JP4563731B2 - Circuit structure and function card having the same - Google Patents

Description

The present invention, the circuit structure and relates to the function card including the same, in particular, functional pattern layer provided therewith circuit structure body and formed by etching according to the pattern formed by the gravure printing IC tag, it relates to the function cards such as an IC card.

  In recent years, functional cards such as IC tags and IC cards have made remarkable progress, such as anti-theft tags, tags for checking in and out, telephone cards, credit cards, prepaid cards, cash cards, ID cards, card keys, and various membership cards. , Has begun to be used for book tickets, medical examination tickets, commuter passes, etc. These functional card antenna circuit components include a base material made of a resin film such as a polypropylene (PP) film and a polyethylene terephthalate (PET) film, and an antenna circuit pattern layer made of a metal foil formed on the surface of the base material. It consists of. The antenna circuit pattern layer is formed on the surface of the base material by attaching the metal foil to one or both surfaces of the base material with a dry laminate method or the like and then etching the metal foil. The

  A conventional antenna circuit structure having the above-described configuration, a function card including the same, and a method for manufacturing the antenna circuit structure are described in Japanese Patent Application Laid-Open No. 2004-140587 (Patent Document 1).

  By the way, in a conventional non-contact type IC tag or IC card, information is often transmitted and received using a radio wave having a short wavelength of 13.56 MHz. As a circuit structure incorporated in such an IC tag or IC card, a loop-shaped metal antenna coil portion is formed as an antenna circuit pattern layer on a resin film, and a necessary semiconductor device (device) such as an IC is mounted. What has been used has been used. In such a configuration, the metal antenna coil portion itself has a certain size (for example, a business card size), and there is a limit to further downsizing the IC tag and the IC card. For this reason, there was a problem that the use of a functional card was restricted.

  In recent years, in order to further reduce the size of IC tags and IC cards, microwaves having a shorter wavelength of 2.45 GHz are used, and a non-loop (for example, rectangular) is used instead of the conventional loop-shaped antenna circuit pattern layer. It has been studied to adopt an antenna circuit pattern layer of a shape dipole antenna. Along with such miniaturization, the dimensional accuracy of circuits has become strict, and a precise circuit structure in which the distance between conductor layers in the circuit pattern layer is 200 μm or less is required.

As described in Japanese Patent Application Laid-Open No. 2004-140587 (Patent Document 1), the conventional manufacturing method uses a resist ink layer antenna circuit pattern formed by gravure printing on the surface of a metal foil as a mask. A metal antenna circuit pattern layer is formed by etching at least a part of the foil.
JP 2004-140587 A

  However, the conventional manufacturing method cannot stably mass-produce the circuit structure including the above-described precise circuit pattern layer at low cost.

  In addition, when a circuit structure having a precise circuit pattern layer as described above is manufactured by a conventional manufacturing method, a short circuit (short circuit) occurs between conductor layers, or a function card malfunctions and sufficiently satisfies the required quality. There was a problem that the circuit structure could not be manufactured and the product yield was greatly reduced.

Accordingly, an object of the present invention is to provide a circuit structure including a functional pattern layer that can satisfy the demand for miniaturization and can improve mass productivity and reliability.

  Another object of the present invention is to provide a functional card having a circuit structure that can satisfy the demand for miniaturization and can improve mass productivity and reliability.

The circuit structure according to the present invention is partially etched so as to have a predetermined function in accordance with a base material containing a resin and a resist ink layer pattern formed on the base material and formed by gravure printing. Ru circuit structure der having a functional pattern layer including metal foils. A step of gravure printing a resist ink layer having a pattern on a metal foil and fixing a substrate containing a resin on the surface of the metal foil that is not gravure printed; and at least one of the metal foil using the resist ink layer as a mask Forming a functional pattern layer including a metal foil and having first and second pattern layer portions separated by an interval of 200 μm or less by etching a portion, and in the gravure printing step, Using a gravure roll in which a plate hole (also referred to as a gravure cell) is formed by linking cells having a pitch size smaller than the pitch size of a cell printing another portion of a pattern to a gravure roll portion that prints the peripheral portion of The above-described circuit structure is manufactured by a manufacturing method that performs gravure printing. By manufacturing the circuit structure in this manner , the functional pattern layer has first and second pattern layer portions separated by an interval of 200 μm or less at the place where the IC chip is mounted. The difference between the maximum value and the minimum value of the interval of the pattern layer portion is 40 μm or less.

