JP4306533B2 - Electronic component mounting equipment - Google Patents

Description

The present invention includes a plasma processing apparatus that performs predetermined processing by irradiating an object with plasma, and is used in an electronic component mounting apparatus that mounts electronic components on a wiring board.

  2. Description of the Related Art Conventionally, there has been known a technique for bonding objects to be bonded to each other such as an electronic component or a substrate after performing cleaning such as removal of an adsorbed substance and surface activation using plasma. The object to be bonded is cleaned in a chamber in a high vacuum state, and bonding is also performed in the chamber in order to prevent oxidation and contamination of the surface after cleaning.

In such an apparatus for joining, parts usable in a vacuum are provided in the chamber, the structure of the apparatus becomes complicated, and the apparatus becomes expensive. Therefore, techniques for simplifying the device structure have been proposed. For example, in Patent Document 1, a substrate on which only bump tips of electronic components are temporarily bonded is carried into a chamber for plasma cleaning, and then taken out of the chamber and exposed to the atmosphere. A technique for simplifying the structure of the apparatus by omitting expensive parts dedicated to a vacuum environment is disclosed by performing main joining that is largely crushed.
JP 2004-071610 A

  By the way, in the electronic component mounting apparatus disclosed in Patent Document 1, the substrate on which the electronic components are temporarily bonded is carried into the chamber and placed on the stage, and the chamber is closed and cleaning with plasma is performed. Later, the substrate is unloaded from the chamber. In such a mounting apparatus, a transfer robot for carrying the substrate in and out of the chamber and a gate for closing the opening of the chamber are required, the apparatus structure and operation are complicated, and there is a limit to improving the processing speed. In addition, a space for providing a stage and a space for advancing and retreating the transfer robot are required in the chamber, and there is a limit to downsizing the chamber.

  The present invention has been made in view of the above-described problems, and an object thereof is to further simplify the structure of a plasma processing apparatus that performs predetermined processing by irradiating an object with plasma.

  The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein the first chamber body in which an opening is formed and the substrate to be processed are held with respect to the first chamber body. A movable substrate holding portion, a first closing portion provided around the substrate holding portion that contacts the opening of the first chamber body and forms a first processing space together with the first chamber body, Applying a high frequency voltage between the pair of first electrodes disposed between the substrate held by the substrate holding part in the first processing space and the pair of first electrodes, the first processing A first plasma processing apparatus having a power source for generating plasma in a space; a second chamber body having an opening; and an electronic component to be processed, which is movable relative to the second chamber body Component holding portion and the second chamber A second closing portion provided around the component holding portion that contacts the opening of the body and forms a second processing space together with the second chamber body, and is held by the component holding portion in the second processing space. A pair of second electrodes arranged with the electronic component sandwiched therebetween, and a power source that generates a plasma in the second processing space by applying a high-frequency voltage between the pair of second electrodes. The substrate holding portion and the component up to a position where the second plasma processing apparatus, the electrode portion of the substrate held by the substrate holding portion, and the electrode portion of the electronic component held by the component holding portion come into contact with each other. A holding unit moving mechanism that moves the holding unit.

  A second aspect of the present invention is the electronic component mounting apparatus according to the first aspect, wherein one of the pair of first electrodes is provided on the board holding portion, and the pair of second electrodes. One of the electrodes is provided in the component holder.

  The invention according to claim 3 is the electronic component mounting apparatus according to claim 1 or 2, wherein the holding surface of the substrate holding portion of the first plasma processing apparatus, and the second plasma processing. The holding surfaces of the component holding portions of the apparatus face in opposite directions.

  A fourth aspect of the present invention is the electronic component mounting apparatus according to the third aspect, wherein the holding surface of the substrate holding portion of the first plasma processing apparatus faces vertically downward.

The invention according to claim 5 is an electronic component mounting apparatus for generating plasma in a processing space in which a substrate and an electronic component are arranged, and contacting and bonding the electrode portion of the substrate and the electrode portion of the electronic component, A first holding portion that holds the first holding portion, a first closing portion that is provided integrally with the first holding portion, a first holding portion that holds the electronic component and is relatively movable with respect to the first holding portion. 2 holding part, a second closing part that is provided integrally with the second holding part and forms a processing space together with the first closing part, and a chamber in which the first opening and the second opening are formed A first holding portion that holds the substrate, the first closing portion is provided in a ring around the first holding surface, and the second holding portion is an electron. A second holding surface for holding a component and facing in a direction opposite to the first holding surface; In a state in which a closing portion is provided annularly around the second holding surface, the first closing portion is in contact with the first opening, and the second closing portion is in contact with the second opening, The first closing part and the second closing part are arranged so that a processing space is formed .

The invention according to claim 6 is the electronic component mounting apparatus according to claim 5, wherein at least one of the first holding part and the second holding part is the first closing part and the second holding part. A mechanism for mounting the electronic component on the substrate by bringing the first holding surface closer to the second holding surface in a state where the closing portion is in contact with the first opening and the second opening .

  In the present invention, the structure of the plasma processing apparatus can be simplified. In addition, the structure of the plasma processing apparatus can be further simplified. Further, the manufacturing cost of the electronic component mounting apparatus can be reduced by simplifying the plasma processing apparatus. Furthermore, in the invention of claim 2, it is possible to perform an appropriate process on the object while holding the object in the holding unit.

  According to the invention of claim 3, the electronic component can be mounted on the wiring board in a short time. Furthermore, in the invention of claim 4, it is possible to easily hold the wiring board and the electronic component in the first plasma processing apparatus and the second plasma processing apparatus.

