JP4047434B2 - Adhesive sheets - Google Patents
Adhesive sheets Download PDFInfo
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- JP4047434B2 JP4047434B2 JP03111798A JP3111798A JP4047434B2 JP 4047434 B2 JP4047434 B2 JP 4047434B2 JP 03111798 A JP03111798 A JP 03111798A JP 3111798 A JP3111798 A JP 3111798A JP 4047434 B2 JP4047434 B2 JP 4047434B2
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- sensitive adhesive
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- Die Bonding (AREA)
- Adhesive Tapes (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、主に電子材料関連でシリコ─ンフリ―の粘着テ―プ、粘着シ―トなどとして用いられる粘着シ―ト類に関する。
【0002】
【従来の技術】
電子材料関連の粘着テ―プには、各種タイプのものが用いられているが、粘着剤層に対する剥離層として、シリコ─ン系剥離剤を使用したものがほとんどである。たとえば、両面粘着テ―プなどでは、シリコ─ン系剥離剤を塗布した剥離紙を用い、この剥離紙上にアクリル系粘着剤からなる粘着剤層を設けたものが、各種電子部品の接着やシ―ル部に多く使用されている。
【0003】
【発明が解決しようとする課題】
しかるに、この種の粘着テ―プをコンピユ―タのハ―ドデイスク部分に使用すると、上記デイスクのヘツドクラツシユが発生するという問題がある。これは、粘着剤層表面に付着している極微量のシロキサンがデイスク表面で酸化重合し、ガラス状の酸化物層を形成するためと考えられている。
【0004】
このため、剥離紙からの粘着剤層面へのシリコ─ンの移行量を減らす検討が行われてきたが、現状では十分な対策がなされていない。したがつて、本発明は、上記の問題を克服し、電子材料関連でシリコ─ンフリ―の粘着シ―ト類として使用でき、ハ―ドデイスク部分に用いてもシリコ─ンを原因としたクラツシユが発生するおそれのない粘着シ―ト類を提供することを目的とする。
【0005】
【課題を解決するための手段】
本発明者らは、上記の目的を達成するために、鋭意検討した結果、従来のシリコ─ン系剥離剤を塗布した剥離紙に代えて、特定構成の低密度ポリエチレンからなるフイルムまたはその積層体を用いることにより、粘着剤層に対する十分な剥離効果を得ることができ、しかも粘着剤層面へのシリコ─ンの移行がみられず、電子材料関連でシリコ─ンフリ―の粘着シ―ト類として使用でき、ハ―ドデイスク部分に用いてもシリコ─ンを原因としたクラツシユの発生がみられなくなることを知り、本発明を完成するに至つたものである。
【0006】
すなわち、本発明は、粘着剤層が、アルキル(メタ)アクリレートのほかに、これとの合計量中3〜15重量%の割合を占める不飽和カルボン酸のみを含有するモノマー混合物の共重合体からなるアクリル系ポリマーを主剤とするアクリル系粘着剤からなり、この粘着剤層に対する剥離層として、密度が0.928以下、重量平均分子量Mwが10万以上、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が3以上である低密度ポリエチレンからなるフイルム、あるいはこのフイルムを含む積層体を用いたことを特徴とする粘着シ―ト類(請求項1)に係るものである。とくに、本発明は、上記の不飽和カルボン酸がアクリル酸、メタクリル酸またはイタコン酸の中から選ばれ、これら不飽和カルボン酸のモノマ―混合物中の含有量が7〜13重量%である上記構成の粘着シ―ト類(請求項2)を、提供できるものである。
【0007】
【発明の実施の形態】
本発明において、剥離層に用いる低密度ポリエチレンは、密度が0.928以下、好ましくは0.925以下(通常、0.890以上)、重量平均分子量Mwが10万以上、好ましくは15万以上(通常、50万まで)で、分子量分布(ゲルパ―ミエ―シヨンクロマトグラフイ―測定による)として、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が3以上、好ましくは5以上(通常、20まで)のポリエチレンである。このような特定の密度、重量平均分子量および分子量分布を有することにより、粘着剤層に対し良好な剥離性を発現でき、またブロツキングなどの支障をきたすこともない。密度などが上記範囲から逸脱すると、上記剥離性などに好結果が得られにくい。
【0008】
