JP4408169B2 - Lamination method - Google Patents

Description

【００５０】
【発明の効果】
本発明の積層方法は、可撓性シート３を付設した上部プレート１及び可撓性シート４を付設した下部プレート２が設置された真空チャンバー６を有する真空積層装置を２台以上使用して、該チャンバー内の上下プレート間で、凹凸を有する基板５ａと、支持体フィルム又は金属箔上に樹脂組成物を積層してなるフィルム状樹脂層５ｂとからなる積層体５を２段階以上圧締して積層を行うに当り、１回目の圧締温度Ｔ₁℃を、（Ｔ_g−２０）℃≦Ｔ₁℃≦（Ｔ_g＋１０）℃〔Ｔ_g：フィルム状樹脂層の樹脂組成物のガラス転移温度〕の条件で、かつ、１回目の圧締時に積層体５にかける圧力が０．５×１０ ⁵ 〜１．５×１０ ⁵ Ｐａとなる条件で実施した後、２回目以降の圧締温度Ｔ_n℃を、（Ｔ₁＋１０）℃≦Ｔ_n℃≦（Ｔ₁＋７０）℃の条件で、かつ、２回目以降の圧締時に積層体５にかける圧力を１回目よりも０．１×１０ ⁵ 〜２０×１０ ⁵ Ｐａ高くする条件で実施するので、追従性、マイクロボイド発生の抑制に優れ、表面平滑性に優れた効果を示すものであり、プリント回路基板の多層化に非常に有用である。
【図面の簡単な説明】
【図１】 本発明の積層装置の主要部の構造図である。
【図２】 本発明の積層装置の主要部の構造図である（搬送用フィルム１３を使用時）。
【符号の説明】
１・・・上部プレート
２・・・下部プレート
３・・・上部プレートに付設した可撓性シート
４・・・下部プレートに付設した可撓性シート
５・・・積層体
５ａ・・・凹凸を有する基板
５ｂ・・・フィルム状樹脂層
６・・・真空チャンバー
７・・・シール
８・・・上部プレートを通過する開口部
９・・・下部プレートを通過する開口部
１０・・・可撓性シート３と上部プレート１間の空隙部
１１・・・可撓性シート３、４間に形成される空間部
１２・・・押えシール金具
１３・・・搬送用フィルム
１４・・・コンベア
１５・・・巻出しロール
１６・・・巻取りロール
１７・・・ガイドロール
１８・・・ニップロール
１９・・・超音波振動装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for laminating a film-like resin layer on a substrate having irregularities in the production of a printed circuit board. More specifically, the film-like resin layer has good followability and the smoothness of the resin surface after lamination. The present invention relates to a lamination method that is excellent in the build-up method and useful for a build-up method.
[0002]
[Prior art]
In recent years, with the miniaturization and high performance of electronic devices, the density and the number of layers of printed circuit boards are increasing.
In multilayering such a printed circuit board, a thermosetting resin composition or a photosensitive resin composition is used as an insulating layer, and the thermosetting resin composition or the photosensitive resin composition is formed on an inner layer circuit formed in advance. Or a film-like resin made of the thermosetting resin composition or the photosensitive resin composition is laminated. A copper foil or a support film (separator film) is usually laminated on one side of such a film-like resin. In the case of a copper foil, it is half-etched or entirely etched, and in the case of a support film, it is peeled off. Then, after drilling with laser or ultraviolet light, after copper plating, a method of forming a circuit by performing patterning with light again using a photoresist film, a so-called build-up method is effectively used.
[0003]
On the other hand, although not directly related to the build-up method, as a conventional method of sticking a dry film on a substrate or a cover film etc. on a substrate, Japanese Patent Application Laid-Open No. 11-129272 discloses a lower sheet material and A method for manufacturing a laminate is disclosed in which pressure is applied when the temperature difference of the upper sheet material falls within a predetermined value.
