JP4409628B1 - Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate - Google Patents

Abstract

A mold for processing a mother board that can perform push back of a product board and punching of a processed board from the mother board in one press without cutting between the outer periphery of the mother board and the outer periphery of the processed board. And the manufacturing method of a processed board using this, and the manufacturing method of a product board are provided.
A first pushback means for punching a product plate from a mother plate and fitting the punched product plate into an original hole; and the product plate in a direction opposite to the product plate from the mother plate. A second pushback means for punching out the supporting frame portion and fitting the punched frame portion into the original hole; and restricting the frame portion from being completely fitted back into the original hole of the mother plate A mold for processing a mother board provided with a fitting back limiting means, and a method for manufacturing a processed plate and a method for manufacturing a product plate using the same.
[Selection] Figure 1

Description

  The present invention relates to a mold for processing a mother board, a method for manufacturing a processed board, and a method for manufacturing a product board. More specifically, a product board (for example, a printed circuit board) is temporarily fixed to a frame portion by a pushback method. Base plate processing mold for manufacturing a processed plate (for example, a mounting substrate), a manufacturing method of a processed plate using such a base plate processing mold, and a frame provided in such a processed plate The present invention relates to a method for producing a product plate obtained by breaking a sheet.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting are generally performed using separate molds. However, if only pushback processing is performed continuously on the mother board, a large warp will occur on the mother board. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, when the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame.

Therefore, in order to solve this problem, Patent Document 1 discloses that the printed circuit board is disposed on the upstream side with respect to the conveyance direction of the printed wiring board, and the printed circuit board is punched out from the printed wiring board. A mounting board including one or two or more of the printed circuit boards that are arranged on the downstream side with respect to the transport direction of the printed wiring board and pushed back. There is disclosed a printed wiring board processing die having an outer shape cutting means for cutting out from a printed wiring board.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

  On the other hand, in recent years, there has been a demand for further efficiency of the automatic mounting process, and the number of printed circuit boards (that is, the total area of the mounting board) formed on one mounting board has been increasing. . For this reason, there is a problem that the mold becomes large in the mold in which the pushback process and the outer shape cutting process are performed in two stages or three stages.

In order to solve this problem, Patent Document 2 describes:
A first region for simultaneously performing a pushback of a first product plate from a mother plate and a pushback of a frame portion for supporting the first product plate;
The first region is
A first pushback means for punching out the first product plate from the mother plate and fitting the punched first product plate into the original hole;
A mold for processing a mother board, comprising: a second pushback means for punching out the frame part from the mother board in a direction opposite to the first product board and fitting the punched frame part into the original hole. Is disclosed.
In the same document,
(1) When the first product plate and the frame portion for supporting the first product plate are pushed back in the opposite direction, the first product plate and the frame portion can be pushed back simultaneously by a single press,
(2) At this time, a cut is made in advance between the outer periphery of the base plate and the outer periphery of the region to be the frame portion, or immediately before the frame portion is pushed back or immediately before the frame portion is pushed back. In this press, when the outer frame cutting means is used to make a cut between the outer periphery of the base plate and the outer periphery of the frame portion or the outer periphery of the region to be the frame portion, The outer frame of the mother board surrounding the periphery of the machine board is divided into pieces, the work board can be easily separated from the mother board, and the work board can be easily lifted and removed, and
(3) Since the pushback of the first product plate and the outer shape cutting of the frame portion can be performed at one place, the mold can be miniaturized,
Is described.

JP 2002-233996 A JP 2007-318052 A

The mold described in Patent Document 2 has an advantage that the mold can be remarkably reduced in size because the push back of the product board (printed circuit board) and the outer shape cutting of the frame portion can be performed at one place. On the other hand, in order to separate the processed board (mounting board) supported by the product plate from the base plate, a cut is made in advance in the mother board, or the outer periphery of the mother board and the outer periphery of the processed board It is necessary to provide an outer frame cutting means for cutting between the two in advance in the mold. In addition, since the outer frame cut apart is scattered on the mold surface, it is necessary to manufacture the mold surface. Furthermore, providing the outer frame cutting means in the mold not only increases the cost of the mold, but also reduces the durability of the mold.
Therefore, in order to further reduce the cost of the mounting substrate, it is preferable to omit the step of cutting the base plate in advance, or to omit the outer frame cutting means from the mold. However, there has been proposed a mold that can perform push-back of the printed circuit board and punching from the mother board of the mounting board in one press without cutting between the outer circumference of the mother board and the outer circumference of the mounting board. There is no such example.

