JP4019081B2 - Electronic device with electronic components mounted - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment that can reduce an area required for mounting a semiconductor device. <P>SOLUTION: The electronic equipment has a plurality of mounting parts which are isolated each other, a circuit board in which these mounting parts are electrically connected and at least flexible wiring materials are employed between mounting parts, and semiconductor chips mounted in each mounting part. In the mounting parts, single semiconductor chip and multiple semiconductor chips are mounted. Also, it is characterized by a mount structure of the semiconductor chips stacked mutually by bending at flexible wiring materials employed for extending a distance between mounting parts so that multiple semiconductor chips are overlaid on the single semiconductor chip which is in a mounted state. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

  The present invention relates to a semiconductor device, a manufacturing method thereof, and an electronic device.

  Examples of the sealing (package) form of a semiconductor device such as an IC or LSI include hermetic sealing and non-hermetic sealing. Further, there are a lead insertion type and a surface mounting type depending on the mounting form of the semiconductor device. For example, SIP (Single Inline Package), ZIP (Zigzag Inline Package), PGA (Pin Grid Array), etc. are lead insertion type packages in which leads are inserted into the insertion holes of the substrate, SOP (Small Outline L-Leaded Package), SOJ (Small Outline J-Leaded Package), QFP (Quad Flat Package), QFJ (Quad Flat J-Leaded Package), and BGA (Ball Grid Array) are surface mount packages. The SOP and SOJ have a structure in which lead pins (leads) are provided in two directions of a package in which an IC chip is sealed, and the QFP and QFJ have a structure in which lead pins are provided in four directions of the package (for example, Non-Patent Document 1). ).

Issued by Nikkei BP "VLSI packaging technology (above)" May 15, 1993, P76-P84.

  Conventional surface-mount semiconductor devices such as SOP, SOJ, QFP, QFJ, and BGA, and PGA-type semiconductor devices are mounted so that the entire package faces the mounting substrate. Therefore, the board mounting area is smaller than the chip size. Can not do it. For this reason, an increase in chip size and an increase in the number of pins increase the size of the package and increase the board mounting area. In the case of increasing the number of pins, the inner lead portion increases to ensure the lead pin pitch and the package becomes larger.

  On the other hand, conventional SIPs and ZIPs in which leads protrude from only one side of the package are lead insertion type semiconductor devices, and have the feature that the board mounting area can be reduced. However, vertical mounting type semiconductor devices, such as lead insertion type semiconductor devices, collect leads in the direction of package mounting on the board. Therefore, when the number of pins is increased, the inner lead portion around which the leads are routed becomes larger, compared to the chip size. Package size is significantly increased. By increasing the number of pins, the length of the package is remarkably increased, and the effectiveness of reducing the board mounting area of the package form is lost. Therefore, conventionally, for example, only about 40 pins have been put into practical use.

  An object of the present invention is to provide a small vertically mounted semiconductor device and a manufacturing method thereof.

  Another object of the present invention is to provide a vertically mounted semiconductor device that can reduce the substrate mounting area and a method of manufacturing the same.

  Another object of the present invention is to provide an electronic device that can achieve a reduction in the mounting area of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The following is a brief description of an outline of typical inventions disclosed in the present application.

(Semiconductor device incorporated in electronic device of the present invention)
(1) A main body portion that is flat across the top and bottom, a plurality of leads protruding from the bottom surface of the main body portion, at least one semiconductor chip incorporated in the main body portion, an electrode of the semiconductor chip, A semiconductor device having a connection means for electrically connecting the tip of the lead, wherein a part of the lead protrudes from the bottom surface of the main body portion and from at least one surface other than the flat surface and is folded back and The front end of the main body extends along an uneven plane, and the tip is aligned with the lead protruding from the bottom of the main body.

  (2) A main body portion that is flat across the top and bottom, a plurality of overlapping portions that are directly or indirectly fixed to the flat surface of the main body portion, and a portion extending from the inside of the main body portion to each overlapping portion. A plurality of leads, a lead protruding from the bottom surface of the main body, a plurality of leads insulatedly supported by the overlapping portion and protruding from below the overlapping portion, and at least one sealed in the main body A semiconductor chip, and a connecting means for electrically connecting the electrode of the semiconductor chip and the tip of the lead in the main body, and the lead extending from the main body to the overlapping portion extends as it is in the overlapping portion. It is connected to the lead protruding below the overlapping portion.

  (3) In the means (2), the main body portion, the overlapping portion, and the leads between the main body portion and the overlapping portion are fixed to a single flexible wiring board.

  (4) In the means (2), a plate-like heat radiation plate made of a material having good thermal conductivity is projected from the lower surface of the main body portion, and at least a part of the heat radiation plate is another surface of the main body portion. Projecting from the main body.

  (5) In the means (2), at least one of the overlapping portions is a heat radiating plate made of a material having good thermal conductivity, and at least one end protrudes outward from one edge of the main body.

  (6) In the means (2), a reinforcing plate having a fixing pin inserted and fixed to the mounting board is fixed to the flat surface of the main body portion or the overlapping portion.

  (7) In the means (2), a part of the leads protruding below the main body part and the overlapping part has a lead insertion type structure and the other part has a surface mount type structure.

  (8) A main body portion that is flat across the top and bottom, a plurality of overlapping portions that are directly or indirectly fixed to the flat surface of the main body portion, and a portion extending from the inside of the main body portion to each overlapping portion. A plurality of leads, a lead protruding from the bottom surface of the main body, a plurality of leads insulatedly supported by the overlapping portion and protruding from below the overlapping portion, and at least one sealed in the main body And a connecting means for electrically connecting the electrode of the semiconductor chip and the tip of the lead in the main body, and at least one of the overlapping portions incorporates at least one semiconductor chip. The tip of the lead extending to the overlapping portion and the electrode of the semiconductor chip are connected by an electrical connection means, and the overlapping portion where an electronic component such as a semiconductor chip is not incorporated extends from the main body portion to the overlapping portion. Leads are continuous with the lead projecting downward integrating unit extends directly in superimposing unit.

  (9) In the means (8), the main body portion and the overlapping portion, the leads between the main body portion and the overlapping portion, and the like are fixed to one flexible wiring board.

(Manufacturing method of semiconductor device incorporated in electronic device of the present invention)
(10) A main body portion that is flat across the top and bottom, a plurality of overlapping portions that are directly or indirectly fixed to the flat surface of the main body portion, and disposed from the inside of the main body portion to each overlapping portion. A plurality of leads, a lead protruding from the bottom surface of the main body, a plurality of leads insulatedly supported by the overlapping portion and protruding from below the overlapping portion, and at least one sealed in the main body A semiconductor chip, and a connecting means for electrically connecting the electrode of the semiconductor chip and the tip of the lead in the main body, and the lead extending from the main body to the overlapping portion extends as it is in the overlapping portion. A method of manufacturing a semiconductor device connected to a lead projecting below an overlapping portion, the lead pattern forming the main body portion, the lead pattern forming the overlapping portion, and between the main body portion and the overlapping portion A step of preparing a lead frame having a card pattern, a step of forming the main body portion and the overlapping portion, a step of cutting and removing unnecessary lead frame portions, and a lead portion between the main body portion and the overlapping portion, The overlapping portion is directly or indirectly overlapped and fixed to the main body portion.