In the circuit structure according to the present invention, even if the first and second pattern layer portions are separated by a minute interval of 200 μm or less among the portions where the IC chip of the functional pattern layer is mounted, the first and second Since the difference between the maximum value and the minimum value of the interval of the pattern layer portion is controlled to 40 μm or less, it is possible to prevent a short circuit from occurring between the pattern layer portions. Thereby, the reliability of a circuit structure can be improved. In addition, in order to produce the circuit structure of the present invention, in the gravure printing step, a plate hole is formed by connecting the predetermined cells to a portion of the gravure roll that prints the peripheral portion of the pattern. Since a process for obtaining a precise pattern can be performed in stages, it is possible to prevent a short circuit from occurring between the first and second pattern layer portions separated by an interval of 200 μm or less. Thereby, the mass productivity and reliability of a circuit structure can be improved.

  In the circuit structure of the present invention, the functional pattern layer preferably includes an antenna circuit pattern layer. In this case, the functional pattern layer can be applied to a non-looped dipole antenna as the circuit structure is downsized.

  Moreover, the circuit structure of this invention WHEREIN: The functional pattern layer may contain the resist ink layer formed on metal foil. In this case, the resist ink layer used as a mask in etching the metal foil can be left without being removed depending on the purpose and application of the circuit component.

  The function card according to the present invention includes a circuit structure having any one of the above-described configurations. Preferably, the functional card further includes an IC chip mounted on the functional pattern layer so as to straddle the interval between the first and second pattern layer portions. Preferably, the function card is an IC tag.

  The method for producing a circuit structure according to the present invention includes a step of gravure printing a resist ink layer having a pattern on a metal foil, and a step of fixing a base material containing a resin on the surface of the metal foil that is not gravure printed And a functional pattern layer having the first and second pattern layer portions including the metal foil and spaced apart by 200 μm or less by etching at least a part of the metal foil using the resist ink layer as a mask. Forming a step. In the gravure printing process, a plate hole (also referred to as a gravure cell) is formed by connecting a cell having a pitch dimension smaller than the pitch dimension of a cell for printing the other part of the pattern to a gravure roll part for printing the peripheral part of the pattern. Gravure printing is performed using a gravure roll that has been formed or at least one of forming a plate hole by connecting recess patterns having a width smaller than 200 μm.

As described above, according to the present invention, it is possible to meet the demand for miniaturization, the mass productivity and the circuit component which can improve the reliability with features patterned layer capable function card with it Can be provided.

  FIG. 1 is a plan view showing a main part of an antenna circuit structure for a functional card according to one embodiment of the present invention, for example, a dipole antenna circuit structure for an IC tag, and FIG. 2 is indicated by II in FIG. FIG. 3 is a partial cross-sectional view of the functional card antenna circuit structure viewed from the direction along the line III-III in FIG. 1. FIG. 9 is a partially enlarged plan view showing the slit edge of the portion (indicated by a two-dot chain line) where the IC chip is mounted in FIG.

  As shown in FIGS. 1 to 3, the antenna circuit component includes a resin film substrate 20, an adhesive layer 30 formed on the surface of the resin film substrate 20, and a predetermined surface on the surface of the adhesive layer 30. The antenna circuit pattern layer 100 is made of a metal foil formed according to the above pattern. The antenna circuit pattern layer 100 has an outer peripheral edge formed by the outer peripheral edge portions 101, 102, 103, 104, and 105 of the pattern layer, and is formed from the edge portions 106 and 107 of the pattern layer slit and the inner peripheral edge portions 108 and 109 of the pattern layer slit. A dipole antenna is formed by having a substantially L-shaped slit portion. The distance G between the pattern layer slit edge portions 106 and 107 of the antenna circuit pattern layer 100 and the distance between the pattern layer slit inner peripheral portions 108 and 109 are 200 μm or less. Further, as shown in FIG. 9, the difference between the maximum value Gmax and the minimum value Gmin of the gap G is controlled to 40 μm or less. As shown in FIG. 2, the IC chip 50 is mounted so as to straddle the gap G between the pattern layer slit edge portions 106 and 107.