  The problem to be solved by the present invention is to push back a product board (printed circuit board) and a processed board (mounting board) without cutting between the outer circumference of the mother board and the outer circumference of the processed board (mounting board). Can be punched from a base plate with a single press, and there is no need to clean the mold surface and the mold has a high durability. Another object of the present invention is to provide a method for manufacturing a processed plate, and a method for manufacturing a product plate that separates a product plate from the processed plate thus manufactured.

In order to solve the above-described problems, a base metal mold according to the present invention is summarized as having the following configuration.
(1) The mother board processing mold is:
A first pushback means for punching a product plate from a mother plate and fitting the punched product plate into the original hole;
A second pushback means for punching out a frame portion for supporting the product plate from the base plate in a direction opposite to the product plate and fitting the punched frame portion into the original hole; .
(2) The mother board processing mold is
There is further provided a fitting back limiting means for limiting the frame part from being completely fitted back into the original hole of the mother board.
(3) The first pushback means includes:
A punch (A) for punching the product plate;
The punch (B) for punching the frame part in the direction opposite to the punching direction of the product plate, with the outer peripheral surface of the punch (A) moving up and down along its inner peripheral surface;
A stripper (A) that moves up and down along the inner peripheral surface of the punch (B) and is biased in a direction opposite to the punching direction of the product plate;
It has.
(4) The second pushback means includes
The punch (B) for punching the frame portion in the direction opposite to the punching direction of the product plate, with the outer peripheral surface of the punch (A) moving up and down along the inner peripheral surface;
A stripper (B) provided on the mold surface opposite to the punch (B) and biased in a direction opposite to the punching direction of the frame portion;
A stripper (C) that moves up and down along the outer peripheral surface of the punch (B) and is biased in a direction opposite to the punching direction of the product plate;
It has.
(5) The fitting back limiting means is a protrusion provided on the surface of the stripper (C) or a mold surface opposite to the stripper (C) so as not to contact the mother plate.

The method for producing a processed plate according to the present invention includes:
Using the mother board processing mold according to the present invention, the product board and the frame part are pushed back against the mother board at the same time, and the frame part is an original hole of the mother board. And a pressing step for restricting the complete reversal.
Furthermore, the gist of the manufacturing method of the product plate according to the present invention is to break the frame portion provided in the processed plate obtained by the method according to the present invention and to separate the product plate.

When the product plate and the frame portion for supporting the product plate are pushed back in the opposite direction, the product plate and the frame portion can be pushed back simultaneously by a single press. In addition, when the rewinding restricting means is provided in the mold, the frame portion is not completely reattached to the original hole of the mother board after the press. Therefore, it is possible to easily separate the processed board from the mother board without making a cut in the mother board in advance or providing an outer frame cutting means in the mold. Further, since the outer frame cut on the mold surface is not scattered, the work for cleaning the mold surface becomes unnecessary.
In addition, in order to limit the reversal of the frame part, it is only necessary to provide a protrusion on the stripper (C) for urging the base plate or the mold surface opposite to the stripper. Compared with, the mold cost can be reduced. Moreover, since it is not necessary to form a through hole for cutting the outer frame in the mold, the durability of the mold is also improved.

1 (a), 1 (b), and 1 (c) are plan views of a lower die for a mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. 2 (a), 2 (b), and 2 (c) are bottom views of the upper die of the mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. FIG. 2D is a partial cross-sectional view in the vicinity of the first upper mold stripper. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.1 and FIG.2, Comprising: It is sectional drawing seen from the orthogonal | vertical direction with respect to the conveyance direction of a printed wiring mother board. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.1 and FIG.2, Comprising: It is sectional drawing seen from the parallel direction with respect to the conveyance direction of a printed wiring mother board.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a mother board processing mold for manufacturing a mounting board in which a printed circuit board is supported by a frame portion from a printed wiring board, a manufacturing method of the mounting board, and a printed circuit board However, the present invention is also applicable to “mother boards” other than printed wiring board, “processed boards” other than mounting boards, and “product boards” other than printed circuit boards. Can do.

[1. Mold for processing base plate (1)]
1 and 2 show a mother board machining die according to a first embodiment of the present invention. In FIG. 1 and FIG. 2, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing. In FIG. 1 and FIG. 2, the mother board machining mold 10 includes a lower mold 20 and an upper mold 50.

[1.1. Lower mold]
[1.1.1. Basic structure of lower mold]
As shown in FIG. 1, the lower mold 20 includes a lower mold base plate 22, a frame punching punch (punch (B), second pushback means or first pushback means) 24, and a first lower mold stripper. (Stripper (A), first pushback means) 26 and a second lower mold stripper 28 (stripper (C), second pushback means).

