JP4314828B2 - Card embossed character and method for forming the embossed character - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a card embossed character for forming an embossed character on a card surface such as a magnetic card, a card having one or both of a contact communication function and a non-contact communication function, and an embossed character thereof. The present invention relates to a forming method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, IC cards using IC chips have been widely used for the purpose of storing and processing important and large amounts of data such as bank cards, cash cards and ID cards. In recent years, not only contact-type IC cards that are used by connecting external terminals and external terminals of IC cards, but also built-in antennas, and exchange data with external devices in a non-contact manner by radio waves or electrostatic coupling. The use of an IC card having a non-contact communication function is increasing, and the demand is increasing for reasons such as no need to insert / remove the card and reduction of maintenance of an external terminal.
[0003]
IC card with non-contact communication function provides a field of vibration energy such as high-frequency electromagnetic field, ultrasonic wave, light, etc. in the space, and absorbs and rectifies the energy to drive the electronic circuit built in the card. Use the frequency of the AC component of this field as it is, or multiply or divide it into an identification signal, and use this identification signal as an information processing circuit for semiconductor elements via a coupler such as an antenna or coil or capacitor Is to be transmitted.
[0004]
In general, an IC card having a non-contact communication function is manufactured as follows. An IC module is mounted on an antenna substrate formed in a film shape having a metal foil antenna or coil for non-contact transmission manufactured by conductive paste printing, winding welding processing, copper foil etching processing, etc. The card is produced by being sandwiched and laminated by a card substrate.
[0005]
At this time, two antenna terminals for connecting the antenna or coil and the IC module are exposed on the antenna substrate. The IC module is mounted with an IC and provided with a terminal for connection with an antenna. A conductive adhesive film is attached to the connection terminal of the antenna substrate. After the IC module is installed on the antenna board so that the connection terminals of the IC module and the antenna board having the conductive adhesive film affixed to the terminals overlap, the terminals of the IC module are applied with heat and pressure. The antenna terminal is coupled to complete the mounting.
[0006]
In addition, recently, a method of mounting an IC chip directly on a film or substrate on which an antenna is formed without using an IC module by using a conductive adhesive film has been widely adopted.
[0007]
Various cards are provided with an emboss display in addition to a display such as printing. As shown in the side cross-sectional view of the embossed card in FIG. 7 (a), the card body 1 has a card-like display information such as the card owner's name, card number, membership number, and card expiration date. The embossed character 2 is formed as a raised character (embossed character) by so-called embossing. This display information is unique information and is used as visible information.
[0008]
For embossing, the desired character information is engraved by the engraving keys (alphabetic characters, numbers, kana characters, katakana characters, etc.) each formed with a character pattern from one side of the card body 1, usually the back side. As shown in the side sectional view of FIG. 1 (a), the card base is raised as a convex portion 2a on the front side of the card body 1, and desired character information is formed as an embossed character 2, while the back surface On the side, an embossed character 2 is formed as a concave portion 2b.
[0009]
In particular, in the IC card having the non-contact communication function, an antenna pattern for information communication is provided in the layer of the card substrate. If embossing is performed from the back side of the card body 1 in a place where there is a fine antenna pattern, the antenna pattern may be disconnected or damaged, which may cause an inability to communicate information.
[0010]
Therefore, without using the embossing method by the key for engraving from the back side to the front side of the card body 1, as shown in the side sectional view of FIG. A resin material is ejected in a letter shape and laminated and bonded, and the convex portion 2c is formed as an embossed character 2, and an embossed character is formed on the card body 1 without causing deformation or distortion due to the embossing. May be used.
[0011]
However, as shown in FIG. 8A, when a stress F such as a frictional force is applied to the convex portion 2c of the card body 1 (card base material 11, printing ink layer, protective resin layer 12), the card body 1 Between the surface layer 12 and the convex portion 2c of the embossed character 2 that is a resin material discharged onto the surface layer by interposing a printing ink layer or a protective resin layer 12 formed in advance on the surface of There is a problem that delamination occurs and the character 2 is dropped as shown in FIG.
[0012]
[Patent Document 1]
Japanese Patent Application No. 2002-167540
[0013]
[Problems to be solved by the invention]
An object of the present invention is to form embossed characters in a convex shape only on the surface of an embossed card such as a magnetic card, or on the surface of an embossed card having either or both of a contact communication function and a non-contact communication function. Another object of the present invention is to provide an embossed character and an embossed character forming method that prevent delamination between the card surface and the embossed character.
[0014]
[Means for Solving the Problems]
The present invention solves such a problem, and the invention according to claim 1 includes a hole forming portion 11a having a depth not more than half the thickness of the card substrate on the surface of the card substrate 11, and the hole forming portion 11a. And a raised portion 11b around the surface of the card base, and liquid resin is filled and solidified so as to cover the raised portion 11b in the hole forming portion 11a, so that a convex portion 2c is formed in an embossed character shape. This is a card embossed character.
[0015]
The invention according to claim 2 of the present invention is the card embossed character according to claim 1, wherein the surface of the card base 11 is provided with a surface resin layer such as a printing layer or a protective layer. It is.
