JP7401480B2 - Chip component transport means and mounting equipment equipped with the same - Google Patents
Chip component transport means and mounting equipment equipped with the same Download PDFInfo
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- JP7401480B2 JP7401480B2 JP2021059942A JP2021059942A JP7401480B2 JP 7401480 B2 JP7401480 B2 JP 7401480B2 JP 2021059942 A JP2021059942 A JP 2021059942A JP 2021059942 A JP2021059942 A JP 2021059942A JP 7401480 B2 JP7401480 B2 JP 7401480B2
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- 238000000034 method Methods 0.000 claims description 76
- 230000032258 transport Effects 0.000 description 23
- 238000010586 diagram Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
本発明は前工程の保持手段で吸着保持されていたチップ部品を受け取り、後工程の保持手段まで搬送して受け渡すチップ部品搬送手段およびこれを備えた実装装置に関する。 The present invention relates to a chip component conveying means that receives a chip component that has been suction-held by a holding means in a previous process, and transports it to a holding means in a subsequent process, and a mounting apparatus equipped with the same.
チップ部品を基板等に実装する実装装置において、前工程から実装部にチップ部品を搬送する際に、接合面を下に向けた状態で搬送するのが一般的である。 In a mounting apparatus that mounts a chip component on a substrate or the like, when the chip component is transported from a pre-process to a mounting section, it is common to transport the chip component with the bonding surface facing downward.
例えば図９に示すように、電極Ｅを有する面を接合面としてチップ部品を搬送する際は、チップスライダ８に電極Ｅが触れる状態で搬送する。これにより、実装工程においてボンディングヘッドがチップ部品Ｃの非接合面を保持するうえで都合がよい。 For example, as shown in FIG. 9, when a chip component is transported with the surface having the electrode E as a bonding surface, the chip component is transported with the electrode E touching the chip slider 8. This is convenient for the bonding head to hold the non-bonding surface of the chip component C during the mounting process.
従来の実装においては、はんだのように酸化膜に覆われている電極を用いることが多く、接合面がチップスライダ等と接触していても後工程に大きな影響を及ぼすことはなかった。 In conventional mounting, electrodes covered with an oxide film, such as solder, are often used, and even if the bonding surface comes into contact with a chip slider or the like, it does not have a major effect on subsequent processes.
しかし、高精度実装が進む昨今では、接合条件の低温化、低圧力化が求められ、接合面を活性化（酸化膜や不純物膜の除去）した状態で実装する要求が増している。ところが、図１０のようにチップ部品Ｃの接合面にプラズマ処理Ｐ等を施しても、図９のような搬送法式では、接合面が汚染されて表面活性が失われてしまう。 However, with the recent advances in high-precision mounting, there is a need for lower temperature and lower pressure bonding conditions, and there is an increasing demand for mounting with the bonding surface activated (removal of oxide films and impurity films). However, even if the bonding surface of the chip component C is subjected to plasma treatment P or the like as shown in FIG. 10, in the transport method as shown in FIG. 9, the bonding surface will be contaminated and the surface activity will be lost.
そこで、接合面に接触することなくチップ部品を保持して搬送する手法が種々検討されている。例えば、特許文献１では、チップ部品を浮上させる方法が提案されている。この方法では、図１１に示すように気流または超音波を利用したチップ部品浮上手段７１を有するチップ部品浮上ステージ７を用いる。すなわち、図１１（ａ）のようにチップ部品Ｃの非接合面を保持した保持手段９をチップ部品浮上ステージ７上に配置してから、チップ部品Ｃの吸着保持を解除して、図１１（ｂ）のようにチップ部品Ｃが浮上状態でチップ部品浮上ステージ７に保持する。図１１（ｂ）の状態において、チップ部品Ｃはチップ部品浮上ステージと接触していないので、接合面の汚染が防げる。 Therefore, various methods of holding and transporting chip components without contacting the bonding surfaces have been studied. For example, Patent Document 1 proposes a method of floating chip components. In this method, as shown in FIG. 11, a chip component floating stage 7 having a chip component floating means 71 using air current or ultrasonic waves is used. That is, after placing the holding means 9 holding the non-bonding surface of the chip component C on the chip component floating stage 7 as shown in FIG. As shown in b), the chip component C is held in a floating state on the chip component floating stage 7. In the state shown in FIG. 11(b), since the chip component C is not in contact with the chip component floating stage, contamination of the bonding surface can be prevented.