In the manufacturing method using the vacuum laminating apparatus, when a substrate having a so-called unevenness with a surface of a printed board that is not so fine and less dense is laminated with a film, there is no small bubbles (microvoids) and surface smoothness is good. Can be manufactured.
[0004]
[Problems to be solved by the invention]
However, when trying to laminate a film-like resin layer with a substrate having irregularities used in a build-up method or the like, in the technique disclosed in JP-A-11-129272, in order to follow the film-like resin to the substrate, It is necessary to increase the laminating temperature and pressure. In that case, microvoids may remain between the substrate and the film resin layer, which may lead to dielectric breakdown of the circuit line. Further, the unevenness of the substrate is reflected, and unevenness may occur on the surface of the laminated resin. Unevenness on the surface of the laminated resin must be avoided because problems such as poor adhesion, poor followability, and poor appearance occur during circuit formation in the next process.
In particular, considering the recent multilayering of substrates, good followability and suppression of microvoids generated between the substrate and the film-like resin layer are important, and surface smoothness after lamination is also important.
[0005]
[Means for solving problems]
In view of such circumstances, the present inventors have intensively studied and, as a result, have a vacuum chamber 6 in which an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4 are installed. Vacuum laminating equipment2 or moreAnd a laminate 5 comprising a substrate 5a having irregularities between the upper and lower plates in the chamber and a film-like resin layer 5b obtained by laminating a resin composition on a support film or a metal foil.2 steps or moreWhen laminating by pressing1Second pressing temperature T₁° C, (T_g−20) ° C. ≦ T₁℃ ≦ (T_g+10) ° C. [T_g: Glass transition temperature of resin composition of film-like resin layer]And the pressure applied to the laminated body 5 at the time of the first pressing is 0.5 × 10 ^Five ~ 1.5 × 10 ^Five Under the condition of PaAfter performing the second and subsequent pressing temperatures T_n° C, (T₁+10) ° C ≦ T_n℃ ≦ (T₁+70) ° CAnd the pressure applied to the laminated body 5 at the time of the second and subsequent pressing is 0.1 × 10 5 than the first time. ^Five ~ 20x10 ^Five Under the condition of increasing PaIt was found that the lamination method to be carried out met the above object, and the present invention was completed.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a specific vacuum laminating apparatus is used.2 or moreAnd using the laminate 5 composed of the substrate 5a having unevenness and the film-like resin layer 5b.2 steps or moreFor pressing and laminating1Second pressing temperature T₁℃ and the second and subsequent pressing temperatures T_nAdjusting ℃And adjusting the pressure applied to the laminate 5 during the first pressing and the second and subsequent pressuresIt is characterized by.
[0007]
First, the apparatus used for carrying out the laminating method of the present invention is not particularly limited as long as it is a vacuum laminating apparatus capable of performing two or more stages of pressing. However, two or more stages using two or more of the same vacuum laminating apparatus are used. It is preferable to perform the pressing in that the trouble of changing the temperature setting at the time of pressing twice or more with one apparatus can be avoided. Such a case will be described below with reference to FIGS.
FIG. 1 shows an embodiment in which the method of the present invention is carried out using two vacuum lamination apparatuses. Each vacuum chamber 6 is provided with an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4. The flexible sheet 4 is provided directly on the lower plate. I am letting. The flexible sheet 3 has an upper portion so that a gap portion 10 (hereinafter sometimes simply referred to as a gap portion 10) can be formed between the flexible sheet 3 and the upper plate 1 by the pressing seal fitting 12 at the four sides. It is attached to the plate 1. Further, the upper plate 1 is provided with an opening 8 that passes through the plate 1 (hereinafter sometimes simply referred to as the opening 8), and the pressure of the gap 10 is adjusted by the opening 8. When gas or liquid is introduced into the gap 10 from the opening 8, the flexible sheet 3 swells like a balloon.
