JP4328472B2 - Substrate reversing apparatus and panel manufacturing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase yield of a process of part mounting on both faces of a substrate, by stabilizing reversing operation of the substrate with one side face previously connected with a part. SOLUTION: The substrate 1 mounting the part 2 is clamped by a pair of holding plates 71, 72. A pair of holding plates 31, 32 press and hold the pair of holding plates 71, 72. The pair of the holding mechanism 31, 32 clamping the substrate 1 through the pair of holding plates 71, 72 rotationally drive a motor 10a, and transfer the substrate 1 reversed by 180 deg.. Thus, the substrate mounting the part 2 is pressed and held from both surfaces by the pair of the holding plates 71, 72 to be reversed, whereby the fluttering or the like and breakage of the substrate 1 and the part 2 are largely reduced, thereby enable mounting of the part with high quality.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate inversion apparatus suitable for assembling and manufacturing, for example, a liquid crystal panel and a plasma display panel, and an improvement of a panel manufacturing apparatus using the same.
[0002]
[Prior art]
A flat display such as a liquid crystal display panel and a plasma display panel is manufactured by connecting and mounting a film-like electronic component such as TCP (Tape Carrier Package) on an electrode portion of a glass substrate. A panel manufacturing apparatus is known as an apparatus for manufacturing such a flat display.
[0003]
Among flat panel displays, a simple matrix liquid crystal display panel is configured such that a liquid crystal layer is sandwiched between two rectangular glass substrates, and electrode portions for connecting electronic components are opposed to each other. It is formed in the direction which mutually orthogonally crosses on the opposing surface of a board | substrate. As described above, since the electrode portions of the two substrates are provided to face each other, in order to connect the electronic components to the individual substrates, it is necessary to invert the substrates once by 180 degrees. Therefore, the substrate manufacturing apparatus is provided with a substrate reversing device.
[0004]
FIG. 13 is a perspective view showing a schematic configuration of a conventional substrate reversing apparatus for reversing a two-layered substrate, and FIG. 14 is a side view of an essential part of the two-layered substrates reversed by the substrate reversing apparatus. An electronic component is connected in advance to the electrode portion of one of the substrates via a connecting member such as an anisotropic conductor.
[0005]
That is, as shown in FIG. 13, an electronic component 2 as a connecting component is connected in advance to the electrode portion of one (downward in the drawing) of the substrates 1 (1A, 1B) bonded together. As shown in FIG. 14, the substrate 1 is sandwiched from both the upper and lower outer surfaces by the U-shaped gripping portion 3 of the substrate reversing device and is pressed and held.
[0006]
The gripping part 3 is connected to the reversing mechanism 4, and the gripping part 3 is configured to be able to reciprocate and rotate 180 degrees in the direction of arrow R by driving a motor built in the reversing mechanism 4. It is reversed and delivered to the next component mounting apparatus.
[0007]
In FIG. 13, the reversing mechanism 4 is connected to a moving mechanism 5 such as a cylinder, so that the reversing operation of the rectangular substrate 1 in the substrate reversing apparatus can be smoothly performed without contacting the surrounding mechanism portion or the like. Required. Therefore, the moving mechanism 5 is configured to move up and down in the direction of the arrow Z while guiding the reversing mechanism 4 to the pair of guide rails 61 and 62 and to reverse the substrate 1 while securing the rotation space of the substrate 1. ing.
[0008]
13 and 14, details of the grip portion 3 are not shown, but the grip portion 3 has a cylinder mechanism and a spring mechanism, and the substrate 1 can be attached from both outer surface sides as necessary. It is configured to perform pressing and holding or release so that the substrate 1 can be received from the previous process and transferred to the next process after the reversal.
[0009]
In the next process of receiving the inverted substrate 1 in which the substrate 1 is inverted by the substrate inverting device having the above configuration and the electrode portion of the lower substrate 1 (1B) is exposed upward as shown in FIG. Similarly, the electronic component 2 is mounted on the electrode portion via an anisotropic conductor.
