incorporated in the card base 10, both antenna coil connection end portions 115 are in contact with each other as shown in FIG. The relationship of the other connection end 114 is the same. The contact surface of the connection end 115 may be finished to a surface inclined with respect to the card substrate surface. As will be described in detail later, the antenna connection structure is such that the antenna coil connection end portions 114 and 115 are extended to the lower surface of the IC module, and the antenna coil connection terminal plates 24 and 25 (see FIG. 16) of the IC module. It is intended to conduct. Originally, the antenna coil connection end portions 114 and 115 are wiring layers formed on the same card base, and therefore, when cut out from one card substrate, a portion overlapping with each other as shown in FIG. 9 is obtained. I can't.
Therefore, two card substrates are used. In order for the portion where antenna coil connection end portions 114 and 115 are in contact with each other to be a flat surface that is not uneven and smooth with respect to the card substrate, it is necessary to adjust the thickness of the surfaces of antenna coil connection end portions 114 and 115. .
The contact pressure between the antenna coil connection end portions 114 and 115 can be adjusted by setting the UIM2 size and the short side widths of the UIM contour portions 10s and 10p on the card substrate side to appropriate ranges.

Next, the shape of the UIM 2 and the IC module 5 will be described.
The UIM2 includes a contact defined by ISO7816-2 and ISO7816-3, and a non-contact interface defined by ISO14443. A contact / non-contact dual mode IC module is mounted on the back surface of the contact terminal board 8 of the UIM 2.
The shape of UIM2 is defined by GSM (Global System for Mobile communications) and 3GPP (3rd Generation Partnership Project) as shown in FIG.
The UIM2 is formed of a substrate having a long side of 25 mm and a short side of 15 mm, and has a uniform thin plate shape having a thickness of 0.76 mm. Therefore, it should be noted that a large shape change does not occur from the standard value even when forming a concave embedded structure. The reason why the notched portion 4 is provided at one corner is to align the position when it is mounted on a mobile phone or the like.
The numerical values in the figure indicate the position of UIM2 in the wallet size card, the numerical values of the long side and the short side, or the allowable position range of the C1 to C8 terminals.

The contact terminal board 6 of the IC module 5 used in the present invention is defined by ISO 7816 and is as shown in FIG. 11, but the terminal board surface itself is different from that of a normal contact IC card IC module. Absent.
As shown in FIG. 11, C1 (Vcc), C2 (RST), C3 (CLK), C5 (GND), C6 (Vpp), and C7 (I / O) are included, but C4 and C8 are RFU (Reserved for Future Use) terminal, which is not currently used.
In the present invention, when the UIM is mounted on a hybrid UIM holder or mobile phone, these C4 and C8 terminals are used for connection with the antenna of the UIM holder or mobile phone.

UIM2, as in Figure 12, since an antenna coil 211 itself UIM2, both ends of the A antenna coil 211 is made to connect to the antenna coil connection end 114, 115. When the antenna coil connection end portions 114 and 115 are also connected to the antenna coil 11 in the card base 10 via the antenna connection portion 21, an effect of enhancing the transmission / reception capability is produced.

An antenna coil 211 and the antenna coil connection terminal plates 24 and 25 so itself UIM2 includes an antenna coil 211, but so that the cross in the vicinity of the antenna connections 21 of UIM2, terminal plates 24 and 25 of the antenna coil 211 ( Alternatively, short-circuiting can be avoided by forming it in a depth region different from the antenna coil connection end portions 114 and 115). For example, the antenna coil 211 and the antenna coil connection ends 114 and 115 are formed on the front and back of the antenna sheet. The connection between the antenna coil 211 and the antenna coil connection terminal plates 24 and 25 (or the antenna coil connection end portions 114 and 115) is a method of injecting a conductive adhesive by excavating a small hole (conduction recess) in the intersecting area. Etc.

  The back surface of the IC module 5 is as shown in FIG. Wire bonding substrate side pads 26, 26a, and 26b are formed on the back surfaces of the C4 and C8 terminals by piercing the insulating base material of the printed circuit board 8. The pad 26a and the antenna coil connection terminal plate 24 are connected by a bonding wire 27 and further wire-bonded to the A1 pad (non-contact communication function unit pad) of the IC chip 3. On the other hand, the pad 26b and the antenna coil connection terminal plate 25 are connected by a bonding wire 27, and are further wire-bonded to the A2 pad (non-contact communication function part pad on the other side) of the IC chip 3. The wire connection portion and the IC chip 3 portion are later protected by resin molding.