このような低密度ポリエチレンは、公知の高圧法(ラジカル重合)や中低圧法(イオン重合)により、その製造条件などを適宜選択することにより、また製造後の精製、分別条件などを適宜選択することにより、容易に得ることができる。市販品をそのまま使用することもできる。本発明において、剥離層は、このような低密度ポリエチレンを適宜の成形法により、厚さが5〜300μmのフイルムとしたものであり、またこのフイルムを他のプラスチツクフイルム、金属箔、紙などの薄層フイルムの片面または両面に積層して、全体厚が5〜300μmとなる積層体としたものである。
【0009】
本発明の粘着シ―ト類の形態には、厚さが5〜300μm、好ましくは30〜200μmの基材上に、厚さが1〜70μm、好ましくは30〜50μmの粘着剤層を設け、この上に剥離層として上記のポリエチレンフイルムまたはポリエチレン積層体を貼り合わせたものがある。ここで、基材には、ポリエステル、ポリプロピレン、ポリ塩化ビニルなどのプラスチツクフイルム、アルミ箔、ステンレス箔などの金属箔、和紙、クレ―プ紙などの紙が用いられる。
【0010】
本発明の粘着シ―ト類の別の形態としては、剥離層として機能させる上記のポリエチレンフイルムまたはポリエチレン積層体を両面粘着シ―ト類用のセパレ―タとして用いたものが挙げられる。また、剥離層として機能させる上記のポリエチレンフイルムと前記同様の基材とを積層構造にし、その基材側に粘着剤層を設けて、ポリエチレンフイルム層を背面側に用いることにより、自背面との剥離性にすぐれる粘着シ―ト類とすることもできる。
【0011】
このような種々の形態の粘着シ―ト類において、粘着剤層としては、ゴム系、アクリル系などの各種の粘着剤が用いられる。これらの中でも、前記剥離層の剥離性の点から、アクリル系粘着剤が好ましい。アクリル系粘着剤は、溶液重合法、エマルシヨン重合法などの重合法により得られるアクリル系ポリマ―を主剤とし、これに必要により、架橋剤、粘着付与剤、軟化剤、老化防止剤、充填剤などの各種の添加剤を加えて、調製される。
【0012】
上記のアクリル系ポリマ―は、ブチル(メタ)アクリレ―ト、2−エチルヘキシル(メタ)アクリレ―トなどのアルキル(メタ)アクリレ―トを主成分とし、これに必要により共重合可能な改質用モノマ―として2−ヒドロキシエチルアクリレ―ト、アクリル酸、スチレン、酢酸ビニルなどの他のモノマ―を加えたモノマ―混合物の共重合体が用いられる。中でも、共重合可能な改質用モノマ―として不飽和カルボン酸を3〜15重量%含有するモノマ―混合物の共重合体が好ましい。とくに、上記の不飽和カルボン酸がアクリル酸、メタクリル酸またはイタコン酸の中から選ばれ、これら不飽和カルボン酸のモノマ―混合物中の含有量が7〜13重量%である上記共重合体が好ましい。これらのアクリル系ポリマ―によれば、前記剥離層の剥離性に一段と好結果が得られる。
【0013】
【実施例】
以下、本発明の実施例を記載して、より具体的に説明する。ただし、本発明はこれらの実施例に限定されるものではない。なお、以下において、部とあるのは重量部を意味するものとする。
【0014】
実施例1
2−エチルヘキシルアクリレ―ト90部とアクリル酸10部とのモノマ―混合物を、酢酸エチルを溶媒とし、ベンゾイルパ―オキサイドを重合開始剤として、常法により溶液重合させて、重量平均分子量が90万のアクリル系ポリマ―の溶液(固形分40重量%)を得た。これに、アクリル系ポリマ―100部あたり、エポキシ系架橋剤0.1部を配合して、アクリル系粘着剤を調製した。
【0015】
このアクリル系粘着剤を、厚さが50μmのポリエステルフイルムからなる基材上に、乾燥後の厚さが30μmになるように塗布し、100℃で3分間乾燥して、粘着剤層を形成した。この粘着剤層面に、剥離層として、密度が0.921、重量平均分子量Mwが32万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が9.0である低密度ポリエチレンからなるフイルムを貼り合わせることにより、粘着テ―プを作製した。
【0016】
実施例2
剥離層として、密度が0.924、重量平均分子量Mwが16万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が4.2である低密度ポリエチレンからなるフイルムを用いた以外は、実施例1と同様にして、粘着テ―プを作製した。
【0017】
実施例3
上質紙の両面に、密度が0.921、重量平均分子量Mwが32万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が9.0である低密度ポリエチレンからなるフイルムを積層して、積層体とした。この積層体の上に、実施例1のアクリル系粘着剤を直接塗布し、100℃で5m/分の速度で乾燥して、ロ―ル状の基材レスの両面粘着テ―プを作製した。
【0018】
比較例1
剥離層として、密度が0.958、重量平均分子量Mwが40万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が7.2である高密度ポリエチレンからなるフイルムを用いるようにした以外は、実施例1と同様にして、粘着テ―プを作製した。
【0019】
比較例2
剥離層として、密度が0.940、重量平均分子量Mwが18万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が8.0である高密度ポリエチレンからなるフイルムを用いるようにした以外は、実施例1と同様にして、粘着テ―プを作製した。
