JP4291313B2 - Head operation control device, control method, and stage device - Google Patents

Description

  The present invention relates to a head operation control device, a control method, and a stage device configured to correct a shift in operation timing of a plurality of heads that occurs in accordance with a yaw angle of a workpiece (a yawing direction angle around a Z axis).

  For example, in a laser irradiation system having a laser head or an ink jet system having an ink jet head, a table on which a substrate (work) as a workpiece is placed is moved, and the processing point of the substrate faces the laser irradiation point of the head. The operation of the head is controlled so that the substrate surface is processed at the timing when it is moved to the position.

  In such a control system, a substrate is placed on a movable table mounted on the X and Y stages of the stage device in order to make the workpiece run at a constant speed with high accuracy, and is placed horizontally above the moving path of the movable table. A head is attached to a frame (head support member), and predetermined processing (laser irradiation, ink application, etc.) is performed on processing points on the substrate.

  In the stage device, the Y sliders provided on both sides of the Y stage on which the movable table is mounted are configured to move in the Y direction by the thrust of the Y direction linear motor, and the Z axis is controlled by controlling the thrust of the Y direction linear motor. The surrounding yaw angle is corrected (for example, see Patent Document 1).

In the stage apparatus, the movement of the movable table measures that the processing point of the substrate has moved to a position facing the head (laser irradiation point) using an X direction laser interferometer and a Y direction laser interferometer, The head is operated at a timing when the position of the processing point measured by the X direction laser interferometer and the Y direction laser interferometer moves to a position facing the head, and predetermined processing is performed.
JP-A-6-163359

  In recent years, with the increase in the size of the substrate (increase in area), multiple heads are arranged in a row on the frame, and multiple processing of the substrate surface is performed in conjunction with the movement of the movable table on which the substrate is placed. It is required to increase the processing efficiency by simultaneously processing a plurality of heads on a point. However, in the method of measuring the distance between the head located at the center of the plurality of heads and the movable table from the coordinate position data measured by the X direction laser interferometer and the Y direction laser interferometer, the movable table is inclined in the yawing direction. If an error due to the yaw angle occurs, the amount of deviation (error) due to the yaw angle differs depending on the position of the plurality of heads, so that the machining point positions corresponding to the plurality of heads cannot be accurately detected.

  For example, even if the error of the head located at the center of the plurality of heads measured by the X-direction laser interferometer and the Y-direction laser interferometer is zero, the head at a position farther from the center head becomes the θ direction (the yawing direction). ) Becomes larger. On the other hand, the demand for processing accuracy is higher, and it is desired to suppress the error between the processing point of the substrate and the laser irradiation point of the head to about one millionth of a millimeter.

  Therefore, even if control is performed so as not to cause an error due to the yaw angle of the movable table in the method of correcting the thrust distribution rate of the pair of linear motors described in Patent Document 1, a minute yaw angle is caused by the fluctuation of the linear motor thrust. When an error due to the above occurs, the amount of error in the θ direction differs depending on the positions of a plurality of heads, so that there is a problem that it is difficult to suppress the errors of all the heads to several microns.

  Therefore, an object of the present invention is to provide a head operation control device, a control method, and a stage device that have solved the above-described problems.

  In order to solve the above problems, the present invention has the following means.

  According to the first aspect of the present invention, either the workpiece support member on which the workpiece is placed or the head support member that supports the plurality of heads arranged to face the workpiece support member is moved, and A head control device that controls the operation of the plurality of heads in conjunction with relative displacement, wherein the workpiece support member or the head support member with respect to the plurality of heads according to an inclination in a yawing direction of a member on a moving side. A correction means for correcting the operation timing is provided.

  According to a second aspect of the present invention, the correction unit detects a tilt of the moving member, and a correction for calculating a correction amount for each of the plurality of heads based on a detection result of the detection unit. And a control unit that individually operates the plurality of heads at a timing corrected by the correction amount from the correction amount calculation unit.