The C4 and C8 contact terminals are connected to the antenna coil connection terminal plates 24 and 25 when the UIM2 is used in a mobile phone, a reader / writer, or a UIM adapter as described above. This is because the antenna is connected via the C4 and C8 terminals.
The antenna coil connection terminal plates 24 and 25 may have a shape extending and extending outside the substrate 8 of the IC module 5 as indicated by a broken line. In this case, an antenna coil connection structure can be provided outside the IC module contact terminal plate 6.

FIG. 16 is a diagram schematically showing a cross section of the IC module mounting portion of the UIM 2, and shows a schematic cross section along the antenna coil connection terminal plate 24. A cross section along the connection terminal board 25 appears in the same manner. In FIG. 16, the printed circuit board 8 of the IC module 5 is suspended from the first recess surface, and the resin mold portion 17 is mounted in the deepest portion (in the second recess) of the recess 20 for embedding the IC module.
The antenna coil connection terminal plate 24 is connected by the antenna coil connection end 114 and the conduction recess 15. The antenna coil connection terminal plate 25 is the same.

The antenna coil connection end portion 114 is exposed to the antenna connection portion 21 and connected to the antenna coil 11 on the card base 10 side. The non-contact communication function unit A1 of the IC chip 3 is wire-connected to the antenna coil connection terminal plate 24, and the C4 terminal and the antenna coil connection terminal plate 24 are also connected to each other via the wire bonding substrate side pads 26a. ing. The terminal having the wire bonding substrate side pad 26 opposite to the C4 terminal means other terminals such as C1, C2, C3, C5, C6, C7.
The antenna coil 211 in the UIM 2 is electrically connected to the antenna coil connection end 114 by the conduction recess 16. This conduction process can be performed at the stage of manufacturing the antenna sheet.

Since the IC card IC module 5 used in the present invention has the antenna coil connection terminal plates 24 and 25 as described above, the IC card IC module 5 is connected to the antenna coil 11 in the UIM IC card base 10 via the antenna connection portion 21. be able to. In this case, the IC card can be used as a contact / non-contact IC card.
On the other hand, when an antenna such as a mobile phone or UIM adapter is used as the UIM, it can be connected to the non-contact communication function unit of the IC chip 3 via the contact terminals of C4 and C8.
In other words, when the dual interface IC chip is modularized, there is an advantage that it can be used in many ways in one form.

Next, the manufacturing process of the UIM IC card will be described.
The UIM IC card for UIM and the IC card substrate (which will be referred to as “outer frame body” hereinafter) 10 are manufactured on the same substrate in the same process. However, it is considered that it is difficult to form a UIM2 folding structure and simultaneously form a re-mountable structure integrally on the same material.
Therefore, in the UIM IC card of the present invention, the manufacture of UIM2 and the manufacture of outer frame body 10 are premised on manufacturing in separate steps.

<Manufacture of UIM>
The manufacture of UIM2 starts with the manufacture of an IC card substrate.
As shown in FIG. 14, first, an antenna sheet (intermediate layer) to be inserted into the card base 10 is produced. The antenna sheet 101 has at least two end portions (antenna coil connection end portions 114, 114) to be joined to the antenna coil connection terminal plate (see FIG. 13) on the back side of the contact / non-contact COT (Chip On Tape) of the UIM 2. 115), a wiring circuit (antenna coil 11) starting from one end and ending at the other end is formed by a winding method, a copper foil or aluminum foil etching method, or a conductive ink silk printing method. The antenna coil of the UIM 2 itself is also formed at this stage. In addition, the rectangular broken line r in FIG. 14 shows the position where UIM2 is formed later.

  As shown in FIG. 15, the antenna sheet 101 is paired with another appropriate core sheet 102 as a central layer, and oversheets 103 and 104 are laminated on both sides of the antenna sheet 101 to apply heat pressure or adhesive. And the IC card base 10 is manufactured. The printing applied to the IC card substrate is laminated after printing on the core sheet or oversheet, or after lamination, is provided on the outermost surface by printing or transfer method. Up to this stage, it is performed in a multi-faceted state, but after hot pressing, it is punched into individual card sizes. In addition, the broken line q in FIG. 15 shows the position where the recessed part for IC module mounting is excavated later.

