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JP4181017B2 - Mold for molding - Google Patents

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JP4181017B2
JP4181017B2 JP2003381913A JP2003381913A JP4181017B2 JP 4181017 B2 JP4181017 B2 JP 4181017B2 JP 2003381913 A JP2003381913 A JP 2003381913A JP 2003381913 A JP2003381913 A JP 2003381913A JP 4181017 B2 JP4181017 B2 JP 4181017B2
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heat insulating
insulating layer
mold
stamper
zirconia
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JP2004175112A (en
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良武 加藤
智之 宮本
雅之 初見
雄介 平井
一樹 岩下
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株式会社東伸精工
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  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)

Description

本発明は、成形用金型、特に、コンパクトディスク(CD)やデジタルバーサタイルディスク(DVD)等の光ディスク用プラスチック基板あるいは、パーソナルコンピュータや携帯電話等に使用される液晶表示装置用またはその他の用途に使用される透明樹脂製の導光板等を形成するために好適な成形用金型に関する。 The present invention is used for molding dies, especially for plastic substrates for optical disks such as compact disks (CDs) and digital versatile disks (DVDs), liquid crystal display devices used in personal computers, mobile phones, and other applications. The present invention relates to a molding die suitable for forming a transparent resin light guide plate and the like to be used.

一般に、CDやDVD等の光ディスク用プラスチック基板は、鋼材等の金属材料で構成された可動側金型及び固定側金型を使用し、これらの金型が組み合わされたとき形成されるキャビテイ内に記録情報に対応するスタンパを配置して、このキャビテイ内にポリカーボネート樹脂等の溶融プラスチックを充填し、冷却、固化後金型から分離して形成される。   In general, plastic substrates for optical discs such as CD and DVD use movable molds and fixed molds made of metal materials such as steel, and the cavities formed when these molds are combined. A stamper corresponding to the recorded information is arranged, and the cavity is filled with a molten plastic such as polycarbonate resin, and after cooling and solidification, it is separated from the mold.

しかし、近年、光ディスクの高密度化に伴い、このような光ディスク用プラスチック基板の成形においては、サブミクロンオーダーの情報ピットやレーザー案内溝の精密転写が最重要課題となっている。特に高密度化のために、基板厚みを0.6mm以下の薄型とすると、溶融プラスチック樹脂がスタンパの溝深さに対して十分に転写しにくく転写性が悪い問題がある。このような問題は、前記導光板の成形においても生じ、導光板の表面の光反射面となる微小な凹凸面の形成において、十分な転写性が得られず、良好な反射面が形成されない問題がある。 However, in recent years, with the increase in the density of optical discs, in the molding of such plastic substrates for optical discs, precise transfer of information pits and laser guide grooves on the order of submicron has become the most important issue. In particular, if the thickness of the substrate is reduced to 0.6 mm or less in order to increase the density, it is difficult to transfer the molten plastic resin sufficiently with respect to the groove depth of the stamper, resulting in poor transferability. Such a problem also occurs in the formation of the light guide plate, and in the formation of a minute uneven surface serving as a light reflection surface on the surface of the light guide plate, sufficient transferability cannot be obtained, and a good reflection surface cannot be formed. There is.

このような問題を解消するために、スタンパと金型コアとの間に溶射法によってセラミックス材による断熱層を形成した成形金型を使用することが提案されている。(例えば、特許文献1)
この方法によれば、スタンパと金型コアとの間に溶射法によってセラミックス材による断熱層を形成するので、充填直後の溶融樹脂温度が、ゲートに近い基板内周部より低い基板外周部でも、樹脂充填直後のスタンパとの境界面温度が樹脂の熱変形温度を越え、しかも基板内周部と外周部とで同じ温度となり、内、外周部とも良好な転写性を得ることができるが、セラミックスによる断熱層を溶射法によって形成するため、スタンパと接触する断熱層の表面の面精度を出すことが困難であり、表面に空隙などによる凹凸部が形成されやすく、その結果、スタンパとの摺接によって、スタンパの摩耗粉が発生する等の問題が生じた。
In order to solve such problems, it has been proposed to use a molding die in which a heat insulating layer made of a ceramic material is formed between a stamper and a die core by a thermal spraying method. (For example, Patent Document 1)
According to this method, since a heat insulating layer made of a ceramic material is formed between the stamper and the mold core by a thermal spraying method, the molten resin temperature immediately after filling is lower than the inner peripheral portion of the substrate near the gate. The temperature at the interface with the stamper immediately after resin filling exceeds the thermal deformation temperature of the resin, and the same temperature is obtained at the inner and outer peripheral parts of the substrate. Good transferability can be obtained at both the inner and outer peripheral parts. Since the thermal insulation layer is formed by the thermal spraying method, it is difficult to obtain surface accuracy of the surface of the thermal insulation layer that contacts the stamper, and uneven portions due to voids are likely to be formed on the surface, resulting in sliding contact with the stamper. As a result, problems such as generation of stamper wear powder occurred.

また、このようなセラミックス材による断熱層を導光板の反射面面等の成形体表面を形成するキャビティ面として利用する場合には、セラミックス材は、一般的に硬度が大きく、断熱層の表面の微細な加工が難しい問題がある。   In addition, when such a heat insulating layer made of a ceramic material is used as a cavity surface for forming a surface of a molded body such as a reflecting surface of a light guide plate, the ceramic material is generally large in hardness and has a surface of the heat insulating layer. There is a problem that fine processing is difficult.

特開平10−149587号公報JP-A-10-149487

本発明は、このような問題点を解決しようとするもので、表面平滑なキャビティ面が容易かつ確実に形成されてスタンパによる摩耗粉の発生を抑えた成形用金型を提供することを目的とする。 The present invention is intended to solve such problems, and an object of the present invention is to provide a molding die in which a smooth surface of a cavity is easily and reliably formed and generation of wear powder by a stamper is suppressed. To do.

