JP4023698B2 - Manufacturing method of side-use electronic component with bottom electrode - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an electronic component in which an electronic element is resin-molded on a side surface and a bottom electrode is provided .
[0002]
[Prior art]
An electronic component in which an electronic element is mounted on an upper surface of a substrate and the upper surface side of the substrate including the electronic element is molded with a sealing resin is well known. In addition, since a method of mounting a large number of electronic components on a circuit board by soldering has become widespread, there is a high need for so-called SMD (surface mounted device) components used for the mounting method. Many of the SMD components have a rectangular parallelepiped block shape. There are electrode terminals on the bottom surface or a side surface close to the lower portion, and the component is placed on the wiring pattern on the circuit board and is in contact with or close to the pattern. The electrode terminal is easily connected with molten solder. The structure of the conventional part for this purpose will be described below.
[0003]
FIG. 5 is a perspective view of the electronic component of the conventional example (1), and FIG. 6 is a perspective view of a part of the collective substrate in the manufacturing process of the conventional example. Reference numeral 1 denotes a substrate, which is one that is cut and separated from the collective substrate 11 by the cut line 12 in the final process. 2 is a side pattern is obtained by etching the copper foil stuck on the flat surface of the substrate 1 and the assembly substrate 11 in a predetermined pattern. 3 is an electronic device, for example LED, is die-bonded to one of the pair of side pattern 2, the other person are connected by bonding wires 4. 5 under surface pattern is a conductive film provided on the lower surface of the substrate 1 and connected to the side pattern 2, free the inner surface of the elongated long hole shape of the through hole 6 which previously provided the assembly substrate 11 It is formed by electrolytic plating or the like. The terms indicating the orientation such as the lower surface and the side surface are expressed with reference to the orientation of the completed electronic component in which the electronic element is positioned on the side surface and the lower surface is mounted on another substrate. It is not related to the top or bottom of. The same applies to a second conventional example described later and an embodiment of the present invention. 7 with the sealing resin, a transparent to transmit emission LED, and so obtained by molding the epoxy resin or the like on the flat surface of the substrate 1 in order to protect the electronic device 3 and the connecting portions from various environmental conditions. The cutting by the cut line 12 is rational after resin molding, but may be molded after cutting. The above is the content of the completed electronic component. However, in FIG. 5, in order to clearly show the internal structure with a solid line, the outline of the sealing resin 7 after completion is shown by a two-dot chain line (imaginary line). In addition, all the conductive patterns of the electronic component are shown shaded by hit points.
[0004]
In FIG. 5, the electronic component has its upper surface electrode 2 turned sideways so as to emit light horizontally on another circuit board, and a pair of wiring patterns such as copper foil indicated by two-dot chain lines on the other circuit board. 8 is surface mounted. The solder material 9 indicated by a two-dot chain line also wets and connects both the wiring pattern 8 and the end face pattern 5 of the electronic component when melted in a surface reflow solder reflow process. In order to perform automatic surface mounting, it is desirable that both patterns be parallel and in close contact, but in this conventional example, since they are orthogonal, the solder may not wet both at the same time or the strength is insufficient even if connected. There was a difficulty in exhibiting sufficient reliability due to breakage of the solder material.
[0005]
FIG. 7 is a perspective view of an electronic component of a second conventional example, FIG. 8 is a rear perspective view thereof, and FIG. 9 is a perspective view of a collective substrate in the second conventional example. In this conventional example, two pairs of side surface patterns 2 and two electronic elements 3 are built in one electronic component. These are, for example, a plurality of LEDs having different emission colors, a pair of a light emitting element and a light receiving element, or a working element and an active element that drives the element. Or less with respect to the basic description of those same names and number the first component of essentially the same nature as those of the conventional example is omitted without repetition, to be described only the differences . Through-hole 6 is provided by one of four for each substrate 1 in a round hole shape, on their inner surface, the lower surface pattern 5 connecting the back surface electrode 10 on the back side pattern 2 and the substrate 1 and the assembly substrate 11 It is formed. Each lower surface pattern 5 becomes approximately semi-cylindrical.
[0006]
The lower surface pattern 5 is opposed to the surface of the wiring pattern 8 on the other circuit board and is connected by a solder material 9. In this case, the solder material 9 may not always satisfactorily wet up and fill the kamaboko-shaped space between the opposing surfaces.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a planar electrode terminal suitable for surface mounting, which can be in close contact with a wiring pattern of a circuit board to be connected , on the lower surface of a block-shaped electronic component having a working electronic element on a side surface. A manufacturing method is provided, and an electronic device having good solder wettability and high connection reliability in a reflow process is obtained.
[0008]
[Means for Solving the Problems]
The manufacturing method of the side surface use electronic component with a lower surface electrode of this invention is equipped with either of the characteristics of following (1) and (2).
(1) A plurality of conductive side surface patterns which are substantially block-shaped and formed on the side surface for mounting an electronic device, and a plurality of conductive planar lower surfaces which are formed on the lower surface and are connected to the side surface pattern. A method of manufacturing an electronic component having a pattern, comprising: preparing an insulating collective substrate having a part of a planar upper surface as the side surface and a part of a planar end surface as the lower surface; Forming a plurality of sets of the side surface patterns on the upper surface of the substrate so as to be parallel to the end surface, and forming a lower surface pattern connected to each of the sets of the side surface patterns on the planar end surface; a step of mounting a predetermined said electronic element with respect to the formed each set of the side pattern, a step of simultaneously resin-sealed the implemented the electronic element on the set substrate, the side after the resin sealing step And Each set of boundary portions of the lower surface pattern, by cutting a plurality of locations of the collective substrate in a plane perpendicular to said end face, having a step of separating the individual electronic components.
(2) In the above (1), each set of the side surface pattern and the bottom surface pattern is provided in a plurality of rows on the collective substrate, and the planar end surface is alternately and parallel to the rows of each set. It is a planar inner surface of a long hole-shaped through hole provided in a plurality on the collective substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view showing the structure of one embodiment of the present invention, and FIG. 2 is a perspective view of a part of a collective substrate used in the manufacturing stage. Electronic components board 1, the side surface pattern 2, the electronic device 3 such as an LED that is die-bonded to the side surface pattern, the bonding wire 4, the lower surface pattern formed on the planar inner surfaces of the slot-like through-hole 6 is connection means 5, (shown in phantom) the sealing resin 7 for protection, consisting of the back surface electrode which is optionally provided (not shown). Reference numeral 11 is a collective substrate, and 12 is a cut line for isolating completed electronic components. These have substantially the same functions as the corresponding elements of the conventional example already described. Indicated by the imaginary line 13 is a mating circuit board that is surface-mounted and connected, 8 is a wiring pattern on the surface, 9 is a solder material that has become a thin layer after the reflow process, and an ideal mounting connection is made Show.
[0010]
FIG. 3 is a perspective view showing the structure of another embodiment of the present invention, and FIG. 4 is a rear perspective view thereof. It has a plurality of electronic elements therein, an example in which a lower surface pattern of a plurality of pairs, since each component has commonality with the same numbers are assigned to the first embodiment, No further explanation will be necessary. The form of the collective substrate is also not shown because it is sufficiently easy to guess from FIG. The effect of mounting is also exhibited as in the first embodiment.
[0011]
Although the two embodiments have been described above, the present invention includes a broader technique. For example, the arrangement of the internal structure and set on a substrate of an electronic component, a material of the substrate, the side surface pattern, the back surface electrode structure can be freely selected depending on the intended use. The electronic elements can have any electromagnetic, optical, acoustic, thermal, and chemical action, as long as they are not disadvantageous to operate on the side of the circuit board. It is. Various types of sealing resin materials and sealing methods can be selected according to the purpose, and the position of the process is also the state of the collective substrate, partly cut and assembled into strips, separated into individual substrates Sealing and molding can be performed in any state.
[0012]
Moreover, the method of forming the lower surface pattern divided on the inner surface of the through hole is not limited. For example, (1) partial application of conductive ink to the inner surface, (2) division by partial application of plating resist before electroless plating, and (3) slightly wider and bite into the inner surface after through-hole formation. (4) After forming a through hole in the substrate, a non-porous copper foil is attached to the entire upper surface, and this is formed by etching and then positioned on the through hole. Various methods are conceivable, such as a method of bending a portion to be bent at a right angle and folding it into a through hole (in this case, it is not necessarily connected to the bottom electrode). Further the lower surface pattern is not a through hole inner surface, the aggregate substrate was placed in a one-dimensional linear rather than two-dimensional arrangement of unit substrates of each component may be formed on the strip-shaped side.
[0013]
【The invention's effect】
In the electronic component of the present invention, since the lower surface electrode can be parallel and in close contact with the formed mating wiring pattern under surface pattern in a planar shape in side surfaces of the through holes formed in the collective substrate, solder wettability good during surface mounting With a thin layer of solder material, it can be firmly connected, and it is possible to demonstrate high reliability of mounting. In addition, there are no design restrictions or cost increase factors, and the effect of device improvement is great.
[Brief description of the drawings]
FIG. 1 is a perspective view of one embodiment of the present invention.
FIG. 2 is a perspective view of a collective substrate that is a material of an electronic component of the present invention.
FIG. 3 is a perspective view of another embodiment of the present invention.
FIG. 4 is a rear perspective view of another embodiment of the present invention.
FIG. 5 is a perspective view of a first conventional electronic component.
FIG. 6 is a perspective view of a collective substrate that is a material of an electronic component of a first conventional example.
FIG. 7 is a perspective view of a second conventional electronic component.
FIG. 8 is a rear perspective view of a second conventional electronic component.
FIG. 9 is a perspective view of a second conventional collective substrate.
[Explanation of symbols]
1 substrate 2 side pattern 3 electronic element 5 under surface pattern 6 through hole 7 sealing resin 8 wiring pattern 9 solder material 10 back surface electrode 11 aggregate substrate 12 cut line 13 mating circuit board