  As described above, in the antenna circuit configuration body, in the antenna circuit pattern layer 100, the pattern layer slit edge portions 106 and 107 and the pattern layer slit inner peripheral portions 108 and 109 are separated by a minute interval of 200 μm or less. Even if it is, it can prevent that a short circuit arises between pattern layers. Further, since the difference between the maximum value and the minimum value of the interval at which the IC chip is mounted is controlled to 40 μm or less, the reliability of the antenna circuit structure can be improved thereby.

  The antenna circuit pattern layer 100 is formed by etching a metal foil using the resist ink layer formed in the gravure printing process as a mask. This manufacturing process will be described later.

  Further, in one embodiment of the present invention shown in FIGS. 1 to 3, the resist ink layer used as a mask when the metal foil is etched is removed on the antenna circuit pattern layer 100. Depending on the purpose and use of functional card products such as IC cards and IC tags, the resist ink layer may be left without removal.

  FIG. 4 is a plan view showing a functional card antenna circuit structure according to another embodiment of the present invention, for example, an IC tag dipole type functional card antenna circuit structure, and FIG. It is the elements on larger scale which expand and show the location to show. FIG. 3 is a partial cross-sectional view of the functional card antenna circuit assembly viewed from the direction along the line III-III in FIG.

  As shown in FIGS. 3 to 5, the antenna circuit component includes a resin film substrate 20, an adhesive layer 30 formed on the surface of the resin film substrate 20, and a predetermined surface on the surface of the adhesive layer 30. Antenna circuit pattern layer 200 made of a metal foil formed according to the above pattern. The antenna circuit pattern layer 200 is composed of two island-shaped pattern layers formed separately, and the outer peripheral edge is formed by the pattern layer outer peripheral edges 201 to 212 and 215 to 218, and the pattern layer gap edge 213 is formed. And a gap formed by 214 forms a dipole antenna. The gap G between the pattern layer gap edge portions 213 and 214 of the antenna circuit pattern layer 200 where the IC chip is mounted is 200 μm or less. The difference between the maximum value and the minimum value of the gap G is controlled to 40 μm or less. As shown in FIG. 5, the IC chip 50 is mounted so as to straddle the gap G between the pattern layer gap edge portions 213 and 214.

  As described above, in the antenna circuit configuration body, even if the gaps between the pattern layer gap edges 213 and 214 in the antenna circuit pattern layer 200 are separated by a minute interval of 200 μm or less, a short circuit is prevented from occurring between the pattern layers. can do. Further, since the difference between the maximum value and the minimum value of the interval at which the IC chip is mounted is controlled to 40 μm or less, the reliability of the antenna circuit structure can be improved thereby.

  In the above-described embodiment, the metal foil constituting the antenna circuit pattern layer 100 or 200 is an aluminum foil, a copper foil, or the like. Among metal foils, it is most preferable to use an aluminum foil as a constituent material of the antenna circuit pattern layer 100 or 200 from the viewpoints of economy, versatility, and reliability. Here, the aluminum foil is not limited to pure aluminum foil, but also includes aluminum alloy foil.

  The metal foil preferably has a thickness of 7 μm to 60 μm, more preferably 15 μm to 50 μm.

  In the embodiment described above, the resin constituting the resin film substrate 20 is polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or the like, and has a thickness of 5 μm to 80 μm. Is preferred. The type and thickness of the resin constituting the resin film substrate are usually selected according to the purpose and application of the finally produced functional card. In the use of an IC tag or IC card, PET or PEN or the like is selected as the type of resin from the viewpoint of processing and cost, and it is used with a thickness of about 25 to 50 μm.