本発明は、第1の発明および第2の発明において、属材料からなる可動側金型及び固定側金型のキャビテイを構成する少なくとも一方の表面に、溶射法によるセラミックからなる断熱層を形成し、この断熱層の表面に、アモルファスのダイヤモンド状炭素質薄膜を形成した成形用金型とすることにより、表面平滑で、スタンパの摩耗を防止して、スタンパによる摩耗粉の発生を抑制することができる。 The present invention is formed in the first and second inventions, at least one surface constituting the cavity of the movable mold and the fixed mold made of metallic material, a heat insulating layer of ceramic by thermal spraying By using a molding die with an amorphous diamond-like carbon thin film formed on the surface of this heat insulation layer, the surface is smooth and the wear of the stamper is prevented and the generation of wear powder by the stamper is suppressed. Can do.

さらに、本発明の第1の発明は、前記断熱層は、ジルコニア、酸化チタン、アルミナ、チタン酸アルミニウムの少なくとも1種から選ばれたセラミック材で構成された成形用金型とすることにより、溶融樹脂のスタンパあるいはキャビティ面からの情報記録部分あるいは導光板の凹凸反射面の転写性が改善される。 Furthermore, the first invention of the present invention, the heat insulation layer, zirconia, titanium oxide, alumina, by a formed shape mold made of a ceramic material selected from at least one of aluminum titanate, The transferability of the molten resin stamper or the information recording portion from the cavity surface or the uneven reflection surface of the light guide plate is improved.

また、本発明の第2の発明は、前記断熱層は、ジルコニアで構成された第1の断熱層とその上に積層される酸化クロム、窒化クロム、アルミナ、窒化アルミ、窒化珪素、炭化珪素の少なくとも1種から選ばれた材質からなる第2の断熱層から構成された成形用金型とすることにより、断熱層の表面をより平滑とすることができる。 Further, according to a second aspect of the present invention, the heat insulating layer is formed of a first heat insulating layer made of zirconia and chromium oxide, chromium nitride, alumina, aluminum nitride, silicon nitride, silicon carbide laminated thereon. with formed form mold made up of the second insulation layer made of a material selected from at least one, it can be made more smooth the surface of the heat insulating layer.

本発明者らは、従来公知のスタンパと金型コアとの間に、セラミックスによる断熱層を溶射法によって形成した成形金型は、光ディスク基板用スタンパの内、外周部とも良好な転写性を得ることができるが、セラミックスによる断熱層を溶射法によって形成するため、スタンパと接触するセラミックスの面精度を出すことが困難であり、表面に空隙などによる凹凸部が形成されやすく、その結果、スタンパとの摺接によってスタンパが摩耗されて、スタンパの摩耗粉が発生することを究明し、この究明に基づき、その解決策を検討した結果、 The inventors of the present invention have a molding die in which a heat insulating layer made of ceramics is formed by a thermal spraying method between a conventionally known stamper and a die core, so that good transferability can be obtained in both the outer periphery and the outer periphery of the stamper for an optical disk substrate However, since the heat insulating layer made of ceramics is formed by a thermal spraying method, it is difficult to obtain the surface accuracy of the ceramics in contact with the stamper, and uneven portions due to voids are easily formed on the surface. As a result of investigating that the stamper is worn by sliding contact, and that the wear powder of the stamper is generated, and based on this investigation, the solution was examined.

射法によって形成されたセラミックスによる断熱層であってもキャビティ面側に断熱機能を有するジルコニアの溶射法による第1の断熱層の上に平坦な被膜を形成しやすい酸化クロム、窒化クロム、アルミナ、窒化アルミ、窒化珪素、炭化珪素の少なくとも1種から選ばれた材質からなる溶射法による第2の断熱層を形成しても良好な表面平滑な表面を得ることができる。即ち、ジルコニアの第1断熱層は、鋼鉄製金型との密着性や熱膨張率が鋼鉄製金型とほぼ等しく、成形時の金型の熱膨張や収縮に対応して割れ等の発生を抑えることができ、好適であるが、良好な転写性を得るには、100μm以上の厚みがあればよく、厚みが増すほど転写性が良くなる。しかし、厚みが増すにつれ、転写性が改善される一方、冷却に要する時間も増し成形サイクルも長くなり生産性が低下するため、転写性、生産性のバランスから1000μm以下とするのが良い。このジルコニアによる断熱層は、溶着粒子間に間隙が形成されやすく、そのため、表面には、空隙などによる凹凸が形成されやすく、良好な表面平坦性が得られ難い。一方、酸化クロム、窒化クロム、アルミナ、窒化アルミ、窒化珪素、炭化珪素等を原料として、溶射法により形成した被膜は、前記溶融粒子間に間隙が形成されにくく、良好な表面平滑性が得られ易い。これらの特徴を考慮し、ジルコニアの溶射法による第1の断熱層の上に平坦な被膜を形成しやすい酸化クロム、窒化クロム、アルミナ、窒化アルミ、窒化珪素、炭化珪素の少なくとも1種から選ばれた材質からなる溶射法による第2の断熱層を形成すると両者の長所が相乗的に発揮して、良好な転写性と共に、良好な表面平滑性の断熱層が容易に得ることができる。この場合、第2の断熱層は、第1の断熱層と第2の断熱層の合計厚の1/10から1/2の範囲とすればよい。 Easily forms chromium oxide flat coating over by thermal spraying of zirconia even heat-insulating layers by ceramic formed by thermal spraying, method having a heat insulating function on the cavity surface first insulation layer, chromium nitride, alumina Even when the second heat insulating layer is formed by a thermal spraying method made of a material selected from at least one of aluminum nitride, silicon nitride, and silicon carbide, a good surface smooth surface can be obtained. In other words, the first heat insulating layer of zirconia has almost the same adhesion and thermal expansion coefficient as the steel mold, and cracks are generated in response to the thermal expansion and contraction of the mold during molding. Although it can be suppressed and is preferable, in order to obtain good transferability, a thickness of 100 μm or more is sufficient, and the transferability improves as the thickness increases. However, as the thickness is increased, the transferability is improved. On the other hand, the time required for cooling is increased, and the molding cycle is lengthened and the productivity is lowered. Therefore, the thickness is preferably set to 1000 μm or less from the balance of transferability and productivity. In this heat insulating layer made of zirconia, gaps are easily formed between the weld particles, and as a result, irregularities due to voids are easily formed on the surface, and it is difficult to obtain good surface flatness. On the other hand, a coating formed by thermal spraying using chromium oxide, chromium nitride, alumina, aluminum nitride, silicon nitride, silicon carbide, etc. as a raw material is unlikely to form a gap between the molten particles, and good surface smoothness is obtained. easy. In consideration of these characteristics, it is selected from at least one of chromium oxide, chromium nitride, alumina, aluminum nitride, silicon nitride, and silicon carbide, which can easily form a flat film on the first heat insulating layer by the zirconia thermal spraying method. When the second heat insulating layer made of a different material is formed by the thermal spraying method, the advantages of both are exhibited synergistically, and a heat insulating layer with good surface smoothness as well as good transferability can be easily obtained. In this case, the second heat insulating layer may be in the range of 1/10 to 1/2 of the total thickness of the first heat insulating layer and the second heat insulating layer.