【0020】
比較例3
剥離層として、密度が0.924、重量平均分子量Mwが5万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が4.2である低密度ポリエチレンからなるフイルムを用いるようにした以外は、実施例1と同様にして、粘着テ―プを作製した。
【0021】
比較例4
剥離層として、密度が0.921、重量平均分子量Mwが40万、Z平均分子量Mzと重量平均分子量Mwとの比〔Mz/Mw〕が2.2である低密度ポリエチレンからなるフイルムを用いるようにした以外は、実施例1と同様にして、粘着テ―プを作製した。
【0022】
上記の実施例1〜3および比較例1〜4の各粘着テ―プについて、以下の剥離性試験により、粘着剤層に対する剥離層の剥離性の良否を調べた。この結果は、後記の表1に示されるとおりであつた。
【0023】
<剥離性試験>
粘着テ―プを20mm幅に切断した試料を2個準備した。そのうちの1個を室温(23℃)で保存し、残りの1個を50℃で3日間保存した。この2個の試料について、実施例3を除く試料では、ポリエステルフイルムからなる基材側を剛性のある板に貼り合わせ、ポリエチレンフイルムからなる剥離層側を、23℃,60%RHの雰囲気中で、万能引張試験機(オリエンテツク社製の「RTM−100」)にて180℃方向に引き剥がしたときの抵抗(剥離力)を調べた。また、実施例3の試料では、粘着テ―プを巻き戻して、剛性のある板に貼り合わせたのち、剥離層(上質紙の両面にポリエチレンフイルムを積層した積層体)を上記と同様に引き剥がしたときの抵抗(剥離力)を調べた。
【0024】
【0025】
上記の表1の結果から明らかなように、本発明の低密度ポリエチレンからなるフイルムまたはその積層体を剥離層とした実施例1〜3の粘着テ―プは、室温保存品および50℃で3日間保存品のいずれにおいても、剥離力が35g/20mm幅以下と低く、すぐれた剥離性を示しており、電子材料関係でシリコ─ンフリ―の粘着テ―プとして有利に使用できるものであることがわかる。これに対して、本発明とは異なるポリエチレンフイルムを剥離層とした比較例1〜4の粘着テ―プでは、上記剥離力がかなり大きく、剥離性に問題を有している。
【0026】
【発明の効果】
以上のように、本発明の粘着テ―プは、粘着剤層に対する剥離層として、特定構成の低密度ポリエチレンからなるフイルムまたはその積層体を用いたことにより、粘着剤層に対し十分な剥離効果が得られ、しかも粘着剤層面へのシリコ─ンの移行がみられないため、電子材料関連でシリコ─ンフリ―の粘着シ―ト類として使用でき、とくにハ―ドデイスク部分に用いてもシリコ─ンを原因としたクラツシユの発生がみられなくなるという格別の効果が奏される。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive sheet used as a silicone-free adhesive tape, an adhesive sheet, etc. mainly related to electronic materials.
[0002]
[Prior art]
Various types of adhesive tapes related to electronic materials are used, but most use a silicone release agent as the release layer for the adhesive layer. For example, for double-sided adhesive tapes, etc., a release paper coated with a silicone release agent is used, and an adhesive layer made of an acrylic adhesive is provided on the release paper to bond various types of electronic components. -It is used in many parts.
[0003]
[Problems to be solved by the invention]
However, when this type of adhesive tape is used in the hard disk portion of a computer, there is a problem that the head crash of the disk occurs. This is considered to be because a very small amount of siloxane adhering to the surface of the pressure-sensitive adhesive layer undergoes oxidative polymerization on the disk surface to form a glassy oxide layer.
