JP3646045B2 - Lamination method - Google Patents

Description

【００４０】
【発明の効果】
本発明の積層方法は、可撓性シート３を付設した上部プレート１及び可撓性シート４を付設した下部プレート２が設置された真空チャンバー７内の上下プレート間に、凹凸を有する基板５ａとフィルム状樹脂層５ｂとの積層体５を挟持してチャンバー内を移送する上下一対の搬送用フィルム６が配置された真空積層装置を使用して、該積層体５を圧締して積層を行うにあたり、搬送用フィルム６を圧締操作以外の工程では可撓性シート３及び可撓性シート４のいずれとも接触させないので、追従性、マイクロボイド発生抑制、表面平滑性に優れた効果を示すものであり、プリント回路基板の多層化の方法として非常に有用である。
【図面の簡単な説明】
【図１】 本発明の積層方法に用いられる積層装置に積層体を搬送した時の断面図である
【図２】 本発明の積層方法に用いられる積層装置において、減圧状態とした時の断面図である
【図３】 本発明の積層方法に用いられる積層装置において、圧締時の断面図である
【図４】 本発明の積層方法に用いられる積層装置において、圧締後、積層体を排出する時の断面図である
【符号の説明】
１・・・上部プレート
２・・・下部プレート
３・・・上部プレートに付設した可撓性シート
４・・・下部プレートに付設した可撓性シート
５・・・積層体
５ａ・・・凹凸を有する基板
５ｂ・・・フィルム状樹脂層
６・・・搬送用フィルム
７・・・真空チャンバー
８・・・ガイドロール
９・・・シール
１０・・・コンベア
１１・・・巻出しロール
１２・・・ニップロール
１３・・・巻取りロール
１４・・・上部プレートを通過する開口部
１５・・・下部プレートを通過する開口部
１６・・・可撓性シート３と上部プレート間の空隙部
１７・・・押さえシール金具
１８・・・跳ね上がり防止装置
１９・・・可撓性シート３、４の間に形成される空間部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for laminating a film-like resin layer on a substrate having irregularities in the production of a printed circuit board. More specifically, the film-like resin layer has good followability and the smoothness of the resin surface after lamination. The present invention relates to a lamination method that is excellent in the build-up method and useful for a build-up method.
[0002]
[Prior art]
In recent years, with the miniaturization and high performance of electronic devices, the density and the number of layers of printed circuit boards are increasing.
In multilayering such a printed circuit board, a thermosetting resin composition or a photosensitive resin composition is used as an insulating layer, and the thermosetting resin composition or the photosensitive resin composition is formed on an inner layer circuit formed in advance. Or a film-like resin composed of the thermosetting resin composition or the photosensitive resin composition is laminated. A copper foil or a support film (separator film) is usually laminated on one side of such a film-like resin. In the case of a copper foil, it is half-etched or entirely etched, and in the case of a support film, it is peeled off. Then, after drilling with a laser or ultraviolet rays, after copper plating, patterning with light using a photoresist film again to form a circuit, a so-called build-up method is effectively used.
[0003]
On the other hand, although there is no description that the film is used in a build-up method, JP-A-5-200880 discloses a method using a conveyor-type vacuum applicator as a conventional method for attaching a film to a substrate in a vacuum state. In the laminating method using such a vacuum applicator, the substrate is conveyed by a belt-like roller, and the substrate is placed on silicon rubber by adjusting the tension of the belt. Japanese Patent Application Laid-Open No. 8-332646 discloses a vacuum laminating apparatus and a vacuum laminating method in which a substrate is transported by a carrier film and a photoresist film is laminated thereon.
[0004]
[Problems to be solved by the invention]
However, when laminating a substrate having unevenness and a film-like resin layer used in a build-up method or the like, in the above Japanese Patent Laid-Open No. 5-200880, there is no film for transport, and therefore a case where a film-like resin layer is pasted on a substrate Microvoids may occur between the laminate substrate and the film-like resin layer. If the substrate or film-like resin is heated to a high temperature after lamination, surface smoothness may deteriorate or bleeding may occur. was there. Further, in JP-A-8-332646, since the substrate is simply transported by the carrier film and the laminated body is not sandwiched, microvoids may occur or the surface smoothness may deteriorate. There was a drawback.