さらにこの第2の断熱層上に、アモルファスのダイヤモンド状炭素質薄膜を形成するとさらに表面平滑性が改善され、好ましい。 Furthermore this second insulation layer, further surface smoothness to form a diamond-like carbonaceous thin film of amorphous is improved, which is preferable.

本発明で使用される可動側金型及び固定側金型は、一般に、超硬合金、ステンレス鋼、炭素鋼、軟鋼等の金属から形成され、プラスチック材の射出成形に好適な金型として使用することができる。 The movable side mold and the fixed side mold used in the present invention are generally formed of a metal such as cemented carbide, stainless steel, carbon steel, mild steel, etc., and are used as molds suitable for injection molding of plastic materials. be able to.

本発明でいう溶射法としては、前記セラミック粉末を使用して、窒素ガス、水素ガス、不活性ガス等を電離させて生ずる高温、高速のプラズマジエットに、前記粉末を送り込み、ジエット中で溶融、加速して、金型母材に衝突させて被膜を形成するプラズマ・パウダー・スプレイ法やセラミックの焼結棒を使用し、約3000℃の酸素−アセチレン火炎中で、溶融し、その溶滴をエアジエット流で加速噴射して被膜を形成するローカイド・ロッド・スプレイ法やセラミック粉末を酸素−アセチレン火炎中で溶融し、ノズル口から燃焼炎の流れにのせて加熱しつつ溶射するサーモ・スプレイ法等が利用できAs the thermal spraying method referred to in the present invention, using the ceramic powder, the powder is fed into a high-temperature, high-speed plasma jet generated by ionizing nitrogen gas, hydrogen gas, inert gas, etc., and melted in the jet. Using a plasma powder spray method or a ceramic sintered rod that accelerates and collides with the mold base material to form a coating, it melts in an oxygen-acetylene flame at about 3000 ° C. Locoid rod spray method that forms a film by accelerating spraying with air jet flow, thermospray method in which ceramic powder is melted in an oxygen-acetylene flame and sprayed while being heated in the flow of the combustion flame from the nozzle opening There Ru available.

本発明の成形金型を用いて成形されるプラスチック材料としては、ポリカーボネート、ポリエーテルイミド、ポリエーテルサルホン、アクリル系樹脂、メタクリル系樹脂、ポリオレフィン系樹脂等熱可塑性樹脂であれば、いずれも使用できる。 As the plastic material molded using the molding die of the present invention, any thermoplastic resin such as polycarbonate, polyetherimide, polyethersulfone, acrylic resin, methacrylic resin, polyolefin resin, etc. can be used. it can.

本発明においては、表面平滑なキャビティ面が容易かつ確実に形成されて、スタンパによる摩耗粉の発生を抑えた成形用金型を提供することができる。 In the present invention, it is possible to provide a molding die in which a smooth-surfaced cavity surface is easily and reliably formed and generation of wear powder by a stamper is suppressed.

以下本発明による直径120mm、厚み0.2mmのDVDディスク用基板の成形のための成形用金型の一実施例について図面を参照しながら説明する。 An embodiment of a molding die for molding a DVD disk substrate having a diameter of 120 mm and a thickness of 0.2 mm according to the present invention will be described below with reference to the drawings.

図1は、本発明による成形用金型を用いて製造されたDVDディスク用基板の記録情報に対応する凹凸部4に相当する部分の拡大断面図であり、DVDディスク基板1の凹凸部4は、ポリカーボネート樹脂で成形され、凹部2の深さHは、約85nm、凸部3間の間隔W、0.8μmで形成されている。 FIG. 1 is an enlarged cross-sectional view of a portion corresponding to the concavo-convex portion 4 corresponding to the recording information of a DVD disc substrate manufactured using the molding die according to the present invention. , is molded of polycarbonate resin, the depth H of the concave portion 2 is about 85 nm, the interval W between the projections 3 are formed of 0.8 [mu] m.

このようなDVDディスク1に使用されるプラスチックディスク基板1を製造する一実施例の成形用金型及び射出成形装置について、図2及び図3に基づいて説明する。 An embodiment of a molding die and an injection molding apparatus for producing a plastic disc substrate 1 used for such a DVD disc 1 will be described with reference to FIGS.