  Guide posts 30, 30... Used for positioning the upper die 50 at the time of pressing are provided at the four corners of the lower die base plate 22. The tips of the guide posts 30, 30... Are higher than the upper surface of the second lower mold stripper 28. The second lower mold stripper 28 can move up and down along the peripheral wall surfaces of the guide posts 30, 30.

The frame punching punch 24 is a punch (male die) for punching upward the frame portion for supporting the printed circuit board from the printed wiring mother board placed on the lower die 20, and at the same time This is a female die for punching the circuit board downward, and is fixed to the approximate center of the lower die base plate 22.
In FIG. 1, the outer shape of the frame punching punch 24 is rectangular. However, the shape is not limited to this, and at least one side is a straight line, and at least one side is orthogonal to this. Just do it. Each side may have unevenness for partially forming a slit for stress relaxation, a semicircular or rectangular cutout, and the like.

  On the upper surface of the frame punching punch 24, positioning pins 32a and 32a used for positioning when the printed wiring board is pressed are provided upright. In FIG. 1, two positioning pins 32a and 32a are provided on the diagonal of the frame punching punch 24, but this is merely an example, and the positions and number of the positioning pins 32a and 32a are as follows. , Can be arbitrarily selected according to the purpose.

The frame punching punch 24 is provided with lift pin insertion holes (lifting / dispensing means) 24a and 24a for inserting lift pins, which will be described later. Further, the lower mold base plate 22 is provided with through holes 22a, 22a at positions corresponding to the lift pin insertion holes 24a, 24a for dropping the punched residue generated by the lift pins downward. The lifting / dispensing means is not necessarily required. However, if the lifting / dispensing means is provided, it becomes easy to transport the mounting substrate after the press working to the next process.
In FIG. 1, two lift pin insertion holes 24ba and 24a are provided on the left and right sides of the frame punching punch 24. However, this is merely an example, and the positions of the lift pin insertion holes 24a and 24a As for the number, the optimum position and number may be selected so that the mounting substrate after the press working is smoothly lifted and removed.

The first lower mold stripper 26 is used for fitting a printed circuit board punched downward from a printed wiring board placed on the lower mold 20 (that is, in a direction opposite to the frame portion) into the original hole. It is supported by the lower mold 20 and urged upward so that it can move up and down (slide) along the inner peripheral surface of the frame punching punch 24.
A pressing plate 26 a is provided on the back surface of the lower mold base plate 22 and below the first lower mold stripper 26. A through hole is provided in the pressing plate 26a, and support bolts 26b, 26b... Are loosely inserted in the through hole. The washers 26c, 26c, and elastic members 26d, 26d, and so on are inserted between the tops of the support bolts 26b, 26b, and the lower surface of the pressing plate 26a. The material of the elastic members 26d, 26d... Is not particularly limited, but urethane rubber or the like is suitable.
Further, the lower mold base plate 22 is provided with a through hole below the first lower mold stripper 26, and pressing pins 26e, 26e... Are loosely inserted into the through holes. The upper ends of the pressing pins 26e, 26e ... are in contact with or fixed to the lower surface of the first lower mold stripper 26, and the lower ends of the pressing pins 26e, 26e ... are in contact with or fixed to the upper surface of the pressing plate 26a. That is, the first lower mold stripper 26 is supported by the pressing pin 26e and is urged upward by the elastic members 26d, 26d.

  In FIG. 1, one first lower mold stripper 26 having a circular cross section is disposed in the frame punching punch 24. However, the shape, number and arrangement of the first lower mold stripper 26 are as follows. It is not particularly limited. That is, the first lower mold stripper 26 may have a shape such as a quadrangle, a triangle, or an ellipse. Further, two or more first lower mold strippers 26 may be disposed in the frame punching punch 24 so as to be movable up and down.

The second lower mold stripper 28 is for mounting a printed wiring board at the time of processing, and can move up and down (slid) along the peripheral wall surface (outer peripheral surface) of the frame punching punch 24. Are supported by the lower mold 20 and biased upward. Support bolts 34, 34... Loosely inserted from the lower surface of the lower mold base plate 22 are fixed to the lower surface of the second lower mold stripper 28. The support bolts 34, 34... Can move up and down in the lower mold base plate 22. Further, elastic members 36, 36... Are inserted between the lower surface of the second lower mold stripper 28 and the upper surface of the lower mold base plate 22. That is, the second lower mold stripper 28 is restricted from moving upward by the support bolts 34, 34... And urged upward by the elastic members 36, 36.
The number and arrangement of the support bolts 34, 34... And the elastic members 36, 36... Are not particularly limited, and the material and thickness of the printed wiring board so that the printed wiring board can be processed smoothly. The optimum number and arrangement are appropriately selected according to the above. The material of the elastic members 36, 36... Is not particularly limited, but urethane rubber or the like is preferable.