  Next, as shown in FIG. 16, the IC module mounting recess 20 is excavated by a counterbore method. The IC module mounting recess 20 includes a first recess for suspending the printed circuit board 8 portion of the IC module, and a second recess at a depth for embedding the resin mold portion of the IC module. Further, excavation for exposing the antenna coil connection ends 114 and 115 is performed. Although not appearing in FIG. 16, the antenna coil connection end 115 side is the same.

Next, when the UIM 2 is incorporated into the outer frame body 10, cutting is performed so that the antenna coil connection end portion 114 that is electrically connected to the outer frame side antenna coil is exposed to the antenna connection portion 21 of the UIM 2, and the UIM including the exposed portion is included. The portion is processed into a shape that engages with the antenna connecting portion 7 of the outer frame (see FIG. 4 and the like).
At the same time, the shape processing is performed so that the UIM 2 has a holding effect so that it does not easily fall off the outer frame body 10. In the case of UIM2, the peripheral slit is formed by an end mill, and the recessed built-in structures 2a, 2b, 2c and the antenna connection portion 21 are formed. Alternatively, after mounting the IC module, the rough shape of the UIM 2 may be punched out, and then the concave built-in structure, the antenna connection portion 21, and the like may be processed by an end mill.
As described above, these processes can be performed by numerical control (NC) precision machining by counterbore processing by an end mill, groove punching processing, and combination processing thereof.

The antenna coil of the IC module 5 is passed through an anisotropic conductive adhesive film (ACF) in which a conductive adhesive is applied or pasted to the antenna coil connection ends 114 and 115 exposed by excavation of the recess 20 for mounting the IC module. Connection terminal plates 24 and 25 are connected.
The IC module 5 is loaded and an IC module seal for pressure bonding is performed. Module sealing is performed by applying hot pressure to the contact terminal plate 6 surface with a heater block.
The IC module may be mounted after the UIM 2 is folded from the card substrate 10, but there is an advantage that the conventional device can be used before the UIM 2 is folded.

<Manufacture of IC card base>
First, an antenna sheet is manufactured. The antenna sheet has an antenna coil 11 and antenna coil connection ends 114 and 115, and is manufactured in the same manner as the UIM described in FIG. When the card base is also provided with a booster coil, this is done at the stage of the antenna sheet. Even when a small capacitor or small coil is attached to the booster coil, it is performed at the stage of the antenna sheet.

The IC card base 10 is manufactured. Also in this process, the antenna sheet is paired with another appropriate core sheet 102 as a central layer, and oversheets 103 and 104 are laminated on both surfaces and applied with heat pressure and integrated through heat fusion or adhesive. To do.
Punching to individual card sizes and punching of outline shapes of UIM contour portions 10s, 10p are performed. Next, the convex built-in structure and the antenna connection portion 7 in the contour portions 10s and 10p are cut into an accurate shape. This cutting is performed using a thin end mill blade.
The antenna connection portion 7 is exposed to the antenna coil connection ends 114 and 115 in the card base.

<Issuance processing>
After the UIM alone or the UIM 2 is re-installed in the card substrate 10, the necessary inspection and issuance processing is performed via the contact or non-contact interface (in the case of performing the UIM alone, contact) to the IC chip in the UIM. Do.
Each process up to the above is substantially the same as the manufacturing process of a normal contact / non-contact IC card except for the formation of an embedded structure.

An embodiment of the present invention will be described with reference to FIGS. 1, 3, 13, 14, and 16.
<Preparation of IC module for IC card>
A COT (glass epoxy base material, thickness 160 μm) IC chip 3 on which a contact terminal plate is formed and a contact / non-contact type IC chip is mounted and the wire bonding portion are surrounded, and an epoxy resin is dropped and molded. . The two antenna coil connection terminal plates 24 and 25 are exposed from the resin mold portion 17, but have a length that fits within the back surface of the printed circuit board 8 of the IC module (see FIG. 13).
The size of the IC module substrate was 13.0 mm × 11.8 mm, the size of the resin mold portion 17 was 8.0 mm × 8.0 mm, and the height of the resin mold portion 17 not including the substrate thickness was 440 μm. .