図2は、金型が閉じられた射出成形装置の概略断面図を示し、4は、DVDディスクの記録情報に対応する凹凸面4を形成する面を内面に有するニッケル材からなるスタンパ、5は、固定側金型、6は可動側金型、7はスタンパ外周ホルダーで、これらの金型は、ステンレス系工具鋼から形成されている。これらの金型を射出成形装置上で組み合わせて閉じられると、成形品、この場合、基板1を成形するキャビテイ8が形成される。キャビテイ8は、固定側金型5に取り付けられたゲート部9及び可動側金型6に上下動自在に取り付けられたゲートカット部材10に形成されたランナー12及びスプルー11とに連通されており、樹脂供給口13から供給される射出成形用樹脂は、スプルー11及びランナー12、ゲート部9を経由してキャビテイ8内に充填される。この樹脂の固化後ゲートカット部材10が上方に移動して、射出された樹脂をゲートカット部で切断し、その後可動側金型6が移動して金型が開き、成形品が図示されない突き出しピンにより突き出されて基板1が製造される。なお、固定側金型5は、固定側取り付け板19に、また、可動側金型6は、可動側取り付け板20に、取り付けられている。前述のスタンパ4は、外周部分をスタンパ外周ホルダー7で、また内周は、スタンパ内周ホルダー14で保持されて可動金型6上に取り付けられている。
参考例1
FIG. 2 is a schematic cross-sectional view of an injection molding apparatus in which a mold is closed. 4 is a stamper made of a nickel material having a surface on which an uneven surface 4 corresponding to recording information of a DVD disc is formed. , A fixed side mold, 6 is a movable side mold, 7 is a stamper outer peripheral holder, and these molds are made of stainless steel. When these molds are combined and closed on the injection molding apparatus, a molded product, in this case, a cavity 8 for molding the substrate 1 is formed. The cavity 8 communicates with a runner 12 and a sprue 11 formed on a gate cut member 10 attached to the gate 9 attached to the fixed die 5 and the movable die 6 so as to move up and down. The injection molding resin supplied from the resin supply port 13 is filled into the cavity 8 through the sprue 11, the runner 12, and the gate portion 9. After the resin is solidified, the gate cut member 10 moves upward, the injected resin is cut at the gate cut part, and then the movable mold 6 moves to open the mold, and the molded product is not shown in the drawing pin. The substrate 1 is manufactured by protruding. The fixed side mold 5 is attached to the fixed side mounting plate 19 and the movable side mold 6 is attached to the movable side mounting plate 20. The above-mentioned stamper 4 is mounted on the movable mold 6 with the outer peripheral portion held by the stamper outer peripheral holder 7 and the inner periphery held by the stamper inner peripheral holder 14.
( Reference Example 1 )

参考例1の特徴部分である可動側金型6部分の構造について、図3に従って説明すると、可動側金型6のキャビテイ面15に、ジルコニア粉末を焼結して得られ、表面が研磨された約100μm厚の円盤状板状部材16が約50μm厚みの銀ろう17によって前記キャビテイ面上に固着されている。この場合、セラミックからなる円盤状板状部材16は、この参考例1で示すように、基板1の全面に相当する部分の面積で設けても良いが、基板の凹凸面からなる記録情報部分に相当する部分のみに配置しても良い。 The structure of the movable mold 6 that is a characteristic part of the reference example 1 will be described with reference to FIG. 3. The surface of the movable mold 6 is obtained by sintering zirconia powder on the cavity surface 15 of the movable mold 6. A disk-shaped plate member 16 having a thickness of about 100 μm is fixed on the cavity surface by a silver solder 17 having a thickness of about 50 μm. In this case, the disk-like plate member 16 made of ceramic may be provided in the area of the portion corresponding to the entire surface of the substrate 1 as shown in Reference Example 1. You may arrange | position only to the corresponding part.

この板状部材の16の表面には、アモルファスのダイヤモンド状炭素質薄膜18が、マグネトロンスパッタリング法等でカーボンターゲットを用いて約3μm厚みで形成されている。この場合、ダイヤモンド状炭素質薄膜18だけでなく、この薄膜18と板状部材16との被着性を改善するため、薄膜18と板状部材16との間に、Cr、W、Ti、Si等からなるスパッタリング下地層を形成しても良い。さらに、薄膜18の摩擦係数を改善するため、フッ素含有のダイヤモンド状薄膜を用いても良い。   An amorphous diamond-like carbon thin film 18 is formed on the surface of the plate-like member 16 with a thickness of about 3 μm using a carbon target by a magnetron sputtering method or the like. In this case, in order to improve the adhesion between the thin film 18 and the plate member 16 as well as the diamond-like carbon thin film 18, Cr, W, Ti, Si are interposed between the thin film 18 and the plate member 16. A sputtering underlayer made of, for example, may be formed. Furthermore, in order to improve the friction coefficient of the thin film 18, a fluorine-containing diamond-like thin film may be used.

この金型部分は、金型6のキャビテイ面15上に、約750℃の融点を有する銀ろう17を配置し、ジルコニア材からなる円盤状板状部材16をその表面載置し、加熱炉内で、1000℃で加熱されて銀ろう17が溶融され、その後冷却されて銀ろう17が固化して板状部材16が可動側金型6に固着される。この場合、前記加熱処理によって、銀ろうの銀成分がジルコニア材からなる円盤状板状部材16及び金型6の接合面内に拡散して、強固に接合する。   In this mold portion, a silver solder 17 having a melting point of about 750 ° C. is disposed on the cavity surface 15 of the mold 6, and a disk-like plate-like member 16 made of zirconia material is placed on the surface thereof. Then, the silver braze 17 is melted by heating at 1000 ° C., and then cooled, the silver braze 17 is solidified, and the plate-like member 16 is fixed to the movable side mold 6. In this case, by the heat treatment, the silver component of the silver brazing diffuses into the joining surface of the disk-like plate member 16 made of zirconia material and the mold 6 and is firmly joined.

このようにして、固着されたジルコニア材からなる円盤状板状部材16は、研磨装置で研磨され、その表面を面精度よく、表面平滑に研磨される。その後、この金型部分を、マグネトロンスパッタ装置内に導入して、カーボンをターゲットとして板状部材16の表面にアモルファスのダイヤモンド状薄膜18を形成する。このようにして形成された金型部分にスタンパ4を設置して、可動側金型部分を成形装置に組み込む。 In this way, the disk-shaped plate member 16 made of the fixed zirconia material is polished by the polishing apparatus, and the surface thereof is polished with high surface accuracy and smooth surface. Thereafter, this mold portion is introduced into a magnetron sputtering apparatus, and an amorphous diamond-like thin film 18 is formed on the surface of the plate-like member 16 using carbon as a target. The stamper 4 is installed on the mold part formed as described above, and the movable mold part is assembled in the molding apparatus.