The lower plate 2 is provided with an opening 9 that passes through the plate 2 (hereinafter, simply referred to as the opening 9), and is formed between the flexible sheets 3 and 4 by the opening 9. The pressure of the space portion 11 (hereinafter sometimes simply referred to as the space portion 11) is adjusted. Further, a seal 7 is disposed on the lower plate in order to efficiently reduce the pressure in the vacuum chamber 6. Further, two ultrasonic vibration devices 19 are built in the lower plate.
[0008]
FIG. 2 further shows a pair of upper and lower transfer films 13 (hereinafter simply referred to as a transfer film 13) that sandwiches a laminate 5 of a substrate 5 a having unevenness and a film-like resin layer 5 b between upper and lower plates of a vacuum chamber 6 and transfers the inside of the chamber. This is a case where a transport film 13 is sometimes installed. The tension and the conveying speed of the conveying film 13 are adjusted by an unwinding roll 15, a winding roll 16, and a nip roll 18. The unwinding roll 15 is located near the entrance of the first vacuum laminating apparatus, and the winding roll 16 and the nip roll. 18 is arranged near the outlet of the second vacuum laminator. A guide roll 17 is disposed in the passage line of the transport film 13.
[0009]
In carrying out the lamination, first, the substrate 5a having projections and depressions (hereinafter simply referred to as the substrate 5a) and the film-like resin layer 5b are preliminarily preliminarily made into a laminate 5 by an auto sheet cut laminator or the like. Is preferred. Specifically, the protective film stuck to the film-like resin layer 5b is peeled off and laminated so that the resin composition layer surface is in contact with the substrate 5a.
The structure of the laminated body 5 is arbitrary, such as board | substrate 5a / film-like resin layer 5b, film-like resin layer 5b / board | substrate 5a / film-like resin layer 5b.
[0010]
First, the first pressing is performed using the first vacuum laminating apparatus.
In order to perform such pressing, the laminated body 5 is placed at the pressing position on the flexible sheet 4, and then the lower plate 2 is lifted and sealed with the upper plate 1. After the sealing engagement, the space 11 is brought into a reduced pressure state. Specifically, suction is performed by a vacuum pump from the opening 9 of the lower plate 2, and the pressure in the space 11 is reduced to 200 Pa or less, preferably 100 Pa or less. When the pressure exceeds 200 Pa, microvoids remain between the substrate 5a having unevenness and the film-like resin layer 5b, and the smoothness of the surface of the film-like resin layer 5b after lamination tends to be deteriorated.
When the space portion 11 is in a reduced pressure state, if the gap portion 10 is in the reduced pressure state at the same time, the downward swelling of the flexible sheet 3 is suppressed, and the laminate 5 and the flexible sheet 3 are It is preferable at the point which can prevent this contact.
[0011]
After the pressure is reduced, the first pressing operation is performed. Such a pressing operation is an operation in which the upper flexible sheet 3 is inflated downward by the pressure difference between the space portion 11 and the gap portion 10 and the uneven substrate 5a and the film-like resin layer 5b are firmly bonded. .
At the time of the first press-fitting, the pressure in the gap portion 10 may be returned to the normal pressure, or may be further pressurized by adding compressed air as necessary, and the space portion 11 may be in a reduced pressure state of 200 Pa or less.
Due to this pressure difference, the flexible sheet 3 swells downward, and 0.5 × 10^Five~ 1.5 × 10^FiveThe laminated body 5 is clamped by the pressure of Pa.
The pressing temperature T at the time of the first pressing₁° C represents the glass transition temperature of the resin composition of the film-like resin layer 5b by T_gAssuming ℃, (T_g−20) ° C. ≦ T₁℃ ≦ (T_g+10) ° C., preferably (T_g−10) ° C. ≦ T₁℃ ≦ (T_g+5) Perform at [deg.] C.
The above T_g° C. indicates the glass transition temperature of the resin composition of the film-like resin layer 5b, and is a value measured by DSC (differential scanning calorimetry).
T₁℃ is (T_gAt −20) ° C. or less, a large amount of microvoids are generated, and (T_gWhen the temperature exceeds +10) ° C., both of the two layers adhere to each other before the bubbles are removed between the film-like resin layer 5b and the substrate 5a, or the film-like resin layer 5b is wrinkled, resulting in poor surface smoothness. Inappropriate.