[0004]
For this reason, studies have been made to reduce the amount of silicone transferred from the release paper to the pressure-sensitive adhesive layer surface, but at present, no sufficient measures have been taken. Therefore, the present invention overcomes the above-mentioned problems and can be used as a silicone-free adhesive sheet for electronic materials, and even when used in a hard disk portion, there is a crash caused by silicone. The object is to provide adhesive sheets that are not likely to occur.
[0005]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above object, the present inventors have replaced a conventional release paper coated with a silicone-based release agent, and a film comprising a low-density polyethylene having a specific configuration or a laminate thereof. As a result, it is possible to obtain a sufficient peeling effect on the pressure-sensitive adhesive layer, and there is no silicone transfer to the surface of the pressure-sensitive adhesive layer. The present invention has been completed by knowing that the occurrence of a crash caused by silicon is not observed even when used in a hard disk portion.
[0006]
That is, the present invention is based on a copolymer of a monomer mixture in which the pressure-sensitive adhesive layer contains only an unsaturated carboxylic acid occupying a proportion of 3 to 15% by weight in the total amount in addition to the alkyl (meth) acrylate. As a release layer for this adhesive layer, the density is 0.928 or less, the weight average molecular weight Mw is 100,000 or more, the Z average molecular weight Mz and the weight average molecular weight Mw A film made of low density polyethylene having a ratio [Mz / Mw] of 3 or higher, or a laminate containing this film is used (Claim 1). In particular, according to the present invention , the unsaturated carboxylic acid is selected from acrylic acid, methacrylic acid or itaconic acid, and the content of the unsaturated carboxylic acid in the monomer mixture is 7 to 13% by weight. The adhesive sheet (Claim 2 ) can be provided.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the low density polyethylene used for the release layer has a density of 0.928 or less, preferably 0.925 or less (usually 0.890 or more), and a weight average molecular weight Mw of 100,000 or more, preferably 150,000 or more ( Usually, up to 500,000), and the molecular weight distribution (according to gel permeation chromatography), the ratio [Mz / Mw] of Z average molecular weight Mz to weight average molecular weight Mw is 3 or more, preferably 5 or more Polyethylene (usually up to 20). By having such a specific density, weight average molecular weight, and molecular weight distribution, good peelability can be expressed with respect to the pressure-sensitive adhesive layer, and there is no trouble such as blocking. If the density or the like deviates from the above range, it is difficult to obtain a good result in the above peelability.
[0008]
Such low-density polyethylene is appropriately selected by its known high-pressure method (radical polymerization) or medium-low pressure method (ionic polymerization) by appropriately selecting its production conditions and the like, as well as purification and fractionation conditions after production. Therefore, it can be easily obtained. Commercial products can also be used as they are. In the present invention, the release layer is a film having a thickness of 5 to 300 μm made of such low-density polyethylene by an appropriate molding method, and the film is made of other plastic film, metal foil, paper, etc. A thin film is laminated on one or both sides to form a laminate having an overall thickness of 5 to 300 μm.
[0009]
In the form of the adhesive sheet of the present invention, a pressure-sensitive adhesive layer having a thickness of 1 to 70 μm, preferably 30 to 50 μm, is provided on a substrate having a thickness of 5 to 300 μm, preferably 30 to 200 μm, There exists what laminated said polyethylene film or polyethylene laminated body on this as a peeling layer. Here, plastic films such as polyester, polypropylene, and polyvinyl chloride, metal foils such as aluminum foil and stainless steel foil, and paper such as Japanese paper and crepe paper are used as the base material.
[0010]
As another form of the adhesive sheet of the present invention, there may be mentioned one using the above-mentioned polyethylene film or polyethylene laminate functioning as a release layer as a separator for double-sided adhesive sheets. In addition, the above-mentioned polyethylene film functioning as a release layer and the above-mentioned base material are made into a laminated structure, an adhesive layer is provided on the base material side, and the polyethylene film layer is used on the back side, thereby It is also possible to use adhesive sheets with excellent peelability.
[0011]
In such various types of pressure-sensitive adhesive sheets, various pressure-sensitive adhesives such as rubber and acrylic are used as the pressure-sensitive adhesive layer. Among these, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of peelability of the release layer. Acrylic adhesives are mainly based on acrylic polymers obtained by polymerization methods such as solution polymerization and emulsion polymerization, and as necessary, crosslinking agents, tackifiers, softeners, anti-aging agents, fillers, etc. It is prepared by adding various additives.