[0005]
[Means for solving problems]
In view of such circumstances, the present inventors have intensively studied, and as a result, the inside of the vacuum chamber 7 in which the upper plate 1 provided with the flexible sheet 3 and the lower plate 2 provided with the flexible sheet 4 are installed. Using a vacuum laminating apparatus in which a pair of upper and lower transport films 6 for transporting the inside of the chamber by sandwiching the laminate 5 of the substrate 5a having unevenness and the film-like resin layer 5b between the upper and lower plates is disposed, When laminating the laminate 5 by pressing, the laminating method in which the conveying film 6 is not brought into contact with either the flexible sheet 3 or the flexible sheet 4 except at the time of pressing meets the above purpose. As a result, the present invention has been completed.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the laminating method of the present invention, when the laminate 5 is pressed using a specific vacuum laminating apparatus, the flexible film 3 and the flexible sheet 4 are used for the transport film 6 in steps other than the pressing operation. It is characterized by not contacting any of the above.
[0007]
First, a vacuum laminating apparatus used in the present invention will be described with reference to FIG. 1 and FIG. 1 and 2, the vacuum chamber 7 is provided with an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4. The flexible sheet 3 exists directly on the plate 2, and is attached to the upper plate 1 so that the gaps 16 can be formed by the pressing seal fittings 17 at the four sides. Further, the upper plate 1 is provided with an opening 14 (hereinafter sometimes simply referred to as the opening 14) that passes through the plate 1. The opening 14 adjusts the pressure of the gap 16 (hereinafter sometimes simply referred to as the gap 16) between the flexible sheet 3 and the upper plate 1, and gas or liquid is supplied to the gap 16 from the opening 14. When introduced, the flexible sheet 3 is inflated like a balloon. The lower plate 2 is provided with an opening 15 that passes through the inside of the plate 2 (hereinafter may be simply referred to as the opening 15). With the opening 15, when the upper plate 1 and the lower plate 2 are sealed, The pressure of the space portion 19 (hereinafter simply referred to as the space portion 19) formed between the flexible sheets 3 and 4 is adjusted. In addition, a seal 9 is disposed on the upper plate 1 and the lower plate 2 in order to efficiently evacuate the chamber.
Between the upper and lower plates, a pair of upper and lower transport films 6 (hereinafter simply referred to as a transport film 6) that sandwich the laminated body 5 of the substrate 5 a having unevenness and the film-like resin layer 5 b and transfer the inside of the chamber. Exist). The tension and transport speed of the transport film 6 are adjusted by the unwinding roll 11, the winding roll 13, and the nip roll 12, and the unwinding roll 11 is near the inlet of the vacuum chamber 7, and the winding roll 13 and the nip roll 12 are near the outlet. Is arranged. Guide rolls 8 are disposed at various points along the passing line of the transport film 6 for guiding the tension of the transport film 6 and holding it in the air.
[0008]
Hereinafter, the laminating method of the present invention will be described in detail.
Prior to the laminating method of the present invention, the substrate 5a having unevenness (hereinafter sometimes simply referred to as the substrate 5a) and the film-like resin layer 5b are preliminarily preliminarily preliminarily formed with an auto sheet cut laminator or the like to form the laminated body 5. .
The laminated structure of the laminated body 5 is arbitrary, such as board | substrate 5a / film-like resin layer 5b, film-like resin layer 5b / board | substrate 5a / film-like resin layer 5b.
[0009]
First, in the laminating method of the present invention, the laminate 5 is inserted between the transport films 6 at the entrance of the vacuum chamber 7. And the laminated body 5 is conveyed in the state pinched | interposed into the film 6 for conveyance to a pressing position (FIG. 1). Although the conveyance speed of the film 6 for conveyance is not specifically limited, 1-25 m / min is preferable.
