JP4301456B2 - 密閉容器の蓋開閉システム - Google Patents
密閉容器の蓋開閉システム Download PDFInfo
- Publication number
- JP4301456B2 JP4301456B2 JP2006314191A JP2006314191A JP4301456B2 JP 4301456 B2 JP4301456 B2 JP 4301456B2 JP 2006314191 A JP2006314191 A JP 2006314191A JP 2006314191 A JP2006314191 A JP 2006314191A JP 4301456 B2 JP4301456 B2 JP 4301456B2
- Authority
- JP
- Japan
- Prior art keywords
- opening
- nozzle
- pod
- gas
- curtain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
Description
Claims (1)
- 複数のウエハを水平に並置して内部に収容可能であってその一つの面に開口を有する箱状の本体と、前記本体から分離可能であって前記開口を塞いで前記本体と共に密閉空間を形成する蓋と、を備える収容容器から前記蓋を取り外すことによって前記開口を開放して前記複数のウエハ各々の挿脱を可能とする、前記蓋の開閉システムであって、
前記収容容器が載置される載置台と、
前記載置台に隣接して前記開口と正対する矩形状の開口部と、
前記蓋を保持可能であると共に前記開口部を閉止可能であり、前記蓋を保持して前記開口部を開放することにより前記開口と前記開口部とを連通させるドアと、
前記開口部に関して前記載置台が配置される側と反対側において、前記矩形状の開口部の一辺である上辺の外側に配置されて前記上辺の対辺である下辺に向かって不活性ガスを線状に放出可能なカーテンノズルと、
前記カーテンノズルよりも前記収容容器内部側であって前記開口部の両側辺の外側に配置され、前記複数のウエハの各々の間に一致するように配置されて前記ウエハの中心部に向けて前記不活性ガスを供給するノズル開口を各々有して前記両側辺の延在方向に各々延在する一対のパージノズルと、を有し、
前記パージノズル各々のノズル開口は、前記矩形状の開口部の両側部の辺に隣接して前記カーテンノズルのノズル開口より前記収容容器内部側に配置されることを特徴とする蓋開閉システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006314191A JP4301456B2 (ja) | 2005-11-30 | 2006-11-21 | 密閉容器の蓋開閉システム |
US11/563,863 US7726353B2 (en) | 2005-11-30 | 2006-11-28 | Lid opening/closing system of an airtight container |
KR1020060118679A KR100799411B1 (ko) | 2005-11-30 | 2006-11-29 | 기밀 용기의 뚜껑 개폐 시스템 |
TW095144098A TWI324371B (en) | 2005-11-30 | 2006-11-29 | Lid opening/closing system of an airtight container |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005346083 | 2005-11-30 | ||
JP2006314191A JP4301456B2 (ja) | 2005-11-30 | 2006-11-21 | 密閉容器の蓋開閉システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007180516A JP2007180516A (ja) | 2007-07-12 |
JP4301456B2 true JP4301456B2 (ja) | 2009-07-22 |
Family
ID=38283777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006314191A Active JP4301456B2 (ja) | 2005-11-30 | 2006-11-21 | 密閉容器の蓋開閉システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US7726353B2 (ja) |
JP (1) | JP4301456B2 (ja) |
KR (1) | KR100799411B1 (ja) |
TW (1) | TWI324371B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9536765B2 (en) | 2013-06-06 | 2017-01-03 | Tdk Corporation | Load port unit and EFEM system |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4012190B2 (ja) | 2004-10-26 | 2007-11-21 | Tdk株式会社 | 密閉容器の蓋開閉システム及び開閉方法 |
JP4278676B2 (ja) | 2005-11-30 | 2009-06-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
JP4194051B2 (ja) * | 2006-05-31 | 2008-12-10 | Tdk株式会社 | 防塵機能を備えたロードポート装置及びミニエンバイロンメントシステム |
CA2849554C (en) * | 2006-07-26 | 2016-09-06 | Health Robotics S.R.L. | Machine for the preparation of pharmaceutical products |
US9105673B2 (en) * | 2007-05-09 | 2015-08-11 | Brooks Automation, Inc. | Side opening unified pod |
JP4264115B2 (ja) * | 2007-07-31 | 2009-05-13 | Tdk株式会社 | 被収容物の処理方法及び当該方法に用いられる蓋開閉システム |
JP4309935B2 (ja) * | 2007-07-31 | 2009-08-05 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
