JP4153849B2 - セラミックヒータおよびそれを用いたグロープラグ - Google Patents
セラミックヒータおよびそれを用いたグロープラグ Download PDFInfo
- Publication number
- JP4153849B2 JP4153849B2 JP2003303762A JP2003303762A JP4153849B2 JP 4153849 B2 JP4153849 B2 JP 4153849B2 JP 2003303762 A JP2003303762 A JP 2003303762A JP 2003303762 A JP2003303762 A JP 2003303762A JP 4153849 B2 JP4153849 B2 JP 4153849B2
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- JP
- Japan
- Prior art keywords
- ceramic heater
- lead
- ceramic
- exposed
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 113
- 238000010438 heat treatment Methods 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- 238000005219 brazing Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- Resistance Heating (AREA)
Description
従って、電圧印加時における突出部の耐熱衝撃に強く、通電耐久性の優れたセラミックヒータを提供することができる。また、このような耐熱衝撃に強いセラミックヒータを用いたグロープラグでは着火不良がなく信頼性を格段に向上させることが可能である。
11:セラミック体
12:発熱抵抗体
13:引出部
14:陽極端子
15:リード線
16:突出部
20:セラミックヒータ
22:金属製外筒
24:陽極端子
25:ハウジング
26:グロープラグ
Claims (4)
- 棒状のセラミック体と、該セラミック体中に内蔵された発熱抵抗体と、該発熱抵抗体に接続され前記セラミック体の表面側に導出されたリード線と、該リード線と接続され前記セラミック体の表面に露出した引出部と、該引出部の露出部と接続された陽極端子とを備えたセラミックヒータにおいて、前記セラミック体の一方端面に突出部を形成するとともに、前記引出部が前記突出部の側壁の複数箇所で露出し、かつ、前記引出部の露出部が、前記突出部の側壁を介して対向する位置に形成されるとともに前記露出部のそれぞれに前記陽極端子が接続可能に構成されていることを特徴とするセラミックヒータ。
- 前記突出部の外径Aと前記セラミック体の外径Bとの比が、0.4≦A/B≦0.88であることを特徴とする請求項1に記載のセラミックヒータ。
- 前記引出部の露出部の面積が1×105〜6.8×105μm2であることを特徴とする請求項1に記載のセラミックヒータ。
- 金属製外筒の先端開口部に請求項1〜3のいずれかに記載のセラミックヒータを挿入固定したことを特徴とするグロープラグ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003303762A JP4153849B2 (ja) | 2003-08-27 | 2003-08-27 | セラミックヒータおよびそれを用いたグロープラグ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003303762A JP4153849B2 (ja) | 2003-08-27 | 2003-08-27 | セラミックヒータおよびそれを用いたグロープラグ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005071943A JP2005071943A (ja) | 2005-03-17 |
JP4153849B2 true JP4153849B2 (ja) | 2008-09-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003303762A Expired - Fee Related JP4153849B2 (ja) | 2003-08-27 | 2003-08-27 | セラミックヒータおよびそれを用いたグロープラグ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4153849B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2005117492A1 (ja) * | 2004-05-27 | 2008-04-03 | 京セラ株式会社 | セラミックヒータ及びそれを用いたグロープラグ |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1916480B1 (en) * | 2005-07-26 | 2013-04-03 | Kyocera Corporation | Brazed structure, ceramic heater, and glow plug |
WO2009085311A1 (en) * | 2007-12-29 | 2009-07-09 | Saint-Gobain Ceramics & Plastics, Inc. | Ceramic heating elements |
JP6979375B2 (ja) * | 2018-02-27 | 2021-12-15 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
-
2003
- 2003-08-27 JP JP2003303762A patent/JP4153849B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2005117492A1 (ja) * | 2004-05-27 | 2008-04-03 | 京セラ株式会社 | セラミックヒータ及びそれを用いたグロープラグ |
Also Published As
Publication number | Publication date |
---|---|
JP2005071943A (ja) | 2005-03-17 |
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