[0012]
The above acrylic polymers are mainly composed of alkyl (meth) acrylates such as butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate, and can be copolymerized if necessary. As the monomer, a copolymer of a monomer mixture in which other monomers such as 2-hydroxyethyl acrylate, acrylic acid, styrene, vinyl acetate and the like are added is used. Among them, a copolymer of a monomer mixture containing 3 to 15% by weight of an unsaturated carboxylic acid is preferable as a copolymerizable modifying monomer. In particular, the above-mentioned copolymer in which the unsaturated carboxylic acid is selected from acrylic acid, methacrylic acid or itaconic acid, and the content of the unsaturated carboxylic acid in the monomer mixture is 7 to 13% by weight is preferable. . According to these acrylic polymers, the peelability of the release layer can be further improved.
[0013]
【Example】
Hereinafter, examples of the present invention will be described in more detail. However, the present invention is not limited to these examples. In the following, “parts” means parts by weight.
[0014]
Example 1
A monomer mixture of 90 parts of 2-ethylhexyl acrylate and 10 parts of acrylic acid was solution-polymerized by a conventional method using ethyl acetate as a solvent and benzoyl peroxide as a polymerization initiator to give a weight average molecular weight of 900,000. An acrylic polymer solution (solid content: 40% by weight) was obtained. An acrylic pressure-sensitive adhesive was prepared by blending 0.1 part of an epoxy-based crosslinking agent per 100 parts of an acrylic polymer.
[0015]
This acrylic pressure-sensitive adhesive was applied onto a substrate made of a polyester film having a thickness of 50 μm so that the thickness after drying was 30 μm, and dried at 100 ° C. for 3 minutes to form a pressure-sensitive adhesive layer. . Low density polyethylene having a density of 0.921, a weight average molecular weight Mw of 320,000, and a ratio [Mz / Mw] of Z average molecular weight Mz to weight average molecular weight Mw of 9.0 as a release layer on the pressure-sensitive adhesive layer surface. An adhesive tape was prepared by laminating a film consisting of
[0016]
Example 2
As the release layer, a film made of low-density polyethylene having a density of 0.924, a weight average molecular weight Mw of 160,000, and a ratio [Mz / Mw] of Z average molecular weight Mz to weight average molecular weight Mw of 4.2 was used. Except for the above, an adhesive tape was prepared in the same manner as in Example 1.
[0017]
Example 3
A film made of low density polyethylene having a density of 0.921, a weight average molecular weight Mw of 320,000, and a ratio of the Z average molecular weight Mz to the weight average molecular weight Mw [Mz / Mw] of 9.0 on both sides of the fine paper. It laminated | stacked and it was set as the laminated body. On this laminate, the acrylic pressure-sensitive adhesive of Example 1 was directly applied and dried at a rate of 5 m / min at 100 ° C. to produce a roll-shaped baseless double-sided pressure-sensitive adhesive tape. .
[0018]
Comparative Example 1
As the release layer, a film made of high density polyethylene having a density of 0.958, a weight average molecular weight Mw of 400,000, a ratio of the Z average molecular weight Mz to the weight average molecular weight Mw [Mz / Mw] of 7.2 is used. A pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that this was changed.
[0019]
Comparative Example 2
As the release layer, a film made of high density polyethylene having a density of 0.940, a weight average molecular weight Mw of 180,000, and a ratio of the Z average molecular weight Mz to the weight average molecular weight Mw [Mz / Mw] of 8.0 is used. A pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that this was changed.
[0020]
Comparative Example 3
As the release layer, a film made of low-density polyethylene having a density of 0.924, a weight average molecular weight Mw of 50,000, and a ratio (Mz / Mw) of Z average molecular weight Mz to weight average molecular weight Mw of 4.2 is used. A pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that this was changed.
[0021]
Comparative Example 4
As the release layer, a film made of low density polyethylene having a density of 0.921, a weight average molecular weight Mw of 400,000, a ratio of the Z average molecular weight Mz to the weight average molecular weight Mw [Mz / Mw] of 2.2 is used. A pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that this was changed.
[0022]
About each adhesive tape of said Examples 1-3 and Comparative Examples 1-4, the quality of the peelability of the peeling layer with respect to an adhesive layer was investigated by the following peelability tests. The results were as shown in Table 1 below.
