JP4524222B2 - Substrate assembly method and apparatus - Google Patents

Description

  The present invention relates to a kind of substrate assembly method, and more particularly to a substrate assembly method applied to a liquid crystal display panel.

  In recent years, with the development of liquid crystal display technology, liquid crystal displays (LCD) have gradually been used instead of traditional cathode ray tube (CRT) displays.

  The traditional LCD manufacturing method becomes more difficult as the area of the display panel increases, and according to an early method, the upper and lower substrates are joined to each other, and the surrounding area between the two substrates. A UV-curable photo-polymer adhesive is applied, and a small hole is retained and liquid crystal is injected therebetween.

  After that, the two substrates are placed in a vacuum chamber and depressurized to a vacuum, immersed in a liquid crystal tank placed in the vacuum chamber after completion, and the liquid crystal in the liquid crystal tank is discharged from a small hole using the pressure difference between the inside and outside. It is injected between the two substrates, and finally the small holes are filled and the two substrates are cleaned.

  The above-described method is a popular and general method for manufacturing a liquid crystal display panel, but its manufacturing time is long, and its difficulty and defect rate also increase with an increase in the area of the display panel, which is not ideal. For this reason, a new technique for improving liquid crystal injection has now occurred.

  In the so-called improved technology, the lower substrate of the two substrates of the display panel is adsorbed on the lower machine base of the vacuum chamber, and a photosensitive resin adhesive is attached around the lower substrate. A spacer is sandwiched in the middle of the adhesive, and the upper substrate of the two substrates is adsorbed to the upper machine base in the vacuum chamber, and the upper substrate is located above the lower substrate, and then above the lower substrate. The liquid crystal is injected into the middle area surrounded by the photosensitive resin adhesive and the spacer, and then the upper base is lowered and the upper substrate and the lower substrate are attached to each other, thus completing the liquid crystal injection process of the two substrates, A liquid crystal panel is formed.

  However, the improved method described above improves the problems of wasting early working time, increasing difficulty, and increasing the defect rate. However, the improved method is different from the upper substrate in a transmission device such as a mechanical arm. The lower substrate is sent to the upper and lower machine bases in the vacuum chamber, and the machine arm needs to take out the previously completed liquid crystal display panel. For this reason, the machine arm must be used for the manufacturing flow and order. Therefore, for a manufacturer that forms a waste of time and manufactures liquid crystal displays in large quantities, the waste of time is equivalent to a decline in production capacity, and the influence becomes large.

The present invention aims to provide a kind of substrate assembling method, which is executed in a vacuum chamber, and this vacuum chamber includes an upper machine base and a lower machine base, and the substrate assembling method of the present invention comprises:
(A) The first transmission device feeds the upper substrate onto the upper stage of the vacuum chamber, and the first transmission device includes a plurality of first lower suction cups and a first lower surface, and a plurality of first transmission devices. A first lower suction cup is provided on the first lower surface, and the first transmission device feeds the upper substrate onto the upper machine base with a plurality of first lower suction cups;
(B) The second transmission device sends the lower substrate onto the lower machine base of the vacuum chamber at the same time as the first transmission device sends out the previous substrate assembly completed last time on the lower machine base.
(C) injecting liquid crystal onto the lower substrate;
(D) superposing the upper substrate on the lower substrate to complete a combination of substrate assemblies;
The above steps are included.

  As can be seen from the above, when the upper substrate and the lower substrate are transported and manufactured, the upper and lower substrates are sent on the vacuum chamber and on the lower machine base using the first transmission device and the second transmission device. It should be noted that at the same time that the second transmission device feeds the lower board onto the lower machine base, the first transmission apparatus sends out the previous board assembly that was completed on the lower machine board.

  Thus, as described above, the first transmission device does not require any extra operation such as rotation, for example, and reliably achieves the transmission work of the upper and lower substrates as well as the second transmission device, and at the same time. It is possible to complete the flow and reliably achieve the simplification effect on the manufacturing flow, reduce the waste of working hours, and increase the production capacity.

