JP4138122B2 - Sensor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, an IC module having a detection unit is housed and fixed in the housing so that the detection unit is disposed at the front end of the housing, and one end of a cord is connected to the IC module in the housing. More particularly, the present invention relates to a sensor device that is suitably used as a vehicle wheel speed sensor.
[0002]
[Prior art]
Conventionally, such an apparatus is already known from, for example, Japanese Utility Model Publication No. 6-76865.
[0003]
[Problems to be solved by the invention]
In the above-mentioned conventional one, the housing for positioning and fixing the IC module at a fixed position while ensuring the sealing performance of the connection portion between the IC module and the signal line is a cylindrical case that houses the holder to which the IC module is attached. A connector for closing a rear end opening of the case and electrically connecting the IC module to the IC module; and a connector formed by a synthetic resin by integrally connecting the connector and the rear of the case The cover is attached to the end, and one end of the cord connected to the terminal of the connector is embedded in the cover. For this reason, it is difficult to say that the number of parts constituting the sensor device is small, and accuracy is required for the structure of the seal portion between the case and the cover or between the connector and the case, and the assemblability is also excellent. Is hard to say.
[0004]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a sensor device that can be configured with a small number of parts and that has improved assemblability while eliminating the need for a seal structure. And
[0005]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, an IC module having a detection portion is housed and fixed in the housing so that the detection portion is disposed at a distal end portion of the housing, and one end portion of a cord is connected to the housing. In the sensor device connected to the IC module, a holder having an accommodation recess, an IC module accommodated in the accommodation recess, and a part of the IC module side in the state connected to the IC module is the accommodation recess and code to be accommodated, the inner挿組solid with the lid part of the IC module and the code is attached to the holder over the open end entire of the housing recess in a state of being accommodated configured A housing made of synthetic resin formed by molding in a mold apparatus into which the insertion assembly is inserted, wherein the entire insertion assembly is covered, and the housing Characterized in that al the cord is pulled out to the outside.
[0006]
According to such a configuration, the entire insertion assembly formed by covering the entire open end of the holder accommodating the IC module and a part of the cord with the lid is covered with the molded housing. The necessary case is not required, and the number of parts can be reduced. In addition, since the cord is pulled out from the housing that covers the entire insertion assembly, it is not necessary to provide a seal portion between the insertion assembly and the housing, and the insertion assembly is inserted into the mold apparatus. Since the housing is formed by molding, the assemblability is also improved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on one embodiment of the present invention shown in the accompanying drawings.
[0008]
1 to 6 show an embodiment when the present invention is applied to a vehicle wheel speed sensor. FIG. 1 is a longitudinal sectional view of the sensor device, and FIG. 2 is a sectional view taken along line 2-2 of FIG. 3 is a view taken in the direction of arrow 3 in FIG. 2, FIG. 4 is an exploded perspective view of the insertion assembly, FIG. 5 is a cross-sectional view of the holder and the lid at a portion corresponding to line 5-5 in FIG. FIG. 3 is a longitudinal sectional view of a housing molding die apparatus.
[0009]
First, in FIGS. 1 to 3, this sensor device is used as, for example, a vehicle wheel speed sensor, and an IC module 13 is housed and fixed in a housing 12 fixed to a fixed support 11. A cord 16 connected to the module 13 extends from the housing 12.
[0010]
The IC module 13 includes a detection unit 14 including a magnet and a Hall IC, a capacitor, a substrate, a pair of terminals 15 and 15, and the like, and the detection unit 14 is disposed at the distal end portion of the housing 12 and the pair of terminals 15 and 15. The housing 15 is housed and fixed in the housing 12 so as to be arranged toward the rear side.
[0011]
Referring also to FIG. 4, the cord 16 is formed by covering a pair of bundled signal wires 17 and 17 with an insulating coating material 18 made of synthetic resin. A substantially cylindrical cord holder 19 made of synthetic resin is attached. A plurality of, for example, two recesses 20, 20 spaced apart in the axial direction are provided on the outer periphery of the cord holder 19, and molten resin flows into these recesses 20, 20 when the housing 12 is molded, The connection between the cord holder 19 and the housing 12 becomes strong.