[0010]
[Problems to be solved by the invention]
As described above, the conventional substrate reversing apparatus is configured to perform the reversing operation while holding the substrate 1 on which the electronic component 2 is previously mounted on one substrate (1A) by the grip portion 3.
[0011]
By the way, recent flat panel displays such as liquid crystal display panels and plasma display panels tend to be increased in size, and the substrate itself is occupying a considerable weight as the size increases. In addition, the increase in the size of the substrate leads to an increase in capacity and functionality of the electronic component 2 connected and mounted on the electrode portion of the substrate 1, and the connected component is not limited to a semiconductor chip such as an LSI. Additional connections such as wiring boards have also been made.
[0012]
As a result, in the reversing operation in the substrate reversing device, components connected to the electrode part far from the rotation center axis have a large inertial stress (or moment) at the time of reversal, which gives a large bending stress to the substrate. It became one of the factors that bent and damaged glass substrates.
[0013]
In particular, when the electronic component 2 is an FPC (Flexible Printed Circuit), COF (Chip On Film) or the like, the film portion which is the main portion is easily bent from the beginning, and the connecting component is fluctuated by the rotation and reversal operation. There is a risk that the parts themselves may be damaged due to a collision, the substrate of the other party of the collision may be broken, and the connection part may be peeled off due to centrifugal force. It was.
[0014]
Therefore, the present invention aims to provide a highly reliable substrate reversing device and a panel manufacturing apparatus using the same, avoiding damage to a substrate and mounted components and avoiding damage to a component connecting portion or the like. And
[0015]
[Means for Solving the Problems]
1st invention is a board | substrate inversion apparatus which inverts the board | substrate mounted in the state in which components protruded from the outer peripheral part, Comprising: The said one surface mutually opposes a pair of holding | maintenance board with which the several buffer member protruded And a reversing mechanism for rotating and reversing the gripping portion. The gripping portion includes the substrate disposed between the pair of holding plates, and the substrate and the component, respectively. A plurality of cushioning members of the pair of holding plates are respectively pressed on both sides of the holding plate, and the reversing mechanism rotates the gripping portion holding the substrate to reverse the substrate together with the pair of holding plates. It is characterized by that.
[0016]
Thus, according to the first aspect, the reversing mechanism reverses by sandwiching the board on which the component is mounted between the pair of holding plates. Accordingly, the component and the substrate are protected by the holding plate, and the fluttering and the like are greatly suppressed, and a substrate reversing device that avoids damage to the substrate and the component can be provided.
[0017]
The second invention is the component substrate reversing device for reversing the substrate that is mounted so as to protrude from the outer peripheral portion, and a suction member for sucking the substrate, a support member for supporting the parts from both sides of its, characterized by comprising a, a rotating mechanism for rotating the straight line parallel with said support member and the suction member on the surface of the substrate as a common rotation axis.
[0018]
Thus, according to the second invention, the rotation mechanism reverses the holding member that holds the substrate and the support member that supports the component. Accordingly, the component and the substrate are protected by the holding member and the support member, and the fluttering and the like are greatly suppressed, so that a substrate reversing device that avoids damage to the substrate and the component can be provided.
[0019]
According to a third invention, in the panel manufacturing apparatus, the substrate reversing device according to the first or second invention is used.
[0020]
Thus, according to the third aspect of the present invention, since the first or second substrate reversing device is employed in the panel manufacturing apparatus, it is possible to avoid damage to the substrate or components during substrate reversal, and the yield. Therefore, it is possible to assemble and manufacture highly reliable liquid crystal panels.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of a substrate reversing apparatus and a panel manufacturing apparatus using the same according to the present invention will be described below in detail with reference to FIGS. The same components as those of the conventional substrate inversion apparatus shown in FIGS. 13 to 15 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0022]
FIG. 1 is a layout diagram of a panel manufacturing apparatus using a substrate reversing apparatus according to the present invention.
[0023]
In FIG. 1, this panel manufacturing apparatus 20 is used for manufacturing a flat panel display such as a liquid crystal panel or a plasma display panel. A substrate supply apparatus 21 for providing a substrate 1 described in FIG. Device 22a, first connecting member pasting device 23a, first electronic component mounting device 24a, substrate reversing device 25, second substrate cleaning device 22b, second connecting member pasting device 23b, second electronic component mounting device 24b, substrate housing device 26.