  In the invention of claim 5, the structure of the electronic component mounting apparatus can be simplified by utilizing the processing space for processing the wiring board and the electronic component at a time. In the invention of claim 6, the apparatus structure is further increased. It can be simplified. In the invention of claim 7, the reliability of mounting the electronic component on the wiring board can be improved.

  FIG. 1 is a plan view showing the configuration of the electronic component mounting apparatus 1 according to the first embodiment of the present invention. FIG. 2 shows the electronic component mounting apparatus 1 from the (−Y) side in FIG. It is the front view seen facing the + Y) direction. The electronic component mounting apparatus 1 is an apparatus for mounting an electronic component 91 on a wiring board 9 on which a wiring pattern is formed.

  As shown in FIGS. 1 and 2, the electronic component mounting apparatus 1 is configured to handle the wiring board 9, a first head 21 that holds the wiring board 9, and a board supply unit that supplies the wiring board 9 to the first head 21. 22, a first head moving mechanism 23 that moves the first head 21 in the X direction in FIG. 1, and a plasma to be described later on the wiring substrate 9 that is on the moving path of the first head 21 by the first head moving mechanism 23. The first chamber main body 24 used for the cleaning process is provided, and a substantially circular opening is formed on the (+ Z) side of the first chamber main body 24 having a substantially disc shape (for example, a disc shape having a diameter of 50 mm to 100 mm and a thickness of 10 mm). A portion 241 is formed.

  In addition, the electronic component mounting apparatus 1 is configured to handle the electronic component 91. The second head 31 that holds the electronic component 91, the component supply unit 32 that supplies the electronic component 91 to the second head 31, and the second head 31 are illustrated. The second head body 33 that moves in the Y direction in FIG. 1 and the second chamber body that is on the movement path of the second head 31 by the second head movement mechanism 33 and is used for the plasma cleaning process for the electronic component 91 A substantially circular opening 341 is formed on the (−Z) side of the second chamber body 34 that is substantially disk-shaped (for example, disk-shaped having a diameter of 30 mm and a thickness of 5 mm).

  The electronic component mounting apparatus 1 further includes an imaging unit 4 that images the wiring board 9 held by the first head 21 and the electronic component 91 held by the second head 31, and the imaging unit 4 is (+ Z). Two imaging windows 41 for imaging the side and the (−Z) side, and a camera advance / retreat mechanism 42 that integrally advances and retracts the two imaging windows 41 in the X direction. In the electronic component mounting apparatus 1, the electronic component 91 is mounted on the wiring board 9 by controlling these configurations by the control unit.

  The substrate supply unit 22 includes a pallet 221 on which a plurality of wiring boards 9 are placed, a stage 222 that holds the pallet 221, a stage moving mechanism 223 that moves the pallet 221 together with the stage 222 in the Y direction, and a plurality of pallets inside A magazine 224 for storing 221 is provided. The wiring board 9 on the pallet 221 is placed with the surface on which the electronic component 91 is mounted (hereinafter referred to as “mounting surface”) facing the (−Z) side. The substrate supply unit 22 further includes a pallet transport mechanism (not shown) that takes out one selected pallet 221 from the magazine 224 attached to the cover 10 and supplies the selected pallet 221 onto the stage 222.

  As shown in FIG. 2, the first head 21 includes a first chuck 211 that is a mechanical chuck that holds the wiring board 9 with the mounting surface facing the (−Z) side from the (+ Z) side. The first chuck 211 and the wiring substrate 9 held downward at the tip of the (−Z) side of the first chuck 211 are moved (lifted / lowered) in the Z direction by the lifting / lowering mechanism 210 provided inside the first head 21. And can be rotated about an axis directed in the Z direction by the rotation mechanism 210a.

  FIG. 3 is an enlarged view of the first chuck 211. The first chuck 211 includes a disc-shaped lid member 212 having a larger diameter than the opening 241 (see FIG. 1) of the first chamber body 24 at the tip of the (−Z) side. Is provided with a substrate holding part 213 for holding the wiring substrate 9 by a mechanical chuck. The substrate holding part 213 includes a substrate holding surface 214 for holding the wiring substrate 9, and the first chamber body 24 is closed around the substrate holding surface 214 facing vertically downward (that is, in the (−Z) direction). An annular blocking portion 215 used for the above is integrally provided with the substrate holding portion 213 as a part of the lid member 212. In other words, the substrate holding surface 214 is provided inside the closing portion 215.

  FIG. 4 is a cross-sectional view showing the vicinity of the first chamber body 24. In the electronic component mounting apparatus 1, the substrate holding unit 213 is movable with respect to the first chamber body 24 by the first head moving mechanism 23 (see FIG. 1), and above the first chamber body 24 (that is, (+ Z)). The closed portion 215 contacts the outer periphery of the opening 241 from the outside of the first chamber body 24 with the substrate holding surface 214 facing the opening 241. Thereby, the closing part 215 forms a processing space 242 for generating plasma together with the substrate holding part 213 and the first chamber main body 24, and the wiring substrate 9 held on the substrate holding surface 214 of the substrate holding part 213 is processed in the processing space 242. Located within.