[1.1.2. Protrusion (Fitting back limiting means)]
On the upper surface of the second lower mold stripper 28 and on the left and right sides with respect to the transport direction of the printed wiring board, protrusions (retraction limiting means) 29 and 29 are provided. The protrusions 29 and 29 are provided at positions that do not come into contact with the printed wiring board used for pressing.
The protrusions 29 and 29 move upward of the second lower mold stripper 28 when the frame portion is punched into the original hole of the printed wiring board after the frame portion punching by the frame portion punching punch 24 is finished. And the frame portion is restricted from being completely fitted back to the original hole of the printed wiring board.

  After punching out the frame part, when the frame part is completely fitted into the original hole of the printed wiring board, it is generally easy to manually remove the mounting board consisting of the frame part and the printed circuit board from the printed wiring board. is not. On the other hand, if the protrusions 29 and 29 are provided on the surface of the second lower mold stripper 28, the upward movement of the second lower mold stripper 28 is restricted at a later stage of the press, and the printed wiring board is completely moved to the original position. Can not be pushed up. Therefore, after the press is completed, the mounting board is lifted from the printed wiring board. When the mounting board is lifted from the printed wiring board, it is easy to remove the mounting board manually.

In order to facilitate the removal of the mounting substrate, the height of the protrusions 29 and 29 should be at least higher than the thickness of the printed wiring board. In order to facilitate the manual removal of the mounting substrate, the height of the protrusions 29 and 29 is preferably 1.5 times or more, more preferably 1.8 times or more the thickness of the printed wiring board. It is.
Generally, the higher the height of the protrusions 29, 29, the higher the floating of the mounting board, so that the frictional force generated between the outer periphery of the mounting board and the original hole of the printed wiring board is reduced. The smaller this frictional force, the easier the removal by human power. Also, if the frictional force generated between the outer periphery of the mounting board and the original hole of the printed wiring board is weaker than the frictional force between the lift pin and the mounting board, which will be described later, it can be lifted and removed by the lift pin. It becomes.

Further, when the height of the protrusions 29 and 29 is set to be twice or more the thickness of the printed wiring board, the mounting board is completely extracted from the printed wiring board after the press. For this reason, it is further facilitated to lift and wipe off the mounting substrate after the press with the lift pins. Further, the mounting substrate after the press can be easily picked up by hand without using lift pins.
However, if the height of the protrusions 29 and 29 is increased more than necessary, not only will there be no profit, but an extra stroke corresponding to the height of the protrusions 29 and 29 will be required, so the lower mold 20 will be enlarged. Accordingly, the height of the protrusions 29 and 29 is preferably not more than four times the thickness of the printed wiring board. The height of the protrusions 29 and 29 is more preferably 3 times or less, more preferably 2.5 times or less the thickness of the printed wiring board.
When the height of the protrusions 29 and 29 is twice or more the thickness of the printed wiring board, the mounting board is not fitted in the original hole of the printed wiring board. However, in the present application, for the sake of convenience, the state where the operation of trying to fit into the original hole is restricted by the protrusions 29 and 29 is also expressed as “fit into the original hole”.

Since the protrusions 29 and 29 only need to be able to limit the upward movement of the second lower mold stripper 28 in the later stage of press working, the shape, number, arrangement, material, and the like are arbitrarily selected according to the purpose. can do.
For example, in the example shown in FIG. 1, the protrusions 29 and 29 are plates whose planar shape is a strip shape, but a plurality of pins may be arranged in a line instead of the strip shape plate.

In addition, the original printed wiring board has a standardized size. The user cuts this original plate into an appropriate size and uses it for pressing. The example shown in FIG. 1 assumes a case in which an original plate is cut into a long and narrow strip to form a printed wiring mother board, which is successively pressed while being conveyed downstream. Therefore, in FIG. 1, the protrusions 29 and 29 are provided at the left and right ends with respect to the conveyance direction of the printed wiring board.
On the other hand, when the original board is cut into a shape slightly larger than the mounting board to form a printed wiring mother board, it is not necessary to sequentially convey the printed wiring mother board to the downstream side. Therefore, in such a case, instead of or in addition to the right and left ends with respect to the “transport direction” shown in FIG. 1, protrusions 29 and 29 are provided at the upper and lower ends of the “transport direction” shown in FIG. You can also.

In order to reliably limit the upward movement of the second lower mold stripper 28, the protrusions 29 and 29 are preferably made of a hard material such as metal or plastic. As long as the movement in the direction can be restricted, an elastic material such as urethane rubber may be used.
Further, as shown in FIG. 1, the protrusions 29 and 29 may be formed on the surface of the second lower mold stripper 28, or all or a part of the protrusion 29, 29 is opposed to the second lower mold stripper 28. You may provide in the lower surface of 50.