このようにして形成されたダイヤモンド状薄膜18の表面には、ジルコニア粒子間の空隙は、ほとんど認められず、良好な表面平滑性を有すると共に、その表面粗さRmaxは、0.01μmと良好な表面粗さ及び、0.1と低摩擦係数を示し、100万回の成形を行ってもスタンパによる摩耗粉の発生は認められなかった。
参考例2
On the surface of the diamond-like thin film 18 formed in this way, there are almost no voids between zirconia particles, and it has good surface smoothness, and its surface roughness Rmax is as good as 0.01 μm. The surface roughness and low friction coefficient of 0.1 were shown, and no generation of wear powder by the stamper was observed even after molding 1 million times.
( Reference Example 2 )

前記参考例1において、アモルファスのダイヤモンド状炭素質薄膜18を省いて同様にして可動側金型部分を作成した。このようにして形成された可動側金型部分の円盤状板状部材16の表面には、ジルコニア粒子間の空隙は、ほとんど認められず、良好な表面平滑性を有すると共に、その表面粗さRmaxは、0.02μmと良好な表面粗さ及び、0.05と低摩擦係数を示し、10万回の成形を行ってもスタンパによる摩耗粉の発生は認められなかった。
参考例3
In the reference example 1 , the amorphous diamond-like carbon thin film 18 was omitted, and a movable mold part was formed in the same manner. On the surface of the disk-shaped plate-like member 16 of the movable mold part formed in this way, there are almost no voids between the zirconia particles, and it has good surface smoothness and its surface roughness Rmax. Exhibited a good surface roughness of 0.02 μm and a low coefficient of friction of 0.05, and no wear powder was generated by the stamper even after 100,000 moldings.
( Reference Example 3 )

図4に示すように、可動側金型6のキャビテイ面15上に、前記プラズマ・パウダー・スプレイ法によって、ジルコニア粉末を使用してジルコニア材からなる断熱層を約100μm厚みで形成し、この表面を研磨した後、約50μm厚みで水ガラスからなる封口層22を形成し、この封口層22上にスタンパ4を設置した。このようにして形成された封口層22の表面は、ジルコニア粒子間の間隙が封口されて、良好な表面平滑性を示すと共に、その表面粗さRmaxは、0.03μmと良好な表面粗さを示し、10万回の成形を行ってもスタンパによる摩耗粉の発生は認められなかった。
(比較例)
As shown in FIG. 4, a heat insulating layer made of zirconia material is formed with a thickness of about 100 μm on the cavity surface 15 of the movable mold 6 by the plasma powder spray method using zirconia powder. After polishing, a sealing layer 22 made of water glass with a thickness of about 50 μm was formed, and the stamper 4 was placed on the sealing layer 22. The surface of the sealing layer 22 formed in this manner is sealed with gaps between zirconia particles and exhibits good surface smoothness, and its surface roughness Rmax is 0.03 μm and has a good surface roughness. It was shown that no abrasion powder was generated by the stamper even after molding 100,000 times.
(Comparative example)

前記参考例3において、封口層22を除き同様にして、可動側金型部分を作製した。この断熱層の表面には、ジルコニア粒子間の間隙が多数認められ、その表面粗さ、Rmaxは、0.1μmと粗く、1000回の成形でスタンパの摩耗粉の発生が認められた。 In Reference Example 3 , a movable mold part was produced in the same manner except for the sealing layer 22. A large number of gaps between zirconia particles were observed on the surface of the heat insulating layer, and the surface roughness, Rmax, was as coarse as 0.1 μm, and generation of stamper wear powder was observed after 1000 moldings.

参考例4
参考例3において、封口層として、水ガラス膜に代えて、無電解Ni-Pメッキ膜を使用した以外同様にして可動側金型部分を作製した。この封口層の表面は、ジルコニア粒子間の間隙が封口されて、良好な表面平滑性を示すと共に、その表面粗さRmaxは、0.05μmと良好な表面粗さを示し、10万回の成形を行ってもスタンパによる摩耗粉の発生は認められなかった。
参考例5
( Reference Example 4 )
In Reference Example 3 , a movable mold part was produced in the same manner except that an electroless Ni—P plating film was used as the sealing layer instead of the water glass film. The surface of the sealing layer is sealed with gaps between zirconia particles and exhibits good surface smoothness, and its surface roughness Rmax is 0.05 μm and exhibits good surface roughness. No wear powder was generated by the stamper even when the test was performed.
( Reference Example 5 )

図5は、参考例5によって形成される導光板23の平面図、図6は、図5のA−A線上で切断した断面図、図7は、図6のB部の一部を切り欠いた拡大断面図である。 5 is a plan view of the light guide plate 23 formed according to Reference Example 5 , FIG. 6 is a cross-sectional view taken along the line AA in FIG. 5, and FIG. 7 is a cutaway view of a portion B in FIG. FIG.