Claims (2)

It has a substantially block shape, and has a plurality of conductive side surface patterns formed on the side surface for mounting an electronic device, and a plurality of conductive planar lower surface patterns formed on the lower surface and connected to the side surface pattern. A method of manufacturing an electronic component, comprising: preparing an insulating collective substrate having a part of a planar upper surface as the side surface and a part of a planar end surface as the lower surface; and an upper surface of the collective substrate. Forming a plurality of sets of the side surface patterns so as to be parallel to the end surface, forming a bottom surface pattern connected to each set of the side surface patterns on the planar end surface, and a step of mounting a predetermined said electronic device for each set of the side pattern, a step of simultaneously resin-sealed the implemented the electronic element on the set substrate, the side and the bottom after the resin sealing step A step-side electronic component with a bottom electrode, wherein a boundary portion of each set of turns is separated into individual electronic components by cutting a plurality of the collective substrates at a plane perpendicular to the end face Manufacturing method.   Each set of the side surface pattern and the lower surface pattern is provided in a plurality of rows on the collective substrate, and the planar end surface is a length provided in a plurality on the collective substrate alternately and in parallel with the rows of each set. 2. The method of manufacturing a side-use electronic component with a bottom electrode according to claim 1, wherein the inner surface is a planar inner side surface of a hole-like through hole.

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