[1.2. Upper mold]
The upper mold 50 includes a top plate 52, a pressing plate holder 54, a pin holder 56, a punch plate 58, and a female mold 60. These are laminated | stacked via the knock pin 52a, 52a ..., and are being fixed by fastening bolt 52b, 52b ....
The female mold 60 is a female mold when the frame part is pushed back. In the female die 60, guide post guide holes 60a, 60a,... Are formed at positions corresponding to the guide posts 30, 30.

Further, a slide space is provided at a position substantially in the center of the female die 60 and corresponding to the frame punching punch (punch (B)) 24, and a frame punched from the printed wiring board in the slide space. A first upper mold stripper (stripper (B), second pushback means) 62 for fitting the portion into the original hole is loosely inserted.
The first upper mold stripper 62 is supported by support bolts 62a, 62a... Loosely inserted from above the punch plate 58, and is restricted from moving downward. The upper ends of the support bolts 62 a, 62 a... Can be moved up and down along the through holes formed in the pin holder 56. The first upper mold stripper 62 is supported by support bolts 62a, 62a... So that the lower end of the first upper mold stripper 62 slightly protrudes from the lower surface of the female mold 60.
As shown in FIG. 2 (d), the punch plate 58 is provided with a through hole above the first upper mold stripper 62, and a lower surface of cap bolts 58a, 58a,. Elastic members 58b, 58b,... For biasing the first upper mold stripper 62 downward are inserted between the upper surfaces of the first upper mold strippers 62. The material of the elastic members 58b, 58b... Is not particularly limited, but urethane rubber or the like is suitable.
Further, the first upper mold stripper 62 is provided with positioning pin guiding holes 62b and 62b at positions corresponding to the positioning pins 32a and 32a.

  In the first upper mold stripper 62, a printed circuit board punch (punch (A), second punch) for punching a printed circuit board downward from the printed wiring board at a position corresponding to the first lower mold stripper 26 is provided. 1 pushback means) 64 is provided. The printed circuit board punching punch 64 is fixed to the punch plate 58. The outer peripheral surface of the printed circuit board punching punch 64 moves vertically (slids) along the inner peripheral surface of the frame punching punch 24. The frame portion is punched in the direction opposite to the punching direction of the printed circuit board punched by the printed circuit board punching punch 64.

In the first upper mold stripper 62, lift pins (lifting / dispensing means) 66a are provided at positions corresponding to the lift pin insertion holes 24a, 24a. The lift pin 66 a is inserted into a through hole provided in the punch plate 58, and its upper end is fixed by a pin holder 56. The tip of the lift pin 66a protrudes from the lower surface of the first upper mold stripper 62 in a no-load state.
The lift pins 66a are for punching out any part of the mounting board thereby lifting the mounting board together with the upper mold 50 by the frictional force between the lift pins 66a and the mounting board. Accordingly, it is preferable that the length of the lift pins 66a is set so that the mounting substrate can be easily lifted. Specifically, the length from the lower surface of the first upper mold stripper 62 to the tip of the lift pin 66a in the no-load state is preferably 0.8 to 2 times the thickness of the printed wiring board.

A slide space is provided in the first upper mold stripper 62 and around the lift pin 66a, and a second upper mold stripper (lifting / dispensing means) 66b is loosely inserted in the slide space. A through hole is provided in the second upper mold stripper 66b, and a lift pin 66a is loosely inserted in the through hole.
The second upper mold stripper 66b is supported by a support bolt (not shown) that is loosely inserted from above the punch plate 58. The upper end of the support bolt that supports the second upper mold stripper 66 b can move up and down along a through-hole provided in the pin holder 56.
Further, the second upper mold stripper 66b is configured such that the lower surface of the second upper mold stripper 66b and the tip surface of the lift pin 66a are on the same plane or the lift pin 66a when the upper mold 50 reaches the top dead center. It is supported by a support bolt (not shown) so that the lower surface of the second upper mold stripper 66b is lower than the front end surface of the second upper mold stripper 66b.

In the through hole that penetrates the pin holder 56 and the punch plate 58, pressing pins 66c, 66c,. The lower ends of the pressing pins 66c, 66c ... are in contact with the upper surface of the second upper mold stripper 66b, and the upper ends of the pressing pins 66c, 66c ... are the lower surfaces of the pressing plates 66d provided in the slide space of the pressing plate holder 54. Touching.
Further, the top plate 52 is provided with a through hole at a position corresponding to the pressing plate 66d, and knockout bushes 66e, 66e,... Are inserted into the through hole. The knockout bushes 66e, 66e,... Are set so that their tips slightly protrude from the upper surface of the top plate 52 in an unloaded state.