そこで、図１１（ｂ）の状態のチップ部品浮上手段７を図９のチップスライダ８と同様に用いることで、図１２のようにチップ部品Ｃの接合面に非接触な状態でチップ部品を搬送することは可能である。しかし、チップ部品Ｃをバランスよく浮上させながら搬送する必要があるため、チップスライダ８に比べて搬送速度が劣り、実装のタクトタイムにも影響を及ぼす。 Therefore, by using the chip component floating means 7 in the state shown in FIG. 11(b) in the same manner as the chip slider 8 in FIG. 9, the chip component is transported without contacting the joint surface of the chip component C as shown in FIG. It is possible to do so. However, since it is necessary to transport the chip component C while floating it in a well-balanced manner, the transport speed is inferior to that of the chip slider 8, which also affects the takt time of mounting.
本発明は、このような課題に鑑みてなされたものであり、チップ部品の接合面に接触することなく、しかも従来と同等の速さでチップ部品を搬送することが可能なチップ部品搬送手段およびこれを備えた実装装置を提供するものである。 The present invention has been made in view of these problems, and provides a chip component transporting means and a chip component transporting means that can transport chip components at the same speed as the conventional method without contacting the joint surfaces of the chip components. A mounting device equipped with this is provided.
上記の課題を解決するために、請求項１に記載の発明は、
前工程の保持手段で吸着保持されていたチップ部品を受け取り、後工程の保持手段まで搬送して受け渡すチップ部品搬送手段であって、
前記前工程の保持手段および前記後工程の保持手段のそれぞれに脱着可能で、前記チップ部品を直接保持するアタッチメントを備え、
前記アタッチメントが、前記前工程の保持手段または前記後工程の保持手段の減圧流路と連通して前記チップ部品を吸着する第１減圧流路と、前記第１減圧流路と独立した第２減圧流路を有するチップ部品搬送手段である。
In order to solve the above problem, the invention according to claim 1,
A chip component conveying means that receives a chip component held by suction by a holding means in a previous process, and transports and delivers it to a holding means in a subsequent process,
an attachment that is removable from each of the holding means of the pre-process and the holding means of the post-process and directly holds the chip component;
The attachment includes a first reduced pressure channel that communicates with a reduced pressure channel of the holding means in the pre-process or the holding means in the subsequent step to adsorb the chip component, and a second reduced pressure channel that is independent of the first reduced pressure channel. This is a chip component transport means having a flow path.
請求項２に記載の発明は、
前工程の保持手段で吸着保持されていたチップ部品を受け取り、後工程の保持手段まで搬送して受け渡すチップ部品搬送手段であって、
前記チップ部品を直接保持するアタッチメントと、前記アタッチメントを保持して、前記前工程の保持手段から前記後工程の保持手段に移動するアタッチメントスライダを備え、
前記アタッチメントは、前記前工程の保持手段または前記後工程の保持手段の減圧流路と連結して前記チップ部品を吸着する第１減圧流路と、前記第１減圧流路と独立して前記アタッチメントスライダが有する減圧流路に連結する第２減圧流路を有するチップ部品搬送手段である。
The invention according to claim 2 is
A chip component conveying means that receives a chip component held by suction by a holding means in a previous process, and transports and delivers it to a holding means in a subsequent process,
comprising an attachment that directly holds the chip component, and an attachment slider that holds the attachment and moves from the holding means in the pre-process to the holding means in the post-process,
The attachment includes a first vacuum channel that adsorbs the chip component by being connected to a vacuum channel of the holding means of the pre-process or the holding means of the post-process, and a first vacuum channel that is independent of the first vacuum channel. The chip component conveying means has a second pressure reduction channel connected to the pressure reduction channel included in the slider.