A method for controlling the temperature at the time of pressing is not particularly limited, but is adjusted by a sheet heater or a steam pipe built in the upper plate 1 and the lower plate 2.
[0012]
When the first pressing operation is completed, the decompressed state of the space 11 is released using the opening 9, the lower plate 2 is moved downward, and the stacked body 5 is discharged from the vacuum stacking apparatus.
[0013]
Next, the second pressing is performed.
In the second pressing, the laminated body 5 obtained above is placed on the flexible sheet 4 of the second vacuum laminating apparatus, and the pressure is reduced as in the first time. Carry out the second press. The second pressing temperature T₂° C is (T₁+10) ° C ≦ T₂℃ ≦ (T₁+70) ° C., preferably (T₁+20) ° C ≦ T₂℃ ≦ (T₁+60) ° C.
T₂℃ is (T₁If it is less than +10) ° C., it is inappropriate because there are many microvoids between the substrate 5a and the film-like resin layer 5b, or the resin cannot be sufficiently filled in the pattern shape of the substrate.₁If the temperature exceeds +70) ° C., the resin content of the film-like resin layer 5b is thermally decomposed and the surface smoothness is deteriorated, which is inappropriate.
[0014]
At the time of the second pressing, the pressure applied to the laminated body 5 is 0.1 × 10 than that at the first pressing.^Five~ 20x10^FiveMake Pa highTheThe pressure difference is 0.1 × 10^FiveIf it is less than Pa, the microvoids cannot be crushed and cannot be eliminated, and 20 × 10^FiveIf Pa is exceeded, the flexible sheet 4 may be broken.is there. Specifically, as the second pressing, the compressed air is introduced into the gap 10 and the pressure in the gap 10 is set to 0.6 × 10^Five~ 21.5 × 10^FiveBy adjusting to Pa, the pressure in the space 11 may be adjusted to a reduced pressure state of 200 Pa or less.
[0015]
After completion of the pressing operation, the decompressed state of the gap portion 10 and the space portion 11 is released using the openings 8 and 9, and the lower plate 2 is moved downward to complete the pressing operation. It is discharged from the second vacuum laminator to complete the lamination.
[0016]
The processing time at the time of the second pressing is not particularly limited, but the first time is 10 to 20 seconds, the second time is 30 to 120 seconds, and within 2 seconds within 700 seconds after the first pressing is completed. It is preferable to perform the second pressing, and further, after 30 to 120 seconds. If the time exceeds 700 seconds, air enters the resin of the film resin layer 5b once depressurized to form microvoids, which is not preferable.
[0017]
Above, for 2 vacuum laminating equipmentPressureAlthough the case where the tightening operation is performed twice is shown, the above operation may be performed three times or more, and after the third time, further planar smoothness is obtained, and the microvoids in the resin of the film-like resin layer are crushed. What is necessary is just to implement clamping by high temperature and high pressure rather than the second clamping operation.
[0018]
Thus, the pressed laminate 5 can be obtained. Furthermore, in order to obtain the laminate 5 industrially continuously, or when there is a possibility that the resin component may ooze out from the end of the film-like resin layer 5b. It is effective to arrange the transport film 13 between the upper and lower plates (FIG. 2).
[0019]
In such a case, the laminate 5 is first inserted between the transport films 13 by the conveyor 14 at the entrance of the first vacuum laminating apparatus. And the laminated body 5 is conveyed by the state clamped by the film 13 for conveyance to the pressing position of the 1st vacuum laminating apparatus with the conveyance speed of 1-25 m / min.
Thereafter, lamination is performed under the same conditions as described above.
[0020]
In the method of the present invention, an ultrasonic vibration device is provided on either the upper plate 1 or the lower plate 2 in order to increase the surface smoothness of the film-like resin layer depending on the surface pattern pattern of the substrate 5a and the density of the circuit. It is preferable that the upper plate 1 or the lower plate 2 is vibrated ultrasonically, and is particularly preferably built in the lower plate 2 when installing 19 and reducing the pressure and / or pressing.