[0023]
<Peelability test>
Two samples were prepared by cutting the adhesive tape into a width of 20 mm. One of them was stored at room temperature (23 ° C.), and the other one was stored at 50 ° C. for 3 days. With respect to these two samples, in the samples other than Example 3, the base material side made of polyester film was bonded to a rigid plate, and the release layer side made of polyethylene film was placed in an atmosphere of 23 ° C. and 60% RH. The resistance (peeling force) when peeled in the direction of 180 ° C. was examined with a universal tensile tester (“RTM-100” manufactured by Orientec Corporation). In the sample of Example 3, the adhesive tape was unwound and bonded to a rigid plate, and then the release layer (laminated body in which polyethylene film was laminated on both sides of fine paper) was pulled in the same manner as described above. The resistance (peeling force) when peeled off was examined.
[0024]
[0025]
As is apparent from the results in Table 1 above, the adhesive tapes of Examples 1 to 3 using the film made of the low density polyethylene of the present invention or a laminate thereof as the release layer were stored at room temperature and 3 ° C. at 50 ° C. In any of the products stored for a day, the peel strength is as low as 35g / 20mm width or less, showing excellent peelability, and can be used advantageously as a silicone-free adhesive tape in relation to electronic materials. I understand. On the other hand, in the adhesive tapes of Comparative Examples 1 to 4 in which a polyethylene film different from that of the present invention is used as the release layer, the release force is considerably large, and there is a problem in peelability.
[0026]
【The invention's effect】
As described above, the pressure-sensitive adhesive tape of the present invention has a sufficient peeling effect on the pressure-sensitive adhesive layer by using a film composed of a low-density polyethylene having a specific structure or a laminate thereof as the pressure-sensitive adhesive layer. In addition, the silicone does not migrate to the surface of the pressure-sensitive adhesive layer, so it can be used as a silicone-free adhesive sheet for electronic materials, especially when used in hard disk parts. A special effect is achieved in that there is no longer any occurrence of cruciforms caused by selenium.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03111798A JP4047434B2 (en) | 1998-02-13 | 1998-02-13 | Adhesive sheets |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03111798A JP4047434B2 (en) | 1998-02-13 | 1998-02-13 | Adhesive sheets |
Publications (2)
Publication Number | Publication Date |
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JPH11228920A JPH11228920A (en) | 1999-08-24 |
JP4047434B2 true JP4047434B2 (en) | 2008-02-13 |
Family
ID=12322472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP03111798A Expired - Lifetime JP4047434B2 (en) | 1998-02-13 | 1998-02-13 | Adhesive sheets |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11541639B2 (en) | 2017-10-12 | 2023-01-03 | Avery Dennison Corporation | Low outgassing clean adhesive |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361844B1 (en) | 1999-01-27 | 2002-03-26 | David T. Ou-Yang | Release article and adhesive article comprising the release article |
TWI276671B (en) * | 2000-03-03 | 2007-03-21 | Lintec Corp | Adhesive sheet and adhered article |
JP2001262093A (en) * | 2000-03-16 | 2001-09-26 | Hitachi Kasei Polymer Co Ltd | Adhesive tapes for electronic device |
US6465091B1 (en) | 2000-03-27 | 2002-10-15 | 3M Innovative Properties Company | Release article and adhesive article containing a polymeric release material |
JP4841058B2 (en) * | 2000-04-28 | 2011-12-21 | リンテック株式会社 | Adhesive sheet and adhesive |
JP2003003132A (en) * | 2001-06-19 | 2003-01-08 | Lintec Corp | Adhesive sheet and adhesive |
JP2003013014A (en) * | 2001-06-27 | 2003-01-15 | Lintec Corp | Adhesive sheet and adhesive |
JP4860114B2 (en) | 2004-03-02 | 2012-01-25 | 日東電工株式会社 | Thermosetting adhesive tape or sheet and method for producing the same |
DE102004019908A1 (en) * | 2004-04-21 | 2005-11-17 | Tesa Ag | Use of a double-sided adhesive foam adhesive tape for attaching structured flat cables, in particular on substrates such as the interior decorative parts of a car, in particular headliner, door side part, trunk lid |
JP5085678B2 (en) * | 2010-03-17 | 2012-11-28 | 日東電工株式会社 | Sheet material and pressure-sensitive adhesive sheet having the same |
JP5923377B2 (en) * | 2012-04-27 | 2016-05-24 | リンテック株式会社 | Release sheet, pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet |
-
1998
- 1998-02-13 JP JP03111798A patent/JP4047434B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11541639B2 (en) | 2017-10-12 | 2023-01-03 | Avery Dennison Corporation | Low outgassing clean adhesive |
Also Published As
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JPH11228920A (en) | 1999-08-24 |
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