  The lid member 212 of the first chuck 211 is provided with an insulator 217 at a site in contact with the first chamber body 24. The portion of the lid member 212 excluding the insulator 217 is formed of a conductor such as metal and is connected to the high frequency power supply 25 to function as an electrode. Hereinafter, the part formed of the conductor of the lid member 212 is referred to as “electrode 216”. The first chamber body 24 formed of a conductor such as metal is grounded and electrically insulated from the electrode 216 by the insulator 217. The electrode 216 and the first chamber body 24 function as a pair of electrodes arranged with the wiring substrate 9 held in the processing space 242 interposed therebetween. Note that the electrode 216 may be provided so as to include the substrate holding portion 213 as shown in FIG. 4 as long as it is provided on the substrate holding portion 213, or the electrode 216 may be provided on the substrate holding portion 213 formed of an insulator. It may be provided inside as a metal plate or the like (the same applies to an electrode 317 described later and the following embodiments).

  In the electronic component mounting apparatus 1, a high frequency voltage is applied from the high frequency power supply 25 to the electrode 216 in the processing space 242 in a predetermined reduced pressure atmosphere, and a high frequency voltage is applied between the electrode 216 and the first chamber body 24. Plasma is generated. As a result, plasma is irradiated to the wiring board 9 inside the first chamber body 24, and unnecessary substances such as water and organic substances adhering to the electrode part formed of gold (Au) of the wiring board 9 are removed. Furthermore, modification such as excitation of the electrode surface and removal of adsorbed substances in the vicinity of the surface (for example, unnecessary substances such as carbon (C) and oxygen (O) adsorbed to a depth of about 10 nm from the surface). And a so-called plasma cleaning process is performed on the electrode portion.

  As described above, in the electronic component mounting apparatus 1, the plasma cleaning process for the wiring substrate 9 is realized by each configuration of the first chamber body 24, the first chuck 211, and the high-frequency power source 25. Hereinafter, these configurations are referred to as a first plasma processing mechanism 20. The electrode paired with the electrode 216 is not necessarily the first chamber body 24 itself, and may be provided as a part of the first chamber body 24 at a position facing the electrode 216 across the wiring board 9. In addition, it may be provided inside the processing space 242 separately from the first chamber body 24. Moreover, the electrode part of the wiring board 9 is not limited to gold, For example, metals, such as copper (Cu), aluminum (Al), tin (Sn), may be sufficient (About the electrode part of the electronic component 91 mentioned later) The same is true.)

  The component supply unit 32 that supplies the electronic component 91 to the second head 31 illustrated in FIG. 1 includes a pallet 321 on which a plurality of electronic components 91 are placed, a stage 322 that holds the pallet 321, and the pallet 321 together with the stage 322 in the X direction. A stage moving mechanism 323 that moves to the inside, and a magazine 324 that houses a plurality of pallets 321 therein. The electronic component 91 on the pallet 321 is placed with the surface on which the electrode portion is formed (the surface to be bonded to the wiring board 9, hereinafter referred to as “bonding surface”) facing the (+ Z) side. Is done. The electrode part of the electronic component 91 is typically a ball bump or plating bump formed of gold on an electrode pattern, or may be the electrode pattern itself.

  The component supply unit 32 further includes a component extraction tool 325 that extracts and holds the electronic component 91 from the pallet 321, and an extraction tool moving mechanism 326 that moves the component extraction tool 325 in the Y direction. 91 is supplied to the second head 31 via the component extraction tool 325. The component supply unit 32 further includes a pallet conveyance mechanism (not shown) that takes out one selected pallet 321 from the magazine 324 attached to the cover 10 and supplies the selected pallet 321 onto the stage 322.

  As shown in FIG. 2, the second head 31 includes a second chuck 311 that sucks and holds the electronic component 91 with the bonding surface directed to the (+ Z) side from the (−Z) side, and is attached to the tip of the second chuck 311. The electronic component 91 held upward can be moved (lifted / lowered) in the Z direction together with the second chuck 311 by the lifting / lowering mechanism 310 provided in the second head 31.

  FIG. 5 is an enlarged view of the second chuck 311, and the second chuck 311 has substantially the same structure as the first chuck 211 shown in FIG. 3. The second chuck 311 is provided with a disk-shaped lid member 312 having a diameter larger than the opening 341 (see FIG. 1) of the second chamber body 34 at the (+ Z) side tip. A component holding unit 313 that holds the electronic component 91 is provided. The component holding unit 313 includes a suction path 3131 for vacuum suction at the center, and sucks and holds the electronic component 91 on the component holding surface 314 by performing suction from a suction port formed at the tip. An annular closing portion 315 used for closing the second chamber body 34 is provided integrally with the component holding portion 313 around the component holding surface 314 facing vertically upward (that is, in the (+ Z) direction). . Further, the second chuck 311 includes a heater 316 that heats the electronic component 91 via the component holding unit 313.

  FIG. 6 is a cross-sectional view showing the vicinity of the second chamber body 34, and the second chamber body 34 has substantially the same structure as the first chamber body 24 shown in FIG. In the electronic component mounting apparatus 1, the component holding unit 313 can be moved with respect to the second chamber body 34 by the second head moving mechanism 33 (see FIG. 1), and the closing unit 315 is located below the second chamber body 34. Then, the component holding surface 314 is opposed to the opening 341 and comes into contact with the outer periphery of the opening 341 from the outside of the second chamber body 34. Accordingly, the closing portion 315 forms a processing space 342 for generating plasma together with the component holding portion 313 and the second chamber main body 34, and the electronic component 91 held on the component holding surface 314 of the component holding portion 313 is processed in the processing space 342. Located within.

  The second chuck 311 is provided with an electrode 317 so as to include the component holding portion 313 and is connected to the high frequency power source 35. The second chamber body 34 formed of a conductor such as metal is grounded, and is electrically insulated from the electrode 317 by an insulator 318 provided on the second chuck 311. Thus, the electrode 317 and the second chamber body 34 function as a pair of electrodes arranged with the electronic component 91 held in the processing space 342 interposed therebetween.

