JP4643055B2 - TAB tape carrier manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a TAB (Tape Automated Bonding) tape carrier used for a CSP (Chip Size Package) or the like.
[0002]
[Prior art]
Conventionally, in manufacturing this type of TAB tape carrier, as shown in FIG. 11, a large number of small holes 54 of a base film 53 having a copper foil 52 bonded to the surface by an adhesive 51 are filled with a conductive portion 55 by plating. When forming, it plated so that the electroconductive part 55 might protrude rather than the back surface of the base film 53, with the base film 53 exposed.
[0003]
After the electronic parts are mounted on the base film 53, when the conductive portion 55 of the base film 53 and the metal terminal of another printed circuit board are connected, the conductive portion 55 protrudes from the back surface of the base film 53. A reliable electrical connection could be obtained for connection between the portion 55 and another printed circuit board.
[0004]
[Problems to be solved by the invention]
Conventionally, since the conductive portion 55 is formed so as to protrude from the back surface of the base film 53 as described above, a vacuum is applied from the back side of the base film 53 by an exposure machine in an exposure process in a subsequent process, for example, a circuit pattern forming process. When processing by suction and fixing, a suction hole is provided in the metal plate for suction, and when the base film 53 is conveyed as shown in FIG. Therefore, there is a problem that the projecting portion 55a of the conductive portion 55 is rubbed against the metal plate 57 and the conductive portion 55 is damaged.
[0005]
Therefore, an object of the present invention is to provide a method for manufacturing a TAB tape carrier that can prevent damage to a conductive portion after forming the conductive portion in the small hole.
[0006]
[Means for Solving the Problems]
Therefore, in order to achieve the above object, the invention described in claim 1 uses a base film in which a protective film is attached to one surface and a cover film is attached to the other surface with an adhesive, and the cover film and the protection film are protected. The process of punching through the film to form small holes in the base film, the process of peeling the cover film, and then sticking the copper foil using an adhesive, and the protective film surface thicker than the base film Forming a conductive portion having a thickness not exceeding in the small hole.
[0007]
According to the second aspect of the present invention, in order to achieve the above object, in the method for manufacturing the TAB tape carrier according to the first aspect, after the electronic component is mounted on the other surface of the base film, the protective film is peeled off. It has the process, It is characterized by the above-mentioned.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 8 sequentially show the steps of the present invention.
[0009]
First, as shown in FIG. 1, one surface of the base film 3 is laminated with a protective film 4 using the base film 3 obtained by laminating the cover film 1 with the adhesive 2 on the other surface of the base film 3. A base film having a cover film laminated on both sides in advance may be used. In this case, the cover film on one side becomes the protective film 4.
[0010]
Next, as shown in FIG. 2, a large number of small holes 5 that also penetrate the cover film 1 and the protective film 4 are formed in the base film 3 by punching.
[0011]
Next, as shown in FIG. 3, after the cover film 1 on the other side is peeled off, the copper foil 6 is laminated on the other side using the adhesive 2 as it is.
[0012]
Next, as shown in FIG. 4, conductive portions 7 are formed in a large number of small holes 5. As an example of the formation method, the conductive portion 7 is filled and formed in the small hole 5 by plating from one side. In that case, as shown in the enlarged view of FIG. 9, the conductive portion 7 is set so as not to exceed the protective film surface 4 a. That is, the conductive portion 7 is thicker than the thickness of the adhesive 2 and the base film 3, but is thinner than the thickness including the thickness of the adhesive 2, the base film 3 and the protective film 4, and does not reach the protective film surface 4a. Thickness. Thereby, the protective film 4 protrudes to the one surface side rather than the electroconductive part 7. FIG.
[0013]
As another example of the method for forming the conductive portion 7, the small hole 5 is slightly larger than the diameter of the small hole 5 and thicker than the adhesive 2 and the base film 3. The conductive portion 7 made of a thin metal and having a cylindrical shape may be press-fitted and formed rather than the thickness including the thickness of the agent 2, the base film 3, and the protective film 4.
[0014]
Next, as shown in FIG. 5, a photoresist / exposure treatment is performed on the copper foil 6 on the other surface side to form a circuit pattern.
[0015]
Next, as shown in FIG. 6, the coating pattern 8 is applied to the circuit pattern and the conductive portion 7 made of the copper foil 6, and the ink 9 that protects the circuit pattern is printed.
[0016]
After that, as shown in FIG. 7, an IC chip 11 as an example of an electronic component is bonded onto a circuit pattern made of copper foil 6 using a die attach film 10, and a wire 12 is bonded to form a sealing resin. These are sealed at 13 to obtain a module on which the IC chip 11 is mounted. The protective film 4 is left until this step.
[0017]
Next, after the protective film 4 is peeled off from the module as shown in FIG. 8 so that the conductive portion 7 covered with the coating plating 8 protrudes from one surface of the base film 3, as shown in FIG. The conductive portion 7 is connected to a copper pattern 16 which is a metal terminal on another printed circuit board 15 which is also coated with the coating plating 14 with a solder paste 17, and the module is mounted on the printed circuit board 15.
[0018]
【The invention's effect】
As described above, according to the present invention, after a protective film is attached to one surface of the base film and a small hole is formed in the base film, the conductive portion having a thickness not exceeding the surface of the protective film is formed in the small hole. After mounting the electronic component on the other side of the base film, the protective film is peeled off, so that reliable conduction is obtained for connection between the conductive part and the other printed circuit board, and in the small hole After the conductive portion is formed, the conductive portion can be prevented from being damaged.
[Brief description of the drawings]
1 to 8 are process diagrams sequentially showing a method according to the present invention, and FIG. 1 is a process of laminating a protective film on a base film.
FIG. 2 is a punching process of small holes.
FIG. 3 is a copper foil laminating process.
FIG. 4 is a conductive part forming step.
FIG. 5 is a circuit pattern forming step.
FIG. 6 is a coating plating / printing process.
FIG. 7 is an IC mounting / resin sealing step.
FIG. 8 is a protective film peeling step.
9 is a partially enlarged cross-sectional view of FIG.
10 is a cross-sectional view of a state where the module after the process of FIG. 8 is mounted on a printed board.
FIG. 11 is a cross-sectional view after a conventional plating process.
FIG. 12 is a cross-sectional view for explaining that a conductive portion is damaged in the related art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cover film 2 Adhesive 3 Base film 4 Protective film 4a Protective film surface 5 Small hole 6 Copper foil 7 Conductive part 8 Cover plating 9 Ink 10 Die attach film 11 IC chip 12 Wire 13 Sealing resin 14 Cover plating 15 Printed circuit board 16 Copper pattern 17 Solder paste

Claims (2)

Adhering a protective film on one side, a cover film on the other surface by using a base film pasted with an adhesive, forming a small hole by punching the base film and also through the cover film and said protective film And a process of
After peeling the cover film, a step of attaching a copper foil using an adhesive,
Forming a conductive portion in the small hole that is thicker than the base film and does not exceed the surface of the protective film;
A method for producing a TAB tape carrier, comprising:   The method for producing a TAB tape carrier according to claim 1, further comprising a step of peeling the protective film after mounting an electronic component on the other surface of the base film.

Images