In the example shown in FIGS. 1 and 2, the lift pin 66a is provided in the first upper mold stripper 62 (that is, any part of the frame portion), but as long as the printed circuit is not damaged. The printed circuit board punching punch 64 (that is, any portion of the printed circuit board) may be provided.
Further, in order to facilitate transport of the mounting substrate after processing to the next process, it is provided with a lift pin 66a, a second upper mold stripper 66b, and a mechanism (lifting / dispensing means) related thereto. However, when it is not necessary to lift the mounting substrate after processing, the lifting / wiping off means can be omitted.

In the mother board machining mold 10 shown in FIGS. 1 and 2,
The first pushback means
A printed circuit board punch (punch (A)) 64 for punching a printed circuit board (product board);
The outer peripheral surface of the printed circuit board punching punch 64 moves up and down (slids) along the inner peripheral surface, and the frame punching punch (punch for punching the frame portion in the direction opposite to the punching direction of the printed circuit board) (B)) 24,
A first lower mold stripper (stripper (A)) 26 that moves up and down (slids) along the inner peripheral surface of the frame punching punch 24 and is biased in a direction opposite to the punching direction of the printed circuit board. And.
The second pushback means
The outer peripheral surface of the printed circuit board punch (punch (A)) 64 moves up and down (slids) along the inner peripheral surface, and the frame portion is punched in a direction opposite to the punching direction of the printed circuit board. A frame punching punch (punch (B)) 24,
A first upper mold stripper (stripper (B)) 62 provided on the mold surface opposite to the frame part punch 24 and biased in a direction opposite to the punching direction of the frame part;
A second lower mold stripper (stripper (C)) 28 that moves up and down (slids) along the outer peripheral surface of the frame punching punch 24 and is biased in a direction opposite to the punching direction of the printed circuit board; ,
It has.

  That is, in the example shown in FIGS. 1 and 2, the printed circuit board is punched downward, and the frame portion is punched upward. However, the punching method of the printed circuit board and the frame part is not limited to this, and when the arrangement of the punch and the stripper is reversed, the printed circuit board is punched upward and the frame part is punched downward. Can do.

[2. Processed board (mounting board) manufacturing method (1) and product board (printed circuit board) manufacturing method (1)]
Next, a method for manufacturing a mounting board using the mother board processing mold shown in FIGS. 1 and 2 and a method for manufacturing a printed circuit board will be described. FIG. 3 shows a process chart of a printed wiring board processing process viewed from a direction perpendicular to the transport direction. FIG. 4 shows a process diagram of a printed wiring board processing step viewed from a direction parallel to the transport direction.

First, as shown in FIGS. 3A and 4A, the printed wiring mother board 100 is placed on the lower mold 20. The printed wiring board 100 is provided with a pushback reference hole in advance, and positioning is performed by inserting the pushback reference hole into the positioning pins 32a and 32a.
When the upper die 50 is lowered from this state, as shown in FIG. 4B, first, the second upper die stripper 66b and the first upper die stripper 62 contact the printed wiring board 100 and move upward. . Along with this, the lift pins 66a protrude from the lower surface of the second upper mold stripper 66b, and the printed wiring board 100 is punched out. Further, as the second upper mold stripper 66b moves upward, the pressing pins 66c, 66c,... Push the pressing plate 66d upward. As a result, knockout bushes 66e, 66e,... Protrude from the top surface of the top plate 52.
At the same time, the upper die 50 pushes only the second lower die stripper 28 downward through the protrusions 29 and 29.

When the upper die 50 is further lowered, as shown in FIGS. 3B and 4C, the printed circuit board punching punch 64 resists the urging force of the elastic members 26d, 26d. The mold stripper 26 is pushed down. As a result, the printed circuit board 102 is punched downward from the printed wiring board 100.
On the other hand, the frame section cutting punch 24 pushes up the first upper mold stripper 62 against the urging force of the elastic members 58b, 58b. At the same time, the female mold 60 pushes down the printed wiring mother board 100 downward. As a result, the frame portion 104 is punched from the printed circuit board 100 in the direction opposite to the printed circuit board 102 (upward). Further, as the first upper mold stripper 62 moves upward, the second upper mold stripper 66b also moves upward, and the pressing pins 66c, 66c... Push the pressing plate 66d and the knockout bushes 66e, 66e. .
Further, the female mold 60 pushes the second lower mold stripper 28 downward further through the protrusions 29 and 29.