  (11) A main body portion that is flat across the top and bottom, a plurality of overlapping portions that are directly or indirectly fixed to the flat surface of the main body portion, and disposed from the inside of the main body portion to each overlapping portion. A plurality of leads, a lead protruding from the bottom surface of the main body, a plurality of leads insulatedly supported by the overlapping portion and protruding from below the overlapping portion, and at least one sealed in the main body And a connecting means for electrically connecting the electrode of the semiconductor chip and the tip of the lead in the main body, and at least one of the overlapping portions incorporates at least one semiconductor chip. The leading end of the lead extending to the overlapping portion and the electrode of the semiconductor chip are connected by an electrical connection means, and in the overlapping portion where an electronic component such as a semiconductor chip is not incorporated, it extends from the main body portion to the overlapping portion. The lead is a method of manufacturing a semiconductor device connected to a lead that extends as it is in the overlapping portion and protrudes below the overlapping portion, a lead pattern that forms the main body portion, a lead pattern that forms the overlapping portion, and A step of preparing a lead frame having a lead pattern between the main body portion and the overlapping portion; a step of forming the main body portion and the overlapping portion; a step of cutting and removing unnecessary lead frame portions; and the main body portion and the overlapping portion. It is folded at the lead portion between and the overlapping portions are directly or indirectly overlapped and fixed to the main body portion.

  (12) A main body portion that is flat across the top and bottom, a plurality of overlapping portions that are directly or indirectly fixed to the flat surface of the main body portion, and disposed from the inside of the main body portion to each overlapping portion. A plurality of leads, a lead protruding from the bottom surface of the main body, a plurality of leads insulatedly supported by the overlapping portion and protruding from below the overlapping portion, and at least one sealed in the main body And a connecting means for electrically connecting the electrode of the semiconductor chip and the tip of the lead in the main body, and at least one of the overlapping portions incorporates at least one semiconductor chip. The leading end of the lead extending to the overlapping portion and the electrode of the semiconductor chip are connected by an electrical connection means, and in the overlapping portion where an electronic component such as a semiconductor chip is not incorporated, it extends from the main body portion to the overlapping portion. The lead that extends as it is in the overlapping portion and continues to the lead protruding below the overlapping portion, and the lead between the main body portion and the overlapping portion and the main body portion and the overlapping portion are supported by a single flexible wiring board. A method for manufacturing a semiconductor device comprising: a lead pattern for forming the main body portion; a lead pattern for forming the overlapping portion; and a flexible wiring board having a lead pattern between the main body and the overlapping portion. A step of forming the main body portion and the overlapping portion, a step of cutting and removing unnecessary flexible wiring board portions, and a flexible wiring board portion between the main body portion and the overlapping portion, and folding each overlapping portion into the main body. Overlay and fix directly or indirectly on the part.

(Electronic device)
(13) An electronic device having a mounting substrate and a semiconductor device mounted on the mounting substrate, wherein the semiconductor device is flattened vertically and has a plurality of protrusions protruding from the bottom surface of the main body portion A lead; at least one semiconductor chip incorporated in the main body; and an electrode for connecting the electrode of the semiconductor chip to a tip of the lead in the main body, wherein a part of the lead is the main body. Projecting out of the main body part from at least one surface other than the bottom surface and the flat surface of the part and folded back and extending along the flat surface of the main body part, and the tip is arranged side by side with the lead projecting from the bottom surface of the main body part Yes.

  (14) In the means (13), the lead portion extending along the uneven plane of the main body is supported by an overlapping portion that is directly or indirectly overlapped and fixed to the main body.

  (15) In the means (14), a semiconductor chip is incorporated in at least one of the overlapping portions, and a predetermined lead and an electrode of the semiconductor chip are connected by a connecting means.

(16) More specifically, in the electronic device, a plurality of mounting portions provided apart from each other and the mounting portions are electrically connected, and at least the plurality of mounting portions are configured by a flexible wiring member. A wiring board, and a semiconductor chip attached to each of the attachment parts,
The plurality of component mounting portions include a component mounting portion on which only one semiconductor chip is mounted and a component mounting portion on which a plurality of semiconductor chips are mounted,
Said folded flexible wiring member portion in which the state where the semiconductor chip is mounted a plurality of semiconductor chips to extend between the mounting portion so that fixed to each other superimposed vital to said single semiconductor chip, the semiconductor chip It has a mounting structure in which they are stacked one on top of another.

(17) Further, another more specific electronic device includes a plurality of mounting portions provided apart from each other,
A wiring board that is electrically connected between the attachment portions and at least between the plurality of attachment portions is constituted by a flexible wiring member;
As one component mounting unit only semiconductor chip is mounted and a plurality of semiconductor chips and a component mounting portion mounted, and a plurality of semiconductor chips attached to each of the plurality of mounting portions,
By bending in the flexible wiring member portion extending between said mounting portion so that the fixed superimposed life-and-death together relative to said plurality of said plurality in a state where the semiconductor chip is mounted the semiconductor chip is the one semiconductor chip, the semiconductor It has a mounting structure in which chips are stacked one on top of another.
Further, another more specific electronic device is configured such that a plurality of attachment portions provided apart from each other and the attachment portions are electrically connected, and at least the plurality of attachment portions are configured by a flexible wiring member. A wiring board, and a semiconductor chip attached to each of the attachment parts,
The plurality of component mounting portions include a component mounting portion on which only one semiconductor chip is mounted and a component mounting portion on which a plurality of semiconductor chips are mounted,
In a state where the semiconductor chip is attached, the plurality of semiconductor chips are mounted by being bent at a flexible wiring member part extending between the attachment parts so as to overlap with the one semiconductor chip,
The component mounting portion on which the plurality of semiconductor chips are mounted is formed in a size that fits within the spread of the component mounting portion on which only the one semiconductor chip is mounted when folded and mounted.
The mounting structure is configured such that the mounting size of the mounting body in which the semiconductor chips are stacked and folded on each other is the same as the mounting size of the component mounting portion on which the one semiconductor chip is mounted. And

(Semiconductor device incorporated in electronic device of the present invention)
According to the means (1), the lead protruding from the bottom surface of the main body is used as a mounting lead as it is, and the lead protruding from the other surface excluding the bottom surface and the flat surface of the main body is also folded back to Since the structure extends to the bottom side of the main body and is used as a mounting lead, the main body can be downsized even if the number of leads is large.

  Also, the mounting leads attached to the mounting board are composed of leads protruding from the bottom surface of the main body and leads extending along the flat surface of the main body, so that the mounting area can be reduced even if the number of leads is large. I can plan.

  According to the means (2), the lead protruding from the bottom surface of the main body is used as a mounting lead as it is, and the lead protruding from the other surface excluding the bottom surface and the flat surface of the main body is also folded back and Since the structure extends to the bottom surface side of the main body and is used as a mounting lead, the semiconductor device main body composed of the main body and the overlapping portion can be downsized even if the number of leads is large. In addition, the mounting area can be reduced.

  In addition, since the lead portion extending along the flat surface of the main body is supported by the overlapping portion, and the overlapping portion is fixed to the main body, the mounting leads are firmly supported.

  According to the means (3), the number of wires can be increased by using a flexible wiring board, and the lead portion can be easily folded.

  According to the means (4), a plate-like heat radiating plate protrudes from the lower surface of the main body, and at least a part of the heat radiating plate protrudes from the other surface of the main body to the outside of the main body. Therefore, it is possible to dissipate heat released from the semiconductor chip in the main body, and a stable operation of the semiconductor device can be achieved.

  According to the means (5), since at least one of the overlapping portions is a heat radiating plate made of a material having good thermal conductivity, heat released from the semiconductor chip in the main body portion via the leads. The semiconductor device can be stably operated.

  According to the means of (6), since the reinforcing plate having the fixing pin inserted and fixed to the mounting substrate is fixed to the flat surface of the main body portion or the overlapping portion, the mechanical strength of mounting the semiconductor device Becomes higher.

  According to the means (7), when mounting the semiconductor device, positioning for mounting can be performed automatically with the lead of the lead insertion type structure, so that the mounting of the lead of another surface mounting type structure can be automatically performed.

  According to the means (8), the lead protruding from the bottom surface of the main body is used as a mounting lead as it is, and the lead protruding from the other surface except the bottom surface and the flat surface of the main body is also folded back and Since the structure extends to the bottom surface side of the main body and is used as a mounting lead, the semiconductor device main body composed of the main body and the overlapping portion can be downsized even if the number of leads is large. In addition, the mounting area can be reduced.