  In the embodiment described above, the adhesive layer 30 is interposed in order to laminate and fix the metal foil constituting the antenna circuit pattern layer 100 or 200 to the resin film substrate 20. In this case, the metal foil is fixed to the resin film substrate by a dry laminating method using an adhesive.

  Next, a method for manufacturing a functional card antenna circuit assembly according to one embodiment of the present invention will be described. FIGS. 6 to 8 show the manufacturing process of the functional card antenna circuit assembly according to one embodiment of the present invention, and are partial cross-sectional views seen from the direction along line III-III in FIG.

  As shown in FIG. 6, an adhesive layer 30 is formed on one surface of the metal foil 10 that is not subjected to gravure printing, and the resin film substrate 20 is fixed with the adhesive layer 30 interposed. For example, a strip-shaped aluminum foil having a width of 500 to 1000 mm is used as the metal foil 10, a PET film is used as the resin film substrate 20, and an adhesive for dry lamination is used as the adhesive layer 30. Thus, the laminated body of the metal foil 10 and the resin film base material 20 is prepared.

  As shown in FIG. 7, a resist ink layer 40 is gravure-printed on the surface of the metal foil 10 in accordance with a predetermined antenna circuit pattern.

  In the above process, after the resist ink layer 40 is gravure-printed on the surface of the metal foil 10 according to a predetermined antenna circuit pattern as shown in FIG. 7, one surface of the metal foil 10 that is not gravure-printed as shown in FIG. Alternatively, an adhesive layer 30 may be formed on the resin film substrate 20, and the resin film substrate 20 may be fixed with the adhesive layer 30 interposed therebetween.

  By the way, when a resist ink used as a mask for etching a metal foil such as an aluminum foil is subjected to gravure printing, a gravure roll in which cells are formed at a density of about 80 lines per 1 cm is often used. In this case, the width of one side of the cell is about 125 μm. Therefore, by using such a gravure roll, it is difficult to perform smooth and fine printing in which the fluctuation of the line width or line interval is about 100 μm at the peripheral edge of the pattern.

  In order to solve this problem, if the cell is made finer and, for example, a plate is made using a gravure roll in which fine cells are formed at a density of about 200 lines per 1 cm, the width of one side of the cell becomes about 50 μm. Apparently, the unevenness of the peripheral portion is reduced, and the peripheral portion is smooth. However, since the depth of the cell becomes shallow, the transfer amount of the resist ink is reduced, which is not suitable for printing resist ink used as an etching mask, for example.

  As a method for making a gravure plate, generally, a photo resist is coated on the surface of a gravure roll as a plate cylinder, masked, and exposed to a laser to be cured. Then, a cell is formed by etching. In order to improve the wear resistance of the plate hole, there is a method of performing a chrome plating process on the surface of the gravure roll. It is also possible to form a plate hole by combining a plurality of cells having different shapes.

  Therefore, in the embodiment of the present invention, the pattern peripheral portion is smoothed using this combination method. That is, a plate hole is formed by connecting a cell having a pitch size smaller than the pitch size of a cell for printing the other portion of the pattern to a gravure roll portion for printing the peripheral portion of the pattern, or smaller than 200 μm. Gravure printing is performed using a gravure roll that has been subjected to at least one of forming a plate hole by connecting concave patterns having a width.

  Specifically, in the antenna circuit pattern shown in FIG. 1, pattern layer outer peripheral edge portions 101, 102, 103, 104 and 105, pattern layer slit edge portions 106 and 107, and pattern layer slit inner peripheral edge portion 108 and A plate hole in which a gravure roll portion that prints a pattern peripheral portion made of 109 is connected with cells having a pitch size smaller than the pitch size of the cells that print other portions of the pattern, for example, the central portion of the antenna circuit pattern layer 100 Or gravure printing using a gravure roll that has been subjected to at least one of forming a plate hole by connecting concave patterns having a width smaller than 200 μm.