[0024]
The substrate supply device 21 takes out the substrates 1 stored in a magazine or the like and supplies them one by one. The substrate 1 supplied by the substrate supply device 21 is transferred to the first substrate cleaning device 22a by a transfer device (not shown).
[0025]
The first substrate cleaning device 22a faces the electrode part of the two substrates 1 (1A, 1B) bonded together, as described with reference to FIG. The edge of the substrate 1A exposed to the surface where the electrode portion is formed is cleaned using a solvent to remove the contamination of the electrode portion. The substrate 1 that has been cleaned is transported to the first connecting member pasting device 23a by a transport device (not shown).
[0026]
The 1st connection member sticking apparatus 23a sticks connection members, such as an anisotropic conductor, with respect to the edge cleaned by the 1st board | substrate cleaning apparatus 22a. The board 1 to which the connecting member is attached is transferred to the first electronic component mounting apparatus 24a by a transfer apparatus (not shown).
[0027]
The first electronic component mounting device 24a connects the electrode portion of the substrate 1A and the electrode portion of the electronic component 2 through the connecting member attached by the first connecting member attaching device 23a. The substrate 1 on which the electronic component 2 is mounted by the first electronic component mounting device 24a is transported to the substrate reversing device 25 by a transport device (not shown).
[0028]
As will be described in detail later, the substrate reversing device 25 reverses the front and back of the substrate 1 having the electronic component 2 connected to the electrode portion of the substrate 1A, and exposes the electrode portion of the substrate 1B that has been facing downward until now. Is. The inverted substrate 1 is transferred to the second substrate cleaning device 22b by a transfer device (not shown).
[0029]
Thereafter, the second substrate cleaning device 22b, the second connecting member pasting device 23b, and the second electronic component mounting device 24b perform the same operation as described above on the electrode portion of the substrate 1B exposed upward. The substrates 1 having the electronic components 2 connected to the electrode portions of the substrate 1B are transported to the substrate storage device 26 by a transport device (not shown) and stored one by one in a magazine or the like.
[0030]
FIG. 2 is a front view showing a first embodiment of the substrate reversing device 25 according to the present invention, and FIG. 3 is an enlarged front view of an essential part of FIG.
[0031]
In the substrate reversing device shown in FIGS. 2 and 3, first, an electronic component 2 on which a semiconductor chip such as an LSI is already mounted is connected to one electrode portion (substrate 1A) of the bonded substrate 1 (substrate 1A). A state is shown in which the substrate reversing device is mounted on the substrate reversing device and can be reversed 180 degrees. Here, the electronic component 2 is composed mainly of a film-like member such as polyimide resin.
[0032]
That is, a plurality of shock-absorbing members 7a project from the opposing surfaces of a pair of upper and lower flat plate-like holding plates 71 and 72 constituting a part of the substrate reversing device, and the holding plate provided with the buffer members 7a. The substrate 1 is transported and mounted on the substrate reversing apparatus main body with the substrate 1 being sandwiched between 71 and 72.
[0033]
The buffer member 7a itself is composed of an elastic body such as a rubber member or a spring member. The individual height of each buffer member 7a is such that the substrate 1 and the holding plates 71 and 72 are parallel to each other, and the holding plates 71 and 72 are parallel to each other. Are pressed so as to be applied to the substrate 1 and the component 2 almost uniformly.
[0034]
In this manner, the transfer from the transfer device 8 shown in FIG. 2 to the substrate reversing device main body side is performed while the substrate 1 is sandwiched between the holding plates 71 and 72 via the buffer member 7a.
[0035]
Therefore, first, the substrate reversing device main body has a pair of left and right gripping mechanisms 31 and 32 that form a U-shaped arm when viewed from the front, and sandwich the substrate 1 through the suction member 3a at both left and right ends in the figure. The upper and lower pair of holding plates 71 and 72 are configured to be pressed and held.