  In addition, since the lead portion extending along the flat surface of the main body is supported by the overlapping portion, and the overlapping portion is fixed to the main body, the mounting leads are firmly supported.

  Moreover, since at least one semiconductor chip is incorporated in at least a part of the superimposition units, the number of semiconductor chips can be increased, and higher integration can be achieved.

  According to the means (9), the number of wires can be increased by using the flexible wiring board, the lead portion can be easily folded back, and the assembling work is facilitated.

(Manufacturing method of semiconductor device incorporated in electronic device of the present invention)
According to the means of (10), after forming the main body portion and the overlapping portion using a lead frame, unnecessary portions of the lead frame are cut and removed, and the lead between the main body portion and the overlapping portion is formed. Since the semiconductor device is manufactured by folding the portion and fixing each overlapping portion directly or indirectly on the main body portion, the semiconductor device can be easily manufactured with a small size and a small mounting area.

  According to the means of (11), after forming the main body portion and the overlapping portion using a lead frame, unnecessary portions of the lead frame are cut and removed, and the lead between the main body portion and the overlapping portion is formed. Since the semiconductor device is manufactured by folding the portion and fixing each overlapping portion directly or indirectly on the main body portion, the semiconductor device can be easily manufactured with a small size and a small mounting area.

  According to the means of (12), after forming the main body portion and the overlapping portion using a single flexible wiring board, unnecessary portions of the flexible wiring substrate are cut and removed, and the main body portion and the overlapping portion are formed. Since the semiconductor device is manufactured by folding the flexible wiring board part between and directly overlapping the main body part directly or indirectly to manufacture the semiconductor device, it is easy to manufacture a semiconductor device that is small and has a small mounting area. can do.

(Electronic device)
According to the means (13), the lead protruding from the bottom surface of the main body of the semiconductor device is used as a mounting lead as it is, and the lead protruding from the other surface except the bottom surface and the flat surface of the main body is also folded. Thus, the mounting area can be reduced even if the number of leads is large, because the structure is extended to the bottom surface side of the main body and used as a mounting lead.

  According to the above means (14), the lead portion extending along the flat plane of the main body is supported by the overlapping portion that is directly or indirectly overlapped and fixed to the main body. The lead mechanical strength is high and the mounting reliability is high.

  According to the means (15), since the semiconductor chip is incorporated in at least one of the overlapping portions other than the main body, the semiconductor device is more highly integrated, and the electronic device is highly integrated. Is done.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.

  1 is a perspective view showing a semiconductor device and a mounting substrate according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a mounting state of the semiconductor device according to the first embodiment, and FIG. 3 is a perspective view of the semiconductor device according to the first embodiment. FIG. 4 is an explanatory view showing a lead example of the semiconductor device of the first embodiment, FIG. 5 is a conceptual development view showing the correlation between the main body portion and the overlapping portion in the first embodiment, and FIG. It is an expanded view which shows the correlation with the main-body part in a present Example 1, and a superimposition part.

(Semiconductor device)
The semiconductor device 1 of the first embodiment is a vertically mounted semiconductor device, and is externally rectangular as shown in FIGS. 1 and 3 (a: front view, b: left side view, c: plan view). From the plate-like main body 2, three overlapping portions 3 b, 3 c, 3 d fixed directly or indirectly on the front and rear surfaces of the main body 2, and from the upper surface and both side surfaces of the main body 2 Leads (connecting leads) 4b, 4c, 4d that protrude and are folded back and enter the peripheral surfaces of the overlapping portions 3b, 3c, 3d, and the bottom surfaces of the main body 2 and the overlapping portions 3b, 3c, 3d And leads (mounting leads) 5a, 5b, 5c, and 5d protruding downward.

  The overlapping portions 3b, 3c, and 3d serve to support and reinforce the leads and keep the intervals between the leads constant. The overlapping portions 3b, 3c, 3d seal and support the leads protruding from the respective surfaces of the main body 2 together with the respective surfaces.

  The overlapping portions 3b, 3c, 3d are the same size as the main body portion 2. Therefore, in the semiconductor device 1 of the first embodiment, the semiconductor device body 6 is constituted by the main body portion 2 and the overlapping portions 3b, 3c, and 3d overlapping the main body portion 2, and the semiconductor device body is flattened vertically. 6 is a vertically mounted semiconductor device in which leads 5a, 5b, 5c, and 5d are projected from the bottom surface of 6 in a row.

  The main body 2 and the overlapping portions 3b, 3c, 3d are formed by a sealing body by transfer molding, as will be described later. As shown in FIG. 5, the main body 2 has a structure in which a semiconductor chip is incorporated in the same manner as a package of a normal resin package type semiconductor device. However, the overlapping portions 3b, 3c, 3d are simply leads 5 It is the structure which only seals from both sides. Therefore, the thickness of the overlapping portions 3b, 3c, 3d is thinner than that of the main body portion 2.

  Therefore, in order to make the pitch between the lead rows constant, the leads 5d are bent stepwise outward one step in the middle as shown in FIG.

  In the semiconductor device 1 according to the first embodiment, the leads 5a, 5b, 5c, and 5d are of the lead insertion type, and the tip shapes of the leads 5a, 5b, 5c, and 5d are as shown in FIGS. It has a shape. That is, the lead 5 is thinned from both sides as shown in FIG. 4A, thinned from one side as shown in FIG. 4B, and bent one step in the middle as shown in FIG. 4C. It has become. A portion whose width becomes wider from the bent portion or the narrowed portion collides with the edge of the insertion hole of the mounting board, and the lead is not inserted more than necessary.

  The overlapping portions 3b, 3c, 3d are fixed directly or indirectly to a wide flat surface (front surface and rear surface) of the main body 2 via an adhesive or an adhesive tape (not shown). As shown in FIG. 6, the main body 2 and the overlapping portions 3b, 3c, 3d are formed in a planar manner, for example, by transfer molding. After that, the left overlapping portion 3b of the central body portion 2 is folded back in the middle of the lead 4b and overlapped and adhered to the front surface of the main body portion 2, and then the right overlapping portion 3c is folded back in the middle of the lead 4c. Then, the upper overlapping portion 3d is folded back to the back side in the middle of the lead 4d to be bonded and fixed to the rear surface of the main body portion 2.

  FIGS. 5 and 6 show unnecessary leads after the body part 2 and the overlapping parts 3b, 3c, 3d are formed by sealing each part of the lead frame by transfer molding in the manufacture of the semiconductor device 1 of the first embodiment. FIG. 5 is a schematic development view showing a state in which the frame portion is cut and removed, and FIG. 5 shows a state in which what is sealed in the main body portion 2 and the overlapping portions 3b, 3c, and 3d can be seen.

  As shown in FIG. 5, a rectangular tab 16 having four corners supported by tab suspension leads 15 is located in the center of the main body 2. A semiconductor chip (IC chip) 17 is fixed on the tab 16. Leads 5 a and leads 4 b, 4 c, 4 d extending from the four sides of the main body 2 to the inside of the main body 2 face the periphery of the tab 16. Lead ends of the leads 5a and leads 4b, 4c, 4d and electrodes (not shown) of the semiconductor chip 17 are connected by conductive wires 18.

  Further, in the overlapping portions 3b, 3c, 3d, each lead 5 protrudes from the overlapping portions 3b, 3c, 3d when the overlapping portions 3b, 3c, 3d are folded back between the connecting leads 4b, 4c, 4d. The overlapping portions 3b and 3c are bent and the overlapping portion 3d goes straight so that 5b, 5c, and 5d are parallel to the lead 5a of the main body portion 2.

  If the lead bending pattern in the overlapping portion is appropriately selected, four overlapping portions (overlapping portions 3b, 3c, 3d, 3e) that directly or indirectly overlap the main body portion 2 as shown in FIG. ). In the case of the semiconductor device of FIG. 28, since the mounting leads 5a, 5b, 5c, 5d, and 5e are projected from one end of the overlapping portions 3b, 3c, 3d, and 3e, respectively, further increase in the number of leads is realized. it can. In the case of the semiconductor device 1 of FIG. 28, further enhancement in functionality and integration can be realized by incorporating a semiconductor chip into some or all of the overlapping portions 3b, 3c, 3d, and 3e. Further, the semiconductor device of the present invention may have more overlapping portions.