請求項３に記載の発明は、請求項２に記載のチップ部品搬送手段であって、
前記アタッチメントスライダは、前記チップ部品に接触することなく前記アタッチメントを保持するチップ部品搬送手段である。
The invention according to claim 3 is the chip component conveying means according to claim 2,
The attachment slider is a chip component conveying means that holds the attachment without coming into contact with the chip component.
請求項４に記載の発明は、請求項１から請求項３のいずれかに記載のチップ部品搬送手段を備えた実装装置であって、
前記後工程の保持手段がボンディングヘッドであって、
前記チップ部品を保持した状態の前記アタッチメントを前記ボンディングヘッドが保持してチップ部品の実装を行う実装装置である。
The invention according to claim 4 is a mounting apparatus comprising the chip component conveying means according to any one of claims 1 to 3,
The holding means in the post-process is a bonding head,
The mounting apparatus is a mounting apparatus in which the bonding head holds the attachment holding the chip component and performs mounting of the chip component.
本発明により、チップ部品の接合面に接触することなく、しかも従来と同等の速さでチップ部品を搬送することが可能となり、接合面の活性化を維持した状態の実装をタクトタイムに大きな影響を及ぼすことなく実現できる。 The present invention makes it possible to transport chip components at the same speed as before without contacting the bonding surface of the chip component, and has a significant impact on takt time when mounting while maintaining the activation of the bonding surface. This can be achieved without causing any adverse effects.
本発明の実施形態について図を用いて説明する。図１は本発明の実施形態に係るチップ部品搬送手段１の構成を示す断面図であり、図２はチップ部品搬送手段１がチップ部品Ｃを保持している状態の断面図である。 Embodiments of the present invention will be described using figures. FIG. 1 is a cross-sectional view showing the configuration of a chip component transport means 1 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the chip component transport means 1 holding a chip component C.
チップ部品搬送手段１は、前工程の保持手段で吸着保持されていたチップ部品Ｃを受け取り、後工程の保持手段まで搬送して受け渡すものであり、アタッチメント２とアタッチメントスライダ３を構成要素としており、アタッチメントスライダ３は図示していない搬送レールにより前工程の保持手段と後工程の保持手段の間を移動する。 The chip component conveyance means 1 receives the chip component C that has been suction-held by the holding means in the previous process, and conveys it to the holding means in the subsequent process and delivers it thereto, and has an attachment 2 and an attachment slider 3 as its constituent elements. , the attachment slider 3 is moved between the holding means in the preceding process and the holding means in the subsequent process by means of a transport rail (not shown).
アタッチメント２は、図２に示すようにチップ部品Ｃを吸着保持する減圧流路を有しているが、第１減圧流路２１Ｖと第２減圧流路２２Ｖという２系統の独立した流路が存在する。ここで、第１減圧流路２１Ｖと第２減圧流路２２Ｖはいずれも一端がチップ部品Ｃを保持する面で開口している。なお、図２においてチップ部品Ｃの電極Ｅがある面が接合面であり、アタッチメント２はチップ部品Ｃの非接合面を保持する。 As shown in FIG. 2, the attachment 2 has a reduced pressure channel for adsorbing and holding the chip component C, but there are two independent channels, a first reduced pressure channel 21V and a second reduced pressure channel 22V. do. Here, one end of each of the first reduced pressure channel 21V and the second reduced pressure channel 22V is open at the surface that holds the chip component C. In addition, in FIG. 2, the surface of the chip component C where the electrode E is located is the bonding surface, and the attachment 2 holds the non-bonding surface of the chip component C.
アタッチメントスライダ３はアタッチメント２を保持するもので、アタッチメントスライダ２を保持した状態においてアタッチメント２の第２減圧流路２２Ｖ（のチップ部品吸着面と反対の端）と連結する減圧流路３２Ｖを有しており、減圧流路３２Ｖは第２減圧流路用真空系ＶＣ２に連通している。また、アタッチメントスライダ３はアタッチメント２を保持した状態おいてもチップ部品Ｃには接触しない形状を有している。 The attachment slider 3 holds the attachment 2, and has a reduced pressure passage 32V that connects with the second reduced pressure passage 22V (the end opposite to the chip component adsorption surface) of the attachment 2 while holding the attachment slider 2. The reduced pressure channel 32V communicates with the second reduced pressure channel vacuum system VC2. Furthermore, the attachment slider 3 has a shape that does not come into contact with the chip component C even when the attachment 2 is held.