  The first transmission device described above includes a plurality of first upper suction cups, a first upper surface, and a plurality of first upper suction cups are provided on the first upper surface. Each of the first upper suction cups communicates with the first upper ventilation duct, each of the plurality of first lower suction cups communicates with the first lower ventilation duct, and each of the upper ventilation duct and the first lower ventilation duct is outside. Communicate.

  The second transmission device includes a plurality of second upper suction cups and a second upper surface, and the plurality of second upper suction cups are provided on the second upper surface. 2. Feed the lower substrate to the lower machine base with the upper suction cup.

  In addition, in the above-described step (A), the upper substrate includes the upper substrate front surface and the upper substrate rear surface, the first transmission device can be adsorbed on the upper substrate rear surface of the upper substrate, and the above-described step (B). The lower substrate includes a lower substrate front surface and a lower substrate rear surface, and the second transmission device sucks the lower substrate rear surface of the lower substrate. With regard to the above-described method, the first and second transmission devices can increase the design variability of the first upper suction cup, the first lower suction cup, and the second upper suction cup.

  The reason for the above method is as follows. In general, so-called upper and lower substrates have a relatively large size due to production capacity factors, and above this, the lower substrate is cut to produce a relatively small size and lower substrate. For example, the relatively large upper and lower substrates are cut to form six relatively small upper and lower substrates. Accordingly, there are many dividing lines on the front surface of the upper substrate and the front surface of the lower substrate, and the position of the suction nozzle can be designed only at the position of the dividing line, which is limited. On the other hand, if the upper substrate rear surface and the lower substrate rear surface are directly attracted to the suction nozzle, the suction position is not limited. Thereby, not only can the design variability of the first upper suction cup, the first lower suction cup and the second upper suction cup be increased, but the upper substrate front and lower substrate front are not destroyed, and the upper and lower substrate Quality can be prevented from being affected.

  In addition, during the above-described step (A), the upper base of the vacuum chamber includes a plurality of upper base suckers, which suck the upper substrate on the upper base. Similarly, during the above step (B), the lower chamber base of the vacuum chamber includes a plurality of lower base suction cups that adsorb the previous substrate assembly on the lower base and that is lower on the lower base. A substrate can be adsorbed.

  In step (C), the periphery of the lower substrate is filled with a photo-polymer adhesive, so that the upper substrate is securely bonded.

  For the above steps, the substrate assembly apparatus of the present invention is mounted in a vacuum chamber, and the vacuum chamber includes an upper machine base and a lower machine base. A machine frame, a second machine frame, a first transmission device, and a second transmission device are included.

  The first and second machine frames described above are installed in the vacuum chamber described above, the first transmission device is pivoted on the first machine frame, and the first transmission device includes a plurality of first upper suction cups and a plurality of first lower suction cups. Including a suction cup, a first upper surface, and a first lower surface, wherein a plurality of first upper suction cups are provided on the first upper surface, and a plurality of first lower suction cups are provided on the first lower surface. .

  In addition, the second transmission device is pivoted on the second machine frame.

  The first transmission device includes a first upper ventilation pipe and a first lower ventilation pipe, the plurality of first upper suction cups communicate with the first upper ventilation pipe, and the plurality of first lower suction cups Each communicates with the first lower ventilation conduit, and the first upper ventilation conduit and the first lower ventilation conduit communicate with the outside. The second transmission device includes a plurality of second upper suction cups and a second upper surface, and the plurality of second upper suction cups are provided on the second upper surface.

  In addition, the above-described first transmission device can send the upper substrate onto the upper base of the vacuum chamber, and the first transmission device can send the upper substrate onto the upper base with the plurality of first lower suction cups. .

  Similarly, the above-described first transmission device can send the previous substrate assembly completed last time on the lower machine base, and the second transmission device sends the lower board onto the lower machine base of the vacuum chamber, and the first The transmission device sends the previous board assembly completed on the lower machine base with the plurality of first upper suction cups, and the second transmission device sends the lower board onto the lower machine base with the plurality of second upper suction cups. Enter.