  Since the semiconductor device 1 according to the first embodiment employs a structure in which leads are respectively projected from the four sides of the main body 2 that is a rectangular package, as in the conventional QFP package, it is possible to achieve multiple leads. Further, since the leads protruding from the three sides of the main body 2 are folded and bent and extended along the flat surface of the main body 2 to be used as mounting leads, a conventional vertical mounting type semiconductor device configuration is adopted. Can do. As a result, a small and multi-lead semiconductor device 1 can be provided. Further, since the semiconductor device 1 has a vertical mounting structure, the mounting area can be reduced.

  In the case of the first embodiment, the main body 2 has a resin package configuration, but it may have a ceramic package configuration incorporating a semiconductor chip or a can package configuration made of a metal case. Further, as will be described later as another embodiment, all or some of the overlapping portions 3b, 3c, 3d may incorporate a semiconductor chip.

  In the first embodiment, the semiconductor chip is incorporated in the main body 2. However, in the present invention, even if the lead 2 is supported (sealed) in the main body 2, there is no problem. No.

  Further, since the connecting leads 4b, 4c and 4d are exposed from the sealing body and may cause a short circuit, an insulating material such as resin or enamel may be applied or resealed on the lead surface.

(Electronic device)
Here, before describing the manufacturing method of the semiconductor device 1 of the first embodiment, an electronic device on which the semiconductor device 1 of the first embodiment is mounted will be described.

  In FIG. 1, what is shown below the semiconductor device 1 is a mounting substrate 7. The mounting substrate 7 is provided with an insertion hole 9 for inserting the leads 5a, 5b, 5c and 5d of the semiconductor device 1. Although not shown, the edge of each insertion hole 9 is formed of a conductor and is connected to the wiring.

  FIG. 2 shows a state in which the semiconductor device 1 is mounted on the mounting substrate 7, that is, a part of the electronic device. The leads 5a, 5b, 5c, 5d inserted into the respective insertion holes 9 of the mounting substrate 7 are fixed by a bonding material such as solder (not shown).

  In the electronic device according to the first embodiment, the lead 5a protruding from the bottom surface of the main body 2 of the semiconductor device 1 is used as a mounting lead as it is and protrudes from other surfaces except the bottom surface and the flat surface of the main body 2. Since the leads 5b, 5c, 5d are folded and extended to the bottom surface side of the main body 2 to be used as mounting leads, the mounting area can be reduced even if the number of leads is large. Can be achieved.

  In the electronic device of the first embodiment, the lead portion extending along the flat surface of the main body 2 is supported by the overlapping portions 3b, 3c, 3d fixed to the main body 2. Therefore, the mechanical strength of each of the leads 5a, 5b, 5c, 5d for mounting is high, and the mounting reliability is increased.

  Further, in the semiconductor device 1 according to the first embodiment, if the semiconductor chip is incorporated in at least one of the overlapping portions 3b, 3c, and 3d, the semiconductor device is more highly integrated, and the electronic device is highly integrated. Can be achieved.

(Method for manufacturing semiconductor device)
Next, a method for manufacturing the semiconductor device 1 according to the first embodiment will be described. FIGS. 5 to 8 are diagrams relating to the method of manufacturing the semiconductor device according to the first embodiment. FIG. 5 is a conceptual development showing the correlation between the main body and the overlapping portion. FIG. FIG. 7 is a plan view showing each process of manufacturing the semiconductor device, and FIG. 8 is a plan view showing each process of manufacturing the semiconductor device.

  In summary, the manufacturing method of the semiconductor device according to the first embodiment has a main body 2 that is flattened vertically and a plurality of overlapping portions 3b that are directly or indirectly fixed to the flat surface of the main body 2. 3c, 3d, a plurality of leads (connection leads 4b, 4c, 4d) disposed from the inside of the main body 2 to the overlapping portions 3b, 3c, 3d, and protruding from the bottom surface of the main body 2 Leads (mounting leads 5a), a plurality of leads (mounting leads 5b, 5c, 5d) that are insulatedly supported by the overlapping portions 3b, 3c, 3d and project from below the overlapping portions, and the main body portion 2 and at least one semiconductor chip 17 sealed in 2 and connection means (wire bonding by a wire 18) for electrically connecting the electrode of the semiconductor chip 17 and the tip of the lead 5 in the main body 2 , The main body 2 Leads extending to the overlapping portions 3b, 3c, 3d (connecting leads 4b, 4c, 4d) are directly extended by the overlapping portions 3b, 3c, 3d and projecting below the overlapping portions 3b, 3c, 3d. In the method of manufacturing the semiconductor device 1 connected to (the mounting leads 5b, 5c, 5d), a lead pattern (main body lead pattern 22) forming the main body portion and a lead pattern (superimposing) forming the overlapping portion. Part lead patterns 23b, 23c, 23d) and a lead frame 20 having lead patterns (connecting leads 4b, 4c, 4d) between the main body part 2 and the overlapping parts 3b, 3c, 3d; A step of forming the main body portion 2 and the overlapping portions 3b, 3c, 3d, a step of cutting and removing unnecessary lead frame portions, and the main body portion 2 and the overlapping portions 3b, 3c, 3 Folded back at the lead portion (connecting leads 4b, 4c, 4d) between the respective overlapped portions 3b, 3c, 3d, directly or indirectly superimposed on the main body portion 2, and a method of fixing.

  Next, a method for manufacturing the semiconductor device of Example 1 will be specifically described.

  First, as shown in FIG. 7A, a lead frame 20 is prepared. The lead frame 20 is formed by patterning a metal plate having a thickness of about 0.15 to 0.2 mm by etching or precision pressing. As the metal, a Fe—Ni alloy such as 42 alloy or Kovar or a copper alloy is used.

  As shown in FIG. 7A, the lead frame 20 becomes a rectangular frame plate 21 having a frame structure in which a predetermined portion is punched out, and a main body lead pattern 22 that forms the main body portion 2 is provided at the lower center of the rectangular frame plate 21. It has been. Further, overlapping portion lead patterns 23 b and 23 c are provided on both sides of the main body portion lead pattern 22. An overlapping portion lead pattern 23 d is provided above the main body portion lead pattern 22. In this explanation, the upper and lower sides indicate the upper edge side or the lower edge side of the paper on which the drawings are described. Further, both sides indicate both side edges of the paper.

  As shown in FIG. 5, the main body lead pattern 22 has a rectangular tab 16, four tab suspension leads 15 that support four corners of the tab 16, and tips on the four sides of the tab 16. The other end is composed of a plurality of leads 5 that extend in the overlapping portion lead patterns 23b, 23c, and 23d.

  The tab suspension lead 15 is connected to the rectangular frame plate 21.

  In the lead 5 extending in four directions from the main body lead pattern 22, the lead 5 extending below the main body lead pattern 22 extends in parallel and is connected to the rectangular frame plate 21. This portion of the lead 5 serves as a mounting lead 5 a of the main body 2.

  The plurality of leads 5 projecting upward from the main body lead pattern 22 go straight upward in parallel with each other, pass through the overlapping lead pattern 23d, and continue to the rectangular frame plate 21. A portion of the lead 5 connected to the rectangular frame plate 21 becomes a mounting lead 5d of the overlapping portion 3d. Each mounting lead 5d is supported by a thin dam 24d extending perpendicularly.

  The leads 5 extending on both sides of the main body lead pattern 22 are advanced into the overlapping portion lead patterns 23b and 23c, then bent obliquely downward by 45 degrees, then bent again and extended downward. The tip portions become mounting leads 5b and 5c of the overlapping portions 3b and 3c. The mounting leads 5a, 5b, 5c are all parallel. These mounting leads 5a, 5b, 5c are structured to be supported in the middle by orthogonal thin dams 24a, 24b, 24c.