  According to a third aspect of the present invention, the correction amount calculating means has an inclination calculating means for obtaining an inclination in a yawing direction of the member on the moving side based on a detection result of the detecting means, and obtained by the inclination calculating means. The correction amount for each of the plurality of heads is calculated according to the calculated result.

  According to a fourth aspect of the present invention, the detecting means comprises a pair of laser interferometers arranged in the yawing direction of the moving member, and the inclination calculating means is a distance measured by the pair of laser interferometers. The inclination of the member on the moving side is obtained from the difference.

According to a fifth aspect of the present invention, either the workpiece support member on which the workpiece is placed or the head support member that supports the plurality of heads arranged to face the workpiece support member is moved, and A control method of a head control device that controls operations of the plurality of heads in conjunction with relative displacement, wherein a first process of detecting a tilt in a yawing direction of a member on the moving side, and a tilt in the yawing direction A second step of calculating a correction amount for each of the plurality of heads based on the second step; and a third step of individually operating the plurality of heads at a timing corrected by the correction amount from the second step. It is characterized by having.

According to a sixth aspect of the present invention, in the second process, an inclination in a yawing direction of a member serving as the moving side is obtained based on a detection result of the first process, and the plurality of the second processes are determined in accordance with the inclination in the yawing direction. The correction amount for each of the heads is calculated.

According to a seventh aspect of the present invention, there is provided a work support member on which a work is placed, a head support member horizontally mounted on the work support member, a plurality of heads arranged in parallel on the head support member, and the work A moving means for moving either the support member or the head support member; a detecting means for detecting an inclination in a yawing direction of the workpiece support member or a member on the moving side of the head support member; and the work support member or the head A head operation control means for controlling the operation of the head in conjunction with the movement of the support member, wherein the head operation control means is based on the inclination in the yawing direction detected by the detection means. Calculating a correction amount for the plurality of heads, and individually operating the plurality of heads at a timing corrected by the correction amount. .

According to an eighth aspect of the present invention, the head operation control means obtains an inclination in the yawing direction of the work support member based on a detection result of the detection means, and corrects the plurality of heads according to the inclination in the yawing direction. It is characterized by calculating a quantity.

According to a ninth aspect of the present invention, there is provided a movable table on which a work is placed, a head support member horizontally mounted on the movable table, a plurality of heads arranged in parallel on the head support member, and the movable table. A moving means for moving; a detecting means for detecting the inclination of the movable table in the yawing direction; and a correction amount corresponding to a change in the inclination of the yawing direction detected by the detecting means while moving the movable table from a start point to an end point. Correction amount calculation means for calculating the correction amount, storage means for storing the correction amount of each moving position obtained in the process of moving the movable table calculated by the correction amount calculation means from the start point to the end point, and the movement means A correction amount corresponding to the moving position of the movable table is read from the storage means, and the plurality of heads are individually operated at a timing according to the correction amount. And having a head operation control means for causing the.

According to a tenth aspect of the present invention, there is provided a movable table on which a work is placed, a head support member horizontally mounted on the movable table, a plurality of heads arranged in parallel on the head support member, and the movable table. The plurality of heads are individually separated at a timing corresponding to each distance data of the yawing direction detected by the plurality of detecting means, a moving means for moving, a plurality of detecting means for detecting distances in the yawing direction with the movable table And a head operation control means for operating the head.

  According to the present invention, since the operation timing for the plurality of heads is corrected according to the inclination of the member on the moving side in the yawing direction, the operation timing is adjusted according to the inclination even if the inclination of the member on the moving side is minute. By shifting the position, the head can be operated at a position where the inclination is zero, and the accuracy can be improved without being affected by the error due to the yaw angle on the moving side.

  Further, according to the present invention, the correction amount of each moving position obtained in the process of moving the movable table calculated by the correction amount calculating means from the start point to the end point is stored in the storage means, and the movable table is moved by the moving means. Since the correction amount corresponding to the position is read from the storage means and the plurality of heads are individually operated at a timing according to the correction amount, the operation timing is set according to the inclination of the movable table even if the inclination of the movable table is very small. By shifting the position, the head can be operated at a position where the inclination is zero, and the accuracy can be improved without being affected by the error due to the yaw angle of the movable table.

