JP4135016B2 - Optical transceiver - Google Patents

Description

  The present invention relates to an optical transceiver, and more particularly, to a bidirectional optical transceiver that performs transmission and reception at different wavelengths using the same fiber.

  2. Description of the Related Art A transmission / reception integrated bidirectional assembly that transmits and receives light of different wavelengths in one optical fiber is known. By setting the transmission light to 1.3 μm and the reception light to 1.55 μm, it becomes possible to simultaneously transmit and receive one optical fiber. For example, the following Patent Document 1 discloses a sleeve for aligning optical fibers on one side surface of a box-type main body, an optical transmission module on a side surface facing the one side surface, and other side surfaces connecting both side surfaces. And an optical receiving module are disclosed. Alternatively, Patent Document 2 below also discloses a transmission / reception integrated assembly. However, a specific form of the optical transceiver on which the transmission / reception integrated assembly is mounted is not disclosed.

On the other hand, in recent years, there are industry standards for external dimensions of pluggable optical transceivers such as so-called SFP (Small Form Factor Pluggable) -MSA (Multi-Source Agreement) and XFP-MSA. There is a widespread spread of optical transceivers that are defined and conform to this standard. However, these optical transceivers stipulated by MSA are intended for so-called full-duplex communication, in which the transmission fiber and the reception fiber are different. An example in which an integrated subassembly is incorporated into an optical transceiver that complies with these industry standards is not yet known.
JP 2004-012835 A US Pat. No. 6,783,284

  The present invention has been made in view of the above, and an object of the present invention is to provide an optical transceiver in which a transmission / reception integrated subassembly is appropriately mounted.

  An optical transceiver according to the present invention includes a transmission / reception integrated subassembly, a circuit board electrically connected to the transmission / reception integrated subassembly, and a housing for housing the transmission / reception integrated subassembly and the circuit board. The transmission / reception integrated subassembly includes a sleeve that accommodates an optical fiber, and a coaxial light emitting subassembly and a coaxial light receiving subassembly that are optically coupled to the optical fiber, and the optical axis of the light emitting subassembly and the light receiving subassembly. It is an assembly assembled integrally so that the optical axis of the assembly is non-parallel. The optical transceiver further includes a fixing part for fixing the transmission / reception integrated subassembly to the housing. The housing has a front space that accommodates the distal end portion of the sleeve, a rear space that accommodates the light emitting subassembly and the light receiving subassembly, and a partition that partitions the front space and the rear space. The partition has a front part and a rear part facing each other, and an intermediate part sandwiched between the front part and the rear part. A first opening that communicates with the first space is formed at the front part, and a second opening that communicates with the second space is formed at the rear part. A third opening that communicates with the first and second openings is formed in the intermediate portion so that the back surface of the front portion and the front surface of the rear portion are exposed. A flange accommodated in the third opening is formed on the outer surface of a portion of the sleeve excluding the tip. The fixed component has first and second pillars that sandwich the portion of the sleeve that includes the flange. Since the first and second pillar portions are respectively press-fitted into the first and second insertion ports provided in the intermediate portion, the flange and the fixing component are placed on the rear surface of the partition wall front and the front surface of the partition wall rear portion. And is positioned between and.

  By pressing the first and second column portions into the first and second insertion ports, respectively, the sleeve of the transmission / reception integrated subassembly is held between the first and second column portions, and the sleeve The formed flange and fixed part are positioned in the housing. As a result, the fixing and positioning of the transmission / reception integrated subassembly with respect to the housing can be completed simultaneously. For this reason, the optical transceiver of the present invention is easy to assemble. In addition, since the sleeve is held in place of the light emitting subassembly and the light receiving subassembly, the transmission / reception integrated subassembly can be fixed regardless of the shape and arrangement of the light emitting subassembly and the light receiving subassembly. In addition, since the movement of the transmission / reception integrated subassembly in the axial direction of the sleeve is restricted by the front part and the rear part of the partition wall, misalignment of the transmission / reception integrated subassembly in that direction is unlikely to occur.

  Each of the 1st and 2nd pillar part may have a level | step difference engaged with a flange. The flange may be pressed against the front rear surface, and the first and second pillars may be pressed against the rear front surface.

  Since the flange is engaged with the step of each column portion, the sleeve can be securely held by these column portions. Further, since the movement in the direction in which the flange is pressed against the step is regulated by each column part, the positional deviation of the transmission / reception integrated subassembly in that direction is unlikely to occur.

  Each of the first and second column portions may have a rib pressed against the front surface of the rear portion of the partition wall.

  Since the first and second column portions are pressed against the rear portion of the partition wall via the ribs, these column portions are less likely to be removed from the insertion port, and the positional displacement of the fixed component is less likely to occur. As a result, the transmission / reception integrated subassembly is more securely fixed and positioned.

  The fixed component may further include a third pillar portion disposed between the first and second pillar portions. The third pillar portion may be press-fitted into a third insertion port provided in the housing, and may have a step that engages with the flange. The flange may be pressed against the back surface of the front portion of the partition wall by the first, second, and third pillar portions.

  In addition to the first and second column portions, the third column portion supports the flange and presses against the front portion of the partition wall, so that the transmission / reception integrated subassembly is more securely fixed and positioned.

  ADVANTAGE OF THE INVENTION According to this invention, the optical transceiver which mounted the transmission / reception integrated bidirectional assembly appropriately can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is an exploded perspective view of a bidirectional communication optical transceiver according to an embodiment. The optical transceiver 10 includes a bi-directional optical sub-assembly (BOSA) 11 including both an optical transmitting device and an optical receiving device, and an integrated circuit that performs electrical processing on the BOSA 11. (Integrated Circuit: IC) 73 on which the circuit board 12 is mounted, the housing 13 housing the BOSA 11 and the circuit board 12 while defining their positions, the housing 13 is covered, and the BOSA 11 and the circuit board 12 are electromagnetically applied from the outside. And a metal cover 14 for shielding. An EMI sheet 82 and an insulating film 83 are sequentially covered on the main surface of the circuit board 12 opposite to the main surface on which the IC 73 is mounted.

  The optical transceiver 10 is a so-called pluggable (insertable / removable) optical transceiver, and is inserted into a cage mounted on a host system, and an electrical connector provided in the cage is formed at the rear end of the circuit board 12. By inserting the plug 40 and ensuring electrical continuity, it becomes possible to communicate with the host system. A bail 15 and a latch mechanism 16 constituting an engagement / release mechanism between the cage and the optical transceiver 10 are attached to the housing 13, and further, the rear end of the circuit board 12, that is, the electric plug 40 is provided. The circuit board 12 is fixed to the housing 13 via the sub-holder 17 so as to define the position with respect to the housing 13.

  FIG. 2 is a perspective view showing the external appearance of the BOSA 11. The BOSA 11 includes a cylindrical sleeve 18 that accommodates an optical fiber, a coaxial light-emitting subassembly (TOSA) 19 optically coupled to the optical fiber, and a coaxial light-receiving subassembly ( This is an assembly in which Receiving Optical Sub-Assembly (ROSA) 20 is integrally assembled. The BOSA 11 has a T-shaped external shape in which two coaxial optical modules 19 and 20 are installed with a difference of about 90 ° in the axial direction with respect to one sleeve 18. The TOSA 19 is installed at a position facing the sleeve 18, and the ROSA 20 is installed in a direction orthogonal to the optical axis connecting the sleeve 18 and the TOSA 19. That is, the optical fiber in the sleeve 18 and the TOSA 19 have a common optical axis 91, and the optical axis 92 of the ROSA 20 is substantially perpendicular to the optical axis 91.

  FIG. 3 is a partial longitudinal sectional view along the major axis of the optical transceiver 10 showing how the BOSA 11 is fixed to the housing 13. In this figure, the cover 14, the heat radiating sheet 50 and the EMI sheet 51, which will be described later, are omitted. As shown in FIG. 3, a cylindrical fiber stub 85 containing an optical fiber 84 is accommodated in the sleeve 18. A portion of the fiber stub 85 excluding the base end portion is covered with a cylindrical inner sleeve 86, and a bush 87 is attached to both base end portions of the fiber stub 85 and the inner sleeve 86. The sleeve 18 is fixed so as to cover the portion excluding the base end portion of the bush 87 and the inner sleeve 86. A proximal end portion of the bush 87 is fixed to a distal end surface of a main body portion 21 to be described later.

  The TOSA 19 and the ROSA 20 have so-called coaxial type packages. That is, in each of the TOSA 19 and the ROSA 20, the semiconductor optical element is mounted on one main surface (hereinafter, “upper surface”) of the disk-shaped metal stem 23. This semiconductor optical element is a light emitting element in TOSA 19 and a light receiving element in ROSA 20. Electrical connection between the semiconductor optical device and the outside is performed via a lead pin 24 attached to the stem 23. The lead pin 24 is drawn to the outside at a substantially right angle to the other main surface (hereinafter referred to as “bottom surface”) of the stem 23. Therefore, the optical axis 91 of the TOSA 19 and the longitudinal direction of the lead pin 24 of the ROSA 20 are substantially perpendicular.

  As shown in FIG. 3, a dome-shaped cylindrical cap 89 is attached to the top surface of the stem 23 of the TOSA 19 so as to cover the light emitting element 88, and the coaxial package is configured by the cap 89 and the stem 23. ing. A lens 90 is installed in an opening provided on the upper wall of the cap 89, and the TOSA 19 is optically coupled to the optical fiber 84 through the lens 90. Such a package structure is the same for ROSA 20.

  Each of the sleeve 18, the TOSA 19, and the ROSA 20 is fixed to a cylindrical main body 21. The main body 21 incorporates a WDM filter 41 (see FIG. 3) that bends the optical axis 91 of the optical fiber 84 by 90 ° toward the ROSA 20. The TOSA 19 emits light having a wavelength of 1.3 μm and enters the optical fiber 84. On the other hand, the ROSA 20 receives light having a wavelength of 1.55 μm from the optical fiber 84. The WDM filter 41 separates the light having a wavelength of 1.3 μm and the light having a wavelength of 1.55 μm. In other words, the WDM filter 41 receives light in the wavelength band of 1.3 μm from the TOSA 19 and sends it to the optical fiber 84, and receives light in the wavelength band of 1.55 μm from the optical fiber 84 and sends it to the ROSA 20.

  In the present embodiment, the TOSA 19, the ROSA 20, the main body 21, and the outer wall of the sleeve 18 are all made of metal. However, these parts may be those in which a resin base wall is provided on a metal base.

  Among the BOSA 11, the TOSA 19, the ROSA 20, and the main body 21 are accommodated in a space 13 a provided in the housing 13. In addition, a receptacle portion 26 having an opening 26a into which an optical connector attached to the tip of an external optical fiber can be inserted is formed at the tip portion of the housing 13, and the tip portion of the sleeve 18 is formed in the opening 26a. Contained. A partition wall 27 is provided between the opening 26a and the space 13a. The partition wall 27 is provided with a through hole communicating with the opening 26a and the space 13a. The through hole accommodates a portion of the sleeve 18 excluding the tip.

  The partition wall 27 includes a front part 58 and a rear part 59 that face each other, and an intermediate part 60 sandwiched between the front part 58 and the rear part 59. The front portion 58 is formed with an opening 58a that communicates with the opening 26a of the receptacle portion 26, and the rear portion 59 is formed with an opening 59a that communicates with the space 13a. The intermediate portion 60 is formed with a relatively wide opening 60a communicating with the openings 58a and 59a. As a result, the back surface 58b of the front portion 58 and the front surface 59b of the rear portion 59 are exposed through the opening 60a. The through hole of the partition wall 27 is formed by these continuous openings 58a to 60a. The back surface 58b of the front portion 58 and the front surface 59b of the rear portion 59 extend from the front end and the rear end of the intermediate portion 60 along a plane orthogonal to the optical axis 91 of the optical fiber 84, respectively.

  The opening 58 a of the front wall 58 has a circular cross section, and the diameter thereof is substantially the same as the outer diameter of the sleeve 18. The portion of the sleeve 18 following the tip is accommodated in the opening 58a. Thereby, the movement of the BOSA 11 in the direction orthogonal to the optical axis 91 is restricted, and the positional deviation is suppressed. The distal end portion of the sleeve 18 passes through the opening 58a and enters the opening 26a of the receptacle portion 26, where it can be engaged with an external optical connector.

  The protruding amount of the sleeve 18 to the opening 26a conforms to the standard of the optical connector. An annular flange 22 for determining the position of the BOSA 11 with respect to the housing 13 is provided at the root of the sleeve 18, that is, in the vicinity of the main body 21. The flange 22 is in contact with the back surface of the front portion 58 of the partition wall 27, whereby the protruding amount of the sleeve 18 into the receptacle portion 26 and the position of the BOSA 11 along the long axis direction of the optical transceiver 10 are determined. The

  The BOSA 11 can move freely behind the transceiver simply by bringing the flange 22 into contact with the front portion 58 of the partition wall 27. Therefore, when the external optical connector is inserted into the opening 26a of the receptacle 26 for engagement with the sleeve 18, The BOSA 11 moves backward, and appropriate optical coupling cannot be realized. Therefore, in the transceiver 10, the backward movement of the BOSA 11 is restricted by fitting the fixing holder 25 into the opening 60a of the intermediate portion 60.

  Hereinafter, the fixed holder 25 will be described in detail with reference to FIGS. 4 to 6. 4 is a partial cross-sectional view taken along the line IV-IV in FIG. 3, and FIG. 5 is a partial cross-sectional view showing the fixing holder 25 by virtually removing BOSA 11. FIG. 6A is a perspective view of the fixed holder 25 as seen from the front, and FIG. 6B is a perspective view as seen from the rear.

  As shown in FIG. 6, the fixed holder 25 is a U-shaped component, and has an upper column portion 28 and a lower column portion 29 that extend substantially parallel to each other, and a support body 93 that connects these upper and lower column portions. With respect to the support body 93, the lower column portion 29 extends longer than the upper column portion 28. On the support 93, a central column portion 30 that protrudes substantially parallel to the upper and lower column portions is formed between the upper column portion 28 and the lower column portion 29. The length that the central column portion 30 extends from the support 93 is shorter than the upper and lower column portions.

  As shown in FIGS. 4 and 5, the upper column portion 28, the lower column portion 29, and the central column portion 30 are press-fitted into insertion ports 68, 69, and 70 formed in the intermediate portion 60 of the partition wall 27, respectively. . These column portions 28 to 30 are in contact with the outer surface of the sleeve 18 so as to sandwich the sleeve 18. As shown in FIG. 1, these insertion ports 68 to 70 communicate with an opening 95 formed on one side surface of the housing 13, and the support 93 of the fixed holder 25 is accommodated in the opening 95. . That is, the fixed component 25 is embedded in the intermediate portion 60 of the partition wall 27. As shown in FIG. 5, a part of the insertion ports 68 to 70 extends to the front portion 58, and as a result, a step 94 is generated on the back surface 58 b of the front portion 58. The front end portions of the column portions 28 to 30 are accommodated in the steps 94.

  As shown in FIG. 6A, a step 32 for accommodating the flange 22 is formed on the surface of the column portions 28 to 30 of the fixed holder 25 facing the flange 22 of the sleeve 18. As shown in FIG. 3, each step 32 is engaged with the flange 22. As a result, the sleeve 18 is firmly held from above and below by the upper column portion 28 and the lower column portion 29.

  As shown in FIG. 6B, a triangular columnar rib (small protrusion) 31 is formed on the surface of the column portions 28 to 30 opposite to the step 32, and the column portions 28 to 30 are inserted. It becomes a crushing allowance when press-fitting into the mouths 68-70. That is, the width of each insertion port (the length along the long axis of the optical transceiver 10) is the thickness of the flange 22 and the portion of the fixed holder 25 that engages with the flange 22 (hereinafter referred to as “flange engaging portion”). ) And the total value excluding the height of the rib 31, that is, the thickness of the flange 22 and the thickness of the flange engaging portion of the fixing holder 25. It is set slightly larger than the total value.

  For this reason, when the column portions 28 to 30 are inserted into the insertion ports 68 to 70, these ribs 31 are pressed against the front surface of the rear wall 59 to be compressed, and the reaction causes the step 32 of the column portions 28 to 30. Is pressed against the flange 22. Accordingly, the flange 22 is pressed against the back surface 58b of the front portion 58. As a result, the fixed holder 25 and the flange 22 are firmly held and positioned by the front portion 58 and the rear portion 59. As a result, the fixing holder 25 and the BOSA 11 are securely fixed, and are prevented from falling off.

  Further, one main surface of the flange 22 contacts the back surface 58b of the front portion 58, and the column portions 28 to 30 that engage with the other main surface of the flange 22 contact the front surface 59b of the rear portion 59 via the ribs 31. Therefore, the movement of the BOSA 11 along the optical axis 91 is restricted. Therefore, the position of the BOSA 11 is reliably positioned in the long axis direction of the optical transceiver 10.

  Thus, by pressing the column portions 28 to 30 into the insertion ports 68 to 70, the BOSA 11 is held between the upper column portion 28 and the lower column portion 29, and the fixing holder 25 is fixed to the housing 13. The As a result, the fixing and positioning of the BOSA 11 with respect to the housing 13 can be completed simultaneously. Therefore, the optical transceiver 10 is easy to assemble. In particular, if the upper column part 28 and the lower column part 29 are inserted into the two insertion openings 68 and 69, respectively, the fixing and positioning are completed. Compared to the structure in which the upper and lower column parts are inserted into a single insertion opening. The fixed holder 25 can be attached smoothly.

  Further, since the sleeve 18 is sandwiched instead of the TOSA 19 and the ROSA 20, the BOSA 11 can be fixed regardless of the shape and arrangement of the TOSA 19 and the ROSA 20.

  Note that the central column portion 30 is not always essential, and the BOSA 11 can be appropriately fixed and positioned by the upper column portion 28 and the lower column portion 29 alone. However, when the central column portion 30 is provided, the flange 22 is supported at three locations, so that the fixing and positioning can be further ensured. The length of the central column 30 from the support 93 is preferably set so that the central column 30 does not press the side surface of the sleeve 18 when the fixing holder 25 is completely inserted into the housing 13. This is because if the central column 30 presses the sleeve 18, the optical axis may be shifted in the BOSA 11.

  The transceiver 10 is configured such that the fixed holder 25 is inserted from the side surface of the housing 13. However, the transceiver 10 is not limited to the side surface of the housing 13 and may be configured to be inserted from the upper surface or the bottom surface. However, in the case of a configuration that is inserted from the upper surface or the bottom surface of the housing 13, there remains a possibility that the ROSA 20 disposed at an angle of approximately 90 ° with respect to the optical axis of the sleeve 18 becomes an obstacle. Specifically, when one of the pillars 28 and 29 of the fixed holder 25 becomes an obstacle to the attachment of the ROSA 20, for example, a problem arises in that a thickness sufficient to ensure sufficient strength cannot be maintained. There is. Therefore, in the present embodiment, a configuration is adopted in which the BOSA 11 is fixed by inserting the fixing holder 25 from the side surface of the housing 13 located on the opposite side of the ROSA 20.

  Refer to FIG. 1 again. The BOSA 11 is electrically connected to the circuit board 12 by flexible boards (hereinafter “FPC boards”) 33 and 34. As already described, the TOSA 19 and the ROSA 20 are attached to the BOSA 11 main body by 90 ° different axial directions due to optical restrictions. Therefore, the connection by the FPC boards 33 and 34 between the TOSA / ROSA and the circuit board 12 must also be based on this 90 ° different angle.

  7 and 8 are a perspective view and a plan view showing how the BOSA 11 and the circuit board 12 are connected. The circuit board 12 is a substantially rectangular board along the long axis direction of the optical transceiver 10 (TOSA 19 optical axis direction), and a connector plug 40 is formed at the rear end thereof. A wiring pattern on the circuit board 12 is extended on the plug 40. When the optical transceiver 10 is inserted into the cage of the host system, the plug 40 engages with the electrical connector of the host system, and the wiring pattern on the plug 40 contacts the electrode of the electrical connector.

  At the front end portion of the circuit board 12, one side of the board 12 is greatly cut to accommodate the TOSA 19, and the stem 23 of the TOSA 19 is positioned in the cut. An FPC board 33 extends from the cut end face 12 a and is connected to the TOSA 19. As shown in FIG. 3, the FPC board 33 is bent downward once with respect to the circuit board 12 and then bent upward so as to be substantially parallel to the stem 23 of the TOSA 19. As a result, the cross section of the FPC board 33 is bent in a U shape. A hard substrate 37 is provided at the tip of the FPC substrate 33 and is connected to a lead pin 24 extending from the stem 23 of the TOSA 19.

  On the other hand, on the other side of the front end of the circuit board 12, an extended end portion 42 protruding from the end face 12a is provided. The extended end portion 42 extends toward the ROSA 20 along the optical axis 91 of the TOSA 19. An FPC board 34 extends from the distal end surface 42 a of the extended end portion 42 toward the stem 23 of the ROSA 20. The FPC board 34 is extended upward so as to stand up with respect to the circuit board 12 after extending from the extended end portion 42. A portion 34 c that extends from the side portion 34 b of the standing portion 34 a formed by the bending is bent forward so as to face the ROSA 20. A hard substrate 38 is provided at the tip of the connecting portion 34c and is connected to the lead pin 24 extending from the stem 23 of the ROSA 20. Below, the part 34c extended from the side part 34b of the standing part 34a is called a "connection part." As shown in FIG. 8, the connection portion 34 c is bent so that its cross section is U-shaped, and further bent in the vicinity of the hard substrate 38 so as to be substantially parallel to the main surface of the stem 23. Connected to.

  As shown in FIG. 8, the standing portion 34a is formed by bending the FPC board 34 with a straight line 71 as a bending line. The bend line 71 is a straight line substantially parallel to the distal end surface 42a of the extension 42 in a plane including the optical axes 91 and 92 (the paper surface of FIG. 8). In this way, the standing portion 34a can be easily formed by bending the FPC board 34 along the distal end surface 42a of the extension portion 42.

  In the transceiver 10, the circuit board 12 is a multilayer wiring board, and a configuration is adopted in which the resin layers and wiring layers of the FPC boards 33 and 34 are embedded in the middle layer of the multilayer board. That is, the FPC boards 33 and 34 extending from the end face of the circuit board 12 are obtained by extending the resin layer and the wiring layer embedded in the middle layer as they are. Further, the hard substrates 37 and 38 to which the lead pins 24 of the TOSA 19 and the ROSA 20 are connected are also multilayer wiring boards, and the resin layers and wiring layers of the FPC boards 33 and 34 are embedded in the middle layer in the multilayer wiring board. 24 is electrically connected to the FPC boards 33 and 34 in the hard boards 37 and 38.

  In the BOSA 11 in which the lead pins 24 of the TOSA 19 and the ROSA 20 are pulled out differently by 90 °, the FPC boards 33 and 34 for electrical connection to the lead pins 24 must be bent with a relatively large curvature. The stress exerted on the FPC boards 33 and 34 is relatively large. In a form in which the circuit board 12 and the hard boards 37 and 38 are separated from the FPC board in terms of material, a situation in which this stress cannot be resisted is created. Therefore, in the transceiver 10, in order to obtain sufficient reliability even when the FPC boards 33 and 34 are bent with a large curvature, the resin layer and the wiring layer in the FPC boards 33 and 34 are connected to the circuit board 12. In addition, a configuration in which the resin layer and the wiring layer in the hard substrates 37 and 38 are continuous and integrally connected is employed.

  FIG. 9 is a plan view showing the circuit board 12 and the FPC boards 33 and 34 before being connected to the BOSA 11. Here, the FPC boards 33 and 34 are drawn in an unbent state. The FPC board 33 for the TOSA 19 extends between the end face 12 a of the circuit board 12 and the hard board 37 for the TOSA 19. The hard substrate 37 is formed with four via holes 39 that are electrically connected to the lead pins 24 of the TOSA 19, and these via holes 39 transmit signals of Sig, Vcc, GND, and Mon to the TOSA 19. Send and receive. Here, Sig is a data signal input to the TOSA 19, Vcc is a power supply voltage supplied to the TOSA 19, GND is a ground voltage supplied to the TOSA 19, and Mon is output from the TOSA 19 and represents an optical output of the light emitting element in the TOSA 19. This is a monitor signal. Hereinafter, the lead pin 24 connected to the ground voltage via hole 39 is referred to as a ground lead pin. The hard substrate 37 is mounted with a chip capacitor connected between the Vcc via hole 39 and the GND via hole 39 to stabilize the power supply voltage.

  On the other hand, the FPC board 34 for the ROSA 20 extends along the TOSA 19 from the distal end surface 42a of the extended end portion 42 of the circuit board 12, and is bent substantially perpendicularly to the main surface of the circuit board 12 to form the standing portion 34a. After the formation, the connecting portion 34c is extended from the side portion 34b of the standing portion 34a and connected to the hard substrate 38 for the ROSA 20. The main surface of the hard substrate 38 depicted in FIG. 9 is a surface that does not face the stem 23 of the ROSA 20 when the FPC substrate 34 is connected to the ROSA 20, that is, the outer surface.

  As a result, the front end portion of the connection portion 34 c can be arranged substantially parallel to the stem 23 of the ROSA 20 and connected to the lead pin 24 without twisting the FPC board 34. Since it is not necessary to twist the FPC board 34, the FPC board 34 is not easily disconnected, and thus the reliability of electrical connection between the ROSA 20 and the circuit board 12 can be improved.

  In particular, in the transceiver 10, the connecting portion 34c is bent along a bending line 72 perpendicular to the optical axes 91 and 92 of both the TOSA 19 and the ROSA 20. By bending the connection portion 34c in this way, the tip end portion of the connection portion 34c can be made substantially parallel to the stem 23 of the ROSA 20. Therefore, the FPC board 34 can be smoothly connected to the ROSA 20 without being twisted.

  Further, in the present transceiver 10, an extended end portion 42 that protrudes toward the ROSA 20 is provided on the end surface 12a of the circuit board 12 from which the FPC board 33 for the TOSA 19 extends, and the FPC board 34 extends from the tip. For this reason, the length of the FPC board 34 can be shortened by the length of the extended end portion, thereby improving the electrical characteristics related to optical reception.

  As shown in FIG. 8, the distal end surface 42a of the extension 42 is inclined with respect to the optical axis 92 of the ROSA 20, and the FPC board 34 extends along a direction perpendicular to the distal end surface 42a. For this reason, the FPC board 34 extends from the front end surface 42a so as to approach the TOSA 19, and forms a standing portion 34a. The connecting portion 34 c extends from the side portion 34 b far from the TOSA 19 in the standing portion 34 a so as to move away from the TOSA 19.

  As described above, the FPC board 34 extends so as to approach the TOSA 19 once and then away from the TOSA 19 because the curvature of the FPC board 34 when the connecting portion 34c of the FPC board 34 is bent for connection to the ROSA 20 is obtained. This is to prevent overloading. By bending the FPC board 34 as described above, the standing portion 34 a can be formed to be inclined with respect to the bottom surface of the stem 23 of the ROSA 20. As shown in FIG. 8, the standing portion 34 a is inclined so as to gradually approach the stem 23 as it proceeds from the side portion close to the TOSA 19 to the side portion 34 b far from the TOSA 19. Compared with the case where the standing portion 34a is perpendicular to the bottom surface of the stem 23, the connection portion 34c extends from the side portion 34b of the standing portion 34a at an angle closer to the parallel to the bottom surface of the stem 23. Curvature can be suppressed. Thereby, disconnection of the FPC board 34 is less likely to occur, so that the reliability of electrical connection can be further increased.

  The hard substrate 38 is formed with five via holes 39 electrically connected to the lead pins 24 of the ROSA 20, and these via holes 39 are formed of Out, / Out, Vcc, Vpd, and GND with the ROSA 20. Send and receive each signal. Out and / Out are complementary data signals output from the ROSA 20 and correspond to optical signals received by the ROSA 20. Vcc and GND are a power supply voltage and a ground voltage supplied to the ROSA 20. Vpd is a bias voltage applied to the semiconductor light receiving element mounted in the ROSA 20.

  The electronic circuit including the light emitting element in the TOSA 19 is electrically connected to the electronic circuit on the circuit board 12 by the FPC board 33. Similarly, the electronic circuit including the light receiving element in the ROSA 20 is electrically connected to the electronic circuit on the circuit board 12 by the FPC board 34. The signal (Sig) wiring pattern in the FPC board 33 is impedance-matched to the electronic circuit in the TOSA 19 and the electronic circuit on the circuit board 12. Similarly, the signal (Out, / Out) wiring pattern in the FPC board 34 is impedance-matched to the electronic circuit in the ROSA 20 and the electronic circuit on the circuit board 12. This impedance matching is realized by appropriately designing the dielectric constant and thickness of the base resin layer in addition to the width of the signal wiring pattern in the FPC boards 33 and 34. This impedance matching suppresses distortion appearing in the signal waveform even in a signal frequency band exceeding 1 GHz.

  FIG. 10 shows another example of the shape of the FPC board 34 for the ROSA 20. Here, the FPC boards 33 and 34 are drawn in a state before being bent. In the example of FIG. 9, the extended end 42 extending along the optical axis 91 of the TOSA 19 is provided on the circuit board 12, and the FPC board 34 having the standing part 34a and the connecting part 34c extends from the front end face 42a. . On the other hand, in the example shown in FIG. 10, the extended end 42 of the circuit board 12 is further extended forward and disposed below the ROSA 20. The FPC board 34 extends along the optical axis 92 of the ROSA 20 from the distal end side part 42 b of the extended end part 42, and is connected to the hard board 38. The hard substrate 38 is connected to the lead pins 24 of the ROSA 20 in a state where the FPC substrate 34 is bent so as to stand up with respect to the extended end portion 42. Compared to the example of FIG. 9, the length of the FPC board 34 can be remarkably shortened, and the number of bendings of the FPC board 34 can be suppressed to one, so that the mechanical reliability of the wiring structure on the FPC board 34 is improved. In addition, the electrical characteristics, particularly the high-frequency propagation characteristics can be prevented from being disturbed. Furthermore, since the extended end 42 extends longer than the example of FIG. 9, components can be mounted on the extended end 42, and the component mounting area of the circuit board 12 can be increased.

  In the present example, the connection between the hard substrate 39 and the ROSA lead pin 24 is reversed for the hard substrate 39 from the previous example. That is, in the previous example, the surface appearing in FIG. 9 was located on the side (outside) that does not face the stem 23 of the ROSA 20. In this example, the surface appearing in FIG. 10 is in a positional relationship facing the stem 23 of the ROSA 20.

  Below, the bracket 43 attached to the stem 23 of the TOSA 19 will be described. FIG. 11 is a perspective view showing the BOSA 11 to which the bracket 43 is attached, and FIG. 12 is a perspective view showing the bracket 43. FIG. 13 is a plan view showing the connection of the BOSA 11 with the bracket 43 attached thereto to the circuit board 12.

  In the optical transceiver 10, the package grounds of the TOSA 19 and the ROSA 20 are unified with the ground of the ROSA 20 so that the large current switching operation in the TOSA 19 does not affect the small signal circuit of the ROSA 20. That is, not only the ROSA 20 package but also the TOSA 19 package is grounded to the ROSA 20 ground. Grounds such as light emitting elements and light receiving elements for monitoring mounted on the TOSA 19 are insulated from at least the package of the TOSA 19, and grounding lead pins provided on the stem 23 of the TOSA 19 are also separated from the package of the TOSA 19 (accordingly, from the stem 23. Also) is insulated. By mounting the optical transceiver 10 on the host system, the ground of the TOSA 19 and the ground of the ROSA 20 are connected in the host system, and at that time, the ground lead pin of the TOSA 19 is grounded.

  Accordingly, the ground lead pin or the solder for connecting the ground lead pin to the via hole 39 of the hard substrate 37 cannot be brought into contact with the package of the TOSA 19. Therefore, the distance between the stem 23 of the TOSA 19 and the hard substrate 37 is prevented so that excess solder does not spread between the stem 23 and the hard substrate 37 due to the capillary phenomenon and the ground lead pin is not electrically connected to the stem 23. Must be secured sufficiently.

  Further, the transceiver 10 operates at a speed in the GHz band. The single-core bidirectional optical communication is defined by the so-called fiber channel standard, but its operation speed exceeds 1 GHz. In the case of handling such a high-speed signal, the heat generation in the LD (laser diode) built in the TOSA 19 is larger than the heat generation in the preamplifier built in the ROSA 20. Furthermore, since the temperature characteristics of the LD and the temperature dependence of the performance are much larger than the preamplifier, the heat dissipation function of the TOSA 19 must be sufficiently ensured.

  For this reason, in this embodiment, the bracket 43 shown in FIG. 12 is attached to the stem 23 of the TOSA 19. The bracket 43 includes a conductive ring portion 44 having a plurality of tabs 46 to 48 and a conductive finger portion 45 extending from the ring portion 44 so as to be away from the center of the ring portion 44. In the present embodiment, both the ring portion 44 and the finger portion 45 are made of metal. The ring portion 44 is attached to the side surface of the stem 23 of the TOSA 19, and the finger portion 45 is connected to a grounding conductor pattern (GND pattern) on the circuit board 12. Thereby, a heat radiation path from the stem 23 of the TOSA 19 to the circuit board 12 is secured.

  As shown in FIG. 12, three tall tabs 46, three tall tabs 47, and two stopper tabs 48 extend from one end face of the ring portion 44. The tall tabs 46 and the short tabs 47 are alternately arranged on the end face of the ring portion 44, and the tips of the tabs are bent at an angle of approximately 90 ° toward the inside of the ring portion 44. Is formed. One stopper tab 48 is formed at a position facing the finger portion 45 on the end face of the ring portion 44, and the other stopper tab 48 is located between the other stopper tab 48 and the finger portion 45 on the same end face. Is formed.

  When the stem 23 of the TOSA 19 is inserted into the ring portion 44, the table portion 49 at the tip of the low-profile tab 47 contacts the bottom surface of the stem 23 (see FIG. 11). That is, the table portion 49 of the low-profile tab 47 functions as a stopper with respect to insertion of the TOSA 19 into the ring portion 44 of the stem 23. On the other hand, when the stem 23 and the bracket 43 of the TOSA 19 are assembled in this way, when the lead pin 24 protruding from the assembly is inserted into the via hole 39 of the hard substrate 37, the table portion 49 at the tip of the tall tab 46 is Abuts on the hard substrate 37 to support the hard substrate 37. That is, a gap equal to the difference in height between the two types of tabs 46 and 47 is generated between the hard substrate 37 and the stem 23. In this example, the gap, that is, the difference between the heights of the two tabs was set to 0.4 mm. Such a sufficiently large gap prevents surplus solder when the lead pins 24 are connected by soldering from spreading in the gap between the hard substrate 37 and the stem 23 due to capillarity, and the ground lead pin of the TOSA 19 It is avoided that the (GND lead) is electrically connected to the stem 23.

  On the other hand, the distance between the hard substrate 38 for the ROSA 20 and the stem 23 is also set to about 0.4 mm, but the ground of the ROSA 20 is set to the same potential as the BOSA main body 21, and the stem 23 and the TOSA 19 are about the same. It is not necessary to set the distance from the hard substrate 38 strictly. Further, the FPC 34 for the ROSA 20 has a longer length from the circuit board 12 to the hard board 38 than the TOSA 19 side, so that the curvature of bending can be reduced. Accordingly, the stress applied to the hard substrate 38 for the ROSA 20 is not as great as the stress applied to the hard substrate 37 for the TOSA 19. Therefore, the distance between the stem 23 of the ROSA 20 and the hard substrate 38 can be determined using a jig different from the bracket 43 when the hard substrate 38 and the lead pin 24 are soldered.

  The stopper tabs 48 a and 48 b extend higher than the table portion 49 of the tall tab 47. The lead pin 24 of the TOSA 19 is inserted into the via hole 39 of the hard substrate 37 and soldered, and when the BOSA 11 is assembled into the housing 13 with the bracket 43 attached to the stem 23 of the TOSA 19, the FPC substrate 33 is bent downward and convexly. Then, a repulsive force is generated in the FPC board 34. This repulsive force tends to push the hard substrate 37 upward. At this time, the stopper tab 48 abuts against the side surface of the hard substrate 37 to absorb the repulsive force. In the absence of the stopper tab 48, the lead pin 24 inserted into the via hole 39, strictly speaking, the root portion of the lead pin 24 must absorb all of this repulsive force. In this example, since the repulsive force is absorbed by the stopper tab 48, the mechanical distortion with respect to the lead pin 24 can be relieved and the reliability of electrical connection can be improved.

  After the BOSA 11, the circuit board 12 and the fixing holder 25 described above are installed in the housing 13, the heat dissipation sheet 50 and the EMI sheet 51 are attached to the housing 13. FIG. 14 is an exploded perspective view showing this attachment. FIG. 15 is a perspective view showing the EMI sheet 51. FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 3 and shows the heat-dissipating sheet 50 and the EMI sheet 51 after being attached.

  As shown in FIG. 14, the heat dissipation sheet 50 before being attached has a shape in which one corner of a rectangular flat plate is cut out in a square shape. The relatively narrow end portion 50a formed by this notch is accommodated in a recess 75 provided in the upper wall 13a of the housing 13.

  The EMI sheet 51 is an electromagnetic shielding material that blocks electromagnetic waves and prevents EMI (Electromagnetic Interference). As shown in FIG. 15, the EMI sheet 51 is a metal part having a flat base portion 52, and a curved portion 53 and a finger portion 54 that are formed one step lower than the base portion 52. The base portion 52 is accommodated in the concave portion 75 of the housing 13 so as to overlap the end portion 50 a of the heat dissipation sheet 50. One end of the base portion 52 is connected to the bending portion 53 and the finger portion 54 while being bent obliquely downward to form a step. The curved portion 53 is a partially cylindrical curved plate formed along the outer peripheral surface of the main body portion 21 of the BOSA 11 and has a circular cross section. On the other hand, the finger part 54 is a rectangular flat plate and extends from the base part 52 along with the curved part 53.

  As shown in FIG. 14, the heat dissipation sheet 50 is placed on the BOSA 11, and the EMI sheet 51 is further stacked thereon. Since the heat dissipating sheet 50 is flexible, it is deformed according to the shape of the EMI sheet 51 and is in close contact with the outer peripheral surface of the main body 21 of the BOSA 11 and the side surface of the stem 23. As shown in FIG. 16, the height of the step formed between the base portion 52, the curved portion 53, and the finger portion 54 corresponds to the difference in height between the bottom surface of the recess 75 and the main body portion 21 of the BOSA 11. .

  14 and 16, when the base portion 52 of the EMI sheet 51 is accommodated in the recess 75, the curved portion 53 of the EMI sheet 51 covers the outer peripheral surface of the main body portion 21 of the BOSA 11, and the finger portion 54 of the TOSA 19 The side surfaces of the stem 23 and the hard substrate 37 are covered. Thereby, the EMI noise leaking from the stem 23 and the lead pin 24 is effectively blocked, and the influence of the ROSA 20 on the small signal amplification unit is suppressed.

  The heat dissipation sheet 50 is sandwiched between the EMI sheet 51 and the BOSA 11 and is in contact with the main body portion 21 of the BOSA 11 and the stem 23 of the TOSA 19. The heat dissipation sheet 50 is made of a resin having good thermal conductivity, such as a silicone resin to which thermally conductive particles are added. The heat dissipating sheet 50 is sandwiched between the EMI sheet 51 and the BOSA 11 and is in close contact with the BOSA 11, so that heat generated in the BOSA 11, particularly the TOSA 19, is effectively transmitted to the EMI sheet 51 or the housing 13, and the heat dissipating effect is obtained. Increase.

  On the other hand, the heat dissipation sheet 50 is stored in the recess 75 of the housing 13 so as to overlap the EMI sheet 51, and the combined thickness of both sheets before installation is set slightly larger than the depth of the recess 75. Has been. For this reason, when the metal cover 14 is put on the housing 13 after the both sheets are attached, the heat dissipation sheet 50 exerts an effect of increasing the heat dissipation effect by pressing the EMI sheet 51 against the metal cover 14 to be brought into close contact therewith.

  A method for manufacturing the optical transceiver 10 on which the BOSA 11 having the above configuration is mounted will be described.

  17 to 23 show the method of manufacturing the optical transceiver 10 in the order of the steps. First, the bracket 43 described above is attached to the stem 23 of the TOSA 19 as shown in FIG. 11, and the low-profile tab 47 engaged with the bottom surface of the stem 23 is soldered to the stem 23. Thereafter, the lead pins 24 of the TOSA 19 and the ROSA 20 are passed through the via holes 39 of the hard substrates 37 and 38 provided at the tips of the FPC boards 33 and 34 extending from the circuit board 12, and the two are soldered. The connection and fixing between the BOSA main body 21 and the stem 23 of the TOSA 19 and ROSA 20 are performed before these solder connections. However, the rotation angle of the two stems 23 with respect to the BOSA main body 21 is determined in consideration of the optical coupling between the optical fiber 84 in the sleeve 18 and the optical element mounted on each stem 23. The angle, that is, the position of the lead pin 24 of the TOSA 19 and the ROSA 20 with respect to the BOSA main body 21 is not necessarily fixed.