JP5048590B2 (ja) * | 2008-05-30 | 2012-10-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5095511B2 (ja) * | 2008-06-05 | 2012-12-12 | 株式会社日立産機システム | エアシャワー装置 |
JP4748816B2 (ja) * | 2008-11-28 | 2011-08-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
US9275884B2 (en) * | 2011-03-25 | 2016-03-01 | Novellus Systems, Inc. | Systems and methods for inhibiting oxide growth in substrate handler vacuum chambers |
JP5494734B2 (ja) * | 2011-08-15 | 2014-05-21 | Tdk株式会社 | パージ装置及び該パージ装置を有するロードポート装置 |
JP2013161924A (ja) * | 2012-02-03 | 2013-08-19 | Tokyo Electron Ltd | 基板収容容器のパージ装置及びパージ方法 |
US20140157722A1 (en) * | 2012-12-04 | 2014-06-12 | Tdk Corporation | Lid opening/closing system for closed container, and substrate processing method using the same |
JP6260109B2 (ja) * | 2013-05-16 | 2018-01-17 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
US9841671B2 (en) * | 2013-07-03 | 2017-12-12 | Murata Machinery, Ltd. | Storage container |
JP6268425B2 (ja) | 2013-07-16 | 2018-01-31 | シンフォニアテクノロジー株式会社 | Efem、ロードポート、ウェーハ搬送方法 |
US9607873B2 (en) * | 2014-02-07 | 2017-03-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and operation method thereof |
JP6226190B2 (ja) * | 2014-02-20 | 2017-11-08 | Tdk株式会社 | パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置 |
US10217656B2 (en) * | 2014-03-17 | 2019-02-26 | Murata Machinery, Ltd. | Purge apparatus and purge method |
JP6287515B2 (ja) * | 2014-04-14 | 2018-03-07 | Tdk株式会社 | Efemシステム及び蓋開閉方法 |
JP6686014B2 (ja) | 2014-10-24 | 2020-04-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ファクトリインターフェースで基板キャリアをパージするシステム、装置及び方法 |
JP6459682B2 (ja) * | 2015-03-20 | 2019-01-30 | Tdk株式会社 | ガスパージ装置、ロードポート装置およびガスパージ方法 |
KR102430627B1 (ko) * | 2015-03-25 | 2022-08-16 | 주식회사 케이씨텍 | 개폐부 및 이를 구비하는 기판처리 장치 |
JP6492884B2 (ja) * | 2015-03-31 | 2019-04-03 | Tdk株式会社 | ロードポート装置 |
ITUB20156790A1 (it) | 2015-12-11 | 2017-06-11 | Ms Printing Solutions S R L | Impianto di stampa, in particolare di stampa digitale, di materiale fibroso in foglio e procedimento di stampa, in particolare di stampa digitale, su detto materiale fibroso in foglio |
US10741432B2 (en) | 2017-02-06 | 2020-08-11 | Applied Materials, Inc. | Systems, apparatus, and methods for a load port door opener |
US10446428B2 (en) | 2017-03-14 | 2019-10-15 | Applied Materials, Inc. | Load port operation in electronic device manufacturing apparatus, systems, and methods |
KR102143208B1 (ko) * | 2018-09-13 | 2020-08-12 | 주식회사 케이씨티 | 에어 커튼 유닛을 구비하는 lpm 및 lpp 시스템 |
KR102146517B1 (ko) * | 2018-11-14 | 2020-08-21 | 주식회사 저스템 | 웨이퍼 용기로의 외기 유입을 차단하는 외기 차단 장치 및 이를 포함하는 반도체 장치 |
TWI723329B (zh) * | 2019-01-19 | 2021-04-01 | 春田科技顧問股份有限公司 | 裝載埠及其氣簾裝置與吹淨方法 |
US20210035842A1 (en) * | 2019-07-31 | 2021-02-04 | Asm Ip Holding B.V. | Cassette lid opening device |
KR102528195B1 (ko) * | 2020-12-16 | 2023-05-03 | 주식회사 싸이맥스 | 에어커튼 장치 |
KR102765337B1 (ko) * | 2021-12-23 | 2025-02-11 | 주식회사 저스템 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0536808A (ja) * | 1991-07-18 | 1993-02-12 | Toshiba Corp | 半導体製造装置 |
JP2533459Y2 (ja) * | 1991-11-14 | 1997-04-23 | 大日本スクリーン製造株式会社 | 基板表面処理室の基板搬入口/搬出口遮断装置 |