In performing such ultrasonic vibration, it is preferable to use a transmission frequency of 20 kHz or higher (more preferably 25 to 100 kHz), and high frequency power is preferably 200 W or higher (further 300 to 600 W).
[0021]
The substrate 5a having projections and depressions used in the present invention is not particularly limited, but a printed substrate having a pattern of copper or the like is preferable, and a multi-layer substrate used in a pill-up method may be used. Although it does not specifically limit as thickness of this board | substrate, It is about 0.1-10 mm.
[0022]
Moreover, the film-form resin layer 5b is comprised from the resin composition and the support body film (separator film) or copper foil.
Such a resin composition has adhesiveness, insulation, adhesion, and hot melt properties. Specifically, a stabilizer, a curing agent, a pigment, a lubricant, and the like are blended with a thermosetting resin, a thermoplastic resin, and the like. Resin composition.
[0023]
Examples of the support film (separator film) include a polyethylene terephthalate film, a polypropylene film, a polyvinyl alcohol film, an ethylene-vinyl acetate copolymer saponified film, and the like.
Although it does not restrict | limit especially as copper foil, What can melt | dissolve by an etching is preferable.
[0024]
Commercially available products for the build-up method in which a protective film made of polyethylene or the like is attached to the resin composition surface of the film-like resin layer 5b include BF series, BL series, AS series, MCF series, Shipley Co., Ltd. manufactured by Hitachi Chemical. MULTIPOSIT-9500 series manufactured by Nippon Paint Co., Ltd. ABF series manufactured by Ajinomoto Co., SB-R series manufactured by Tokyo Ohka Co., Ltd., MR series manufactured by Mitsui Kinzoku Co., Ltd., R series manufactured by Matsushita Electric Works, APL series manufactured by Sumitomo Bakelite Co., Ltd., CAD series manufactured by Nikkan Co., Ltd., Asahi Kasei PCC series manufactured by Mitsubishi Gas Chemical Made in CBR series, CCL series, GMP series, and the like.
Examples of the film-like resin layer 5b for other uses include a solder resist mask film resin layer, a conform mask film resin layer, and a dry film photoresist film resin layer.
[0025]
Depending on the type of the film-like resin layer 5b, a heat treatment step is performed under conditions of 100 to 200 ° C. and 20 to 120 minutes after the lamination method of the present invention is performed in order to ensure insulation and stability. Sometimes.
[0026]
The surface of the film-like resin layer 5b that comes into contact with the substrate is preferably mat-treated in that air escape during lamination is good and there are few microvoids.
The mat treatment is not particularly limited, but the surface roughness Rz (measured according to JIS B 0610) is preferably 3 to 40 μm.
[0027]
The flexible sheets 3 and 4 are not particularly limited as long as they are heat resistant and expandable, and examples thereof include silicon rubber and fluorine rubber. In addition, the thing which put the filler, the fiber, foil, and the board inside the flexible sheets 3 and 4 can also be used.
[0028]
The surface roughness Rz of the surface in contact with the laminate 5 and the transport film 13 of the flexible sheet is 20 to 700 μm, and the durometer hardness HDD (measured according to JIS K7215) of the surface rubber is 15 to 90. It is preferable. When Rz is less than 20 μm or when the HDD exceeds 90, the surface smoothness of the substrate 5a after lamination is good, but there is a problem with remaining microvoids. When Rz exceeds 700 μm or the HDD is less than 15, The surface smoothness may deteriorate during multi-layer lamination.
[0029]
As a method for adjusting Rz or HDD, the surface may be treated with sandpaper or emery sandpaper, or a pattern satisfying these may be formed on the surface.