When the upper die 50 is raised after the press is finished, the elastic members 26d, 26d... Push the first lower die stripper 26 and the printed circuit board 102 upward. At the same time, the elastic members 58b, 58b... Push down the first upper mold stripper 62 and the frame portion 104 downward. As a result, as shown in FIGS. 3C and 4D, the printed circuit board 102 is fitted into the original hole.
On the other hand, projections 29 and 29 are provided between the second lower mold stripper 28 and the lower surface of the upper mold 50. Therefore, when the printed circuit board 102 is fitted into the original hole, the second lower mold stripper 28 and the printed wiring mother board 100 cannot completely return to their original positions. As a result, the frame portion 104 is lifted from the printed wiring motherboard 100.
In the example shown in FIGS. 3 and 4, the heights of the protrusions 29 and 29 are drawn twice as high as the thickness of the printed wiring mother board 100. Is completely punched from the printed wiring board 100. As described above, in the present application, for convenience, this is also referred to as “inserting into the original hole”. Further, the frame portion 104 is simply pushed back in the direction opposite to the punching direction, and strictly speaking, it is not completely returned to the hole remaining after the printed wiring board is punched out. This is also called “pushback”.
Further, as shown in FIG. 4D, at this time, since the downward biasing force does not act on the second upper mold stripper 66b, the second upper mold stripper 66b remains moved upward.

Further, at this time, the frame portion 104 is completely lifted from the printed wiring board 100, and the lift pins 66a and 66a are stuck into the frame portion 104. Therefore, when the upper die 50 is further raised from this state, the mounting substrate 106 in which the printed circuit board 102 is supported by the frame portion 104 is lifted by the lift pins 66a and 66a as shown in FIG. And lifted upward.
Thereafter, when the upper die 50 is further raised and the upper die 50 approaches the top dead center, a pressing means (not shown) presses the knockout bushes 66e, 66e. As a result, the pressing plate 66d pushes down the second upper mold stripper 66b downward via the pressing pin 66c, and the mounting substrate 106 is removed from the upper mold 50.
The obtained mounting board 106 is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board 102. After the automatic mounting is completed, the printed circuit board 102 can be separated by breaking the frame portion 104.

[3. Action of mold for processing base plate (1), manufacturing method of processed plate (1) and manufacturing method of product plate (1)]
The mother board processing mold 10 according to the present embodiment includes a first pushback means for pushing back the printed circuit board 102 and a second pushback for the frame 104 for supporting the printed circuit board 102. Push-back means and the push-back of the printed circuit board 102 and the push-back of the frame portion 104 are simultaneously performed. Can be performed simultaneously. Therefore, the mold can be reduced in size as compared with the conventional mold in which pushback and outer shape cutting are performed in separate areas.

Further, when the protrusions 29 and 29 are provided on the lower mold 20, the frame portion 104 is not completely fitted back into the original hole of the printed wiring motherboard 100 after the press is completed. Therefore, the mounting substrate 106 can be easily separated from the printed wiring mother board 100 without making a cut in the mother board in advance or providing an outer frame cutting means in the mold. Moreover, since the outer frame is not cut apart, the work for cleaning the mold surface is not required.
In addition, in order to limit the fitting back of the frame portion 104, it is only necessary to provide the protrusions 29 and 29 on the second lower mold stripper 28 for urging the printed wiring board 100 or the lower surface of the upper mold facing the second lower mold stripper 28. Therefore, the mold cost can be reduced as compared with the case where the outer frame cutting means is provided. Moreover, since it is not necessary to form a through hole for cutting the outer frame in the mold, the durability of the mold is also improved.
Further, since the frame portion 104 is not completely fitted into the printed wiring mother board 100, the mounting substrate 106 after the press working can be easily lifted together with the upper die 50 by the lift pins 66a. For this reason, it is very easy to transport the mounting substrate 106 to the next process, and the working efficiency is dramatically improved. Further, even when the lifting pins are not provided with lifting pins, it is easy to remove the mounting board 106 by human power.

[4. Mold for processing base plate (2), manufacturing method of processed plate (2), and manufacturing method of product plate (2) "
Although not shown in the drawing, the die for processing a base plate according to the second embodiment of the present invention has protrusions 29 and 29 on the upper surface of the second lower mold stripper (stripper (D)) 28 as a retraction limiting means. Instead of providing, the urging force of the elastic members 36, 36... Urging the second lower mold stripper 28 upward is intentionally weakened. Other points are the same as those in the first embodiment, and thus the description thereof is omitted.