  Further, according to the present invention, the plurality of heads are individually operated at a timing corresponding to the distance data to the movable table facing the plurality of heads detected by the plurality of detection means, and accordingly, according to the inclination of the movable table. The head can be operated at the position, and the accuracy can be improved without being affected by the error due to the yaw angle of the movable table.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a stage apparatus to which an embodiment of a head operation control apparatus according to the present invention is applied. As shown in FIG. 1, the stage apparatus 10 includes a pair of Y sliders 12 that move in the Y direction, a pair of guides 14 that guide the Y sliders 12, and a Y stage 16 that is horizontally mounted between the Y sliders 12. And a flat movable table (work support member) 20 that moves in the X direction on the Y stage 16.

  The stage apparatus 10 includes a stone surface plate 22 that supports the pair of guides 14, a vibration isolation mount 24 that supports the stone surface plate 22, a pair of gantry frames 26 mounted on the stone surface plate 22, And a head support member 28 laid across the gantry frame 26.

  The Y slider 12 is provided with a Y-direction linear motor (not shown) that drives the movable table 20 in the Y direction, and an X-direction linear motor that drives the movable table 20 in the X direction on the Y stage 16. (Not shown) is provided. The Y stage 16 and the movable table 20 are provided with a plurality of static pressure pads (not shown) so that they can be moved on the guide 14 and the stone surface plate 22 with almost no friction. It has been.

The head support member 28 is fixed so as to be horizontally mounted at a substantially intermediate position between a pair of gantry frames 26 laid across the left and right sides of the stone surface plate 22. The head support member 28 is provided with a plurality of heads 30 (30 ₁ to 30 _n ) arranged in a line at predetermined intervals and a head operation control device 31 that operates the plurality of heads 30.

  The upper surface of the movable table 20 is a workpiece suction surface that sucks the substrate, and a Y-direction mirror 32 and an X-direction mirror 34 are attached to the periphery. Further, Y1, Y2 laser interferometers (detection means) 36, 37 for detecting the Y-direction position are arranged in parallel at the Y-direction end of the stone surface plate 22, and the X-direction end of the stone surface plate 22 Is provided with an X laser interferometer 38 for detecting the position in the X direction.

Here, a measurement method using the Y1, Y2 laser interferometers 36, 37 will be described with reference to FIG. In FIG. 2, it is assumed that five heads 30 ₁ to 30 ₅ are arranged.

Y1 laser interferometer 36 is the length interferometer measurement, it is arranged in the Y-direction axis intersecting the head 30 ₃ located in the center of the plurality of heads 30. The Y2 laser interferometer 37 is a yaw angle calculation interferometer, and is attached to a position shifted from the Y1 laser interferometer 36 by a distance D1 in the X direction.

  Accordingly, the Y direction position of the movable table 20 is measured by the Y1 laser interferometer 36, and the X direction position of the movable table 20 is measured by the X laser interferometer 38. Further, the inclination (yaw angle θ) of the movable table 20 around the Z axis is the difference δ1 (= L1−L2) between the distance L1 measured by the Y1 laser interferometer 36 and the distance L2 measured by the Y2 laser interferometer 37. ) And the distance between the Y1 and Y2 laser interferometers 36 and 37 (X direction separation distance D1).

The position of the working point corresponding to the head 30 ₃ located in the center of the plurality of heads 30 (the distance) is measured by Y1 laser interferometer 36 and the X laser interferometer 38. Then, the distance from the head 30 ₃ to the other heads 30 ₁ D2, when the machining point error due to the yaw angle θ and .delta.2, the correction amount △ T for the trigger signal is obtained from the following equation.