JPH06302669A (ja) * | 1993-04-12 | 1994-10-28 | Kokusai Electric Co Ltd | 半導体製造装置換気方法 |
JPH07183354A (ja) * | 1993-12-24 | 1995-07-21 | Tokyo Electron Ltd | 基板の搬送システム及び基板の搬送方法 |
JPH08203985A (ja) * | 1995-01-20 | 1996-08-09 | Matsushita Electric Ind Co Ltd | 基板移し替え装置 |
JP3722604B2 (ja) | 1997-11-13 | 2005-11-30 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3769417B2 (ja) * | 1999-06-30 | 2006-04-26 | 株式会社東芝 | 基板収納容器 |
JP2003007799A (ja) | 2001-06-21 | 2003-01-10 | Tokyo Electron Ltd | 処理システム |
JP3880343B2 (ja) * | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
JP2004235516A (ja) | 2003-01-31 | 2004-08-19 | Trecenti Technologies Inc | ウエハ収納治具のパージ方法、ロードポートおよび半導体装置の製造方法 |
JP4027837B2 (ja) | 2003-04-28 | 2007-12-26 | Tdk株式会社 | パージ装置およびパージ方法 |
US20040237244A1 (en) * | 2003-05-26 | 2004-12-02 | Tdk Corporation | Purge system for product container and interface seal used in the system |
JP4585514B2 (ja) | 2004-06-21 | 2010-11-24 | 株式会社ライト製作所 | ロードポート |
JP4012190B2 (ja) | 2004-10-26 | 2007-11-21 | Tdk株式会社 | 密閉容器の蓋開閉システム及び開閉方法 |
-
2006
- 2006-11-21 JP JP2006314191A patent/JP4301456B2/ja active Active
- 2006-11-28 US US11/563,863 patent/US7726353B2/en active Active
- 2006-11-29 KR KR1020060118679A patent/KR100799411B1/ko active IP Right Grant
- 2006-11-29 TW TW095144098A patent/TWI324371B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9536765B2 (en) | 2013-06-06 | 2017-01-03 | Tdk Corporation | Load port unit and EFEM system |
Also Published As
Publication number | Publication date |
---|---|
TW200735256A (en) | 2007-09-16 |
US7726353B2 (en) | 2010-06-01 |
KR100799411B1 (ko) | 2008-01-30 |
US20070151619A1 (en) | 2007-07-05 |
KR20070057003A (ko) | 2007-06-04 |
JP2007180516A (ja) | 2007-07-12 |
TWI324371B (en) | 2010-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4301456B2 (ja) | 密閉容器の蓋開閉システム | |
JP4278676B2 (ja) | 密閉容器の蓋開閉システム | |
JP4309935B2 (ja) | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 | |
JP4264115B2 (ja) | 被収容物の処理方法及び当該方法に用いられる蓋開閉システム | |
JP4251580B1 (ja) | 被収容物搬送システム | |
JP5448000B2 (ja) | 雰囲気置換装置 | |
JP6198043B2 (ja) | ロードポートユニット及びefemシステム | |
JP4666183B2 (ja) | 密閉容器の蓋開閉システムに用いられるパージ用パイプユニット | |
JP4012190B2 (ja) | 密閉容器の蓋開閉システム及び開閉方法 | |
JP6226190B2 (ja) | パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置 | |
JP7417023B2 (ja) | Efem | |
JP2015142008A (ja) | ロードポート装置 | |
JP6206126B2 (ja) | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 | |
JP6969645B2 (ja) | ガスパージノズル及びフロントパージユニット | |
JP2017216383A (ja) | ガスパージノズル及びフロントパージユニット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080804 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080811 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081010 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090415 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090416 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120501 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4301456 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130501 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140501 Year of fee payment: 5 |