JP4451854B2 - 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 - Google Patents
縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 Download PDFInfo
- Publication number
- JP4451854B2 JP4451854B2 JP2006076133A JP2006076133A JP4451854B2 JP 4451854 B2 JP4451854 B2 JP 4451854B2 JP 2006076133 A JP2006076133 A JP 2006076133A JP 2006076133 A JP2006076133 A JP 2006076133A JP 4451854 B2 JP4451854 B2 JP 4451854B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- transfer mechanism
- substrate support
- encoder
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
w 半導体ウエハ
2 処理容器
3 熱処理炉
9 ボート(保持具)
16 収納容器
20 基板支持具
21 移載機構
50 進退駆動部(移動機構)
57 ピッチ変換駆動部(ピッチ変換機構)
65 エンコーダ
66 コントローラ
Claims (4)
- 熱処理炉と、多数枚の被処理体を上下方向に所定間隔で多段に保持して上記熱処理炉に搬入搬出される保持具と、昇降及び旋回可能な基台上に被処理体を支持するピッチ変換可能な複数枚の基板支持具を水平方向に進退可能に有し、複数枚の被処理体を所定間隔で収納する収納容器と上記保持具との間で被処理体の移載を行う移載機構と、該移載機構を制御するコントローラと、を備え、上記基台にはピッチ変換機構を有する移動体を進退移動操作する移動機構が設けられ、上記ピッチ変換機構にはその駆動部の回転角度を検出するエンコーダが設けられ、上記コントローラは、上記基板支持具の移動機構の作動時にピッチ変換機構のエンコーダから出力されるエンコーダ値を監視し、保持具内の異常状態の被処理体に基板支持具が干渉してピッチ変換機構の駆動部が回転されることにより該エンコーダ値が変化した時に異常駆動と判定し、上記移載機構の駆動を停止すると共に異常駆動の発生を通報するように構成されていることを特徴とする縦型熱処理装置。
- 上記コントローラは、上記異常駆動と判定した時に、上記移動機構の駆動部に逆回転方向の電流を供給した後、電流の供給を遮断することにより、基板支持具を直ちに後退させて停止するように構成されていることを特徴とする請求項1記載の縦型熱処理装置。
- 熱処理炉と、多数枚の被処理体を上下方向に所定間隔で多段に保持して上記熱処理炉に搬入搬出される保持具と、昇降及び旋回可能な基台上に被処理体を支持するピッチ変換可能な複数枚の基板支持具を水平方向に進退可能に有し、複数枚の被処理体を所定間隔で収納する収納容器と上記保持具との間で被処理体の移載を行う移載機構と、該移載機構を制御するコントローラとを備えた縦型熱処理装置における移載機構の制御方法において、上記基台にはピッチ変換機構を有する移動体を進退移動操作する移動機構が設けられ、上記ピッチ変換機構にはその駆動部の回転角度を検出するエンコーダが設けられ、上記コントローラは、上記基板支持具の移動機構の作動時にピッチ変換機構のエンコーダから出力されるエンコーダ値を監視し、保持具内の異常状態の被処理体に基板支持具が干渉してピッチ変換機構の駆動部が回転されることにより該エンコーダ値が変化した時に異常駆動と判定し、上記移載機構の駆動を停止すると共に異常駆動の発生を通報するように構成されていることを特徴とする縦型熱処理装置における移載機構の制御方法。
- 上記コントローラは、上記異常駆動と判定した時に、上記移動機構の駆動部に逆回転方向の電流を供給した後、電流の供給を遮断することにより、基板支持具を直ちに後退させてから停止するように構成されていることを特徴とする請求項3記載の縦型熱処理装置における移載機構の制御方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006076133A JP4451854B2 (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
US11/723,392 US20070238062A1 (en) | 2006-03-20 | 2007-03-19 | Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus |
KR1020070026429A KR20070095208A (ko) | 2006-03-20 | 2007-03-19 | 종형 열처리 장치 및 종형 열처리 장치에 있어서의 이동적재 기구의 제어 방법 |
CNB2007101006382A CN100568449C (zh) | 2006-03-20 | 2007-03-19 | 立式热处理装置及立式热处理装置中移载机构的控制方法 |
TW096109528A TW200818320A (en) | 2006-03-20 | 2007-03-20 | Vertical heat treating apparatus and control method for transfer mechanism of vertical heat treating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006076133A JP4451854B2 (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007251087A JP2007251087A (ja) | 2007-09-27 |
JP4451854B2 true JP4451854B2 (ja) | 2010-04-14 |
Family
ID=38575724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006076133A Active JP4451854B2 (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070238062A1 (ja) |