[0030]
Further, the lengths of the flexible sheets 3 and 4 are not particularly limited, but specifically, a flat film shape having a size of 200 to 1200 mm and a thickness of 0.2 to 20 mm is used. preferable. The flexible sheet 3 is preferably 5 to 50% longer in length and width than the flexible sheet 4.
[0031]
Although it does not specifically limit about the film 13 for conveyance, It is preferable that they are any of a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a nylon film, a polyimide film, a polystyrene film, and a fluorinated olefin film.
[0032]
The surface of the transport film 13 is not particularly limited. However, when the surface in contact with the laminated body 5 is subjected to a mat treatment, air escape at the time of lamination is good, and there are few microvoids. With respect to the mat treatment, if the haze value of the surface is about 5 to 40% (measured using an integrating sphere type light transmittance measuring device), air escape is good.
[0033]
The thickness of the transport film 13 is preferably 10 to 100 μm, and more preferably 20 to 50 μm.
The upper and lower intervals of the transport film 13 may be about the thickness of the laminate, and are usually 1 to 10 mm, and the width may be a size that can enter the vacuum chamber, and is usually 0.5 to 3 m.
[0034]
Loading and unloading of the laminated body 5 into and from the vacuum laminating apparatus is not particularly limited, but it is preferable to use a conveyor 14, and the conveyor 14 may be a rotating roll or an endless belt. Good thing not to do. The length of the conveyor 14 is 0.3 to 3 m, preferably 0.5 to 1.5 m.
Further, after the exit conveyor 14, a stocker for storing the substrate, a cooling device, a pressurizing device for improving the planar smoothness of the laminate, and the like may be arranged.
[0035]
In FIG. 1 of the present invention, the lower plate 2 moves up and down and the flexible sheet 3 expands. However, the upper plate 1 moves and the flexible sheet 4 expands also. Needless to say, this is the range.
The laminating method of the present invention is a very useful laminating method for the build-up method, and is used for pasting a dry film on a printed circuit board, for other uses other than the printed circuit board, for example, on an LCD substrate, a polarizing plate with an adhesive It is also very effective as a method of bonding a retardation plate with an adhesive or a method of bonding a dicing tape or the like to various electronic substrates.
[0036]
【Example】
Hereinafter, the present invention will be specifically described with reference to examples.
Example 1
The laminating apparatus shown in FIG. 1 was used.
The laminate 5 is manufactured by arranging a thermosetting resin composition (glass transition temperature 85 ° C.) made of an epoxy resin and a film-like resin layer 5b made of a polyethylene terephthalate film on both sides of the substrate 5a. It was temporarily fixed by an auto laminator so that the resin surface of 5b (Rz is 3.5 μm) was in contact with the uneven surface of the substrate 5a.
The flexible sheets 3 (800 mm in length and width respectively) and 4 (700 mm in length and width each) are 3 mm thick silicon rubber.
[0037]
(First press)
As shown in FIG. 1, in two vacuum laminating apparatuses, the upper and lower plates were heated to 80 ° C. in advance by a sheet heater built in each plate. After the laminated body 5 is placed on the flexible sheet 4 of the chamber 6 of the first vacuum laminating apparatus, the lower plate 2 is raised, air is sucked from the openings 8 and 9, and the gap 10 and The space 11 was in a reduced pressure state up to 60 Pa. Next, using two ultrasonic vibration devices (manufactured by Kaijo Electric Co., Ltd., “Auto Parser 400-28F”) 19 built in the lower plate 2, ultrasonic vibration is performed at 28 kHz and 400 W for 50 seconds, and then the opening portion is opened. 8 is opened to the atmosphere, the flexible sheet 3 is expanded downward, and the pressing temperature T is kept for 10 seconds.₁The pressure applied to the laminate 5 is 1.0 × 10^FiveClamping was performed at Pa. Thereafter, the opening 9 was released to return to atmospheric pressure, the upper plate 1 and the lower plate 2 were opened, and the pressed laminate 5 was discharged from the first vacuum laminator.