以下、チップ部品搬送手段１が前工程の保持手段で保持されていたチップ部品Ｃを受け取り、後工程の保持手段まで搬送して受け渡す工程について説明する。 Hereinafter, a process will be described in which the chip component conveyance means 1 receives the chip component C held by the holding means in the previous process, and transports it to the holding means in the subsequent process and delivers it.
本実施形態の説明においては、まず図１１のような状態で浮上しているチップ部品Cを前工程の保持手段が保持する段階から説明する。ただし、チップ部品浮上ステージ７は固定状態とする。 In the description of this embodiment, first, the stage where the chip component C floating in the state shown in FIG. 11 is held by the holding means in the previous process will be explained. However, the chip component floating stage 7 is kept in a fixed state.
図３（ａ）は、前工程の保持手段４が、浮上状態のチップ部品Ｃの上側に配置された状態であるが、前工程の保持手段４は減圧流路４０Ｖを減圧することでアタッチメント２を保持している。また、保持手段４は、アタッチメント２を保持した状態においてアタッチメント２の第１減圧流路２１Ｖ（のチップ部品吸着面と反対の端）と連結する減圧流路４１Ｖを有しており、減圧流路４１Ｖは第１減圧流路用真空系ＶＣ１に連通している。 In FIG. 3(a), the holding means 4 in the previous process is placed above the chip component C in the floating state. is held. In addition, the holding means 4 has a reduced pressure passage 41V that connects with the first reduced pressure passage 21V (an end opposite to the chip component adsorption surface) of the attachment 2 in a state where the attachment 2 is held. 41V is connected to the vacuum system VC1 for the first reduced pressure channel.
図３（ａ）の状態から前工程の保持手段４を降下させるとアタッチメント２がチップ部品の非接合面に接触し、この状態で第１減圧流路用真空系ＶＣ１を作動させることにより（図３（ｂ））、チップ部品Ｃはアタッチメント２に吸着し、チップ部品浮上ステージ７から受け渡される（図３（ｃ））。 When the holding means 4 in the previous step is lowered from the state shown in FIG. 3(a), the attachment 2 comes into contact with the non-bonding surface of the chip component. 3(b)), the chip component C is attracted to the attachment 2 and transferred from the chip component floating stage 7 (FIG. 3(c)).
この後、図４（ａ）に示すように、アタッチメント２の下にアタッチメントスライダ３が移動し、前工程の保持手段４を降下させ、図４（ｂ）のようにアタッチメントスライダ３にアタッチメント２を密着させる。この状態において、アタッチメント２の第２減圧流路２２Ｖとアタッチメントスライダ３の減圧流路３２Ｖは連結され、この状態で第２減圧流路用真空系ＶＣ２を作動させることにより、第１減圧流路用真空系ＶＣ１を停止してもチップ部品Ｃはアタッチメント２に保持された状態を維持できる。このため、前工程の保持手段４は、アタッチメント２を保持するためのアタッチメント吸着用真空系Ｖ０を停止してから上昇することで、アタッチメント２の保持を解除できる（図４（Ｃ））。すなわち、チップ部品Ｃを保持したチップ部品保持手段１として分離する
この後、アタッチメントスライダ３は第２減圧流路用真空系ＶＣ２を作動させた状態で、チップ部品搬送手段１は、図５に示すように（図示しない搬送レールに沿って）後工程に向かって移動する。
After that, as shown in FIG. 4(a), the attachment slider 3 moves below the attachment 2, lowers the holding means 4 of the previous process, and moves the attachment 2 onto the attachment slider 3 as shown in FIG. 4(b). Bring it into close contact. In this state, the second reduced pressure channel 22V of the attachment 2 and the reduced pressure channel 32V of the attachment slider 3 are connected, and by operating the vacuum system VC2 for the second reduced pressure channel in this state, the second reduced pressure channel 22V of the attachment slider 3 is connected. Even if the vacuum system VC1 is stopped, the chip component C can remain held by the attachment 2. Therefore, the holding means 4 in the previous process can release the holding of the attachment 2 by stopping the attachment suction vacuum system V0 for holding the attachment 2 and then rising (FIG. 4(C)). That is, the chip component holding means 1 holding the chip component C is separated. After this, the attachment slider 3 is in a state where the vacuum system VC2 for the second reduced pressure channel is operated, and the chip component conveying means 1 is moved as shown in FIG. (along a transport rail, not shown) toward the subsequent process.