[0036]
That is, each gripping mechanism 31 and 32 has a pair of gripping pieces 3b and 3c that are vertically paired, and the gripping pieces 3b and 3c are guided by the linear guides 3e and 3e, respectively, by the operation of the cylinder 3d. The holding plates 71 and 72 are held and fixed by being sandwiched between the gripping pieces 3b and 3c.
[0037]
Exhaust holes 3g and 3g are formed in the gripping pieces 3b and 3c of the gripping mechanisms 31 and 32 as shown in FIG. 3, and the exhaust holes 3g and 3g are connected to an intake pump (not shown). The adsorbing members 3a and 3a connected to the exhaust holes 3g and 3g adsorb and hold the holding plates 71 and 72 corresponding to the intake operation of the intake pump.
[0038]
Further, as shown in FIG. 2, the cylinders 3d and 3d of the gripping mechanisms 31 and 32 are fixed to the gripping bodies 3f and 3f, respectively, and the gripping bodies 3f and 3f are provided in pairs corresponding to each other. The ball screw mechanisms 91 and 92 are incorporated.
[0039]
The ball screw mechanisms 91 and 92 are configured so that the gripping mechanisms 31 and 32 can be moved in the direction of the arrow X in the figure by the rotational drive of the servo motors 9a and 9a.
[0040]
That is, the servo motors 9a and 9a of the ball screw mechanisms 91 and 92 are incorporated and fixed in L-shaped frames 10b and 10b that rotate integrally by driving the motor 10a of the reversing mechanism 10, and each set of gripping mechanisms 31 is fixed. , 32 is configured to be capable of moving forward and moving backward on the rotating shaft of the reversing mechanism 10 and moving backward.
[0041]
As shown in FIG. 2, the pair of L-shaped frames 10b and 10b are commonly connected by a connecting beam 10c having a substantially U-shape in plan view. While rotating 10b, 10b by the bearing 10d at the other end, the reversing operation of 180 degrees can be repeated by the rotation in the arrow R direction by the motor 10a.
[0042]
In the configuration shown in FIG. 2, the substrate reversing device shows a state in which the holding plates 71 and 72 sandwiched with the substrate 1 in the center are received and held from the transfer device 8. The inverted substrate 1 is transferred to the transport device 8 together with the holding plates 71 and 72. The transport device 8 includes a transport table 8a on which the substrate 1 is mounted, and an XY-θ stage 8b that supports the transport table 8a so as to be movable in the X, Y, and θ directions. The transport table 8a An adsorbing member 8d that adsorbs and moves in the arrow Z direction by a vertical movement device such as a cylinder 8c is provided.
[0043]
Next, a procedure for transferring the substrate 1 together with the holding plates 71 and 72 to the substrate reversing device main body by the transfer device 8 and transferring the inverted substrate 1 together with the holding plates 71 and 72 to the transfer device 8 is shown in FIG. This will be described below with reference to FIGS.
[0044]
First, as shown in FIG. 4, the servo motors 9a, 9a on the substrate reversing apparatus main body side are driven by control by a control means (not shown), and the pair of gripping mechanisms 31, 32 move (retract) from side to side. The pair of holding plates 71 and 72 sandwiching the substrate 1 in the open space is held by the suction member 8d and is operated in the direction indicated by the arrow Z1 by operating the cylinder 8c from the transfer table 8a of the transfer device 8. It is pushed up and positioned at the position shown in FIG.
[0045]
In this state, the control means (not shown) operates the servo motors 9a and 9a to move the left and right gripping mechanisms 31 and 32 forward in the direction of the arrow X1, and each suction member 3a and 3a is set at a preset position. The holding plates 71 and 72 are stopped at positions where they can be sucked while being pressed.
[0046]
Next, as shown in FIG. 2, the holding plates 71 and 72 are pressed and held from above and below by the operation of the cylinders 3d of the pair of gripping mechanisms 31 and 32, and the suction member 8d of the transport device 8 releases the suction. Then, the cylinders 8c are lowered to the position shown in FIG. 2 by the operation of the cylinder 8c. In this state, the holding plates 71 and 72 holding the substrate 1 by the rotation of 180 degrees in the direction of the arrow R by driving the motor 10a. Inverted.