JP (1) | JP4451854B2 (ja) |
KR (1) | KR20070095208A (ja) |
CN (1) | CN100568449C (ja) |
TW (1) | TW200818320A (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101952951A (zh) * | 2008-02-21 | 2011-01-19 | 圣戈本陶瓷及塑料股份有限公司 | 陶瓷桨叶 |
JP5456287B2 (ja) | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP2010067871A (ja) * | 2008-09-12 | 2010-03-25 | Dainippon Screen Mfg Co Ltd | 基板搬送装置およびそれを備えた基板処理装置 |
KR101181560B1 (ko) | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
KR100980706B1 (ko) * | 2008-09-19 | 2010-09-08 | 세메스 주식회사 | 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법 |
JP5592710B2 (ja) * | 2010-06-17 | 2014-09-17 | セイコーインスツル株式会社 | ピッチ変換装置 |
JP6024653B2 (ja) * | 2011-03-02 | 2016-11-16 | 株式会社ニコン | 合成石英ガラスの熱処理装置、合成石英ガラスの熱処理方法、光学系の製造方法および露光装置の製造方法 |
JP5795174B2 (ja) * | 2011-03-18 | 2015-10-14 | 株式会社Screenホールディングス | 基板移載装置 |
JP5490860B2 (ja) * | 2012-09-18 | 2014-05-14 | 大日本スクリーン製造株式会社 | 基板搬送装置およびそれを備えた基板処理装置 |
JP6000038B2 (ja) * | 2012-09-20 | 2016-09-28 | 東京エレクトロン株式会社 | スペーサ、スペーサの搬送容器、スペーサの搬送方法、処理方法、及び、処理装置 |
JP6114060B2 (ja) * | 2013-02-27 | 2017-04-12 | 東京エレクトロン株式会社 | 基板搬送装置、基板受渡位置確認方法及び基板処理システム |
CN104752304B (zh) * | 2013-12-31 | 2018-08-24 | 北京北方华创微电子装备有限公司 | 一种反应腔室及等离子体加工设备 |
CN104752291B (zh) * | 2013-12-31 | 2018-05-08 | 北京北方华创微电子装备有限公司 | 一种传输装置及等离子体加工设备 |
WO2015114850A1 (ja) * | 2014-01-28 | 2015-08-06 | 川崎重工業株式会社 | 基板搬送システムおよび方法 |
CN106856664B (zh) * | 2014-09-05 | 2019-11-19 | 日商乐华股份有限公司 | 装载口及装载口的气氛置换方法 |
CN104567365A (zh) * | 2014-12-16 | 2015-04-29 | 广东风华高新科技股份有限公司 | 钟罩炉及其承烧平台 |
CN104596314A (zh) * | 2015-01-08 | 2015-05-06 | 北京七星华创电子股份有限公司 | 一种热处理设备的炉门控制机构 |
JP6685213B2 (ja) * | 2016-09-29 | 2020-04-22 | 株式会社Screenホールディングス | 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法 |
JP6804146B2 (ja) * | 2016-11-10 | 2020-12-23 | 株式会社ディスコ | 搬送装置、加工装置及び搬送方法 |
CN107634024B (zh) * | 2017-07-27 | 2023-11-10 | 罗博特科智能科技股份有限公司 | 一种硅片批量中转装置 |
CN114351122B (zh) * | 2021-12-14 | 2023-08-08 | 湖南红太阳光电科技有限公司 | 一种用于异质结cvd设备的载板传输提升系统 |
CN114823441B (zh) * | 2022-06-28 | 2022-09-02 | 深圳市星国华先进装备科技有限公司 | 一种针测机传输机构晶圆防滑出保护装置 |
CN115180394B (zh) * | 2022-07-22 | 2024-04-09 | 广州城市理工学院 | 一种夹取装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4338553A (en) * | 1979-12-04 | 1982-07-06 | Scott Jr Waller M | Control system for a motor actuated door operating mechanism |
JPS63245388A (ja) * | 1987-03-30 | 1988-10-12 | フアナツク株式会社 | 産業ロボットにおける運動の阻害事態の警報装置 |
JP2825616B2 (ja) * | 1990-05-21 | 1998-11-18 | 東京エレクトロン株式会社 | 板状体搬送装置 |
JPH10107125A (ja) * | 1996-08-08 | 1998-04-24 | Tokyo Electron Ltd | 搬送装置のインターロック機構 |
US5963449A (en) * | 1996-08-08 | 1999-10-05 | Tokyo Electron Limited | Interlock apparatus for a transfer machine |
JP3288250B2 (ja) * | 1997-03-25 | 2002-06-04 | ファナック株式会社 | ロボット制御装置 |