  In the electronic component mounting apparatus 1, the second chamber main body 34, the second chuck 311 and the high frequency power source 35 function as the second plasma processing mechanism 30 and, like the first plasma processing mechanism 20 shown in FIG. In the processing space 342, the electronic component 91 is irradiated with plasma to perform a plasma cleaning process.

  7 and 8 are diagrams illustrating the flow of the mounting operation of the electronic component 91 by the electronic component mounting apparatus 1. In FIG. 7, for the convenience of illustration, the operation (steps S15 to S18) of holding the electronic component 91 and performing the plasma cleaning process after the operation of holding the wiring substrate 9 and performing the plasma cleaning process (steps S11 to S14). Although the flow of the mounting operation is shown as being performed, in the actual electronic component mounting apparatus 1, the cycle time (the average time required for mounting one electronic component 91 is also referred to as “tact”) is shortened. Therefore, the operations shown in steps S11 to S14 and the operations shown in steps S15 to S18 are performed in parallel.

  When the electronic component 91 is mounted on the wiring board 9 by the electronic component mounting apparatus 1, first, the position in the Y direction of the pallet 221 on which the plurality of wiring boards 9 are placed as shown in FIG. A wiring board 9 that is adjusted by the stage moving mechanism 223 and is to be mounted with the electronic component 91 under the head 21 is disposed below the first chuck 211. Subsequently, the first chuck 211 is lowered by the elevating mechanism 210 (see FIG. 2), and is lifted after holding the wiring substrate 9 on the pallet 221 by the substrate holding portion 213 (see FIG. 3), whereby the first head 21 is moved. The supply of the wiring board 9 to is completed (step S11). Hereinafter, the position of the first head 21 when the wiring board 9 is supplied is referred to as a “board supply position”.

  Next, the first chuck 211 that holds the wiring substrate 9 downward is moved in the (+ X) direction from the substrate supply position by the first head moving mechanism 23 and positioned above the first chamber body 24 (step S12). . The first chuck 211 is lowered by the elevating mechanism 210 and closes the opening 241 of the first chamber body 24 as shown in FIG. 4, whereby the first plasma having the processing space 242 in which the wiring substrate 9 is accommodated. The processing mechanism 20 is configured (step S13).

  When the first chamber body 24 is closed, the air in the processing space 242 is exhausted and depressurized to about 1 Pa (pascal), and then a processing gas such as argon (Ar) gas is supplied to A predetermined reduced-pressure atmosphere is set. At this time, the pressure in the processing space 242 is about 10 Pa. Next, in this reduced pressure environment, the high frequency power supply 25 is activated and the wiring substrate 9 is irradiated with plasma, and the first plasma processing mechanism 20 performs a plasma cleaning process on the wiring substrate 9 (step S14). In the first plasma processing mechanism 20, since the distance between the electrode 216 arranged with the wiring substrate 9 interposed therebetween and the first chamber body 24 which is a pair of electrodes is small (so-called narrow gap), plasma cleaning is performed. Processing can be performed in a short time.

  As described above, in the electronic component mounting apparatus 1, in parallel with the operations shown in steps S11 to S14, the position in the X direction of the pallet 321 on which the plurality of electronic components 91 shown in FIG. The electronic component 91 to be mounted is adjusted below the component extraction tool 325 by being adjusted by the stage moving mechanism 323 below the component 325. Subsequently, after the component extraction tool 325 is lowered by an elevator mechanism (not shown) and sucks and holds the electronic component 91 on the pallet 321, the component extraction tool 325 is moved in the (−Y) direction by the extraction tool moving mechanism 326 and moved to the second head 31. Located above the second chuck 311. Next, the second chuck 311 is lifted by the elevating mechanism 310 (see FIG. 2), and the electronic component 91 held by the component picking tool 325 is sucked and held by the component holding portion 313 (see FIG. 5) and lowered. The electronic component 91 is supplied to the second head 31 (step S15). Hereinafter, the position of the second head 31 when the electronic component 91 is supplied is referred to as a “component supply position”.

  When the electronic component 91 is supplied to the second head 31, the second chuck 311 that holds the electronic component 91 upward is moved in the (−Y) direction from the component supply position by the second head moving mechanism 33, and the second head 311. It is located below the chamber body 34 (step S16). Subsequently, the second chuck 311 is raised by the elevating mechanism 310 and closes the opening 341 of the second chamber main body 34 as shown in FIG. 6, thereby having a processing space 342 in which the electronic component 91 is accommodated. The two plasma processing mechanism 30 is configured (step S17).

  When the second chamber main body 34 is closed, the processing space 342 is in a predetermined reduced pressure atmosphere like the processing space 242. Note that when the pressure is reduced, the shutter provided in the suction path 3131 is closed, and leakage of air from the suction path 3131 to the processing space 342 is prevented. The electronic component 91 is simply placed on the component holding unit 313. Subsequently, the high frequency power source 35 is activated to irradiate the electronic component 91 with plasma, and a plasma cleaning process is performed on the electronic component 91 by the second plasma processing mechanism 30 (step S18). Also in the second plasma processing mechanism 30, since the distance between the electrode 317 and the second chamber body 34 is small, the plasma cleaning process can be performed in a short time.

  When the plasma cleaning process for the wiring substrate 9 and the electronic component 91 is completed, air is supplied to the processing space 242 and the processing space 342 and returned to the atmospheric pressure. In parallel with this, suction by the component holding unit 313 is resumed. Thus, the electronic component 91 is again sucked and held on the component holding surface 314 of the component holding portion 313.