[0038]
(Second press)
Next, after placing the laminated body 5 on the flexible sheet 4 of the second vacuum laminating apparatus 70 seconds after the completion of the first pressing, the lower plate 2 is raised and the first pressing is performed. The pressure was reduced for 50 seconds in the same manner as at the time. Next, the opening 8 is opened to the atmosphere, and compressed air is further introduced from the opening 8 so that the pressure in the gap 10 is 10 × 10 10.^FiveAs Pa, the flexible sheet 3 is inflated downward and subjected to ultrasonic vibration in the same manner as in the first pressing for 30 seconds, and then the pressing temperature T₂The pressure applied to the laminated body 5 is 10 × 10^FiveClamping was performed at Pa.
Thereafter, the opening 9 was released to return to atmospheric pressure, the upper plate 1 and the lower plate 2 were opened, and the pressed laminate 5 was discharged from the vacuum laminator.
[0039]
The laminated body 5 after pressing was evaluated for followability, microvoids, and surface smoothness in the following manner.
(Followability)
The following property of the film-like resin layer 5b with respect to the substrate 5a having irregularities was visually confirmed with a 100 × microscope and evaluated as follows.
... The film-shaped resin layer 5b is completely filled in the recesses of the substrate 5a having irregularities.
×: The film-shaped resin layer 5b is not completely filled in the concave portions of the substrate 5a having irregularities, and elongated bubbles remain along the concave surface of the substrate 5a having irregularities.
[0040]
(Micro void)
The microvoids between the uneven substrate 5a and the film-like resin layer 5b were visually confirmed with a 100 × microscope and evaluated as follows.
... There are no microvoids between the concavo-convex portion of the substrate 5a having concavo-convexity and the film-like resin 5b.
X: There is a micro void between the uneven portion of the substrate 5a having unevenness and the film-like resin 5b.
[0041]
(Surface smoothness)
(1) The surface smoothness of the film-like resin layer 5b was measured with a surface roughness meter ("suftest-201" manufactured by Mitutoyo Corporation) and evaluated as follows.
... The uneven step on the surface of the film-like resin layer 5b is less than 0.5 μm.
Δ: The uneven step on the surface of the film-like resin layer 5b is 0.5 to 1 μm.
X ... The uneven | corrugated level | step difference of the surface of the film-form resin layer 5b exceeds 1 micrometer.
(2) The laminate was evaluated by the cross section method and the vertical cut surface was observed with an electron microscope as follows.
... The uneven step on the surface of the film-like resin layer 5b is less than 1 μm.
Δ: The uneven step on the surface of the film-like resin layer 5b is 0.5 to 1 μm.
X ... The uneven | corrugated level | step difference of the surface of the film-form resin layer 5b exceeds 1 micrometer.
[0042]
Example 2
A vacuum laminating apparatus shown in FIG. 2 on which a transport film 13 (thickness 25 μm, width 900 mm, haze value 6%) was arranged was used.
The laminated body 5 is transferred to the conveying film 13 by the conveyor 14 and conveyed to the pressing position, and then the first pressing is performed in the same manner as in Example 1, and then the vacuum chamber 6 of the second vacuum laminating apparatus is used. The second pressing was performed in the same manner as in Example 1, and the same evaluation was performed.
[0043]
Example 3
In Example 1, the same evaluation was performed in the same manner except that the ultrasonic vibration performed in the first and second decompression states and the pressing was not performed.
[0044]
Comparative Example 1
In Example 1, the same evaluation was performed except that only the first pressing was performed and the second pressing was omitted.
[0045]
Comparative Example 2
In Example 1, the first pressing temperature T₁The same evaluation was performed in the same manner except that the temperature was changed to 60 ° C.
[0046]
Comparative Example 3
In Example 1, the first pressing temperature T₁The same evaluation was performed in the same manner except that the temperature was changed to 100 ° C.
[0047]
Comparative Example 4
In Example 1, the second pressing temperature T₂The same evaluation was performed in the same manner except that the temperature was 85 ° C.