  In the lead 5, the portion between the main body lead pattern 22 and the overlapping portion lead patterns 23b, 23c, 23d is particularly called a connecting lead (leads 4b, 4c, 4d). Of the connecting leads 4b, 4c and 4d, the connecting leads 4b and 4c have the same length, but the connecting lead 4d has a different overlapping state with respect to the main body 2 as described above, that is, the overlapping portion. Although 3b and 3c directly overlap the main body 2, the overlapping portion 3d is overlapped with the overlapping portion 3c overlapped with the main body 2, so that it is long as shown in FIGS. 6 and 7D.

  The lead frame 20 is plated at various places as necessary.

  Next, the semiconductor chip 17 is fixed on the tab 16 with respect to the lead frame 20 as shown in FIG. The semiconductor chip 17 may be fixed by a commonly used method such as a gold-silicon eutectic alloy, a conductive resin (adhesive) such as silver paste, or an adhesive tape.

  Next, as shown in FIGS. 7C and 5, the electrode (not shown) of the semiconductor chip 17 and the tip portion of the lead 5 that faces the tip of the semiconductor chip 17 are connected by a conductive wire 18. The This electrical connection means may be a face-down structure using a bump, a beam lead structure, or the like.

  Next, as shown in FIGS. 7D and 6, the main body lead pattern 22 portion and the three overlapping portion lead patterns 23b, 23c, and 23d portions are sealed by transfer molding, and the sealing body 25 is used. (Body part 2 and superposition parts 3b, 3c, 3d) are formed.

  Next, as shown in FIG. 8A, unnecessary lead frame portions, that is, dams 24a, 24b, 24c, and 24d are cut and removed, and the mounting leads 5a, 5b, 5c, and 5d are rectangular frame plates. Detach from 21. However, the tab 16 is supported by the rectangular frame plate 21 via the tab suspension lead 15. At this time, resin burrs generated during molding are also removed. At this time, if necessary, the lead is formed and bent as shown in FIG.

  In the first embodiment, the tab 16 is fixed to the rectangular frame plate 21 by the tab suspension lead 15 in order to improve the subsequent workability. At this time, the tab suspension lead is attached at the base of the tab 16. 15 may be cut to completely separate the main body 2 and the overlapping portions 3b, 3c, and 3d from the lead frame 20, and the state shown in FIG.

  Next, as shown in FIG. 8 (b), on the flat surfaces of the overlapping portions 3b, 3c, 3d, an adhesive 26 such as an adhesive or an adhesive tape is attached to the front surface of the overlapping portions 3b, 3c. In the part 3d, the adhesive 26 is attached to the rear surface. An adhesive tape may be attached instead of the adhesive. In the case of the adhesive 26, curing may be promoted in a heating furnace as necessary.

  Next, as shown in FIG. 8C, the overlapping portions 3b, 3c, and 3d are folded back and adhered to the main body portion 2. That is, first, the connecting lead 4b is folded back to the front side, and the overlapping portion 3b is overlapped and bonded to the main body portion 2. Thereafter, the connecting lead 4 c is folded back to the front side, and the overlapping portion 3 c is overlapped and bonded to the overlapping portion 3 b fixed to the main body portion 2. Further, the connecting lead 4d is folded back to the rear surface side, and the overlapping portion 3d is overlapped and adhered to the rear surface of the main body portion 2. By directly or indirectly fixing the overlapping portions 3b, 3c, 3d to the main body portion 2, as shown in FIG. 8D, a semiconductor device body 6 including the main body portion 2 and the overlapping portions 3b, 3c, 3d is formed. The

  Next, as shown in FIG. 8 (e), the semiconductor device 1 is manufactured by cutting the tab suspension lead 15 from the base of the main body 2.

  According to the first embodiment, the following effects can be obtained.

  (1) In the semiconductor device 1 of the first embodiment, the lead 5a protruding from the bottom surface of the main body 2 is used as it is as a lead for mounting, and protrudes from other surfaces except the bottom surface and the flat surface of the main body 2. Since the lead is also folded and extended to the bottom surface side of the main body portion and used as the mounting leads 5b, 5c, 5d, the main body portion can be downsized even if the number of leads is large. .

  (2) In the semiconductor device 1 of the first embodiment, the leads protruding from the both side surfaces and the upper surface of the main body 2 are extended along the front surface and the rear surface which are the flat surfaces of the main body 2. Since it is supported by the thin overlapping portions 3b, 3c, 3d, the thickness of the semiconductor device body 6 including the main body portion 2 and the overlapping portions 3b, 3c, 3d can be reduced.

  (3) By the above (1) and (2), the semiconductor device 1 becomes a semiconductor device with a small mounting area.

  (4) In the semiconductor device 1 of the first embodiment, the mounting lead 5a is supported by the main body 2 and the mounting leads 5b, 5c, 5d are supported by the overlapping portions 3b, 3c, 3d. Each lead for use will be firmly supported.

  (5) According to the method of manufacturing the semiconductor device of the first embodiment, after forming the main body 2 and the overlapping portions 3b, 3c, 3d using the lead frame 20, unnecessary portions of the lead frame 20 are cut. The lead portions (connecting leads 4b, 4c, 4d) between the main body portion 2 and the overlapping portions 3b, 3c, 3d are folded back to directly connect the overlapping portions 3b, 3c, 3d to the main body portion 2. Alternatively, since the semiconductor device 1 is manufactured by being indirectly overlapped and fixed, it is possible to easily manufacture a semiconductor device that is small and has a small mounting area.

  Next, the following method may be employed in the first embodiment.

  For example, in order to prevent the lead from being deformed, an insulating resin tape or film may be attached to the predetermined portion.

  Further, each lead such as a connecting lead may be fixed with a reinforcing frame that separates the leads at the time of cutting.

  Further, as a method for mounting a semiconductor chip, a structure in which the semiconductor chip is once attached to a wiring board and wire-bonded, and the wiring board and the lead frame are again bonded and attached can be considered. In this case, the lead frame may not be provided with a tab.

  FIG. 9 is a side view of a semiconductor device according to a first modification of the first embodiment. The semiconductor device 1 has a structure in which the mounting leads 5a, 5b, and 5c are arranged in a zigzag manner. By making the lead arrangement zigzag, the lead pitch can be made smaller and the mounting efficiency can be improved.

  FIGS. 10A and 10B are views showing a semiconductor device according to a second modification of the first embodiment. In the semiconductor device 1 of this embodiment, the mounting leads 5a, 5b, 5c and 5d are of the surface mounting type. Since there is no through hole in this method, the back surface of the substrate can be used effectively.

  FIGS. 11A and 11B are views showing a semiconductor device according to a third modification of the first embodiment. In the semiconductor device 1 of this embodiment, a part of the mounting leads is a lead insertion type lead 30 and the other part is a surface mounting type lead 31. Therefore, when the semiconductor device 1 is mounted, the lead insertion type Since positioning for mounting is possible with the lead 30, positioning of other surface mounting type leads 31 can be automatically performed, device misalignment during board mounting can be prevented, and the back side of the board can be used effectively because there are few mounting through holes. it can.

  FIG. 12 is a diagram showing a semiconductor device according to a second embodiment of the present invention, and FIG. 13 is a plan view showing the correlation between the main body and leads in the manufacture of the semiconductor device according to the second embodiment.

  The semiconductor device 1 according to the second embodiment is a vertically mounted semiconductor device having the simplest structure.

  In summary, as shown in FIGS. 12 and 13, the semiconductor device 1 of the second embodiment has a main body portion 2 that is flat in the vertical direction and a plurality of leads 5 (mounting) that protrude from the bottom surface of the main body portion 2. A semiconductor device having a lead 5a), at least one semiconductor chip incorporated in the main body 2, and connection means for electrically connecting an electrode of the semiconductor chip and a tip of the lead in the main body A part of the lead 5 protrudes outside the main body 2 from at least one surface other than the bottom surface and the flat surface of the main body 2 and is folded back to extend along the flat surface 35 of the main body 2. The leads 5 (mounting leads 5d) are arranged side by side with the leads (mounting leads 5a) protruding from the bottom surface of the main body 2.