  Subsequently, the first head 21 is raised by the elevating mechanism 210 (see FIG. 2) to move away from the first chamber body 24, and is moved in the (+ X) direction by the first head moving mechanism 23. Located at the position indicated by. At the same time, the second head 31 is lowered by the elevating mechanism 310 (see FIG. 2) and is separated from the second chamber body 34, and is moved in the (−Y) direction by the second head moving mechanism 33 in FIG. Is located at a position indicated by a two-dot chain line, that is, a position below the first head 21 and facing the substrate holding surface 214 (step S21). At this time, the wiring board 9 is held by the board holding surface 214 with the mounting surface facing down, and the electronic component 91 is the component holding surface 314 of the second head 31 facing the direction opposite to the board holding surface 214. Is held with the joint surface facing upward. In the electronic component mounting apparatus 1, the electronic component 91 is mounted on the wiring board 9 from the above arrangement. In the following description, the positions of the first head 21 and the second head 31 when the electronic component 91 is mounted ( That is, the positions indicated by two-dot chain lines in FIG. 1 are referred to as “mounting positions”.

  When the first head 21 and the second head 31 are located at the mounting position, the two imaging windows 41 are moved in the (−X) direction by the camera advance / retreat mechanism 42 of the imaging unit 4, and are indicated by a two-dot chain line in FIG. 1. Located in position. FIG. A and FIG. B is an enlarged view of the vicinity of the first chuck 211 and the second chuck 311. FIG. FIG. As shown to A, the two imaging windows 41 are located between the 1st chuck | zipper 211 and the 2nd chuck | zipper 311 which oppose, and the upper wiring board 9 is imaged through the imaging window 41 of the (+ Z) side. At the same time, the lower electronic component 91 is imaged through the (−Z) side imaging window 41 (step S22).

  Next, based on the images of the wiring board 9 and the electronic component 91 acquired by the imaging unit 4, the first head moving mechanism 23 and the second head moving mechanism 33 shown in FIG. The relative positions in the X direction and the Y direction are adjusted, the orientation of the wiring board 9 is adjusted by the rotation mechanism 210a shown in FIG. 2, and the alignment (alignment) between the wiring board 9 and the electronic component 91 is completed (step S23). ).

  When the alignment is completed, the two imaging windows 41 are integrally moved in the (+ X) direction by the camera advancing / retreating mechanism 42, and between the first chuck 211 and the second chuck 311, FIG. Retreat to the position shown in B. FIG. As shown in B, the first chuck 211 is lowered by the elevating mechanism 210 (see FIG. 2), the second chuck 311 is raised by the elevating mechanism 310 (see FIG. 2), and the wiring held by the substrate holding unit 213 The electrode part of the substrate 9 and the electrode part of the electronic component 91 held by the component holding part 313 and heated by the heater 316 are brought into contact with each other in the atmosphere and are metal-bonded to each other. Is completed (step S24). At this time, since the surface of the electrode portion of the wiring board 9 and the electronic component 91 is subjected to plasma cleaning treatment, strong coupling due to the atomic force between the gold atoms occurs between the two electrode portions, and the electronic component 91 is It is firmly attached to the wiring board 9. The electronic component 91 may be mounted on the wiring board 9 by moving the component holding unit 313 relative to the board holding unit 213. For example, the electronic component 91 may be mounted by raising only the component holding unit 313. It may be broken.

  When the mounting of the electronic component 91 is completed, the suction holding of the electronic component 91 by the second chuck 311 is released, and the wiring substrate 9 on which the electronic component 91 is mounted (hereinafter referred to as “mounted substrate 9”) is a substrate holding unit. 213 only. The first chuck 211 is lifted together with the mounted substrate 9 by the elevating mechanism 210 shown in FIG. 2, and is moved from the mounting position to the (−X) direction by the first head moving mechanism 23 to return to the substrate supply position. Subsequently, the first chuck 211 is lowered to place the mounted substrate 9 on the pallet 221. In parallel with these operations, the second chuck 311 also moves in the (+ Y) direction from the mounting position and returns to the component supply position. In the electronic component mounting apparatus 1, the electronic components 91 are sequentially mounted on the plurality of wiring boards 9 on the pallet 221, and when the mounting on all the wiring boards 9 is completed, the pallet 221 is moved out of the electronic component mounting apparatus 1. It is unloaded and sealed with resin in a later process.

  As described above, in the first plasma processing mechanism 20 of the electronic component mounting apparatus 1, the processing space 242 is formed by the first chuck 211 and the first chamber body 24, and is held by the first chuck 211 in the processing space 242. Since the plasma cleaning process is performed on the printed wiring board 9, the first plasma processing mechanism 20 is compared with a conventional apparatus that requires a transfer robot or the like for carrying an object in and out of the plasma processing chamber. This structure can be further simplified, and the first plasma processing mechanism 20 can be downsized. Similarly, the structure of the second plasma processing mechanism 30 can be further simplified and downsized. As a result, the manufacturing cost of the electronic component mounting apparatus 1 can be reduced.

  Further, in the first plasma processing mechanism 20, the opening 241 of the first chamber body 24 is closed by the closing portion 215 provided integrally around the substrate holding surface 214, and thus the structure of the first plasma processing mechanism 20. Can be further simplified. Further, since the electrode 216 is provided on the substrate holding part 213, an appropriate plasma cleaning process can be performed while the wiring board 9 is held on the substrate holding part 213. Similarly, the structure of the second plasma processing mechanism 30 can be further simplified, and an appropriate plasma cleaning process can be performed while the electronic component 91 is held on the component holding portion 313.