In the present invention, the conveying film 6 is not in contact with the flexible sheet 3 and the flexible sheet 4 until pressing in the reduced pressure state described below. It is necessary to make them non-contact, and the distance between the transport film 6 and the flexible sheet 3 and the flexible sheet 4 at the time of non-contact is preferably 1 to 10 mm, and more preferably 3 to 6 mm. desirable.
When the transport film 6, the flexible sheet 3, and the flexible sheet 4 come into contact with each other before pressing, the substrate 5a and the film-like resin layer 5b are partially fused to increase the number of microvoids or the degree of vacuum. It is unsuitable because it takes a long time to increase the surface, and when it comes into contact after pressing, the surface smoothness is deteriorated, or the resin composition of the film-like resin layer 5b oozes out from the laminated body 5 after pressing. Is unsuitable because it becomes large.
[0010]
When the laminated body 5 comes to the pressing position, the lower plate 2 is lifted and sealed with the upper plate 1. After the sealing engagement, the space 19 is brought into a reduced pressure state (FIG. 2).
Specifically, suction is performed from the opening 15 of the lower plate 2 by a vacuum pump, and the pressure of the space 19 in the vacuum chamber 7 is reduced to 200 Pa or less, preferably 100 Pa or less. When it exceeds 200 Pa, microvoids remain between the substrate 5a having unevenness and the film-like resin layer 5b, and the smoothness of the surface of the film-like resin layer 5b after lamination tends to deteriorate.
Even in such a reduced pressure state, the transport film 6 needs to be carried out without being in contact with either the flexible sheet 3 or the flexible sheet 4.
[0011]
Such a method is not particularly limited, but specifically, it is between the unwinding roll 11, the winding roll 13, and the nip roll 12 so that the transport film 6 does not come into contact with the flexible sheets 3 and 4 except during pressing. It is preferable to press with the flexible sheets 3 and 4 while controlling the rotation speed at 3 to 15 kg / cm ² and further to 5 to 10 kg / cm ² .
When the space portion 19 is in a reduced pressure state, it is preferable that the gap portion 16 is also in a reduced pressure state in that the flexible sheet 3 is slightly swollen downward and can be prevented from coming into contact with the transport film 6.
[0012]
In the method of the present invention, it is preferable that the base material of the flexible sheets 3 and 4 is also specified. In particular, the surface roughness of the surface of the flexible sheet in contact with the transport film 6 (measured according to JIS B 0610) ) Is 20 to 700 μm, and the durometer hardness (measured according to JIS K 7215) of the surface rubber is preferably 15 to 90. When the surface roughness (Rz) is less than 20 μm or the durometer hardness (HDD) exceeds 90, the surface smoothness of the substrate 5a after lamination is good, but there is a problem with remaining microvoids, and Rz is 700 μm. If it exceeds or the HDD is less than 15, the surface smoothness is poor, so that a problem remains during build-up multilayer lamination.
[0013]
As a method for adjusting Rz or HDD, the surface may be treated with sandpaper or emery sandpaper, or a pattern having such roughness may be formed on the surface.
[0014]
Such flexible sheets 3 and 4 are preferably heat-resistant and expandable, and examples thereof include silicon rubber and fluorine rubber. A film thickness of 1 to 10 mm is usually used. In addition, the thing which put the filler, the fiber, foil, and the board inside the flexible sheets 3 and 4 can also be used.
[0015]
In addition, the flexible sheet is preferably in the form of a flat plate having a vertical and horizontal length of usually 200 mm to 1200 mm and a thickness of 0.2 to 20 mm. The flexible sheet 3 is preferably longer than the flexible sheet 4 in length and width by about 5 to 50%.
[0016]
After the pressure is reduced, a pressing operation is performed (FIG. 3).
In the pressing operation, the upper flexible sheet 3 is expanded downward by the pressure difference between the space 19 and the gap 16 to bond the uneven substrate 5a and the film-like resin layer 5b together.
