JP2000153681A - Booklet-form printed matter including non-contact type ic storing medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen the causes of an IC chip accident by adhering a non-contact type IC storing medium having a non-contact type IC module built therein between two superimposed and adhered sheet on the front cover or rear cover of booklet-type printed matter. SOLUTION: A non-contact type IC storing medium 1 is adhered to a region near the corner of the inside surface of a front cover 11a or rear cover 11b of a leaflet form printed matter 11. In this instance, when the printed matter 11 is used in carrying out a printing process of a printer in ATM system such as a deposit passbook or the like, a hindrance can be avoided in which an IC chip 3 or non-contact type IC module is broken through application of pressure caused by a delivery roller traveling near the central part of a deposit passbook to the non-contact IC module. Also, since the structure of such a booklet-form printed matter main body is formed without the need of a special structure, and hence the booklet-type printed matter main body can be manufactured only by the use of ordinary paper, a booklet-form printed matter which can be subjected to a non-contact process is obtained at a low manufacturing cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a booklet-shaped printed matter having a non-contact IC storage medium having a built-in non-contact IC module capable of performing non-contact communication with an external processing device.

[0002]

2. Description of the Related Art Conventionally, for example, a non-contact type I.S.
C cards are generally known. These non-contact ICs
The card is usually made of plastic, and is connected to a data communication coil for inputting and outputting a signal in a non-contact manner inside a 0.76 mm thick card made of, for example, a polyvinyl chloride substrate. In general, a non-contact type IC card is configured by incorporating a non-contact type IC module including an IC chip (semiconductor integrated circuit).

[0003] Since these non-contact type IC cards are usually made of plastic, processing and molding of the card base are required depending on the shape of the built-in non-contact type IC module. It is also a factor that hinders the trend in each industry to improve services by introducing a contact-type customer service system.

In recent years, it has become possible to reduce the thickness of non-contact IC modules, and a non-contact IC card having a thickness of, for example, 0.25 mm using a polyethylene terephthalate substrate as a card substrate has been developed. These non-contact I
Since the non-contact type IC card as the C storage medium is made of plastic, it is not possible to write or print various kinds of information and data even when it is desired to print the data with a printer or the like. There is a problem that it is not suitable for various booklet-like printed materials such as passbooks and passports that require printing.

[0005] Therefore, in order to provide a non-contact IC storage means in a booklet-shaped printed matter, a front cover or a back cover is formed by a resin sheet having a non-contact IC module built therein.
A booklet-shaped printed matter in which a book body text sheet is stitched between the front cover and the back cover so that it can be written on the paper body paper has been developed and is known. However, since these booklet-shaped printed materials usually have a structure in which a non-contact IC module is built in the vicinity of the center in a resin sheet provided on the front side of the booklet-shaped printed material, for example, a booklet-shaped printed material having such a structure is used. When used for passbooks, etc., ATM
At the time of printer printing processing by the device (automatic depositing and dispensing device), by the feed roller running near the center of the passbook,
Pressure is applied to the built-in IC chip and the non-contact IC module, and there is a risk of breaking the IC chip and the non-contact IC module, which is not preferable.

In order to incorporate a non-contact IC module in the front cover or the back cover of a booklet-like printed material, the manufacturing cost is increased. There is a lot of waste on resources and there is a problem.

[0007]

SUMMARY OF THE INVENTION The present invention is to provide a booklet-like printed material capable of providing a non-contact IC function with resource saving and low manufacturing cost as compared with a conventional product. When used for booklet-like printed materials that need to be printed by a simple printer printing device,
The non-contact IC module provided on the booklet-like printed matter by the feed roller in the printer printing apparatus is configured so as not to be adversely affected by the pressure on the IC chip as much as possible. It is an object of the present invention to provide a booklet-shaped printed matter having a non-contact IC storage medium which is devised so that the IC chip is not pushed by the body paper stitched therein and causes the IC chip to be less likely to fail.

[0008]

In order to achieve the above-mentioned object, a book-like print having a non-contact IC storage medium according to the present invention comprises a non-contact IC module between two superposed and laminated sheets. The present invention is characterized in that the built-in non-contact IC storage medium is attached to the front cover or the back cover of a printed book.

Further, the present invention is characterized in that the non-contact IC storage medium is attached to a region near a corner on an inner surface of a front cover or a back cover of the booklet-shaped printed matter.