[0047]
The inverted substrate 1 is not shown in the figure, but the opposite operation, that is, “the upward movement of the suction member 8d of the transfer device 8” → “the suction of the holding plate by the suction member 8d” → “the holding plate 71 by the cylinder 3d, 72 ”→“ retraction of the gripping mechanisms 31, 32 by the servo motors 9a, 9a ”→“ downward movement of the suction member 8d ”in sequence, the inverted substrate 1 together with the holding plates 71, 72 It is transported and delivered to the component mounting process.
[0048]
In the next process, the holding plates 71 and 72 are removed, and the state shown in FIG. 15 is obtained. Therefore, components such as electronic components are mounted on the electrode portions of the substrate 1B facing upward by reversal.
[0049]
In the first embodiment, the plurality of suction members 3a and 3a are configured to suck and hold the holding plates 71 and 72. However, together with the holding plates 71 and 72, the board 1 or the component 2 is sucked. It can also be configured.
[0050]
That is, FIG. 6 is a side view of the main part showing a second embodiment of the substrate reversing device of the present invention. The holding plates 71, 72 are provided with through holes 71a, 72a, and a part of the adsorbing members 3a, 3a. Is configured to directly suck and hold the substrate 1 (1A, 1B) through the through holes 71a, 72a and reduce the displacement of the substrate 1 during the reversing operation.
[0051]
Of course, the through holes 71a and 72a may be configured such that the adsorbing members 3a and 3a directly adsorb the electronic component 2.
[0052]
In the first and second embodiments, if an exhaust pipe or the like is erected on the plate surface of the substrate 1, the holding plates 71 and 72 are provided to avoid the exhaust pipe or the like. In addition to providing a through-hole or the like in advance, the gripping mechanisms 31 and 32 can also be configured by appropriately deforming the shape so as not to come into contact with the exhaust pipe or the like in operations such as forward and backward movement.
[0053]
In any case, according to the substrate reversing device according to the first and second embodiments, the substrate on which the electronic component or the like is mounted is sandwiched between the pair of holding plates, and the holding plate is held and reversed. As a result, the effect of stress on the board due to the rotational movement of parts, etc. is reduced, and damage to the connected parts between the board and the parts is reduced as well as damage to the mounted parts and board. can do.
[0054]
Next, a third embodiment of the substrate reversing device according to the present invention will be described with reference to FIGS.
[0055]
FIG. 7 is a plan view showing a third embodiment of the substrate reversing device according to the present invention, FIG. 8 is a cross-sectional view of FIG. 7, and FIG. 9 shows an operation state of the substrate reversing device shown in FIG. 10 is a cross-sectional view of FIG. 9, FIG. 11 is a plan view showing another operation state of the substrate reversing device shown in FIG. 7, and FIG. 12 is a cross-sectional view of FIG.
[0056]
The substrate reversing device 40 shown in FIGS. 7 to 12 directly sucks and holds the substrate 1 with a pair of upper and lower suction members (constituting holding members) 3a and 3a without using a pair of holding plates 71 and 72. The electronic component 2 connected to the substrate 1 is supported from both upper and lower surfaces by a pair of upper and lower support members (constituting support members) 41 and 41.
[0057]
In other words, two pairs of upper and lower suction members 3a, 3a for holding the substrate 1 by suction are provided on the pair of left and right slide mechanisms 42, 42, respectively. The slide mechanisms 42 and 42 are respectively arranged on the upper and lower sides of the rotary frame 43 and have slide arms 44 and 44 that are movable while being guided in the direction of the arrow X by a feed mechanism that uses a motor or the like as a drive source. Configured. Further, support brackets 46 and 46 are supported on the respective slide arms 44 and 44 through the upper and lower cylinders 45 and 45 so as to be movable in the vertical direction. The suction members 3a and 3a are supported by the support brackets 46 and 46, respectively. It is supported by. In addition, support members 41 and 41 are fixedly disposed on the slide arms 44 and 44, and the mutually opposing surfaces of the support members 41 and 41 facing vertically hold the electronic component 2 from both the front and back surfaces. It functions as a support surface that enables it.