ΔT = ± δ2
= ± δ1 × D2 / D1 (1)
In the above formula (1), D1, D2 is because it is known, it is possible to obtain the correction amount △ T by substituting the difference [delta] 1 of the measurement values of Y1, Y2 laser interferometer 36. In equation (1), the correction amount ΔT can be obtained without calculating the yaw angle of the movable table 20.

Further, the correction amount ΔT of the heads 30 ₂ , 30 ₄ , and 30 ₅ other than the above can be calculated using the equation (1) in the same manner as described above. Then, by correcting the operating positions of the _five heads 30 ₁ to 30 ₅ with the correction amount T, for example, when the movable table 20 moves in the Y direction with the angle θ inclined clockwise as viewed from above, the head The machining timing is shifted by adding or subtracting the correction amount ΔT to the machining positions 30 ₁ to 30 ₅ .

For example, the head 30 ₁ faster correction amount △ _{T 1} minute processing with respect to the head 30 ₃ serving as a reference. The head 30 ₂ faster correction amount △ _{T 2} minutes processing with respect to the head 30 ₃ serving as a reference. Head 30 ₄ slows the correction amount △ _{T 4} minutes processing with respect to the head 30 ₃ serving as a reference. Head 30 ₅ slows the correction amount △ _{T 5} minutes processing with respect to the head 30 ₃ serving as a reference. Thus, the processing point P1~P5 by the head ₃₀ 1 to 30 _5, a circular portion indicated by a broken line in FIG. 2 (but without a central head 30 ₃ Correction), and correct the shift amount δ according to the yaw angle θ to zero It becomes the position.

Therefore, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the yaw angle θ of the movable table 20, and the processing point on the substrate placed on the movable table 20 is the head 30 _1. it is possible to perform processing at matched timing with 30 ₅ processing point.

  Here, the correction processing by the head operation control device 31 is represented by analog control as shown in FIG.

3, the correction amount calculation unit 44 ₁ is based on the difference (L1-L2) between the distance L1, L2 measured by the conducted Y1, Y2 laser interferometer 36 and 37 the operation of equation (1) described above Thus, the correction amount ΔT according to the yaw angle is calculated.

The distance L1 measured by the Y1 laser interferometer 36 is corrected by adding or subtracting the correction amount ΔT. The decision unit 46 _1, the value of the corrected distance L1 ± △ T has determined whether to match the processing position data, and outputs the head 30 ₁ of the signal if they match.

Further, the correction amount calculation unit ₄₄ 2-44 ₅ and judging section ₄₆ 2-46 ₅ outputs a signal by performing the same correction processing for the other head ₃₀ 2-30 _5. Thereby, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the yaw angle θ of the movable table 20, and the processing point on the substrate placed on the movable table 20 is the head 30. ₁ - 30 in the machining point and matching the timing of ₅ for machining.

FIG. 4 is a conceptual diagram of a control block for processing the correction processing of the head operation control device 31 of the first embodiment by digital control. As shown in FIG. 4, the head operation control device 31 includes a microcomputer, and a distance calculation unit 40 that calculates a distance L1 from the signal measured by the Y1 laser interferometer 36 to the movable table 20, Y1, Y2 a correction amount calculation unit 44 that calculates a correction amount △ T for each of the heads ₃₀ 1 to 30 ₅ on the basis of the distance L1, L2 measured by the laser interferometer 37, the correction amount from the correction amount calculation unit 44 And a head controller (control means) 46 that individually operates the heads 30 ₁ to 30 ₅ at a prescribed timing.

The head control unit 46 has input machining position data in advance, corrects the distance L1 from the distance calculation unit 40 by the correction amount ΔT from the correction amount calculation unit 44, and this correction value L1 ± ΔT is the machining data. When the same, the machining signals of the heads 30 ₁ to 30 ₅ are output. As a result, the heads 30 ₁ to 30 ₅ have their laser processing timing shifted in time according to the yaw angle θ of the movable table 20, and the processing point on the substrate placed on the movable table 20 is the head. Machining is performed at the timing coincident with the machining points P1 to P5 of 30 ₁ to 30 ₅ .