  In the electronic component mounting apparatus 1, since the substrate holding surface 214 and the component holding surface 314 face in directions opposite to each other, mounting is performed without changing the orientation of the wiring substrate 9 and the electronic component 91 after the plasma cleaning process. The electronic component 91 can be mounted on the wiring board 9 in a short time. As a result, in the mounting by metal bonding in the atmosphere, it is possible to suppress the re-adsorption of unnecessary substances on the surface of the electrode part after the plasma cleaning process and to mount the electronic component 91 reliably. As described above, the structure of the plasma processing mechanism of the electronic component mounting apparatus 1 is particularly suitable for the plasma cleaning process for the wiring substrate 9 just before the electronic component 91 is mounted and the electronic component 91 just before being mounted on the wiring substrate 9. Yes.

  In the electronic component mounting apparatus 1, the substrate holding surface 214 is directed vertically downward, and the object held downward in the processing space 242 in a reduced pressure atmosphere (which is difficult to be sucked and held) is compared with the electronic component 91. Therefore, the wiring substrate 9 and the electronic component 91 can be easily held in the first plasma processing mechanism 20 and the second plasma processing mechanism 30.

  FIG. 10 is a sectional view showing a plasma processing mechanism 20a of the electronic component mounting apparatus according to the second embodiment of the present invention. In the electronic component mounting apparatus according to the second embodiment, one chamber main body 24a is provided instead of the first chamber main body 24 and the second chamber main body 34 of the electronic component mounting apparatus 1 shown in FIG. Other configurations are substantially the same as those in FIG. 1, and the same reference numerals are given in the following description.

  The chamber main body 24a is provided between the first head 21 and the second head 31 at the mounting position indicated by a two-dot chain line in FIG. 1, and as shown in FIG. 10, the first chuck 211 and the second chuck 311 are provided. Along with the high-frequency power supply 25, it functions as a plasma processing mechanism 20a that simultaneously performs a plasma cleaning process on the wiring board 9 and the electronic component 91. A substantially circular upper opening 241a and lower opening 241b are formed on the (+ Z) side and (−Z) side of the substantially disc-shaped chamber body 24a, respectively.

  In the plasma processing mechanism 20a, the closing portion 215 of the first chuck 211 contacts the outer periphery of the upper opening 241a, and the closing portion 315 of the second chuck 311 contacts the outer periphery of the lower opening 241b. A substrate holding part 213, a closing part 315, a component holding part 313, a processing space 242 a for generating plasma by the chamber body 24 a, and a wiring board 9 held on the board holding surface 214 of the substrate holding part 213; The electronic component 91 held on the component holding surface 314 of the component holding unit 313 is located in the processing space 242a.

  The electrode 216 of the first chuck 211 and the electrode 317 of the second chuck 311 are arranged with the wiring substrate 9 and the electronic component 91 in the processing space 242a interposed therebetween. The electrode 216 and the electrode 317 are the insulator 217 and the insulator 318, respectively. Is electrically insulated. The electrode 317 is grounded. In the plasma processing mechanism 20a, a high frequency voltage is applied between the electrode 216 and the electrode 317 by the high frequency power supply 25 in the processing space 242a in a predetermined reduced pressure atmosphere to generate plasma, and the wiring substrate 9 and the electronic component 91 are protected. A plasma cleaning process is performed in a lump.

  When the plasma cleaning process of the wiring substrate 9 and the electronic component 91 by the plasma processing mechanism 20a is completed, the first chuck 211 and the second chuck 311 are separated from the chamber main body 24a, and the chamber main body 24a is moved by the moving mechanism (not shown) to the first chuck 211. Then, the wiring board 9 and the electronic component 91 are aligned by the imaging unit 4 as in the case of the first embodiment. Thereafter, the first chuck 211 is lowered, the second chuck 311 is raised, the electrode part of the wiring board 9 held by the board holding part 213, and the electrons held by the component holding part 313 and heated by the heater 316. When the electrode parts of the component 91 are in contact with each other in the atmosphere and are metal-bonded, the mounting of the electronic component 91 on the wiring board 9 is completed. The movement of the component holding unit 313 relative to the board holding unit 213 during mounting may be relative.

  In the electronic component mounting apparatus according to the second embodiment, the structure of the electronic component mounting apparatus can be simplified by using the processing space 242a for processing the wiring board 9 and the electronic component 91 at a time. Further, similarly to the electronic component mounting apparatus 1 according to the first embodiment, the structure of the plasma processing mechanism 20a can be further simplified, and the manufacturing cost of the electronic component mounting apparatus can be reduced. Furthermore, the electronic component 91 can be mounted on the wiring board 9 in a short time.

  In the plasma processing mechanism 20a, since the electrodes 216 and 317 are provided on the substrate holding unit 213 and the component holding unit 313, an appropriate plasma cleaning process can be performed while holding the wiring substrate 9 and the electronic component 91. Further, the wiring board 9 and the electronic component 91 can be easily held by mechanically holding the wiring board 9 upward.

  FIG. 11 is a cross-sectional view showing a plasma processing mechanism 20b of an electronic component mounting apparatus according to the third embodiment of the present invention. The plasma processing mechanism 20b is different from the plasma processing mechanism 20a shown in FIG. 10 except that a substrate advancing / retracting mechanism 218 for advancing / retreating the wiring substrate 9 held on the substrate holding surface 214 below the closing portion 215 is provided in the substrate holding portion 213. The same reference numerals are used in the following description.