参考例5により形成された導光板23は、ポリカーボネートからなり、後述する成形金型により射出成形して形成される。図5及び図6から明らかなように、長さが46mmで、幅が31mmの長方形状で、その表面に段階的に傾斜する反射面24を有しており、図6の左方から入射される光源(図示せず)からの光線がこの反射面で上方に屈曲反射されるようになっている。この反射面24は、図7から明らかなように、0.3mm幅で、図5の幅方向に平行な部分的反射面24aが、長手方向に向かって、7μmづつ段階的に下降傾斜しながら160面形成されて構成されている。このような反射面24は、反射効率を上げるためにも、微小な凹凸となる多数の傾斜する部分的反射面24aが精度良く形成される必要があり、このような微小凹凸を有する反射面24を、通常の超硬合金、ステンレス鋼、炭素鋼等の金属に、直接Ni―Pメッキ膜を形成しそのメッキ膜に凹凸の成形面が形成された金型を使用した場合には、射出される溶融樹脂が金型形状に精度よく対応した状態で、転写され難く、光学的特性に問題があった。参考例5では、このような微小な凹凸面を有する導光板成形体を光学的特性が良好な状態で射出成形可能なように、金型の微小な凹凸面に対応するキャビティ表面と前記金属金型間にセラミックス材からなる断熱層を配して、射出される溶融樹脂が精度よく前記キャビティ表面が転写されるようにすると共に、微小な凹凸面を有するキャビティ表面を容易且つ確実に形成できるようにしたものである。 The light guide plate 23 formed in Reference Example 5 is made of polycarbonate and is formed by injection molding using a molding die to be described later. As is apparent from FIGS. 5 and 6, the rectangular shape is 46 mm in length and 31 mm in width, and has a reflecting surface 24 that is gradually inclined on the surface, and is incident from the left side of FIG. A light beam from a light source (not shown) is bent and reflected upward by this reflecting surface. As is apparent from FIG. 7, the reflecting surface 24 is 0.3 mm wide, and a partially reflecting surface 24a parallel to the width direction in FIG. 5 is inclined downward by 7 μm stepwise in the longitudinal direction. 160 surfaces are formed. In order to increase the reflection efficiency, such a reflection surface 24 needs to be formed with a large number of inclined partial reflection surfaces 24a that are minute irregularities with high precision, and the reflection surface 24 having such minute irregularities. When using a die with a Ni-P plating film directly formed on a normal metal such as cemented carbide, stainless steel, carbon steel, etc. In a state where the molten resin corresponding to the mold shape with high accuracy is difficult to be transferred, there is a problem in optical characteristics. In Reference Example 5 , the cavity surface corresponding to the minute uneven surface of the mold and the metal mold so that the light guide plate molded body having such a minute uneven surface can be injection-molded with good optical characteristics. A heat insulating layer made of a ceramic material is disposed between the molds so that the injected molten resin can be accurately transferred to the cavity surface, and a cavity surface having a minute uneven surface can be easily and reliably formed. It is a thing.

前記良好な光学的特性を有する導光板を得るために、図8で示される成形用金型を提供しようとするものである。図8は、図2に示すような成形装置の固定金型5または可動金型6の中に組み込まれ、キャビティ8の表面を形成する成形金型の入れ子25の断面図を示し、この入れ子25は、ステンレス鋼からなる入れ子本体26と断熱層27と封口層28とから構成されている。この入れ子本体26には、その上面に、前記導光板の長さ及び幅より長い径で深さが0.5mmの四角形状の凹み部29が形成されており、この凹み部29内に、部分安定化材YO3を含有したジルコニア(ZrO)セラミックス粉末を使用し、プラズマ・パウダースプレイ溶射法により断熱材を充填し、研磨して平坦化処理を施し、さらにこの表面にフッ化水素酸でエッチング処理を施し粗面化して断熱層27を形成する。この場合、入れ子本体26と断熱層27の密着性を良くするため、前記凹み部29の四方の内側面を図8に示すように、θ度傾斜した傾斜面30とされている。さらにこの断熱層27上及びこの断熱層27の周辺の入れ子本体26に、Ni-P無電解メッキからなる封口層28が約130μmの厚みで形成されている。ここで、前記傾斜面の角度θは、この参考例5では、30度が採用されているが、10〜60度の範囲が好ましく、角度が小さい場合には、断熱層27の入れ子本体との密着性がわるく、この角度が大きくなるにつれ密着性が改善される。しかし、この角度θが大きくなるにつれ、断熱層厚が薄くなって断熱機能が低下する部分が多くなるので、60度までの範囲が好ましい。また、この断熱層の厚みは厚いほど断熱機能が良好となるが、厚くなるに従い、溶射法による断熱層の形成に長時間を要することになるので、100〜1000μm厚みとするのがよい。 In order to obtain a light guide plate having good optical characteristics, the molding die shown in FIG. 8 is to be provided. FIG. 8 shows a cross-sectional view of a molding die insert 25 which is incorporated into the fixed mold 5 or the movable mold 6 of the molding apparatus as shown in FIG. Is composed of a nesting body 26 made of stainless steel, a heat insulating layer 27 and a sealing layer 28. The nesting body 26 is formed with a rectangular recess 29 having a diameter longer than the length and width of the light guide plate and a depth of 0.5 mm on the upper surface thereof. Using a zirconia (ZrO 2 ) ceramic powder containing the stabilizing material Y 2 O 3 , a thermal insulation material is filled by a plasma powder spray spraying method, polished and flattened, and hydrogen fluoride is applied to the surface. The heat insulation layer 27 is formed by roughening the surface by etching with acid. In this case, in order to improve the adhesion between the nesting body 26 and the heat insulating layer 27, the four inner side surfaces of the recess 29 are inclined surfaces 30 inclined by θ degrees as shown in FIG. Further, a sealing layer 28 made of Ni-P electroless plating is formed on the heat insulating layer 27 and on the nesting body 26 around the heat insulating layer 27 with a thickness of about 130 μm. Here, the angle θ of the inclined surface is 30 degrees in this reference example 5. However, the range of 10 to 60 degrees is preferable, and when the angle is small, Adhesion is poor, and the adhesion improves as this angle increases. However, as the angle θ increases, the heat insulating layer thickness decreases and the number of portions where the heat insulating function deteriorates increases. Therefore, the range up to 60 degrees is preferable. In addition, the thicker the heat insulating layer, the better the heat insulating function. However, as the thickness increases, it takes a long time to form the heat insulating layer by the thermal spraying method, so the thickness is preferably 100 to 1000 μm.