[0012]
The extending portions of the signal lines 17 and 17 from one end of the insulating coating material 18 are connected to the terminals 15 and 15 of the IC module 13 by caulking using conductive metal joints 21 and 21, welding, or the like. The
[0013]
The IC module 13 and a part of the cord 16 on the IC module 13 side connected to the IC module 13 are accommodated in a holder 22 formed of a synthetic resin, and the IC module 13 and the cord 16 An insertion assembly 24 is formed by attaching a synthetic resin lid 23 to the holder 22 in a state where a part of the insertion assembly 24 is accommodated, and the insertion assembly 24 is covered with the housing 12.
[0014]
Further, referring to FIG. 5 as well, the holder 22 is formed by a cord lead-out portion 22b connected to the rear end of the holder main portion 22a extending in a straight line at a substantially right angle and integrally, and is formed in a substantially L shape. The
[0015]
The holder 22 is formed with a housing recess 25 that is open to one side. The housing recess 25 is connected to the module housing portion 25a formed in the front half of the holder main portion 22a and the module housing portion 25a. It consists of a pair of signal line accommodating portions 25b and 25b formed in the latter half of the holder main portion 22a and the cord lead-out portion 22b.
[0016]
The front half of the holder main portion 22a is formed in a substantially U-shaped cross section so as to form the module housing portion 25a, and the front end of the holder main portion 22a is an end that defines the front end of the module housing portion 25a. A wall 26 is provided, and a part of the end wall 26 is notched at a portion on the opening end side of the module housing portion 25a .
[0017]
A partition wall 27 projecting from the rear half of the holder main portion 22a and both side portions of the cord lead-out portion 22b is projected from the rear half of the holder main portion 22a and the center portion in the width direction of the cord lead-out portion 22b. The signal line housing portions 25b and 25b are formed between the partition wall 27 and the rear half portion of the holder main portion 22a and both side portions of the cord lead-out portion 22b.
[0018]
Further, a pair of holding claws 28, 28 having a substantially L-shaped cross section so as to protrude forward from the end wall 26 are integrally provided at the front end of the holder main portion 22a, and the cord lead-out portion 22b. Guide protrusions 29, 29 extending in a straight line are integrally protruded on the outer surfaces of both sides of the two, and a pair of protrusions 30, 30 are integrally protruded on the outer side surface in the longitudinal direction of the holder main portion 22a. A rib 31 extending in a straight line is integrally projected at the center in the width direction of the surface of the holder main portion 22a opposite to the housing recess 25.
[0019]
The detection part 14 of the IC module 13 in which the main part is accommodated in the module accommodation part 25a is disposed in front of the holder 22 over the end wall 26, and the holder 22 includes a pair of holding claws 28, 28 provided at the front end. Inserted and held between the end wall 26. On the other hand, one end of each of the signal lines 17 and 17 in the cord 16 is connected to the terminals 15 and 15 of the IC module 13 by joints 21 and 21 and the like. The portions are accommodated in both signal line accommodating portions 25b, 25b that are substantially L-shaped, and the remaining portions of both signal lines 17, 17 are drawn out from the holder 22. At this time, the cord holder 19 attached to one end portion of the insulating coating material 18 in the cord 16 is disposed to face the rear end of the cord lead-out portion 22b in the holder 22 with a predetermined interval.
[0020]
The lid body 23 includes a first flat plate portion 23a that covers all of the module housing portion 25a in the holder main portion 22a and a part of the signal wire housing portions 25b and 25b, and the remaining portions of the signal wire housing portions 25b and 25b in the cord lead-out portion 22b. The first flat plate portion 23a is formed in a substantially L-shape and is connected to the second flat plate portion 23b that covers the right angle, and the first flat plate portion 23a has a rectangular fitting hole into which the partition wall 27 in the holder 22 is fitted. 33 is provided. On both sides of the connecting portion of the first and second flat plate portions 23a and 23b, guide portions 34 and 34 for fitting the guide protrusions 29 and 29 in the holder 22 have a substantially U-shaped cross-sectional shape. Provided integrally.
[0021]
The main part is housed in the module housing part 25 a of the holder 22, the housing recess 25 included in the holder 22, and the detection part 14 is held at the tip of the holder 22. The IC module 13 is connected to the IC module 13. In the state, a part of the signal lines 17 and 17 on the IC module 13 side is accommodated in the cord accommodating portions 25b and 25b, and the lid 23 is attached to the holder 22 so as to cover the opening end of the accommodating recess 25. An interpolation assembly 24 will be constructed.