[0016]
The invention according to claim 3 of the present invention is the card embossed character according to claim 1 or claim 2, wherein the hole forming portion 11a is formed by laser beam irradiation.
[0017]
According to a fourth aspect of the present invention, in the card embossed character according to any one of the first to third aspects, the convex portion 2c is formed by discharging and solidifying a liquid resin. Card embossed characters.
[0018]
The invention according to claim 5 of the present invention is the card embossed character according to any one of claims 1 to 4, wherein the liquid resin is a dissolved resin dissolved in a hot-melt resin or a volatile solvent. A card embossed character.
[0019]
In the invention according to claim 6 of the present invention, a hole portion 11a having a depth less than half the thickness of the card substrate is formed on the surface of the card substrate 11 by laser beam irradiation, and the card of the hole portion 11a is formed. A raised portion 11b is formed around the surface of the substrate, and then liquid resin is ejected in an embossed character form from above the hole 11a to fill the hole 11a and cover the bump 11b. An embossed character-shaped convex portion 2c is formed by drying and solidifying later, and this is a card embossed character forming method.
[0020]
The invention according to claim 7 of the present invention is the card embossed character forming method according to claim 6, wherein the liquid resin is a dissolved resin dissolved in a hot-melt resin or a volatile solvent. It is a forming method.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a side cross-sectional view illustrating an example of an embossed card body 1 on which card embossed characters according to the present invention are formed. The card body 1 includes a card base 11 made of a single layer or multilayer synthetic resin, A surface resin layer 12 such as a printing ink layer or a protective overcoat layer is provided on the surface, and an embossed character 2 is formed on the front surface (or back surface) of the card substrate 11.
[0022]
The embossed card body 1 is a magnetic card provided with a magnetic recording layer, or an IC card provided with one or both of a contact communication function and a non-contact communication function.
[0023]
In the case of a magnetic card, a magnetic stripe (magnetic recording layer: not shown) is provided on the front surface or the back surface of the card substrate 11, and in the case of an IC card, the inside of the card substrate 11 by the multilayer laminated resin. In the case of an IC card having an IC chip on the surface, an external contact terminal on the surface, and a non-contact communication function, a coiled pattern obtained by etching a contact copper wire or metal foil inside the card base 11 The antenna pattern 5 is provided, and power can be efficiently supplied to the IC chip by adjusting so as to resonate at the communication frequency with the reader / writer.
[0024]
The front surface (or back surface) of the embossed card body 1 of the present invention is provided with one or two or several lines of embossing areas, for example, two embossing areas for embossing according to ISO 7811 standard are provided. One embossing area is assigned for an identification number such as a cardholder's membership number, and the other embossing area is assigned a name and other necessary data for the identification embossing data of the holder. Information is formed as an embossed character 2 in both embossed areas.
[0025]
As shown in FIG. 1, the embossed character 2 of the present invention provided on the surface of the embossed card body 1 has a card substrate thickness t (for example, on the surface of the card substrate 11 made of a single-layer or multilayer plastic sheet. A hole 11a having a depth d (for example, d = 50 μm or less, preferably d = 4 to 8 μm), which is approximately half or less than t = 760 μm), is provided around the hole 11a on the surface of the card base 11. Is provided with a raised portion 11b having a height h, and the substantial depth of the hole portion 11a is d + h.
[0026]
In the hole 11a (depth = d + h), the bulging portion 11b is filled with liquid resin in an embossed character shape so as to cover the upper surface of the bulged portion 11b and solidified to form an embossed character-shaped convex portion 2c. And the embossed character 2 by this convex-shaped part 2c is formed.
[0027]
Further, a surface resin layer 12 such as a printing ink layer (for example, a layer thickness of 1 to 3 μm) or an overcoat layer (protective resin layer, a layer thickness of 3 to 5 μm) is provided on the surface of the card substrate 11.
[0028]
As shown in FIG. 2, by irradiating the flat surface of the card substrate 11 with a laser beam L using a laser beam irradiation means 21 (thermal laser), the irradiated portion of the card substrate 11 is a laser beam. The hole portion 11a is formed by melting by the heat of L, and the resin in the hole portion 11a is pushed out to the outside of the hole portion 11a on the surface of the card base 11 as shown in FIG. A raised portion 11b having a length h is formed. The laser beam L is irradiated until the depth d is about half or less of the thickness t of the card substrate 11.
[0029]
Next, as shown in FIG. 4 (a), the liquid resin R is ejected in an embossed character form by the liquid resin ejection means 22 from above the hole 11a formed on the surface of the card base 11, The liquid resin R is filled in the holed portion 11a and coated on the upper surface of the raised portion 11b to be dried and solidified.
[0030]
As a result, as shown in FIG. 4B, an embossed character 2 is formed on the surface of the card body 1 by the embossed character-shaped convex portion 2c by the resin R dried and solidified.