  The head operation control device 31 according to the second embodiment first moves the movable table 20 in the Y direction before entering the machining process, and corrects at each moving position by changing the yaw angle from the start point to the end point of the Y direction stroke. The amount is calculated and stored in advance in a database (storage means). The correction amount ΔT corresponding to the yaw angle at the Y-direction movement position stored in the database changes, for example, as schematically shown in FIG. In FIG. 5, the horizontal axis represents the Y-direction movement position, and the vertical axis represents the correction amount ΔT according to the yaw angle. Therefore, if the Y-direction movement position is measured by the Y1 laser interferometer 36, the correction amount ΔT corresponding to the movement position can be read out instantaneously.

Then, in processing the substrate placed on the movable table 20, it is possible to correct the machining timing of the head 30 ₁ to 30 ₅ reads the correction amount for each movement position previously stored in the database When the movable table 20 is moved at a high speed, the correction process can be performed at a high speed according to the moving speed.

  Here, when the correction processing by the head operation control device 31 is represented by analog control, it is as shown in FIG.

6, the correction amount calculation unit 44 _1, the correction amount △ T corresponding the signals measured by Y1 laser interferometer 36 to the distance L1 to the movable table 20, reads from the database (see FIG. 6), Y1 laser The correction amount ΔT is added to or subtracted from the distance L1 measured by the interferometer 36. The decision unit 46 _1, the value of the corrected distance L1 ± △ T has determined whether to match the processing position data, and outputs the processed signal of the head 30 ₁ if they match.

This correction method does not require a yaw angle calculation process for obtaining the yaw angle θ around the Z axis of the movable table 20 based on the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37 as in the first embodiment. to become, and shortens the time it takes to output the processed signals correspondingly head 30 _1, it is possible to perform the correction process in response to high-speed movement of the movable table 20 at high speed.

Further, the processing signal correction amount calculating section ₄₄ 2-44 ₅ and judging section ₄₆ 2-46 ₅ by performing the same correction processing is to be capable of outputting at high speed relative to the other heads ₃₀ 2-30 ₅ Become. Thereby, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the change in the yaw angle θ of the movable table 20, and the processing points on the substrate placed on the movable table 20 are changed. Processing can be performed at a timing that coincides with the processing points P1 to P5 of the heads 30 ₁ to 30 ₅ .

Thus, the processing point P1~P5 by the head ₃₀ 1 to 30 _5, a circular portion indicated by a broken line in FIG. 2 (but without a central head 30 ₃ Correction), and correct the shift amount δ according to the yaw angle θ to zero It becomes the regular position.

  FIG. 7 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 according to the second embodiment by digital control.

As shown in FIG. 7, the head operation control device 31 includes a microcomputer, and includes the above-described distance calculation unit 40, yaw angle calculation unit 42, correction amount calculation unit 44, database 48, and movable table 20. Loading correction amount of the head ₃₀ 1 to 30 ₅ corresponding to the moving position from the database 48, and a head control unit (control means) 46 for actuating the head ₃₀ 1 to 30 ₅ individually at a timing according to the correction amount . The yaw angle calculator 42 calculates the yaw angle θ around the Z axis of the movable table 20 based on the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37. The correction amount calculation unit 44 calculates a correction amount △ T for s respectively of the head 30 ₁ to 30 ₅ in accordance with the yaw angle θ obtained by the yaw angle calculation unit 42.

That is, the correction amount calculation unit 44 moves the movable table 20 from the start point to the end point of the Y-direction stroke and changes the head according to the change in the difference δ2 between the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37. A correction amount ΔT for each of 30 ₁ to 30 ₅ is calculated. Database 48 stores a correction amount of the movement positions of the correction amount calculation unit 44 the head 30 ₁ to 30 ₅ to the computed moving table 20 obtained in the process of moving from the start point to the end point by.