To limit the punched frame from being completely reinserted into the original hole,
(1) As shown in FIGS. 1 to 5, a first method of providing protrusions 29, 29 to physically limit the upward movement of the second lower mold stripper 28;
(2) Although not shown, the force that pushes up the second lower mold stripper 28 is weaker than the frictional force generated between the outer periphery of the frame portion 104 and the inner peripheral surface of the original hole of the printed wiring board 100. A second method of
There is. In the present embodiment, the second method is used.

  Usually, the number and arrangement of the elastic members 36, 36... For urging the second lower mold stripper 28 upward are determined so that the frame portion 104 can be completely fitted back into the original hole. . On the other hand, if the urging force of the elastic members 36, 36... Urging the second lower mold stripper 28 upward is intentionally weakened, the mounting substrate is provided at the time when the press working is completed without providing the protrusions 29, 29. Can be lifted from the printed wiring board.

  For a method of manufacturing a processed plate using the mother plate processing mold according to the present embodiment and a method of manufacturing a product plate from the processed plate thus obtained, the second upper mold stripper 28 Since it is the same as that of the first embodiment except that the urging force in the direction is intentionally weakened, detailed description is omitted.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

The mold for processing a mother board according to the present invention can be used as a mold for manufacturing a mounting board in which a printed circuit board is supported by a frame portion by a pushback method.
Moreover, the manufacturing method of the processed board which concerns on this invention can be used as a manufacturing method of the board | substrate for mounting by which the printed circuit board was supported by the frame part by the pushback method.
Furthermore, the manufacturing method of the product board which concerns on this invention can be used as a method of manufacturing a printed circuit board from the mounting board | substrate with which the printed circuit board was supported by the frame part by the pushback method.

DESCRIPTION OF SYMBOLS 10 Base plate processing metal mold 20 Lower mold 24 Frame part punch (Punch (B), 2nd pushback means or 1st pushback means)
24a Lift pin guide hole (lifting / wiping off means)
26 First lower mold stripper (stripper (A), first pushback means)
28 Second lower mold stripper (stripper (C), second pushback means)
50 Upper mold 62 Upper mold first stripper (stripper (B), second pushback means)
64 Punches for printed circuit board punching (punch (A), first pushback means)
66a Lift pin (lifting / wiping off means)
66b 2nd upper mold stripper (lifting / dispensing means)

Claims (5)

A mold for processing a mother board having the following configuration.
(1) The mother board processing mold is:
A first pushback means for punching a product plate from a mother plate and fitting the punched product plate into the original hole;
A second pushback means for punching out a frame portion for supporting the product plate from the base plate in a direction opposite to the product plate and fitting the punched frame portion into the original hole; .
(2) The mother board processing mold is
There is further provided a fitting back limiting means for limiting the frame part from being completely fitted back into the original hole of the mother board.
(3) The first pushback means includes:
A punch (A) for punching the product plate;
The punch (B) for punching the frame part in the direction opposite to the punching direction of the product plate, with the outer peripheral surface of the punch (A) moving up and down along its inner peripheral surface;
A stripper (A) that moves up and down along the inner peripheral surface of the punch (B) and is biased in a direction opposite to the punching direction of the product plate;
It has.
(4) The second pushback means includes
The punch (B) for punching the frame portion in the direction opposite to the punching direction of the product plate, with the outer peripheral surface of the punch (A) moving up and down along the inner peripheral surface;
A stripper (B) provided on the mold surface opposite to the punch (B) and biased in a direction opposite to the punching direction of the frame portion;
A stripper (C) that moves up and down along the outer peripheral surface of the punch (B) and is biased in a direction opposite to the punching direction of the product plate;
It has.
(5) The fitting back limiting means is a protrusion provided on the surface of the stripper (C) or a mold surface opposite to the stripper (C) so as not to contact the mother plate. The mold for processing a mother board according to claim 1 , wherein the height of the protrusion is higher than the thickness of the mother board and not more than four times the thickness of the mother board. At the same time as push back of the product plate and push back of the frame portion, a lift pin provided on the upper mold is used to punch out any part of the processed plate including the product plate supported by the frame portion The working plate is lifted upward together with the upper die by the frictional force between the lift pin and the working plate, and when the upper die reaches near the top dead center, the working plate is resisted against the frictional force. The mold for processing a mother board according to claim 1 or 2 , further comprising lifting / discharging means that presses downward and drops the processed plate downward. A mold for processing a base plate according to any one of claims 1 to 3 , wherein the product plate is pushed back and the frame portion is pushed back against the base plate at the same time, and the frame portion The manufacturing method of the processed board provided with the press process which restrict | limits that it is completely fitted back to the original hole of the said mother board. The manufacturing method of the product board which fractures | ruptures the said frame part with which the processed board obtained by the method of Claim 4 is equipped, and isolate | separates the said product board.

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