The invention of claim 1 is a substrate assembly method, wherein the substrate assembly method is executed in a vacuum chamber including an upper machine base and a lower machine base,
(A) was fed on the substrate on the upper machine table in a vacuum chamber at a first transmission device, of which the opposite of the first transmission device is a single arm, and the first upper surface, said first upper surface comprises a first lower surface, a plurality of first upper suction cup and a plurality of first lower suction cup located on the side, these first upper suction cup is provided in the first table above surface, and these first lower suction cup said first provided 1 below surface, the first transmission device is fed to the upper substrate on the upper machine base in these first lower suction cup, the upper machine table is includes a plurality of upper machine base sucker, these Sending the upper substrate onto the upper machine base with an upper machine suction cup;
(B) In the first transmission device described above, the previous board assembly on the lower machine base completed on the lower machine base is sent out by the first upper sucker, and at the same time, the next board is placed on the lower machine base by the second transmission device. the forced in, the second transmission device is the one arm, and comprises a second upper surface and a plurality of second upper suction cup,且these second upper suction cup is provided on the second above table surface, the The second transmission device feeds the lower board onto the lower machine base with these second upper suction cups, and the lower machine base includes a plurality of lower machine base suction cups to attach the previous board assembly or the lower board to the lower machine base. Steps to send on the lower machine stand,
(C) injecting liquid crystal onto the lower substrate;
(D) superposing the upper substrate on the lower substrate to complete a combination of substrate assemblies;
The substrate assembly method includes the above steps.
According to a second aspect of the present invention, in the substrate assembling method according to the first aspect, during the step (A), the first lower suction cups communicate with the first lower ventilation duct, respectively, and the first lower ventilation duct is external. The board assembly method is characterized in that the circuit board is communicated with the board.
According to a third aspect of the present invention, in the substrate assembling method according to the first aspect, during the step (A), the first upper suction cups communicate with the first upper ventilation conduit, respectively, and the first upper ventilation conduit is external. The board assembly method is characterized in that the circuit board is communicated with the board.
According to a fourth aspect of the present invention, in the substrate assembly method according to the first aspect, during the step (A), the upper substrate includes the upper substrate front surface and the upper substrate rear surface, and the first transmission device is the upper substrate upper substrate. The substrate assembly method is characterized by adsorbing the back surface.
According to a fifth aspect of the present invention, in the substrate assembly method according to the first aspect, during the step (B), the lower substrate includes the lower substrate front surface and the lower substrate rear surface, and the second transmission device is the lower substrate lower substrate. The substrate assembly method is characterized by adsorbing the back surface.
The invention of claim 6 is the substrate assembly method according to claim 1, characterized in that the photosensitive resin adhesive is filled around the lower substrate during the step (C).
The invention of claim 7 is the substrate assembly apparatus, wherein the substrate assembly apparatus is mounted in a vacuum chamber, and the substrate assembly apparatus comprises:
Upper machine base with multiple upper machine suction cups,
A lower machine stand with a plurality of lower machine suckers,
A first machine frame provided in the vacuum chamber;
A second machine frame provided in the vacuum chamber;
The first machine frame is pivotally provided as one arm and has a first upper surface, a first lower surface opposite to the first upper surface, a plurality of first upper suction cups, and a plurality of first lower surfaces comprising a suction cup, these first upper suction cup is provided in the first table above surface, they first lower suction cup is provided on the first table surface, a first transmission unit,
A second transmission pivoted on the second machine frame, as one arm, and comprising a second upper surface and a plurality of second upper suction cups, the second upper suction cups being provided on the second upper surface. Equipment,
Including
The first transmission device sends the previous board assembly completed on the lower machine base with the first upper suction cup, and simultaneously the second transmission device feeds the next board onto the lower machine base. The board assembly apparatus is characterized by the above.
According to an eighth aspect of the present invention, in the board assembly apparatus according to the seventh aspect, the second transmission device includes a plurality of second upper suction cups and a second upper surface, and the second upper suction cups are the second upper surface. The substrate assembly apparatus is characterized by being provided on the surface .
According to a ninth aspect of the present invention, in the board assembly apparatus according to the seventh aspect, the first transmission device further includes a first upper ventilation duct and a first lower ventilation duct, and the first upper suction cups are respectively the first upper suction pipe. A board assembly characterized in that the first lower suction cup communicates with the first lower ventilation duct, and the first upper ventilation duct and the first lower ventilation duct communicate with the outside. It is a device.
According to a tenth aspect of the present invention, in the board assembly apparatus according to the eighth aspect, the second transmission apparatus sucks the lower board with a second upper suction cup and feeds it onto the lower machine base. It is a device.