[0022]
Such an insertion assembly 24 is inserted into the mold apparatus 39 shown in FIG. 6, and in order to position the insertion assembly 24 in the mold apparatus 39, the insertion assembly 24 is used. One positioning projection 35 projects from the front of the first flat plate portion 23a of the lid 23, and a pair of positioning projections 36, 36 project from the rear of the first flat plate portion 23a. Further, at the front part of the holder main part 22a of the holder 22, one positioning protrusion 37 protruding in a direction opposite to the positioning protrusions 35, 36. Are provided with positioning projections 38, 38 projecting on the same side as the positioning projection 37.
[0023]
The mold apparatus 39 includes a fixed mold 40, and first and second movable molds 41 and 42 that can move toward and away from the fixed mold 40. The fixed mold 40 is in a clamped state. A cavity 43 corresponding to the outer shape of the housing 12 is formed between the mold 40 and both movable molds 41 and 42.
[0024]
In the first movable mold 41, the positioning projections 35, 36... In the insertion assembly 24 are engaged with the distal ends, and the positioning sections 44, 44 for positioning the insertion assembly 24 in the mold device 39. .. Are provided, and the fixed mold 40 is engaged with positioning protrusions 37, 38,... Of the insertion assembly 24 to position the insertion assembly 24 in the mold device 39. Positioning portions 46, 47... Are provided.
[0025]
Incidentally, as shown in FIGS. 2 and 3, the housing 12 is integrally provided with a bracket portion 12a extending outward, and the bracket 12a is fastened to the support body 11 with the bracket portion 12a. A metal collar 48 through which a bolt (not shown) is inserted is embedded in the body. Thus, the second movable mold 42 is integrally provided with a support portion 49 that is inserted into the collar 48.
[0026]
In this way, a hard synthetic resin such as polyamide mixed with glass fibers is provided in the first movable mold 41 in a state where the position of the insertion assembly 24 is determined in the mold apparatus 39. By being injected into the cavity 43 from a gate (not shown), the molding device 39 performs molding of the housing 12, and the housing 12 is buried up to a part of the cord holder 19 attached to the cord 16. As a result, the entire insertion assembly 24 is covered, and the cord 16 is pulled out from the housing 12.
[0027]
Next, the operation of this embodiment will be described. In this sensor device, an insertion assembly 24 in which the entire open end of the holder 22 in which a part of the IC module 13 and the cord 16 is accommodated is covered with a lid 23. Since it is covered with the housing 12 molded with synthetic resin, the case in which the IC module is accommodated in the prior art becomes unnecessary, and the number of parts constituting the housing 12 can be reduced.
[0028]
In addition, since the cord 16 is pulled out from the housing 12 that covers the entire insertion assembly 24, it is not necessary to provide a seal portion between the insertion assembly 24 and the housing 12. Since the housing 12 is formed by molding in the state of being inserted into the device 39, the assemblability is also improved.
[0029]
Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the present invention described in the claims. Is possible.
[0030]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the number of parts by eliminating the case that has been conventionally required, and it is possible to eliminate the need to provide a seal portion between the insertion assembly and the housing. Assemblability is also improved.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a sensor device.
2 is a cross-sectional view taken along line 2-2 of FIG.
FIG. 3 is a view taken in the direction of arrow 3 in FIG. 2;
FIG. 4 is an exploded perspective view of the insertion assembly.
FIG. 5 is a cross-sectional view of the holder and the lid at a portion corresponding to line 5-5 in FIG.
FIG. 6 is a longitudinal sectional view of a housing molding die apparatus.
[Explanation of symbols]
12 ... Housing 13 ... IC module 14 ... Detection part 16 ... Cord 22 ... Holder 23 ... Cover body 25 ... Housing recess 24 ... Insertion assembly 39 ...・ Mold equipment

Claims (1)

An IC module (13) having a detection portion (14) is housed and fixed in the housing (12) so that the detection portion (14) is disposed at the tip of the housing (12), and the cord (16) In the sensor device in which one end of the sensor is connected to the IC module (13) in the housing (12),
A holder (22) having a housing recess (25), an IC module (13) housed in the housing recess (25), and the IC module (13) side connected to the IC module (13). A cord (16) that is partly accommodated in the accommodating recess (25), and the entire open end of the accommodating recess (25) in a state where a part of the IC module (13) and the cord (16) is accommodated. And a lid (23) mounted on the holder (22) to form an insertion assembly (24), and a mold apparatus (39) in which the insertion assembly (24) is inserted. A synthetic resin housing (12) formed by molding covers the entire insertion assembly (24), and the cord (16) is drawn out from the housing (12). Sensor device.

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