On the back surface of the COT (opposite surface of the terminal plate), except for the resin mold portion 17 and the antenna coil connection terminal plates 24 and 25, the first recess (in the IC module mounting recess and the contact terminal plate is placed). A heat-reactive anisotropic conductive adhesive tape (polyester resin system, thickness 50 μm) 9 was punched out and laminated so that the portion in contact with the portion) was covered.
The pressing conditions were 130 ° C. and time 5 seconds. During the lamination, the adhesive tape 9 was compressed by about 10 μm.

<Manufacture of antenna sheet>
As a card base antenna sheet, a base material in which a copper foil with a thickness of 35 μm is laminated on a white hard vinyl chloride sheet with a thickness of 360 μm is used, and the antenna coil 11 and antenna coil connection ends 114 and 115 are formed by photoetching. Formed. The antenna coil 11 has a square shape of approximately 42 mm × 42 mm, and was formed so as to make five turns.
In addition, the wiring part from which both antenna coil connection end parts 114 and 115 slip out from the outer shape of UIM2 was made into the wiring pattern shape located in the antenna connection part 7 (refer FIG. 14).

<Preparation of IC card base>
A sheet of white hard vinyl chloride sheet with a thickness of 360 μm is combined with this antenna sheet with the antenna coil 11 inside, and these two sheets are used as core sheets, and two sheets of a transparent vinyl chloride sheet with a thickness of 50 μm on both sides. After temporarily fixing a total of four sheets arranged on the upper and lower surfaces of the core sheet, they were fused by applying hot pressure (150 ° C., 0.03 MPa, time 40 minutes), and the antenna base embedded card base 2 I prepared a sheet. One sheet is used for manufacturing the UIM 2 and the other sheet is used for a card base having a UIM outline.
In this state, the antenna coil connection end portions 114 and 115 are present in the range of 410 μm to 445 μm from the card surface.

1. Manufacture of UIM <Cutting of recesses for mounting IC modules>
The IC module mounting recess 20 was formed by NC cutting of a counterbore machine.
First, the first recess was cut to a depth corresponding to the total thickness of the IC module substrate (contact terminal plate) and the adhesive tape 9 (see FIG. 16).
The size of the first recess at this stage was 13.1 × 11.9 mm (corner radius of curvature 2.5 mm), and the depth was 200 μm. This size is an opening about 0.1 mm larger than the actual terminal board size.

Further, the second concave portion (the deepest portion at the center of the concave portion for mounting the IC module) that accommodates the resin mold portion 17 of the IC module 5 has a size of 8.2 mm × 8.2 mm, a depth of 640 μm from the card surface, and a surface of the first concave portion. Further, excavation was performed so as to be 440 μm deep.
Finally, two conducting recesses (diameter 2 mm) 15 for conducting the antenna coil connecting terminal plates 24 and 25 of the IC module 5 and the antenna coil connecting end portions 114 and 115 in the card base are provided. 1 Drilled from the concave surface. The depth of excavation was about 430 μm from the card surface (see FIG. 16).

<Installation of IC module>
A liquid conductive thermosetting resin is applied on the antenna coil connection end portions 114 and 115 exposed by the conductive recess 15, and the previously prepared IC module 5 on which the heat-reactive conductive adhesive tape 9 is laminated is prepared. The IC module was fixed by punching from the COT and mounting, and applying the hot pressure (150 ° C., time 5 seconds) to melt the adhesive tape 9.
Thereby, both the adhesion between the IC module 5 and the IC card base 10 and the electrical connection between the IC module 5 and the antenna coil in the card base were completed.

<Finishing>
The outer shape was formed by an end mill so that the UIM 2 had a long side of 25 mm and a short side of 15 mm, and a notch 4 was provided at one corner. After that, as shown in FIG. 4 , the concave cut structures 2a, 2b, 2c were formed to have a length of about 7 mm so as to be 1.5 mm inside from the side. The antenna connection portion 21 was cut so that the antenna coil connection ends 114 and 115 were exposed on the surface. The thickness of the antenna coil connection end portions 114 and 115 exposed on the surface was cut to be a little more than ½ of the thickness of the original 35 μm foil. Thereby, UIM2 was completed.