  The present invention provides a substrate assembling method and apparatus for bonding a lower substrate on a liquid crystal display device, and includes a first transmission device and a second transmission device for transporting the upper and lower substrates on a vacuum chamber and on a lower machine base. A first transmission device comprising a plurality of first upper suction cups and first lower suction cups; a second transmission device comprising a plurality of second upper suction cups and second lower suction cups; and the second transmission device comprising a lower transmission device. At the same time when the board is sent to the lower machine base, the first transmission apparatus sends out the previously assembled board assembly on the lower machine base, so that the first transmission apparatus does not require any other extra operation, and the second transmission apparatus. At the same time, the transmission work of the upper and lower substrates is completed, the effect of simplification is surely achieved in the manufacturing flow, the waste of working time is reduced, and the production capacity is increased.

  FIG. 2 is a three-dimensional view of the present invention, in which the vacuum chamber 1 is displayed and the upper machine base 11 and the lower machine base 12 are included in the vacuum chamber 1. In this embodiment, the upper machine base 11 includes a plurality of upper machine base suction cups 111, and the lower machine base 12 includes a plurality of lower machine base suction cups 121.

  See also FIGS. 3 is a three-dimensional view of the first transmission device of the present invention, FIG. 4 is a plan view of the first transmission device of the present invention, and FIG. 5 is a side view of the first transmission device of the present invention. A first machine frame 5 mounted separately in 1 is shown, and a rotatable first transmission device 2 is pivoted on the first machine frame 5. In the present embodiment, the first transmission device 2 includes a first upper surface 21 and a first lower surface 22, of which the first upper surface 21 includes a plurality of first upper suction cups 211, and the first lower surface 21 22 includes a plurality of first lower suction cups 221, and the plurality of first upper suction cups 211 communicate with the first upper ventilation duct 212, respectively, and the plurality of first lower suction cups 221 each have a first lower ventilation duct 222. The first upper ventilation pipe 212 and the first lower ventilation pipe 222 communicate with the outside, respectively, and supply the gas of the first upper suction cup 211 and the first lower suction cup 221 to achieve the adsorption action. Let

  Please refer to the three-dimensional view of the second transmission device of the present invention in FIGS. 2 and 6, the plan view of the second transmission device of the present invention in FIG. 7, and the side view of the second transmission device of the present invention in FIG. . A second machine frame 6 is attached in the vacuum chamber 1, and a second transmission device 4 that can rotate is pivoted on the second machine frame 6. In this embodiment, the second transmission device 4 is a second transmission device 4. An upper surface 41 is included, and the second upper surface 41 includes a plurality of second upper suction cups 411.

  FIG. 1 is a flowchart of the present invention. See FIGS. 2, 3, 4, 5, and FIG. FIG. 9 shows the manufacturing flow of the present invention. When the liquid crystal display panel is manufactured, first, the first transmission device 2 is used to suck the upper substrate 31 and send it onto the upper unit 11 of the vacuum chamber 1 (SA). At this time, the upper substrate 31 includes an upper substrate front surface 311 and an upper substrate rear surface 312, and the first transmission device 2 sucks the upper substrate rear surface 312 of the upper substrate 31 with the plurality of first lower suction cups 221, and The upper machine base 11 sucks the upper board back surface 312 of the upper board 311 with the upper machine sucker 111. The method of adsorbing the upper substrate rear surface 312 of the upper substrate 31 can prevent unnecessary destruction of the upper substrate front surface 311 of the upper substrate 31.