  In the electronic component mounting apparatus according to the third embodiment, after the alignment of the wiring board 9 and the electronic component 91 is performed, the closing portion 215 of the first chuck 211 and the closing portion 315 of the second chuck 311 are the chamber body. In the processing space 242a in contact with the upper opening 241a and the lower opening 241b of 24a and in a predetermined reduced pressure atmosphere, the plasma cleaning process is performed on the wiring board 9 and the electronic component 91 in the same manner as in the second embodiment. .

  Subsequently, the substrate holding surface 214 holding the wiring substrate 9 by the substrate advance / retreat mechanism 218 moves in a direction away from the closing portion 215 of the first chuck 211 (that is, the (−Z) direction), whereby the processing space 242a. Inside, the substrate holding surface 214 approaches the component holding surface 314 that holds the electronic component 91. And the electrode part of the wiring board 9 hold | maintained at the board | substrate holding surface 214 located in the position shown with a dashed-two dotted line in FIG. 11, and the electrode part of the electronic component 91 hold | maintained at the component holding part 313 and heated, However, the mounting of the electronic component 91 on the wiring board 9 is completed by contacting and metal-bonding in the processing space 242a. Note that in the electronic component mounting apparatus according to the third embodiment, a mechanism that advances and retracts the component holding surface 314 on which the electronic component 91 is placed is used together with the board advance / retreat mechanism 218 or instead of the board advance / retreat mechanism 218. The electronic component 91 may be mounted by the mechanism provided in the holding unit 313.

  In the electronic component mounting apparatus according to the third embodiment, the plasma with respect to the wiring substrate 9 is processed in the processing space 242a in a predetermined reduced-pressure atmosphere without exposing the wiring substrate 9 and the electronic component 91 subjected to the plasma cleaning process to the atmosphere. Since the component 91 is mounted, it is possible to prevent unnecessary substances from being re-adsorbed on the surface of the electrode part after the plasma cleaning process, and to improve the reliability of mounting the electronic component 91 on the wiring board 9.

  Further, similarly to the electronic component mounting apparatus according to the second embodiment, the structure of the electronic component mounting apparatus is simplified by using the processing space 242a for processing the wiring board 9 and the electronic component 91 at a time. Can do. In addition, the electronic component 91 can be mounted on the wiring board 9 in a short time. In the plasma processing mechanism 20b, the wiring board 9 and the electronic component 91 are easily held by holding the wiring board 9 on the upper side, and further, an appropriate plasma cleaning process is performed while being held by the electrodes provided in the holding unit. Can do.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

  For example, the plasma processing mechanism is not limited to the shape and configuration described in the above embodiment, and may be configured as shown in FIGS. 12 and 13, for example. In FIGS. 12 and 13, a pair of electrodes provided with the wiring substrate 9 and the electronic component 91 that are processing objects sandwiched therebetween, and a high-frequency power source that applies a high-frequency voltage between the pair of electrodes are illustrated. Omitted.

  In the plasma processing mechanism 20c shown in FIG. 12, the substrate holding portion 213a of the first chuck 211a that holds the wiring substrate 9 is inserted into the chamber main body 24b from the opening 241c formed on the side of the chamber main body 24b. A closing portion 215a provided integrally with the holding portion 213a contacts the opening 241c from the outside of the chamber body 24b. Thereby, the processing space 242b is formed by the closing portion 215a and the chamber body 24b, and the wiring board 9 held by the substrate holding portion 213a is positioned in the processing space 242b. By adopting such a configuration, the structure of the plasma processing mechanism 20c can be simplified. Note that the pair of electrodes used for generating plasma may be disposed in the processing space 242b with the wiring substrate 9 interposed therebetween, or may be provided in the chamber body 24b and the substrate holding portion 213a.

  The plasma processing mechanism 20d shown in FIG. 13 includes a first chuck 211b that holds the wiring substrate 9, and a bottomed cylindrical second chuck 311a that can move relative to the first chuck 211b. The first chuck 211b has the same configuration as that of the first chuck 211 shown in FIG. 3, and includes a substrate holding portion 213b that holds the wiring substrate 9, and a closing portion 215b that is provided integrally with the substrate holding portion 213b. Is provided. In addition, a component holding portion 313a for holding the electronic component 91 is provided at the center of the inner bottom surface of the second chuck 311a. The cylindrical portion of the second chuck 311a and the portion around the bottom component holding portion 313a are It becomes the obstruction | occlusion part 315a provided integrally with respect to the component holding part 313a.

  In the plasma processing mechanism 20d, the closing portion 315a of the second chuck 311a contacts the closing portion 215b of the first chuck 211b. Accordingly, a processing space 242c is formed by the substrate holding portion 213b and the closing portion 215b of the first chuck 211, and the component holding portion 313a and the closing portion 315a of the second chuck 311, and the wiring board held by the substrate holding portion 213b. 9 and the electronic component 91 held by the component holding portion 313a are located in the processing space 242c. The plasma processing mechanism 20d includes the plasma processing mechanism 20d because the plasma cleaning process is performed on the wiring substrate 9 and the electronic component 91 held at the substrate holding unit 213b and the component holding unit 313a at a time in the processing space 242c. The structure of the electronic component mounting apparatus can be simplified.

  In the plasma processing mechanism, the wiring substrate and the electronic component may be cleaned by a fast atom beam (FAB) including a plasma, an ion beam, or the like. The gas used for plasma cleaning is not limited to argon, and may be nitrogen, oxygen, fluorine, hydrogen, or the like.