  Next, the semiconductor device 1 of the second embodiment will be specifically described.

  As shown in FIGS. 12 and 13, the semiconductor device 1 is flattened up and down and has a rectangular main body 2 in which a semiconductor chip is incorporated, and a plurality of mounting leads 5 a protruding from the bottom surface of the main body 2. And a plurality of leads 5 projecting from the upper surface of the main body 2. The plurality of leads 5 protruding from the upper surface of the main body 2 are folded back to the front side of the main body 2 near the base of the main body 2 and overlapped with the flat surface 35 of the main body 2.

  As shown in FIG. 13, vertically extending grooves 36 are provided in parallel on the flat surface 35 on the front surface of the main body 2, and the folded leads 5 are fitted into the grooves 36. The fitted lead 5 is fixed to the main body 2 by a bonding material (not shown).

  The lead 5 extending downward from the groove 36 is used as a mounting lead 5d. The mounting lead 5a and the mounting lead 5d are arranged in parallel.

  In the semiconductor device 1 according to the second embodiment, the lead protruding from the bottom surface of the main body 2 is used as the mounting lead 5a as it is, and the lead 5 protruding from the other surface except the bottom surface and the flat surface 35 of the main body 2. Is also folded and extended to the bottom side of the main body 2 to be used as the mounting lead 5d, so that the main body 2 can be downsized even if the number of leads is large.

  Further, the mounting leads 5a and 5d attached to the mounting substrate are composed of a lead protruding from the bottom surface of the main body 2 and a lead extending along the flat surface of the main body, so that even if the number of leads is large, the mounting leads 5a and 5d are mounted. The area can be reduced.

  In the semiconductor device 1 according to the second embodiment, for example, the lead 5 fitted in the groove 36 is not necessarily fixed. Alternatively, the folded lead 5 may be provided along the flat surface 35 side of the main body 2 without providing the groove 36.

  FIG. 14 is a diagram showing a semiconductor device that is Embodiment 3 of the present invention, and FIG. 15 is a development view showing the correlation between the main body and the overlapping portion in the manufacture of the semiconductor device of Embodiment 3.

  The semiconductor device 1 according to the third embodiment has a structure in which, in the semiconductor device 1 according to the second embodiment, the lead folded back to the front side of the main body 2 is sealed and supported by the overlapping portion 3d made of a resin package.

  In the third embodiment, two positioning protrusions 37 are provided on the flat surface 35 on the front surface of the main body 2 as shown in FIG. In addition, two concave portions 38 corresponding to the front and rear protrusions 37 are provided on the corresponding surface of the overlapping portion 3d.

  As a result, when the superimposing portion 3d is superposed on the main body portion 2, the superimposing portion 3d can be superposed on the main body portion 2 with high accuracy by pressing and fitting the protrusion 37 into the concave portion 38.

  16 to 18 are diagrams related to the semiconductor device according to the first modification of the third embodiment. FIG. 16 is a diagram illustrating the semiconductor device. FIG. 17 is a diagram in which the main body and the overlapping portion are expanded in the manufacture of the semiconductor device. FIG. 18 is an explanatory view showing a positioning claw in the semiconductor device.

  The semiconductor device 1 of this modification shows an example of a fixing structure of the main body 2 and the overlapping portion 3d in the semiconductor device 1 of the third embodiment shown in FIGS. In this modification, projecting positioning claws 39 as shown in FIG. 18 are provided on both end sides of the main body 2, and positioning grooves 40 through which the positioning claws 39 can pass are provided at corresponding positions of the overlapping portion 3d. Is.

  When the overlapping portion 3d is overlapped with the main body portion 2, the positioning claw 39 passes through the positioning groove 40 and is elastically hooked to the edge of the opposite surface of the overlapping portion 3d, so that the main body portion 2 and the overlapping portion 3d are integrated. .

  In the semiconductor device 1 of this modification, by providing the positioning claw 39 and the positioning groove 40, the overlay accuracy of the main body 2 and the superimposing portion 3d is increased, and the fixing of the semiconductor device main body 6 is also ensured. .

  FIG. 19 is a diagram illustrating a semiconductor device according to a second modification of the third embodiment, and FIG. 20 is a development view illustrating the correlation between the main body and the overlapping portion in the manufacture of the semiconductor device according to the second modification of the third embodiment. .

  Similar to the first modification of the third embodiment, the present modification relates to a fixing structure of the main body 2 and the overlapping portion 3d in the semiconductor device 1. In this modification, as shown in FIG. 20, one lead is projected in a wide state from both side surfaces of the overlapping portion 3 d to form a fixing lead 41. Then, as shown in FIG. 19, the fixing lead 41 is bent and hooked to both end portions of the main body 2. In this case, as shown in FIG. 20, a receiving groove 42 for receiving the fixing lead 41 may be provided in the main body 2.

  FIG. 21 is a diagram showing a semiconductor device that is Embodiment 4 of the present invention, and FIG. 22 is a conceptual plan view showing a state in which the main body portion and the overlapping portion are developed in the manufacture of the semiconductor device of Embodiment 4.

  In the semiconductor device 1 of the fourth embodiment, the tab 16 in the main body 2 (that is, the plate material forming the lead 5) is projected as it is from the upper and lower surfaces of the main body 2 to form a wide sheet and used as the heat radiating plate 45. Is. That is, since the material constituting the leads and tabs 16 is formed of a metal plate having good thermal conductivity as described above, it can be used as a heat sink.

  Therefore, in the fourth embodiment, the lead portion protruding from the bottom surface of the main body 2 is used as the mounting heat sink 46. In the semiconductor device 1 according to the fourth embodiment, since the mounting lead is a surface mounting type, the mounting heat sink 46 also has a surface mounting type structure. The heat radiating plate 45 protruding from the upper surface of the main body 2 extends straight upward for heat dissipation.

  In the semiconductor device 1 according to the fourth embodiment, the overlapping portions 3b and 3c are formed of a plate attached to one surface of a plurality of leads 5 extending in parallel. The overlapping portions 3b, 3c, and 3d are made of a metal plate, a ceramic plate, and a resin plate, and are bonded to the lead 5 via an insulating adhesive or adhesive tape. The overlapping portions 3b, 3c, 3d play a role of lead reinforcement.

  The semiconductor device 1 according to the fourth embodiment has a structure in which a plate-like heat radiating plate 45 projects outward from the main body 2, so that heat radiated from the semiconductor chip 17 in the main body 2 is dissipated. Therefore, stable operation of the semiconductor device 1 can be achieved.

  Moreover, in the semiconductor device 1 of the fourth embodiment, the overlapping portions 3b and 3c are plate bodies, and are thinner than the sealing body structure by transfer molding, so that the thickness of the semiconductor device body 6 can be further reduced. The semiconductor device 1 can be thinned and the mounting area can be reduced.

  FIG. 23 is a diagram showing a semiconductor device that is Embodiment 5 of the present invention, and FIG. 24 is a conceptual plan view showing a state in which the main body portion and the overlapping portion are developed in the manufacture of the semiconductor device of Embodiment 5.

  In the semiconductor device 1 according to the fifth embodiment, the lead 5 extending from the main body 2 to the left and right sides and upward is provided on the overlapping portion 3b made of a metal plate, a ceramic plate, and a resin plate as in the fourth embodiment. , 3c and 3d. The lead protruding from each surface of the main body 2 is fixed to each overlapping portion 3b, 3c, 3d by an insulating adhesive or adhesive tape for each surface.

  Further, among the overlapping portions 3 b, 3 c, 3 d, the upper ends of the overlapping portions 3 b, 3 c on both sides of the main body 2 protrude longer outside one edge (one side) of the main body 2.