  See FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 10, 11. FIG. 10 is a second of the display diagrams of the manufacturing flow of the present invention. FIG. 11 is a second diagram of the manufacturing flow of the present invention. Thereafter, the second transmission device 4 sucks the lower substrate 32 and feeds it onto the lower machine base 12 of the vacuum chamber 1, and the lower substrate 32 includes the lower substrate front surface 321 and the lower substrate rear surface 322. Adsorbs the lower substrate back surface 322 of the lower substrate 32 with the plurality of second upper suction cups 411 and feeds it onto the lower machine base 12. The lower substrate back surface 322 of the lower substrate 32 is adsorbed. The method of adsorbing the lower substrate rear surface 322 of the lower substrate 32 prevents the lower substrate front surface 321 of the lower substrate 32 from being damaged.

  It should be noted that, simultaneously with the above-described steps, the first transmission device 2 first sucks and sends out the previous board assembly 30 that has completed the previous board combination on the lower machine base 12 with the plurality of first upper suction cups 211. After that, the second transmission device 4 sucks the lower substrate 32 with the plurality of second upper suction cups 411 and sucks it on the lower machine base 12 (SB). Thereby, the 1st transmission apparatus 2 does not require other extra operations, such as rotation, for example, and the 2nd transmission apparatus 4 achieves the upper and lower board | substrate 31 and 32 adsorption | suction work reliably, and at the same time. By completing the same flow, it is possible to reliably achieve the effect of simplification with respect to the manufacturing flow, prevent waste of work time, and increase the production capacity.

  Please refer to FIG. 1, 2 and FIG. FIG. 12 is a third of the manufacturing flow display diagrams of the present invention. Thereafter, the liquid crystal 7 is further injected onto the lower substrate 32 (SC), and at the same time, the periphery of the lower substrate 32 is filled with the photosensitive resin adhesive 8.

  Please refer to FIGS. FIG. 13 is a fourth of the manufacturing flow display diagram of the present invention. Finally, the upper machine base 11 is moved downward and the upper substrate 31 is superposed on the lower substrate 32 (SD). Thus, the substrate assembly 33 is completed, and the manufacturing flow of the liquid crystal display panel is achieved.

  The above embodiments have been presented for the sake of explanation, and the scope of the claims of the present invention is not limited to the above-described embodiments in accordance with the description of the scope of claims.

3 is a flowchart of the present invention. FIG. It is a three-dimensional view of the 1st transmission apparatus of this invention. It is a top view of the 1st transmission device of the present invention. It is a side view of the 1st transmission apparatus of this invention. It is a three-dimensional view of the 2nd transmission apparatus of this invention. It is a top view of the 2nd transmission apparatus of this invention. It is a side view of the 2nd transmission apparatus of this invention. It is one of the manufacturing flow display diagrams of the present invention. It is 2nd of the manufacturing flow display figure of this invention. It is the second two of the manufacturing flow display diagrams of the present invention. It is the third of the manufacturing flow display diagrams of the present invention. It is four of the manufacturing flow display figure of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 11 Upper machine stand 111 Upper machine stand sucker 12 Lower machine stand 121 Lower machine stand sucker 2 1st transmission apparatus 21 1st upper surface 211 1st upper sucker 212 1st upper ventilation line 22 1st lower surface 30 Previous time Substrate assembly 31 Upper substrate 311 Upper substrate front 312 Upper substrate rear 32 Lower substrate 321 Lower substrate front 322 Lower substrate rear 33 Substrate assembly 4 Second transmission device 41 Second upper surface 411 Second upper suction cup 5 First machine frame 6 Second Machine frame 7 Liquid crystal 8 Photosensitive resin adhesive

Claims (10)