The present invention is also directed to a method for binding a booklet-shaped printed matter to an IC chip portion contained in a non-contact IC storage medium affixed to the booklet-shaped printed matter, and binding the IC chip portion inside the booklet-shaped printed matter. A notch is provided in a region near a corner of the body sheet so that the combined body sheet does not overlap.

Further, the present invention is characterized in that the booklet-shaped printed matter is a bankbook or a passport.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view showing a state in which an upper sheet is removed from a non-contact IC storage medium before die-cutting, FIG. 2 is a cross-sectional view of FIG. 1A-A, and FIG. FIG. 4 is a cross-sectional view showing a state in which a release paper is provided, FIG. 4 is a cross-sectional view of a non-contact IC storage medium obtained by cutting the non-contact IC storage medium of FIG. FIG. 6 is a cross-sectional view showing a state in which various types of non-contact IC modules are incorporated, FIG. 6 is a cross-sectional view of the non-contact IC storage medium cut out from the non-contact IC storage medium before die cutting shown in FIG. Is a booklet-shaped printed matter according to the present invention and is a non-contact IC
FIG. 8 is a perspective view showing a state where the storage medium is attached, and FIG.
-B sectional view, FIG. 9 is a perspective view showing a state in which a cutout portion is provided at a corner portion of the text paper in the booklet-shaped printed matter of the present invention,
FIG. 10 is a perspective view showing a state in which the body paper of FIG. 9 is superimposed on the back cover side on which the non-contact IC storage medium is stuck, and FIG. 11 is a plan view showing a state in which the booklet-shaped printed matter of the present invention is bound.

Non-contact IC storage medium 1 used in the present invention
As shown in FIGS. 1 and 2, a non-contact IC module 5 is provided between two superposed and bonded sheets 2a and 2b.
Are built in. The non-contact IC module 5 includes a non-contact IC chip 3 and the IC chip 3.
And a transmission / reception coil 4 for transmitting and receiving signals in a non-contact manner.

There are various configurations of the non-contact IC module 5, for example, on a polyethylene terephthalate sheet 2b having a thickness of about 80 μm, as shown in FIG. 4a, and at the portions where the conductive inks intersect, coil printing with conductive ink is performed.
a is covered with an insulating ink, and a coil print 4a is formed thereon with a conductive ink to form a loop-shaped transmitting / receiving coil 4. The number of turns of the transmitting / receiving coil 4 formed in a loop by the coil printing 4a using conductive ink is suitably 3 to 5 turns. Also, coil printing 4a
Is preferably about 1 mm.

When the transmitting and receiving coil 4 is formed by performing coil printing 4a using conductive ink, a non-contact IC chip 3 (for example, one having a thickness of about 50 μm) is provided under a non-contact IC chip 3 having a thickness of about 20 μm. By providing the anisotropic conductive sheet 6, the IC chip 3 and coil printing 4a of conductive ink are provided.
Connect the parts. Then, an adhesive 7 is applied on the sheet 2b provided with the non-contact IC module 5 on the upper side as shown in FIG. 2, and a polyethylene terephthalate sheet 2a having a thickness of, for example, about 80 μm is laminated and bonded. Thus, the non-contact IC storage medium 1 in a state before the die cutting is manufactured. Next, as shown in FIG. 3, the adhesive 9 is applied to the lower surface side of the sheet 2b, and then the release paper 10 is attached thereto, or the release paper 10 coated with the adhesive 9 is applied to the sheet 2b. Laminate on the lower surface side. Then, a non-contact IC storage medium seal 1a as shown in FIG. 4 is manufactured by cutting out a die-cutting line 8 having a desired size (for example, 2 cm long and 3 cm wide).

Further, as the transmission / reception coil 4 of the non-contact IC module 5, a coated copper wire 4b may be used instead of the coil printing 4a made of the conductive ink. FIGS. 5 and 6 show an example in which a coated copper wire 4b is used for the transmitting and receiving coil 4.
As shown in FIG. 2, a non-contact IC chip 3 (for example, having a thickness of about 50 μm) and a coated copper wire 4b (for example,
The non-contact IC module 5 is formed by connecting a device having a size of about 0 μm to form about four turns in a loop. The non-contact IC module 5 is sandwiched between two sheets 2a and 2b of, for example, resin-impregnated paper having a thickness of about 100 μm.
The non-contact IC storage medium 1 before die-cutting is manufactured by sandwiching the sheets and bonding and integrating them with the adhesives 7a and 7b applied to the inner surfaces of the sheets 2a and 2b.