Specifically, the pressure difference can be adjusted by returning the pressure in the gap 16 to almost normal pressure and weakening the reduced pressure state in the space 19 to 300 to 600 Pa. If air is used for these pressure adjustments. Good.
Due to this pressure difference, the flexible sheet 3 swells downward and comes into contact with the transport film 6, and the flexible sheet 4 also comes into contact with the transport film 6.
Subsequently, the pressure in the gap 16 is increased.
Specifically, this setting can be made by increasing the pressure of the gap 16 to 1.0 × 10 ^{5 to} 20 × 10 ⁵ Pa and adjusting the pressure of the space 19 to a reduced pressure state of 200 Pa or less again. The flexible sheet 3 swells further downward, strongly pressing the transport film 6 and strongly pressing the substrate 5a and the film-like resin layer 5b.
[0017]
The temperature of the space 19 at the time of pressing is preferably 40 ° C to 185 ° C, and more preferably 70 to 135 ° C.
If the temperature is lower than 40 ° C., the uneven surface of the substrate 5a cannot be filled with the resin composition of the film-like resin layer 5b, resulting in poor followability or remaining microvoids. If the temperature exceeds 185 ° C., the film-like resin layer 5b Is undesirable because it causes thermal decomposition and microvoids are generated by the decomposition gas. Although it does not specifically limit as a control method of such temperature, It adjusts with the surface heater built in the upper plate 1 and the lower plate 2, and a steam pipe.
[0018]
After completion of the pressing operation, the reduced pressure state is released using the openings 14 and 15, and the lower plate 2 is moved downward.
[0019]
And the laminated body 5 is conveyed by the conveyance film 6 to the flexible sheet 3 and the flexible sheet 4 in non-contact (FIG. 4), and is discharged | emitted from the vacuum chamber 7. FIG.
[0020]
The material for the transport film 6 is not particularly limited, but is preferably any one of a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a nylon film, a polyimide film, a polystyrene film, and a fluorinated olefin film. The film thickness is preferably 10 to 100 μm, more preferably 20 to 50 μm, and the width is preferably 0.5 to 3 m.
[0021]
The surface of the transport film 6 is not particularly limited, but the surface in contact with the laminate 5 is matted, for example, the surface haze value is about 5 to 40 (measured using an integrating sphere light transmittance measuring device). It is desirable that air escape during lamination is good and that there are few microvoids.
[0022]
The substrate 5a having projections and depressions used in the present invention is not particularly limited, but is preferably a printed circuit board with a pattern of copper or the like, and may be a multi-layer substrate used in a pill-up method. A suitable thickness of the substrate is about 0.1 to 10 mm.
[0023]
Moreover, it is preferable that the film-form resin layer 5b is comprised from a resin composition, a support body film (separator film), or copper foil.
Such a resin composition may be any resin composition having insulating properties, tackiness, adhesiveness, and hot melt properties, or a resin composition that softens at a glass transition temperature or higher. Examples of such a resin composition include a thermosetting resin composition mainly composed of an epoxy resin, or a photosensitive resin composition composed of a resin, an ethylenically unsaturated compound, and a photopolymerization initiator.
[0024]
Examples of such a support film (separator film) include a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polyvinyl alcohol film, and an ethylene vinyl acetate copolymer saponified film.
Although it does not restrict | limit especially as copper foil, What can melt | dissolve by an etching is preferable.
[0025]
Commercially available products for the build-up method of the film-like resin layer 5b (some of which have a protective film attached) include Hitachi Chemical's BF Series, BL Series, AS Series, MCF Series, Shipley's MULTIPOSIT- 9500 series, Nippon Paint Propicoat series, Ciba Specialty Probelec series, DuPont Valux series, Taiyo Ink PVI series, HBI series, Asahi Denka BUR series, Ajinomoto Co. ABF series, Tokyo Ohka SB-R series, Mitsui Kinzoku MR series, Matsushita Electric R series, Sumitomo Bakelite APL series, Nikkan CAD series, Asahi Kasei PCC series CBR series manufactured by Mitsubishi Gas Chemical Company , CCL series, GMP series, and the like.