The head control unit 46 has previously inputted machining position data, corrects the distance L1 from the distance calculation unit 40 by the correction amount ΔT read from the database 48 with the correction amount ΔT of the heads 30 ₁ to 30 ₅ , when the corrected distance L1 ± △ T is coincident with the processed data, and outputs the processed signal of the head ₃₀ 1 to 30 _5. Thereby, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the yaw angle θ of the movable table 20, and the processing point on the substrate placed on the movable table 20 is the head 30. it is possible to perform processing at matched timing and processing point P1~P5 of ₁ - 30 _5.

FIG. 8 is a plan view showing the measurement method of the third embodiment. As shown in FIG. 8, in the third embodiment, it is Y1~Y5 laser interferometer ₅₀ 1-50 ₅ which measures the distance between the movable table 20 provided in a Y-direction position of the head ₃₀ 1 to 30 ₅ correspond to Yes. Centrally disposed Y3 laser interferometer 50 ₁ is the length interferometer measurement, other laser interferometer _{50 1,} 50 _2, 50 4, 50 _5, in the position detecting interferometer which functions as a correction means is there.

The Y1 to Y5 laser interferometers 50 ₁ to 50 ₅ are arranged on the line in the Y direction intersecting with the heads 30 ₁ to 30 _5, and the distance L1 according to the inclination (yaw angle θ) of the movable table 20 in the yawing direction. ~ L5 is measured. Therefore, the Y1 to Y5 laser interferometers 50 ₁ to 50 ₅ can detect the shift amount δ2 due to the yaw angle of the processing points facing the heads 30 ₁ to 30 ₅ .

The head operation control device 31 individually operates the heads 30 ₁ to 30 ₅ when the distances L ₁ to L ₅ measured by the Y ₁ to Y ₅ laser interferometers 50 ₁ to 50 ₅ coincide with the machining position data.

Thus, in this embodiment, since the heads 30 ₁ to 30 ₅ and the Y1 to Y5 laser interferometers 50 ₁ to 50 ₅ are provided at 1: 1, the Y1 to Y5 laser interferometers 50 ₁ to 50 _{5 are used.} By operating the heads 30 ₁ to 305 at the timing when the measured distances L ₁ to L ₅ coincide with the processing position data, the processing points P ₁ to P ₅ have corrected the shift amount δ 2 due to the yaw angle θ of the movable table 20 to zero. Corrected to the correct position.

  Here, when the correction processing by the head operation control device 31 is expressed by analog control, it is as shown in FIG.

9, the determination unit _461, when the distance L1 from the signals measured by Y1 laser interferometer 50 ₁ to the movable table 20 is supplied, and determines whether or not to match the processing position data, and it outputs the processed signal of the head 30 ₁ if they match.

Also, the determination section ₄₆ 2-46 ₅ outputs a processed signal by performing the same correction processing to the other head ₃₀ 2-30 _5. Therefore, the determination unit ₄₆ 1 to 46 _5, placed on the movable table 20 by parallel processing the distance data L1~L5 of each processing point measured by the respective Y1~Y5 laser interferometer ₅₀ 1-50 ₅ substrate processing point above performs processing at a timing that matches the machining point P1~P5 heads ₃₀ 1 to 30 _5. Therefore, when the movable table 20 having an inclination by the yaw angle, the processing timing of the head 30 ₁ to 30 ₅ are displaced in time in accordance with a change in the yaw angle θ of the movable table 20.

Thus, the processing point P1~P5 by the head ₃₀ 1 to 30 _5, a circular portion indicated by a broken line in FIG. 8 (but without a central head 30 ₃ Correction), and correct the shift amount δ2 by the yaw angle θ to zero It becomes the regular position.

FIG. 10 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of Example 3 by digital control. As shown in FIG. 7, the head operation controller 31 is a microcomputer, operation and distance calculator ₄₄ 1-44 _5, the distance calculation unit ₄₄ 1 to 44 ₅ which varies with the movement of the movable table 20 A head control unit (control means) 46 that individually operates the heads 30 ₁ to 30 ₅ at a timing according to the distance data with respect to the movable table 20.