  In the semiconductor device 1 of the fifth embodiment, since the overlapping portions 3b and 3c are heat radiating plates, heat released from the semiconductor chip 17 in the main body portion 2 through the leads 5 is radiated to the outside. Thus, stable operation of the semiconductor device 1 can be achieved.

  Further, in the semiconductor device 1 of the fifth embodiment, the overlapping portions 3b, 3c, and 3d are plate bodies and are thinner than the sealing body structure by transfer molding, so that the thickness of the semiconductor device body 6 can be further reduced. Thus, the semiconductor device 1 can be thinned and the mounting area can be reduced.

  In the fifth embodiment, at least one of the overlapping portions 3b, 3c, 3d may be a heat radiating plate made of a material having good thermal conductivity. Moreover, in order to maintain the heat dissipation effect, the one end of the heat dissipation plate needs to protrude outward from one edge (one side) of the main body 2.

  FIG. 25 is a diagram showing a semiconductor device that is Embodiment 6 of the present invention. FIG. 25 (a) is a front view of the semiconductor device 1, and FIG. 25 (a) is a left side view.

  In the semiconductor device 1 of the sixth embodiment, in the semiconductor device 1 in which the mounting leads 5a, 5b, 5c, and 5d are of the surface mounting type, the fixing pin 50 to be inserted into the mounting substrate is provided on the flat surface of the overlapping portion 3d. The reinforcing plate 51 is fixed. Two fixing pins 50 are provided on both sides.

  In the semiconductor device 1 of the sixth embodiment, since the reinforcing plate 51 having the fixing pins 50 fixed to the mounting substrate is fixed to the flat surface of the overlapping portion 3d, the mechanical strength of mounting the semiconductor device is high. Become. In other words, by inserting and fixing the fixing pin 50 to the mounting substrate, it is possible to prevent the tilting and displacement of the mounted surface mount semiconductor device and to improve the mounting workability.

  In the sixth embodiment, the reinforcing plate 51 having the fixing pin 50 may be provided directly on the main body 2 when there are few overlapping portions.

  FIG. 26 is a conceptual plan view showing a state in which the main body portion and the lead reinforcing portion are developed in the manufacture of the semiconductor device according to the seventh embodiment of the present invention.

  The semiconductor device 1 of the seventh embodiment uses a flexible wiring board 52 instead of a lead frame, and a resin flow stop frame 53 made of a rectangular frame is used for the main body lead pattern 22 to perform resin sealing by potting. Thus, the main body 2 is formed.

  In the overlapping portion lead patterns 23b, 23c, and 23d, the overlapping portions 3b, 3c, and 3d as reinforcing plates are attached to the leads 5 and the flexible wiring board 52.

  Also in the case of the seventh embodiment, the overlapping portions 3b, 3c, and 3d are overlapped and fixed directly or indirectly on the main body portion 2 to manufacture the semiconductor device 1.

  In the semiconductor device 1 of the seventh embodiment, the number of wirings can be increased by using the flexible wiring board 52. Further, the use of the flexible wiring board 52 facilitates the folding back of the lead portion (connecting lead) and improves the assembly workability.

  In the seventh embodiment, as a method of mounting the semiconductor chip (IC chip) 17, when the semiconductor chip 17 is mounted directly on the flexible wiring board 52 as shown in the figure and connected by wire bonding, another wiring board is once used. In the case where the flexible wiring board 52 is bonded again and attached, a method of attaching the bumped wiring to the electrode pad portion of the semiconductor chip 17 by gang bonding can be considered. The flexible substrate may be flexible only in the folded portions (4b, 4c, 4d), and the other portion may be made of a normal substrate.

  In addition, the lead tip portion to be mounted on the mounting board may have a metal pin attached to the flexible wiring board 52.

  FIG. 27 is a conceptual plan view showing a state in which the main body portion and the overlapping portion are developed in the manufacture of the semiconductor device according to the eighth embodiment of the present invention.

  The semiconductor device 1 according to the eighth embodiment is an example in which an electronic component such as a semiconductor chip is incorporated in an overlapping portion other than the main body portion. In this case, a lead frame may be used to manufacture the semiconductor device 1, but in this example, a flexible wiring board is used as in the case of the seventh embodiment.

  The structure of the semiconductor device 1 of the eighth embodiment will be described by explaining its manufacture.

  As shown in FIG. 27, the semiconductor device 1 of the eighth embodiment is provided with a flexible wiring board 60 in its manufacture. The flexible wiring board 60 has a portion for forming the main body 2 and the three overlapping portions 3b, 3c, 3d and a portion for arranging the connecting leads 4b, 4c, 4d.

  And the resin flow stop frame 53 is provided in the part which forms the said main-body part 2 and the superimposition part 3b, 3c, 3d similarly to the case of the said Example 7. FIG.

  In the formation part of the main body 2, the semiconductor chip 17 is directly attached to the flexible wiring board 60.

  The multichip module plate 61 is attached to the inside of the resin flow stop frame 53 at the formation portion of the overlapping portions 3b, 3c, 3d. A chip-type electronic component 62 composed of the semiconductor chip 17, a chip capacitor, a chip resistor, or the like is fixed to the multichip module plate 61.

  The wires (pads) of the multichip module board 61 and the electrodes of the semiconductor chip 17 are connected by wires 18. The wires (pads) of the multichip module board 61 are connected to the tips of predetermined leads 5 (mounting leads 5b, 5c, 5d and connecting leads 4b, 4c, 4d) by wires 18.

  The resin is sealed in the four resin flow stop frames 53 to form the main body 2 and the overlapping portions 3b, 3c, 3d. Resin is poured into the four resin flow stop frames 53 by, for example, potting.

  A flexible wiring substrate 60 shown in FIG. 27, although not shown, manufactures a semiconductor device by superimposing overlapping portions 3b, 3c, and 3d directly or indirectly on the main body 2.

  As a result, a semiconductor device having a multichip structure (a multichip module is manufactured).

  In the case of the semiconductor device according to the eighth embodiment, as the electrode connecting means of the semiconductor chip 17, bumps are formed on the semiconductor chip 17, and the semiconductor chip 17 is fixed to the wiring (pad) at once. Also good.

  It is also possible to mount the finished IC package on the flexible wiring board 60 by soldering or using a conductive adhesive. The flexible substrate may be flexible only in the folded portions (4b, 4c, 4d), and the other portion may be a normal substrate.

  Further, the lead tip portion mounted on the substrate may have a metal pin attached to the flexible wiring substrate.

  In the semiconductor device according to the eighth embodiment, since the semiconductor chip 17 and the chip-type electronic component 61 are mounted on the overlapping portions 3b, 3c, and 3d other than the main body portion 2, the degree of integration is significantly increased, and the mounting area of the semiconductor device is increased. Can be reduced.

  Further, in the semiconductor device 1 according to the eighth embodiment, the number of wirings can be increased by using the flexible wiring board 60. Further, by using the flexible wiring board 60, the lead portion can be easily folded, and the assembly workability is improved.

  In the semiconductor device of the eighth embodiment, the lead protruding from the bottom surface of the main body 2 is used as the mounting lead 5a as it is, and the lead protruding from the other surface except the bottom surface and the flat surface of the main body 2 is also folded back. Thus, the main body 2 is extended to the bottom surface side and used as the mounting leads 5b, 5c, 5d, so that the main body can be downsized even if the number of leads is large. In addition, the mounting area can be reduced.

  In the eighth embodiment, a structure in which an electronic component is not incorporated in some of the overlapping portions may be employed. In this case, in the overlapping portion that does not incorporate an electronic component such as a semiconductor chip, the lead extending from the main body portion to the overlapping portion extends as it is in the overlapping portion and protrudes below the overlapping portion (mounting lead). The structure is connected to

  FIG. 28 is a plan view showing a state in which the main body portion and the overlapping portion are developed in the manufacture of the semiconductor device according to the ninth embodiment of the present invention.