A substrate assembly method, wherein the substrate assembly method is executed in a vacuum chamber including an upper machine base and a lower machine base,
(A) was fed on the substrate on the upper machine table in a vacuum chamber at a first transmission device, of which the opposite of the first transmission device is a single arm, and the first upper surface, said first upper surface comprises a first lower surface, a plurality of first upper suction cup and a plurality of first lower suction cup located on the side, these first upper suction cup is provided in the first table above surface, and these first lower suction cup said first provided 1 below surface, the first transmission device is fed to the upper substrate on the upper machine base in these first lower suction cup, the upper machine table is includes a plurality of upper machine base sucker, these Sending the upper substrate onto the upper machine base with an upper machine suction cup;
(B) In the first transmission device described above, the previous board assembly on the lower machine base completed on the lower machine base is sent out by the first upper sucker, and at the same time, the next board is placed on the lower machine base by the second transmission device. the forced in, the second transmission device is the one arm, and comprises a second upper surface and a plurality of second upper suction cup,且these second upper suction cup is provided in the second table above surface, the The second transmission device feeds the lower board onto the lower machine base with these second upper suction cups, and the lower machine base includes a plurality of lower machine base suction cups to attach the previous board assembly or the lower board to the lower machine base. Steps to send on the lower machine stand,
(C) injecting liquid crystal onto the lower substrate;
(D) superposing the upper substrate on the lower substrate to complete a combination of substrate assemblies;
The board | substrate assembly method characterized by including the above step.   2. The substrate assembly method according to claim 1, wherein during the step (A), each of the first lower suction cups communicates with the first lower ventilation duct, and each of the first lower ventilation ducts communicates with the outside. A substrate assembly method.   2. The substrate assembly method according to claim 1, wherein during the step (A), each of the first upper suction cups communicates with the first upper ventilation conduit, and the first upper ventilation conduit communicates with the outside. A substrate assembly method.   2. The substrate assembly method according to claim 1, wherein, during step (A), the upper substrate includes the upper substrate front surface and the upper substrate rear surface, and the first transmission device sucks the upper substrate rear surface of the upper substrate. A substrate assembly method.   2. The substrate assembly method according to claim 1, wherein, during step (B), the lower substrate includes a lower substrate front surface and a lower substrate rear surface, and the second transmission device adsorbs the lower substrate lower substrate back surface. A substrate assembly method.   2. The substrate assembling method according to claim 1, wherein a photosensitive resin adhesive is filled around the lower substrate during the step (C). In the substrate assembly apparatus, the substrate assembly apparatus is mounted in a vacuum chamber,
Upper machine base with multiple upper machine suction cups,
A lower machine stand with a plurality of lower machine suckers,
A first machine frame provided in the vacuum chamber;
A second machine frame provided in the vacuum chamber;
The first machine frame is pivotally provided as one arm and has a first upper surface, a first lower surface opposite to the first upper surface, a plurality of first upper suction cups, and a plurality of first lower surfaces comprising a suction cup, these first upper suction cup is provided in the first table above surface, they first lower suction cup is provided on the first table surface, a first transmission unit,
A second transmission pivoted on the second machine frame, as one arm, and comprising a second upper surface and a plurality of second upper suction cups, the second upper suction cups being provided on the second upper surface. Equipment,
Including
The first transmission device sends the previous board assembly completed on the lower machine base with the first upper suction cup, and simultaneously the second transmission device feeds the next board onto the lower machine base. A board assembly apparatus characterized by the above. In the substrate assembly apparatus according to claim 7, wherein, the second upper sucker second transmission device of the plurality, and includes a second upper surface, and that these second upper suction cup is disposed in the second table above surface A board assembly apparatus.   8. The board assembly apparatus according to claim 7, wherein the first transmission device further includes a first upper ventilation duct and a first lower ventilation duct, and the first upper suction cups communicate with the first upper ventilation duct, respectively. A board assembly apparatus, wherein the first lower suction cups communicate with the first lower ventilation pipes, and the first upper ventilation pipes and the first lower ventilation pipes communicate with the outside.   9. The board assembly apparatus according to claim 8, wherein the second transmission apparatus sucks the lower board with a second upper suction cup and feeds it onto the lower machine base.

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