2. Manufacture of IC Card Base The other sheet identical to the UIM2 base was used for the UIM IC card base.
After punching out the approximate position of the UIM 2 of the card base 10, the end mounting is used to form the convex embedded structures 10 a, 10 b, 10 c corresponding to the concave cut structures 2 a, 2 b, 2 c of the UIM 2 and the antenna connection portion 7. A shape was formed.
The thicknesses of the antenna coil connection end portions 114 and 115 exposed on the surface of the antenna connection portion 7 were cut to be a little more than ½ of the thickness of the original 35 μm foil. Thus, the UIM IC card base (outer frame) 10 was completed.

The UIM 2 completed in the above steps is incorporated into the outer frame body 10 having the UIM contour portion 10s to complete the UIM IC card 1 (see FIG. 1).
It was also confirmed that the UIM IC card 1 can be used as a contact / non-contact IC card without trouble, and the UIM 2 can be removed and used as a mobile phone UIM. Further, it was possible to use it again by incorporating it in the original UIM IC card substrate 10.

  Although UIM2 was manufactured in the same process as Example 1, it formed in the IC card base | substrate (outer frame) 10 in the shape which has the antenna coil 11c for boosters like FIG.

<Manufacture of antenna sheet>
As a card base antenna sheet, a base material in which a copper foil with a thickness of 35 μm is laminated on a white hard vinyl chloride sheet with a thickness of 360 μm is used, and the antenna coil 11 and antenna coil connection ends 114 and 115 are formed by photoetching. Formed. The antenna coil 11 has a square shape of approximately 42 mm × 42 mm and is formed so as to make five turns, and the booster antenna coil 11 c is formed in a square shape of approximately 36 mm × 36 mm and has five turns inside thereof. Formed.
In addition, the wiring part from which both antenna coil connection end parts 114 and 115 slip out from the outer shape of UIM2 was made into the wiring pattern shape located in the antenna connection part 7 (refer FIG. 14).

The preparation and finishing of the IC card base were performed using the same materials and processes as in Example 1 to complete the IC card base (outer frame) 10.
The UIM 2 completed in the above steps is incorporated into the outer frame body 10 having the UIM contour portion 10s to complete the UIM IC card 1 (see FIG. 3).
It was confirmed that this UIM IC card 1 was used as a contact / non-contact IC card without hindrance and had a booster effect. It was also confirmed that the UIM2 can be removed and used as a mobile phone UIM. Further, it was possible to use it again by incorporating it in the original UIM IC card substrate 10.

  In the above embodiments, the UIM 2 and the IC card base 10 are manufactured using the conventional IC card manufacturing process. However, the UIM 2 is also manufactured by a manufacturing method in which an IC module is insert injection molded. It is obvious to those skilled in the art that the IC card substrate can be manufactured in the same manner, and it is obvious that the UIM IC card of the present invention is not limited to the manufacturing method of the embodiment.

It is a top view which shows 1st Embodiment of the IC card for UIM of this invention. It is a top view which shows 2nd Embodiment of the IC card for UIM of this invention. It is a top view which shows 3rd Embodiment of the IC card for UIM of this invention. It is a figure explaining the built-in structure of UIM and an IC card base. It is a figure explaining the built-in structure of UIM and an IC card base. It is a figure explaining the built-in structure of UIM and an IC card base. It is a figure explaining the built-in structure of UIM and an IC card base. It is a figure explaining the built-in structure between an antenna coil connection terminal and the antenna coil connection edge part by the side of a card base. It is a figure explaining the connection state between an antenna coil connection terminal and the antenna coil connection edge part by the side of a card base. It is a figure which shows the standard value regarding the shape etc. of UIM. It is a figure which shows the contact terminal board surface of an IC module. It is a figure which shows UIM with an antenna coil. It is a figure which shows the back surface of an IC module. It is a top view which shows an antenna sheet. It is a figure which shows the laminated structure of an IC card base | substrate. It is the figure which showed typically the IC module mounting part cross section of UIM. It is a figure explaining the conventional IC card for UIM.