[0048]
Comparative Example 5
In Example 1, the second pressing temperature T₂The same evaluation was performed in the same manner except that the temperature was changed to 160 ° C.
The evaluation results of Examples 1 to 3 and Comparative Examples 1 to 5 are shown in Table 1.
[0049]

[0050]
【The invention's effect】
The laminating method of the present invention comprises a vacuum laminating apparatus having a vacuum chamber 6 in which an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4 are installed.2 or moreAnd a laminate 5 comprising a substrate 5a having irregularities between the upper and lower plates in the chamber and a film-like resin layer 5b obtained by laminating a resin composition on a support film or a metal foil.2 steps or moreWhen laminating by pressing1Second pressing temperature T₁° C, (T_g−20) ° C. ≦ T₁℃ ≦ (T_g+10) ° C. [T_g: Glass transition temperature of resin composition of film-like resin layer]And the pressure applied to the laminated body 5 at the time of the first pressing is 0.5 × 10 ^Five ~ 1.5 × 10 ^Five Under the condition of PaAfter performing the second and subsequent pressing temperatures T_n° C, (T₁+10) ° C ≦ T_n℃ ≦ (T₁+70) ° CAnd the pressure applied to the laminated body 5 at the time of the second and subsequent pressing is 0.1 × 10 5 than the first time. ^Five ~ 20x10 ^Five Under the condition of increasing PaSince it is carried out, it has excellent followability and suppression of microvoid generation, and exhibits excellent effects in surface smoothness, and is very useful for multilayering printed circuit boards.
[Brief description of the drawings]
FIG. 1 is a structural diagram of a main part of a laminating apparatus of the present invention.
FIG. 2 is a structural diagram of the main part of the laminating apparatus of the present invention (when a transport film 13 is used).
[Explanation of symbols]
1 ... Upper plate
2 ... Lower plate
3 ... Flexible sheet attached to the upper plate
4 ... Flexible sheet attached to the lower plate
5 ... Laminated body
5a... Substrate with irregularities
5b ... Film-like resin layer
6 ... Vacuum chamber
7 ... Seal
8 ... Opening through upper plate
9 ... Opening through the lower plate
10: A gap between the flexible sheet 3 and the upper plate 1
11: Space formed between the flexible sheets 3 and 4
12 ... Presser seal bracket
13 ... Film for conveyance
14 ... conveyor
15 ... Unwinding roll
16 ... take-up roll
17 ... Guide roll
18 ... Nip roll
19 ... Ultrasonic vibration device

Claims (3)

Using two or more vacuum laminating apparatuses having a vacuum chamber 6 in which an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4 are installed, between the upper and lower plates in the chamber In performing lamination by pressing the laminate 5 comprising the substrate 5a having irregularities and the film-like resin layer 5b obtained by laminating the resin composition on the support film or metal foil, in two or more stages . the clamping temperature T ₁ ° C. of the first _{time, (T g -20) ℃ ≦} T 1 ℃ ≦ (T g +10) ℃: under the condition of [T _g glass transition temperature of the resin composition of the film-like resin layer] and, after carrying out under the condition that pressure applied to the laminate 5 during the first pressing is ^{0.5 × 10 5 ~1.5 × 10 5} Pa, the second and subsequent to pressing temperature T _n ° C., ( _{T 1 +10) ℃ ≦ T n} ℃ ≦ (T 1 +70) at ° C. conditions, and the second and subsequent A laminating method characterized in that the laminating method is carried out under a condition that the pressure applied to the laminate 5 at the time of pressing is higher by 0.1 × 10 ^{5 to} 20 × 10 ⁵ Pa than the first time . Between the upper and lower plates, according to claim 1 Symbol mounting method of a multilayer pair of upper and lower conveying film 13, characterized by using the placed laminating device for transferring the vacuum chamber 6 the laminate 5 by sandwiching. The laminating method according to claim 1 or 2 , wherein a laminating apparatus in which an ultrasonic vibration device is attached to either the upper plate 1 or the lower plate 2 is used.

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