Next, as shown in FIG. 5, on the lower surface side of the sheet 2b, after the adhesive 9 is applied, the release paper 10 is bonded, or the release paper 10 on which the adhesive 9 has been applied is placed. The sheet is bonded to the lower surface of the sheet 2b. Then, a non-contact IC storage medium seal 1a as shown in FIG. 6 is manufactured by cutting out a die-cutting line 8 having a desired size (for example, 2 cm long and 3 cm wide).

Also, the non-contact IC module 5 can be built in the non-contact IC storage medium by filling and curing the resin between the sheets 2a and 2b using a resin such as a thermoplastic resin instead of the adhesive. Good. Then, the non-contact IC storage medium 1
Is prepared by applying an adhesive 9 on the lower surface side of the sheet 2b in advance and leaving the release paper 10 unattached, and applying an adhesive to the lower surface side of the sheet 2b when it is necessary to attach the release paper 10 to the booklet-shaped printed matter. 9 may be applied and affixed to a desired position of the booklet-shaped printed matter.

The first aspect of the present invention is to provide a non-contact IC on the front cover 11a or the back cover 11b of the booklet-shaped printed matter 11.
Characterized in that a storage medium is attached,
FIG. 7 shows a configuration in which the non-contact IC storage medium 1 is attached to the inner surface of the back cover 11b. Usually, the booklet-shaped printed matter includes a front cover 11a, a back cover 11b, and a front cover 11a.
And the body paper 11c sandwiched between the back cover 11b. If the non-contact IC storage medium 1 is attached to the body paper 11c, the body paper 11c If the contact IC storage medium 1 is bent and an extra stress is applied to the built-in non-contact IC module 5, there is a risk of causing a failure. Further, since the thin paper is usually used as the main body paper 11c, if the non-contact IC storage medium 1 is attached, there is a danger that the paper may be broken at the time of use.

According to the first invention, the non-contact IC storage medium 1 is attached to a desired position on the front or back surface of the front cover 11a or the back cover 11b according to the intended use of the booklet-shaped printed material 11. Thus, the form can be adjusted. In particular, the front cover 11a or the back cover 11b
When the non-contact IC storage medium 1 is attached to the surface of the sheet 2a, a desired print pattern or character information may be printed on the surface of the sheet 2a.

Next, according to a second aspect of the present invention, as shown in FIG. 7, the non-contact IC storage medium 1 is placed near the corner of the inner surface of the front cover 11a or the back cover 11b of the booklet-like printed material 11. It is attached to the area. In the case where the booklet-shaped printed material 11 is a medium such as a passbook, which is used for performing a printer printing process of an ATM device, a non-contact I-type built in by a feed roller running near the center of the passbook.
Pressure is applied to the C module under the influence of the feed roller, and there is a risk that the IC chip and the non-contact IC module are broken. Therefore, the non-contact IC is provided in the area near the corner on the inner surface of the front cover 11a or the back cover 11b of the booklet-shaped printed matter 11.
By sticking the storage medium 1, it is possible to avoid the adverse effects of these feed rollers.

However, the non-contact IC storage medium 1
Since the IC chip 3 is sandwiched between the two sheets 2a and 2b, the sheets 2a and 2b of the portion containing the IC chip 3 are pushed out, and a part of the non-contact IC storage medium 1 is formed. The thickness of the contactless IC storage medium 1 is actually increased by about 50 μm, and the cover 11a
Alternatively, when pasted on the back cover 11b, the surface containing the IC chip 3 swells as shown in FIG.
When the booklet-shaped printed matter 11 is bound in this state, there is a danger that the IC chip 3 is pressed by the text paper 11c bound inside the booklet-shaped printed matter 11, thereby applying pressure and causing damage or failure.

Therefore, a third aspect of the present invention is to provide a cover 11a of the booklet-like printed material 11 as shown in FIG.
Alternatively, the non-contact IC storage medium 1 is attached to a region near a corner on the inner surface of the back cover 11b, and the body paper 1 bound to the inside of the booklet-shaped printed matter 11 as shown in FIG.
When the IC 1c is overlapped and bound on the front cover 11a or the back cover 11b, especially the IC built in the non-contact IC storage medium 1 is used.
The notch 1 is formed in the vicinity of the corner of the text paper 11c so that the chip 3 and the text paper 11c do not overlap.
2 is provided.