[0031]
The liquid resin discharging means 22 includes a liquid resin R melted by heating, a liquid resin R dissolved in a volatile solvent (for example, toluene, methyl ethyl ketone, etc.), a two-component reaction curable resin, an ultraviolet curable resin, a heating A means equipped with a discharge nozzle 22a for extruding and discharging a cross-linking curable liquid resin R such as a curable resin can be used.
[0032]
Then, by moving the card body 1 side or the liquid resin discharge means 22 side relatively in the XY plane, the discharge nozzle 22a is moved and scanned in an embossed character along the hole 11a. The liquid resin R is filled in the hole 11a and the upper surface of the raised portion 11b is covered with an embossed character.
[0033]
As shown in the plan view of FIG. 5A and the partially enlarged perspective view of FIG. 5B, the embossed character 2 of the present invention is coated and solidified with the liquid resin R in the form of an embossed character along the hole 11a. It is comprised by the embossed letter-like convex part 2c formed by doing.
[0034]
6 (a) to 6 (b) show a hole portion 11a of the embossed character 2 of the present invention, and an embossed character-shaped convex portion 2c formed by coating and solidifying the liquid resin R in an embossed character shape. FIG. 6A is a plan view showing, for example, a continuous line shape as shown in FIG. 6A, or an interrupted line shape (or an intermittent point shape) as shown in FIG. 6B. The embossed character 2 by the convex part 2c is formed by filling the liquid resin R from the upper side of the part 11a and the surrounding raised part 11b and covering the part 11a with the embossed character.
[0035]
【The invention's effect】
As described above, according to the embossed card on which the embossed character of the present invention is formed, the embossed character by the convex portion is formed only on the front surface (or back surface) side of the card body, and the back surface (or front surface of the card body). ) Side is not formed, and at least one surface of the embossed card is formed with a flat surface having no concavo-convex portion, and good touch and design of the card body can be obtained.
[0036]
In addition, since the embossed character of the present invention is formed using heat generated by laser beam irradiation, the embossed character is struck in the direction from the front surface (or back surface) to the back surface (or front surface) of a card substrate such as a conventional embossed card. Compared to the case where embossed characters are formed by embossing character information with the engraving key, there is no engraving stress or stress such as physical pressing when forming characters on the card base, and the card body is distorted. The curl deformation can be made difficult to occur, and the IC chip, the wiring pattern, and the antenna pattern of the IC card having one or both of the contact communication function and the non-contact communication function are damaged or broken. It is possible to avoid occurrence of disconnection.
[0037]
Moreover, the embossed character of this invention has the effect which can prevent the delamination of the card | curd main body surface and an embossed character by the anchoring part and the bulging part which were drilled in the card | curd base material having an anchor effect | action.
[Brief description of the drawings]
FIG. 1 is a side sectional view for explaining an example of an embossed character according to the present invention.
FIG. 2 is a side view illustrating an embossed character forming process according to the present invention.
FIG. 3 is a partial cross-sectional view illustrating a process for forming embossed characters according to the present invention.
FIGS. 4A and 4B are partial side cross-sectional views illustrating a process for forming embossed characters according to the present invention. FIGS.
5A is a plan view for explaining an example of an embossed character according to the present invention, and FIG. 5B is a partially enlarged perspective view thereof.
6A to 6B are plan views for explaining an example of the structure of embossed characters according to the present invention.
FIGS. 7A and 7B are side sectional views for explaining conventional embossed characters.
FIGS. 8A and 8B are side views illustrating conventional embossed characters.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Card main body 2 ... Embossing character 2a ... Convex part 2b ... Concave part 2c ... Convex part 11 ... Card base material 11a ... Perforated part 11b ... Swelling part 12 ... Surface resin layer

Claims (7)

Provided on the surface of the card base 11 is a hole 11a having a depth less than half the thickness of the card base, and a raised portion 11b around the surface of the card base 11a. The card embossing character is characterized in that a liquid resin is filled and solidified so as to cover the swelled portion 11b, and a convex portion 2c is formed in an embossed character shape. The card embossing character according to claim 1, wherein a surface resin layer such as a printing layer or a protective layer is provided on the surface of the card substrate 11. The card embossing character according to claim 1 or 2, wherein the hole portion 11a is formed by laser beam irradiation. The card-embossed character according to any one of claims 1 to 3, wherein the convex portion 2c is formed by discharging and solidifying a liquid resin. The card embossing character according to any one of claims 1 to 4, wherein the liquid resin is a melted resin dissolved in a hot melt resin or a volatile solvent. A hole 11a having a depth less than half the thickness of the card base is formed by laser beam irradiation on the surface of the card base 11 and a raised portion 11b is formed around the card base surface of the hole 11a. Subsequently, the liquid resin is discharged in an embossed character shape from above the holed portion 11a, filled into the holed portion 11a and coated on the raised portion 11b, and then dried and solidified, whereby an embossed character-like shape is obtained. A method for forming a card embossed character, wherein the convex portion 2c is formed. The card embossed character forming method according to claim 6, wherein the liquid resin is a melted resin dissolved in a hot melt resin or a volatile solvent.

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