  On the other hand, in gravure printing, the resist ink is transferred while being scraped off by a doctor, so that the pattern shape of the transferred resist ink is a base material (a metal foil or a resin in the embodiment of the present invention). In many cases, a difference in shape and size occurs depending on the traveling direction of the laminate of the film base and the metal foil. The pattern peripheral portion arranged in parallel to the printing direction is smoothly printed with little unevenness, but the pattern peripheral portion arranged so as to be orthogonal to the printing direction is printed so as to have large unevenness.

  In consideration of the above phenomenon, in the antenna circuit pattern shown in FIG. 1, the gravure for printing the pattern layer outer peripheral portions 102 and 103 and the pattern layer slit inner peripheral portions 108 and 109 as the pattern peripheral portions orthogonal to the printing direction P On the part of the roll, the other part of the pattern, for example, the center part of the antenna circuit pattern layer 100 is formed with a cell having a smaller pitch dimension than that of the cell to be printed, for example, with a density of about 80 lines per 1 cm. As a cell smaller than the formed cell, a plate hole is formed by connecting fine cells formed with a density of about 200 lines per cm, or a recess pattern having a width smaller than 200 μm is connected. If at least one of the processes (hereinafter referred to as “peripheral process”) is performed, the unevenness is reduced and the height is increased. It is more effective to form the peripheral portion in accuracy. Further, if the above processing is performed also on the gravure roll portion that prints the pattern layer slit edge portions 106 and 107 that define the interval G on which the IC chip 50 is mounted, the peripheral portion can be formed with high accuracy with less unevenness. It is more effective to form.

  The antenna circuit pattern layer 100 is formed as shown in FIG. 8 by etching the metal foil 10 using the resist ink layer 40 thus formed by gravure printing as a mask. The distance between the pattern layer slit edge portions 106 and 107 is 200 μm or less, and the antenna circuit pattern layer 100 is formed in which the difference between the maximum value and the minimum value of the interval where the IC chip is mounted is controlled to 40 μm or less.

  Thereafter, as shown in FIG. 3, the resist ink layer 40 is removed. In this case, the resist ink layer 40 may remain depending on the purpose and application of the function card.

  The antenna circuit pattern layer 200 shown in FIGS. 4 to 5 is also formed in the same manner as described above. In this case, the printing direction may be the direction indicated by the arrow P in FIG.

  Hereinafter, the antenna circuit structure was produced according to the following Examples 1-3 by etching using the resist ink layer which carried out the periphery process to the gravure roll, and was gravure-printed as a mask. Moreover, the antenna circuit structural body was produced according to the following comparative example 1 by etching using the resist ink layer which carried out the gravure printing without performing the periphery process to a gravure roll as a mask.

(Gravure roll edge processing)
In order to perform gravure printing of the rectangular strip-shaped dipole antenna circuit pattern shown in FIG. As the dimensions of the slit portion in the antenna circuit pattern shown in FIG. 1, the interval between the pattern layer slit edge portions 106 and 107 and the interval between the pattern layer slit inner peripheral portions 108 and 109 are each set to 0.10 mm (IC chip mounted) The interval of the place to be set was also set to 0.10 mm).

  As the design of the plate hole, in order to form a plate hole having the shape of the antenna circuit pattern shown in FIG. 1 (external dimensions: 1.50 mm × 50.00 mm, the above-mentioned interval: 0.10 mm), the number of lines is 1 cm. A cell formed with a density of about 80 lines was used. In Comparative Example 1, when gravure printing was performed without applying a peripheral treatment to the gravure roll, a plate hole was formed using the gravure roll formed of only the above cells.