Distance calculator ₄₄ 1-44 ₅ calculates the distance L1~L5 measured by Y1~Y5 laser interferometer ₅₀ 1-50 ₅ as a correction amount for each of the heads ₃₀ 1 to 30 _5.

The head controller 46 performs parallel processing on the operation timings of the heads 30 ₁ to 30 ₅ , and machining position data is input in advance. Then, the head controller 46, when the distance data L1~L5 from the distance calculation unit ₄₄ 1 to 44 ₅ is matched with each of the processing data of the head ₃₀ 1 to 30 _5, the processing signal of the head ₃₀ 1 to 30 ₅ Output. Thereby, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the yaw angle θ of the movable table 20, and the processing point on the substrate placed on the movable table 20 is the head 30. it is possible to perform processing at matched timing and processing point P1~P5 of ₁ - 30 _5.

In the present embodiment, the configuration in which the heads 30 ₁ to 30 ₅ and the Y1 to Y5 laser interferometers 50 ₁ to 50 ₅ are arranged at 1: 1 has been described as an example. If the number of laser interferometers increases, one laser interferometer may be arranged for two heads. In this case, the head operation timing that matches the Y-direction position of the laser interferometer is controlled by the distance data measured by the laser interferometer, and the head operation timing that matches the Y-direction position of the laser interferometer is as described above. By correcting by the method of the first embodiment or the second embodiment, the processing is performed at the timing when the processing points on the substrate placed on the movable table 20 coincide with the processing points P1 to _Pn of the heads 30 ₁ to 30 _n. be able to.

In the above embodiment has been described for the case where moving the movable table 20 in the Y direction by the stage device is not limited to this, a table which a workpiece is placed and fixed side, supporting the head 30 ₁ to 30 ₅ Head Of course, the present invention can be applied to a structure in which the support member 28 is moved in the Y direction by a linear motor or the like.

In the above-described embodiment, the case where the head operation control device 31 corrects the operation timing of the heads 30 ₁ to 30 _n mounted on the stage device has been described as an example. Of course, the present invention can be applied to apparatuses other than the stage apparatus as long as the apparatus moves any of the support members.

Further, as the heads 30 ₁ to 30 _n in the above-described embodiments, a laser processing head that irradiates a processing point of a work with laser light, an inkjet head that sprays ink on the work surface, and a surface of the processed work are inspected. The present invention can also be applied to a configuration in which the inspection head or the like is mounted on the head support member 28.

It is a perspective view which shows the stage apparatus with which one Example of the head operation control apparatus which becomes this invention was applied. It is a top view for demonstrating the measuring method using Y1, Y2 laser interferometer 36,37. It is a systematic diagram explaining the correction process by the head operation control apparatus 31 of Example 1 by analog control. FIG. 3 is a conceptual diagram of a control block that performs correction processing of the head operation control device 31 of Example 1 by digital control. It is a figure which shows the relationship between Y direction movement position and correction amount (DELTA) T according to a yaw angle. It is a systematic diagram explaining the correction process by the head operation control apparatus 31 of Example 2 by analog control. It is a conceptual diagram of the control block which processes the correction process of the head operation control apparatus 31 of Example 2 by digital control. 10 is a plan view showing a measurement method of Example 3. FIG. It is a systematic diagram explaining the correction process by the head operation control apparatus 31 of Example 3 by analog control. It is a conceptual diagram of the control block which processes the correction process of the head operation control apparatus 31 of Example 3 by digital control.