  The mechanism for holding the wiring board 9 in the board holding part 213 is not limited to the mechanical chuck. For example, if the wiring board 9 can be held from above even under a reduced pressure environment, the wiring board 9 is held by electrostatic force, for example. An electrostatic chuck that attracts may be employed.

  The electronic component mounting apparatus is particularly suitable for mounting fine electronic components such as semiconductor light emitting elements such as LED chips and semiconductor lasers, but is also suitable for mounting other electronic components. Further, the object to be processed may be, for example, a film substrate, a three-dimensional circuit substrate, a package that accommodates an electronic component or the like (used for joining the package body and the lid), and the like.

  Furthermore, the plasma processing mechanism that forms the processing space by the closing portion integrally provided with the holding portion and the chamber main body can be applied to various plasma processing performed in fields other than mounting electronic components.

  The present invention is applicable to a plasma processing apparatus that performs a predetermined process such as a cleaning process by irradiating various objects such as a wiring board and an electronic component with plasma.

The top view which shows the structure of the electronic component mounting apparatus which concerns on 1st Embodiment Front view showing the configuration of the electronic component mounting apparatus Enlarged view showing the first chuck Sectional view showing the vicinity of the first chamber body Enlarged view showing the second chuck Sectional view showing the vicinity of the second chamber body Diagram showing the flow of electronic component mounting operation Diagram showing the flow of electronic component mounting operation Enlarged view showing the vicinity of the first chuck and the second chuck Enlarged view showing the vicinity of the first chuck and the second chuck Sectional drawing which shows the plasma processing mechanism which concerns on 2nd Embodiment Sectional drawing which shows the plasma processing mechanism which concerns on 3rd Embodiment The figure which shows the other example of a plasma processing mechanism The figure which shows the other example of a plasma processing mechanism

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 9 Wiring board 20 1st plasma processing mechanism 20a, 20b, 20c, 20d Plasma processing mechanism 24 1st chamber main body 24a, 24b Chamber main body 25, 35 High frequency power supply 30 2nd plasma processing mechanism 34 2nd chamber main body 91 Electronic parts 210, 310 Elevating mechanism 213, 213a, 213b Substrate holding part 214 Substrate holding surface 215, 215a, 215b, 315, 315a Closure part 216, 317 Electrode 218 Substrate advance / retreat mechanism 241, 241c, 341 Opening part 241a Upper opening part 241b Lower opening 242, 242a, 242b, 242c, 342 Processing space 313, 313a Component holder 314 Component holding surface S11-S18, S21-S24 Step

Claims (6)

An electronic component mounting apparatus for mounting electronic components on a substrate,
A first chamber body in which an opening is formed; a substrate holder that holds a substrate to be processed and is movable relative to the first chamber body; and the first chamber that abuts against the opening of the first chamber body. A first closing portion provided around the substrate holding portion that forms a first processing space together with the main body, and a pair disposed with the substrate held by the substrate holding portion in the first processing space. A first plasma processing apparatus comprising: a first power source configured to generate a plasma in the first processing space by applying a high-frequency voltage between the pair of first electrodes;
A second chamber body in which an opening is formed; a component holder that holds electronic components to be processed and is movable with respect to the second chamber body; and the second chamber body abuts against the opening of the second chamber body. A second closing portion provided around the component holding portion that forms a second processing space together with the chamber main body, and the electronic component held by the component holding portion in the second processing space A second plasma processing apparatus comprising: a pair of second electrodes; and a power source for generating a plasma in the second processing space by applying a high-frequency voltage between the pair of second electrodes,
A holding portion that moves the substrate holding portion and the component holding portion to a position where the electrode portion of the substrate held by the substrate holding portion and the electrode portion of the electronic component held by the component holding portion come into contact with each other. A moving mechanism;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 1,
One of the pair of first electrodes is provided on the substrate holding part,
Wherein one of the pair of second electrodes, the electronic component mounting apparatus characterized in that it is provided in the component holder. The electronic component mounting apparatus according to claim 1 or 2,
An electronic component mounting apparatus, wherein a holding surface of the substrate holding portion of the first plasma processing apparatus and a holding surface of the component holding portion of the second plasma processing apparatus face in opposite directions. The electronic component mounting apparatus according to claim 3,
An electronic component mounting apparatus, wherein a holding surface of the substrate holding part of the first plasma processing apparatus faces vertically downward. An electronic component mounting apparatus for generating plasma in a processing space in which a substrate and an electronic component are arranged, and joining the electrode portion of the substrate and the electrode portion of the electronic component in contact with each other,
A first holding unit for holding a substrate;
A first closing portion provided integrally with the first holding portion;
A second holding unit that holds an electronic component and is movable relative to the first holding unit;
A second closing portion provided integrally with the second holding portion and forming a processing space together with the first closing portion;
A chamber main body formed with a first opening and a second opening,
The first holding part includes a first holding surface for holding the substrate, and the first closing part is provided annularly around the first holding surface,
The second holding part holds an electronic component and includes a second holding surface facing in a direction opposite to the first holding surface, and the second closing part is provided annularly around the second holding surface,
The first blocking portion and the first blocking portion are formed so that the processing space is formed in a state where the first blocking portion is in contact with the first opening and the second blocking portion is in contact with the second opening. An electronic component mounting apparatus, wherein a second closing portion is arranged . The electronic component mounting apparatus according to claim 5 ,
At least one of the first holding part and the second holding part is configured such that the first closing part and the second closing part are in contact with the first opening part and the second opening part. An electronic component mounting apparatus comprising: a mechanism for mounting an electronic component on a substrate by bringing a holding surface closer to the second holding surface.

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