[0058]
The rotating frame 43 is rotatably supported on left and right support shafts 48 and 48 by a frame member 47 fixedly supported on a support (not shown). Here, a pulley 49 is fixed to one of the support shafts 48 (the left side in the drawing), and is connected via a belt 53 and a pulley 51 fixed to an output shaft of a motor 50 fixed to the frame member 47. Yes. Thereby, the rotating frame 43 can rotate around the support shaft 48 by driving the motor 50.
[0059]
In the rotating frame 43, a pair of substrate support members 52, 52 are disposed between the slide arms 44, 44 facing each other. The substrate support members 52 and 52 are respectively provided on the upper and lower surfaces of the rotary frame 43 and supported so as to be capable of rotating 90 degrees between the state shown by the solid line and the state shown by the two-dot chain line in FIG. The rotary frame 43 is supported so as to be movable in the vertical direction.
[0060]
Next, in the substrate reversing apparatus 40, a procedure from when the substrate 1 is delivered from the previous process to after being reversed and delivered to the subsequent process will be described below.
[0061]
First, as shown in FIG. 9, among the slide arms 44 and 44 of the rotary frame 43, the slide arms 44 and 44 positioned on the upper side of the rotary frame 43 are separated from each other (from the state shown in FIG. 7 to FIG. 9). In the same manner, the upper substrate support member 52 is rotated to the state indicated by a two-dot chain line in FIG. 7 to form a space for loading the substrate 1. Then, the substrate 1 transported by a transport device (not shown) passes through this space, and the suction members 3a and 3a and the substrate support member 52 supported by the slide arms 44 and 44 positioned below the rotary frame 43, 52. At this time, support members 41 and 41 are positioned below the electronic component 2 connected to the substrate 1.
[0062]
Next, as shown in FIG. 11, the slide arms 44, 44 located on the upper side of the rotating frame 43 move closer to the substrate 1 side to a position facing the slide arms 44, 44 located on the lower side. As shown in FIG. 7, the upper substrate support members 52 and 52 are similarly rotated on the substrate 1. Then, the suction members 3a and 3a are lowered, and the substrate support members 52 and 52 are lowered to press and hold the substrate 1 from both the upper and lower surfaces.
[0063]
In this state, the substrate 1 is inverted by rotating the rotating frame 43 by 180 degrees by driving the motor 50. At this time, as shown in FIG. 7, the electronic component 2 connected to the substrate 1 is held by the support members 41 and 41 from the front and back.
[0064]
The inverted substrate 1 operates in the opposite direction, that is, “the suction members 3a and 3a rise and the substrate support members 52 and 52 rise” → “the direction in which the slide arms 44 and 44 located above are separated from each other”. And the substrate support members 52 and 52 positioned on the upper side are transferred to the next electronic component mounting step and passed through the procedure of “turning the substrate support members 52 and 52 positioned on the upper side to the positions indicated by the two-dot chain line” in FIG.
[0065]
In the third embodiment, since the substrate 1 is inverted while being pressed and held by the adsorbing members 3a and 3a and the substrate support members 52 and 52 from above and below, the stress accompanying the rotational motion is caused by the substrate 1 In addition, the electronic component 2 connected to the substrate 1 is held by the support members 41 and 41 during the reversing operation of the substrate 1. The fluttering can be prevented, and the substrate 1 and the electronic component 2 can be prevented from being damaged.
[0066]
【The invention's effect】
According to the present invention, a stable reversing operation can be performed without swinging the components mounted on the substrate, so that a substrate such as a liquid crystal panel having a high yield and high reliability can be assembled and manufactured, which is practically obtained. The effect is great.
[Brief description of the drawings]
FIG. 1 is a layout diagram of a panel manufacturing apparatus using a substrate reversing apparatus according to the present invention.
FIG. 2 is a front view showing a first embodiment of a substrate reversing device according to the present invention.
FIG. 3 is an enlarged front view of a main part of the apparatus shown in FIG.