Explanation of symbols

10 stage device 14 Y direction linear motor 16 Y stage 20 movable table 28 the head support member _{30 (30} 1 _~30 n) head 31 head operation controller 36 Y1 laser interferometer 37 Y2 laser interferometer 44 correction amount computing unit ₄₄ 1 44 ₅ Correction amount calculation unit 46 Head control unit 46 _{1 to 4 6 5} Determination unit 50 ₁ to 50 ₅ Laser interferometer

Claims (10)

The workpiece support member on which the workpiece is placed and the head support member that supports the plurality of heads arranged opposite to the workpiece support member are moved, and the plurality of the plurality of the workpiece support members are moved in conjunction with the relative displacement of the two members. A head control device for controlling the operation of the head of the
A head operation control device comprising correction means for correcting operation timings for the plurality of heads according to an inclination in a yawing direction of a member on the moving side of the work support member or the head support member. The correction means includes
Detecting means for detecting an inclination of the member on the moving side;
A correction amount calculating means for calculating a correction amount for each of the plurality of heads based on a detection result of the detecting means;
Control means for individually operating the plurality of heads at a timing corrected by the correction amount from the correction amount calculation means;
The head operation control device according to claim 1, further comprising:   The correction amount calculating means includes an inclination calculating means for obtaining an inclination in a yawing direction of the member on the moving side based on a detection result of the detecting means, and the correction amount calculating means includes the inclination calculating means according to the calculation result obtained by the inclination calculating means. The head operation control device according to claim 2, wherein a correction amount for each of the plurality of heads is calculated. The detection means comprises a pair of laser interferometers arranged in the yawing direction of the moving member,
4. The head operation control device according to claim 3 , wherein the tilt calculation means obtains the tilt of the member on the moving side from a difference in distance measured by the pair of laser interferometers. Either the workpiece support member on which the workpiece is placed or the head support member that supports the plurality of heads arranged to face the workpiece support member is moved, and the plurality of the plurality of the plurality of the plurality of head support members are interlocked with the relative displacement of the two members. A control method of a head control device for controlling the operation of the head of
A first process of detecting the inclination of the yawing direction of the moving member;
A second step of calculating a correction amount for each of the plurality of heads based on the inclination in the yawing direction ;
A third step of individually operating the plurality of heads at a timing corrected by the correction amount from the second step;
A control method for a head operation control device. In the second process, an inclination in the yawing direction of the moving member is obtained based on the detection result in the first process, and a correction amount for each of the plurality of heads is determined according to the inclination in the yawing direction. 6. The method of controlling a head operation control device according to claim 5, wherein the control is performed. A workpiece support member on which the workpiece is placed;
A head support member horizontally mounted on the workpiece support member;
A plurality of heads arranged side by side on the head support member;
Moving means for moving either the work support member or the head support member;
Detecting means for detecting an inclination in a yawing direction of a member on the moving side of the work support member or the head support member;
Head operation control means for controlling the operation of the head in conjunction with movement of the work support member or the head support member;
A stage apparatus comprising:
The head operation control unit calculates a correction amount for the plurality of heads based on the inclination in the yawing direction detected by the detection unit, and individually operates the plurality of heads at a timing corrected by the correction amount. A stage apparatus characterized by that. The head operation control means obtains the inclination of the workpiece support member in the yawing direction based on the detection result of the detection means, and calculates correction amounts for the plurality of heads according to the inclination of the yawing direction. The stage apparatus according to claim 7. A movable table on which the workpiece is placed;
A head support member horizontally mounted on the movable table;
A plurality of heads arranged side by side on the head support member;
Moving means for moving the movable table;
Detecting means for detecting the inclination of the movable table in the yawing direction ;
Correction amount calculation means for calculating a correction amount according to a change in the inclination of the yawing direction detected by the detection means while moving the movable table from the start point to the end point;
Storage means for storing a correction amount of each movement position obtained in the process of moving the movable table calculated by the correction amount calculation means from the start point to the end point;
A head operation control unit that reads a correction amount corresponding to the moving position of the movable table by the moving unit from the storage unit and individually operates the plurality of heads at a timing according to the correction amount;
A stage apparatus characterized by comprising: A movable table on which the workpiece is placed;
A head support member horizontally mounted on the movable table;
A plurality of heads arranged side by side on the head support member;
Moving means for moving the movable table;
A plurality of detection means for detecting a distance in the yawing direction with the movable table;
Head operation control means for individually operating the plurality of heads at timing according to each distance data in the yawing direction detected by the plurality of detection means;
A stage apparatus characterized by comprising:

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