  In the antenna circuit pattern shown in FIG. 1, the pattern layer outer peripheral edge portions 101, 102, and 103 and the pattern layer slit inner peripheral edge portions 108 and 109 are printed as pattern peripheral portions orthogonal to the printing direction P. From the other part of the pattern, for example, a cell having a pitch size smaller than the pitch size of the cell printing the central portion of the antenna circuit pattern layer 100, that is, a cell having a density of about 80 lines per 1 cm. As small cells, plate holes were formed by connecting fine cells formed with a density of about 200 lines per 1 cm, or by connecting concave patterns having a width of 25 μm smaller than 200 μm. Further, the above processing was also performed on the gravure roll portion on which the pattern layer slit edge portions 106 and 107 defining the interval G on which the IC chip 50 is mounted to form plate holes. In Examples 1 to 3, a gravure roll having a plate hole formed as described above was used.

Example 1
As shown in FIG. 6, an aluminum foil (material JIS 1N30-H material) having a thickness of 20 μm is used as the metal foil 10, and a polyurethane-based dry film is used as an adhesive layer 30 on one side of a PET film having a thickness of 38 μm as the resin film substrate 20. Bonding was performed using a laminate adhesive. Using a vinyl chloride-vinyl acetate resist ink on the surface of the aluminum foil of this laminate, a resist ink (after drying) according to the antenna circuit pattern (size per pattern: length 1.5 mm × width 50 mm) shown in FIG. by printing the coating weight 2g / m ^2), a resist ink layer 40 as shown in FIG. 7 was formed on the metal foil 10. However, the gravure roll which performed said periphery process at this time was used. At the time of printing, the direction indicated by the arrow P in FIG. 1 was matched with the rotation direction of the gravure roll. After drying the resist ink layer, the portion of the aluminum foil on which the resist ink was not printed was removed by etching with a ferric chloride solution to produce an antenna circuit structure as shown in FIG. As a result, a large number of antenna circuit pattern layers 100 were formed.

  In the obtained antenna circuit structure, the interval between the pattern layer slit edge portions 106 and 107 and the interval between the pattern layer slit inner peripheral portions 108 and 109 shown in FIG. 1 were measured. Specifically, for one 30 antenna circuit pattern layers 100, the above-described one interval was measured with a microscope with respect to each antenna circuit pattern layer 100. The measurement results of these intervals are shown in Table 1 as “average value of intervals”, “maximum value of intervals”, and “minimum value of intervals”. Further, when contact was made at any one of the pattern layer slit edge portions 106 and 107 or the pattern layer slit inner peripheral edge portions 108 and 109, it was regarded as short-circuited and counted as “the number of short circuits”.

  Further, as shown in FIG. 9, the maximum value Gmax and the minimum value Gmin are measured as shown in FIG. 9 for the gap G between the pattern layer slit edge portions 106 and 107 where the IC chips are mounted as shown in FIG. The difference was calculated for each of the layers 100. The maximum value of the difference is shown in Table 1 as “Unevenness of interval G”.

(Example 2)
As shown in FIG. 6, an aluminum foil (material JIS 1N30-O material) having a thickness of 10 μm is used as the metal foil 10, and a polyurethane-based dry is used as an adhesive layer 30 on one side of a PET film having a thickness of 25 μm as the resin film substrate 20. Bonding was performed using a laminating adhesive. A resist ink layer 40 was formed on the metal foil 10 as shown in FIG. 7 using a rosin-maleic acid resin resist ink on the surface of the aluminum foil of the laminate. Printing and etching were performed under the same conditions as in Example 1. The results measured in the same manner as in Example 1 are shown in Table 1.

(Example 3)
An antenna circuit component was produced under the same conditions as in Example 1 except that a rolled copper foil having a thickness of 18 μm (copper purity: 99.5 mass%) was used as the metal foil. The results measured in the same manner as in Example 1 are shown in Table 1.

(Comparative Example 1)
An antenna circuit structure was produced under the same conditions as in Example 1. However, in the gravure printing step, a gravure roll not subjected to the above-described peripheral processing was used. The results measured in the same manner as in Example 1 are shown in Table 1.