Examples of the resin layer for other applications include a solder resist mask film resin layer, a conform mask film resin layer, and a photoresist film resin layer.
[0026]
The surface of the film-like resin layer 5b to be laminated on the substrate 5a is not particularly limited, but the mat treatment is favorable in that air escape during lamination is good and there are few microvoids.
Although it does not specifically limit regarding this mat process, About 3-40 micrometers is preferable at Rz.
[0027]
Loading and unloading of the laminated body 5 into the vacuum chamber 7 is not particularly limited, but it is preferable to use a conveyor 10, which may be a group of rotating rolls or an endless belt, and is a material that is not easily contaminated. Good thing not to do.
The conveyor 10 may have a length of 0.3 to 3 m, preferably 0.5 to 1.5 m, and the conveyance speed is usually 1 to 25 m / min.
Further, after the outlet conveyor 10, a stocker for storing the pressed laminate 5 and a pressurizing device for further improving the planar smoothness of the film layer surface of the laminate 5 are arranged. Also good.
[0028]
In addition, when pressing at a temperature of 15 ° C. or higher than the glass transition temperature of the resin composition of the film-like resin layer 5b, the seepage that occurs when the substrate 5a and the film-like resin layer 5b are laminated may occur. is there.
When the contamination occurs, it adheres to the surface of the next substrate to be laminated, or the followability is lowered due to the adhesion, and a good circuit board cannot be obtained. The exuding resin component is preferably adhered to the transport film 6 to be continuously transported, and the transport film 6 is removed.
If necessary, the transport film 6 can be reused by removing the contaminated part after use, or provided with a step of removing the contaminated part and continuously supplied in a rotary manner for reuse. it can.
In particular, when there is a large amount of oozing, the transport film 6 and the end of the laminate 5 are fixed, so that the transport film 6 and the laminate 5 are transferred in the process of passing the laminate 5 to the conveyor 10 at the outlet of the vacuum chamber 7. At the time of peeling, the laminate 5 jumps up and falls on the conveyor 10, and the surface smoothness of the film-like resin layer may be impaired. In order to prevent such splashing, a splash prevention device 18 may be installed, or the transport film 6 may be extended to the top of the conveyor 10.
[0029]
As described above, as the vacuum laminating apparatus, the mode in which the lower plate 2 moves up and down and the flexible sheet 3 expands has been mainly described. However, the upper plate 1 moves up and down and the flexible sheet 4 expands. Needless to say, this is within the scope of the present invention.
Thus, a good laminate 5 can be obtained by the method of the present invention. However, depending on the type of the film-like resin layer 5b, the laminate 5 after pressing may have a thickness of 100 to 200 in order to ensure insulation and stability. A heat treatment process may be performed under the conditions of 20 ° C. and 20 to 120 minutes, and in the heat treatment, if there are microvoids in the laminated body 5, the surface of the laminated body 5 may be smoothed by rupture or depression. Although the laminate 5 obtained by the method of the present invention has no microvoids, it is possible to maintain a good surface state even when such heat treatment is performed.
[0030]
The laminating method of the present invention is a very useful laminating method for the build-up method, but it is used for pasting a photoresist film on a printed circuit board or other applications other than the printed circuit board, for example, an adhesive on an LCD substrate. It is also very effective as a method of bonding a polarizing plate or a retardation plate with an adhesive, or a method of bonding a dicing tape or the like to various electronic substrates.
[0031]
【Example】
Hereinafter, the present invention will be specifically described with reference to examples.
The vacuum lamination apparatus shown in FIG. 1 was used.
The laminate 5 is manufactured by arranging a thermosetting resin composition made of an epoxy resin (glass transition temperature 80 ° C.) and a film-like resin layer 5b made of a polyethylene terephthalate film on both surfaces of the substrate 5a. The resin surface of 5b (Rz is 3.5 μm) was temporarily bonded and laminated by an auto-cut laminator so that the uneven surface of the substrate 5a was in contact.