ところで、図５のアタッチメント２とアタッチメントスライダ３によってチップ部品Cが密閉空間に封入されるような構造をチップ部品搬送手段１が有しているのであれば、密閉空間内に不活性ガスを封入するような構成にすることにより、搬送途上における接合面の酸化や窒化が抑制できる。 By the way, if the chip component transport means 1 has a structure in which the chip component C is sealed in a sealed space by the attachment 2 and the attachment slider 3 shown in FIG. 5, an inert gas is sealed in the sealed space. With such a configuration, oxidation and nitridation of the bonding surface during transportation can be suppressed.
チップ部品Ｃを吸着保持したチップ部品保持手段１は、図６（ａ）のように後工程の保持手段５の直下に移動した後に、図６（ｂ）のように後工程の保持手段５がアタッチメント５に接触する。この状態において、アタッチメント吸着用真空系Ｖ０を作動させることで、後工程の保持手段にアタッチメント２が密着保持されるとともに、アタッチメント２の第１減圧流路２１Ｖと後工程の保持手段５の減圧流路５１Ｖは連結される。また、この状態で第１減圧流路用真空系ＶＣ１を作動させることにより、第２減圧流路用真空系ＶＣ２を停止してもチップ部品Ｃはアタッチメント２に保持された状態を維持できる。このため、後工程の保持手段５は、第２減圧流路用真空系ＶＣ２を停止してから上昇することで、図６（ｃ）のように、後工程の保持手段５に保持されたアタッチメント２をアタッチメントスライダ３から分離することができる。 The chip component holding means 1 holding the chip component C by suction is moved directly below the holding means 5 in the post-process as shown in FIG. 6(a), and then the holding means 5 in the post-process is moved as shown in FIG. Contact attachment 5. In this state, by activating the attachment adsorption vacuum system V0, the attachment 2 is held in close contact with the holding means in the subsequent process, and the reduced pressure flow between the first reduced pressure passage 21V of the attachment 2 and the holding means 5 in the subsequent process is performed. The path 51V is connected. Furthermore, by operating the first vacuum system VC1 for the vacuum channel in this state, the state in which the chip component C is held by the attachment 2 can be maintained even if the second vacuum system VC2 for the vacuum channel is stopped. For this reason, the holding means 5 in the post-process is raised after stopping the vacuum system VC2 for the second decompression flow path, so that the attachment held by the holding means 5 in the post-process is removed as shown in FIG. 6(c). 2 can be separated from the attachment slider 3.
以上の図４から図６において示したように、本発明において、前工程から後工程の移動において、チップ部品Ｃは真空吸着によってアタッチメント２にしっかりと固定されているため、アタッチメントスライダ３を従来のチップスライダと同様な速さで移動させても問題はなく、チップ移動の時間に起因したタクトタイムの増加はない。また、前工程の保持手段で吸着保持されていたチップ部品Ｃを受け取り、後工程の保持手段まで搬送して受け渡す過程においてチップ部品Ｃの接合面が他の物体に接触することは一切ないため、接合面の汚染が防げる。 As shown in FIGS. 4 to 6 above, in the present invention, the chip component C is firmly fixed to the attachment 2 by vacuum suction during movement from the front process to the back process, so the attachment slider 3 is There is no problem even if it is moved at the same speed as the chip slider, and there is no increase in takt time due to the time taken to move the chip. In addition, the joint surface of the chip component C never comes into contact with any other object during the process of receiving the chip component C that was held by suction by the holding means in the previous process and transporting it to the holding device in the subsequent process. , preventing contamination of the joint surface.