さらに、封口層28の厚みは、前述のように、1μm以上の厚みとすることで、断熱層の表面に形成される空隙を封口して、表面の平滑な面を形成することが可能であるが、さらに、この封口層28の表面をキャビティ表面33として利用する場合には、切削加工する関係上、ある程度の厚みが必要であり、厚みが厚くなるにつれ、Ni-P無電解メッキ法によるNi-P被膜の形成に長時間を要するので、500μm以下の厚みとすることが好ましい。   Further, as described above, the thickness of the sealing layer 28 is 1 μm or more, so that the void formed on the surface of the heat insulating layer can be sealed to form a smooth surface. However, when the surface of the sealing layer 28 is used as the cavity surface 33, a certain amount of thickness is necessary for cutting, and as the thickness increases, Ni by the Ni-P electroless plating method is required. Since it takes a long time to form the -P film, the thickness is preferably 500 μm or less.

この封口層28は、前記断熱層27の表面のエッチング処理により、断熱層27との密着性が改善されるとともに、鋼材からなる入れ子本体26の外周側面に幅(h1)が100〜500μmの広幅の第1段部31及び幅(h2)が10〜100μmの第1の段部31より狭幅の第2段部32を形成し、これらの段部31及び32をも被覆する構造とすることにより、断熱層27及び入れ子本体26との密着性が良好となり、成形時に封口層28の剥離や破損を防止することができる。 The sealing layer 28 is improved in adhesion to the heat insulating layer 27 by etching the surface of the heat insulating layer 27 and has a width (h1) of 100 to 500 μm on the outer peripheral side surface of the nested body 26 made of steel. The first step portion 31 and the second step portion 32 having a narrower width than the first step portion 31 having a width (h2) of 10 to 100 μm are formed, and the step portions 31 and 32 are also covered. As a result, the adhesion between the heat insulating layer 27 and the nested body 26 is improved, and the sealing layer 28 can be prevented from being peeled off or damaged during molding .

この封口層28の表面は、キャビティ表面33となるが、このキャビティ表面33は、導光板23の反射面24に対応する微細な凹凸面34が前述の長さ、幅、段差でダイヤモンド工具を使用した切削加工によって形成されている。Ni-Pからなる封口層28は、セラミックスからなる断熱層27に比較して加工性が良く、微細な凹凸がダイヤモンド工具を使用した切削加工により、容易に形成することができる。   The surface of the sealing layer 28 becomes a cavity surface 33. The cavity surface 33 has a fine uneven surface 34 corresponding to the reflecting surface 24 of the light guide plate 23, and uses a diamond tool with the above-mentioned length, width and step. It is formed by cutting. The sealing layer 28 made of Ni-P has better workability than the heat insulating layer 27 made of ceramics, and fine irregularities can be easily formed by cutting using a diamond tool.

このような金型を使用し、ポリカーボネートにより、導光板23を射出成形した結果、光学的特性の良好な導光板23を容易かつ確実に成形することができた。
(実施例)
As a result of injection molding of the light guide plate 23 with polycarbonate using such a mold, the light guide plate 23 with good optical characteristics could be easily and reliably formed.
( Example)

この実施例では、DVD用プラスチック基板を作製するに好適な金型の構造を示すもので、図9の断面図でその構造を示す。この金型は、図2の成形装置の可動金型6に対応するものであり、この金型6は、ステンレス鋼からなる円板状本体34の上面に少なくともDVDの記録情報部分に相当する幅のドーナッツ状の凹み部35が形成されており、この凹み部35内に部分安定化材YO3を含有したジルコニア(ZrO)セラミックス粉末を使用し、プラズマ・パウダースプレイ溶射法により断熱材を充填して第1の断熱層36を0.4mm厚みで形成し、続いて、酸化クロム(Cr2O3)粉末を使用してプラズマ・パウダースプレイ溶射法により第2の断熱層37を第1断熱層36上に0.1mm厚みで積層形成し、この第2断熱層37の表面を研磨して、表面を平滑化する。このようにして形成された第2断熱層37の表面は、表面粗さRmaxは、0.03μmとなり、良好な表面粗さを示した。 In this embodiment, a structure of a mold suitable for producing a plastic substrate for DVD is shown, and the structure is shown in a sectional view of FIG. This mold corresponds to the movable mold 6 of the molding apparatus of FIG. 2, and this mold 6 has a width corresponding to at least the recorded information portion of the DVD on the upper surface of the disc-shaped main body 34 made of stainless steel. A donut-shaped recess 35 is formed, and a zirconia (ZrO 2 ) ceramic powder containing a partial stabilizing material Y 2 O 3 is used in the recess 35, and a heat insulating material is formed by a plasma powder spray spraying method. To form a first heat insulation layer 36 having a thickness of 0.4 mm, and then, using a chromium oxide (Cr 2 O 3 ) powder, a second heat insulation layer 37 is formed by plasma powder spraying. The first heat insulating layer 36 is laminated to a thickness of 0.1 mm, and the surface of the second heat insulating layer 37 is polished to smooth the surface. The surface of the second heat insulating layer 37 formed in this way had a surface roughness Rmax of 0.03 μm, indicating a good surface roughness.

さらに、この第2断熱層37上にアモルファスのダイヤモンド状炭素質薄膜38を、マグネトロンスパッタリング法により、3μm厚で形成されており、この炭素質薄膜38の表面粗さRmaxは、0.01μmとさらに平滑性が改善されている。   Further, an amorphous diamond-like carbon thin film 38 is formed on the second heat insulating layer 37 by a magnetron sputtering method so as to have a thickness of 3 μm. The surface roughness Rmax of the carbon thin film 38 is further 0.01 μm. Smoothness is improved.

この炭素質薄膜38上にスタンパ4を配置して、可動側金型部分を成形装置に組み込み、射出成形を行った結果、100万回の成形を行ってもスタンパによる摩耗粉の発生が認められなかった。 As a result of placing the stamper 4 on the carbon thin film 38, incorporating the movable side mold part into the molding apparatus, and performing injection molding , generation of wear powder by the stamper was recognized even after one million moldings. There wasn't.