表１に示される結果から、比較例１では短絡が観察されるのに対し、本発明に従って作製された実施例１〜３のアンテナ回路構成体では短絡が観察されず、また、各アンテナ回路パターン層においてパターン層部分の間隔が２００μｍ以下の範囲内で大きくばらつくことなく、特にＩＣチップを搭載する箇所のその間隔Ｇの最大値と最小値の差も４０μｍ以下に制御されていることがわかる。

From the results shown in Table 1, while a short circuit is observed in Comparative Example 1, no short circuit is observed in the antenna circuit structures of Examples 1 to 3 manufactured according to the present invention, and each antenna circuit pattern It can be seen that the difference between the maximum value and the minimum value of the gap G of the portion where the IC chip is mounted is controlled to 40 μm or less, without greatly varying the distance between the pattern layer portions in the range of 200 μm or less.

  It should be considered that the embodiments and examples disclosed above are illustrative and non-restrictive in every respect. The scope of the present invention is shown not by the above embodiments and examples but by the scope of claims, and includes all modifications and variations within the scope and meaning equivalent to the scope of claims.

It is a top view which shows the principal part of the antenna circuit structure for function cards according to one embodiment of this invention. It is the elements on larger scale which expand and show the location shown by II in FIG. FIG. 5 is a partial cross-sectional view of the functional card antenna circuit component viewed from the direction along the line III-III in FIG. 1 or FIG. 4. It is a top view which shows the antenna circuit structure for function cards according to another embodiment of this invention. FIG. 5 is a partially enlarged plan view showing a portion indicated by V in FIG. 4 in an enlarged manner. It is the fragmentary sectional view which showed the 1st manufacturing process of the antenna circuit structural body for function cards according to one embodiment of this invention, and was seen from the direction along the III-III line of FIG. It is the fragmentary sectional view which showed the 2nd manufacturing process of the antenna circuit structural body for function cards according to one embodiment of this invention, and was seen from the direction along the III-III line of FIG. FIG. 5 is a partial cross-sectional view showing a third manufacturing process of the functional card antenna circuit assembly according to one embodiment of the present invention, as seen from the direction along line III-III in FIG. 1. FIG. 3 is a partially enlarged plan view showing a slit edge portion in FIG. 2 further enlarged.

Explanation of symbols

  10: Metal foil, 20: Resin film base, 30: Adhesive layer, 40: Resist ink layer, 100, 200: Antenna circuit pattern layer, 101-105: Outer peripheral edge of pattern layer, 106, 107: Pattern layer slit Edge portions 108, 109: inner peripheral edge portions of the pattern layer slit, 201-212, 215-218: outer peripheral edge portions of the pattern layer, 213, 214: edge portions of the pattern layer gap, G: interval.

Claims (6)

A base material containing a resin;
A circuit structure comprising a functional pattern layer including a metal foil formed on the base material and partially etched to have a predetermined function according to a pattern of a resist ink layer formed by gravure printing. There,
A step of gravure printing a resist ink layer having a pattern on a metal foil, and fixing a base material containing a resin on the surface of the metal foil that is not gravure-printed, and the metal foil using the resist ink layer as a mask Forming a functional pattern layer including the metal foil and having first and second pattern layer portions separated by an interval of 200 μm or less by etching at least a part of the gravure printing. In this step, a gravure roll in which a plate hole is formed by connecting a cell having a pitch dimension smaller than the pitch dimension of a cell printing another part of the pattern to a gravure roll part printing the peripheral edge of the pattern is used. By the manufacturing method for gravure printing, the circuit structure is manufactured,
In the place where the IC chip is mounted, the functional pattern layer has first and second pattern layer portions separated by an interval of 200 μm or less, and the maximum value of the interval between the first and second pattern layer portions is A circuit structure having a minimum value difference of 40 μm or less.   The circuit configuration body according to claim 1, wherein the functional pattern layer includes an antenna circuit pattern layer.   The circuit structure according to claim 1, wherein the functional pattern layer includes a resist ink layer formed on a metal foil.   A function card comprising the circuit structure according to any one of claims 1 to 3.   The functional card according to claim 4, further comprising an IC chip mounted on the functional pattern layer so as to straddle a distance between the first and second pattern layer portions.   The function card according to claim 5, wherein the function card is an IC tag.

Images