As the transport film 6, a polyethylene terephthalate film (thickness 25 μm, haze 6) was used.
The flexible sheets 3 (800 mm in length and width respectively) and 4 (700 mm in length and width each) are 3 mm thick silicon rubber.
The laminated body 5 is transferred to the transport film 6 by the conveyor 10, the tension is adjusted to 5 kg / cm ² , and the transport film 6 is not brought into contact with the flexible sheet 3 and the flexible sheet 4. Then, it was carried to the pressing position. The upper plate 1 and the lower plate 2 were preliminarily heated to 120 ° C., and the temperature of the space 19 was set to 120 ° C.
[0032]
Next, as shown in FIG. 2, the lower plate 2 is raised at the pressing position, and the conveying film 6 is kept at a distance of 3 mm from the flexible sheet 3 and the flexible sheet 4, and the decompression operation is performed. Has entered.
Air is sucked from the openings 14 and 15 to reduce the space 16 and the space 19 to 60 Pa, and after 50 seconds, the opening 14 is opened to the atmosphere, the space is set to atmospheric pressure, and the space 19 is 400 Pa. As shown in FIG. 3, the flexible sheet 3 and the flexible sheet 4 were brought into contact with the transport film 6, and the transport film 6 lightly pressed the laminate 5. Ten seconds later, the space 19 is again brought into a reduced pressure state of 60 Pa, and compressed air is further introduced through the opening 14 so that the gap portion 16 is 6 × 10 ⁵ Pa, and the flexible sheet 3 is greatly expanded to be laminated. The conveying film 6 sandwiching the body 5 was strongly pressed at 120 ° C. for 300 seconds.
[0033]
Next, the openings 14 and 15 are returned to the atmospheric pressure, the upper plate 1 and the lower plate 2 are opened, and the laminate is sandwiched from the pressing position by the tension-controlled transport film 6 as shown in FIG. 5 was discharged from the vacuum chamber 7 without contact with the flexible sheet 3 and the flexible sheet 4.
The laminated body 5 after pressing was evaluated for followability, microvoids, and surface smoothness in the following manner.
[0034]
(Followability)
The following property of the film-like resin layer 5b with respect to the substrate 5a having unevenness was visually confirmed with a 50 × microscope and evaluated as follows.
... The film-like resin layer 5b is completely filled in the recesses of the substrate 5a having irregularities.
X: The film-like resin layer 5b is not completely filled in the concave portion of the substrate 5a having irregularities, and elongated bubbles remain along the concave surface of the substrate 5a.
[0035]
(Micro void)
The microvoids between the uneven substrate 5a and the film-like resin layer 5b were visually confirmed with a 50 × microscope and evaluated as follows.
... There are no micro voids between the concavo-convex portion of the substrate 5 a having concavo-convex and the film-like resin 2.
X: There are microvoids between the uneven portion of the substrate 5a having unevenness and the film-like resin 2.
[0036]
(Surface smoothness)
(1) The surface smoothness of the film-like resin layer 5b was measured with a surface roughness meter (“suftest-201” manufactured by Mitutoyo Corporation) and evaluated as follows.
O ... The uneven step on the surface of the film-like resin layer 5b is 1 µm or less.
X ... The uneven | corrugated level | step difference of the surface of the film-form resin layer 5b exceeds 1 micrometer.
(2) The laminate was evaluated by the cross section method and the vertical cut surface was observed with a microscope as follows.
O ... The uneven step on the surface of the film-like resin layer 5b is 1 µm or less.
X ... The uneven | corrugated level | step difference of the surface of the film-form resin layer 5b exceeds 1 micrometer.
[0037]
Comparative Example 1
After carrying in to the pressing position, the tension control of the conveying film 6 was cut, and the conveying film 6 was brought into contact with the flexible sheet 4 before the pressing operation, and was laminated in the same manner as in Example 1.