  As shown in FIG. 28, the semiconductor device of the ninth embodiment has four overlapping portions 3b, 3c, 3d, and 3e with respect to the main body 2, and is directly or indirectly with respect to the main body 2. In particular, the semiconductor device can be manufactured by overlapping the overlapping portions 3b, 3c, 3d, and 3e. The shapes of the main body 2 and the overlapping portions 3d and 3e may be appropriately selected depending on the degree of overlap.

  In the semiconductor device 1 of the ninth embodiment, for example, further integration can be achieved by incorporating a semiconductor chip, a chip-type electronic component, or the like in all the overlapping portions 3b, 3c, 3d, 3e other than the main body portion 2. Thus, a reduction in the mounting area can be achieved.

  The invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Nor.

  The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

  (1) Since the semiconductor device employs a structure in which the leads protrude from the four sides of the main body 2 which is a rectangular package, as in the conventional QFP package, it is possible to achieve multiple leads.

  (2) Since the semiconductor device is used as a mounting lead by folding and bending the lead protruding from the three sides of the main body and extending it along the flat surface of the main body, the conventional vertical mounting type semiconductor device configuration Thus, a reduction in size and a reduction in mounting area can be achieved.

  (3) According to the above (1) and (3), it is possible to provide a semiconductor device that is small, has multiple leads, and can reduce the mounting area.

  (4) Although the semiconductor device has a main body portion and a plurality of overlapping portions that are superimposed on the main body portion, further integration can be achieved by incorporating electronic components such as a semiconductor chip in the overlapping portion.

It is a perspective view which shows the semiconductor device which is Example 1 of this invention, and a mounting substrate. It is a perspective view which shows the mounting state of the semiconductor device of the present Example 1. FIG. 1 is a diagram illustrating an appearance of a semiconductor device according to a first embodiment. FIG. 6 is an explanatory diagram illustrating a lead example of the semiconductor device according to the first embodiment; FIG. 3 is a conceptual development view showing a correlation between a main body part and an overlapping part in the manufacture of the semiconductor device according to the first embodiment. FIG. 6 is a development view illustrating a correlation between a main body portion and an overlapping portion in manufacturing the semiconductor device according to the first embodiment. FIG. 6 is a plan view showing each step of manufacturing the semiconductor device of Example 1; FIG. 6 is a plan view showing each step of manufacturing the semiconductor device of Example 1; It is a side view of the semiconductor device by the 1st modification of the present Example 1. FIG. It is a figure which shows the semiconductor device by the 2nd modification of the present Example 1. FIG. It is a figure which shows the semiconductor device by the 3rd modification of the present Example 1. FIG. It is a figure which shows the semiconductor device which is Example 2 of this invention. It is a top view which shows the correlation with the main-body part and lead | read | reed in manufacture of the semiconductor device of the present Example 2. It is a figure which shows the semiconductor device which is Example 3 of this invention. It is an expanded view which shows the correlation of the main-body part and superimposition part in manufacture of the semiconductor device of the present Example 3. It is a figure which shows the semiconductor device by the 1st modification of the present Example 3. It is an expanded view which shows the correlation of the main-body part and superimposition part in manufacture of the semiconductor device by the 1st modification of the present Example 3. It is explanatory drawing which shows the positioning nail | claw in the semiconductor device by the 1st modification of the present Example 3. It is a figure which shows the semiconductor device by the 2nd modification of the present Example 3. It is an expanded view which shows the correlation of a main-body part and a superimposition part in manufacture of the semiconductor device by the 2nd modification of the present Example 3. It is a figure which shows the semiconductor device which is Example 4 of this invention. It is a conceptual top view which shows the state by which the main-body part and the superimposition part were expand | deployed in manufacture of the semiconductor device of the present Example 4. It is a figure which shows the semiconductor device which is Example 5 of this invention. FIG. 10 is a conceptual plan view illustrating a state in which a main body portion and an overlapping portion are developed in manufacturing a semiconductor device according to a fifth embodiment. It is a figure which shows the semiconductor device which is Example 6 of this invention. It is a conceptual top view which shows the state by which the main-body part and the lead reinforcement part were expand | deployed in manufacture of the semiconductor device which is Example 7 of this invention. It is a notional top view which shows the state by which the main-body part and the superimposition part were expand | deployed in manufacture of the semiconductor device which is Example 8 of this invention. It is a top view which shows the state by which the main-body part and the superimposition part were expand | deployed in manufacture of the semiconductor device which is Example 9 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Main-body part, 3b, 3c, 3d, 3e ... Overlapping part, 4b, 4c, 4d, 4e ... Lead (connection lead), 5a, 5b, 5c, 5d, 5e ... Lead (for mounting) Lead), 6 ... Semiconductor device body, 7 ... Mounting board, 9 ... Insertion hole, 15 ... Tab suspension lead, 16 ... Tab, 17 ... Semiconductor chip, 18 ... Wire, 20 ... Lead frame, 21 ... Rectangular frame plate, 22 ... body part lead pattern, 23b, 23c, 23d ... overlapping part lead pattern, 24a, 24b, 24c, 24d ... dam, 25 ... sealing body, 26 ... adhesive, 30 ... lead insertion type lead, 31 ... surface mount type Lead, 35 ... flat surface, 36 ... groove, 37 ... protrusion, 38 ... recess, 39 ... positioning claw, 40 ... positioning groove, 41 ... fixing lead, 42 ... receiving groove, 45 ... heat sink, 46 ... for mounting Heat sink, 50 ... fixed Down, 51 ... reinforcing plate 52 ... flexible wiring board, 53 ... resin flow fiddle, 60 ... flexible wiring board, 61 ... multi-chip module board, 62 ... chip-type electronic component.

Claims (3)

A plurality of mounting portions provided at a distance from each other, a wiring board that is electrically connected between the mounting portions, and at least the plurality of mounting portions are configured by a flexible wiring member, and is attached to each of the mounting portions. A semiconductor chip,
The plurality of component mounting portions include a component mounting portion on which only one semiconductor chip is mounted and a component mounting portion on which a plurality of semiconductor chips are mounted,
Said folded flexible wiring member portion in which the state where the semiconductor chip is mounted a plurality of semiconductor chips to extend between the mounting portion so that fixed to each other superimposed vital to said single semiconductor chip, the semiconductor chip An electronic device having a mounting structure in which the layers are stacked one upon another. A plurality of attachment portions provided apart from each other;
A wiring board that is electrically connected between the attachment portions and at least between the plurality of attachment portions is constituted by a flexible wiring member;
As one component mounting unit only semiconductor chip is mounted and a plurality of semiconductor chips and a component mounting portion mounted, and a plurality of semiconductor chips attached to each of the plurality of mounting portions,
By bending in the flexible wiring member portion extending between said mounting portion so that the fixed superimposed life-and-death together relative to said plurality of said plurality in a state where the semiconductor chip is mounted the semiconductor chip is the one semiconductor chip, the semiconductor An electronic device having a mounting structure in which chips are stacked on top of each other. A plurality of mounting portions provided at a distance from each other, a wiring board that is electrically connected between the mounting portions, and at least the plurality of mounting portions are configured by a flexible wiring member, and is attached to each of the mounting portions. A semiconductor chip,
  The plurality of component mounting portions include a component mounting portion on which only one semiconductor chip is mounted and a component mounting portion on which a plurality of semiconductor chips are mounted,
  In a state where the semiconductor chip is attached, the plurality of semiconductor chips are mounted by being bent at a flexible wiring member part extending between the attachment parts so as to overlap with the one semiconductor chip,
  The component mounting portion on which the plurality of semiconductor chips are mounted is formed in a size that fits within the spread of the component mounting portion on which only the one semiconductor chip is mounted when folded and mounted.
  The mounting structure is configured such that the mounting size of the mounting body in which the semiconductor chips are stacked and folded on each other is the same as the mounting size of the component mounting portion on which the one semiconductor chip is mounted. An electronic device.

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