本発明による成形用金型を使用して、CDやDVD等の光ディスク用プラスチック基板あるいはパーソナルコンピュータや携帯電話等に使用される液晶表示装置用または他の用途に使用される透明樹脂製の導光板等の分野においても有効に利用することができる。なお、本発明の実施例として、光ディスク用プラスチック基板の例を示したが、本発明の成形用金型は、光ディスク用プラスチック基板に限らず、ハードディスク用プラスチック基板やプラスチックレンズ等においても適用できるものである。 Light guide plate made of transparent resin for use in plastic substrates for optical disks such as CDs and DVDs, liquid crystal display devices used in personal computers, mobile phones, etc., or other applications using the molding die according to the present invention It can be effectively used also in such fields. In addition, although the example of the optical substrate for optical disks was shown as an Example of this invention, the metal mold | die of this invention is applicable not only to the plastic substrate for optical disks but to the plastic substrate for hard disks, a plastic lens, etc. It is.

本発明による成形用金型を用いて製造されたDVDディスク用基板の記録情報に対応する凹凸部2に相当する部分の拡大断面図である。It is an expanded sectional view of the part corresponding to the uneven | corrugated | grooved part 2 corresponding to the recording information of the board | substrate for DVD disc manufactured using the metal mold | die by this invention. 本発明で使用される成形金型が閉じられた射出成形装置の概略断面図である。It is a schematic sectional drawing of the injection molding apparatus with which the shaping die used by this invention was closed. 参考例1の可動側金型部分の断面図である。 5 is a cross-sectional view of a movable mold part of Reference Example 1. FIG. 参考例3の可動側金型部分の断面図である。 10 is a cross-sectional view of a movable mold part of Reference Example 3. FIG. 参考例5による成形金型を用いて製造された導光板の平面図である。It is a top view of the light-guide plate manufactured using the shaping die by the reference example 5 . 図5のA−A線上で切断された断面図である。It is sectional drawing cut | disconnected on the AA line of FIG. 図6のB部の拡大断面図である。It is an expanded sectional view of the B section of FIG. 参考例5による成形金型の一部となる入れ子の断面図である。It is sectional drawing of the nest | insert which becomes a part of shaping die by the reference example 5. FIG. 本発明の実施例の可動側金型部分の断面図である。It is sectional drawing of the movable mold part of the Example of this invention.

符号の説明Explanation of symbols

1 DVDディスク基板
2 凹凸部
3 凹部
4 スタンパ
5 固定側金型
6 可動側金型
7 スタンパ外周ホルダー
8 キャビテイ
9 ゲート部
10 ゲートカット部材
15 キャビテイ面(固定側金型)
16 板状部材
17 銀ろう
18 ダイヤモンド状薄膜
19 固定側取り付け板
20 可動側取り付け板
21 断熱層
22 封口層
23 導光板
24 反射面
24a 部分的反射面
25 入れ子
26 入れ子本体
27 溶射法による断熱層
28 封口層
29 凹み部
30 傾斜面
31 第1段部
32 第2段部
33 キャビティ表面
34 金型本体
35 ドーナッツ状凹み部
36 第1断熱層
37 第2断熱層
38 炭素質薄膜
DESCRIPTION OF SYMBOLS 1 DVD disc board | substrate 2 Uneven part 3 Concave part 4 Stamper 5 Fixed side metal mold 6 Movable side metal mold 7 Stamper outer periphery holder 8 Cavity 9 Gate part 10 Gate cut member 15 Cavity surface (fixed side metal mold)
DESCRIPTION OF SYMBOLS 16 Plate-shaped member 17 Silver brazing 18 Diamond-like thin film 19 Fixed side mounting plate 20 Movable side mounting plate 21 Heat insulation layer 22 Sealing layer 23 Light guide plate 24 Reflecting surface 24a Partial reflecting surface 25 Nesting 26 Nesting body 27 Thermal insulation layer 28 by thermal spraying method 28 Sealing layer 29 Indented portion 30 Inclined surface 31 First step portion 32 Second step portion 33 Cavity surface 34 Mold body 35 Donut-shaped indentation portion 36 First heat insulating layer 37 Second heat insulating layer 38 Carbonaceous thin film

Claims (2)

金属材料からなる可動側金型及び固定側金型のキャビテイを構成する少なくとも一方の表面に、溶射法によるセラミックからなる断熱層を形成し、この断熱層の表面に、アモルファスのダイヤモンド状炭素質薄膜を形成し、かつ、前記断熱層は、ジルコニア、酸化チタン、アルミナ、チタン酸アルミニウムの少なくとも1種から選ばれたセラミック材で構成されたことを特徴とする成形用金型。 A heat insulating layer made of ceramic is formed on the surface of at least one of the cavities of the movable mold and the fixed mold made of a metal material, and an amorphous diamond-like carbon thin film is formed on the surface of the heat insulating layer. And the heat insulation layer is made of a ceramic material selected from at least one of zirconia, titanium oxide, alumina, and aluminum titanate . 金属材料からなる可動側金型及び固定側金型のキャビテイを構成する少なくとも一方の表面に、溶射法によるセラミックからなる断熱層を形成し、この断熱層の表面に、アモルファスのダイヤモンド状炭素質薄膜を形成し、かつ、前記断熱層は、ジルコニアで構成された第1の断熱層とその上に積層される酸化クロム、窒化クロム、アルミナ、窒化アルミ、窒化珪素、炭化珪素の少なくとも1種から選ばれた材質からなる第2の断熱層から構成されたことを特徴とする成形用金型。 A heat insulating layer made of ceramic is formed on the surface of at least one of the cavities of the movable mold and the fixed mold made of a metal material, and an amorphous diamond-like carbon thin film is formed on the surface of the heat insulating layer. And the heat insulating layer is selected from at least one of a first heat insulating layer made of zirconia and chromium oxide, chromium nitride, alumina, aluminum nitride, silicon nitride, and silicon carbide laminated thereon. A molding die comprising a second heat insulating layer made of the above-described material .
JP2003381913A 2002-11-13 2003-11-12 Mold for molding Expired - Fee Related JP4181017B2 (en)

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