4 is a front view showing a state in which a substrate is transported in the apparatus shown in FIG. 2;
5 is a front view showing a state where the apparatus shown in FIG. 2 is intended to hold the transported substrate following FIG. 3. FIG.
FIG. 6 is an enlarged front view of an essential part showing a second embodiment of a substrate reversing device according to the present invention.
FIG. 7 is a plan view showing a third embodiment of the substrate reversing device according to the present invention.
8 is a cross-sectional view of the substrate reversing device shown in FIG.
9 is a plan view showing an operation state of the substrate reversing device shown in FIG. 7;
10 is a cross-sectional view showing an operation state of the substrate reversing device shown in FIG.
11 is a plan view showing another operation state of the substrate reversing apparatus shown in FIG. 7;
12 is a cross-sectional view of the substrate reversing device shown in FIG.
FIG. 13 is a perspective view showing a conventional substrate reversing device.
14 is a side view of essential parts of the apparatus shown in FIG. 13. FIG.
15 is a perspective view showing a state in which components are mounted on a substrate inverted by the apparatus shown in FIG. 13;
[Explanation of symbols]
1, 1A, 1B Substrate 2 Parts 3 Grasping parts 31, 32 Grasping mechanism 3a Adsorption member 3b Grasping piece 3c Grasping part 3d Cylinder 3e Linear guide 3f Grasping body 3g Exhaust holes 4, 10 Reversing mechanism 5 Moving mechanism 71, 72 Holding plate 71a 72a Through-hole 7a Buffer member 8 Transport device 8a Transport table 8b XY-θ stage 8c Cylinder 8d Adsorption member 91, 92 Ball screw mechanism 9a Servo motor 10a Motor 10b Frame body 10c Connecting beam 10d Bearing 20 Panel manufacturing device 21 Substrate Supply device 22a First substrate cleaning device 22b Second substrate cleaning device 23a First connecting member pasting device 23b Second connecting member pasting device 24a First electronic component mounting device 24b Second electronic component mounting device 25 Substrate reversing device 26 Substrate receiving device 40 Substrate reversing device 41 Support member 42 Slide mechanism 43 Rotating frame 44 Slide arm 45 Cylinder 46 Support bracket 47 Frame member 48 Support shaft 49 Pulley 50 Motor 51 Pulley 52 Substrate support member 53 Belt

Claims (7)

A substrate reversing device for reversing a substrate mounted with components protruding from the outer periphery,
A gripping part for holding a pair of holding plates having a plurality of cushioning members protruding on one side so that the one side faces each other;
A reversing mechanism for rotating and reversing the gripping part,
The gripping part sandwiches the substrate disposed between the pair of holding plates by pressing a plurality of buffer members of the pair of holding plates on both surfaces of the substrate and the component, respectively.
The substrate reversing device, wherein the reversing mechanism rotates a gripping part sandwiching the substrate to reverse the substrate together with the pair of holding plates. The gripping part is composed of a pair of gripping mechanisms arranged opposite to each other,
The substrate reversing apparatus according to claim 1, wherein the reversing mechanism is configured to rotate the pair of gripping mechanisms synchronously. The gripper, substrate reversing device according to claim 1 or 2, characterized in that the holding plate via a suction member configured to retain suction. In the substrate reversing device that reverses the substrate mounted with the components protruding from the outer periphery,
An adsorbing member for adsorbing the substrate;
A support member for supporting the component from both sides thereof;
A substrate reversing apparatus comprising: a rotation mechanism configured to rotate the adsorption member and the support member about a straight line parallel to the surface of the substrate as a common rotation center axis. 5. The substrate according to claim 4, wherein the adsorption member is provided as a pair of groups that respectively adsorb both surfaces of the substrate, and a plurality of the pairs are arranged in a direction along a surface of the substrate. Inversion device. Wherein the support member, a substrate reversing device according to claim 4 or 5, characterized in that it has a pair of opposing surfaces facing each other so as to support the device from its both sides. The panel manufacturing apparatus using the board | substrate inversion apparatus of any one of Claims 1 thru | or 6 .

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