チップ部品Ｃ接合面の汚染が防げることから、本発明のチップ部品搬送手段１を実装装置への適用が好適である。すなわち、後工程の保持手段５をボンディングヘッドとして用いることが望ましい。 Since contamination of the bonding surface of the chip component C can be prevented, it is preferable to apply the chip component conveying means 1 of the present invention to a mounting apparatus. That is, it is desirable to use the holding means 5 in the subsequent process as a bonding head.
図７、８は、本発明の後工程の保持手段５をボンディングヘッドとしてチップ部品Ｃを実装する例を示している。図７（ａ）はアタッチメントスライダ３が退避した状態であり、図７（ｂ）はアタッチメント２が保持するチップ部品Ｃの下に基板Ｓを保持する基板ステージ６を配置してチップ部品Ｃと基板Ｓの位置合わせを行なっている状態である。また、図８（ａ）はボンディングヘッド（後工程の保持手段）５を降下して、チップ部品Ｃを基板に密着して実装している乗田であり、図８（ｂ）は第１減圧流路用真空系ＶＣ１を停止してボンディングヘッド５を上昇させた状態を示している。 7 and 8 show an example in which a chip component C is mounted using the holding means 5 in the post-process of the present invention as a bonding head. 7(a) shows the state in which the attachment slider 3 is retracted, and FIG. 7(b) shows the state in which the substrate stage 6 holding the substrate S is placed under the chip component C held by the attachment 2. This is a state in which positioning of S is being performed. In addition, FIG. 8(a) shows Norida lowering the bonding head (holding means for post-processing) 5 and mounting the chip component C in close contact with the board, and FIG. 8(b) shows the first reduced pressure flow. This shows a state in which the road vacuum system VC1 is stopped and the bonding head 5 is raised.
なお、図８（ｂ）における後工程の保持手段５をボンディングヘッドとして用いる場合に限らず、後工程完了後に、後工程の保持手段５がアタッチメント２を保持している状態だと、次にチップ部品Ｃを保持したアタッチメント２を保持することが困難であるため、後工程完了後は、アタッチメント吸着用真空系Ｖ０を停止してアタッチメント２を脱着して回収するのが望ましい。 Note that, not only when the holding means 5 in the post-process shown in FIG. Since it is difficult to hold the attachment 2 holding the component C, it is desirable to stop the attachment suction vacuum system V0 and detach and collect the attachment 2 after the post-process is completed.
以上、本発明においてアタッチメントスライダ３がアタッチメント２を保持してチップ部品を搬送する例について説明したが、図１に示すようにアタッチメント２が減圧流路２１Vと第２減圧流路２２Vを有する構成においては、真空系に連通したチューブ等を第２減圧流路２２Vに連結するだけで、第１減圧流路２１Vを用いた吸着を解除してもチップ部品Cをアタッチメント２で保持することが出来る。このため、アタッチメント２を図９に示したチップスライダとして用いることも可能である。 In the above, an example in which the attachment slider 3 holds the attachment 2 and transports a chip component in the present invention has been described. However, as shown in FIG. By simply connecting a tube or the like communicating with the vacuum system to the second depressurizing channel 22V, the chip component C can be held by the attachment 2 even after the suction using the first decompressing channel 21V is released. Therefore, it is also possible to use the attachment 2 as a chip slider shown in FIG.