JP2000150612A (ja) * | 1998-11-09 | 2000-05-30 | Sony Corp | ウェーハ搬送装置 |
JP4010891B2 (ja) * | 2002-07-03 | 2007-11-21 | Necエレクトロニクス株式会社 | 半導体ウェハ搬送方法 |
-
2006
- 2006-03-20 JP JP2006076133A patent/JP4451854B2/ja active Active
-
2007
- 2007-03-19 CN CNB2007101006382A patent/CN100568449C/zh active Active
- 2007-03-19 KR KR1020070026429A patent/KR20070095208A/ko not_active Application Discontinuation
- 2007-03-19 US US11/723,392 patent/US20070238062A1/en not_active Abandoned
- 2007-03-20 TW TW096109528A patent/TW200818320A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070095208A (ko) | 2007-09-28 |
TW200818320A (en) | 2008-04-16 |
CN101042994A (zh) | 2007-09-26 |
JP2007251087A (ja) | 2007-09-27 |
CN100568449C (zh) | 2009-12-09 |
US20070238062A1 (en) | 2007-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4451854B2 (ja) | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 | |
JP2007251088A (ja) | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 | |
JP4047826B2 (ja) | 縦型熱処理装置及び移載機構の自動教示方法 | |
US11139191B2 (en) | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith | |
KR101245464B1 (ko) | 열처리 장치, 열처리 방법 및 기억 매체 | |
JP4313824B2 (ja) | 基板移載装置及び基板移載方法並びに記憶媒体 | |
WO2019030565A1 (en) | STORAGE APPARATUS FOR STORING CASSETTES FOR SUBSTRATES AND PROCESSING APPARATUS EQUIPPED THEREWITH | |
JP6063716B2 (ja) | 基板処理装置及び基板搬送方法 | |
JP4313401B2 (ja) | 縦型熱処理装置及び被処理基板移載方法 | |
US8940096B2 (en) | Vertical thermal processing apparatus and substrate supporter | |
JP5456287B2 (ja) | 縦型熱処理装置 | |
US20080199818A1 (en) | Vertical heat processing apparatus and heat processing method using the vertical heat processing apparatus | |
JP2009099996A (ja) | 縦型熱処理装置及び被処理体移載方法 | |
EP1752725B1 (en) | Vertical heat treatment equipment and method for transferring object to be treated | |
JP2009164226A (ja) | 基板処理装置および基板の芯合わせ方法 | |
JP2008235810A (ja) | 熱処理方法及び熱処理装置並びに被処理基板移載方法 | |
KR100947135B1 (ko) | 종형 열처리 장치 및 이동 적재 기구의 자동 교시 방법 | |
US11769682B2 (en) | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith | |
JP4757499B2 (ja) | 処理装置および処理方法 | |
JP3260160B2 (ja) | 板状体の配列ピッチ変換装置 | |
CN113261080B (zh) | 基板处理装置、炉口封闭单元及半导体器件的制造方法 | |
KR20070084979A (ko) | 웨이퍼 이송로봇 및 이를 구비한 반도체 제조설비 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090526 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090602 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090716 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20090716 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100126 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100128 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4451854 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130205 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130205 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160205 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |