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JP4105996B2 - Wire bonding method - Google Patents

Wire bonding method Download PDF

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Publication number
JP4105996B2
JP4105996B2 JP2003279556A JP2003279556A JP4105996B2 JP 4105996 B2 JP4105996 B2 JP 4105996B2 JP 2003279556 A JP2003279556 A JP 2003279556A JP 2003279556 A JP2003279556 A JP 2003279556A JP 4105996 B2 JP4105996 B2 JP 4105996B2
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Japan
Prior art keywords
wire
ball
neck height
bond point
loop
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Expired - Fee Related
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JP2003279556A
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JP2005045135A (en
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竜成 三井
直希 関根
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to JP2003279556A priority Critical patent/JP4105996B2/en
Priority to TW093115630A priority patent/TW200504902A/en
Priority to KR1020040052573A priority patent/KR100571344B1/en
Publication of JP2005045135A publication Critical patent/JP2005045135A/en
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Publication of JP4105996B2 publication Critical patent/JP4105996B2/en
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  • Wire Bonding (AREA)

Description

本発明は、第１ボンド点と第２ボンド点間をワイヤで接続するワイヤボンディング方法に係り、特に低ワイヤループ形成方法に関する。   The present invention relates to a wire bonding method for connecting a first bond point and a second bond point with a wire, and more particularly to a method for forming a low wire loop.

第１ボンド点と第２ボンド点間を接続したワイヤに垂れが生じると、ワイヤがダイに接触して電気的にショート不良となる。これを防止するため、従来は、第１ボンド点にボールを圧着して圧着ボールを形成した後、圧着ボール上に上方に伸びたネック高さ部を形成し、ネック高さ部の上端に屈折部（癖）を形成している。例えば特許文献１参照。   When the wire connecting the first bond point and the second bond point sags, the wire comes into contact with the die and an electrical short circuit occurs. In order to prevent this, conventionally, after a ball is pressed to the first bond point to form a press-bonded ball, a neck height portion extending upward is formed on the press-bonded ball and refracted at the upper end of the neck height portion. The part (癖) is formed. For example, see Patent Document 1.

特開平１０−１８９６４１号公報JP-A-10-189441

上記従来技術の方法は、圧着ボール上にネック高さ部を形成するので、必然的に高いワイヤループ形状となる。近年、半導体装置は小型化及び薄型化の傾向にあるが、従来技術の方法では、この要望を十分に満足させることがでなかった。   The above prior art method forms a neck height portion on the pressure-bonded ball, and therefore inevitably has a high wire loop shape. In recent years, semiconductor devices tend to be smaller and thinner, but the prior art methods have not been able to fully satisfy this demand.

本発明の課題は、圧着ボール上のネック高さ部を除去して低ワイヤループ化が図れると共に、ワイヤループ強度の向上が図れるワイヤボンディング方法を提供することにある。   An object of the present invention is to provide a wire bonding method capable of reducing the wire loop strength by removing the neck height portion on the press-bonded ball and improving the wire loop strength.

上記課題を解決するための本発明の請求項１は、第１ボンド点にボンディングされた圧着ボール上に上方に伸びたネック高さ部を形成して第２ボンド点にワイヤを接続した後、キャピラリの下端に延在したワイヤの先端にボールを形成し、このボールを回路基板に押し付けて下面平坦ボールを形成し、続いて前記下面平坦ボールを前記ネック高さ部の頂部に押し付けてネック高さ部を押し下げることを特徴とする。   According to claim 1 of the present invention for solving the above-mentioned problem, after connecting the wire to the second bond point by forming the neck height portion extending upward on the press-bonded ball bonded to the first bond point, A ball is formed at the tip of the wire extending to the lower end of the capillary, and this ball is pressed against the circuit board to form a lower flat ball, and then the lower flat ball is pressed against the top of the neck height to increase the neck height. It is characterized by pushing down the head portion.

ネック高さ部の頂部を押し下げるので、圧着ボールの上端部の強度が増大し、該圧着ボールの上端部からの垂れ下がりが生じなく、またネック高さ部の押し下げにより、ネック高さ部がなくなり、極めて低いワイヤループが形成される。   Since the top of the neck height portion is pushed down, the strength of the upper end portion of the press-bonded ball is increased, and no drooping from the upper end portion of the press-bonded ball occurs, and the neck height portion is eliminated by pressing down the neck height portion, A very low wire loop is formed.

本発明のワイヤボンディング方法の一実施の形態を図１及び図２により説明する。図１（ａ）に示すように、セラミック基板やプリント基板等の基板又はリードフレーム等よりなる回路基板１上には、電極パッド２ａが形成されたダイ２がマウントされている。電極パッド２ａの第１ボンド点Ａと回路基板１の配線又はリード等の第２ボンド点Ｂ間はワイヤ３により電気的に接続されている。   An embodiment of the wire bonding method of the present invention will be described with reference to FIGS. As shown in FIG. 1A, a die 2 on which an electrode pad 2a is formed is mounted on a circuit substrate 1 made of a substrate such as a ceramic substrate or a printed substrate or a lead frame. A first bond point A of the electrode pad 2 a and a second bond point B such as a wiring or lead of the circuit board 1 are electrically connected by a wire 3.

図１（ａ）に示すワイヤ３のループ形状は、一般に台形ループと呼ばれており、特許文献１の図５（ａ）と同じであり、同文献１の図６に示す工程によって形成されるので、その詳細な説明は省略する。第１ボンド点Ａと第２ボンド点Ｂとに接続したワイヤループ形状は、ネック高さ部３１、台形部長さ部分３２及び傾斜部３３とからなっており、台形部長さ部分３２の両端に屈折部３ａ、３ｂが付けられている。なお、３４は、ワイヤ３の先端に形成されたボールを電極パッド２ａにボンディングして形成された圧着ボールを示す。このような台形ループは、ダイ２の各第１ボンド点Ａと該第１ボンド点Ａに対応する各第２ボンド点Ｂにそれぞれ形成する。以上は従来技術と同じである。   The loop shape of the wire 3 shown in FIG. 1A is generally called a trapezoidal loop, is the same as FIG. 5A of Patent Document 1, and is formed by the process shown in FIG. Therefore, the detailed description is abbreviate | omitted. The wire loop shape connected to the first bond point A and the second bond point B includes a neck height portion 31, a trapezoidal portion length portion 32, and an inclined portion 33, and is refracted at both ends of the trapezoidal portion length portion 32. Portions 3a and 3b are attached. Reference numeral 34 denotes a press-bonded ball formed by bonding a ball formed at the tip of the wire 3 to the electrode pad 2a. Such a trapezoidal loop is formed at each first bond point A of the die 2 and each second bond point B corresponding to the first bond point A. The above is the same as the prior art.

次に図１（ｂ）に示すように、キャピラリ４に挿通されたワイヤ３の先端にボール５を形成する。その後、図１（ｃ）に示すように、キャピラリ４を下降させて回路基板１の電気的な接続部分以外の部分（電気的に影響しない部分）に押し付けて下端を平坦にした下面平坦ボール５ａを形成する。   Next, as shown in FIG. 1B, a ball 5 is formed at the tip of the wire 3 inserted through the capillary 4. Thereafter, as shown in FIG. 1 (c), the lower surface flat ball 5a having the lower end flattened by lowering the capillary 4 and pressing it against a portion other than the electrical connection portion of the circuit board 1 (a portion that does not affect electrically). Form.

次に図１（ｄ）に示すように、キャピラリ４を上昇及びＸＹ軸方向に移動させ、下面平坦ボール５ａを１本目のワイヤループのネック高さ部３１の頂部、即ち屈折部３ａの上方に位置させる。続いて図１（ｅ）に示すように、キャピラリ４を下降させて下面平坦ボール５ａで屈折部３ａを下方に押し下げる。これにより、屈折部３ａが除去されてネック高さ部３１は、ほぼ水平に折り曲げられ台形部長さ部分３２とほぼ同じ水平形状となる。その後図２に示すように、キャピラリ４は上昇する。   Next, as shown in FIG. 1 (d), the capillary 4 is raised and moved in the XY-axis direction, and the lower flat ball 5a is placed on the top of the neck height portion 31 of the first wire loop, that is, above the refracting portion 3a. Position. Subsequently, as shown in FIG. 1 (e), the capillary 4 is lowered and the refracting portion 3a is pushed downward by the lower flat ball 5a. As a result, the refracting portion 3a is removed, and the neck height portion 31 is bent substantially horizontally to have substantially the same horizontal shape as the trapezoidal portion length portion 32. Thereafter, as shown in FIG. 2, the capillary 4 rises.

次の２本目のワイヤループのネック高さ部３１の上方に位置し、前記と同様の動作を行う。この動作は３本目以降のワイヤループについても同様に行う。予め決められた本数のワイヤループについてのネック高さ部３１の押し下げを行った後、下面平坦ボール５ａを回路基板１の電気的に影響しない部分にステッチボンドして取り除き、新しく下面平坦ボール５ａを形成して前記した動作を行う。   The next second wire loop is positioned above the neck height portion 31 and performs the same operation as described above. This operation is similarly performed for the third and subsequent wire loops. After the neck height portion 31 is pushed down for a predetermined number of wire loops, the lower flat ball 5a is removed by stitch bonding to a portion of the circuit board 1 that is not electrically affected, and a new lower flat ball 5a is removed. Then, the above-described operation is performed.

次に図１（ａ）に示す台形ループ（以下、従来例という）と図２に示す低ワイヤループ（以下、本実施の形態という）との引張強度試験を行った結果について説明する。ワイヤ３は住友金属鉱山株式会社製の型式「ＳＧＬ（２）」の金線２５μｍを使用し、従来例及び本実施の形態をそれぞれ４０本のワイヤ３について試験を行った。なお、ワイヤループ長は、平均で０．９７ｍｍであった。第１ボンド点Ａから第２ボンド点Ｂの方向に２００μｍ離れたワイヤ３の部分を上方に引張荷重を加えてワイヤ３の破断を調べた結果、〔表１〕のような結果が得られた。   Next, the results of a tensile strength test performed on the trapezoidal loop shown in FIG. 1A (hereinafter referred to as a conventional example) and the low wire loop shown in FIG. 2 (hereinafter referred to as the present embodiment) will be described. The wire 3 used was a gold wire 25 μm of model “SGL (2)” manufactured by Sumitomo Metal Mining Co., Ltd., and the conventional example and the present embodiment were tested for 40 wires 3 respectively. The wire loop length was 0.97 mm on average. As a result of examining the breakage of the wire 3 by applying a tensile load upward to the portion of the wire 3 that is 200 μm away from the first bond point A to the second bond point B, the results shown in Table 1 were obtained. .

Figure 0004105996
Figure 0004105996

〔表１〕より明らかなように、本実施の形態は従来例より、ループ高さは平均で３０．０μｍ低くなり、引張強度は２．３９ｇ増大した。また従来例は圧着ボール３４の上端部でワイヤ３が破断したが、本実施の形態は引張荷重を加えた箇所でワイヤ３が破断した。   As apparent from [Table 1], the loop height of this embodiment is 30.0 μm lower on average and the tensile strength is increased by 2.39 g than the conventional example. In the conventional example, the wire 3 is broken at the upper end portion of the press-bonded ball 34. However, in this embodiment, the wire 3 is broken at a place where a tensile load is applied.

このように、本実施の形態は圧着ボール３４の上端では破断しなく、引張荷重を加えた箇所で破断し、また引張強度が増大したことにより、圧着ボール３４の上端部の強度が増大し、該圧着ボール３４の上端部からの垂れ下がりが生じなく、また下面平坦ボール５ａによるネック高さ部３１の押し下げにより、屈折部３ａの屈折が除去され、ネック高さ部３１と台形部長さ部分３２がほぼ水平に形成されたものと思われる。このように、ネック高さ部３１がなくなり、極めて低いワイヤループが形成された。   Thus, the present embodiment does not break at the upper end of the press-bonded ball 34, but breaks at a place where a tensile load is applied, and the tensile strength increases, so that the strength of the upper end of the press-bonded ball 34 increases. The crimp ball 34 does not sag from the upper end portion, and the refraction of the refracting portion 3a is removed by the depression of the neck height portion 31 by the lower flat ball 5a, so that the neck height portion 31 and the trapezoidal portion length portion 32 are formed. It seems that it was formed almost horizontally. In this way, the neck height portion 31 was eliminated, and an extremely low wire loop was formed.

なお、上記実施の形態は、図１（ａ）のワイヤループを全て又は複数本形成した後に図１（ｂ）乃至（ｅ）及び図２の工程を行ったが、１本のワイヤループを形成した後に図１（ｂ）乃至（ｅ）及び図２の工程を行ってもよい。しかし、この方法は、図１（ｃ）の工程及び下面平坦ボール５ａを除去するステッチ工程を毎回行う必要があるので生産性が悪い。また上記実施の形態は、図１（ｃ）のように下面平坦ボール５ａを形成した後、該下面平坦ボール５ａを図１（ｄ）（ｅ）に示すようにネック高さ部３１に押し付けたが、この下面平坦ボール５ａを形成しなく、図１（ｂ）に示すボール５を直接ネック高さ部３１に押しつけて図１（ｄ）（ｅ）に示す工程を行ってもよい。しかし、ボール５であると、ボール５とワイヤ３との位置ずれが生じ、一方が逃げ易くなるので注意が必要である。   In the above embodiment, all or a plurality of wire loops in FIG. 1A are formed and then the steps in FIGS. 1B to 1E and 2 are performed. However, one wire loop is formed. After that, the steps of FIGS. 1B to 1E and FIG. 2 may be performed. However, this method has poor productivity because it is necessary to perform the process of FIG. 1C and the stitching process of removing the lower flat ball 5a every time. In the above embodiment, after the lower flat ball 5a is formed as shown in FIG. 1C, the lower flat ball 5a is pressed against the neck height portion 31 as shown in FIGS. 1D and 1E. However, the step shown in FIGS. 1D and 1E may be performed by pressing the ball 5 shown in FIG. 1B directly against the neck height portion 31 without forming the lower flat ball 5a. However, if the ball 5 is used, care must be taken because the ball 5 and the wire 3 are displaced and one of them easily escapes.

本発明のワイヤボンディング方法の参考の形態を図３により説明する。上記実施の形態は、ワイヤボンディングを行うキャピラリ４を用い、下面平坦ボール５ａを形成してネック高さ部３１の頂部を押し下げた。本参考の形態は、図１（ａ）及び図３（ａ）に示すように台形ループを形成した後、下面が平坦なワイヤ押圧ツール６で図３（ｂ）〜（ｃ）に示すように屈折部３ａを下方に押し下げる。その後図３（ｄ）に示すようにワイヤ押圧ツール６は上昇し、次の２本目のワイヤループのネック高さ部３１の上方に位置し、前記と同様の動作を行う。このように形成しても、前記と同様の効果が得られる。また本参考の形態は前記実施の形態のようにボール５を形成する必要がないので、生産性に優れている。 A reference embodiment of the wire bonding method of the present invention will be described with reference to FIG. In the above embodiment, the capillary 4 for wire bonding is used, the lower flat ball 5a is formed, and the top of the neck height portion 31 is pushed down. In this embodiment , as shown in FIGS. 3B to 3C, a trapezoidal loop is formed as shown in FIG. 1A and FIG. The refraction part 3a is pushed downward. Thereafter, as shown in FIG. 3 (d), the wire pressing tool 6 moves up, is positioned above the neck height portion 31 of the next second wire loop, and performs the same operation as described above. Even if it forms in this way, the effect similar to the above is acquired. Further, the present embodiment is excellent in productivity because it is not necessary to form the balls 5 as in the above embodiment.

なお、前記各実施の形態は、台形ループに適用した場合について説明したが、特許文献１の図５（ｂ）の三角ループ、図１のような台形部長さ部分３２の中央に窪みを形成したループにも適用できることは勿論である。   In addition, although each said embodiment demonstrated the case where it applied to a trapezoidal loop, the hollow was formed in the center of the triangular loop of FIG.5 (b) of patent document 1, and the trapezoid part length part 32 like FIG. Of course, it can also be applied to loops.

本発明のワイヤボンディング方法の一実施の形態を示す工程図である。It is process drawing which shows one Embodiment of the wire bonding method of this invention. 図１の続きの工程図である。FIG. 2 is a process diagram following FIG. 1. 本発明のワイヤボンディング方法の参考の形態を示す工程図である。It is process drawing which shows the reference form of the wire bonding method of this invention.

符号の説明Explanation of symbols

Ａ 第１ボンド点
Ｂ 第２ボンド点
１ 回路基板
２ ダイ
２ａ 電極パッド
３ ワイヤ
３１ ネック高さ部
３２ 台形部長さ部分
３４ 圧着ボール
３ａ、３ｂ 屈折部
４ キャピラリ
５ ボール
５ａ 下面平坦ボール
６ ワイヤ押圧ツール A 1st bond point B 2nd bond point 1 Circuit board 2 Die 2a Electrode pad 3 Wire 31 Neck height part 32 Trapezoid part length part 34 Crimp ball 3a, 3b Refraction part 4 Capillary 5 Ball 5a Bottom flat ball 6 Wire pressing tool

Claims (1)

第１ボンド点にボンディングされた圧着ボール上に上方に伸びたネック高さ部を形成して第２ボンド点にワイヤを接続した後、キャピラリの下端に延在したワイヤの先端にボールを形成し、このボールを回路基板に押し付けて下面平坦ボールを形成し、続いて前記下面平坦ボールを前記ネック高さ部の頂部に押し付けてネック高さ部を押し下げることを特徴とするワイヤボンディング方法。   After forming a neck height portion extending upward on the press-bonded ball bonded to the first bond point and connecting the wire to the second bond point, the ball is formed at the tip of the wire extending to the lower end of the capillary. A wire bonding method comprising pressing the ball against a circuit board to form a lower flat ball, and then pressing the lower flat ball against the top of the neck height to push down the neck height.
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