[0038]
Comparative Example 2
After the pressing, the tension control of the transport film 6 was turned off, and the operation was continued while the transport film 6 was in contact with the flexible sheet 4.
The evaluation results of Example 1 and Comparative Examples 1 and 2 are shown in Table 1.
[0039]

[0040]
【The invention's effect】
The laminating method of the present invention comprises a substrate 5a having irregularities between upper and lower plates in a vacuum chamber 7 in which an upper plate 1 provided with a flexible sheet 3 and a lower plate 2 provided with a flexible sheet 4 are installed. Using a vacuum laminating apparatus in which a pair of upper and lower transport films 6 that sandwich the laminate 5 with the film-like resin layer 5b and transfer the inside of the chamber is disposed, the laminate 5 is pressed and laminated. In this case, since the transport film 6 is not brought into contact with either the flexible sheet 3 or the flexible sheet 4 in a process other than the pressing operation, it exhibits excellent followability, microvoid generation suppression, and surface smoothness. It is very useful as a method for multilayering printed circuit boards.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view when a laminate is transported to a laminating apparatus used in the laminating method of the present invention. FIG. FIG. 3 is a cross-sectional view of the laminating apparatus used in the laminating method of the present invention at the time of pressing. FIG. 4 is a schematic view of the laminating apparatus used in the laminating method of the present invention. Is a cross-sectional view when
DESCRIPTION OF SYMBOLS 1 ... Upper plate 2 ... Lower plate 3 ... Flexible sheet 4 attached to upper plate ... Flexible sheet 5 attached to lower plate ... Laminated body 5a ... Concavity and convexity Substrate 5b ... Film-like resin layer 6 ... Transport film 7 ... Vacuum chamber 8 ... Guide roll 9 ... Seal 10 ... Conveyor 11 ... Unwinding roll 12 ... Nip roll 13 ... take-up roll 14 ... opening 15 passing through upper plate ... opening 16 passing through lower plate ... gap 17 between flexible sheet 3 and upper plate ... Pressing seal metal fitting 18 ... Bounce prevention device 19 ... Space formed between flexible sheets 3 and 4

Claims (6)

Between the upper and lower plates in the vacuum chamber 7 in which the upper plate 1 provided with the flexible sheet 3 and the lower plate 2 provided with the flexible sheet 4 are installed, the substrate 5a having unevenness and the film-like resin layer 5b are provided. In carrying out lamination by pressing the laminate 5 using a vacuum laminating apparatus in which a pair of upper and lower transfer films 6 that sandwich the laminate 5 and move in the chamber are arranged, the transfer film 6 is A laminating method characterized by not contacting any of the flexible sheet 3 and the flexible sheet 4 except during pressing. The laminated body 5 is sandwiched between the transport film 6 at the entrance of the vacuum chamber 7 and transported to the pressing position, and the upper plate 1 and the lower plate 2 are hermetically sealed to reduce the pressure between the upper and lower plates. After the pressing operation is completed, the reduced pressure state is released, the upper plate 1 and the lower plate 2 are opened, and the pressed laminate 5 sandwiched between the transport films 6 is discharged from the vacuum chamber 7. The laminating method according to claim 1, wherein: Tension is controlled between the winding roll 11 on the inlet side and the winding roll 13 on the outlet side so that the transport film 6 does not come into contact with the flexible sheets 3 and 4 except during pressing. The lamination method according to claim 1 or 2. The laminating method according to any one of claims 1 to 3, wherein the transport film 6 is any one of a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a nylon film, a polyimide film, a polystyrene film, and a fluorinated olefin film. The lamination method according to any one of claims 1 to 4, wherein a surface of the transport film 6 in contact with the laminate 5 is subjected to a mat treatment. The lamination method according to any one of claims 1 to 5, wherein a surface of the film-like resin layer 5b to be laminated on the substrate 5a having irregularities is subjected to a mat treatment.

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