  In the optical transceiver 10, the variation in the position of the lead pin 24 is absorbed by using the FPC boards 33 and 34. Further, a bracket 43 having a stopper tab 48 is attached to the TOSA 19 so that stress due to positional variation exerted on the FPC board 33 does not directly affect the lead pin 24. On the ROSA side, the stress exerted on the FPC board 34 is absorbed by the fact that the length of the FPC board 34 from the circuit board 12 is longer than that on the TOSA side and that the FPC board 34 is bent in the middle. Yes. At this stage, the solder connection between the finger portion 45 of the bracket 43 and the circuit board 12 is not performed.

  The BOSA 11 and the circuit board 12 assembled in this way are assembled into the housing 13 as shown in FIG. From the rear side of the housing 13, the sleeve 18 of the BOSA 11 is inserted into a through hole formed in the partition wall 27 of the housing 13. A notch 76 extending forward from the rear end is formed on the side wall of the housing 13, and a groove 77 is formed on the inner surface of the side wall so as to be continuous with the notch 76. In addition, a protrusion 78 is provided substantially at the center of the side surface of the circuit board 12, and a portion of the circuit board 12 in front of the protrusion 78 is formed wider than other portions. When the circuit board 12 with BOSA is inserted from the rear side of the housing 13 so that the wide portion 79 fits into the groove 77 on the inner surface of the side wall of the housing 13, the front end of the protrusion 78 of the circuit board 12 comes into contact with the notch 76 at the back end. The circuit board 12 stops. Thus, the insertion distance of the circuit board 12 is determined.

  Thereafter, as shown in FIG. 18, the sub-holder 17 is inserted from the rear side of the circuit board 12. The sub-holder 17 is a resin part provided with an opening 55 for receiving the rear end of the substrate 12, and grooves on both sides of the circuit board 12 are accommodated on two opposite side surfaces of the opening 55. 56 is formed. A claw 57 having a shape that traces the rear end face of the projection 78 of the circuit board 12 is provided on the outer surface of the side wall having the groove 56, and the upper side of the opening 55 (shown on the upper side in FIG. A latch structure 96 is provided on the outside of the latch structure 96.

  When the sub-holder 17 is pushed into the housing 13 until the claws 57 abut against the protrusions 78 of the board 12 while the both side ends of the circuit board 12 are accommodated in the grooves 56 in the opening 55, the latch structure 58 and the notch 76 of the housing 13 are formed. Spread both side walls of the formed part. A concave portion is formed on the inner surface of the portion, and the latch structure 58 of the sub-holder 17 is accommodated in the concave portion, and the circuit board 12 is fixed to the housing 13. As a result, the forward movement of the circuit board 12 of the housing 13, that is, the movement of the circuit board 12 to the side where the receptacle portion 26 is formed is restricted by the protrusion 78 of the circuit board 12 coming into contact with the bottom surface of the notch 76 of the housing 13. The rearward movement of the circuit board 12 is restricted by the rear side surface of the projection 78 contacting the claw 57 of the sub-holder 17 and the latch structure of the sub-holder 17 being housed in the recess of the housing side wall. Has been. Further, the movement of the circuit board 12 in the vertical direction is restricted by the side end of the circuit board 12 being accommodated in the groove 77 on the inner side surface of the housing side wall.

  After the circuit board 12 with the BOSA 11 is accommodated and fixed in the housing 13, the fixing holder 25 is assembled to the BOSA 11 (FIG. 19). An opening 95 having a shape corresponding to the support 93 of the fixed holder 25 is formed on the side surface of the housing 13, and the fixed holder 25 is pushed into the opening 95. By pushing the column portions 28 to 30 fully into the insertion ports 68 to 70 communicating with the opening 95, the column portions 28 to 30 engage with the flange 22 of the sleeve 18, and the upper and lower column portions 28 and 29 are connected to each other. The flange 22 is sandwiched from above and below. Furthermore, the BOSA 11 is positioned with respect to the housing 13 by crushing the tops of the ribs 31 formed in the fixed holder 25.

  After reliably defining the positional relationship between the BOSA 11 and the housing 13, the finger portion 45 of the bracket 43 and the circuit board 12 are soldered (FIG. 20). Since the bottom surface of the housing 13 is greatly opened, the solder connection of the finger 45 to the circuit board 12 can be easily performed. In this example, the solder connection between the bracket 43 and the circuit board 12 is performed after the fixing by the fixing holder 25, but this order may be reversed. That is, the order in which the fixing holder 25 is set after the bracket 43 is solder-connected to the circuit board 12 can also be adopted. If the position of the circuit board 12 and the housing 13 is determined and before the metal cover 14 is set, the order of setting the fixing holder 25 is not limited.

  Thereafter, as shown in FIG. 21, the heat dissipation block 61 is set in the opening 63 of the housing 13 so as to contact the IC 73 on the circuit board 12. The heat dissipation block 61 may be made of metal or resin. In the case of employing a metal heat dissipation block, it is preferable that a thin heat dissipation sheet 62 made of resin is interposed between the block and the surface of the IC 73 or on the block and a portion that the metal cover 14 will be covered later. This is to absorb the impact of the metal block.

  Further, as shown in FIG. 14, the heat dissipating sheet 50 and the EMI sheet 51 are sequentially covered on the BOSA main body 21 and the TOSA 19, and both ends thereof are installed in the recess 75 of the housing 13.

  Next, as shown in FIG. 22, the metal cover 14 is mounted so as to slide from the rear of the housing 13, and the housing 13 is wrapped with the metal cover 14. The metal cover 14 is formed by cutting a single metal plate (stainless steel or the like) and forming it only by bending. On the upper wall of the metal cover 14, elastic pieces 64 are formed at locations corresponding to the recesses 75 where the EMI sheet 51 is exposed, and locations corresponding to the openings 63 for the heat dissipation block 61 and the heat dissipation sheet 62. These elastic pieces 64 are formed by making a U-shaped cut in the upper wall of the metal cover 14, forming a plate piece having one end connected to the upper wall, and bending the plate piece toward the inside of the cover. Is done. When the elastic piece 64 presses the EMI sheet 51, the heat dissipation block 61, or the heat dissipation sheet 62, the thermal contact of the heat dissipation member to the BOSA 11, the IC 73, or the housing 13 is ensured.