Explanation of symbols

1 UIM IC card 2 UIM
2a, 2b, 2c Concave built-in structure 2s Peripheral slit 3 IC chip 4 Notch 5 IC module 6 Contact terminal board 7 Antenna connection 8 Printed circuit board 9 Conductive adhesive tape 10 Card base, outer frame 10s, 10p For UIM Contour parts 10a, 10b, 10c Convex built-in structure 11, 11a, 11b Antenna coil 11c Antenna coil for booster 14 Notch part 15, 16 Concave concave part 17 Resin mold part 20 IC module mounting concave part 21 Antenna connection part 24, 25 Terminal board for antenna coil connection 26, 26a, 26b Wire bonding substrate side pad 27 Bonding wire 114, 115 Antenna coil connection end

Claims (8)

A UIM IC card in which a UIM having an antenna coil is attached to a UIM contour in a wallet-size card base made of a thin plate having the same thickness as the UIM, and the UIM itself has a structure that can be removed and reassembled. The IC chip of the IC module mounted on the UIM is for both contact and non-contact use, and the non-contact communication function part of the IC chip is connected to the antenna coil of the UIM itself, and the card base side and UIM are connected to the inner side surface of the contour part. via the antenna connection portion which also serves as a support structure of UIM provided so that both the connection ends of the side overlap to connect to the antenna coil of the wallet size card substrate, and the non-contact communication function part contact terminal plate A UIM IC card characterized by being connected to C4 and C8 terminals. The UIM for contour of the wallet size card base made of thin sheet of UIM same thickness, UIM is instrumentation wearing removal and re-embeddable structure having an antenna coil in UIM itself, and the removed UIM re A UIM IC card having another UIM contour that can be incorporated, wherein the IC chip of the IC module mounted on the UIM is for both contact and non-contact use, and non-contact communication of the IC chip The functional unit is connected to the antenna coil of the UIM itself, and the inner end surface of the contour unit is provided so that the connection ends on both the card base and UIM sides overlap with each other via an antenna connecting unit that also functions as a UIM support structure. connect the antenna coil wallet size card base Te, and you connect non-contact communication function part in C4, C8 terminal of the contact terminal plate , UIM for an IC card, characterized by being further formed in addition to the antenna coil be the same card substrate to be connected to the other one UIM for contour. The UIM for contour of the wallet size card base made of thin sheet of UIM same thickness, an IC card UIM to UIM having an antenna coil in UIM itself is instrumentation wearing removal and re-embeddable structure The IC chip of the IC module mounted on the UIM is for both contact and non-contact, and the non-contact communication function part of the IC chip is connected to the antenna coil of the UIM itself, via the antenna connection portion which also serves to connect the antenna coil wallet size card substrate as a support structure for UIM provided so that both the connection ends of the UIM side overlap, and non-contact communication function part contact terminal There is a booster antenna coil in the card base that is connected to the C4 and C8 terminals of the board and not connected to the UIM. UIM for IC card according to claim Rukoto. The re-installable structure includes a convex built-in structure that protrudes parallel to the contour line of the contour portion on the IC card base side, and a concave built-in structure that matches the convex built-in structure on the UIM side. The UIM IC card according to any one of claims 1 to 3, wherein the UIM IC card is a UIM IC card. The re-installable structure is alternately formed on the side of the IC card base so that the side extends toward the lower surface, the side narrows toward the lower surface, and the side on the UIM side so as to match the shape. 4. The UIM IC card according to claim 1, further comprising: a side that narrows toward the lower surface and a side that widens toward the lower surface. Re embeddable structure, the structure of a concave trapezoid shaped to engage with the convex trapezoidal convex trapezoidal shape and UIM side projecting parallel to the contour lines of the contour of the IC card base body and consists of The IC card for UIM according to any one of claims 1 to 3, wherein the IC card is for UIM. Re embeddable structure, a concave receiving structure that engages with the convex supporting structure of the convex support structure and UIM side projecting parallel to the contour lines of the contour of the IC card base body, to have a The UIM IC card according to any one of claims 1 to 3, wherein the UIM IC card is a UIM IC card. The contact terminal board of the IC module is located at a predetermined position of the wallet size card defined by ISO7816 when the UIM is incorporated into the UIM contour portion in the wallet size card base. The UIM IC card according to claim 1.

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