As a result, as shown in FIG. 11, when the booklet-shaped printed matter 11 is bound, the non-contact IC
The IC chip 3 built in the storage medium 1 is used as the body paper 11c.
Thus, it is possible to avoid adverse effects such as failure due to receiving pressure. The shape of the cutout portion 12 formed in the vicinity of the text sheet may be a desired shape such as a corner cut or a rounded corner.

The booklet-shaped printed matter having the non-contact IC storage medium of the present invention is particularly effective when used for a bankbook, a passport or the like in which the booklet-shaped printed matter cannot be misused by a third party. In the IC chip 3, for example, collation data for certifying the identity such as face photograph data of the identity is stored, and the identity of the collation data is confirmed by wirelessly communicating a signal with an external device. This makes it possible to ensure certainty when using a booklet-shaped printed material such as a passport.

[0026]

As described above in detail, the booklet-shaped printed matter having the non-contact IC storage medium of the present invention is manufactured after the booklet-shaped printed matter main body and the non-contact IC storage medium are separately manufactured. Since the non-contact IC storage medium is affixed to the main body, there is no need to make the structure of the booklet-shaped printed matter main body special, and the booklet-shaped printed matter main body can be manufactured using ordinary paper. Non-contact IC at low cost
A booklet print that can be processed can be provided, and it can be produced with resource saving.

In addition, even when the non-contact IC storage medium is used for a booklet-like printed matter for which printing by a printer printing apparatus such as a passbook or the like is required, the non-contact IC storage medium can be used in the area around the corners of the front cover or the back cover. Has the effect of minimizing the adverse effect of the pressure on the IC chip of the non-contact IC module provided on the booklet by the feed roller in the printer. Moreover, even when the booklet-shaped printed matter is bound, the IC chip is devised so that the IC chip is not pressed by the body paper bound inside the booklet-shaped printed matter. Is expected to be very small.

[0028]

[Brief description of the drawings]

FIG. 1 is a plan view showing a state in which an upper sheet has been removed from a non-contact IC storage medium before die cutting.

FIG. 2 is a cross-sectional view of FIG. 1A-A.

FIG. 3 is a cross-sectional view showing a state where an adhesive layer and a release paper are provided on the non-contact IC storage medium of FIG. 2;

FIG. 4 is a cross-sectional view of the non-contact IC storage medium that has been cut out from the non-contact IC storage medium of FIG.

FIG. 5 is a cross-sectional view showing a state in which different types of non-contact IC modules are incorporated in FIG.

FIG. 6 is a cross-sectional view of the non-contact IC storage medium that has been die-cut from the non-contact IC storage medium before the die-cutting of FIG.

FIG. 7 is a perspective view showing a state in which a non-contact IC storage medium is attached with a booklet-shaped printed matter according to the present invention.

FIG. 8 is a sectional view taken along the line BB of FIG. 5;

FIG. 9 is a perspective view showing a state in which a notch is provided at a corner portion of a text sheet in the booklet-shaped printed matter according to the present invention.

10 is a perspective view showing a state in which the body paper of FIG. 9 is superimposed on the back cover side to which the non-contact IC storage medium is attached.

FIG. 11 is a plan view showing a state in which booklet-shaped printed materials according to the present invention are bound.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Non-contact IC storage medium 1a Non-contact IC storage medium seal 2a, 2b Sheet 3 IC chip 4 Receiving / transmitting coil 4a Coil printing 4b Coated copper wire 5 Non-contact IC module 6 Anisotropic conductive sheet 7, 7a, 7b Adhesive 8 Die-cut line 9 Adhesive 10 Release paper 11 Booklet-shaped printed matter 11a Front cover 11b Back cover 11c Body paper 12 Notch

Claims (4)

[Claims] 1. A non-contact IC storage medium having a non-contact IC module built between two superposed and bonded sheets is attached to the front or back cover of a book-like printed matter. Printed matter having a non-contact IC storage medium. 2. The non-contact IC storage medium according to claim 1, wherein the non-contact IC storage medium is attached to a region near a corner on an inner surface of a front cover or a back cover of the booklet-shaped printed matter. A booklet-shaped printed matter having a medium. 3. When the booklet-shaped printed matter is bound,
The IC chip portion contained in the non-contact IC storage medium affixed to the booklet-shaped printed matter, and the body paper bound inside the booklet-shaped printed matter do not overlap, so that the area near the corner of the body paper is 3. The printed matter having a non-contact IC storage medium according to claim 2, wherein a cutout portion is provided. 4. The booklet-shaped printed matter having a non-contact IC storage medium according to claim 1, wherein the booklet-shaped printed matter is a bankbook or a passport.