  Next, the bail 15 and the latch mechanism 16 are attached to the front end of the housing 13 to which the cover 14 is attached (FIG. 23). The latch mechanism 16 has a shape formed by bending a metal plate into a U shape, and a lift claw 65 projects from the bent portion. A latch engagement structure 66 is formed on the bottom surface of the receptacle 26 of the housing 13, and one of two pieces of the latch mechanism 16 that are opposed to each other with the bent portion interposed therebetween is inserted into the latch engagement structure 66. When the transceiver 10 is inserted into the cage of the host system, a triangular latch protrusion 67 formed on the bottom surface of the receptacle 26 is formed in a hole formed at the center of the engagement piece provided at the lower front end of the cage. The transceiver 10 is secured to the cage so that the transceiver 10 cannot be easily removed from the cage. In order to release the engagement relationship between them, the bail 15 on the transceiver 10 side is rotated to push down the lift pawl 65 linked to the bail 15 downward. Since the lift pawl 65 is in contact with the engagement piece of the cage, the rotational movement of the bail 15 simultaneously pushes the engagement piece of the cage downward, and the engagement piece and the engagement protrusion 67 on the transceiver 10 side are fitted. And the transceiver 10 can be removed from the cage.

  Finally, a label 81 (see FIG. 1) is attached to the upper surface of the cover 14 or, if necessary, the side surface thereof, thereby completing the optical transceiver 10.

  The present invention has been described in detail based on the embodiments. However, the present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

It is an exploded view showing an optical transceiver of an embodiment. It is a perspective view which shows the transmission-and-reception integrated subassembly mounted in the optical transceiver of embodiment. It is a fragmentary longitudinal cross-section which shows the optical transceiver of embodiment. FIG. 4 is a partial cross-sectional view taken along line IV-IV in FIG. 3. It is a fragmentary sectional view which removes BOSA virtually and shows a fixed holder. It is a perspective view which shows a fixed holder. It is a perspective view which shows the mode of the connection of a transmission / reception integrated subassembly and a circuit board. It is a top view which shows the mode of the connection of a transmission / reception integrated subassembly and a circuit board. It is a top view which shows an example of the circuit board before connecting to a transmission / reception integrated subassembly, and a flexible substrate. It is a top view which shows the other example of the circuit board before connecting to a transmission / reception integrated subassembly, and a flexible substrate. It is a perspective view which shows the transmission / reception integrated subassembly with which the bracket was mounted | worn. It is a perspective view which shows a bracket. It is a top view which shows the connection to the circuit board of the transmission / reception integrated subassembly with which the bracket was mounted | worn. It is a disassembled perspective view which shows a mode that a heat-radiation sheet and an electromagnetic shielding material are attached to a housing. It is a perspective view which shows an electromagnetic shielding material. FIG. 4 is a sectional view taken along line XVI-XVI in FIG. 3. It is a perspective view which shows the process of incorporating the assembly which connected the transmission / reception integrated subassembly and the circuit board with the flexible substrate in the housing. It is a perspective view which shows the process of attaching a sub holder to the terminal part of a circuit board, and fixing a circuit board with respect to a housing. It is a perspective view which shows the process of attaching a fixing holder from the side surface of a housing and fixing a transmission / reception integrated subassembly to a housing. It is a perspective view which shows the process of solder-connecting the finger part of a bracket to the conductor pattern of a circuit board. It is a perspective view which shows the process of making a thermal radiation block contact the surface of IC mounted on the circuit board from opening of a housing. It is a perspective view which shows the process of putting a cover on a housing. It is a perspective view which shows the process of attaching a bale and a latch mechanism to the receptacle bottom face of the housing exposed from the cover.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Optical transceiver, 12 ... Circuit board, 13 ... Housing, 14 ... Cover, 15 ... Bale, 16 ... Latch mechanism, 17 ... Sub holder, 18 ... Sleeve, 19 ... TOSA, 20 ... ROSA, 21 ... Main part, 22 ... Flange, 23 ... stem, 24 ... lead pin, 25 ... fixing holder, 26 ... receptacle, 27 ... partition wall, 28 ... upper pillar part, 29 ... lower pillar part, 30 ... central pillar part, 31 ... rib, 32 ... step, 33 , 34 ... FPC board, 37, 38 ... rigid board, 39 ... via hole, 40 ... connector plug, 41 ... filter, 42 ... extension, 43 ... bracket, 44 ... ring, 45 ... finger, 46 ... tall tab, 47 ... Lower tab, 48 ... Stopper tab, 49 ... Table part, 50 ... Heat dissipation sheet, 51 ... EMI sheet, 52 ... Base part, 53 ... Bent part, 54 ... Finger part 55 ... opening, 56 ... groove, 57 ... claw, 58 ... front part, 59 ... rear part, 60 ... middle part, 61 ... heat dissipation block, 62 ... heat dissipation sheet, 63 ... opening, 64 ... elastic piece, 65 ... lift claw, 66 ... Latch engagement structure, 67 ... Latch projection, 68-70 ... Inlet, 73 ... IC, 75 ... Recess, 76 ... Notch, 77 ... Groove, 78 ... Protrusion, 79 ... Wide portion, 93 ... Support, 95 ... Opening, 96 ... Latch structure

Claims (4)

A sleeve that houses the optical fiber, and a coaxial light emitting subassembly and a coaxial light receiving subassembly optically coupled to the optical fiber, the optical axis of the light emitting subassembly and the optical axis of the light receiving subassembly; A transmission / reception integrated sub-assembly assembled integrally so as to be non-parallel,
A circuit board electrically connected to the transmit / receive integrated subassembly;
A housing for housing the transmission / reception integrated subassembly and the circuit board;
A fixing part for fixing the transmission / reception integrated sub-assembly to the housing;
An optical transceiver comprising:
The housing is
A front space for accommodating the tip of the sleeve;
A rear space that houses the light emitting subassembly and the light receiving subassembly;
A partition partitioning the front space and the rear space;
Have
The partition has a front part and a rear part facing each other, and an intermediate part sandwiched between the front part and the rear part,
A first opening communicating with the first space is formed in the front portion,
A second opening communicating with the second space is formed in the rear portion,
The intermediate portion is formed with a third opening communicating with the first and second openings so that the back surface of the front portion and the front surface of the rear portion are exposed.
A flange accommodated in the third opening is formed on the outer side surface of the sleeve excluding the tip,
The fixing component includes first and second pillars that sandwich a portion of the sleeve including the flange,
The flange and the fixing component are inserted into the first and second insertion ports provided in the intermediate portion, respectively, so that the flange and the fixing component are connected to the rear surface of the front portion and the second portion. An optical transceiver that is sandwiched and positioned between the front of the rear. Each of the first and second pillars has a step that engages with the flange;
The optical transceiver of claim 1, wherein the flange is pressed against the back surface of the front portion, and the first and second pillar portions are pressed against the front surface of the rear portion.   The optical transceiver according to claim 2, wherein each of the first and second pillar portions includes a rib pressed against the front surface of the rear portion. The fixed component further includes a third pillar portion disposed between the first and second pillar portions, and the third pillar portion is a third insertion port provided in the housing. And has a step that engages with the flange,
4. The optical transceiver according to claim 2, wherein the flange is pressed against the back surface of the front portion by the first, second, and third pillar portions. 5.

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