１ チップ部品搬送手段
２ アタッチメント
３ アタッチメントスライダ
４ 前工程の保持手段
５ 後工程の保持手段（ボンディングヘッド）
６ 基板ステージ
７ チップ部品浮上ステージ
２１Ｖ 第１減圧流路
２２Ｖ 第２減圧流路
３２Ｖ 減圧流路
４０Ｖ 減圧流路（アタッチメント吸着用）
４１Ｖ 減圧流路（チップ部品吸着用）
５０Ｖ 減圧流路（アタッチメント吸着用）
５１Ｖ 減圧流路（チップ部品吸着用）
７１ チップ部品浮上手段
Ｃ チップ部品
Ｅ 電極（チップ部品の電極）
ＥＳ 電極（基板の電極）
Ｓ 基板
Ｖ０ アタッチメント吸着用真空系
ＶＣ１ 第１減圧流路用真空系
ＶＣ２ 第２減圧流路用真空系
1 Chip component transport means 2 Attachment 3 Attachment slider 4 Pre-process holding means 5 Post-process holding means (bonding head)
6 Substrate stage 7 Chip component floating stage 21V 1st reduced pressure channel 22V 2nd reduced pressure channel 32V Reduced pressure channel 40V Reduced pressure channel (for attachment adsorption)
41V pressure reduction channel (for adsorption of chip parts)
50V pressure reduction channel (for attachment adsorption)
51V pressure reduction channel (for adsorption of chip parts)
71 Chip component floating means C Chip component E Electrode (electrode of chip component)
ES electrode (substrate electrode)
S Substrate V0 Attachment suction vacuum system
VC1 Vacuum system for the first reduced pressure channel VC2 Vacuum system for the second reduced pressure channel
Claims (4)
後工程の保持手段まで搬送して受け渡すチップ部品搬送手段であって、
前記前工程の保持手段および前記後工程の保持手段のそれぞれに脱着可能で、前記チップ部品を直接保持するアタッチメントを備え、
前記アタッチメントが、前記前工程の保持手段または前記後工程の保持手段の減圧流路と連通して前記チップ部品を吸着する第１減圧流路と、前記第１減圧流路と独立した第２減圧流路を有するチップ部品搬送手段。 Receive the chip parts that were held by suction by the holding means in the previous process,
A chip component transport means for transporting and delivering to a holding means in a subsequent process,
an attachment that is removable from each of the holding means of the pre-process and the holding means of the post-process and directly holds the chip component;
The attachment includes a first reduced pressure channel that communicates with a reduced pressure channel of the holding means in the pre-process or the holding means in the subsequent step to adsorb the chip component, and a second reduced pressure channel that is independent of the first reduced pressure channel. A chip component transport means having a flow path.
後工程の保持手段まで搬送して受け渡すチップ部品搬送手段であって、
前記チップ部品を直接保持するアタッチメントと、
前記アタッチメントを保持して、前記前工程の保持手段から前記後工程の保持手段に移動するアタッチメントスライダを備え、
前記アタッチメントは、前記前工程の保持手段または前記後工程の保持手段の減圧流路と連通して前記チップ部品を吸着する第１減圧流路と、前記第１減圧流路と独立して前記アタッチメントスライダが有する減圧流路に連通する第２減圧流路を有するチップ部品搬送手段。 Receive the chip parts that were held by suction by the holding means in the previous process,
A chip component transport means for transporting and delivering to a holding means in a subsequent process,
an attachment that directly holds the chip component;
an attachment slider that holds the attachment and moves from the holding means of the pre-process to the holding means of the post-process,
The attachment includes a first vacuum channel that adsorbs the chip component by communicating with a vacuum channel of the holding means of the pre-process or the holding means of the post-process, and a first vacuum channel that is independent of the first vacuum channel. A chip component conveying means having a second pressure reduction channel communicating with a pressure reduction channel included in the slider.
前記アタッチメントスライダは、前記チップ部品に接触することなく前記アタッチメントを保持するチップ部品搬送手段。 The chip component conveying means according to claim 2,
The attachment slider is a chip component conveying means that holds the attachment without coming into contact with the chip component.
前記後工程の保持手段がボンディングヘッドであって、
前記チップ部品を保持した状態の前記アタッチメントを前記ボンディングヘッドが保持してチップ部品の実装を行う実装装置。 A mounting apparatus comprising the chip component conveying means according to any one of claims 1 to 3,
The holding means in the post-process is a bonding head,
A mounting apparatus in which the bonding head holds the attachment holding the chip component and performs mounting of the chip component.
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